A sealed high voltage DC relay with circuit board

By setting the circuit board above the sealing colloid layer and welding and fixing it with the circuit board, the problems of difficulty in installation of circuit boards and inconvenient heat dissipation in the prior art are solved, and convenient maintenance and effective heat dissipation are achieved.

CN110690080BActive Publication Date: 2025-04-22ZHEJIANG HONGZHOU NEW ENERGY TECH
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN201910795849.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-08-27
Publication Date
2025-04-22
Estimated Expiration
2039-08-27

AI Technical Summary

Technical Problem

In existing sealed high-voltage DC relays, the circuit board is installed in the housing cavity sealed by the colloidal layer, resulting in difficulty in repair, inconvenient heat dissipation and the risk of glue shrinkage and damage to the circuit board.

Method used

The circuit board is arranged above the sealing colloid layer, and the coil frame is equipped with a long thin-sheet coil lead sheet. The upper end of the coil lead sheet passes through the inner support cover and is welded and fixed with the circuit board. The sealing colloid layer is covered with one of the sections of the coil lead sheet.

Benefits of technology

It avoids the maintenance difficulties during circuit board installation, inconvenient heat dissipation and the risk of glue shrinkage and damage to the circuit board, and achieves convenient maintenance and heat dissipation of the circuit board.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN110690080B_ABST
    Figure CN110690080B_ABST
Patent Text Reader

Abstract

The invention discloses a sealed high-voltage DC relay with a circuit board, comprising a static contact lead-out terminal, an inner support cover, an iron cup, a coil frame, an outer shell, a circuit board and a sealing colloid layer; two static contact lead-out terminals are respectively mounted on the top of the inner support cover; the inner support cover is mounted on the upper part of the iron cup, and the coil frame is mounted on the bottom of the iron cup; the inner support cover and the iron cup are installed in the inner cavity of the outer shell together, the sealing colloid layer covers the inner support cover and the iron cup, and the edge of the sealing colloid layer contacts the inner cavity wall of the outer shell; the circuit board is arranged above the sealing colloid layer, the coil frame is equipped with a long thin sheet type coil lead-out piece, the upper end of the coil lead-out piece passes through the inner support cover and is welded and fixed with the circuit board to realize electrical connection, and the sealing colloid layer is coated on one section of the coil lead-out piece between the inner support cover and the circuit board. This structure of the invention can avoid the disadvantages caused by the circuit board being installed in the outer shell cavity sealed by the colloid layer in the prior art.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The invention relates to the technical field of relays, in particular to a sealed high-voltage direct current relay with a circuit board. Background Art

[0002] A relay is an electronic control device that has a control system (also called an input circuit) and a controlled system (also called an output circuit). It is usually used in automatic control circuits. It is actually an "automatic switch" that uses a smaller current to control a larger current. Therefore, it plays the role of automatic regulation, safety protection, and circuit conversion in the circuit.

[0003] A sealed high-voltage DC relay in the prior art is to seal the contact parts, push rod parts and magnetic circuit parts of the contact part in a cavity surrounded by an inner support cover and an iron cup. Specifically, two static contact lead-out ends are installed on the top of the inner support cover, and the bottom ends of the static contact lead-out ends are accommodated in the cover of the inner support cover; the inner support cover is installed on the upper part of the iron cup, so that the inner support cover and the iron cup form a cavity; the moving reed, the push rod parts and the magnetic circuit parts are respectively installed in the cavity. When sealing, the iron cup is installed in the shell, and a layer of colloid layer is formed on the upper end surface of the inner support cover by dispensing glue (such as epoxy resin), so that the inner support cover, the iron cup and other parts are sealed in the shell cavity, so that the cavity surrounded by the inner support cover and the iron cup is a sealed cavity. In order to achieve the energy-saving function, this sealed high-voltage DC relay usually needs to install a circuit board in the relay, and the lead-out of the coil of the magnetic circuit part needs to be connected to the circuit board. In the prior art, the circuit board is usually installed in a housing cavity sealed by a colloid layer. This circuit board arrangement method has the following main disadvantages:

[0004] 1. When the circuit board fails, it is not convenient to repair or replace, and the colloid layer needs to be destroyed during repair or replacement;

[0005] 2. The heat generated by the electrical components of the circuit board when working is difficult to dissipate;

[0006] 3. Since the circuit board is loaded first and then glue is applied to form a colloid layer, there is a risk of damaging the circuit board due to glue shrinkage during the glue drying process; Summary of the invention

[0007] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a sealed high-voltage DC relay with a circuit board. Through structural improvement, the disadvantages caused by the circuit board being installed in a housing cavity sealed by a colloid layer in the prior art can be avoided.

[0008] The technical solution adopted by the present invention to solve its technical problems is: a sealed high-voltage DC relay with a circuit board, comprising a static contact lead-out terminal, an inner support cover, an iron cup, a coil frame, an outer shell, a circuit board and a sealing colloid layer; the inner support cover is provided with an inner cavity with an opening facing downward, and two static contact lead-out terminals are respectively installed on the top of the inner support cover, and the bottom ends extend into the inner cavity of the inner support cover; the iron cup is provided with an inner cavity with an opening facing upward, and the inner support cover is installed on the upper part of the iron cup, and together with the iron cup, it forms a cavity for accommodating the contact components, the push rod components and the magnetic circuit part of the relay; the coil The frame is installed at the bottom of the iron cup; the outer shell is provided with an inner cavity with an opening facing upward, the inner support cover and the iron cup are loaded into the inner cavity of the outer shell together, the sealing colloid layer covers the inner support cover and the iron cup, and the edge of the sealing colloid layer contacts the inner cavity wall of the outer shell; the circuit board is arranged above the sealing colloid layer, the coil frame is provided with a long thin sheet-type coil lead-out piece, the upper end of the coil lead-out piece passes through the inner support cover and is fixed to the circuit board by welding to achieve electrical connection, and the sealing colloid layer is coated on one section of the coil lead-out piece between the inner support cover and the circuit board.

[0009] The coil frame is protruded upwardly and is provided with a socket, and the lower end of the coil lead-out piece is plugged into the socket of the coil frame and connected to the enameled wire wound around the coil frame.

[0010] One section of the coil lead-out sheet is also provided with an opening penetrating the long thin sheet in the thickness direction.

[0011] Furthermore, it also includes a mounting bracket, which is located above the sealing colloid layer and fixed to the inner cavity wall of the shell, and the circuit board is installed on the mounting bracket.

[0012] The inner support cover is embedded in the upper part of the inner cavity of the iron cup and is fitted with the inner cavity wall of the iron cup in an interference fit.

[0013] The top edge of the inner support cover is provided with a brim portion protruding in the horizontal direction, the side wall of the inner support cover is embedded in the iron cup and interference fits with the iron cup, and the brim portion of the inner support cover rests on the top surface of the opening portion of the iron cup.

[0014] The inner side wall of the upper part of the shell is provided with a glue dispensing groove extending from top to bottom, and the sealing colloid layer also covers the outer edge of the contact between the edge of the inner support cover and the top end surface of the opening of the iron cup from the side.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. The present invention adopts the method of arranging the circuit board above the sealing colloid layer, and the coil frame is equipped with a long thin coil lead-out piece. The upper end of the coil lead-out piece passes through the inner support cover and is welded and fixed to the circuit board to achieve electrical connection. The sealing colloid layer covers one section of the coil lead-out piece between the inner support cover and the circuit board. This structure of the present invention can avoid the disadvantages of the prior art caused by the circuit board being installed in the shell cavity sealed by the colloid layer. First, when the circuit board fails, it is easy to repair or replace, and the colloid layer will not be damaged during repair or replacement; second, the heat generated by the electrical components of the circuit board when working can be dissipated outward; third, because the colloid layer is formed by dispensing glue first, and then the circuit board is installed, there is no risk of damaging the circuit board due to glue shrinkage during the glue drying process.

[0017] 2. The present invention adopts a method of providing an opening in the thickness direction of a long thin strip in one section of the coil lead-out sheet covered by the sealing colloid layer. On the one hand, the bonding strength between the coil lead-out sheet and the sealing colloid layer can be enhanced. On the other hand, the heat conduction volume between the coil lead-out sheet and the sealing colloid layer can be reduced. When the coil lead-out sheet is welded to the circuit board, the risk of cracking of the sealing colloid layer due to local overheating can be reduced.

[0018] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments; however, the sealed high-voltage DC relay with a circuit board of the present invention is not limited to the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic diagram of a three-dimensional structure of an embodiment of the present invention;

[0020] Figure 2 is a structural cross-sectional view of an embodiment of the present invention;

[0021] Figure 3 yes Figure 2 A magnified schematic diagram of part A in FIG.

[0022] Figure 4 yes Figure 2 A magnified schematic diagram of part B in FIG.

[0023] Figure 5 It is a schematic diagram of the structure of the coil lead-out piece of an embodiment of the present invention. DETAILED DESCRIPTION

[0024] Example

[0025] See also Figures 1 to 5As shown, a sealed high-voltage DC relay with a circuit board of the present invention comprises a static contact lead-out terminal 1, an inner support cover 2, an iron cup 3, a coil frame 4, an outer shell 5, a circuit board 6 and a sealing colloid layer 7; the inner support cover 2 is provided with an inner cavity with an opening facing downward, two static contact lead-out terminals 1 are respectively mounted on the top of the inner support cover 2, and the bottom ends of the static contact lead-out terminals 1 are extended into the inner cavity of the inner support cover 2; the iron cup 3 is provided with an inner cavity with an opening facing upward, the inner support cover 2 is mounted on the upper part of the iron cup 3, and the inner support cover 2 and the iron cup 3 together form a cavity for accommodating the contact components, the push rod components and the magnetic circuit part of the relay; the coil frame 4 is mounted on the inner support cover 2 The bottom of the iron cup 3; the outer shell 5 is provided with an inner cavity with an opening facing upward, the inner support cover 2 and the iron cup 3 are loaded into the inner cavity of the outer shell 5 together, the sealing colloid layer 7 covers the inner support cover 2 and the iron cup 3, and the edge of the sealing colloid layer 7 is in contact with the inner cavity wall of the outer shell 5; the circuit board 6 is arranged above the sealing colloid layer 7, the coil frame 4 is equipped with a long thin sheet-type coil lead-out piece 8, the upper end of the coil lead-out piece 8 passes through the inner support cover 2 and is welded and fixed to the circuit board 6 to achieve electrical connection, and the sealing colloid layer 7 is coated on one section 81 of the coil lead-out piece 8 between the inner support cover and the circuit board.

[0026] In this embodiment, the coil frame 4 is provided with a socket 41 protruding upward, and the lower end of the coil lead-out piece 8 is inserted into the socket 41 of the coil frame and connected to the enameled wire wound around the coil frame.

[0027] In this embodiment, one section 81 of the coil lead-out sheet 8 is further provided with an opening 82 penetrating the long thin sheet in the thickness direction.

[0028] Furthermore, it also includes a mounting bracket 9 , which is located above the sealing colloid layer 7 and fixed to the inner cavity wall of the housing 5 , and the circuit board 6 is mounted on the mounting bracket 9 .

[0029] In this embodiment, the circumference of the top end of the inner support cover 2 is provided with an edge portion 21 protruding in the horizontal direction, the side wall of the inner support cover 2 is embedded in the iron cup 3 and is interference fit with the iron cup 3, and the edge portion 21 of the inner support cover rests on the top end surface 31 of the opening of the iron cup.

[0030] Of course, the edge portion may not be provided at the top of the inner support cover, but the inner support cover may be embedded in the upper part of the inner cavity of the iron cup and fit with the inner cavity wall of the iron cup in an interference fit.

[0031] In this embodiment, the inner side wall of the upper part of the shell 5 is provided with a glue dispensing groove 51 extending from top to bottom, and the sealing colloid layer 7 also covers the outer edge of the contact between the edge portion 21 of the inner support cover and the top end surface 31 of the opening of the iron cup from the side.

[0032] A sealed high-voltage DC relay with a circuit board of the present invention adopts a method of arranging the circuit board 6 above the sealing colloid layer 7, and the coil frame 4 is equipped with a long thin coil lead-out piece 8, the upper end of the coil lead-out piece 8 passes through the inner support cover 2 and is welded and fixed to the circuit board 6 to achieve electrical connection, and the sealing colloid layer 7 is coated on a section 81 of the coil lead-out piece 8 between the inner support cover and the circuit board. This structure of the present invention can avoid the disadvantages of the prior art caused by the circuit board being installed in the shell cavity sealed by the colloid layer. First, when the circuit board fails, it is easy to repair or replace, and the colloid layer will not be damaged during repair or replacement; second, the heat generated by the electrical components of the circuit board when working can be dissipated outward; third, because the colloid layer is formed by dispensing glue first, and then the circuit board is installed, there is no risk of damaging the circuit board due to glue shrinkage during the glue drying process.

[0033] A sealed high-voltage DC relay with a circuit board of the present invention adopts a method in which a section 81 of a coil lead-out sheet covered by a sealing colloid layer 7 is provided with an opening 82 in the thickness direction of the long thin sheet. On the one hand, the bonding strength between the coil lead-out sheet and the sealing colloid layer can be enhanced, and on the other hand, the heat conduction volume between the coil lead-out sheet and the sealing colloid layer can be reduced. When the coil lead-out sheet is welded to the circuit board, the risk of cracking of the sealing colloid layer due to local overheating can be reduced.

[0034] The above is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with the art can make many possible changes and modifications to the technical solution of the present invention by using the technical content disclosed above, or modify it into an equivalent equivalent embodiment without departing from the scope of the technical solution of the present invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention should fall within the scope of protection of the technical solution of the present invention.

Claims

1. A sealed high-voltage DC relay with a circuit board, comprising a static contact lead-out terminal, an inner support cover, an iron cup, a coil frame, an outer shell, a circuit board and a sealing colloid layer; the inner support cover is provided with an inner cavity with an opening facing downward, two static contact lead-out terminals are respectively mounted on the top of the inner support cover, and the bottom ends extend into the inner cavity of the inner support cover; the iron cup is provided with an inner cavity with an opening facing upward, the inner support cover is mounted on the upper part of the iron cup, and together with the iron cup, it forms a cavity for accommodating the contact component, the push rod component and the magnetic circuit part of the relay; the coil frame is mounted on the bottom of the iron cup; the outer shell is provided with an inner cavity with an opening facing upward, the inner support cover and the iron cup are loaded into the inner cavity of the outer shell together, the sealing colloid layer covers the upper surface of the inner support cover and the iron cup, and the edge of the sealing colloid layer contacts the inner cavity wall of the outer shell; it is characterized in that: The circuit board is arranged above the sealing colloid layer, and the coil frame is equipped with a long thin coil lead-out plate. The upper end of the coil lead-out plate passes through the inner support cover and is welded and fixed to the circuit board to achieve electrical connection. The sealing colloid layer covers a section of the coil lead-out plate between the inner support cover and the circuit board.

2. The sealed high-voltage DC relay with a circuit board according to claim 1, characterized in that: The coil frame is protruded upwardly and is provided with a socket, and the lower end of the coil lead-out piece is plugged into the socket of the coil frame and connected to the enameled wire wound around the coil frame.

3. The sealed high-voltage DC relay with a circuit board according to claim 1, characterized in that: One section of the coil lead-out sheet is also provided with an opening penetrating the long thin sheet in the thickness direction.

4. The sealed high-voltage DC relay with a circuit board according to claim 1, 2 or 3, characterized in that: Furthermore, it also includes a mounting bracket, which is located above the sealing colloid layer and is fixed to the inner cavity wall of the shell in an interference fit, and the circuit board is mounted on the mounting bracket.

5. The sealed high-voltage DC relay with a circuit board according to claim 1, characterized in that: The inner support cover is embedded in the upper part of the inner cavity of the iron cup and is fitted with the inner cavity wall of the iron cup in an interference fit.

6. The sealed high-voltage DC relay with a circuit board according to claim 1, characterized in that: The top edge of the inner support cover is provided with a brim portion protruding in the horizontal direction, the side wall of the inner support cover is embedded in the iron cup and interference fits with the iron cup, and the brim portion of the inner support cover rests on the top surface of the opening portion of the iron cup.

7. The sealed high-voltage DC relay with a circuit board according to claim 6, characterized in that: The inner side wall of the upper part of the shell is provided with a glue dispensing groove extending from top to bottom, and the sealing colloid layer also covers the outer edge of the contact between the edge of the inner support cover and the top end surface of the opening of the iron cup from the side.

Citation Information

Patent Citations

  • Sealed high-voltage direct-current relay with circuit board

    CN210516635U