A double-molded LED product and manufacturing process

Abstract

The present application discloses a double-molded LED product and a manufacturing process, wherein the LED product includes a PCB board, an LED chip fixedly mounted on the PCB board, a reflective cup formed by a first molding, and a protective plate formed by a second molding; the reflective cup is arranged on the PCB board, and the protective plate is arranged on the reflective cup, and the shape and size of the protective plate are adapted to the shape and size of the reflective cup, and the protective plate, the reflective cup and the PCB board together form a receiving space for receiving the LED chip. The reflective cup is obtained by molding the first organic material for the first time, and then the LED chip is fixed on the PCB board, and then the protective plate is molded for the second time with the second organic material, so that the problem of stress release in the LED product can be solved, and the reliability and air tightness of the LED product can be improved.

Description

Technical Field

[0001] The present application relates to the field of LED technology, and in particular to a double-molded LED product and a manufacturing process. Background Art

[0002] LED products are widely used in the lighting and display industries due to their advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free and environmental protection, and have become one of the most watched products in recent years.

[0003] The packaging of LED products refers to the packaging of light-emitting chips. The packaging of LEDs is not only required to protect the wick, but also to be able to transmit light. The existing LED packaging is to package the chip on the bracket, wrap the chip and the bracket with glue, and then bake it for a long time to solidify the glue, and finally complete the packaging process. This packaging structure is unreliable and easy to fall off. The stress caused by the heat of the chip or the humidity of the environment leads to poor air tightness of the packaging glue. Summary of the invention

[0004] In view of this, the present application provides a double-molded LED product and a manufacturing process, which can effectively solve the above-mentioned problems.

[0005] According to a first aspect of an embodiment of the present application, a double-molded LED product is provided, comprising:

[0006] PCB board;

[0007] LED chip, fixedly mounted on the PCB board;

[0008] A reflective cup is arranged on the PCB board and is made by a first compression molding;

[0009] A protection plate is arranged on the reflective cup, and the protection plate is made by secondary compression molding; the shape and size of the protection plate are adapted to the shape and size of the reflective cup, and together with the reflective cup and the PCB board, form a receiving space for receiving the LED chip.

[0010] In the LED product provided in the embodiment of the present application, the reflective cup is made of a first organic material; the protective plate is made of a second organic material; wherein the first organic material and the second organic material both include the same organic-based skeleton.

[0011] In the LED product provided in the embodiment of the present application, the reflective cup includes a reflective surface and a fixed surface, the reflective surface is conical in shape, and the shape of the fixed surface is compatible with the shape of the PCB board.

[0012] In the LED product provided in the embodiment of the present application, the protection plate includes a tapered portion, and the tapered portion abuts against the reflective cup and the PCB board;

[0013] Wherein, the conical portion includes a curved surface and a flat surface, and the shape and size of the curved surface are adapted to the shape and size of the reflecting surface.

[0014] In the LED product provided in the embodiment of the present application, the protection plate includes a planar portion, and the planar portion is the portion where light of the LED product is emitted.

[0015] In the LED product provided in the embodiment of the present application, the organic-based skeleton includes at least one of an epoxy resin skeleton and an organic silicone skeleton.

[0016] According to a second aspect of an embodiment of the present application, a manufacturing process of a double-molded LED product is provided, wherein the LED product comprises a PCB board, an LED chip, a reflective cup and a protective plate, and wherein the manufacturing process comprises:

[0017] Performing a first molding process on the PCB board using a first organic material to mold the reflective cup on the PCB board to obtain a first assembly;

[0018] The LED chip is fixedly mounted on the PCB board on the first assembly to obtain a second assembly;

[0019] Performing a second molding process on the PCB board and the reflective cup of the second assembly with a second organic material, so as to mold the protection plate on the PCB board and the reflective cup of the second assembly to obtain an LED package device;

[0020] The LED packaging device is cut to obtain individual LED products.

[0021] In the manufacturing process provided in the embodiment of the present application, the first organic material and the second organic material both include the same organic-based skeleton.

[0022] In the manufacturing process provided in the embodiment of the present application, the organic-based skeleton includes at least one of an epoxy resin skeleton and an organic silicone skeleton.

[0023] In the manufacturing process provided in the embodiment of the present application, before the first molding is performed on the PCB board using the first organic material to mold the reflective cup on the PCB board to obtain the first assembly, the process further includes:

[0024] Copper coating and etching are performed on an insulating member made of a resin-based or glass-fiber-like material to obtain the PCB board.

[0025] The technical solution provided by the embodiment of the present application may include the following beneficial effects: The present application provides a double-molded LED product and a manufacturing process, the LED product includes a PCB board, an LED chip fixedly mounted on the PCB board, a reflective cup molded by a first molding, and a protective plate molded by a second molding; the reflective cup is arranged on the PCB board, and the protective plate is arranged on the reflective cup, the shape and size of the protective plate are adapted to the shape and size of the reflective cup, and together with the reflective cup and the PCB board, form a receiving space for accommodating the LED chip. The LED product obtains the reflective cup by first molding with an organic material, then fixes the LED chip on the PCB board, and then obtains the protective plate by second molding with an organic material, so that the problem of stress release in the LED product can be solved, and the reliability and air tightness of the LED product can be improved.

[0026] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 It is a structural schematic diagram of a double-molded LED product provided in one embodiment of the present application;

[0029] Figure 2 yes Figure 1 The schematic diagram of the structure of the LED product at another angle;

[0030] Figure 3 yes Figure 1 Schematic diagram of LED products in the figure;

[0031] Figure 4 yes Figure 1 Schematic diagram of some structures of LED products;

[0032] Figure 5 yes Figure 1 Schematic diagram of the structure of the reflective cup;

[0033] Figure 6 yes Figure 1 A schematic diagram of the structure of the reflective cup at another angle;

[0034] Figure 7 yes Figure 1 A schematic diagram of the structure of the protection plate;

[0035] Figure 8 yes Figure 1 Partial structural diagram of LED products;

[0036] Fig. 9 yes Figure 8 A schematic diagram of the structure of the conductive member in FIG.

[0037] Fig.10 yes Figure 8 A schematic diagram of the structure of the conductive member at another angle;

[0038] Fig.11 yes Figure 8 Schematic diagram of the electrical connection of the LED chip;

[0039] Fig.12 It is a schematic diagram of a process flow of a double-molded LED product manufacturing process provided by an embodiment of the present application;

[0040] Fig.13 This is another schematic diagram of a process for manufacturing a double-molded LED product provided in one embodiment of the present application.

[0041] Description of reference numerals:

[0042] 10, reflective cup; 110, reflective surface; 120, fixed surface;

[0043] 20, protection plate; 210, plane portion; 220, tapered portion; 221, plane; 222, arc surface;

[0044] 30, PCB board; 310, insulating member; 320, conductive member; 321, first conductive surface; 322, second conductive surface; 323, positioning hole;

[0045] 40, LED chip; 410, light emitting chip; 420, driver chip; 430, bonding wire;

[0046] 50. Conductive column;

[0047] 60. Accommodate space. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0049] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0050] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0051] See also Figures 1 to 3 The embodiment of the present application provides a double-molded LED product, including a PCB board 30, an LED chip 40 fixedly mounted on the PCB board 30, a reflective cup 10 molded for the first time, and a protective plate 20 molded for the second time. The reflective cup 10 is arranged on the PCB board 30, and the protective plate 20 is arranged on the reflective cup 10. The shape and size of the protective plate 20 are adapted to the shape and size of the reflective cup 10, and together with the reflective cup 10 and the PCB board 30, form an accommodating space 60 for accommodating the LED chip 40.

[0052] After adopting the above technical scheme, since the protection plate 20 and the reflective cup 10 are both compression molded, the protection plate 20 is used to replace the traditional protective glue. The protection plate 20 is also compression molded, with high dimensional accuracy and small warping deformation, and at the same time has the characteristics of small shrinkage rate and relatively stable mechanical properties. The sealing effect is better than the protective layer cured by the protective glue. At the same time, the compression molded protection plate 20 has a low cost, its mold structure is simpler, and the manufacturing cost is usually lower than that of injection molds or transfer molding molds, and the price is relatively low during mass production.

[0053] In an optional embodiment, the reflective cup 10 is made of a first organic material, and the protection plate 20 is made of a second organic material, wherein the first organic material and the second organic material both include the same organic-based skeleton.

[0054] The packaging structure of traditional LED products is to fill the reflective cup 10 with protective glue to surround the LED chip 40. The driver chip 420 in the LED chip 40 is made of semiconductor silicon material, and the light-emitting chip 410 is made of gallium nitride or aluminum gallium phosphide. The protective glue is generally composed of a variety of organic materials and inorganic materials. The protective glue composed of multiple materials will affect the moisture-sensitive characteristics of the LED product and also restrict the reliability of the LED product. Because the water absorption or expansion rate of the various materials that make up the protective glue in the use or processing of traditional LED products are not completely the same, the protective glue is prone to expansion under damp or high temperature conditions. The stress generated in this process may damage the internal structure of the LED product or cause the protective glue to separate from the frame, thereby causing the LED product to fail. For example, traditional LED products cannot be processed by high-temperature SMT (Surface Mounted Technology) processes, otherwise the protective glue inside the reflective cup 10 is prone to expand due to high temperature. The stress generated in this process may cause the bonding wire 430 in the LED chip 40 to break and fail.

[0055] The reflective cup 10 and the protective plate 20 are fixedly connected, and both the reflective cup 10 and the protective plate 20 are molded with an organic material including the same organic-based skeleton, so that the expansion rate of the reflective cup 10 and the protective plate 20 is substantially the same. When the LED product is damp or heated, the internal stress generated by the reflective cup 10 and the protective plate 20 is also substantially the same, ensuring that the relative deformation of the two is relatively consistent, thereby improving the reliability and air tightness of the LED product. For example, when the LED chip 40 in the accommodating space 60 composed of the reflective cup 10, the protective plate 20 and the PCB board 30 is powered on and causes the reflective cup 10 and the protective plate 20 to generate heat and generate internal stress, the relative deformation between the reflective cup 10 and the protective plate 20 is relatively consistent, thereby further enhancing the reliability and air tightness of the LED product.

[0056] On the other hand, due to the functional characteristics of the LED product itself, the protection plate 20 has high light transmittance or light diffusion. When the LED chip 40 emits light, with the cooperation of the reflective cup 10, the light generated by the LED chip 40 is transmitted or diffused from the protection plate 20 to the outside, so that the LED product can work normally, and the LED product has a variety of light emission modes. The second organic material used to make the reflective cup 10 is opaque and plays a role in reflection and focusing. Compared with general five-sided LED products, the LED product provided in the embodiment of the present application is provided with an opaque reflective cup 10, which has a high light focusing effect and enhances the luminous intensity of the LED product in a specified direction.

[0057] In an optional embodiment, in the LED product provided in the embodiment of the present application, the first organic material and the second organic material include the same organic-based skeleton, which is at least one of an epoxy resin skeleton and an organic silicone skeleton. For example, when the organic material adopts EMC (Epoxy Molding Compound), it is easy to cure, has strong adhesion, and good insulation. The shrinkage of EMC during curing is low, and the internal stress generated is small, which also helps to improve the adhesion strength. Compared with unsaturated polyester resin and phenolic resin, the epoxy resin skeleton in EMC shows very low shrinkage (less than 2%) during the curing process, thereby reducing the impact of thermal stress release on the LED product.

[0058] See also Figure 5 and Figure 6 In an optional embodiment, the reflective cup 10 includes a reflective surface 110 and a fixed surface 120. The reflective surface 110 is conical in shape, and the shape of the fixed surface 120 matches the shape of the first conductive surface 321. The setting of the reflective surface 110 makes the LED product in the embodiment of the present application better in focusing light, and improves the directional light intensity of the LED product. The fixed surface 120 of the reflective cup 10 formed by the first molding contacts the PCB board 30, and the shape of the fixed surface 120 matches the shape of the first conductive surface 321, so that the fixed connection between the reflective cup 10 and the PCB board 30 is more stable, further increasing the reliability of the LED product. Please refer to Figure 4 , four control interfaces are formed at the contact point between the reflective cup 10 and the PCB board 30, and the first conductive pin is located in the four control interfaces to facilitate the subsequent input / output of power or electrical signals. Among them, the reflective cup 10 is also provided with a foolproof structure. In this embodiment, the foolproof structure is a structure including a circular pattern. After the LED packaging is completed, the projection of the foolproof structure is located at the position where the first conductive pin is located on the PCB board 30.

[0059] See also Figure 7In an optional embodiment, the protection plate 20 includes a plane portion 210 and a tapered portion 220. The tapered portion 220 includes a curved surface 222 and a plane 221. The shape and size of the curved surface 222 match the shape and size of the reflective surface 110 of the reflective cup 10. The shape and size of the plane 221 match the shape and size of the first conductive surface 321 of the reflective cup 10. The tapered portion 220 of the protection plate 20 formed by the second molding abuts against the reflective surface 110 of the reflective cup 10, so that the fixed connection between the protection plate 20 and the reflective cup 10 is more stable, further increasing the reliability of the LED product. In addition, the plane portion 210 is the light emitting portion of the LED product. At this time, the light emitting surface of the LED product is the entire plane portion 210, and the emitted light is scattered light, with weak light focusing and low brightness, but a wide irradiation area. It is understandable that in another optional embodiment, the protection plate 20 does not include the planar portion 210. In this case, the light-emitting surface of the LED is the surface of the conical portion 220 facing away from the reflective cup 10. In this case, the light emitted by the LED product is concentrated light with strong focusing and high brightness, but the irradiation surface is narrow.

[0060] In some specific embodiments, the thickness of the plane portion 210 in the protection plate 20 is 0.1 mm to 7 mm, for example, 0.1 mm, 2 mm, 5 mm or 7 mm, and the LED product has a good lighting effect. When the thickness of the protection plate 20 remains unchanged, the smaller the thickness of the plane portion 210, the closer the light angle of the light emitted by the LED product is to the angle of the conical portion 220 of the reflective cup 10, and the stronger the light focusing property; the larger the thickness of the plane portion 210, the closer the light angle of the light emitted by the LED product is to 180 degrees, and the weaker the light focusing property is.

[0061] See also Figure 8 In an optional embodiment, the PCB board 30 includes an insulating member 310 made of a resin-based or glass-fiber-like material and a conductive member 320 coated on the surface of the insulating member 310, and the conductive member 320 is used to connect to an external power source and / or signal source.

[0062] Specifically, in the LED product provided in the embodiment of the present application, the reflective cup 10 and the protective plate 20 are made of organic materials, and the insulating member 310 is made of a resin-based material, so that the expansion coefficients of the reflective cup 10, the protective plate 20 and the insulating member 310 are not much different, further improving the reliability of the LED product. When the insulating member 310 is made of a glass fiber-like material, the insulating member 310 has a high elastic coefficient and strong rigidity, and has good adhesion to the resin, and the fixed connection with the reflective cup 10 is more stable.

[0063] See also Figures 8 to 10In an optional embodiment, the insulating member 310 includes a bottom surface and a top surface that are oppositely disposed, and the conductive member 320 includes a first conductive surface 321 and a second conductive surface 322. The first conductive surface 321 is coated on the top surface, and the second conductive surface 322 is coated on the bottom surface. The LED chip 40 is fixedly mounted on the first conductive surface 321.

[0064] See also Figures 8 to 10 In an optional embodiment, the conductive member 320 further includes a plurality of conductive pins. The number of conductive pins in the LED product is mainly designed according to the driving mode of the LED product, and the present application does not impose any limitation thereto. In the following embodiments, the LED product is mainly described by taking four conductive pins as an example. The first conductive pin is used for grounding, the second conductive pin is used for connecting to a power source, the third conductive pin is used for signal output, and the fourth conductive pin is used for signal input. For other numbers of conductive pins, this embodiment will not be described in detail here.

[0065] See also Figures 8 to 10 In an optional embodiment, the conductive member 320 further includes a plurality of positioning holes 323, and the PCB board 30 further includes a plurality of conductive pillars 50 adapted to the positioning holes 323. The conductive pillars 50 are used to electrically connect the first conductive surface 321 and the second conductive surface 322, and to introduce the control signal and output signal of the LED chip 40 from the first conductive surface 321 to the second conductive surface 322 at the bottom, so as to facilitate subsequent SMT electrical connection.

[0066] See also Fig.11 In an optional embodiment, the LED chip 40 includes a light emitting chip 410 for emitting light and a driving chip 420 for controlling the light emitting chip 410. Both the light emitting chip 410 and the driving chip 420 are electrically connected to the first conductive surface 321.

[0067] In an optional embodiment, if Figure 8 , Fig. 9 and Fig.11 As shown, there are three light emitting chips 410, two of which are mounted on the second conductive pin, and another light emitting chip 410 is mounted on the third conductive pin. In this embodiment, there are nine bonding wires 430, seven of which are provided on the driving chip 420, and are respectively electrically connected to the first conductive pin, the second conductive pin, the third conductive pin, the fourth conductive member 320 and the three light emitting chips 410, and the other two are respectively used to connect one of the light emitting chips 410 on the second conductive pin and the light emitting chip 410 on the third conductive pin to the second conductive pin.

[0068] See also Fig.12The embodiment of the present application provides a manufacturing process of a double-molded LED product, wherein the LED product includes a PCB board 30, an LED chip 40, a reflective cup 10 and a protective plate 20, and the manufacturing process includes the following steps:

[0069] S101, performing a first molding process on the PCB board 30 using a first organic material, so as to mold the reflective cup 10 on the PCB board 30 to obtain a first assembly;

[0070] S102, fixing the LED chip 40 on the PCB board 30 on the first assembly to obtain a second assembly;

[0071] S103, performing a second molding process on the PCB board 30 and the reflective cup 10 of the second assembly using a second organic material, so as to mold the protection plate 20 on the PCB board 30 and the reflective cup 10 of the second assembly to obtain an LED package device;

[0072] S104: Cut the LED package components to obtain individual LED products.

[0073] Specifically, in step S101, the first organic material is a light-impermeable material. In step S103, the second organic material is a highly light-transmitting material. The first organic material and the second organic material both include the same organic-based skeleton.

[0074] Due to the functional characteristics of the LED product itself to emit light, the protective plate 20 in the light-emitting direction is highly light-transmitting so that the LED product can work normally, and the second organic material used to make the reflective cup 10 is opaque. Compared with general five-sided light-emitting LED products, the LED product provided in the embodiment of the present application is provided with an opaque reflective cup 10, which has a highly focusing effect and enhances the light-emitting intensity of the LED product in a specified direction.

[0075] In an optional embodiment, in the LED product provided in the embodiment of the present application, the organic-based skeleton includes at least one of an epoxy resin skeleton and an organic silicone skeleton. For example, when the organic material adopts EMC, it is easy to cure, has strong adhesion, and good insulation. The shrinkage of EMC during curing is low, and the internal stress generated is small, which also helps to improve the adhesion strength. Compared with unsaturated polyester resin and phenolic resin, the epoxy resin skeleton in EMC shows very low shrinkage (less than 2%) during the curing process, thereby reducing the impact of thermal stress release on the LED product.

[0076] See also Fig.12 In an optional embodiment, a manufacturing process of a double-molded LED product includes the following steps:

[0077] S201 , copper coating and etching are performed on the insulating member 310 made of resin-based or glass fiber-like material to obtain a PCB board 30 .

[0078] S202, performing a first molding process on the PCB board 30 using a first organic material, so as to mold the reflective cup 10 on the PCB board 30 to obtain a first assembly;

[0079] S203, fixing the LED chip 40 on the PCB board 30 on the first assembly to obtain a second assembly;

[0080] S204, performing a second molding process on the PCB board 30 and the reflective cup 10 of the second assembly using a second organic material, so as to mold the protection plate 20 on the PCB board 30 and the reflective cup 10 of the second assembly to obtain an LED package device;

[0081] S205: Cut the LED package components to obtain individual LED products.

[0082] Specifically, in the LED product provided in the embodiment of the present application, the reflective cup 10 and the protective plate 20 are made of organic materials, and the insulating member 310 is made of a resin-based material, so that the expansion coefficients of the reflective cup 10, the protective plate 20 and the insulating member 310 are not much different, thereby further improving the reliability of the LED product; when the insulating member 310 is made of a glass fiber-like material, the insulating member 310 has a high elastic coefficient and strong rigidity, and at the same time has good adhesion to the resin, and the fixed connection with the reflective cup 10 is more stable.

[0083] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0084] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0085] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0086] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0087] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A double-molded LED product, characterized in that: include: PCB board; LED chip, fixedly mounted on the PCB board; A reflective cup is arranged on the PCB board, and the reflective cup is made by a first compression molding; A protection plate is arranged on the reflective cup, and the protection plate is made by a second compression molding; the shape and size of the protection plate are adapted to the shape and size of the reflective cup, and together with the reflective cup and the PCB board, form a receiving space for receiving the LED chip; the protection plate is compression molded, has high dimensional accuracy and small warping deformation, and has the characteristics of small shrinkage rate and relatively stable mechanical properties, and has a better sealing effect than the protective layer cured by protective glue, and the compression molded protection plate has a low cost and a simple mold structure; wherein the protection plate includes a tapered portion, the tapered portion abuts against the reflective cup and the PCB board, and the protection plate also includes a plane portion, and the plane portion is the light emitting portion of the LED product; The reflective cup is made of a first organic material; the protective plate is made of a second organic material; the first organic material and the second organic material both include the same organic-based skeleton, so that the expansion rate of the reflective cup and the protective plate is the same, so that the relative deformation of the reflective cup and the protective plate is relatively consistent, and the organic-based skeleton includes an epoxy resin skeleton, which is easy to cure, has strong adhesion, good insulation, low shrinkage during curing, and generates small internal stress, thereby alleviating the influence of thermal stress release on the LED product; Among them, the protection plate has high light transmittance or light diffusion. When the LED chip emits light, with the cooperation of the reflective cup, the light generated by the LED chip is transmitted or diffused from the protection plate to the outside, so that the light emission mode of the LED product is diverse; the thickness of the plane part in the protection plate is 0.1 mm to 7 mm. When the thickness of the protection plate remains unchanged, the smaller the thickness of the plane part, the stronger the light focusing property; the larger the thickness of the plane part, the weaker the light focusing property.

2. The LED product according to claim 1, characterized in that: The reflective cup comprises: A reflective surface, which is conical in shape and is used to reflect the light emitted by the LED chip; The fixing surface is fixedly connected to the PCB board, and the fixing surface is adapted to the PCB board.

3. The LED product according to claim 2, characterized in that: The conical portion includes a curved surface, and the curved surface is matched with the reflecting surface.

4. A manufacturing process for a double-molded LED product, characterized in that: The LED product includes a PCB board, an LED chip, a reflective cup and a protection board, and the manufacturing process includes: Performing a first molding process on the PCB board using a first organic material to mold the reflective cup on the PCB board to obtain a first assembly; The LED chip is fixedly mounted on the PCB board on the first assembly to obtain a second assembly; A second compression molding is performed on the PCB board and the reflective cup of the second assembly using a second organic material, so as to obtain an LED package device by compression molding the protection plate on the PCB board and the reflective cup of the second assembly; the protection plate is compression molded, has high dimensional accuracy and small warping deformation, and has the characteristics of small shrinkage rate and relatively stable mechanical properties, and has a better sealing effect than a protective layer cured by protective glue, and the compression molded protection plate has a low cost and a simple mold structure; the first organic material and the second organic material both include the same organic-based skeleton, so that the expansion rate of the reflective cup and the protection plate is the same, so that the relative deformation of the reflective cup and the protection plate is relatively consistent; the organic-based skeleton includes an epoxy resin skeleton, which is easy to cure, has strong adhesion, good insulation, low shrinkage during curing, and generates small internal stress, thereby alleviating the influence of thermal stress release on the LED product; Cutting the LED package device to obtain individual LED products; Wherein, the protection plate includes a conical portion, the conical portion abuts against the reflective cup and the PCB board, and the protection plate also includes a flat portion, the flat portion is the light emitting portion of the LED product; Among them, the protection plate has high light transmittance or light diffusion. When the LED chip emits light, with the cooperation of the reflective cup, the light generated by the LED chip is transmitted or diffused from the protection plate to the outside, so that the light emission mode of the LED product is diverse; the thickness of the plane part in the protection plate is 0.1 mm to 7 mm. When the thickness of the protection plate remains unchanged, the smaller the thickness of the plane part, the stronger the light focusing property; the larger the thickness of the plane part, the weaker the light focusing property.

5. The manufacturing process according to claim 4, characterized in that: Before the first molding is performed on the PCB board using the first organic material to mold the reflective cup on the PCB board to obtain the first assembly, the method further includes: Copper coating and etching are performed on an insulating member made of a resin-based or glass-fiber-like material to obtain the PCB board.

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