A microwave detection module with a multi-layer structure and a manufacturing method thereof

Abstract

The present invention provides a microwave detection module with a multi-layer structure and a manufacturing method thereof, wherein based on the fixing of two double-sided copper-clad substrates on both sides of a curing sheet, the microwave detection module with a multi-layer structure includes a radiation source in a sequential arrangement state, an antenna substrate, a reference ground, the curing sheet, a circuit shielding ground, a circuit substrate and a circuit layer, wherein the circuit shielding ground, the reference ground and a grounding layer of the circuit layer are electrically connected via a grounding line passing through the antenna substrate and the circuit substrate, wherein the radiation source is electrically connected to the circuit layer via a feeder line passing through the antenna substrate and the circuit substrate, wherein the circuit shielding ground and the grounding layer are electrically connected via multiple connection lines passing through the circuit substrate, thereby forming a microwave detection module with a stable and consistent highly integrated structure and excellent anti-interference performance.

Description

Technical Field

[0001] The present invention relates to the field of microwave detection, and more particularly to a microwave detection module with a multi-layer structure and a manufacturing method thereof. Background Art

[0002] With the development of Internet of Things technology, artificial intelligence, smart home, and smart security technology have an increasing demand for environmental detection, especially for the detection of human presence, movement, and micro-motion characteristics. Among them, microwave detection technology based on the Doppler effect principle, as an important hub connecting people and objects, and objects and objects, has unique advantages in behavior detection and existence detection technology. It can detect active objects, such as human motion characteristics, movement characteristics, and micro-motion characteristics, and even human heartbeat and breathing characteristics without infringing on human privacy, and therefore has broad application prospects.

[0003] Existing microwave detection modules are mainly divided into microwave detection modules with columnar radiation source structures and microwave detection modules with flat radiation source structures according to the structure of the radiation source, wherein the microwave detection module with the flat radiation source structure is favored due to its advantages of small space occupation and relatively high efficiency. Specifically, the microwave detection module with the flat radiation source structure includes a radiation source configured as a copper-clad layer, and a reference ground also configured as a copper-clad layer and spaced from the radiation source, wherein a radiation gap of the microwave detection module is formed between the radiation source and the reference ground, wherein the radiation gap directly affects the performance of the microwave detection module.

[0004] In the existing manufacturing method and corresponding structure of the microwave detection module with a flat radiation source structure, a multi-layer structure design is mostly adopted. By integrating the corresponding circuit into the microwave detection module, such as integrating the oscillation circuit, the mixer detection circuit, the amplification circuit, the filter network and the logic circuit with the MCU as the carrier into the microwave detection module, the compactness of the structure of the microwave detection module is improved and the volume of the microwave detection module is reduced, and it is beneficial to the impedance matching between the corresponding circuit and the microwave detection module. Due to the above advantages of the microwave detection module with a multi-layer structure design, the multi-layer structure has become the current structural design trend of the microwave detection module. However, while the microwave detection module is highly integrated due to the multi-layer structure design, it also brings new technical problems due to the multi-layer structure design, such as the consistency problem of the radiation gap of the microwave detection module with a multi-layer structure, and the interference problem of the corresponding circuit on the radiation source and the reference ground of the microwave detection module. Among them, corresponding to the consistency problem of the radiation gap of the microwave detection module adopting a multi-layer structure, in the structural description of a microwave detector with a multi-layer PCB structure disclosed in the utility model patent with application number 201920044134.1, the structural relationship between the corresponding FR4 dielectric layer (1), the middle stratum (2), the radio frequency circuit layer (3) and the microstrip antenna layer (5) can obtain a microwave detector with a consistent multi-layer PCB structure, that is, based on the microwave detector with a multi-layer PCB structure disclosed in the utility model patent, the radiation gap formed between the middle stratum (2) and the microstrip antenna layer (5) is filled with a stable FR4 dielectric layer (1) and has consistency. However, it is understandable that when the microwave detector of the multi-layer PCB structure is working, the high-frequency electrical signal carried by the radio frequency circuit layer (3) will inevitably respond to the grounded intermediate layer (2) to generate radiation, and affect the potential distribution of the intermediate layer (2), that is, the response between the microstrip antenna layer (5) and the intermediate layer (2) is affected, which affects the matching design of the microstrip structure antenna formed by the intermediate layer (2) and the microstrip antenna layer (5). Moreover, although the structure of arranging the intermediate layer (2) in the middle of the FR4 dielectric layer (1) is simple, it is difficult to implement based on the existing circuit board manufacturing process.

[0005] That is to say, the existing manufacturing method and corresponding structure of the microwave detection module with a flat-plate radiation source structure mostly adopt a multi-layer structural design, but the consistency problem of the radiation gap of the microwave detection module caused by the multi-layer structural design and the interference problem of the corresponding circuit on the radiation source and the reference ground of the microwave detection module have not been effectively solved. Summary of the invention

[0006] One object of the present invention is to provide a multi-layer microwave detection module and a manufacturing method thereof, wherein the multi-layer microwave detection module has a stable and consistent radiation gap and can resist the interference of the corresponding circuit integrated in the multi-layer microwave detection module to the multi-layer microwave detection module, thereby improving the stability and consistency of the multi-layer microwave detection module.

[0007] Another object of the present invention is to provide a multi-layer microwave detection module and a manufacturing method thereof, wherein the radiation source and reference ground of the multi-layer microwave detection module are respectively formed on the two copper-clad surfaces of a double-sided copper-clad substrate, and the radiation gap formed between the radiation source and the reference ground is filled with an antenna substrate of the double-sided copper-clad substrate to have stable consistency.

[0008] Another object of the present invention is to provide a multi-layer microwave detection module and a manufacturing method thereof, wherein the multi-layer microwave detection module has a circuit shielding ground and a circuit layer respectively formed on the two copper-clad surfaces of another double-sided copper-clad substrate covering a circuit substrate, so that the interference of the circuit layer to the reference ground can be blocked and suppressed by the circuit shielding layer, which is beneficial to improving the stability and consistency of the multi-layer microwave detection module.

[0009] Another object of the present invention is to provide a microwave detection module with a multi-layer structure and a manufacturing method thereof, wherein the reference ground and the circuit shielding ground are fixed at intervals on two sides of a solidified sheet to form a microwave detection module with a multi-layer structure and the multi-layer structure integrating the circuit layer.

[0010] Another object of the present invention is to provide a multi-layer microwave detection module and a manufacturing method thereof, wherein the multi-layer microwave detection module can be easily prepared by fixing two double-sided copper-clad substrates to the two sides of the curing sheet, thereby being simple and easy to operate.

[0011] Another object of the present invention is to provide a multi-layer microwave detection module and a manufacturing method thereof, wherein the reference ground and the circuit shielding ground are respectively bonded to the two sides of a semi-cured sheet, and then the semi-cured sheet is converted into the cured sheet by pressing and the reference ground and the circuit shielding ground are fixed on the two sides of the cured sheet at intervals. This is simple and easy to operate, and a consistent and stable cured sheet can be obtained to form a consistent and stable connection structure between the reference ground and the circuit shielding ground.

[0012] Another object of the present invention is to provide a multi-layer microwave detection module and a manufacturing method thereof, wherein the isolation between the reference ground and the circuit shielding ground by the solidified sheet avoids direct conduction between the reference ground and the circuit shielding ground in a surface contact manner, that is, the reference ground and the circuit shielding ground are avoided to be equivalent to the same conductive layer under the action of high-frequency electrical signals. The interference of the circuit layer on the reference ground can be blocked by the circuit shielding layer and suppressed, which is beneficial to improving the stability and consistency of the multi-layer microwave detection module.

[0013] Another object of the present invention is to provide a microwave detection module with a multi-layer structure and a manufacturing method thereof, wherein the radiation source is provided with a feeding point, wherein the feeding point is offset from the physical center of the radiation source, wherein the radiation source is conductively connected to the circuit layer from the feeding point via a feeding line passing through the antenna substrate and the circuit substrate, so that the radiation source is fed at the feeding point by the circuit layer via the feeding line.

[0014] Another object of the present invention is to provide a microwave detection module with a multi-layer structure and a manufacturing method thereof, wherein the feeding line is configured as a metallized through hole formed by a metallized via structure that penetrates the antenna substrate and the circuit substrate, so as to facilitate obtaining a stable and consistent line connection when the corresponding circuit is integrated into the microwave detection module with the multi-layer structure.

[0015] Another object of the present invention is to provide a multi-layer microwave detection module and a manufacturing method thereof, wherein the circuit shielding ground is electrically connected to a grounding layer of the circuit layer through a grounding line penetrating the circuit substrate, and wherein the grounding layer is electrically connected to the ground potential of the corresponding power supply line and grounded when the multi-layer microwave detection module is powered on. The circuit shielding ground, as a planar conductive structure connected to the grounding layer of the circuit layer, has a shielding effect on the circuit layer and is beneficial to suppressing the interference of the circuit layer on the reference ground.

[0016] Another object of the present invention is to provide a multi-layer microwave detection module and a manufacturing method thereof, wherein the grounding circuit is conductively extended to be conductively connected to the reference ground and penetrates the antenna substrate to form a state in which the reference ground is grounded by being electrically connected to the circuit shielding ground and the grounding layer through the grounding circuit that passes through the antenna substrate and the circuit substrate, and at the same time, the high-frequency electrical signal carried by the circuit layer is shared by the circuit shielding ground and is suppressed from affecting the potential distribution of the reference ground, that is, the interference of the circuit layer to the reference ground can be suppressed by the circuit shielding ground, which is beneficial to improving the stability and consistency of the multi-layer microwave detection module.

[0017] Another object of the present invention is to provide a multi-layer microwave detection module and a manufacturing method thereof, wherein the grounding circuit is configured to be a metallized through hole that penetrates the antenna substrate and the circuit substrate after the reference ground and the circuit shielding ground are fixed at intervals on both sides of the curing sheet with a metallized via structure, so as to facilitate obtaining a stable and consistent circuit connection when the corresponding circuit is integrated into the multi-layer microwave detection module.

[0018] Another object of the present invention is to provide a multi-layer microwave detection module and a manufacturing method thereof, wherein the grounding circuit is configured as a metallized through-hole formed by a metallized via structure and penetrating the antenna substrate and the circuit substrate, so as to be suitable for forming a grounded state of the ground layer by connecting the grounding circuit to the ground potential of the corresponding power supply line when the multi-layer microwave detection module is powered and connected to the corresponding power supply line, which is beneficial to obtaining a stable and consistent line connection when the multi-layer microwave detection module is connected to the corresponding power supply line.

[0019] Another object of the present invention is to provide a microwave detection module with a multi-layer structure and a manufacturing method thereof, wherein the circuit shielding ground is electrically connected to the grounding layer in a multi-point connection manner at its periphery, so that a uniform equipotential body is formed on the circuit shielding ground when the circuit shielding ground is connected to the grounding layer of the circuit layer, that is, the high-frequency electrical signal carried by the circuit layer converges to the ground, and the potential difference generated on the circuit shielding ground can be offset to form a uniform equipotential body on the circuit shielding ground, then the influence of the high-frequency electrical signal carried by the circuit layer on the potential distribution of the circuit shielding ground can be suppressed and hindered from affecting the potential distribution of the reference ground, and the harmonic radiation generated by the influence of the fluctuation of the potential distribution of the circuit shielding ground on the potential distribution of the reference ground can be suppressed, that is, the influence of the circuit layer on the potential distribution of the circuit shielding ground is suppressed and it is difficult to further affect the potential distribution of the reference ground, so that when the reference ground is electrically connected to the ground potential of the circuit layer, the interference of the circuit layer on the reference ground can be suppressed, which is conducive to reducing the harmonic radiation of the circuit layer.

[0020] Another object of the present invention is to provide a microwave detection module with a multi-layer structure and a manufacturing method thereof, wherein the circuit shielding is electrically connected to the grounding layer of the circuit layer through multiple connecting lines passing through the circuit substrate, thereby forming a state in which the circuit shielding is electrically connected to the grounding layer at multiple points around its periphery.

[0021] Another object of the present invention is to provide a microwave detection module with a multi-layer structure and a manufacturing method thereof, wherein the connecting line is arranged as a metallized through hole formed by a metallized via structure and penetrating the circuit substrate, corresponding to a metallized blind hole formed on the circuit substrate after the reference ground and the circuit shielding ground are fixed at intervals on the two sides of the curing sheet, so as to facilitate obtaining a stable and consistent line connection between the circuit shielding ground and the grounding layer.

[0022] Another object of the present invention is to provide a microwave detection module with a multi-layer structure and a manufacturing method thereof, wherein the connecting line penetrating the circuit substrate formed by a metallized via structure extends from the circuit shielding ground through the circuit substrate to the ground layer, so as to form a surround for the circuit layer at the side edge of the circuit substrate, which is beneficial to suppress the circuit layer carrying high-frequency electrical signals from radiating interference to the outside world through the side edge of the circuit substrate, including interference with the reference ground and the radiation source, and is also beneficial to suppress the interference of external electromagnetic radiation to the circuit layer through the side edge of the circuit substrate.

[0023] Another object of the present invention is to provide a microwave detection module with a multi-layer structure and a manufacturing method thereof, wherein the wavelength parameter corresponding to the frequency of the microwave detection module with the multi-layer structure is set to λ, and the distance between two adjacent connecting lines is less than or equal to 1 / 8λ, which is beneficial to improving the inhibitory effect of the connecting line on the side edge of the circuit substrate on the radiation interference through the side edge of the circuit substrate, including the harmonic radiation interference of the circuit layer to the outside through the side edge of the circuit substrate, and the interference of external electromagnetic radiation to the circuit layer through the side edge of the circuit substrate, thereby helping to improve the anti-interference performance of the microwave detection module with the multi-layer structure, including the harmonic radiation interference of the microwave detection module with the outside.

[0024] Another object of the present invention is to provide a multi-layer microwave detection module and a manufacturing method thereof, wherein the radiation source is provided with a grounding point based on the idea of ​​grounding the radiation source to reduce the impedance of the multi-layer microwave detection module, wherein the radiation source is grounded from the grounding point to reduce the impedance of the multi-layer microwave detection module, thereby improving the quality factor (i.e., Q value) of the multi-layer microwave detection module and enhancing the anti-interference performance of the multi-layer microwave detection module.

[0025] Another object of the present invention is to provide a multi-layer microwave detection module and a manufacturing method thereof, wherein the radiation originates from the grounding point and is conductively connected to the reference ground via an impedance line passing through the antenna substrate to be grounded, so as to facilitate the integration of the corresponding circuit connection to the highly integrated multi-layer microwave detection module.

[0026] Another object of the present invention is to provide a microwave detection module with a multi-layer structure and a manufacturing method thereof, wherein the impedance line is configured as a metallized through hole formed by a metallized via structure and penetrating the antenna substrate, corresponding to a metallized blind hole formed on the antenna substrate after the reference ground and the circuit shielding ground are fixed at intervals on both sides of the curing sheet, so as to facilitate obtaining a stable and consistent line connection when the corresponding circuit is integrated into the multi-layer microwave detection module.

[0027] Another object of the present invention is to provide a multi-layer microwave detection module and a manufacturing method thereof, wherein the grounding point is set at the physical center point of the radiation source so as to reduce the impedance of the multi-layer microwave detection module while reducing the influence of the grounding structure of the radiation source on the gain of the multi-layer microwave detection module.

[0028] Another object of the present invention is to provide a microwave detection module with a multi-layer structure and a manufacturing method thereof, wherein the microwave detection module with a multi-layer structure is further provided with a shielding cover, wherein the cover edge of the shielding cover is conductively fixed to the grounding layer at a side of the circuit substrate where the circuit layer is provided, so as to form an electromagnetic shielding space for the circuit layer by shielding the connecting line and the circuit, thereby suppressing the interference of the circuit layer carrying high-frequency electrical signals to the outside world and the interference of external electromagnetic radiation to the circuit layer, thereby improving the anti-interference performance of the microwave detection module with a multi-layer structure.

[0029] Another object of the present invention is to provide a multi-layer microwave detection module and a manufacturing method thereof, wherein the multi-layer microwave detection module manufactured based on the manufacturing method of the multi-layer microwave detection module has a stable and consistent highly integrated structure and excellent anti-interference performance, and the manufacturing method of the multi-layer microwave detection module is simple and easy based on the existing circuit board manufacturing process.

[0030] According to one aspect of the present invention, the present invention provides a microwave detection module with a multi-layer structure, wherein the microwave detection module with a multi-layer structure comprises:

[0031] A first double-sided copper-clad substrate, wherein the first double-sided copper-clad substrate comprises a radiation source, an antenna substrate and a reference ground, wherein the radiation source and the reference ground are respectively arranged on two sides of the antenna substrate, wherein the radiation source has a feeding point, wherein the feeding point deviates from the physical center of the radiation source;

[0032] a second double-sided copper-clad substrate, wherein the second double-sided copper-clad substrate comprises a circuit shielding ground, a circuit substrate and a circuit layer, wherein the circuit shielding ground and the circuit layer are respectively arranged on two sides of the circuit substrate, wherein the circuit layer comprises a grounding layer arranged around the circuit substrate, wherein the grounding layer is suitable for being electrically connected to the ground potential of the corresponding power supply line and being grounded when the microwave detection module of the multi-layer structure is powered;

[0033] A curing sheet, wherein the reference ground and the circuit shielding ground are fixed to two sides of the curing sheet at intervals to form a structural state in which the radiation source, the antenna substrate, the reference ground, the curing sheet, the circuit shielding ground, the circuit substrate and the circuit layer are arranged in sequence;

[0034] a feeder circuit, wherein the feeder is provided through the antenna substrate and the circuit substrate and is isolated from the reference ground and the circuit shielding ground, wherein the radiation originates from the feeder point and is electrically connected to the circuit layer via the feeder circuit;

[0035] At least one grounding circuit, wherein the grounding circuit passes through the antenna substrate and the circuit substrate and is electrically connected to the reference ground, the circuit shielding ground and the grounding layer.

[0036] In one embodiment, the multi-layer microwave detection module further comprises a plurality of connection lines, wherein the connection lines pass through the circuit substrate and are electrically connected to the circuit shielding ground and the ground layer.

[0037] In one embodiment, the connection line is configured as a metalized blind hole formed with a metalized via structure, penetrating the circuit substrate and electrically connecting the circuit shielding ground and the ground layer.

[0038] In one embodiment, the multi-layer microwave detection module further comprises a shielding cover, wherein the shielding cover is fixed to the circuit substrate at a side of the circuit substrate where the circuit layer is disposed in a state of being conductively connected to the ground layer.

[0039] In one embodiment, the wavelength parameter corresponding to the frequency of the microwave detection module of the multi-layer structure is assumed to be λ, and the distance between two adjacent connection lines is set to be less than or equal to λ / 8.

[0040] In one embodiment, an isolation region is provided at a position of the reference ground and the circuit shielding ground corresponding to the feeding point, wherein the feeding line passes through the isolation region and is isolated from the reference ground and the circuit shielding ground.

[0041] In one embodiment, the feeding circuit is configured as a metallized through hole formed with a metallized via structure and penetrating the antenna substrate and the circuit substrate.

[0042] In one embodiment, the grounding circuit is configured as a metallized through hole formed by a metallized via structure and penetrating the antenna substrate and the circuit substrate.

[0043] In one embodiment, the radiation source is electrically connected to the ground layer of the circuit layer.

[0044] In one embodiment, the multi-layer microwave detection module further includes an impedance line, wherein the impedance line passes through the antenna substrate, and wherein the radiation source is electrically connected to the reference ground via the impedance line and is electrically connected to the ground layer of the circuit layer.

[0045] In one embodiment, the impedance line is configured as a metallized blind hole formed by a metallized via structure and penetrating the antenna substrate.

[0046] In one embodiment, the radiation source has a grounding point, wherein the grounding point is located at the physical center of the radiation source, and wherein the radiation source is electrically connected to the reference ground via the impedance line from the grounding point.

[0047] According to another aspect of the present invention, a method for manufacturing a microwave detection module with a multi-layer structure is further provided, and the method for manufacturing a microwave detection module with a multi-layer structure comprises the following steps:

[0048] A. A radiation source is formed by etching one of the copper-clad layers of a first double-sided copper-clad substrate in a corresponding shape and size, and the other copper-clad layer of the first double-sided copper-clad substrate corresponds to a reference ground, and an antenna substrate corresponds to the area between the radiation source and the reference ground;

[0049] B. Etching one of the copper-clad layers of a second double-sided copper-clad substrate in a corresponding shape and size to form a circuit layer having a ground layer, then the other copper-clad layer of the second double-sided copper-clad substrate corresponds to a circuit shielding ground, and the space between the circuit shielding ground and the circuit layer corresponds to a circuit substrate;

[0050] C. Fixing the reference ground and the circuit shielding ground on two sides of a solid sheet to form a structural state in which the radiation source, the antenna substrate, the reference ground, the solid sheet, the circuit shielding ground, the circuit substrate and the circuit layer are arranged in sequence;

[0051] D. electrically connecting the radiation source to the circuit layer at a feeding point of the radiation source through a feeding line penetrating the antenna substrate and the circuit substrate; and

[0052] E. Electrically connecting the reference ground, the circuit shielding ground and the ground layer of the circuit layer through at least one ground line penetrating the antenna substrate and the circuit substrate.

[0053] In one embodiment, the method further comprises the following steps before step (C):

[0054] F. Using a plurality of connection lines to penetrate the circuit substrate to electrically connect the circuit shielding ground and the grounding layer of the circuit layer.

[0055] In one embodiment, in the step (F), a metallized via process is used to form the connection line that penetrates the circuit substrate and electrically connects the circuit shielding ground and the ground layer.

[0056] In one embodiment, according to the step (F), the wavelength parameter corresponding to the frequency of the microwave detection module of the multi-layer structure is set to λ, wherein the distance between two adjacent connecting lines is set to be less than or equal to λ / 8.

[0057] In one embodiment, the method further comprises the following steps before step (C):

[0058] G. Penetrating the antenna substrate with an impedance line to electrically connect the radiation source and the reference ground.

[0059] In one embodiment, in the step (G), the impedance line penetrating the antenna substrate and electrically connecting the radiation source and the reference ground is formed by a metallized via process.

[0060] In one embodiment, in the step (G), the impedance line penetrating the antenna substrate and electrically connecting the radiation source and the reference ground is formed at the physical center of the radiation source by a metallized via process.

[0061] In one embodiment, the method further comprises the following steps after step (C):

[0062] H. Fixing the shielding cover to the circuit substrate by conductively connecting the cover edge of a shielding cover to the ground layer on the side of the circuit substrate where the circuit layer is provided.

[0063] In one embodiment, according to step (C), the reference ground and the circuit shielding ground are respectively bonded to the two sides of a semi-cured sheet, and then the semi-cured sheet is converted into the cured sheet by pressing and the reference ground and the circuit shielding ground are fixed at intervals on the two sides of the cured sheet.

[0064] In one embodiment, according to the step (D), the feeding point is offset from the physical center of the radiation source.

[0065] In one embodiment, in the step (D), the feeding line penetrating the antenna substrate and the circuit substrate is formed by a metallized via process.

[0066] In one embodiment, in the step (E), the grounding line penetrating the antenna substrate and the circuit substrate is formed by a metallized via process. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] Figure 1 FIG. 4 is a schematic diagram of a three-dimensional structure of a microwave detection module with a multi-layer structure according to an embodiment of the present invention.

[0068] Figure 2 Schematic side cross-sectional view of the multi-layer structure microwave detection module according to the above embodiment of the present invention.

[0069] Figure 3 4 is a circuit principle block diagram of the multi-layer structure microwave detection module according to the above embodiment of the present invention.

[0070] Figure 4 FIG. 4 is a schematic diagram of the three-dimensional structure of the microwave detection module of the layer structure according to the above-mentioned variant embodiment of the present invention.

[0071] Figure 5 1 is a side cross-sectional schematic diagram of the microwave detection module of the layer structure according to the above-mentioned variant embodiment of the present invention.

[0072] Figure 6 4 is a circuit principle block diagram of the microwave detection module of the layer structure according to the above-mentioned variant embodiment of the present invention. DETAILED DESCRIPTION

[0073] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0074] Those skilled in the art should understand that, in the disclosure of the present invention, the orientation or position relationship indicated by the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0075] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0076] Referring to the accompanying drawings of the present invention Figure 1 and Figure 2 As shown, a multi-layered microwave detection module according to an embodiment of the present invention is schematically shown, wherein the attached Figure 1 and attached Figure 2 The three-dimensional structure and the side cross-sectional structure of the multi-layer microwave detection module are respectively illustrated. The multi-layer microwave detection module comprises a radiation source 101, an antenna substrate 102, a reference ground 103, a circuit shielding ground 201, a circuit substrate 202, a circuit layer 203 and a curing sheet 300, wherein the radiation source 101 and the reference ground 103 are respectively arranged on the two sides of the antenna substrate 102, wherein the circuit shielding ground 201 and the circuit layer 203 are respectively arranged on the two sides of the circuit substrate 202, wherein the reference ground 103 and the circuit shielding ground 201 are fixed to the two sides of the curing sheet 300 at intervals, so as to form the multi-layer microwave detection module in which the radiation source 101, the antenna substrate 102, the reference ground 103, the curing sheet 300, the circuit shielding ground 201, the circuit substrate 202 and the circuit layer 203 are arranged in sequence.

[0077] Furthermore, the radiation source 101 and the reference ground 103 are respectively formed on the two copper-clad surfaces of a first double-sided copper-clad substrate 100, and the circuit shielding ground 201 and the circuit layer 203 are respectively formed on the two copper-clad surfaces of a second double-sided copper-clad substrate 200. By fixing the first double-sided copper-clad substrate 100 and the second double-sided copper-clad substrate 200 to the two sides of the curing sheet 300, the multi-layer microwave detection module can be easily prepared.

[0078] Specifically, by respectively bonding the reference ground 103 and the circuit shielding ground 201 to the two sides of a semi-cured sheet, and then converting the semi-cured sheet into the cured sheet 300 by pressing, and forming a state in which the reference ground 103 and the circuit shielding ground 201 are fixed at intervals on the two sides of the cured sheet 300, it is simple and easy, and a consistent and stable cured sheet 300 can be obtained to form a consistent and stable connection structure between the reference ground 103 and the circuit shielding ground 201.

[0079] Those skilled in the art should understand that, based on the fact that the first double-sided copper-clad substrate 100 and the second double-sided copper-clad substrate 200 having a double-sided copper-clad structure can be stably acquired in large quantities and over a large area, a radiation gap formed between the radiation source 101 and the reference ground 103 is filled by the antenna substrate 102 and has stable consistency, which is beneficial to the impedance matching of the microwave detection module of the multi-layer structure. At the same time, the first double-sided copper-clad substrate 100 and the second double-sided copper-clad substrate 200 have a consistent and stable structure, which is beneficial to obtaining a consistent and stable microwave detection module of the multi-layer structure.

[0080] Furthermore, the radiation source 101 is provided with a feeding point 1011, wherein the feeding point 1011 is offset from the physical center of the radiation source 101, wherein the radiation source 101 is conductively connected to the circuit layer 203 at the feeding point 1011 via a feeding line 400 penetrating the antenna substrate 102 and the circuit substrate 202, so that the radiation source 101 is fed at the feeding point 1011 via the feeding line 400 through the circuit layer 203.

[0081] In particular, the feed line 400 is configured to be a metallized through hole formed by a metallized via structure that penetrates the antenna substrate 102 and the circuit substrate 202, so as to facilitate obtaining a stable and consistent line connection between the circuit layer 203 and the radiation source 101 when the circuit layer 203 is integrated into the microwave detection module of the multi-layer structure.

[0082] It can be understood that the feed line 400 is isolated from the reference ground 103 and the circuit shielding ground 201. Specifically, before the first double-sided copper clad substrate 100 and the second double-sided copper clad substrate 200 are fixed to the curing sheet 300, the reference ground 103 and the circuit shielding ground 201 are respectively provided with isolation areas corresponding to the position of the feeding point 1011, so that when the feed line 400 is formed by penetrating the antenna substrate 102 and the circuit substrate 202 at the feeding point 1011 with a metallized via structure, the feed line 400 is isolated from the reference ground 103 and the circuit shielding ground 201.

[0083] Furthermore, the circuit shielding ground 201 is electrically connected to a grounding layer 2031 of the circuit layer 203 through at least one grounding line 500 penetrating the circuit substrate 202, wherein the grounding layer 2031 is the outer conductive layer of the circuit layer 203 and is electrically connected to the ground potential of the corresponding power supply line and grounded when the microwave detection module of the multi-layer structure is powered. Then, the circuit shielding ground 201, as a planar conductive structure connected to the grounding layer 2031 of the circuit layer 203, has a shielding effect on the circuit layer 203, that is, the interference of the circuit layer 203 to the reference ground 103 can be blocked and suppressed by the circuit shielding layer 201, which is beneficial to improving the stability of the microwave detection module of the multi-layer structure.

[0084] In particular, the grounding line 500 conductively extends to be conductively connected to the reference ground 103 and penetrates the antenna substrate 102, so as to form a state in which the reference ground 103 is grounded by being electrically connected to the circuit shielding ground 201 and the grounding layer 2031 through the grounding line 500 passing through the antenna substrate 102 and the circuit substrate 202. At the same time, the high-frequency electrical signal carried on the circuit layer 203 is shared by the circuit shielding ground 201 to the convergence of the grounding layer 2031 and is suppressed from affecting the potential distribution of the reference ground 103. That is, the interference of the circuit layer 203 to the reference ground 103 can be suppressed by the circuit shielding ground 201, which is beneficial to improving the stability and consistency of the microwave detection module with the multi-layer structure.

[0085] Specifically, the grounding circuit 500 is configured to form a metallized through hole that penetrates the antenna substrate 102 and the circuit substrate 202 after the reference ground 103 and the circuit shielding ground 201 are fixed at intervals on both sides of the curing sheet 300 with a metallized via structure, so as to facilitate obtaining a stable and consistent line connection between the circuit shielding ground 201, the reference ground 103 and the grounding layer 2031 of the circuit layer 203 when the circuit layer 203 is integrated into the microwave detection module of the multi-layer structure.

[0086] It can be understood that the circuit shielding ground 201 is electrically connected to the grounding layer 2031 of the circuit layer 203 through the grounding line 500, and the high-frequency electrical signal carried by the circuit layer 203 on the grounding layer 2031 can affect the potential distribution of the circuit shielding ground 201, wherein the reference ground 103 and the circuit shielding ground 201 are isolated by the curing sheet 300 and can avoid direct conduction in a surface contact manner, that is, the reference ground 103 and the circuit shielding ground 201 are avoided to be equivalent to the same conductive layer under the action of the high-frequency electrical signal. , the influence of the potential distribution of the circuit shielding ground 201 on the potential distribution of the reference ground 103 can be suppressed due to the isolation between the circuit shielding ground 201 and the reference ground 103, that is, the harmonic radiation of the microwave detection module of the multi-layer structure caused by the influence of the fluctuation of the potential distribution of the circuit shielding ground 201 on the potential distribution of the reference ground 103 can be suppressed, and the interference of the corresponding circuit layer 203 on the reference ground 103 can be blocked by the circuit shielding layer 201 and suppressed, which is beneficial to improving the stability and consistency of the microwave detection module of the multi-layer structure.

[0087] Furthermore, the circuit shielding ground 203 is electrically connected to the grounding layer 2031 at its periphery in a multi-point connection manner, wherein the periphery of the circuit shielding ground 201 is a projection area of ​​the grounding layer 2031 corresponding to the circuit layer 103 on the circuit shielding ground 201 in a direction perpendicular to the circuit shielding ground 201, so as to form a uniform equipotential body on the circuit shielding ground 201 when the circuit shielding ground 201 is connected to the grounding layer 2031 of the circuit layer 203, that is, the high-frequency electrical signal carried by the circuit layer 203 converges on the grounding layer 2031 and the potential difference generated in the circuit shielding ground 201 can be offset to form a uniform equipotential body on the circuit shielding ground 201, then the high-frequency electrical signal carried by the circuit layer 203 converges on the grounding layer 2031 and the influence on the potential distribution of the circuit shielding ground 201 can be suppressed and the potential distribution affecting the reference ground 103 is prevented from being affected. That is to say, the influence of the circuit layer 203 on the potential distribution of the circuit shielding ground 201 is suppressed and it is difficult to further affect the potential distribution of the reference ground 103, so that the reference ground 103 is electrically connected to the grounding layer 2031 of the circuit layer 203 and is grounded. At the same time, the interference of the circuit layer 203 to the reference ground 103 can be suppressed, and the corresponding harmonic radiation of the multi-layer structure microwave detection module can be suppressed.

[0088] Specifically, in this embodiment of the present invention, the circuit shielding ground 201 is electrically connected to the grounding layer 2031 of the circuit layer 203 in a multi-point connection manner through multiple connecting lines 600 passing through the circuit substrate 202, thereby forming a state in which the circuit shielding ground 201 is electrically connected to the grounding layer 2031 in a multi-point connection manner around its periphery, and forming a uniform equipotential body on the circuit shielding ground 201, so that the circuit layer 203 converges with the grounding layer 2031, and the influence on the potential distribution of the circuit shielding ground 201 can be suppressed, thereby preventing the potential distribution of the reference ground 103 from being affected.

[0089] In particular, the connecting line 600 is configured to be a metallized through hole formed by a metallized via structure that penetrates the circuit substrate 202, corresponding to a metallized blind hole formed on the circuit substrate 202 after the first double-sided copper clad substrate 100 and the second double-sided copper clad substrate 200 are fixed to the curing sheet 300, so as to facilitate obtaining a stable and consistent line connection between the grounding layer 2031 and the circuit shielding ground 201.

[0090] It is worth mentioning that the connecting line 600 formed by the metallized via structure and penetrating the circuit substrate 202 extends from the periphery of the circuit shielding ground 201 through the circuit substrate 202 to the grounding layer 2031 of the circuit layer 203, so as to form a surround for the circuit layer 203 at the side edge of the circuit substrate 202, which is beneficial to suppress the interference of the circuit layer 203 carrying high-frequency electrical signals to the outside world through the side edge of the circuit substrate 202, including interference with the reference ground 103 and the radiation source 101, which is beneficial to suppress the harmonic radiation of the microwave detection module of the multi-layer structure, and at the same time, it is beneficial to suppress the interference of external electromagnetic radiation to the circuit layer 203 through the side edge of the circuit substrate 202.

[0091] In particular, the wavelength parameter corresponding to the frequency of the microwave detection module of the multi-layer structure is assumed to be λ, wherein the distance between two adjacent connecting lines 600 is preferably set to be less than or equal to 1 / 8λ, so as to help improve the inhibitory effect of the connecting line 600 on the side edge of the circuit substrate 202 on the interference passing through the side edge of the circuit substrate 202, especially the interference of the circuit layer 203 on the reference ground 103 through the side edge of the circuit substrate 202, thereby helping to suppress the harmonic radiation of the microwave detection module of the multi-layer structure.

[0092] Further reference is made to the accompanying drawings of the present invention. Figure 3As shown, a circuit principle block diagram of the microwave detection module of the multi-layer structure according to the above embodiment of the present invention is schematically shown, wherein the circuit layer 203 has an oscillating circuit unit 2032 and a mixing detection unit 2033, wherein the oscillating circuit unit 2032 is configured to allow being powered and output an excitation current with a corresponding frequency, wherein the radiation source 101 is fed and connected to the oscillating circuit unit 2032 at the feeding point 1011 via the feeding line 400, wherein the circuit shielding ground 201 is electrically connected to the grounding layer 2031 of the circuit layer 203 via the grounding line 500 and the connecting line 600 and is grounded, wherein the reference ground 103 is connected to the grounding layer 2031 of the circuit layer 203 via the grounding line 500 and the connecting line 600, and The ground line 500 is electrically connected to the circuit shielding ground 201 and the grounding layer 2031 and is grounded, wherein the radiation source 101 has an initialized polarization direction under the excitation of the excitation current and emits electromagnetic waves of corresponding frequencies in response to the reference ground 103, and allows receiving corresponding reflected echoes, wherein the mixing detection unit 2033 is electrically coupled to the oscillation circuit unit 2032 and the radiation source 101 to output a difference signal corresponding to the difference in characteristic parameters between the excitation current and the corresponding reflected echo based on the principle of Doppler effect, then the difference signal corresponds to the movement of the object that reflects the electromagnetic waves emitted by the microwave detection module of the multi-layer structure to form the corresponding reflected echo.

[0093] It can be understood that, corresponding to the corresponding circuit design of the circuit layer 203, the microwave detection module of the multi-layer structure can be set to have both transmitting and receiving functions, or be independently used for transmitting or receiving in a microwave detection based on the Doppler effect principle in a separate transmitting and receiving manner, that is, corresponding to the function of the microwave detection module of the multi-layer structure, the circuit layer 203 has a corresponding circuit structure and is not limited to the circuit structure of the oscillation circuit unit 2032 and the mixing detection unit 2033 of this embodiment of the present invention, wherein the circuit design of the corresponding circuit layer 203 itself does not constitute a limitation on the structure and connection relationship between the circuit layer 203 of the present invention and the radiation source 101, the antenna substrate 102, the reference ground 103, the circuit shielding ground 201 and the circuit substrate 202.

[0094] Those skilled in the art should understand that, based on the existing structure, process and functional circuit modules, the double-sided copper clad substrate, the metallized via structure, the oscillation circuit unit 2032 and the mixing detection unit 2033 can be easily obtained or implemented, and thus the microwave detection module with a multi-layer structure is easy to implement based on the combination of the existing structure, process and functional circuit modules, and has a stable and consistent highly integrated structure, and excellent and stable anti-interference performance.

[0095] Further, referring to the accompanying drawings of the present invention, Figures 4 to 6 As shown, based on the idea of ​​grounding the radiation source 101 to reduce the impedance of the multi-layer microwave detection module, the multi-layer microwave detection module according to a variant embodiment of the above embodiment of the present invention is schematically shown, wherein Figures 4 to 6 The three-dimensional structure, the side view cross-sectional structure and the circuit principle block diagram of the microwave detection module of the multi-layer structure are respectively illustrated. In this variant embodiment of the present invention, based on the idea of ​​grounding the radiation source 101 to reduce the impedance of the microwave detection module of the multi-layer structure, the radiation source 101 is provided with a grounding point 1012, wherein the radiation source 101 is grounded at the grounding point 1012 to reduce the impedance of the microwave detection module of the multi-layer structure, thereby improving the quality factor (i.e., Q value) of the microwave detection module of the multi-layer structure and enhancing the anti-interference performance of the microwave detection module of the multi-layer structure.

[0096] Specifically, the radiation source 101 is grounded at the grounding point 1012 by being conductively connected to the reference ground 103 via an impedance line 700 penetrating the antenna substrate 102, so as to facilitate the integration of the corresponding line connection with the highly integrated multi-layer structure microwave detection module.

[0097] Furthermore, the impedance line 700 is configured as a metallized through hole that penetrates the antenna substrate 102 and is formed in the first double-sided copper clad substrate 100 with a metallized via structure, corresponding to a metallized blind hole formed in the antenna substrate 102 after the reference ground 103 and the circuit shielding ground 201 are fixed at intervals on both sides of the curing sheet 300, so as to facilitate obtaining a stable and consistent line connection when the corresponding circuit is integrated into the microwave detection module of the multi-layer structure.

[0098] Preferably, the grounding point 1012 is arranged at the physical center point of the radiation source 101 to reduce the impedance of the microwave detection module of the multi-layer structure while reducing the influence of the grounding structure of the radiation source 101 on the gain of the microwave detection module of the multi-layer structure.

[0099] Furthermore, in this variant embodiment of the present invention, the microwave detection module of the multi-layer structure also includes a shielding cover 800, wherein the shielding cover 800 is on the side of the circuit substrate 202 where the circuit layer 203 is provided. Specifically, the shielding cover 800 is fixed to the circuit substrate 202 at the side of the circuit substrate 202 where the circuit layer 203 is provided in a state of being conductively connected to the grounding layer 2031. Then, the shielding cover 800, the connecting line 600 and the circuit shielding ground 201 form an electromagnetic shielding space for the circuit layer 203, so as to suppress the interference of the circuit layer 203 carrying high-frequency electrical signals to the outside world, and the interference of external electromagnetic radiation to the circuit layer 203, thereby improving the anti-interference performance of the microwave detection module of the multi-layer structure.

[0100] Those skilled in the art should understand that in the description of the above embodiments, based on the existing structure and process and functional circuit modules, the double-sided copper-clad substrate, the metallized via structure, the oscillation circuit unit 2032 and the mixer detection unit 2033 can be easily obtained or implemented, so the microwave detection module with a multi-layer structure is easy to implement based on the combination of the existing structure and process and functional circuit modules. To further disclose the present invention, the present invention also provides a method for manufacturing a microwave detection module with a multi-layer structure, wherein the method for manufacturing a microwave detection module with a multi-layer structure comprises the following steps:

[0101] A. One of the copper clad layers of the first double-sided copper clad substrate 100 is etched with a corresponding shape and size to form the radiation source 101, and the other copper clad layer of the first double-sided copper clad substrate 100 corresponds to the reference ground 103;

[0102] B. One of the copper clad layers of the second double-sided copper clad substrate 200 is etched with a corresponding shape and size to form the circuit layer 203, and the other copper clad layer of the second double-sided copper clad substrate 200 corresponds to the circuit shielding ground 201;

[0103] C. Fixing the reference ground 103 and the circuit shielding ground 201 to two sides of the curing sheet 300 to form a structural state in which the radiation source 101, the reference ground 103, the circuit shielding ground 201 and the circuit layer 203 are sequentially arranged;

[0104] D. electrically connecting the radiation source 101 to the circuit layer 203 at the feeding point 1011 of the radiation source 101 via the feeding line 400; and

[0105] E. At least one grounding line 500 penetrating the antenna substrate 102 and the circuit board is used to electrically connect the reference ground 103 , the circuit shielding ground 201 , and the grounding layer 2031 of the circuit layer 203 .

[0106] It can be understood that the step (D) and the step (E) are after the step (C) without limiting the order between the step (D) and the step (E), wherein the order of the step (A) and the step (B) in the manufacturing method of the multi-layer microwave detection module is not limited, and is preferably before the step (C).

[0107] In particular, the method for manufacturing the microwave detection module of the multilayer structure further comprises the following steps before the step (C):

[0108] F. Electrically connecting the circuit shielding ground 201 of the second double-sided copper clad substrate 200 to the ground layer 2031 of the circuit layer 203 through the plurality of connecting circuits 600 on the second double-sided copper clad substrate 200 .

[0109] In some embodiments of the present invention, the method for manufacturing the microwave detection module of the multi-layer structure further comprises the following steps before the step (C):

[0110] G. The radiation source 101 and the reference ground 103 are electrically connected via the impedance line 700 penetrating the antenna substrate 102 .

[0111] In some embodiments of the present invention, the method for manufacturing the microwave detection module of the multi-layer structure further comprises the following steps after step (C):

[0112] H. Fixing the shielding cover 800 to the circuit substrate 202 by conductively connecting the cover edge of the shielding cover 800 to the ground layer 2031 on the side of the circuit substrate 202 where the circuit layer 203 is disposed.

[0113] Those skilled in the art will appreciate that the above embodiments are merely examples, wherein features of different embodiments may be combined with each other to obtain implementation methods that are easily conceivable based on the contents disclosed in the present invention but are not explicitly indicated in the drawings.

[0114] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A multi-layer microwave detection module, characterized in that: include: A first double-sided copper-clad substrate, wherein the first double-sided copper-clad substrate comprises a radiation source, an antenna substrate and a reference ground, wherein the radiation source and the reference ground are respectively arranged on two sides of the antenna substrate, wherein the radiation source has a feeding point, wherein the feeding point deviates from the physical center of the radiation source; a second double-sided copper-clad substrate, wherein the second double-sided copper-clad substrate comprises a circuit shielding ground, a circuit substrate and a circuit layer, wherein the circuit shielding ground and the circuit layer are respectively arranged on two sides of the circuit substrate, wherein the circuit layer comprises a grounding layer arranged around the circuit substrate, wherein the grounding layer is suitable for being electrically connected to the ground potential of the corresponding power supply line and being grounded when the microwave detection module of the multi-layer structure is powered; A curing sheet, wherein the reference ground and the circuit shielding ground are fixed to two sides of the curing sheet at intervals to form a structural state in which the radiation source, the antenna substrate, the reference ground, the curing sheet, the circuit shielding ground, the circuit substrate and the circuit layer are arranged in sequence; a feeder circuit, wherein the feeder circuit is arranged through the antenna substrate and the circuit substrate and is isolated from the reference ground and the circuit shielding ground, wherein the radiation originates from the feeder point and is electrically connected to the circuit layer via the feeder circuit; At least one grounding circuit, wherein the grounding circuit passes through the antenna substrate and the circuit substrate and is electrically connected to the reference ground, the circuit shielding ground and the grounding layer.

2. The multi-layer microwave detection module according to claim 1, wherein the multi-layer microwave detection module further comprises a plurality of connecting lines, wherein the connecting lines pass through the circuit substrate and are electrically connected to the circuit shielding ground and the ground layer.

3. The microwave detection module of the multi-layer structure according to claim 2, wherein the connecting line is configured as a metallized blind hole formed by a metallized via structure, penetrating the circuit substrate and electrically connecting the circuit shielding ground and the ground layer.

4. The microwave detection module of the multi-layer structure according to claim 3, wherein the microwave detection module of the multi-layer structure further comprises a shielding cover, wherein the cover edge of the shielding cover is fixed to the circuit substrate in a state of being conductively connected to the ground layer on a side of the circuit substrate where the circuit layer is provided.

5. The microwave detection module of the multi-layer structure according to claim 4, wherein the wavelength parameter corresponding to the frequency of the microwave detection module of the multi-layer structure is set to λ, and the distance between two adjacent connecting lines is set to be less than or equal to λ / 8.

6. The microwave detection module of the multi-layer structure according to claim 1, wherein the reference ground and the circuit shielding ground are provided with an isolation area at the position corresponding to the feeding point, wherein the feeding line passes through the isolation area and is isolated from the reference ground and the circuit shielding ground. 7 . The microwave detection module of the multi-layer structure according to claim 6 , wherein the feeding line is configured as a metallized through hole formed with a metallized via structure and penetrating through the antenna substrate and the circuit substrate. 8 . The microwave detection module of the multi-layer structure according to claim 1 , wherein the grounding line is configured as a metallized through hole formed with a metallized via structure and penetrating the antenna substrate and the circuit substrate. 9 . The microwave detection module of the multi-layer structure according to claim 1 , wherein the radiation source is electrically connected to the ground layer of the circuit layer.

10. A multi-layer microwave detection module according to claim 9, wherein the multi-layer microwave detection module further comprises an impedance line, wherein the impedance line passes through the antenna substrate, wherein the radiation source is electrically connected to the reference ground via the impedance line and is electrically connected to the ground layer of the circuit layer. 11 . The microwave detection module of the multi-layer structure according to claim 10 , wherein the impedance line is configured as a metallized blind hole formed by a metallized via structure and penetrating the antenna substrate.

12. The multi-layer microwave detection module according to claim 11, wherein the radiation source has a grounding point, wherein the grounding point is located at the physical center of the radiation source, and wherein the radiation source is electrically connected to the reference ground via the impedance line from the grounding point.

13. A method for manufacturing a multi-layer microwave detection module, characterized in that: The steps include: A. A radiation source is formed by etching one of the copper-clad layers of a first double-sided copper-clad substrate in a corresponding shape and size, and the other copper-clad layer of the first double-sided copper-clad substrate corresponds to a reference ground, and an antenna substrate corresponds to the area between the radiation source and the reference ground; B. Etching one of the copper-clad layers of a second double-sided copper-clad substrate in a corresponding shape and size to form a circuit layer having a ground layer, then the other copper-clad layer of the second double-sided copper-clad substrate corresponds to a circuit shielding ground, and the space between the circuit shielding ground and the circuit layer corresponds to a circuit substrate; C. Fixing the reference ground and the circuit shielding ground on two sides of a solid sheet to form a structural state in which the radiation source, the antenna substrate, the reference ground, the solid sheet, the circuit shielding ground, the circuit substrate and the circuit layer are arranged in sequence; D. electrically connecting the radiation source to the circuit layer at a feeding point of the radiation source by a feeding line penetrating the antenna substrate and the circuit substrate; and E. Electrically connecting the reference ground, the circuit shielding ground and the ground layer of the circuit layer through at least one ground line penetrating the antenna substrate and the circuit substrate.

14. The method for manufacturing a multi-layer microwave detection module according to claim 13, further comprising the step of: F. Using a plurality of connection lines to penetrate the circuit substrate to electrically connect the circuit shielding ground and the grounding layer of the circuit layer.

15. The method for manufacturing a multi-layer microwave detection module according to claim 14, wherein in the step (F), a metallized via process is used to form the connection line that penetrates the circuit substrate and electrically connects the circuit shielding ground and the ground layer.

16. The method for manufacturing a multi-layer microwave detection module according to claim 15, wherein according to the step (F), the wavelength parameter corresponding to the frequency of the multi-layer microwave detection module is set to λ, wherein the distance between two adjacent connecting lines is set to be less than or equal to λ / 8.

17. The method for manufacturing a multi-layer microwave detection module according to claim 13, further comprising the step of: G. Penetrating the antenna substrate with an impedance line to electrically connect the radiation source and the reference ground.

18. The method for manufacturing a multi-layer microwave detection module according to claim 17, wherein in the step (G), the impedance line that penetrates the antenna substrate and electrically connects the radiation source and the reference ground is formed by a metallized via process.

19. The method for manufacturing a multi-layer microwave detection module according to claim 18, wherein in the step (G), the impedance line that passes through the antenna substrate and electrically connects the radiation source and the reference ground is formed at the physical center of the radiation source by a metallized via process.

20. The method for manufacturing a multi-layer microwave detection module according to claim 13, further comprising the step of: H. Fixing the shielding cover to the circuit substrate by conductively connecting the cover edge of a shielding cover to the ground layer on the side of the circuit substrate where the circuit layer is provided.

21. The method for manufacturing a multi-layer microwave detection module according to claim 13, wherein according to the step (C), the reference ground and the circuit shielding ground are respectively bonded to the two sides of a semi-cured sheet, and then the semi-cured sheet is converted into the cured sheet by pressing and the reference ground and the circuit shielding ground are fixed on the two sides of the cured sheet at intervals.

22. The method for manufacturing a multi-layer microwave detection module according to any one of claims 13 to 21, wherein according to the step (D), the feeding point is offset from the physical center of the radiation source.

23. The method for manufacturing a multi-layer microwave detection module according to claim 22, wherein in the step (D), the feed line penetrating the antenna substrate and the circuit substrate is formed by a metallized via process.

24. The method for manufacturing a multi-layer microwave detection module according to claim 23, wherein in the step (E), the grounding line penetrating the antenna substrate and the circuit substrate is formed by a metallized via process.

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