Narrow-package fingerprint module and fingerprint recognition mobile terminal

Abstract

The present application provides a narrow package fingerprint module and a fingerprint recognition mobile terminal, which relate to the field of fingerprint module technology. The narrow package fingerprint module includes a packaging unit and a circuit substrate. The packaging unit is provided with a single row of pads, and the pads are connected to the circuit substrate; a sealant is provided on the side of the packaging unit close to the circuit substrate, and the sealant is provided along the periphery of the circuit substrate. By only providing one row of pads at the bottom of the packaging unit, the width occupied by the pads is reduced, so that the area where the sealant is provided on the periphery of the circuit substrate is larger, which is conducive to improving the sealing effect.

Description

Technical Field

[0001] The present invention relates to the technical field of fingerprint modules, and in particular to a narrow package fingerprint module and a fingerprint recognition mobile terminal. Background Art

[0002] In the existing fingerprint module, the chip is fixed on the circuit board by conductive material, and the periphery of the circuit board needs to be sealed with glue to protect the conductive material between the chip and the circuit board.

[0003] However, in a narrow package module, the width of the circuit board is only slightly narrower than the width of the chip. As a result, the area on the periphery of the circuit board that can be glued is very narrow, making it difficult to achieve reliable sealing. Summary of the invention

[0004] The objectives of the present invention include, for example, providing a narrow package fingerprint module and a fingerprint recognition mobile terminal, which are suitable for a narrower package unit and can improve the sealing between the circuit substrate and the package unit.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] In a first aspect, a narrow package fingerprint module provided in this embodiment includes a package unit and a circuit substrate, wherein the package unit is provided with a plurality of pads, the plurality of pads are arranged in a single row along the length direction of the package unit, and the pads are connected to the circuit substrate;

[0007] A sealant is provided on one side of the packaging unit close to the circuit substrate, and the sealant is provided along the periphery of the circuit substrate.

[0008] In an optional embodiment, the packaging unit includes a fingerprint chip, the fingerprint chip includes a first surface connected to the circuit substrate, the first surface includes a first area and a second area, and the second area is located outside the first area;

[0009] The pad is disposed in the first region, and the circuit substrate is disposed opposite to the first region; the sealant is disposed in the second region to wrap the periphery of the circuit substrate.

[0010] In an optional embodiment, the sealant is in the form of a U-shaped ring disposed on the outer periphery of the circuit substrate, and the U-shaped opening serves as a wire outlet of the circuit substrate.

[0011] In an optional embodiment, a power line is provided on the circuit substrate, the pads include a first power pad closest to the outlet, the power line is connected to the first power pad, and the power line is led out from the first power pad and extends out of the outlet.

[0012] In an optional embodiment, the pads further include a plurality of signal pads spaced apart from the first power pad, a plurality of signal lines are provided on the circuit substrate, and each of the signal lines is connected to one of the signal pads.

[0013] In an optional embodiment, the signal line includes a first signal line, and the first signal line is arranged on a side of the circuit substrate close to the pad and close to two side edges of the circuit substrate.

[0014] In an optional embodiment, the signal line includes a second signal line, and the second signal line is arranged on a side of the circuit substrate away from the pad.

[0015] In an optional implementation, a via hole is provided on the circuit substrate, and the second signal line is connected to the signal pad through the via hole.

[0016] In an optional implementation, an outer diameter of the power line is greater than an outer diameter of the signal line.

[0017] In a second aspect, this embodiment provides a fingerprint recognition mobile terminal, comprising a device housing, a main circuit board and a narrow package fingerprint module according to any one of the aforementioned embodiments, wherein the main circuit board is arranged in the device housing, and the circuit substrate is electrically connected to the main circuit board.

[0018] The narrow package fingerprint module and fingerprint recognition mobile terminal provided by the embodiments of the present invention have beneficial effects including, for example:

[0019] The narrow package fingerprint module provided by the present invention has a single row of pads on one side of the packaging unit close to the circuit substrate, and the pads are connected to the circuit substrate. Since the pads are only arranged in a single row, the width occupied by the pads on the packaging unit is narrower, and accordingly, the width of the circuit substrate for accommodating the pads is also reduced, which is suitable for extremely narrow packaging units. In addition, after the width occupied by the single row of pads is reduced relative to the width occupied by the multiple rows of pads, the glue-cutting area at the bottom of the packaging unit for sealing the circuit substrate becomes relatively wider, and the effective glue-cutting area is larger, which is conducive to improving the sealing of the circuit substrate and the packaging unit and enhancing the sealing effect.

[0020] The fingerprint recognition mobile terminal provided by the present invention includes the above-mentioned narrow package fingerprint module, which is conducive to improving the sealing performance of the extremely narrow package unit, has a small volume, occupies less space, and has good sealing performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 A schematic diagram of a glue stripping method for a fingerprint module in the prior art;

[0023] Figure 2 It is a schematic diagram of another glue stripping method of the fingerprint module in the prior art;

[0024] Figure 3 A simplified schematic diagram of the overall structure of a narrow package fingerprint module provided by an embodiment of the present invention;

[0025] Figure 4 A schematic diagram of the planar structure of a narrow package fingerprint module provided by an embodiment of the present invention;

[0026] Figure 5 A schematic diagram of a first type of outlet structure of a power line of a pad of a narrow package fingerprint module provided by an embodiment of the present invention;

[0027] Figure 6 A schematic diagram of a second outlet structure of a power line of a pad of a narrow package fingerprint module provided in an embodiment of the present invention;

[0028] Figure 7 A schematic diagram of a third type of outlet structure of a power line of a pad of a narrow package fingerprint module provided by an embodiment of the present invention;

[0029] Figure 8 A schematic diagram of a fourth type of outlet structure of a power line of a pad of a narrow package fingerprint module provided by an embodiment of the present invention;

[0030] Fig. 9 A schematic diagram of a fifth outlet structure of a power line of a pad of a narrow package fingerprint module provided by an embodiment of the present invention;

[0031] Fig.10 A schematic diagram of the output structure of the first signal line of the pad of the narrow package fingerprint module provided by an embodiment of the present invention;

[0032] Fig.11 A schematic diagram of the output structure of the second signal line of the pad of the narrow package fingerprint module provided by an embodiment of the present invention.

[0033] Icons: 10-fingerprint chip; 11-double-row pads; 20-circuit board; 30-glue; 100-narrow package fingerprint module; 101-packaging unit; 110-fingerprint chip; 111-pads; 120-circuit substrate; 130-conductive material; 140-sealant; 150-chip protection layer; 103-line outlet; 201-first power pad; 202-second power pad; 203-third power pad; 210-power line; 220-first signal line; 230-second signal line; 121-via. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0037] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0038] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0039] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0040] Figure 1 A schematic diagram of a glue stripping method for a fingerprint module in the prior art. Figure 2This is a schematic diagram of another method of stripping the fingerprint module in the prior art. Please refer to Figure 1 and Figure 2 The inventors found that the fingerprint chip 10 in the current narrow package module mostly adopts a double-row pad 11 design, and the circuit board 20 also needs a corresponding space to accommodate the double-row pad 11. In this way, the width d1 of the circuit board 20 is only slightly narrower than the width d2 of the fingerprint chip 10, resulting in a relatively narrow edge of the fingerprint chip 10 that can be glued and sealed. The glue 30 used for glue sealing is used to isolate and protect the pads between the circuit board 20 and the fingerprint chip 10. It should be noted that the glue-scratchable edge here refers to the area on the fingerprint chip 10 other than the positive projection area of ​​the circuit board 20 on the fingerprint chip 10.

[0041] In actual production, in order to seal the edge of the fingerprint chip 10 with glue, the double-row pads 11 are usually arranged to one side of the fingerprint chip 10, so that a relatively wide edge space is left on the other side of the fingerprint chip 10 for sealing with glue. However, in this case, only one side of the fingerprint chip 10 can be sealed with glue in a straight line, such as Figure 1 As shown; or L-shaped glue, such as Figure 2 As shown. The sealing of the unsealed part of the circumference can only rely on the fluidity of the glue 30 itself to fill and seal the pad. Since the sealing area of ​​the glue on one side is small and the remaining unsealed area is large, it is difficult to ensure the reliable sealing of the circumference of the circuit board 20 by relying solely on the fluidity of the glue 30, which has a great impact on the sealing protection performance of the pad, and there is a risk of unreliable sealing in actual production.

[0042] In order to overcome the defects in the prior art, this embodiment provides a narrow package fingerprint module 100, which can increase the glue scribing area around the circuit substrate 120, improve the sealing performance around the circuit substrate 120, and achieve reliable sealing of the pad 111.

[0043] Figure 3 A simplified schematic diagram of the overall structure of the narrow package fingerprint module 100 provided in an embodiment of the present invention, Figure 4 For a schematic diagram of the planar structure of the narrow package fingerprint module 100 provided in an embodiment of the present invention, please refer to Figure 3 and Figure 4 .

[0044] This embodiment provides a narrow package fingerprint module 100, including a packaging unit 101 and a circuit substrate 120, wherein the packaging unit 101 is fixed on the circuit substrate 120 by a conductive material 130. Optionally, the packaging unit 101 is provided with a plurality of pads 111, and the plurality of pads 111 are arranged in a single row along the length direction of the packaging unit 101, and the pads 111 are connected to the circuit substrate 120. A sealant 140 is provided on one side of the packaging unit 101 close to the circuit substrate 120, and the sealant 140 is arranged along the periphery of the circuit substrate 120, for isolating and sealing the pads 111 between the circuit substrate 120 and the packaging unit 101. Since a single row of pads 111 is provided at the bottom of the packaging unit 101, the width space occupied by the pads 111 is greatly reduced, and the circuit substrate 120 only needs to accommodate the width of the single row of pads 111. The width D of the circuit substrate 120 is also reduced accordingly. In this way, there is sufficient edge space around the circuit substrate 120 and the bottom of the packaging unit 101 for glue sealing, thereby providing better sealing protection for the circuit substrate 120 and the pads 111 between the circuit substrate 120 and the packaging unit 101.

[0045] Optionally, the packaging unit 101 includes a fingerprint chip 110 and a chip protection layer 150, and the chip protection layer 150 covers the side surface of the fingerprint chip 110 away from the circuit substrate 120 to protect the fingerprint chip 110. The fingerprint chip 110 includes a first surface connected to the circuit substrate 120, and the first surface includes a first area and a second area, and the second area is located at the periphery of the first area. A single row of pads 111 is provided in the first area, and the circuit substrate 120 is arranged opposite to the first area; a sealant 140 is provided in the second area to wrap the periphery of the circuit substrate 120. Due to the use of a single row of pads 111, there is enough space on both sides of the fingerprint chip 110 for glue sealing, and the glue sealing area is increased. Furthermore, the sealant 140 is in a U-shaped ring and is arranged on the periphery of the circuit substrate 120. The U-shaped opening serves as the wire outlet 103 of the circuit substrate 120. That is, U-shaped glue can be used on the fingerprint chip 110. Only a very small area of ​​the wire outlet 103 needs to rely on the fluidity of the glue itself to achieve sealing. The sealing performance is enhanced, which greatly reduces the risk in the actual production process and improves product quality.

[0046] It should be noted that the circuit substrate 120 includes but is not limited to a flexible circuit board, a hard board and a hard-soft board. The fingerprint chip 110 may also use a photosensitive chip or other chips in other embodiments to adapt to the functions of other application scenarios, which is not specifically limited here. In this embodiment, a flexible circuit board and a fingerprint chip 110 are used as examples for explanation. A single row of pads 111 is provided on the fingerprint chip 110, and solder joints corresponding to the single row of pads 111 are also provided on the circuit substrate 120. The pads 111 and the solder joints are electrically connected by welding conductive material 130. The sealant 140 arranged on the periphery of the circuit substrate 120 seals and isolates the circuits, solder joints on the circuit substrate 120, the pads 111 on the fingerprint chip 110, and the conductive material 130 between the pads 111 and the solder joints to ensure reliable electrical connection between the circuit substrate 120 and the fingerprint chip 110. The fingerprint chip 110 is arranged with a single row of pads 111, so that there is enough space for glue cutting on the periphery of the circuit substrate and the edge of the fingerprint chip 110, and the glue cutting area of ​​the sealant 140 is larger, the sealing is more reliable, and the sealing performance is better.

[0047] It should be noted that the packaging unit 101 can be a land grid array package (LGA for short), and the pads 111 of the LGA are welded to the circuit substrate 120. The packaging unit 101 can be, for example, a land grid array package, but it is not limited thereto, and can also be a packaging unit 101 of another chip packaging structure, such as a ball grid array package. Since the narrow package fingerprint module 100 adopts an extremely narrow packaging unit 101, the fingerprint chip 110 adopts a single-row pad 111 design, that is, the width of the fingerprint chip 110 and the width of the circuit substrate 120 are both very narrow. In the case of extremely limited width space, it is necessary to ensure that the power lines 210 and signal lines of all pads 111 can be normally connected. This embodiment also provides a single-row pad 111 connection method, which makes full use of the extremely narrow width to ensure that the power lines 210 and signal lines of all pads 111 can be normally connected.

[0048] Furthermore, a power line 210 is provided on the circuit substrate 120, and the pads 111 include a first power pad 201 closest to the outlet 103, the power line 210 is connected to the first power pad 201, and the power line 210 is led out from the first power pad 201 and extends out of the outlet 103. In order to lead out the line on the circuit substrate 120 with an extremely narrow width and reduce the lead-out area occupied by the power line 210, the present embodiment defines the pad 111 closest to the outlet 103 as the first power pad 201, which can save the space occupied by the power line 210, such as Figure 5 shown.

[0049] Optionally, if the single-row pad 111 includes more than one power pad, that is, it also includes a second power pad 202, then the second power pad 202 needs to be defined as a pad 111 disposed adjacent to the first power pad 201. If the voltages of the first power pad 201 and the second power pad 202 are the same, that is, the first power pad 201 and the second power pad 202 are shared, then the second power pad 202 is connected to the first power pad 201, and the first power pad 201 and the second power pad 202 share the same power line 210, and the power line 210 extends from the line outlet 103, as shown in FIG. Figure 6 shown.

[0050] If the voltages of the first power pad 201 and the second power pad 202 are different, that is, the first power pad 201 and the second power pad 202 cannot be shared. At this time, the power line 210 is led out from the first power pad 201 and extends out of the line outlet 103, the first power pad 201 and the second power pad 202 are not connected, and the second power pad 202 does not need to lead out other power lines 210, such as Figure 7 shown.

[0051] Optionally, the single-row pad 111 also includes a third power pad 203, and the third power pad 203 needs to be defined as a pad 111 disposed adjacent to the second power pad 202. If the voltages of the first power pad 201, the second power pad 202, and the third power pad 203 are the same, that is, the first power pad 201, the second power pad 202, and the third power pad 203 can share the same power line 210. At this time, the outlet mode of the power line 210 is: the first power pad 201, the second power pad 202, and the third power pad 203 are connected in sequence, and the power line 210 is led out from the first power pad 201 and extends out from the outlet 103, such as Figure 8 shown.

[0052] If the voltage of the second power pad 202 and the third power pad 203 is the same, but different from the voltage of the first power pad 201, the first power pad 201, the second power pad 202 and the third power pad 203 cannot share the same power line 210. The power line 210 is led out from the first power pad 201 and extends out from the outlet 103, and the second power pad 202 is connected to the third power pad 203, but the second power pad 202 and the third power pad 203 do not lead out other power lines 210, such as Fig. 9 shown.

[0053] Similarly, if the single-row pad 111 includes multiple power pads, the multiple power pads need to be arranged in sequence adjacent to the outlet 103. If the voltages of the multiple power pads are the same, the multiple power pads can be connected in sequence to share the same power line 210, which is drawn from the first power pad 201 and extends from the outlet 103. If the voltages of the multiple power pads are not equal, the power line 210 cannot be shared, and the power line 210 is only drawn from the first power pad 201 and extends from the outlet 103, and the remaining power pads do not need to draw additional power lines 210. This arrangement can ensure that the power line 210 is normally output and occupies less space to adapt to the extremely narrow packaging unit 101.

[0054] The pads 111 also include a plurality of signal pads spaced apart from the first power pad 201. Since the power pad needs to be disposed adjacent to the outlet 103, the pads 111 other than the power pad are signal pads. A plurality of signal lines are disposed on the circuit substrate 120, and each signal line is connected to a signal pad. The outer diameter of the power line 210 is greater than the outer diameter of the signal line, that is, the power line 210 is the thickest connecting line, and the power line 210 is led out from the first power pad 201 adjacent to the outlet 103.

[0055] Combination Fig.10 and Fig.11 The signal line includes a first signal line 220 and a second signal line 230. The first signal line 220 is arranged on a side of the circuit substrate 120 close to the pad 111 and close to the two side edges of the circuit substrate 120. The second signal line 230 is arranged on a side of the circuit substrate 120 away from the pad 111. Furthermore, a via 121 is arranged on the circuit substrate 120, and the second signal line 230 is connected to the signal pad through the via 121.

[0056] It is easy to understand that when the number of signal pads is small, that is, the number of signal lines is small, only the first signal line 220 or only the second signal line 230 may be included. In this embodiment, the first signal line 220 and the second signal line 230 are included as an example for description.

[0057] From the pad 111 adjacent to the outlet 103 to the direction away from the outlet 103, the pads 111 are marked as the first pad 111, the second pad 111, the third pad 111, the fourth pad 111, ..., the eleventh pad 111, and the twelfth pad 111, respectively; wherein the first pad 111, the second pad 111, and the third pad 111 are power pads 111 of the common power line 210. The fourth pad 111, the fifth pad 111, ..., and the eleventh pad 111 are signal pads 111. There are four first signal lines 220, which are connected to the fourth pad 111, the fifth pad 111, the sixth pad 111 and the seventh pad 111 respectively; there are five second signal lines 230, which are connected to the eighth pad 111, the ninth pad 111, the tenth pad 111, the eleventh pad 111 and the twelfth pad 111 respectively, and there are five vias 121. Among them, the seventh pad 111 and the twelfth pad 111 are connected to the ground wire respectively. Of course, it is not limited to this. The number of vias 121 and the number of signal lines are determined according to the actual number of signal pads. When the number of signal pads is relatively large, multiple signal pads can also share one signal line, which is not specifically limited here.

[0058] Optionally, the first signal line 220 is routed along the edges of both sides of the circuit substrate 120, and the orthographic projection of the second signal line 230 on the surface of the circuit substrate 120 on the side close to the pad 111 does not overlap with the first signal line 220. It is easy to understand that when the width of the packaging unit 101 and the width of the circuit substrate 120 are both very small, in order to reduce the line outlet space, only two first signal lines 220 are arranged on the side of the circuit substrate 120 close to the packaging unit 101, and the two signal lines are routed along the left and right sides of the circuit substrate 120 respectively, and the remaining signal pads are connected to the second signal line 230, and the second signal line 230 is routed from the side of the circuit substrate 120 away from the packaging unit 101 through the via 121, so that the routing space of the signal line can be smaller.

[0059] The wiring method of the power line 210 and the signal line provided in this embodiment is suitable for the case where the width of the packaging unit 101 and the width of the circuit substrate 120 are both very narrow, or the case where the width of the packaging unit 101 and the width of the circuit substrate 120 are approximately 1:1. It can ensure that all signal lines of the LGA are normally wired out and meet the manufacturing and electrical performance requirements.

[0060] This embodiment provides a fingerprint recognition mobile terminal, including a device housing, a main circuit board and the aforementioned narrow package fingerprint module 100, the main circuit board is arranged in the device housing, and the circuit substrate 120 is electrically connected to the main circuit board. The fingerprint recognition mobile terminal includes but is not limited to a mobile phone, a tablet computer, a laptop computer, a PDA or other electronic terminal device with a fingerprint recognition function, which is not specifically limited here.

[0061] In summary, the embodiment of the present invention provides a narrow package fingerprint module 100 and a fingerprint recognition mobile terminal, which have the following beneficial effects:

[0062] The narrow package fingerprint module 100 provided by the embodiment of the present invention reduces the width space occupied by the pads 111 on the package unit 101 by setting a single row of pads 111 at the bottom of the package unit 101, thereby providing the package unit 101 with sufficient edge space for glue sealing, and can realize glue sealing on both sides of the package unit 101, that is, the sealant 140 is set in a U shape and wrapped around the periphery of the circuit substrate 120 to seal the circuit, solder joints, pads 111 of the package unit 101, and the conductive material 130 between the pads 111 and the solder joints on the circuit substrate 120. Only a very small area of ​​the outlet 103 on the circuit substrate 120 needs to rely on the fluidity of the sealant 140 itself to achieve sealing, which reduces the risk of the manufacturing process, is conducive to enhancing the sealing reliability of the product, and improves the product yield.

[0063] Secondly, this embodiment proposes a power line 210 and signal line outlet method suitable for the narrow package fingerprint module 100, with the pad 111 closest to the outlet port 103 as the first power pad 201, and the power line 210 is led out from the first power pad 201, and the remaining power pads that can be shared with the first power pad 201 are connected in pairs in sequence and connected in sequence with the first power pad 201, sharing a power line 210; the signal line includes a first signal line 220 and a second signal line 230, the first signal line 220 is routed along the left and right edges of the side of the circuit substrate 120 close to the packaging unit 101, and the second signal line 230 is routed from the side of the circuit substrate 120 away from the packaging unit 101 through the via 121, thereby reducing the outlet space of the power line 210 and the signal line, which can not only ensure that all signal lines of the LGA are well outlet, but also meet the manufacturing and electrical performance requirements.

[0064] The fingerprint module mobile terminal provided in this embodiment adopts the above-mentioned narrow package fingerprint module 100, and has good sealing performance. At the same time, when the width of the packaging unit 101 and the width of the circuit substrate 120 are very narrow, the outlet space of the power line 210 and the signal line can be reduced as much as possible, which can not only ensure that all signal lines of the LGA are well outlet, but also meet the manufacturing and electrical performance requirements, and has great promotion and application value and market competitive advantages.

[0065] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A narrow package fingerprint module, characterized in that: It comprises a packaging unit and a circuit substrate, wherein the packaging unit is provided with a plurality of pads, the plurality of pads are arranged in a single row along the length direction of the packaging unit, and the pads are connected to the circuit substrate; A sealant is provided on one side of the packaging unit close to the circuit substrate, and the sealant is provided along the periphery of the circuit substrate; The packaging unit comprises a fingerprint chip and a protection layer, wherein the chip protection layer covers a surface of the fingerprint chip on a side away from the circuit substrate.

2. The narrow package fingerprint module according to claim 1, characterized in that: The fingerprint chip includes a first surface connected to the circuit substrate, the first surface includes a first area and a second area, and the second area is located outside the first area; The pad is disposed in the first region, and the circuit substrate is disposed opposite to the first region; the sealant is disposed in the second region to wrap the periphery of the circuit substrate.

3. The narrow package fingerprint module according to claim 1 or 2, characterized in that: The sealant is in the form of a U-shaped ring and is arranged on the outer periphery of the circuit substrate, and the U-shaped opening serves as a wire outlet of the circuit substrate.

4. The narrow package fingerprint module according to claim 3, characterized in that: The circuit substrate is provided with a power line, the pads include a first power pad closest to the outlet, the power line is connected to the first power pad, and the power line is led out from the first power pad and extends out of the outlet.

5. The narrow package fingerprint module according to claim 4, characterized in that: The pads further include a plurality of signal pads spaced apart from the first power pads. A plurality of signal lines are disposed on the circuit substrate, and each of the signal lines is connected to one of the signal pads.

6. The narrow package fingerprint module according to claim 5, characterized in that: The signal line includes a first signal line, and the first signal line is arranged on a side of the circuit substrate close to the pad and close to two side edges of the circuit substrate.

7. The narrow package fingerprint module according to claim 5, characterized in that: The signal line includes a second signal line, and the second signal line is arranged on a side of the circuit substrate away from the pad.

8. The narrow package fingerprint module according to claim 7, characterized in that: The circuit substrate is provided with a via hole, and the second signal line is connected to the signal pad through the via hole.

9. The narrow package fingerprint module according to claim 5, characterized in that: The outer diameter of the power line is greater than the outer diameter of the signal line.

10. A fingerprint recognition mobile terminal, characterized in that: It comprises a device housing, a main circuit board and a narrow package fingerprint module as claimed in any one of claims 1 to 9, wherein the main circuit board is arranged in the device housing, and the circuit substrate is electrically connected to the main circuit board.

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