An online monitoring method and device for warping deformation and defects of a packaging module

Abstract

The present invention belongs to the technical field of encapsulation module monitoring, and discloses an on-line monitoring method and device for warping deformation and defects of an encapsulation module. The device includes a projection moire module, an infrared imaging module, and a monitoring and analysis module. The method includes: obtaining first warping information of a to-be-tested encapsulation module sample through the projection moire module; obtaining second warping information of the to-be-tested encapsulation module sample through the infrared imaging module; and obtaining monitoring result information based on the first warping information and the second warping information. The present invention solves the problem in the prior art that the warping deformation and defects of an encapsulation module cannot be monitored on-line, and can on-line monitor the failure conditions of the encapsulation modules of electronic devices in the actual industrial production process.

Description

Technical Field

[0001] The present invention relates to the technical field of package module monitoring, and particularly to an online monitoring method and device for warping deformation and defects of a package module. Background Art

[0002] At present, integrated circuit technology has penetrated into all fields of industry and social life, and the electronics industry has become the largest industry today. Since the 1970s, the global electronic information industry has developed rapidly. The electronic information industry has developed on the basis of the development and application of electronic science and technology. Due to the improvement of production technology and processing technology in the development of the electronic information industry, integrated circuits are updated about every three years; the large-scale production and use of large-scale integrated circuits and computers, and the rise of optical fiber communication, digital communication, and satellite communication technologies have made the electronics industry a rapidly emerging high-tech industry. The development of the electronics industry and the wide application of its products have had an extremely profound impact on aspects such as the global economy and culture. From the perspective of both science and technology and economic development, the importance of semiconductors is extremely huge.

[0003] In most current electronic products, the core units in computers, mobile phones, or digital recorders are extremely closely related to semiconductors. The packaging technology of electronic devices is one of the key links restricting the development of integrated circuits. The warping problem caused by the differences in the sizes and material properties of various materials (substrate, adhesive layer, chip, and packaging material) in the packaging of electronic devices under a large temperature difference has seriously affected the reliability, welding performance, and yield of electronic devices. Therefore, the warping problem of electronic devices has become a major obstacle to the further development of electronic packaging technology.

[0004] In the semiconductor process, as various material layers and various semiconductor device structures are formed on the wafer surface, various stresses will be generated on the wafer surface, causing the wafer to warp during the process. In the most ideal state, the wafer should not warp. Even if it cannot be completely flat, in the ideal state, the warp of the wafer should be a bowl-shaped that warps from the edge towards the front of the wafer and is symmetric about the central axis perpendicular to the wafer; in actual situations, due to the asymmetry of the stress on the front of the wafer, various asymmetric warps of the wafer often occur, resulting in the wafer being prone to warp defects, causing some chips to fail or even break into pieces.

[0005] In the prior art, it is difficult to achieve on-line monitoring of the warping defects of the encapsulation module of electronic devices in industrial production. There are many measurement methods for warping deformation, such as electronic speckle interferometry, shadow moiré, projection moiré, and digital image correlation method (DIC), etc. These methods have their specific measurement accuracies and application scenarios, and at the same time, their measurement areas and measurement ranges are also different. Electronic speckle interferometry is not suitable for the measurement and monitoring of large-area warping deformation such as wafers due to its expensive high-power laser. Shadow moiré is also not suitable for the measurement and monitoring of large-area warping deformation due to the problem of its optical path setting. The digital image correlation method is not suitable for samples that cannot be surface-pretreated because it requires spraying a layer of speckles with specific gray levels on the surface of the sample. The projection moiré method is a modern optical measurement technology developed in the 1970s of the 20th century, and is mostly used for the detection of in-plane deformation, out-of-plane displacement, and surface topography. With the advantages of non-contact, fast, full-field measurement, high resolution, and high precision, the projection moiré method is widely used in many fields such as biological and medical detection, product detection, and reverse engineering. At present, there are mature equipment products for the projection moiré technology both at home and abroad, and the measurement accuracy for warping is relatively high, reaching an accuracy of 1.5 microns. However, due to its own principle, the projection moiré technology can only measure the surface of an object and basically does not have the penetration ability, so its ability to detect internal defects of products is weak.

[0006] In addition, for the warping deformation and defects of the encapsulation module of electronic devices, in the industrial production process, usually only offline detection is carried out after the electronic device fails. This method not only has a complex process and requires a large number of equipment, but also takes a long time and has poor test effects, and is not very helpful for improving the production process of electronic devices. How to effectively and reliably on-line monitor the warping state of electronic devices is an urgent problem to be solved in current industrial production. Summary of the Invention

[0007] By providing an on-line monitoring method and device for the warping deformation and defects of an encapsulation module, the embodiments of the present application solve the problem that the warping deformation and defects of the encapsulation module cannot be on-line monitored in the prior art.

[0008] The embodiments of the present application provide an on-line monitoring device for the warping deformation and defects of an encapsulation module, including: a projection moiré module, an infrared imaging module, and a monitoring and analysis module;

[0009] The monitoring and analysis module is respectively connected to the projection moiré module and the infrared imaging module;

[0010] The projection moiré module is used to obtain the first warping information of the sample of the encapsulation module to be measured;

[0011] The infrared imaging module is used to obtain the second warping information of the sample of the encapsulation module to be measured;

[0012] The monitoring and analysis module is used to obtain monitoring result information based on the first warping information and the second warping information.

[0013] Preferably, the moiré projection module includes: a CCD camera and a grating projector;

[0014] The grating projector is used to project a grating onto the surface of the sample of the package module to be measured;

[0015] The CCD camera is used to continuously capture and collect the changes of the grating on the surface of the sample of the package module to be measured, so as to obtain the first warping information.

[0016] Preferably, the moiré projection module further includes: a first synchronous trigger;

[0017] The CCD camera is a CCD camera array composed of multiple CCD cameras; the CCD camera array is connected to the first synchronous trigger;

[0018] The grating projector is a grating projector array composed of multiple grating projectors.

[0019] Preferably, the infrared imaging module includes: an infrared camera;

[0020] The infrared camera is used to continuously collect infrared images of the surface of the sample of the package module to be measured, so as to obtain the second warping information.

[0021] Preferably, the infrared imaging module includes: a thermal shock source and an infrared camera;

[0022] The thermal shock source is used to perform thermal shock on the sample of the package module to be measured;

[0023] The infrared camera is used to continuously collect infrared images of the surface of the sample of the package module to be measured after thermal shock, so as to obtain the second warping information.

[0024] Preferably, the infrared imaging module further includes: a second synchronous trigger;

[0025] The infrared camera is an infrared camera array composed of multiple infrared cameras, and the infrared camera array is connected to the second synchronous trigger.

[0026] Preferably, the monitoring and analysis module includes: a data storage device, a data analysis device, and a monitoring display device;

[0027] The data storage device is used to store the information from the moiré projection module and the infrared imaging module, and transmit it to the data analysis device;

[0028] The data analysis device is used to obtain warping deformation information based on the first warping information, obtain warping defect information based on the second warping information, and obtain the monitoring result information based on the warping deformation information and the warping defect information;

[0029] The monitoring display device is used to display the monitoring result information.

[0030] Preferably, the on-line monitoring device for warping deformation and defects of the packaging module further includes: an optical three-dimensional measurement calibrator;

[0031] The optical three-dimensional measurement calibrator is used to calibrate the internal parameters, external parameters and height of the camera.

[0032] Preferably, the on-line monitoring device for warping deformation and defects of the packaging module further includes: a flat placement table;

[0033] The packaging module sample to be measured is placed on the flat placement table; the thermal shock source is arranged inside or on the side of the flat placement table.

[0034] On the other hand, using the above device, an embodiment of the present application provides an on-line monitoring method for warping deformation and defects of a packaging module, including the following steps:

[0035] Obtain the first warping information of the packaging module sample to be measured through the projection moire module;

[0036] Obtain the second warping information of the packaging module sample to be measured through the infrared imaging module;

[0037] Obtain the monitoring result information according to the first warping information and the second warping information.

[0038] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0039] In the embodiment of the present application, the first warping information of the packaging module sample to be measured is obtained through projection moire, the second warping information of the packaging module sample to be measured is obtained through infrared imaging, and then the first warping information and the second warping information are combined and analyzed to obtain the monitoring result information, so as to realize on-line monitoring of the failure situation of the packaging module of electronic devices in the actual industrial production process, changing the deadlock of offline detection of failed products in the industrial circle in the past. Description of the Drawings

[0040] To more clearly illustrate the technical solutions in this embodiment, the following will briefly introduce the drawings required for the description of the embodiment. Obviously, the drawings in the following description are an embodiment of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0041] Figure 1 Structural schematic of an on-line monitoring device for warpage deformation and defects of a packaging module provided by an embodiment of the present invention Figure 1 ;

[0042] Figure 2 Structural schematic of an on-line monitoring device for warpage deformation and defects of a packaging module provided by an embodiment of the present invention Figure 2 ;

[0043] Figure 3 Structural schematic of an on-line monitoring device for warpage deformation and defects of a packaging module provided by an embodiment of the present invention Figure 3 ;

[0044] Figure 4 Structural schematic of an on-line monitoring device for warpage deformation and defects of a packaging module provided by an embodiment of the present invention Figure 4 .

[0045] Among them, 1 - CCD camera, 2 - grating projector, 3 - thermal shock source, 4 - infrared camera, 5 - packaging module sample to be measured. Specific implementation manner

[0046] To better understand the above technical solutions, the following will combine the accompanying drawings of the specification and specific implementation manners to elaborate on the above technical solutions in detail.

[0047] The present invention provides an on-line monitoring device for warpage deformation and defects of a packaging module, mainly including: a projection moiré module, an infrared imaging module, and a monitoring and analysis module; the monitoring and analysis module is respectively connected to the projection moiré module and the infrared imaging module.

[0048] The projection moiré module is used to obtain the first warpage information of the packaging module sample to be measured; the infrared imaging module is used to obtain the second warpage information of the packaging module sample to be measured; the monitoring and analysis module is used to obtain monitoring result information according to the first warpage information and the second warpage information.

[0049] The following will further illustrate the present invention with specific embodiments.

[0050] Embodiment 1:

[0051] An online monitoring device for warping deformation and defects of a packaging module provided in Example 1 includes a projection moiré module, an infrared imaging module, and a monitoring and analysis module; the monitoring and analysis module is connected to the projection moiré module and the infrared imaging module, respectively.

[0052] Among them, see Figures 1 - 4 The projection moiré module includes: a CCD camera 1 and a grating projector 2; the grating projector 2 is used to project a grating onto the surface of the package module sample 5 to be tested; the CCD camera 1 is used to continuously capture and collect the grating changes on the surface of the package module sample 5 to be tested, so as to obtain the first warping information.

[0053] The infrared imaging module includes: an infrared camera 4; the infrared camera 4 is used to continuously collect infrared images of the surface of the package module sample 5 to be tested, so as to obtain the second warpage information.

[0054] The monitoring and analysis module includes: a data storage device, a data analysis device, and a monitoring display device. The data storage device is used to store information from the projection moiré module and the infrared imaging module, and transmit it to the data analysis device; the data analysis device is used to obtain warping deformation information according to the first warping information, to obtain warping defect information according to the second warping information, and to obtain the monitoring result information according to the warping deformation information and the warping defect information; the monitoring display device is used to display the monitoring result information.

[0055] The judgment process of warpage deformation and defects is a combined analysis. The warpage deformation is completed by the projection moiré module. If the analysis result shows that the warpage deformation of the package module sample to be tested is obviously too large, it is combined with the infrared imaging module responsible for warpage defect monitoring to obtain a comprehensive analysis result. That is, the two need to be comprehensively analyzed to determine whether the sample to be tested is failed.

[0056] Since the projection moiré technology has high accuracy in measuring product warpage, it can be used to monitor online the warpage measurement process of large-area packaging modules that may have large warpage defects. Since infrared imaging technology has the characteristics of fast response speed, large detection area, and online monitoring of certain objects that are difficult to contact or prohibited to contact, it can be used to monitor online the characterization process of large warpage defects in large-area packaging modules. Combining projection moiré technology with infrared imaging technology can further monitor the warpage defects of electronic devices in industrial production online, improve the timeliness of warpage defect monitoring, and promptly detect unqualified and failed devices, providing an effective dynamic reference for improving the quality of the product production process, thereby improving the yield rate of electronic devices and reducing production costs.

[0057] Embodiment 2:

[0058] The on-line monitoring device for warping deformation and defects of a packaging module provided in Embodiment 2 is different from that in Embodiment 1 in that the projection moire module further includes a first synchronous trigger, and the CCD camera 1 is a CCD camera array composed of a plurality of CCD cameras; the CCD camera array is connected to the first synchronous trigger. The grating projector 2 is a grating projector array composed of a plurality of grating projectors.

[0059] The first synchronous trigger and multiple CCD cameras are respectively connected through data lines, and then the first synchronous trigger is connected to a workstation (i.e., the monitoring and analysis module) that controls photographing and analysis. The first synchronous trigger is used to ensure that multiple CCD cameras can be triggered to take pictures simultaneously during photographing, so as to ensure that the pictures taken at the same moment can be synthesized into a single whole picture in the workstation.

[0060] Using a CCD camera array can realize on-line monitoring of a large-area packaging module and can improve the limitation of the camera field of view size. Measuring by forming an array with multiple cameras, for example, the field of view of an array composed of 16 CCD cameras is 600*600mm, and the measurement accuracy can reach 4 microns, and the accuracy can reach 1.5 microns in a 240*240mm field of view. By using 64, 100, 200 or even more cameras to form an array in the present invention, it is theoretically possible to measure warping deformation and defects under an infinitely large area.

[0061] The number of the grating projectors 2 theoretically depends on whether the gratings projected by the projectors cover the entire surface of the packaging module sample 5 to be measured. In order to achieve a theoretically infinitely large measurement area, by increasing the number of grating projectors, that is, assembling in a grating projector array, the purpose of large-area monitoring can be achieved.

[0062] Embodiment 3:

[0063] The on-line monitoring device for warping deformation and defects of a packaging module provided in Embodiment 3 is different from that in Embodiment 1 or Embodiment 2 in that the infrared imaging module further includes a second synchronous trigger, the infrared camera 4 is an infrared camera array composed of a plurality of infrared cameras, and the infrared camera array is connected to the second synchronous trigger. Each of the infrared cameras includes an infrared lens and an infrared detector.

[0064] When on-line monitoring a large-area packaging module, a single infrared lens may not be able to cover the entire area to be detected. Therefore, using an infrared camera array can achieve large-area coverage. Using the second synchronous trigger can ensure that multiple infrared cameras can be triggered to take pictures simultaneously.

[0065] Embodiment 4:

[0066] The on-line monitoring device for warpage deformation and defects of a packaging module provided in Embodiment 4 is different from those in Embodiments 1-3 in that the infrared imaging module further includes: a thermal shock source 3 for performing thermal shock on the sample 5 of the packaging module to be measured; and an infrared camera 4 for continuously collecting infrared images of the surface of the sample 5 of the packaging module to be measured after thermal shock to obtain the second warpage information.

[0067] The main purpose of adding the thermal shock source 3 is to enable the infrared imaging module to work better in the industrial production line, because there is often no temperature gradient when the product is approaching detection during production, while the normal operation of the infrared imaging module requires a certain temperature gradient in the sample itself. After the thermal shock source 3 shocks the sample, due to the different thermal expansion coefficients of different materials in the sample itself, the temperatures raised in the same time are also different, thus forming a certain temperature gradient.

[0068] In addition, in Embodiments 1-4, an optical three-dimensional measurement calibrator can also be used to calibrate the internal parameters, external parameters, and height of the camera, and the sample 5 of the packaging module to be measured is placed on a flat mounting table. Among them, the role of the high-precision three-dimensional calibrator is to calibrate the internal parameters, external parameters, and height of multiple cameras, and establish a spatial coordinate system between the cameras and between the cameras and the sample 5 of the packaging module to be measured.

[0069] According to the different regions to be monitored by infrared imaging, the installation method of specific devices can also be adjusted accordingly. As Figures 1 - 4 shown, the infrared camera 4 can be integrated on the side of the sample 5 of the packaging module to be measured (for example, installed on the side wall of the temperature chamber) or on the top (for example, installed on the top of the temperature chamber), and the thermal shock source 3 can be arranged inside or on the side of the flat mounting table (for example, installed on the side wall of the temperature chamber).

[0070] The following gives a reference parameter: (1) The projected moiré fringe area that can be emitted is 600mm×600mm, the frequency is 50Hz, and the fringe density is adjustable from 2 to 50 lines; (2) The image resolution is 64 million pixels, the camera frame rate is 75fps, the frame rate at 64 million pixels is not less than 10fps, the field of view is not less than 600mm×600mm, and the warpage deformation measurement resolution is 4 microns (600mm×600mm).

[0071] Using the on-line monitoring device for warpage deformation and defects of a packaging module provided in the above embodiments, this embodiment provides an on-line monitoring method for warpage deformation and defects of a packaging module, including the following steps:

[0072] Obtain the first warpage information of the sample of the packaging module to be measured through the projected moiré fringe module;

[0073] Obtain the second warpage information of the packaged module sample to be measured through the infrared imaging module;

[0074] Obtain the monitoring result information according to the first warpage information and the second warpage information.

[0075] Among them, the monitoring sequence methods include but are not limited to the following two:

[0076] (1) Adopt the method of simultaneously using infrared imaging and moiré projection functions for on-line monitoring of warpage defects.

[0077] (2) Adopt the method of alternately using infrared imaging and moiré projection functions in sequence or in a specific repeated sequence for on-line monitoring of warpage defects.

[0078] Taking the on-line monitoring device for warpage deformation and defects of the packaged module provided in Embodiment 4 as an example, the corresponding on-line monitoring method is as follows: In the moiré projection module, the high-speed grating projector projects the grating onto the sample surface, and the array CCD camera group continuously captures and collects the changes of the grating on the sample surface, and monitors the warpage defects of the sample through the moiré projection analysis software; In the infrared imaging module, the thermal shock source performs a short and appropriate thermal shock on the sample, so that the sample generates a temperature difference due to the different thermal conductivity coefficients of its own materials, and then the array infrared camera continuously collects the infrared images of the sample surface (such as the cross-section side view direction), and inputs them into the computer through the infrared detector to analyze and monitor the warpage defects of the sample. The data of infrared imaging and moiré projection are input into the data storage device through the data line, and then output to the data analysis device and the image display device to realize the visual on-line monitoring of warpage defects. Through this complete set of infrared imaging and moiré projection systems, the purpose of on-line monitoring of warpage deformation and defects of large-area packaged modules is achieved.

[0079] An on-line monitoring method and device for warpage deformation and defects of a packaged module provided by an embodiment of the present invention at least include the following technical effects:

[0080] The present invention can perform on-line monitoring of warpage defects of electronic devices in industrial production, improve the timeliness of warpage defect monitoring, timely detect unqualified failed devices, provide an effective dynamic reference for improving the quality of the product production process flow, thereby improving the yield rate of electronic devices and reducing production costs.

[0081] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the examples, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered by the scope of the claims of the present invention.

Claims

1. An on-line monitoring device for warping deformation and defects of a packaging module, characterized in that, Including: A projection moiré module, an infrared imaging module, and a monitoring and analysis module; The monitoring and analysis module is respectively connected to the projection moiré module and the infrared imaging module; The projection moiré module includes: a CCD camera and a grating projector; the grating projector is used to project a grating onto the surface of the sample of the package module to be measured; the CCD camera is used to continuously capture and collect the change of the grating on the surface of the sample of the package module to be measured, so as to obtain the first warpage information of the sample of the package module to be measured; The infrared imaging module includes: a thermal shock source and an infrared camera; the thermal shock source is used to perform thermal shock on the sample of the package module to be measured; the infrared camera is used to continuously collect infrared images of the surface of the sample of the package module to be measured after thermal shock, so as to obtain the second warpage information of the sample of the package module to be measured; The monitoring and analysis module is used to obtain monitoring result information according to the first warpage information and the second warpage information.

2. The on-line monitoring device for warping deformation and defects of the encapsulation module according to claim 1, wherein The projection moiré module further includes: a first synchronization trigger; The CCD camera is a CCD camera array composed of multiple CCD cameras; the CCD camera array is connected to the first synchronization trigger; The grating projector is a grating projector array composed of multiple grating projectors.

3. The on-line monitoring device for warping deformation and defects of the encapsulation module according to claim 1, characterized in that, The infrared imaging module further includes: a second synchronization trigger; The infrared camera is an infrared camera array composed of multiple infrared cameras, and the infrared camera array is connected to the second synchronization trigger.

4. The on-line monitoring device for warping deformation and defects of the encapsulation module according to claim 1, characterized in that The monitoring and analysis module includes: a data storage device, a data analysis device, and a monitoring display device; The data storage device is used to store information from the projection moiré module and the infrared imaging module, and transmit it to the data analysis device; The data analysis device is used to obtain warpage deformation information according to the first warpage information, obtain warpage defect information according to the second warpage information, and obtain the monitoring result information according to the warpage deformation information and the warpage defect information; The monitoring display device is used to display the monitoring result information.

5. The on-line monitoring device for warping deformation and defects of the encapsulation module according to claim 1, characterized in that, Further including: An optical three-dimensional measurement calibrator; The optical three-dimensional measurement calibrator is used to perform internal parameter, external parameter, and height calibration on the cameras, and the cameras include CCD cameras and infrared cameras.

6. The on-line monitoring device for warping deformation and defects of the encapsulation module according to claim 1, characterized in that, Further including: A planar placement table; The sample of the package module to be measured is placed on the planar placement table; The thermal shock source is arranged inside or on the side of the planar placement table.

7. An online monitoring method for warping deformation and defects of a packaging module, characterized in that, Using the on-line monitoring device for warpage deformation and defects of the package module as described in any one of claims 1-6, the method includes the following steps: Obtaining the first warpage information of the sample of the package module to be measured through the projection moiré module; Obtaining the second warpage information of the sample of the package module to be measured through the infrared imaging module; Obtaining monitoring result information according to the first warpage information and the second warpage information.

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