Substrate structure and manufacturing process

Abstract

A substrate structure includes at least one detachable first substrate unit and a substrate body. The detachable first substrate unit includes a plurality of corners and a plurality of first engaging portions. Each of the first engaging portions is disposed at each of the corners of the detachable first substrate unit. The substrate body includes a plurality of second substrate units, at least one opening, and a plurality of second engaging portions. The opening is substantially defined by a plurality of sidewalls of the second substrate unit and includes a plurality of corners. Each of the second engaging portions is disposed at each of the corners of the opening. The detachable first substrate unit is disposed in the opening, and the second engaging portions engage with the first engaging portions.

Description

Technical Field

[0001] The present disclosure relates to a substrate structure and a manufacturing process, and more particularly to a substrate structure including a detachable substrate unit, and a method for manufacturing the substrate structure and a package structure including the substrate structure. Background Art

[0002] A semiconductor substrate structure may include multiple substrate units. After testing (e.g., electrical and / or functional testing), some substrate units may be found to be defective or poor quality, failing the test and are labeled as "failed." These units are then assigned a "good" (NG) rating. Other substrate units that are found to be non-defective or good quality, passing the test, are labeled as good. The ratio of the number of failed units to the total number of all substrate units (including both good and failed units) is defined as the failure rate, yield loss, or acceptable number of "good" units. To increase production per hour (UPH) and reduce packaging waste, packaging houses typically require that substrate structures provided by substrate suppliers (substrate houses) have a maximum failure rate of 10%, 20%, or more (i.e., the number of failed units must be less than 10%, 20%, or more of the total number of substrate units). Therefore, before shipping substrate structures to a packaging house, the substrate supplier (substrate house) must ensure that the failure rate of each substrate structure meets the desired requirements or specifications recommended or specified by the packaging house. Summary of the Invention

[0003] In some embodiments, a substrate structure includes at least one detachable first substrate unit and a substrate body. The detachable first substrate unit includes a plurality of corners and a plurality of first engaging portions. Each of the first engaging portions is disposed at each of the corners of the detachable first substrate unit. The substrate body includes a plurality of second substrate units, at least one opening, and a plurality of second engaging portions. The opening is substantially defined by a plurality of sidewalls of the second substrate unit and includes a plurality of corners. Each of the second engaging portions is disposed at each of the corners of the opening. The detachable first substrate unit is disposed in the opening, and the second engaging portions engage with the first engaging portions.

[0004] In some embodiments, a substrate structure includes at least one detachable first substrate unit and a substrate body. The detachable first substrate unit includes a plurality of sidewalls and a plurality of first engaging portions. The first engaging portions are disposed on the sidewalls of the detachable first substrate unit. The substrate body includes a frame, a plurality of slots, a plurality of second substrate units, at least one opening, and a plurality of second engaging portions. The slots are disposed on the frame to define the second substrate units. The opening is substantially defined by at least one sidewall of the second substrate unit and at least two sidewalls of the frame. The second engaging portions are disposed on the sidewalls of the frame. The detachable first substrate unit is disposed in the opening, and each of the second engaging portions engages with each of the first engaging portions.

[0005] In some embodiments, a manufacturing process includes: (a) providing a first substrate structure, wherein the first substrate structure includes at least one first substrate unit defined by multiple imaginary cutting lines; (b) removing at least one first substrate unit from the first substrate structure, wherein the first substrate unit includes multiple corners and multiple first engaging portions, and each of the first engaging portions is arranged at each of the corners of the first substrate unit; (c) providing a second substrate structure, wherein the second substrate structure includes multiple second substrate units defined by multiple imaginary cutting lines; (d) removing at least one second substrate unit from the second substrate structure to form at least one opening and multiple second engaging portions, wherein the opening is substantially defined by multiple side walls of the second substrate unit, the opening includes multiple corners, and each of the second engaging portions is arranged at each of the corners of the opening; and (e) disposing the first substrate unit of (b) in the opening of the second substrate structure, wherein each of the second engaging portions engages with each of the first engaging portions. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] When read in conjunction with the accompanying drawings, aspects of some embodiments of the present disclosure can be easily understood from the following detailed description. It should be noted that various structures may not be drawn to scale, and the sizes of various structures may be arbitrarily increased or decreased for clarity of discussion.

[0007] Figure 1 A top view of a substrate structure according to some embodiments of the present disclosure is shown.

[0008] Figure 2 show Figure 1 3D exploded view of .

[0009] Figure 3 show Figure 1 and Figure 2 A top view of the first substrate unit.

[0010] Figure 4 show Figure 1 Magnified view of area "A" in the middle.

[0011] Figure 5 show Figure 1 and Figure 2 FIG. 1 is a top view of a substrate structure of FIG. 1 , wherein the detachable first substrate unit is omitted for the purpose of clear explanation.

[0012] Figure 6 show Figure 5 Magnified view of area "B" in the middle.

[0013] Figure 7 A top view of a first substrate unit according to some embodiments of the present disclosure is shown.

[0014] Figure 8 A top view of a first substrate unit according to some embodiments of the present disclosure is shown.

[0015] Figure 9 A top view of a first substrate unit according to some embodiments of the present disclosure is shown.

[0016] Figure 10 show Figure 2 A cross-sectional view of a portion of a substrate structure.

[0017] Figure 11 show Figure 1 A cross-sectional view of a portion of a substrate structure.

[0018] Figure 12 A top view of a substrate structure according to some embodiments of the present disclosure is shown.

[0019] Figure 13 show Figure 12 A three-dimensional exploded view of the substrate structure.

[0020] Figure 14 show Figure 12 and Figure 13 A top view of the first substrate unit.

[0021] Figure 15 show Figure 12 Magnified view of area “C” in the middle.

[0022] Figure 16 show Figure 12 and Figure 13 FIG. 1 is a top view of a substrate structure of FIG. 1 , wherein the detachable first substrate unit is omitted for the purpose of clear explanation.

[0023] Figure 17 One or more stages of some embodiments of the manufacturing process of the present disclosure are shown.

[0024] Figure 18 One or more stages of some embodiments of the manufacturing process of the present disclosure are shown.

[0025] Figure 19 One or more stages of some embodiments of the manufacturing process of the present disclosure are shown.

[0026] Figure 20 One or more stages of some embodiments of the manufacturing process of the present disclosure are shown.

[0027] Figure 21 One or more stages of some embodiments of the manufacturing process of the present disclosure are shown.

[0028] Figure 22 One or more stages of some embodiments of the manufacturing process of the present disclosure are shown.

[0029] Figure 23 One or more stages of some embodiments of the manufacturing process of the present disclosure are shown.

[0030] Figure 24 One or more stages of some embodiments of the manufacturing process of the present disclosure are shown. DETAILED DESCRIPTION

[0031] Throughout the drawings and detailed description, common reference numerals are used to refer to the same or similar components. Embodiments of the present disclosure will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings.

[0032] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. Specific examples of components and arrangements are described below to illustrate certain aspects of the present disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, the formation of a first feature above or on a second feature may include embodiments in which the first feature and the second feature are formed or arranged in direct contact, and may also include embodiments in which additional features may be formed or arranged between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, the present disclosure may repeat reference numerals and / or letters in various examples. This repetition is for the purpose of simplicity and clarity and does not, in itself, indicate the relationship between the various embodiments and / or configurations discussed.

[0033] At least some embodiments of the present disclosure provide a substrate structure including at least one detachable first substrate unit, and at least some embodiments of the present disclosure provide a technology for manufacturing the substrate structure and a package structure including the substrate structure.

[0034] In a comparative embodiment, if the failure rate of the first substrate structure does not meet the expected requirements or expected specifications recommended or proposed by the packaging factory (i.e., the number of unqualified units exceeds an acceptable amount), the substrate supplier (substrate factory) will adopt a compensation method to reduce the failure rate of the first substrate structure. The compensation method is described as follows. Unqualified units (or NG units) are cut out from the first substrate structure by, for example, punching to form an opening in the first substrate structure. Qualified units (or known good units) are cut out from the compensation substrate structure by, for example, punching to form compensated qualified units (or compensated known good units). The size and profile of the compensated qualified units are substantially the same as the size and profile of the unqualified units. Then, the unqualified units are replaced with compensated qualified units. That is, the compensated qualified units are arranged or placed in the opening of the first substrate structure. Therefore, the failure rate of the first substrate structure is improved. However, the first substrate structure may not be able to firmly hold the compensated qualified units, and therefore, the engagement force between the compensated qualified units and the first substrate structure may be loose, and the compensated qualified units may easily fall off from the first substrate structure.

[0035] To address these issues, in a comparative embodiment, the corners of the qualified compensation cells and the corners of the unqualified cells are designed to have special profiles. For example, the four corners of the unqualified cells are connected to the frame of the first substrate structure via connecting rods before the cutting process. Then, during the cutting process, the connecting rods are cut using a specific cutting tool or a punching tool so that the portion of the connecting rod remaining in the unqualified cell has a special profile, such as a protruding portion, and the portion of the connecting rod remaining in the frame of the first substrate structure has a special profile, such as a recessed portion. Similarly, the four corners of the qualified compensation cells are connected to the frame of the compensation substrate structure via connecting rods before the cutting process. Then, during the cutting process, the connecting rods are cut using a specific cutting tool or a punching tool so that the portion of the connecting rod remaining in the qualified compensation cell has a special profile, such as a protruding portion, and the portion of the connecting rod remaining in the frame of the compensation substrate structure has a special profile, such as a recessed portion. Then, the portion of the connecting rod remaining in the qualified compensation cell (i.e., the protruding portion) can mate with the portion of the connecting rod remaining in the frame of the first substrate structure (i.e., the recessed portion). Therefore, the engagement force between the qualified compensation cells and the first substrate structure can be improved. However, the above solution is only applicable to a substrate structure used in a pin / ball grid array (PBGA) type.

[0036] The present disclosure provides a substrate structure comprising at least one detachable substrate unit to at least address the aforementioned issues and improve manufacturing processes. In some embodiments, the detachable substrate unit includes a plurality of first engaging portions that are capable of engaging with a plurality of second engaging portions disposed within openings in a substrate body. Thus, the substrate body can securely hold the detachable substrate unit, and the solution is applicable to any type of substrate structure.

[0037] Figure 1 A top view of a substrate structure 1 according to some embodiments of the present disclosure is shown. Figure 2 show Figure 1 3D exploded view. The substrate structure 1 may be a matrix array BGA substrate or a Dofu-BGA substrate. That is, the substrate units (e.g., substrate units 12a, 12b, 12c, 12d, 12e) of the substrate structure 1 are arranged side by side or in an array. The entire outer side surface of one substrate unit is connected to the entire outer side surface of an adjacent substrate unit, and there are no slots between the two substrate units. In addition, there may be no boundary between the singulation street 19 and the substrate units. Therefore, the substrate structure 1 may be a continuous plate structure, and the encapsulant will cover all substrate units on one side of the substrate structure 1 during the molding process. For example, before the molding process, the substrate structure 1 may be set or accommodated in a cavity of a moldchase. The substrate structure 1 may have only one molding gate, so that during the molding process, the encapsulant can flow through the molding gate to enter the cavity of the moldchase and simultaneously cover all substrate units. The encapsulant is formed integrally and simultaneously.

[0038] It should be understood that another type of substrate structure may be the above-mentioned PBGA substrate 3 ( Figure 12 and Figure 13 ). The PBGA substrate includes a plurality of slots arranged between substrate units. Therefore, the substrate units are separated by the slots and are connected to the frame of the PBGA substrate by connecting rods. There may be a gap between the side of one substrate unit and the side of an adjacent substrate unit. For example, before the molding process, the PBGA substrate may be arranged or accommodated in a plurality of cavities of a molding groove, and each substrate unit is arranged in each cavity of the molding groove. Each substrate unit may have a molding gate, so that in the molding process, the molding material may flow through the molding gate to cover each substrate unit in each cavity of the molding groove to form a package. Therefore, there may be a plurality of packages formed on the PBGA substrate, and each package is arranged on each substrate unit.

[0039] refer to Figure 1 and Figure 2The substrate structure 1 includes at least one detachable first substrate unit (e.g., first substrate units 22a, 22b) and a substrate body 10. The detachable first substrate units 22a, 22b are compensation qualified units (or compensation known good units) cut out from the compensation substrate structure. For example, the detachable first substrate unit 22a includes multiple corners 222a (e.g., four corners 222a), multiple first meshing portions 223a (e.g., four first meshing portions 223a), and multiple first serration portions 224a (e.g., four first serration portions 224a). The detachable first substrate unit 22a has multiple side walls 221a (e.g., four side walls 221a). Each side wall 221a is arranged between two corners 222a. Each first serration portion 224a is arranged on each side wall 221a. Each first meshing portion 223a is arranged at each corner 222a of the detachable first substrate unit 22a. It should be noted that the size, dimensions, and profile of the detachable first substrate unit 22b can be substantially the same as the size, dimensions, and profile of the detachable first substrate unit 22a. The material of the detachable first substrate unit (e.g., first substrate units 22a, 22b) can include glass-reinforced epoxy materials (e.g., FR4), bismaleimide triazine (BT), epoxy resin, silicon, printed circuit board (PCB) material, glass, or ceramic.

[0040] The material of the substrate body 10 may be the same as or different from the material of the detachable first substrate unit (e.g., the first substrate units 22a, 22b). For example, the material of the substrate body 10 may include glass-reinforced epoxy resin material (e.g., FR4), bismaleimide triazine (BT), epoxy resin, silicon, printed circuit board (PCB) material, glass, or ceramic. Figure 1 and Figure 2 As shown, the substrate body 10 includes a frame 11, a plurality of second substrate units (e.g., second substrate units 12a, 12b, 12c, 12d, 12e), at least one opening (e.g., openings 14a, 14b), a plurality of second engaging portions 16, a plurality of second serrations 124a, a plurality of imaginary cutting lines 18, and a plurality of single lanes 19. The frame 11 surrounds the second substrate units (e.g., second substrate units 12a, 12b, 12c, 12d, 12e) and the removable first substrate units (e.g., first substrate units 22a, 22b). The frame 11 may also be referred to as a "side rail."

[0041] The second substrate units (e.g., second substrate units 12a, 12b, 12c, 12d, 12e) are defined by an imaginary cutting line 18. It should be noted that the imaginary cutting line 18 is different from the single lane 19 in the present disclosure. If some of the second substrate units are found to be defective units or bad units that fail a test (e.g., an electrical test and / or a functional test), they will be marked as unqualified units or "NG" units and will be cut off along the imaginary cutting line 18. They will then be replaced by qualified units (or known good units) cut from the compensation substrate structure. In contrast, after the molding process, the substrate structure 1 and the package covering the electrical components on the substrate structure 1 are singulated along the single lane 19 to form a plurality of package structures. As Figure 1 As shown, there are no slots between the second substrate units (e.g., second substrate units 12a, 12b, 12c, 12d, 12e), between the second substrate units (e.g., second substrate units 12a, 12b, 12c, 12d, 12e) and the frame 11, between the removable first substrate units (e.g., first substrate units 22a, 22b) and the frame 11, and between the second substrate units (e.g., second substrate units 12a, 12b, 12c, 12d, 12e) and the removable first substrate units (e.g., first substrate units 22a, 22b).

[0042] like Figure 2 As shown, the second substrate elements (e.g., second substrate elements 12a, 12b, 12c, 12d, and 12e) may have sidewalls when adjacent substrate elements are cut away. For example, second substrate element 12a has a lower sidewall 121a, second substrate element 12b has a right sidewall 121b, second substrate element 12c has an upper sidewall 121c, and second substrate element 12d has a left sidewall 121d. Opening 14a is substantially defined by a plurality of sidewalls (e.g., sidewalls 121a, 121b, 121c, and 121d) of the second substrate elements (e.g., second substrate elements 12a, 12b, 12c, and 12d). In other words, the sidewalls (e.g., sidewalls 121a, 121b, 121c, and 121d) of the second substrate elements (e.g., second substrate elements 12a, 12b, 12c, and 12d) serve as the sidewalls of opening 14a. The second serration portion 124a is provided on the sidewalls (eg, the sidewalls 121a, 121b, 121c, 121d) of the second substrate unit (eg, the second substrate units 12a, 12b, 12c, 12d).

[0043] Furthermore, for example, second substrate unit 12a has right sidewall 122a, second substrate unit 12b has upper sidewall 122b, and frame 11 has inner upper sidewall 111 and inner right sidewall 112. Similarly, opening 14b is substantially defined by multiple sidewalls (e.g., sidewalls 122a, 122b) of the second substrate units (e.g., second substrate units 12a, 12b) and sidewalls (e.g., sidewalls 111, 112) of frame 11. In other words, the sidewalls (e.g., sidewalls 122a, 122b) of the second substrate units (e.g., second substrate units 12a, 12b) and the sidewalls (e.g., sidewalls 111, 112) of frame 11 serve as sidewalls of opening 14b.

[0044] In one or more embodiments, the size, dimensions, and profile of the second substrate units (e.g., second substrate units 12a, 12b, 12c, 12d) may be substantially equal to the size, dimensions, and profile of the openings (e.g., openings 14a, 14b). In addition, the size, dimensions, and profile of the detachable first substrate units (e.g., first substrate units 22a, 22b) may be substantially equal to the size, dimensions, and profile of the openings (e.g., openings 14a, 14b). In one or more embodiments, the width W1 ( Figure 3 ) may be substantially equal to or greater than the width W2 ( Figure 6 In one or more embodiments, the width W1 of the detachable first substrate unit (e.g., first substrate units 22a, 22b) is greater than the width W2 of the opening (e.g., openings 14a, 14b) by 10 μm or more, 20 μm or more, or 30 μm or more. The opening 14a includes a plurality of corners 142a (e.g., four corners 142a). Each second engaging portion 16 is disposed at each corner 142a of the opening 14a.

[0045] like Figure 1As shown, when the removable first substrate unit (e.g., first substrate units 22a, 22b) is placed in an opening (e.g., openings 14a, 14b), the second engaging portion 16 engages with the first engaging portion 223a, and at least one sidewall of the removable first substrate unit (e.g., first substrate units 22a, 22b) contacts a sidewall of the second substrate unit (e.g., second substrate units 12a, 12b, 12c, 12d). For example, when the removable first substrate unit 22a is placed in the opening 14a, the second engaging portion 16 at the corner 142a of the opening 14a engages with the first engaging portion 223a at the corner 222a of the removable first substrate unit 22a. Furthermore, the first serrations 224a on the sidewall 221a of the removable first substrate unit 22a engage with the second serrations 124a on the sidewalls (e.g., sidewalls 121a, 121b, 121c, 121d) of the second substrate units (e.g., second substrate units 12a, 12b, 12c, 12d). Consequently, the failure rate of the substrate structure 1 is improved. Furthermore, the substrate body 10 can securely hold the removable first substrate units (e.g., first substrate units 22a, 22b) that have passed the compensation test. Specifically, the removable first substrate units (e.g., first substrate units 22a, 22b) can be securely positioned within the openings (e.g., openings 14a, 14b). The engagement force between the removable first substrate units (e.g., first substrate units 22a, 22b) and the substrate body 10 can be relatively high, and the first substrate units (e.g., first substrate units 22a, 22b) are less likely to fall off the substrate body 10.

[0046] Figure 3 show Figure 1 and Figure 2 A top view of the first substrate unit 22a. The first substrate unit 22a includes four corners 222a, four first engaging portions 223a, four first serrations 224a and an effective area 225. The detachable first substrate unit 22a has four side walls 221a. Each side wall 221a is disposed between two corners 222a. Each first engaging portion 223a is disposed at each of the corners 222a of the detachable first substrate unit 22a. The first engaging portion 223a is a recessed portion or a notch. Figure 3 As shown, the shape of the detachable first substrate unit 22a is a square with a width W1. However, in other embodiments, the shape of the detachable first substrate unit 22a may be other shapes. Figure 3 As shown, the shape of the first engagement portion 223a is a square or a trapezoid. However, in other embodiments, the shape of the first engagement portion 223a may be other shapes, such as a triangle or a semicircle. In addition, each first serration portion 224a is provided on each side wall 221a. Figure 3 As shown, the shape of the teeth of the first serration portion 224a is square. However, in other embodiments, the shape of the teeth of the first serration portion 224a may be other shapes, such as a triangle or a semicircle. In addition, the effective area 225 is defined by the single lane 19, and the first engaging portion 223a is disposed outside the effective area 225. It should be noted that the electrical components (e.g., semiconductor dies, passive components, or circuit layers) are disposed within the effective area 225. After the molding process, the first substrate unit 22a and the package body covering the electrical components (e.g., semiconductor dies, passive components, or circuit layers) on the first substrate unit 22a are singulated along the single lane 19 to form a package structure. Therefore, the effective area 225 is the area retained in the package structure. As shown in FIG. Figure 3 As shown, there is a gap g between the sidewall 221a of the detachable first substrate unit 22a and the effective area 225 of the detachable first substrate unit 22a. The gap g is greater than zero. For example, the gap g can be greater than 0.1 mm, greater than 0.5 mm, or greater than 1.0 mm.

[0047] Figure 4 show Figure 1 Magnified view of area "A" in the middle. Figure 4 The second substrate unit 12e is shown as part of the substrate body 10. The second substrate unit 12e is defined by an imaginary cut line 18. If the second substrate unit 12e is found to be a defective unit or a bad unit that fails a test (e.g., an electrical test and / or a functional test), it will be marked as a failed unit or an "NG" unit and will be cut away from the substrate body 10 along the imaginary cut line 18. It will then be replaced by a qualified unit (or known good unit) cut from the compensating substrate structure (i.e., the detachable first substrate unit (e.g., the first substrate units 22a, 22b)). In some embodiments, the size, dimensions, and contour of the second substrate unit 12e may be similar to those of the detachable first substrate unit 22a ( Figure 3 ) are substantially the same in size, dimensions and outline. The second substrate unit 12e includes four imaginary corners 122e, four imaginary first meshing portions 123e, four imaginary first serration portions 124e and an effective area 125. The second substrate unit 12e has four imaginary side walls 121e. Each imaginary side wall 121e is disposed between two imaginary corners 122e. Each imaginary first meshing portion 123e is disposed at each imaginary corner 122e of the second substrate unit 12e. The size and outline of the imaginary first meshing portion 123e are substantially the same as those of the second substrate unit 12e. Figure 3 The size and profile of the first engaging portion 223a of the first substrate unit 22a are the same as those of the first engaging portion 223a of the first substrate unit 22a. The size and profile of the first sawtooth portion 124e are assumed to be the same as those of the first sawtooth portion 124e. Figure 3 The first serration portion 224a of the first substrate unit 22a has the same size and profile.

[0048] The active area 125 of the second substrate unit 12e is defined by the singulation lanes 19. It should be noted that the electrical components (e.g., semiconductor die, passive components, or circuit layers) are disposed within the active area 125. After the molding process, the second substrate unit 12e and the package covering the electrical components (e.g., semiconductor die, passive components, or circuit layers) on the second substrate unit 12e are singulated along the singulation lanes 19 to form a package structure. Therefore, the active area 125 is the area remaining in the package structure. Figure 4 As shown, there is a gap g between the imaginary cutting line 18 and the effective area 125 (or the single lane 19). The gap g is greater than zero. For example, the gap g may be greater than 0.1 mm, greater than 0.5 mm, or greater than 1.0 mm.

[0049] Figure 5 show Figure 1 and Figure 2 FIG. 1 is a top view of a substrate structure 1 , wherein the detachable first substrate unit (eg, first substrate units 22 a, 22 b ) is omitted for the purpose of clear explanation. Figure 6 show Figure 5 Magnified view of area "B" in the middle. Figure 6 The opening 14a shown is a portion of the substrate body 10 and is used to receive the first substrate unit 22a. The opening 14a is substantially defined by the side walls 121a, 121b, 121c, 121d of the second substrate units 12a, 12b, 12c, 12d. In other words, the side walls 121a, 121b, 121c, 121d of the second substrate units 12a, 12b, 12c, 12d are the side walls of the opening 14a. The second serrations 124a are provided on the side walls 121a, 121b, 121c, 121d of the second substrate units 12a, 12b, 12c, 12d. Each second engaging portion 16 is provided at each corner 142a of the opening 14a. Figure 6 As shown, the second engaging portion 16 is a first engaging portion 223a ( Figure 3 ) of the protruding part. Figure 6 As shown, the shape of the second engaging portion 16 is a square or a trapezoid. However, in other embodiments, the shape of the second engaging portion 16 may be other shapes, such as a triangle or a semicircle. In addition, each second sawtooth portion 124a corresponds to each first sawtooth portion 224a ( Figure 3 ).like Figure 6 As shown, the shape of the teeth of the second sawtooth portion 124a is square. However, in other embodiments, the shape of the teeth of the second sawtooth portion 124a may be other shapes, such as triangle or semicircle. Figure 6As shown, the shape of the opening 14a is a square with a width W2. However, in other embodiments, the shape of the opening 14a may be other shapes.

[0050] Figure 7 A top view of the first substrate unit 22c of some embodiments of the present disclosure is shown. The first substrate unit 22c can be Figure 3 The first substrate unit 22a is similar except for the number of first engaging portions 223a. Figure 7 As shown, the first substrate unit 22c includes only two first engaging portions 223a, and the first engaging portions 223a are provided at diagonally opposite corners 222a.

[0051] Figure 8 A top view of the first substrate unit 22d is shown for some embodiments of the present disclosure. Figure 3 The first substrate unit 22a is similar except for the outline of the first engaging portions 223b, 223c. Figure 8 As shown, the first substrate unit 22d includes two first engaging portions 223b and two first engaging portions 223c. The first engaging portions 223b are located at diagonally opposite corners 222b, and the first engaging portions 223c are located at diagonally opposite corners 222c. The first engaging portions 223b are convex portions, such as those with a three-quarter circle or semicircular outline. The first engaging portions 223c are concave portions, such as those with a quarter circle outline.

[0052] Figure 9 A top view of the first substrate unit 22e of some embodiments of the present disclosure is shown. The first substrate unit 22e can be Figure 3 The first substrate element 22a is similar except for the outlines of the first engaging portions 223d, 223e and the outline of the active area 225e. Figure 9 As shown, the first substrate unit 22e includes three first engaging portions 223d, a first engaging portion 223e, four sidewalls 221e and an effective area 225e. The contour of the first engaging portion 223d is similar to that of the first engaging portion 223e. Figure 3The first meshing portion 223a has the same profile as the first meshing portion 223e. The profile of the first meshing portion 223e is different from the profile of the first meshing portion 223d. In other words, the first meshing portions 223d and 223e of the first substrate unit 22e have different profiles. For example, the profile of the first meshing portion 223e may be semicircular. In addition, the edge of the effective area 225e is very close to the side wall 221e, so that the area of ​​the effective area 225e is increased. For example, the gap g1 between the side wall 221e and the edge of the effective area 225e (or the single lane 19) may be less than 1.0 mm, less than 0.5 mm, or less than 0.1 mm. The effective area 225e has four chamfers at its corners. Each chamfer corresponds to each of the first meshing portions 223d and 223e. Therefore, the effective area 225e is substantially octagonal.

[0053] Figure 10 show Figure 2 sectional view of a portion of the substrate structure 1. Figure 11 show Figure 1 A cross-sectional view of a portion of the substrate structure 1. Figure 10 As shown, the sidewalls 121b and 121d of the opening 14a are inclined, and the sidewall 221a of the removable first substrate unit 22a is also inclined. The opening 14a tapers from its top to its bottom, so the width W2 (i.e., the maximum width) of the top side of the opening 14a is greater than the width W4 (i.e., the minimum width) of the bottom side of the opening 14a. Furthermore, the removable first substrate unit 22a also tapers from its top to its bottom, so the width W1 (i.e., the maximum width) of the top side of the removable first substrate unit 22a is greater than the width W3 (i.e., the minimum width) of the bottom side of the removable first substrate unit 22a. The slope of the sidewalls 121b and 121d of the opening 14a is substantially equal to the slope of the sidewall 221a of the detachable first substrate unit 22a, and the maximum width W1 of the detachable first substrate unit 22a is greater than the minimum width W4 of the opening 14a, allowing the sidewalls 121b and 121d of the opening 14a to receive the sidewall 221a of the detachable first substrate unit 22a. In one embodiment, the top width W2 and bottom width W4 of the opening 14a are substantially equal to the top width W1 and bottom width W3 of the detachable first substrate unit 22a, respectively. However, in other embodiments, the top width W1 of the detachable first substrate unit 22a may be 20 μm greater than the top width W2 of the opening 14a, allowing the detachable first substrate unit 22a to be securely positioned within the opening 14a.

[0054] Figure 12 A top view of a substrate structure 3 is shown according to some embodiments of the present disclosure. Figure 13 show Figure 123D exploded view of the substrate structure 3. The substrate structure 3 may be a PBGA substrate. The PBGA substrate structure 3 includes a plurality of slots 33 disposed between substrate units (e.g., substrate units 32a, 32b, 32c, 32e). Thus, the substrate units (e.g., substrate units 32a, 32b, 32c, 32e) are separated by the slots 33 and connected to the frame 31 of the PBGA substrate structure 3 via connecting rods 35. A gap may exist between the side of one substrate unit and the side of an adjacent substrate unit. For example, there is a gap between the side 321b of the substrate unit 32b and the side 321e of the adjacent substrate unit 32e. In addition, the corners of the substrate units (e.g., substrate units 32a, 32b, 32c, 32e) do not contact the adjacent substrate units of the frame 31.

[0055] refer to Figure 12 and Figure 13 The substrate structure 3 includes at least one detachable first substrate unit (e.g., first substrate units 42a, 42b) and a substrate body 30. The detachable first substrate units 42a, 42b are compensation qualified units (or compensation known good units) cut out from the compensation substrate structure. For example, the detachable first substrate unit 42a includes multiple sidewalls 421a (e.g., four sidewalls 421a), multiple first engaging portions (e.g., four first engaging portions 423), and multiple first clamping portions (e.g., two first clamping portions 424 and two first clamping portions 426). The detachable first substrate unit 42a has multiple sidewalls 421a (e.g., four sidewalls 421a). Two first engaging portions 423 are provided on one sidewall 421a, two first clamping portions 424 are provided on one sidewall 421a, and two first clamping portions 426 are provided on one sidewall 421a. It should be noted that the size, dimensions, and profile of the detachable first substrate unit 42b can be substantially the same as the size, dimensions, and profile of the detachable first substrate unit 42a. The material of the detachable first substrate unit (e.g., first substrate units 42a, 42b) can include glass-reinforced epoxy materials (e.g., FR4), bismaleimide triazine (BT), epoxy, silicon, printed circuit board (PCB) materials, glass, or ceramics.

[0056] The material of the substrate body 30 may be the same as or different from the material of the detachable first substrate unit (e.g., the first substrate units 42a, 42b). For example, the material of the substrate body 30 may include glass-reinforced epoxy resin material (e.g., FR4), bismaleimide triazine (BT), epoxy resin, silicon, printed circuit board (PCB) material, glass, or ceramic. Figure 12 and Figure 13As shown, the substrate body 30 includes a frame 31, a plurality of slots 33, a plurality of second substrate units (e.g., second substrate units 32a, 32b, 32c, 32e), at least one opening (e.g., openings 34a, 34b), a plurality of second engaging portions (e.g., four second engaging portions 361), a plurality of second clamping portions (e.g., two second clamping portions 362 and two second clamping portions 363), a plurality of imaginary cutting lines 18, and a plurality of single lanes 19. The frame 31 surrounds the second substrate units (e.g., second substrate units 32a, 32b, 32c, 32e) and the removable first substrate units (e.g., first substrate units 42a, 42b). The slots 33 are provided on the frame 31 to define the second substrate units (e.g., second substrate units 32a, 32b, 32c, 32e).

[0057] The second substrate units (e.g., second substrate units 32a, 32b, 32c, 32e) are defined by an imaginary cut line 18 and half of a slot 33. If some of the second substrate units are found to be defective or bad cells that fail a test (e.g., an electrical test and / or a functional test), they will be marked as failed cells or "NG" cells and will be cut away along the imaginary cut line 18 and the slot 33. They will then be replaced with good cells (or known good cells) cut from the compensation substrate structure. Figure 12 As shown, the slots are arranged between the second substrate units (e.g., the second substrate units 32b, 32e, 32c), between the second substrate units (e.g., the second substrate units 32a, 32b, 32c, 32e) and the frame 31, between the removable first substrate units (e.g., the first substrate units 42a, 42b) and the frame 31, and between the second substrate units (e.g., the second substrate unit 32a) and the removable first substrate units (e.g., the first substrate units 42a, 42b).

[0058] like Figure 12 and Figure 13 As shown, second substrate unit 32a has sidewall 321a, second substrate unit 32b has sidewall 321b, and second substrate unit 32e has sidewall 321e. Opening 34a is substantially defined by at least one sidewall (e.g., sidewall 321a) of the second substrate unit (e.g., second substrate unit 32a) and at least two sidewalls (e.g., three sidewalls 311) of frame 31. That is, the sidewalls (e.g., sidewall 321a) of the second substrate unit (e.g., second substrate unit 32a) and the sidewalls (e.g., three sidewalls 311) of frame 31 serve as the sidewalls of opening 34a. Second clamping portions 362 are disposed on sidewalls (e.g., sidewall 321a) of the second substrate unit (e.g., second substrate unit 32a), and second clamping portions 363 are disposed on sidewalls (e.g., sidewall 311) of frame 31.

[0059] In one or more embodiments, the size of the second substrate unit (e.g., second substrate units 32a, 32b, 32c, 32e) can be substantially different from the size of the opening (e.g., openings 14a, 14b). In addition, the size of the removable first substrate unit (e.g., first substrate units 42a, 42b) can be substantially different from the size of the opening (e.g., openings 14a, 14b). In one or more embodiments, the width W5 ( Figure 14 ) may be substantially smaller than the width W6 of the opening 34a ( Figure 16 ).

[0060] like Figure 12 As shown, when the removable first substrate unit (e.g., first substrate units 42a, 42b) is placed in the opening (e.g., openings 34a, 34b), the second engaging portion 361 engages with the first engaging portion 423, the second clamping portion 362 engages with the first clamping portion 424, and the second clamping portion 363 engages with the first clamping portion 426. Therefore, the failure rate of the substrate structure 3 is improved. Furthermore, the substrate body 30 can securely hold the removable first substrate unit (e.g., first substrate units 42a, 42b) that has passed the compensation test. That is, the removable first substrate unit (e.g., first substrate units 42a, 42b) can be securely placed in the opening (e.g., openings 34a, 34b). The engagement force between the removable first substrate unit (e.g., first substrate units 42a, 42b) and the substrate body 30 can be relatively high, and the first substrate unit (e.g., first substrate units 42a, 42b) is less likely to fall off the substrate body 30.

[0061] Figure 14 show Figure 12 and Figure 13 The first substrate unit 42a is a top view of the first substrate unit 42a. The first substrate unit 42a includes four side walls 421a, four first engaging portions 423, two first clamping portions 424, two first clamping portions 426 and an effective area 425. The first engaging portion 423 and the first clamping portions 424 and 426 are provided on the side wall 421a. The first engaging portion 423 is a protruding portion having a trapezoidal end, the first clamping portion 424 is a clamping portion, and the first clamping portion 426 is a protruding portion having a semicircular end. Figure 14As shown, the shape of the detachable first substrate unit 42a is substantially square with a width W5. However, in other embodiments, the shape of the detachable first substrate unit 42a may be other shapes. In addition, the active area 425 is defined by the singulation lane 19, and the first engaging portion 423 and the first clamping portions 424 and 426 are disposed outside the active area 425. It should be noted that the electrical components (e.g., semiconductor dies, passive components, or circuit layers) are disposed within the active area 425. After the molding process, the first substrate unit 42a and the package body covering the electrical components (e.g., semiconductor dies, passive components, or circuit layers) on the first substrate unit 42a are singulated along the singulation lanes 19 to form a package structure. Therefore, the active area 425 is the area retained in the package structure.

[0062] Figure 15 show Figure 12 Magnified view of area “C” in the middle. Figure 15 The second substrate unit 32e is shown as part of the substrate body 30. The second substrate unit 32e is defined by the imaginary cut line 18 and half of the slot 33. If the second substrate unit 32e is found to be a defective unit or a bad unit that fails a test (e.g., an electrical test and / or a functional test), it will be marked as a failed unit or an "NG" unit and will be cut away from the substrate body 30 along the imaginary cut line 18 and the slot 33. It will then be replaced by a qualified unit (or known good unit) cut from the compensating substrate structure (i.e., the detachable first substrate unit (e.g., the first substrate units 42a, 42b)). In some embodiments, the size, dimensions, and contour of the second substrate unit 32e may be similar to those of the detachable first substrate unit 42a ( Figure 14 The second substrate unit 12e includes four sidewalls 321e, four imaginary first engaging portions 323, two imaginary first clamping portions 324, two imaginary first clamping portions 326, and an effective area 325.

[0063] The imaginary first engaging portion 323 and the imaginary first clamping portions 324 and 326 are provided on the side wall 321e. The size and profile of the imaginary first engaging portion 323 are similar to those of the imaginary first clamping portions 324 and 326. Figure 14 The size and profile of the first engaging portion 423 of the first substrate unit 42a are the same as those of the first clamping portions 324 and 326. Figure 14 The first clamping portions 424, 426 of the first substrate unit 42a are identical in size and profile.

[0064] The active area 325 of the second substrate unit 32e is defined by singulation lanes 19. It should be noted that electrical components (e.g., semiconductor die, passive components, or circuit layers) are disposed within the active area 325. After the molding process, the second substrate unit 32e and the package body covering the electrical components (e.g., semiconductor die, passive components, or circuit layers) on the second substrate unit 32e are singulated along the singulation lanes 19 to form a package structure. Therefore, the active area 325 is the area remaining in the package structure.

[0065] Figure 16 show Figure 12 and Figure 13 FIG. 3 is a top view of a substrate structure 3, wherein the detachable first substrate unit (eg, first substrate units 42a, 42b) is omitted for the purpose of clear explanation. Figure 16 The illustrated opening 34a is a portion of the substrate body 30 and is configured to receive the first substrate unit 42a.

[0066] The opening 34a is substantially defined by at least one side wall (e.g., side wall 321a) of the second substrate unit (e.g., second substrate unit 32a) and at least two side walls (e.g., three side walls 311) of the frame 31. That is, the side walls (e.g., side wall 321a) of the second substrate unit (e.g., second substrate unit 32a) and the side walls (e.g., three side walls 311) of the frame 31 are the side walls of the opening 34a. The second engaging portion 361 is disposed on the side walls (e.g., three side walls 311) of the frame 31. The second clamping portion 362 is disposed on the side walls (e.g., side wall 321a) of the second substrate unit (e.g., second substrate unit 32a), and the second clamping portion 363 is disposed on the side walls (e.g., side wall 311) of the frame 31. As Figure 16 As shown, the second engaging portion 361 is a first engaging portion 423 ( Figure 14 ) is a concave part. Figure 16 As shown, the shape of the second engaging portion 361 is a square or a trapezoid. However, in other embodiments, the shape of the second engaging portion 361 may be other shapes, such as a triangle or a semicircle. In addition, each second clamping portion 362 corresponds to each first clamping portion 424 ( Figure 14 ), and each second clamping portion 363 corresponds to each first clamping portion 426 ( Figure 14 ). In addition, the shape of the opening 34a is substantially square with a width W6. The width W6 of the opening 34a is larger than the width of the detachable first substrate unit 42a ( Figure 14 It should be understood that the width W6 of the opening 34a can be the width of the detachable first substrate unit 42a ( Figure 14) and the total width of the slot 33.

[0067] Figures 17 to 24 One or more stages of some embodiments of the manufacturing process of the present disclosure are shown. Figure 17 , providing a first substrate structure 2. In these embodiments, the first substrate structure 2 may be similar to Figure 1 and Figure 2 The substrate structure 1 shown includes at least one first substrate unit (eg, including first substrate units 22a, 22b, 22c) defined by a plurality of imaginary cutting lines 18. The first substrate structure 2 is a compensation substrate structure.

[0068] refer to Figure 18 , the first substrate structure 2 is tested (for example, electrical test and / or functional test). That is, all first substrate units of the first substrate structure 2 are tested (for example, including first substrate units 22a, 22b, 22c). Then, some first substrate units that have passed the test (for example, including first substrate units 22a, 22b) will be marked as qualified units or known good units, and will be cut out along the imaginary cutting line 18. For example, the qualified first substrate units 22a, 22b are removed from the first substrate structure 2. That is, a cutting process is performed along the imaginary cutting line 18 by, for example, stamping or laser cutting to remove the first substrate units 22a, 22b from the first substrate structure 2. The qualified first substrate units 22a, 22b will be referred to as compensation substrate units. For example, the qualified first substrate unit 22a and the qualified first substrate unit 22a are Figures 1 to 3 The first substrate unit 22a is substantially identical to the first substrate unit 22a. The first substrate unit 22a includes four corners 222a, four first engaging portions 223a, four first serrations 224a, and an active area 225. The first substrate unit 22a has four sidewalls 221a. Each sidewall 221a is positioned between two corners 222a. Each first engaging portion 223a is positioned at each corner 222a of the first substrate unit 22a. In addition, each first serration 224a is positioned on each sidewall 221a.

[0069] refer to Figure 19 , providing a second substrate structure 1 '. In these embodiments, the second substrate structure 1 ' may be similar to Figure 1 and Figure 2 In the substrate structure 1 shown, the second substrate structure 1 ′ includes a plurality of second substrate units (eg, including second substrate units 12 a , 12 b , 12 c , 12 d , 12 e , 12 f , and 12 g ) defined by a plurality of imaginary cutting lines 18 .

[0070] refer to Figure 20, the second substrate structure 1' is tested (for example, electrical test and / or functional test). That is, all the second substrate units of the second substrate structure 1' are tested (for example, including the second substrate units 12a, 12b, 12c, 12d, 12e). Then, some second substrate units (for example, including the second substrate units 12f, 12g) are found to be defective units or bad units that have failed the test (for example, electrical test and / or functional test). Then, they will be marked as unqualified units or "NG" units and will be cut away along the imaginary cutting line 18. For example, the unqualified second substrate units 12f, 12g are removed from the second substrate structure 1'. That is, a cutting process is performed along the imaginary cutting line 18 by, for example, stamping or laser cutting to remove the second substrate units 12f, 12g from the second substrate structure 1'. The second substrate units 12f, 12g will be ignored.

[0071] At the same time, at least one opening (eg, including openings 14a and 14b), a plurality of second engaging portions 16, and a plurality of second sawtooth portions 124a are formed in the second substrate structure 1'. Figure 5 and Figure 6 The openings 14a and 14b shown are substantially identical. Opening 14a is substantially defined by the sidewalls 121a, 121b, 121c, and 121d of the second substrate elements 12a, 12b, 12c, and 12d. In other words, the sidewalls 121a, 121b, 121c, and 121d of the second substrate elements 12a, 12b, 12c, and 12d serve as the sidewalls of opening 14a. Second serrations 124a are provided on the sidewalls 121a, 121b, 121c, and 121d of the second substrate elements 12a, 12b, 12c, and 12d. Each second engaging portion 16 is provided at each corner 142a of opening 14a.

[0072] refer to Figure 21 ,Will Figure 18 The qualified first substrate units 22a, 22b are arranged or placed in the openings 14a, 14b of the second substrate structure 1' to form Figures 1 to 6 The substrate structure 1. That is, Figure 19 and Figure 20 The unqualified second substrate units 12f, 12g of the second substrate structure 1' are replaced by Figure 17 and Figure 18Qualified first substrate units 22a, 22b. Therefore, the failure rate (or yield loss) of the substrate structure 1 is improved. When the first substrate unit (e.g., first substrate units 22a, 22b) is placed in the opening (e.g., openings 14a, 14b), the second engaging portion 16 engages with the first engaging portion 223a, and at least one sidewall of the removable first substrate unit (e.g., first substrate units 22a, 22b) contacts the sidewall of the second substrate unit (e.g., second substrate units 12a, 12b, 12c, 12d). For example, when the removable first substrate unit 22a is placed in the opening 14a, the second engaging portion 16 at the corner 142a of the opening 14a engages with the first engaging portion 223a at the corner 222a of the removable first substrate unit 22a. Furthermore, the first serrations 224a on the sidewall 221a of the removable first substrate unit 22a engage with the second serrations 124a on the sidewalls (e.g., sidewalls 121a, 121b, 121c, 121d) of the second substrate units (e.g., second substrate units 12a, 12b, 12c, 12d). Consequently, the substrate body 10 can securely hold the removable first substrate units (e.g., first substrate units 22a, 22b) that have passed the compensation test. Specifically, the removable first substrate units (e.g., first substrate units 22a, 22b) can be securely positioned within the openings (e.g., openings 14a, 14b). The engagement force between the removable first substrate units (e.g., first substrate units 22a, 22b) and the substrate body 10 can be relatively high, and the first substrate units (e.g., first substrate units 22a, 22b) are less likely to fall off the substrate body 10.

[0073] refer to Figure 22 , multiple electrical components (eg, semiconductor die 50, passive components 52, or circuit layers) are attached to the top surface of the second substrate structure 1' (or substrate structure 1) within an active area (eg, active area 225 of the first substrate unit 22a).

[0074] refer to Figure 23 , using a package body 54 to cover the electrical components (e.g., semiconductor die 50, passive components 52, or circuit layers) and the second substrate structure 1' (or substrate structure 1). Since the substrate structure 1 is a matrix array BGA substrate or a Dofu-BGA substrate, the package body 54 will cover all substrate units on one side of the substrate structure 1 during the molding process. For example, before the molding process, the substrate structure 1 can be set or accommodated in a cavity of the molding groove. The substrate structure 1 may have only one molding gate, so during the molding process, the package body 54 can flow through the molding gate to enter the cavity of the molding groove and cover all substrate units at the same time. The package body 54 is formed in one piece at the same time.

[0075] refer to Figure 24A singulation process is performed along the singulation lanes 19 of the second substrate structure 1 ′ (or substrate structure 1 ) to form a plurality of package structures 5 . It should be noted that the active area (eg, active area 225 ) is the area remaining in the package structure 5 .

[0076] As used herein, the singular terms "a," "an," and "the" may include plural referents unless the context clearly dictates otherwise.

[0077] Unless otherwise indicated, spatial descriptions such as "above," "below," "up," "left," "right," "lower," "top," "bottom," "vertical," "horizontal," "side," "above," "below," "upper," "on," "below," etc., are indicated relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and actual embodiments of the structures described herein may be spatially arranged in any orientation or manner, with the proviso that the advantages of the embodiments of the present disclosure do not deviate from such arrangements.

[0078] As used herein, the terms "substantially," "approximately," "substantially," and "about" are used to describe and account for small variations. When used in conjunction with an event or circumstance, the terms may refer to instances where the event or circumstance clearly occurred as well as instances where the event or circumstance closely approximates to occurring. For example, when used in conjunction with a numerical value, the terms may refer to a range of variation of less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, two values ​​may be considered “substantially” the same or equal if the difference between them is less than or equal to ±10% of the mean of the values ​​(e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%).

[0079] Two surfaces may be considered coplanar or substantially coplanar if the displacement between them is no greater than 5 μm, no greater than 2 μm, no greater than 1 μm, or no greater than 0.5 μm.

[0080] In the description of some embodiments, a component provided "on" another component may include a situation where the latter component is directly on (e.g., in physical contact with) the former component, as well as a situation where one or more intervening components are located between the former and latter components.

[0081] In addition, amounts, ratios, and other numerical values ​​are sometimes presented herein in a range format. It should be understood that such range format is used for convenience and brevity and should be interpreted flexibly to include not only the values ​​explicitly specified as limits of the range, but also all individual values ​​or sub-ranges encompassed within the range, as if each value and sub-range were explicitly specified.

[0082] Although the present disclosure has been described and illustrated with reference to specific embodiments of the present disclosure, these descriptions and illustrations are not restrictive. Those skilled in the art will understand that various changes may be made and equivalents substituted without departing from the true spirit and scope of the present disclosure as defined by the appended claims. Illustrations may not necessarily be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the artistic reproduction in the present disclosure and the actual device. There may be other embodiments of the present disclosure that are not specifically described. The description and drawings should be regarded as illustrative, not restrictive. Modifications may be made to adapt specific circumstances, materials, compositions of matter, methods or processes to the objectives, spirit and scope of the present invention. All such modifications are intended to be within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations may be combined, subdivided or reordered to form equivalent methods without departing from the teachings of the present invention. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of the present disclosure.

Claims

1. A substrate structure comprising: at least one detachable first substrate unit, comprising a plurality of corners and a plurality of first engaging portions, wherein each of the first engaging portions is disposed at each of the corners of the detachable first substrate unit, and a sidewall of the detachable first substrate unit is inclined; and A substrate body comprising a plurality of second substrate units, at least one opening and a plurality of second engaging portions, wherein the opening is substantially defined by a plurality of side walls of the second substrate unit, the opening comprises a plurality of corners, and the side walls of the opening are inclined, each of the second engaging portions is arranged at each of the corners of the opening, the detachable first substrate unit is arranged in the opening, the side walls of the opening receive the side walls of the detachable first substrate unit, and the second engaging portions engage with the first engaging portions. 2 . The substrate structure according to claim 1 , wherein the sidewall of the second substrate unit is a sidewall of the opening. 3 . The substrate structure according to claim 1 , wherein a sidewall of the detachable first substrate unit contacts the sidewall of the second substrate unit. 4 . The substrate structure according to claim 1 , wherein the first engaging portion is a concave portion, and the second engaging portion is a convex portion. The substrate structure of claim 1 , wherein the first engaging portion has different profiles.

6. The substrate structure according to claim 1, wherein the detachable first substrate unit further includes a plurality of first serration portions arranged on the side wall of the detachable first substrate unit, the substrate body further includes a plurality of second serration portions arranged on the side wall of the second substrate unit, and the first serration portions are engaged with the second serration portions. 7 . The substrate structure according to claim 1 , wherein a size of the second substrate unit is substantially equal to a size of the opening. 8 . The substrate structure according to claim 1 , wherein a size of the detachable first substrate unit is substantially equal to a size of the opening. 9 . The substrate structure according to claim 1 , wherein a width of the detachable first substrate unit is substantially equal to or greater than a width of the opening. 10 . The substrate structure according to claim 9 , wherein the width of the detachable first substrate unit is 20 μm greater than the width of the opening. The substrate structure according to claim 1 , wherein the opening is tapered from a top side toward a bottom side thereof. 12 . The substrate structure according to claim 11 , wherein a maximum width of the detachable first substrate unit is greater than a minimum width of the opening. 13 . The substrate structure according to claim 1 , wherein the detachable first substrate unit further includes an active area, and the first engaging portion is provided outside the active area. 14 . The substrate structure according to claim 13 , wherein a gap exists between a sidewall of the detachable first substrate unit and the active area of ​​the detachable first substrate unit.

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