A substrate assembling device and a assembling control system and method

Abstract

The present invention discloses a substrate box-joining device and a box-joining control system and method, wherein the substrate box-joining device includes a feeding and discharging mechanism, a substrate plugging and unplugging mechanism and a substrate buffer mechanism; the feeding and discharging mechanism is provided with a feeding area and a discharging area, each of which is provided with a plurality of clips; the substrate plugging and unplugging mechanism includes a servo X-axis, a servo Y-axis, a servo Z-axis, a substrate plugging and unplugging claw, a substrate transfer fixture and a CCD; the XYZ three-axis mechanism can realize the substrate plugging and unplugging positioning, the substrate transfer fixture is located below the substrate plugging and unplugging claw, and the CCD is located above the substrate transfer fixture; the substrate buffer mechanism includes an abnormal material lifting shaft, a buffer platform and a non-contact suction cup, and the non-contact suction cup can move up and down along the abnormal material lifting shaft. Using the substrate box-joining device of the present invention can effectively reduce the work intensity of personnel, save labor, and has the advantages of substrates not easy to deform, not easy to break, error-proof and fool-proof, no stains and high efficiency.

Description

Technical Field

[0001] The present invention relates to a substrate box combining device and a box combining control system and method, belonging to the technical field of intelligent manufacturing in the integrated circuit packaging and testing industry. Background Art

[0002] In the chip packaging and testing industry, after Wire Bonding, a post-film laminating machine is required to apply film to the back of the chip substrate to prevent glue overflow. The current post-film laminating machine is operated by a person who puts in a magazine. After the post-film laminating machine is completed, the person takes out the magazine. There are only a few pieces in each magazine, and the person needs to pull out the chip board to combine it into a magazine before transferring to another process. The problems and shortcomings of the existing operation method are: 1. When the person sorts or makes mistakes in manual operation, the product will be deformed or damaged; 2. Dirt on the hands or sweat glands will damage the product; 3. The person is highly dependent on the person, cannot prevent mistakes, and has low efficiency. Summary of the invention

[0003] Purpose of the invention: The purpose of the present invention is to provide a substrate merging device, which is placed next to a post-film laminating machine to perform the operation of merging multiple boxes into one box, assist the post-film laminating machine, and improve product quality and work efficiency. The present invention also provides a merging control system and method for the merging device.

[0004] Technical solution: To achieve the above-mentioned invention objectives, a substrate box combining device described in the present invention includes a feed-in and feed-out mechanism and a substrate plug-in and pull-out mechanism; the feed-in and feed-out mechanism is provided with a feed-in area and a feed-out area, the feed-in area is provided with at least two clips, and the feed-out area is provided with at least one clip; the substrate plug-in and pull-out mechanism includes a servo X-axis, a servo Y-axis, a servo Z-axis, a substrate plug-in and pull-out claw, a substrate transfer fixture and a CCD; the servo X-axis is horizontally arranged, the servo Z-axis is vertically arranged, and can move left and right along the servo X-axis, the servo Y-axis points to the feed-in and feed-out mechanism, and can move up and down along the servo Z-axis; the substrate plug-in and pull-out claw can move forward and backward along the servo Y-axis, the substrate transfer fixture is located below the substrate plug-in and pull-out claw, and the CCD is located above the substrate transfer fixture.

[0005] Preferably, the device further comprises a substrate cache mechanism, which comprises an abnormal material lifting shaft, a cache platform and a non-contact suction cup; the non-contact suction cup can move up and down along the abnormal material lifting shaft, and the cache platform is located below the non-contact suction cup.

[0006] Preferably, the device is enclosed in a rectangular frame, and the substrate buffer mechanism is located on one side of the frame; an operation window is provided on the frame corresponding to the material feeding and discharging mechanism, and an abnormal opening is provided corresponding to the substrate buffer mechanism.

[0007] Preferably, the number of clips in the feeding zone is more than that in the discharging zone. In specific implementation, the ratio of the number of clips can be 3:2 or 2:1; the feeding zone and the discharging zone can be arranged in a single layer or in multiple layers.

[0008] Preferably, the servo drivers of the servo X-axis, the servo Y-axis and the servo Z-axis and the CCD are connected to an industrial computer.

[0009] A substrate and box combining control system described in the present invention comprises the substrate and box combining device described above, an industrial computer connected to the substrate and box combining device, and an MES system connected to the industrial computer;

[0010] The industrial computer is used to control the servo driver to drive the substrate plugging and unplugging mechanism to move the position according to the instructions of the MES system, control the X and Z axes to move to the specified positions with the substrate clips respectively, control the Y axis to drive the substrate plugging and unplugging claws to take the substrate, and move the substrate to the position below the CCD; notify the CCD to scan the substrate code and feed back the code information to the MES system, and merge the substrate into the corresponding clip according to the clip position of the discharge area issued by the MES system;

[0011] The MES system is used to receive the codes of loaded and empty clips input and scanned by the operator, send a merge instruction to the industrial computer, obtain substrate-related information based on the substrate codes received from the industrial computer, and allocate the empty clip position in the discharge area in combination with the information of the existing substrates in the clips in the discharge area.

[0012] Preferably, the industrial computer is also used to control the X and Z axes to move to the cache platform position when there is abnormal material, use the non-contact suction cup on the abnormal material lifting axis to suck the substrate away from the substrate transfer fixture, then control the X and Z axes to move away, and use the abnormal material lifting axis to place the abnormal substrate into the cache platform.

[0013] A substrate and box control method according to the present invention comprises the following steps:

[0014] (1) The MES system receives and records the codes of loaded and empty magazines inserted and scanned by the operator;

[0015] (2) The MES system sends a merge command to the industrial computer, which controls the servo driver to drive the substrate insertion and extraction mechanism to move the position, controls the X and Z axes to move to the specified positions where the substrate clips are installed, and drives the Y axis to take the substrate and move the substrate to the position below the CCD.

[0016] (3) The CCD scans the substrate code, and the substrate insertion and extraction claws continue to pull the substrate until it is completely pulled out; the industrial computer obtains the substrate code scanned by the CCD and sends it to the MES system. The MES system obtains substrate-related information based on the substrate code fed back by the industrial computer, and allocates the clip position of the discharge area based on the information of the existing substrates in the clip of the discharge area and sends it to the industrial computer;

[0017] The industrial computer controls the X and Z axes to move the extracted substrate to the specified position of the empty clip and put the substrate in;

[0018] (4) Repeat steps (2) and (3) until all the clip substrates in the feeding area are removed.

[0019] Preferably, when there is abnormal material, the industrial computer controls the X and Z axes to move to the cache platform position, uses the non-contact suction cup on the abnormal material lifting axis to suck the substrate away from the substrate transfer fixture, then controls the X and Z axes to move away, and uses the abnormal material lifting axis to place the abnormal substrate into the cache platform.

[0020] Beneficial effects: The present invention can replace the manual operation of plugging and unplugging substrates and merging boxes by designing a merging device for merging multiple boxes into one box, effectively avoiding the problem of product damage and easy errors caused by manual operation. The feeding and unloading mechanism can flexibly set the number of clips in the feeding area and the discharging area according to the production capacity requirements. The plugging and unplugging mechanism of the substrate can flexibly move in three axes, front, back, up, down, left and right, and can realize automatic material collection, automatic merging and automatic sorting according to the control instructions, and with the assistance of positioning and scanning code CCD, it can effectively collect information on chip substrates, and can realize accurate positioning of substrates and scanning code anti-fool function. The substrate caching mechanism of the present invention can realize the caching of abnormal materials. When abnormal materials appear, there is no need to stop the machine and alarm, and the operation can continue. The use of the substrate merging device of the present invention can effectively reduce the work intensity of personnel, save labor, and has the advantages of substrates that are not easy to deform, not easy to break, error-proof, anti-fool, no stains and high efficiency. The merging control system and method of the present invention can effectively combine the device for merging multiple boxes into one box of substrates with the MES system, while ensuring product quality, effectively improving the production efficiency of the production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of the device structure of an embodiment of the present invention.

[0022] Figure 2 It is a structural schematic diagram of the feeding and discharging mechanism in an embodiment of the present invention.

[0023] Figure 3 It is a structural schematic diagram of the plug-in substrate mechanism in an embodiment of the present invention.

[0024] Figure 4 Schematic diagram of the structure of the substrate buffer mechanism in an embodiment of the present invention.

[0025] Figure 5 It is a front view of the overall appearance of the device according to an embodiment of the present invention.

[0026] Figure 6 It is a top view of the overall appearance of the device according to an embodiment of the present invention.

[0027] Figure 7 Schematic diagram of control system connection according to an embodiment of the present invention.

[0028] Figure 8 The figure is a flow chart of a control method according to an embodiment of the present invention.

[0029] In the figure, 1-feeding area clip, 2-discharging area clip, 3-servo X-axis, 4-servo Y-axis, 5-servo Z-axis, 6-abnormal material lifting axis, 7-substrate insertion and extraction claws, 8-substrate transfer fixture, 9-CCD, 10-non-contact suction cup, 11-cache platform. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0031] In the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediary medium. The terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] like Figure 1 As shown, a substrate box combining device disclosed in an embodiment of the present invention includes a feeding and discharging mechanism, a substrate plugging and unplugging mechanism, and a substrate buffer mechanism. The feeding and discharging mechanism is provided with a feeding area and a discharging area. The feeding area is provided with at least two clips, and the discharging area is provided with at least one clip. The specific number of clips can be set according to space and production capacity requirements. The ratio of the number of clips 1 in the feeding area and the number of clips 2 in the discharging area can be controlled to be 3:2 or 2:1. Figure 2 In this example, the feeding area can simultaneously put in 6 magazines, and the discharging area can simultaneously put in 4 magazines, which can be used for two batches. The feeding area and the discharging area can also be set up as multiple layers, such as in this example, divided into upper and lower layers, which is convenient for operation.

[0033] like Figure 3As shown, the substrate plugging and unplugging mechanism includes a servo X-axis 3, a servo Y-axis 4, a servo Z-axis 5, a substrate plugging and unplugging claw 7, a substrate transfer fixture 8 and a CCD 9. The XYZ three-axis mechanism can realize the plugging and unplugging positioning of the substrate, wherein the servo X-axis 3 is horizontally arranged, the servo Z-axis 5 is vertically arranged, and can move left and right along the servo X-axis 3, and the servo Y-axis 4 points to the feeding and unloading mechanism and can move up and down along the servo Z-axis 5. The substrate plugging and unplugging claw 7 can move forward and backward along the servo Y-axis, the substrate transfer fixture 8 is located above the substrate plugging and unplugging claw 7, and the CCD 9 is located above the substrate transfer fixture 8, which is used to scan and extract the code (such as a barcode or a QR code) on the substrate, and can realize the substrate positioning and scanning code anti-fool function. The substrate plugging and unplugging claw 7 and the substrate transfer fixture 8 can be replaced according to the product type.

[0034] like Figure 4 As shown, the substrate buffer mechanism includes an abnormal material lifting shaft 6, a buffer platform 11 and a non-contact suction cup 10. The non-contact suction cup 10 can move up and down along the abnormal material lifting shaft 6, and the buffer platform 11 is located below the non-contact suction cup 10. When one wrong substrate appears, the buffer function can be realized without stopping the machine to alarm and wait for personnel to handle. If there are more than two consecutive wrong substrates, the machine can be stopped to wait for personnel to handle.

[0035] like Figure 5 , 6 The figure is a schematic diagram of the overall appearance of the device of the present invention. The device can be enclosed in a rectangular frame, the substrate buffer mechanism is located on one side of the frame, an operation window is provided on the frame corresponding to the feeding and discharging mechanism, and an abnormal port is provided corresponding to the substrate buffer mechanism.

[0036] After the personnel place the empty and loaded clips in their respective designated positions, close the operation window, move the XZ axis to the designated position of the substrate clip, and the Y axis drives the insertion and extraction claws to take the substrate from the clip. After the CCD scans and locates (the substrate barcode / QR code can be pasted directly below the CCD direction), the insertion and extraction claws continue to pull the substrate until it is completely pulled out, and then move the pulled-out substrate to the designated position of the empty clip through the XZ axis to put the substrate in, and repeat this process. When there is abnormal material, move the pulled-out substrate to the cache platform position through the XZ axis, use the non-contact suction cup on the abnormal material lifting axis to suck the substrate away from the substrate transfer fixture, move the XZ axis away, and the abnormal material lifting axis puts the abnormal substrate into the cache platform. When it reaches 2 pieces, the machine alarms and the personnel take the abnormal substrate away from the abnormal port.

[0037] The servo X, Y, Z, abnormal material lifting axis and CCD are all connected to the industrial computer and perform corresponding operations according to the instructions of the industrial computer. Figure 7As shown, an industrial computer can be used to control the four servo drivers of X, Y, Z, and abnormal material lifting, and the CAN bus can be used to control the driver to drive the servo motors of X, Y, Z, and abnormal material lifting. The CCD is connected to the industrial computer through the communication interface RS232. The CCD reads the substrate barcode / QR code according to the instructions of the industrial computer and feeds it back to the industrial computer. The industrial computer and the MES system are linked through the local area network to transmit instructions and information.

[0038] Another embodiment of the present invention discloses a substrate box merging control system, including the above-mentioned substrate box merging device, an industrial computer connected to the substrate box merging device, and an MES system connected to the industrial computer. The industrial computer is used to control the servo driver to drive the substrate plugging and unplugging mechanism to move the position according to the instructions of the MES system, control the X and Z axes to move to the specified positions with the substrate clips respectively, control the Y axis to drive the substrate plugging and unplugging claws to take the substrate, and move the substrate to the position below the CCD; notify the CCD to scan the substrate code and feed back the coding information to the MES system, and merge the substrate into the corresponding clip according to the clip position of the discharge area issued by the MES system; the MES system is used to receive the codes of the loaded clip and the empty clip inserted and scanned by the operator, send a merge instruction to the industrial computer, and obtain the substrate-related information according to the substrate code fed back by the industrial computer, and allocate the empty clip position of the discharge area in combination with the information of the existing substrate in the clip of the discharge area. When a substrate caching mechanism is provided, the industrial computer is also used to control the X and Z axes to move to the cache platform position when there is abnormal material, use the non-contact suction cup on the abnormal material lifting axis to suck the substrate away from the substrate transfer fixture, then control the X and Z axes to move away, and use the abnormal material lifting axis to place the abnormal substrate on the cache platform.

[0039] like Figure 8 As shown, another embodiment of the present invention discloses a substrate assembling and box control method based on the above substrate assembling and box device, and its main steps are as follows:

[0040] 1. The loading / unloading operator scans the code of the loaded magazine in the MES system, records the number of the loaded magazine, puts the loaded magazine into the feeding area, puts the empty magazine into the discharging area, and scans the magazine code at the same time, and records it in the MES in the order of position;

[0041] 2. The MES system sends a merge command to the industrial computer. The industrial computer controls the servo driver to drive the servo motor of the substrate plug-in mechanism to move the position. The X and Z axes move to the specified positions with the substrate clips respectively. The Y axis drives the plug-in claws to take the substrate from the clips. The substrate moves to the position below the CCD.

[0042] 3. The CCD scans the substrate barcode / QR code and sends it to the MES system to obtain the substrate product, process, and work order information, and allocates the discharge clip position of the substrate. The allocation rule is: if the obtained substrate product, process, and work order information are the same as the product, process, and work order information of the substrate already in the discharge area clip, and the number of substrates already merged in the clip is less than the set threshold (such as 20), the clip position of this discharge area is obtained. If the number of substrates already merged in the clip is the set threshold (such as 20), a new empty clip is allocated to obtain a new empty clip position in the discharge area. If the obtained substrate product, process, and work order information are different from the product, process, and work order information of the substrate already in the discharge area clip, a new empty clip is allocated to obtain a new empty clip position in the discharge area, and the discharge area clip position is sent to the industrial computer. The industrial computer controls the servo driver to drive the plug-in claw to continue pulling the substrate until it is completely pulled out, and then moves the pulled-out substrate through the X and Z axes to the allocated discharge clip position to put the substrate in;

[0043] 4. When there are abnormal materials, such as unclear barcode / QR code, stains that cannot be read, damaged barcode / QR code, or QR code not in the specified position, they are all abnormal and need manual processing. The X and Z axes move to the specified positions with substrate clips respectively, and the Y axis drives the plug-in claw to take the substrate from the clip. The plug-in claw continues to pull the substrate until it is completely pulled out, and then the pulled-out substrate is moved to the cache platform position through the X and Z axes. The non-contact suction cup on the abnormal material lifting axis sucks the substrate away from the substrate transfer fixture, and the X and Z axes move away. The abnormal material lifting axis puts the abnormal substrate into the cache platform. When it reaches 2 pieces, the platform alarms, and the staff takes the abnormal substrate away at the abnormal port;

[0044] 5. Repeat this process until all the loading clip base plates are removed;

[0045] 6. Notify the MES system to complete the substrate merging;

[0046] 7. The loading / unloading operator scans the combined clips in the unloading area and prepares to load the rear laminating machine;

[0047] 8. Feed the rear laminating machine;

[0048] 9. Post laminating machine operation.

[0049] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A substrate assembling device, characterized in that: It includes a feeding and discharging mechanism and a substrate plugging and unplugging mechanism; the feeding and discharging mechanism is provided with a feeding area and a discharging area, the feeding area is provided with at least two clips, and the discharging area is provided with at least one clip; the substrate plugging and unplugging mechanism includes a servo X-axis, a servo Y-axis, a servo Z-axis, a substrate plugging and unplugging claw, a substrate transfer fixture and a CCD; the servo X-axis is horizontally arranged, the servo Z-axis is vertically arranged, and can move left and right along the servo X-axis, the servo Y-axis points to the feeding and discharging mechanism, and can move up and down along the servo Z-axis; the substrate plugging and unplugging claw can move forward and backward along the servo Y-axis, the substrate transfer fixture is located below the substrate plugging and unplugging claw, and the CCD is located above the substrate transfer fixture; the clips in the feeding area are more than the clips in the discharging area, and the number of clips is proportional; the CCD is used to scan the substrate code and feed back the code information to the MES system, so that the MES system can send the clip position of the discharging area and merge the substrate into the corresponding clip.

2. The substrate assembling device according to claim 1, characterized in that: It also includes a substrate cache mechanism, which includes an abnormal material lifting shaft, a cache platform and a non-contact suction cup; the non-contact suction cup can move up and down along the abnormal material lifting shaft, and the cache platform is located below the non-contact suction cup.

3. The substrate assembling device according to claim 2, characterized in that: The device is enclosed in a rectangular frame, and the substrate buffer mechanism is located on one side of the frame; an operation window is provided on the frame corresponding to the material feeding and discharging mechanism, and an abnormal opening is provided corresponding to the substrate buffer mechanism.

4. The substrate assembling device according to claim 1, characterized in that: The number of clips in the feeding zone is more than that in the discharging zone, and the ratio of the number of clips is 3:2 or 2:

1.

5. The substrate assembling device according to claim 1, characterized in that: The feeding area and the discharging area are arranged in a single layer or in multiple layers.

6. The substrate assembling device according to claim 1, characterized in that: The servo drivers of the servo X-axis, the servo Y-axis and the servo Z-axis and the CCD are connected to the industrial computer.

7. A substrate and box control system, characterized in that: It comprises a substrate box combining device according to any one of claims 1 to 6, an industrial computer connected to the substrate box combining device, and an MES system connected to the industrial computer; The industrial computer is used to control the servo driver to drive the substrate plugging and unplugging mechanism to move the position according to the instructions of the MES system, control the X and Z axes to move to the specified positions with the substrate clips respectively, control the Y axis to drive the substrate plugging and unplugging claws to take the substrate, and move the substrate to the position below the CCD; notify the CCD to scan the substrate code and feed back the code information to the MES system, and merge the substrate into the corresponding clip according to the clip position of the discharge area issued by the MES system; The MES system is used to receive the codes of loaded and empty clips input and scanned by the operator, send a merge instruction to the industrial computer, obtain substrate-related information based on the substrate codes received from the industrial computer, and allocate the empty clip position in the discharge area in combination with the information of the existing substrates in the clips in the discharge area.

8. The substrate and box control system according to claim 7, characterized in that: The industrial computer is also used to control the X and Z axes to move to the cache platform position when there is abnormal material, use the non-contact suction cup on the abnormal material lifting axis to suck the substrate away from the substrate transfer fixture, then control the X and Z axes to move away, and use the abnormal material lifting axis to place the abnormal substrate into the cache platform.

9. A substrate assembling and box control method using the substrate assembling and box device according to any one of claims 1 to 6, characterized in that: The steps include: (1) The MES system receives and records the codes of loaded and empty magazines inserted and scanned by the operator; (2) The MES system sends a merge command to the industrial computer, which controls the servo driver to drive the substrate insertion and extraction mechanism to move the position, controls the X and Z axes to move to the specified positions where the substrate clips are installed, and drives the Y axis to take the substrate and move the substrate to the position below the CCD. (3) The CCD scans the substrate code, and the substrate insertion and extraction claws continue to pull the substrate until it is completely pulled out; the industrial computer obtains the substrate code scanned by the CCD and sends it to the MES system. The MES system obtains the substrate-related information based on the substrate code fed back by the industrial computer, and allocates the clip position of the discharge area in combination with the information of the existing substrate in the clip of the discharge area and sends it to the industrial computer; the industrial computer controls the X and Z axes to move the pulled-out substrate to the specified position of the empty clip and puts the substrate in; (4) Repeat steps (2) and (3) until all the clip substrates in the feeding area are removed.

10. The substrate cassette control method according to claim 9, characterized in that: The method further includes: when there is abnormal material, the industrial computer controls the X and Z axes to move to the cache platform position, uses the non-contact suction cup on the abnormal material lifting axis to suck the substrate and separate it from the substrate transfer fixture, then controls the X and Z axes to move away, and uses the abnormal material lifting axis to place the abnormal substrate into the cache platform.

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