A tool for detecting crush damage on circuit boards

Abstract

A tool for detecting pressure damage of circuit boards, comprising a main body area, the main body area comprising a protective film layer, a wiring layer, a first substrate layer, an upper conductive layer, a supporting isolation layer, a lower conductive layer and a second substrate layer stacked in sequence from top to bottom, the upper conductive layer being divided into a plurality of conductive units, and no conductivity between any two conductive units, a plurality of wires being provided in the wiring layer, a plurality of vias being provided in the first substrate layer, the wires and vias being respectively arranged in one-to-one correspondence with the conductive units, the wires being electrically connected to the conductive units along the vias; an observation area being provided on one side of the main body area, the observation area being equipped with a power supply and a plurality of indicator lights, the indicator lights being electrically connected to the wires and being arranged in one-to-one correspondence, the power supply being respectively electrically connected to the plurality of indicator lights, and the power supply being also electrically connected to the lower conductive layer. Compared with the prior art, the present invention can accurately and efficiently detect pressure damage of circuit boards relative to manual detection, and secondly, the detection accuracy is high.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB manufacturing, and in particular to a tool for detecting pressure damage of a circuit board. Background Art

[0002] During the ET test process of circuit board production, a special fixture and supporting test machine are required to perform open and short circuit tests on the circuit board. The specific process is: put the circuit board on the PIN of the lower fixture → start the test machine → press the test machine press down → drive the fixture fixed under the press to press down → the test pin on the fixture contacts the corresponding test point pad → connect the electrical signal → the test machine outputs the result after the test is completed → the press machine returns to normal → take the board → continue to the next cycle.

[0003] When the test needle contacts the pad of the circuit board, it is elastic under normal circumstances and will not cause pressure damage to the copper surface of the pad. Under abnormal circumstances, such as when the test needle is bent or rusted, or when there is foreign matter such as copper slag on the contact surface between the board and the fixture, the circuit board will be damaged. To address this situation, the industry currently relies on random inspections and direct observation with the eyes using a magnifying glass, but this is very inefficient. In addition, the circuit board becomes uneven due to surface ink, text, and lines, and its color is also different. Relying solely on visual inspection has a great risk of missing information.

[0004] Therefore, it is necessary to provide a new tool for detecting pressure damage of circuit boards to solve the above technical problems. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a tool for detecting pressure damage of circuit boards which can accurately detect with high precision and high efficiency.

[0006] The present invention solves its technical problem with a technical solution, which is a tool for detecting pressure damage on a circuit board, comprising a main body area, the main body area including a protective film layer, a wiring layer, a first substrate layer, an upper conductive layer, a support isolation layer, a lower conductive layer, and a second substrate layer stacked in sequence from top to bottom, the upper conductive layer being divided into a plurality of conductive units, with no conduction between any two conductive units, the wiring layer being provided with a plurality of conductive wires, the first substrate layer being provided with a plurality of vias, the conductive wires and the vias being respectively provided in a one-to-one correspondence with the conductive units, the conductive wires being electrically connected to the conductive units along the vias;

[0007] An observation area is provided on one side of the main body area, and a power supply and multiple indicator lights are installed in the observation area. The indicator lights are electrically connected to the wires and are arranged in one-to-one correspondence. The power supply is electrically connected to the multiple indicator lights respectively, and the power supply is also electrically connected to the lower conductive layer.

[0008] Preferably, the supporting isolation layer is provided with a pressure-sensitive adhesive and a plurality of ceramic micro-beads, and the plurality of ceramic micro-beads are embedded in the pressure-sensitive adhesive.

[0009] Preferably, supports are provided on both sides of the wire.

[0010] Preferably, the thickness of the upper conductive layer and the lower conductive layer are both 15-21 um.

[0011] Preferably, the diameter of the ceramic microbeads is 10-20 μm.

[0012] Preferably, the thickness of the protective film layer is 20-30 μm.

[0013] Preferably, the upper conductive layer and the lower conductive layer are both made of copper.

[0014] Preferably, the protective film layer is made of PI film.

[0015] Preferably, the support is a filling glue.

[0016] Preferably, the material of the substrate layer is FR-4.

[0017] Compared with the prior art, the present invention can quickly detect whether the circuit board is bruised by using a bruise detection tool, compared with manual detection. If there is bruise, the indicator light will be on, and if there is no bruise, the indicator light will not be on. This detection method is accurate and efficient. When the circuit board is bruised, the indicator light connected to the corresponding conductive unit will be on. This design can accurately reflect the bruise area, making it easy for the operator to accurately find the bruise point, and the detection accuracy is high. Secondly, it can be used repeatedly. When the upper conductive layer and the lower conductive layer are in close contact, just remove the pressure, and the upper conductive layer and the lower conductive layer can be separated under the elastic force of the ceramic microbeads, thereby achieving the purpose of repeated detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the present invention;

[0019] Figure 2 It is a cross-sectional schematic diagram of the main body area of ​​the present invention.

[0020] In the picture:

[0021] 1. Main body area, 2. Observation area, 11. Protective film layer, 12. Wiring layer, 13. First substrate layer, 14. Upper conductive layer, 15. Support isolation layer, 16. Lower conductive layer, 17. Second substrate layer, 121. Wire, 122. Support, 131. Via hole, 141. Conductive unit, 151. Pressure-sensitive adhesive, 152. Ceramic beads, 3. Power supply, 4. Indicator light. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0023] Refer to the attached Figure 1-2 The present embodiment provides a tool for detecting pressure damage on a circuit board, comprising a main body 1. The main body 1 comprises a protective film layer 11, a wiring layer 12, a first substrate layer 13, an upper conductive layer 14, a support isolation layer 15, a lower conductive layer 16, and a second substrate layer 17, which are stacked in sequence from top to bottom. The upper conductive layer 14 is divided into a plurality of conductive units 141, and no conductive connection is established between any two conductive units 141. The wiring layer 12 is provided with a plurality of conductive wires 121, and the first substrate layer 13 is provided with a plurality of vias 131. The conductive wires 121 and the vias 131 are respectively provided in a one-to-one correspondence with the conductive units 141, and the conductive wires 121 are electrically connected to the conductive units 141 along the vias 131.

[0024] An observation area 2 is provided on one side of the main body area 1. This area is equipped with a power supply 3 and multiple indicator lights 4. The indicator lights 4 are electrically connected to the wires 121 and are arranged one-to-one. The power supply 3 is electrically connected to each of the multiple indicator lights 4, and is also electrically connected to the lower conductive layer 16. The conductive units 141 are arranged one-to-one with the wires 121 and the indicator lights 4, making it easy to quickly find the circuit board area corresponding to the conductive unit 141 that has been damaged by the indicator lights 4.

[0025] The supporting isolation layer 15 is provided with a pressure-sensitive adhesive 151 and a plurality of ceramic microbeads 152, and the plurality of ceramic microbeads 152 are embedded in the pressure-sensitive adhesive 151. The pressure-sensitive adhesive 151 reacts sensitively to pressure, and the ceramic microbeads 152 are elastic and can separate the upper conductive layer 14 and the lower conductive layer 16. The ceramic microbeads 152 have good self-lubrication and fluidity, which facilitates the upper conductive layer 14 and the lower conductive layer 16 to quickly respond to local excessive pressure. By providing the pressure-sensitive adhesive 151 and the ceramic microbeads 152, when pressed tightly, if there is a compression injury, when the local pressure is too high, the upper conductive layer 14 and the lower conductive layer 16 can be in close contact and thus conduct electricity. This design can quickly detect which area of ​​the circuit board has been compressed. After the pressure is released, under the elastic force of the ceramic microbeads 152, the upper conductive layer 14 and the lower conductive layer 16 separate and return to their original state, and the compression injury of the circuit board can continue to be detected.

[0026] Supports 122 are provided on both sides of the wire 121. The support 122 is filled with glue. By providing the filling glue, the wiring layer 12 can be made flat, avoiding affecting the use of the pressure detection tool.

[0027] The thickness of the upper conductive layer 14 and the lower conductive layer 16 are both 15-21 μm. By providing thin upper conductive layer 14 and lower conductive layer 16, they can easily respond to local excessive pressure, making it easier to detect the pressure-damaged area of ​​the circuit board.

[0028] The diameter of the ceramic beads 152 is 10-20 μm, ensuring that the upper conductive layer 14 and the lower conductive layer 16 are in close contact under the influence of local excessive pressure, and that the upper conductive layer 14 and the lower conductive layer 16 are separated and restored to their original state under the elastic force of the ceramic beads 152 after the pressure is released.

[0029] The thickness of the protective film layer 11 is 20-30 μm. The thin protective film layer 11 can easily react to pressure, making it easier to detect the damaged area of ​​the circuit board.

[0030] The upper conductive layer 14 and the lower conductive layer 16 are both made of copper. Copper has good electrical conductivity, is not easily corroded, has low hardness, and is easy to respond to pressure.

[0031] The protective film layer 11 is made of a PI film.

[0032] The material of the base material layer is FR-4.

[0033] The working steps of the tool for detecting crush damage on circuit boards provided by the present invention are as follows:

[0034] (1) When all the randomly inspected circuit boards have completed the test, suspend the circuit board test and put the tested circuit boards on the PIN of the lower fixture;

[0035] (2) Turn on the power supply 3 of the pressure injury detection tool. Before use, press any area with the tip of a pen or a test needle to simulate a pressure injury to test whether it can accurately detect the pressure injury. If not, check and repair the pressure injury detection tool so that it can accurately detect the pressure injury.

[0036] (3) Place the pressure damage detection tool flatly into the circuit board test area;

[0037] (4) Operate the testing machine, lower the press, and tighten the clamp on the press to detect the crushing tool;

[0038] (5) If the circuit board is damaged, the corresponding indicator light 4 will light up:

[0039] (6) If indicator light 4 does not light up, loosen the press, slightly move the pressure detection tool, and retest; there is a small gap between the conductive units to ensure that there is no conductivity between the conductive units. Slightly moving the pressure detection tool and retesting can avoid the situation where the pressure area of ​​the circuit board coincides with the gap between the conductive units and is not detected.

[0040] (7) If indicator light 4 is off after retesting, it means that the circuit board is not damaged;

[0041] (8) Follow the above steps to test other tested circuit boards.

[0042] The working principle of the pressure damage detection tool is: place the pressure damage detection tool into the circuit board test area and press the pressure damage detection tool. If the circuit board is damaged, it will cause excessive local pressure, and the corresponding conductive unit 141 and the lower conductive layer 16 will be pressed and contacted to be conductive, and the indicator light 4 corresponding to the conductive unit 141 will light up; on the contrary, the circuit board is not damaged, the overall pressure is balanced, the upper conductive layer 14 and the lower conductive layer 16 are separated by the ceramic beads 152, and are not conductive, and the indicator light 4 will not light up.

[0043] Compared with manual detection, the present invention can quickly detect whether the circuit board is bruised by using a bruise detection tool. If there is bruise, the indicator light 4 will light up, and if there is no bruise, the indicator light 4 will not light up. This detection method is accurate and efficient. When the circuit board is bruised, the indicator light 4 connected to the corresponding conductive unit 141 will light up. This design can accurately reflect the bruise area, making it easy for the operator to accurately find the bruise point, and the detection accuracy is high. Secondly, it can be used repeatedly. When the upper conductive layer 14 and the lower conductive layer 16 are in close contact, just remove the pressure, and the upper conductive layer 14 and the lower conductive layer 16 can be separated under the elastic force of the ceramic microbeads 152, achieving the purpose of repeated detection.

[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A tool for detecting pressure damage on a circuit board, characterized in that: The main body region includes a protective film layer, a wiring layer, a first substrate layer, an upper conductive layer, a support isolation layer, a lower conductive layer, and a second substrate layer stacked sequentially from top to bottom, the upper conductive layer is divided into a plurality of conductive units, and no conductivity is generated between any two conductive units. The wiring layer is provided with a plurality of conductive wires, and the first substrate layer is provided with a plurality of vias. The conductive wires and the vias are respectively provided in a one-to-one correspondence with the conductive units, and the conductive wires are electrically connected to the conductive units along the vias. An observation area is provided on one side of the main area, and a power supply and multiple indicator lights are installed in the observation area. The indicator lights are electrically connected to the wires and are arranged in a one-to-one correspondence. The power supply is electrically connected to the multiple indicator lights respectively, and the power supply is also electrically connected to the lower conductive layer; the supporting isolation layer is provided with pressure-sensitive adhesive and multiple ceramic microbeads, and the multiple ceramic microbeads are embedded in the pressure-sensitive adhesive; the diameter of the ceramic microbeads is 10-20um; during the detection process, if the circuit board is crushed, the indicator light will light up; if the indicator light is not on, the crush detection tool will be moved and retested; if the indicator light is not on after retesting, it means that the circuit board is not crushed.

2. The tool for detecting pressure damage of a circuit board according to claim 1, characterized in that: Supports are provided on both sides of the wire.

3. The tool for detecting pressure damage of a circuit board according to claim 2, characterized in that: The thickness of the upper conductive layer and the lower conductive layer are both 15-21 μm.

4. The tool for detecting pressure damage of a circuit board according to claim 3, characterized in that: The thickness of the protective film layer is 20-30 μm.

5. The tool for detecting pressure damage of a circuit board according to claim 4, characterized in that: The upper conductive layer and the lower conductive layer are both made of copper.

6. The tool for detecting pressure damage of a circuit board according to claim 5, characterized in that: The protective film layer is made of PI film.

7. The tool for detecting pressure damage of a circuit board according to claim 6, characterized in that: The support is a filling glue.

8. The tool for detecting pressure damage of a circuit board according to claim 7, characterized in that: The material of the substrate layer is FR-4.

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