Optical fingerprint module and electronic device

Abstract

The present invention provides an optical fingerprint module and an electronic device, relating to the field of optical fingerprint modules. The optical fingerprint module includes a bracket, a chip, a flexible circuit board, and a reinforcing member. The bracket is connected to the reinforcing member, and an accommodation space is formed between the bracket and the reinforcing member. The chip is disposed in the accommodation space and electrically connected to the flexible circuit board. The flexible circuit board is disposed on one side of the reinforcing member close to the bracket. One end of the flexible circuit board is located in the accommodation space, and the other end extends out of the accommodation space. Connecting the bracket to the reinforcing member in this optical fingerprint module is beneficial to improving the flatness of the bracket installation and preventing displacement or inclination of the bracket after installation.

Description

Technical Field

[0001] The present invention relates to the field of optical fingerprint modules, and more particularly, to an optical fingerprint module and an electronic device. Background Art

[0002] In existing optical fingerprint modules, the bracket is usually connected to a flexible circuit board. Due to the material and production process of the flexible circuit board, the surface of the flexible circuit board cannot be made very flat. When the bracket is installed on the flexible circuit board, problems such as misalignment or inclination are likely to occur, affecting the product quality. Summary of the Invention

[0003] An object of the present invention is to provide an optical fingerprint module and an electronic device, which can improve the flatness of the bracket installation, avoid misalignment or inclination of the bracket, and improve the product quality.

[0004] Embodiments of the present invention may be implemented as follows:

[0005] In a first aspect, an embodiment of the present invention provides an optical fingerprint module, including a bracket, a chip, a flexible circuit board, and a reinforcing member;

[0006] The bracket is connected to the reinforcing member, and an accommodation space is formed between the bracket and the reinforcing member. The chip is disposed in the accommodation space and is electrically connected to the flexible circuit board;

[0007] The flexible circuit board is disposed on a side of the reinforcing member close to the bracket. One end of the flexible circuit board is located in the accommodation space, and the other end extends out of the accommodation space.

[0008] In an optional embodiment, a groove communicating with the accommodation space is formed on a side of the reinforcing member close to the bracket, and the flexible circuit board is disposed in the groove.

[0009] In an optional embodiment, an installation notch or a through hole is formed on a side wall of the groove. One end of the flexible circuit board is disposed in the groove, and the other end extends out from the installation notch or the through hole.

[0010] In an optional embodiment, the width of the installation notch is not less than the width of the flexible circuit board, or the diameter of the through hole is not less than the width of the flexible circuit board.

[0011] In an optional embodiment, sealant is provided at the installation notch or the through hole to seal the gap between the flexible circuit board and the reinforcing member.

[0012] In an alternative embodiment, the reinforcing member includes a bottom wall and a boss protruding from a surface of the bottom wall close to the bracket toward the bracket side, and the bottom wall and the boss form the groove; the flexible circuit board is disposed on the bottom wall, and the bracket is connected to the boss.

[0013] In an alternative embodiment, the bracket is adhesively bonded to the boss.

[0014] In an alternative embodiment, the chip is disposed on the bottom wall or the flexible circuit board.

[0015] In an alternative embodiment, it further includes a lens and a filter. The lens is mounted on the bracket, the filter is mounted on a side of the chip away from the reinforcing member, and the filter is disposed opposite to the lens.

[0016] In an alternative embodiment, the reinforcing member is made of a steel sheet.

[0017] In a second aspect, an embodiment of the present invention provides an electronic device, including a device main body and the optical fingerprint module according to any one of the foregoing embodiments, and the optical fingerprint module is mounted on the device main body.

[0018] The beneficial effects of the optical fingerprint module and the electronic device provided by the present invention include:

[0019] For the optical fingerprint module provided by the present invention, the reinforcing member is used to support the flexible circuit board. The material and production process of the reinforcing member have a higher surface flatness compared to the material and processing process of the flexible circuit board. Mounting the bracket on the reinforcing member can effectively improve the flatness of the mounting surface of the bracket, thereby avoiding tilting or deviation after the bracket is mounted, which is beneficial to improving the product quality.

[0020] For the electronic device provided by the present invention, including the device main body and the above-mentioned optical fingerprint module, since the optical fingerprint module can improve the flatness of the bracket mounting and prevent the tilting of the bracket, the electronic device has the advantages of high flatness and good quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 It is a simplified structural schematic diagram of an optical fingerprint module provided by a specific embodiment of the present invention from a perspective;

[0023] Figure 2 A schematic structural diagram of another perspective of the optical fingerprint module provided by a specific embodiment of the present invention;

[0024] Figure 3 A schematic structural diagram of a reinforcing member of the optical fingerprint module provided by a specific embodiment of the present invention;

[0025] Figure 4 A schematic structural diagram of another reinforcing member of the optical fingerprint module provided by a specific embodiment of the present invention;

[0026] Figure 5 A schematic installation structure diagram of a chip of the optical fingerprint module provided by a specific embodiment of the present invention;

[0027] Figure 6 A schematic installation structure diagram of another chip of the optical fingerprint module provided by a specific embodiment of the present invention.

[0028] Reference numerals: 100 - optical fingerprint module; 110 - bracket; 115 - accommodation space; 120 - reinforcing member; 121 - installation surface; 123 - bottom wall; 124 - boss; 125 - groove; 126 - installation notch; 127 - through hole; 130 - flexible circuit board; 135 - gap; 140 - chip; 150 - lens; 160 - filter; 170 - sealant. Detailed Description of Specific Embodiments

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Generally, the components of the embodiments of the present invention described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0031] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0032] In the description of the present invention, it should be noted that if terms such as "upper", "lower", "inner", "outer", etc. are used to indicate the orientation or positional relationship, it is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present invention is usually placed when in use. This is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0033] In addition, if terms such as "first", "second", etc. are only used for distinguishing descriptions, they should not be construed as indicating or implying relative importance.

[0034] It should be noted that, without conflict, the features in the embodiments of the present invention can be combined with each other.

[0035] Please refer to Figure 1 and Figure 2 As shown in [drawings not provided], this embodiment provides an optical fingerprint module 100, which includes a bracket 110, a lens 150, a filter 160, a chip 140, a flexible circuit board 130, and a reinforcing member 120. The bracket 110 is connected to the reinforcing member 120, and an accommodation space 115 is formed between the bracket 110 and the reinforcing member 120. The chip 140 is disposed in the accommodation space 115 and is electrically connected to the flexible circuit board 130. The flexible circuit board 130 is disposed on the side of the reinforcing member 120 close to the bracket 110, and the reinforcing member 120 supports the flexible circuit board 130. One end of the flexible circuit board 130 is located in the accommodation space 115, and the other end extends out of the accommodation space 115. The lens 150 is mounted on the bracket 110, and the position of the lens 150 is set opposite to the position of the chip 140. The filter 160 is disposed between the lens 150 and the chip 140. The optical fingerprint module 100 provided in this embodiment changes the installation position of the bracket 110 and mounts the bracket 110 on the reinforcing member 120. Since the reinforcing member 120 supports the flexible circuit board 130, the strength and stiffness of the reinforcing member 120 are greater than those of the flexible circuit board 130, and the material and processing technology of the reinforcing member 120 are more likely to process a surface with higher precision, that is, the flatness of the reinforcing member 120 is higher. Mounting the bracket 110 on the reinforcing member 120 can improve the installation accuracy of the bracket 110 and avoid phenomena such as displacement or inclination of the bracket 110.

[0036] Optionally, the reinforcement member 120 is made of a steel sheet. The steel sheet has high strength and stiffness, and can provide better support for the flexible circuit board 130. In addition, the steel sheet has the advantages of wear resistance, long service life, and low cost. Moreover, the surface machining accuracy of the steel sheet is relatively high, which can provide a mounting surface with relatively high flatness for the bracket 110 and improve the mounting accuracy of the bracket 110. Of course, it is not limited to this. The reinforcement member 120 can also be made of other metal materials such as aluminum sheets and copper sheets, or can also be made of non-metal materials such as film, which is not specifically limited here.

[0037] Please refer to Figure 3 , the bracket 110 is in a ring-shaped column shape. The bracket 110 is mounted on the reinforcement member 120 and forms an accommodation space 115 with the reinforcement member 120. Since one end of the flexible circuit board 130 is located in the accommodation space 115 and the other end needs to extend out of the accommodation space 115, that is, a channel communicating with the outside needs to be provided in the accommodation space 115 for the flexible circuit board 130 to extend out. It is easy to understand that the channel can be provided on the reinforcement member 120 or on the bracket 110. In this embodiment, a groove 125 communicating with the accommodation space 115 is formed on the side of the reinforcement member 120 close to the bracket 110, and the groove 125 communicates with the outside. One end of the flexible circuit board 130 is disposed in the groove 125 and the other end extends out of the groove 125.

[0038] Further, in this embodiment, the reinforcing member 120 includes an installation surface 121 for installing the bracket 110, and a groove 125 for installing the flexible circuit board 130 is formed on the installation surface 121. An installation notch 126 is formed on the side wall of the groove 125. One end of the flexible circuit board 130 is disposed in the groove 125, and the other end extends out from the installation notch 126. Optionally, the width of the installation notch 126 is not less than the width of the flexible circuit board 130. With this arrangement, when the bracket 110 and the reinforcing member 120 are connected, the gas in the accommodation space 115 can be discharged from the installation notch 126. Of course, this is not the only way. It is also possible that the height of the installation notch 126 is not less than the thickness of the flexible circuit board 130, as long as there is a gap 135 between the flexible circuit board 130 and the reinforcing member 120 at the installation notch 126, and this gap 135 can allow the gas in the bracket 110 to be discharged from the accommodation space 115. Compared with the existing installation method of the bracket 110: the bracket 110 is completely attached to the flexible circuit board 130, and the gas in the bracket 110 cannot be discharged, and only exhaust holes need to be formed on the bracket 110 to allow the gas in the bracket 110 to be discharged smoothly. In this embodiment, by providing the groove 125 on the reinforcing member 120, it can not only enable the flexible circuit board 130 to extend out of the accommodation space 115, but also solve the problem of discharging the gas in the bracket 110 without the need to additionally provide exhaust holes, with a simpler structure and more convenient process. Moreover, by disposing the flexible circuit board 130 in the groove 125 of the reinforcing member 120, it is beneficial to reduce the height of the entire optical fingerprint module 100 and is conducive to manufacturing a thinner and lighter product.

[0039] It should be noted that after the bracket 110 and the reinforcing member 120 are installed, a sealant 170 is provided at the installation notch 126 to seal the gap 135 between the flexible circuit board 130 and the reinforcing member 120, as well as the gaps between the flexible circuit board 130 and the bracket 110 and between the bracket 110 and the reinforcing member 120. In this way, after the gas is discharged, the bracket 110 and the reinforcing member 120 can form a closed accommodation space 115 again. By providing the sealant 170 for sealing, the dust and water prevention effect is better, and it can better protect the chip 140, the flexible circuit board 130, etc. in the accommodation space 115.

[0040] Optionally, there are many ways to set the groove 125 on the reinforcement member 120. For example, a hollowing method can be used to cut a groove on a complete steel sheet, or a protruding side wall can be added to a steel sheet, and the protruding side wall and the steel sheet jointly enclose to form the groove 125. In an alternative embodiment, the reinforcement member 120 includes a bottom wall 123 and a boss 124 connected to the bottom wall 123. The boss 124 protrudes from the surface of the bottom wall 123 close to the bracket 110 toward the bracket 110 side, and the bottom wall 123 and the boss 124 enclose to form the groove 125. The bottom wall 123 and the boss 124 can be integrally formed or separately fixed, such as by bonding, riveting, welding, threaded connection or snap connection, etc., which are not specifically limited here. Further, the flexible circuit board 130 is disposed on the bottom wall 123, and the bracket 110 is connected to the boss 124. Optionally, the reinforcement member 120 is rectangular and includes four mounting edges. The boss 124 includes a first segment, a second segment and a third segment connected in sequence. The first segment, the second segment and the third segment are respectively arranged along three mounting edges of the reinforcement member 120, and a mounting notch 126 is formed on one mounting edge where the boss 124 is not provided, through which the flexible circuit board 130 can extend out of the groove 125. It is easy to understand that the width of the mounting notch 126 should be greater than the width of the flexible circuit board 130, that is, a gap 135 is formed between the flexible circuit board 130 and the boss 124 on both sides, facilitating the gas in the bracket 110 to be discharged from the gap 135.

[0041] Of course, it is not limited to this. Please refer to Figure 4 , the boss 124 can also include four segments, and the four segments are respectively arranged along the four mounting edges of the reinforcement member 120 to form a closed annular side wall, and then a through hole 127 is opened on one of the segments. The function of the through hole 127 is the same as that of the aforementioned mounting notch 126. The aperture of the through hole 127 is not less than the width of the flexible circuit board 130. The through hole 127 can not only allow the flexible circuit board 130 to extend out, but also let the gas in the bracket 110 be discharged. After the bracket 110 and the reinforcement member 120 are installed, the through hole 127 is sealed with the sealant 170.

[0042] The surface of the end of the boss 124 away from the bottom wall 123 is the mounting surface 121. In this embodiment, the bracket 110 is bonded to the mounting surface 121 of the boss 124. The bonding method has simple process, convenient operation and reliable connection, ensuring a higher degree of fit between the bracket 110 and the mounting surface 121. Of course, it is not limited to this. The installation method of the reinforcement member 120 and the bracket 110 can also be screw connection, snap connection, threaded connection, etc., which are not specifically limited here.

[0043] Please refer to Figure 5 and Figure 6, the chip 140 is disposed on the bottom wall 123 or the flexible circuit board 130. Optionally, the chip 140 can be disposed in the groove 125 of the reinforcing member 120, that is, the chip 140 is disposed on the bottom wall 123. The flexible circuit board 130 is also disposed on the bottom wall 123. The chip 140 and the flexible circuit board 130 are arranged side by side, and the chip 140 is electrically connected to the flexible circuit board 130. As shown in the figure, the chip 140 is disposed at one end of the bottom wall 123 away from the mounting notch 126. One end of the flexible circuit board 130 is disposed between the chip 140 and the mounting notch 126, and the other end extends out from the mounting notch 126. In other alternative embodiments, the flexible circuit board 130 is disposed on the bottom wall 123, and the chip 140 is disposed on the flexible circuit board 130 and is located on the side of the flexible circuit board 130 away from the reinforcing member 120. The chip 140 and the flexible circuit board 130 are electrically connected.

[0044] It should be noted that there are many ways to electrically connect the chip 140 and the flexible circuit board 130. For example, by wire bonding, a first solder joint is provided on the chip 140, and a second solder joint corresponding to the first solder joint is provided on the flexible circuit board 130. The first solder joint and the second solder joint are soldered to achieve the electrical connection between the flexible circuit board 130 and the chip 140; or, a first pin is provided on the chip 140, and a second pin is provided on the flexible circuit board 130. The first pin and the second pin are arranged opposite to each other, and the first pin and the second pin are bonded together by a wire or the like, which can also achieve the electrical connection between the chip 140 and the flexible circuit board 130.

[0045] In this embodiment, the chip 140 is an optical fingerprint chip 140. The lens 150 is mounted on the bracket 110, and the lens 150 is disposed opposite to the optical fingerprint chip 140. The filter 160 is disposed between the lens 150 and the chip 140 and is located on the optical path from the lens 150 to the chip 140. The filter 160 is used to filter light and improve the quality of the optical fingerprint module 100. Optionally, the filter 160 is mounted on the side of the chip 140 away from the reinforcing member 120, and the filter 160 is disposed opposite to the lens 150. Further, the filter 160 is adhered to the chip 140 by an adhesive. In other alternative embodiments, the filter 160 can also be mounted on the bracket 110, such as by being fixed in the card slot of the bracket 110 or directly adhered to the bracket 110, which is not specifically limited here.

[0046] An optical fingerprint module 100 provided in this embodiment has the following specific installation principle:

[0047] The reinforcing member 120 is made of a steel sheet. A groove 125 is formed on the mounting surface 121 of the reinforcing member 120, and the groove wall of the groove 125 has a mounting notch 126 communicating with the outside. One end of the flexible circuit board 130 is mounted in the groove 125, and the other end extends out from the mounting notch 126 to the outside. The flexible circuit board 130 extending to the outside can be used to connect to the main board of the electronic device. The chip 140 is disposed in the groove 125, and the chip 140 can be mounted on the bottom wall 123 of the groove 125 or on the flexible circuit board 130. The bracket 110 is mounted on the reinforcing member 120 and is adhered to the mounting surface 121 of the reinforcing member 120 through an adhesive.

[0048] Since the bracket 110 is adhesively attached to the mounting surface 121 of the reinforcing member 120, the surface accuracy of the mounting surface 121 of the reinforcing member 120 is higher than that of the flexible circuit board 130, which can effectively improve the flatness of the attachment of the bracket 110 and prevent the inclination or deviation of the bracket 110 after installation. The reinforcing member 120 is provided with a mounting notch 126 communicating with the groove 125. One end of the flexible circuit board 130 is located in the groove 125, and the other end extends out from the mounting notch 126. The width of the mounting notch 126 is greater than the width of the flexible circuit board 130, so that a gap 135 is left between the flexible circuit board 130 and the reinforcing member 120, facilitating the discharge of the gas between the bracket 110 and the reinforcing member 120 from the gap 135. In this way, there is no need to additionally provide exhaust holes on the bracket 110, solving the exhaust problem in the accommodation space 115 of the bracket 110, and the process is simpler. At the same time, by disposing the flexible circuit board 130 in the groove 125 of the reinforcing member 120, the height of the entire optical fingerprint module 100 can also be reduced, saving space, which is beneficial to designing a thinner mobile phone.

[0049] The embodiment of the present invention further provides an electronic device, including a device main body and the optical fingerprint module 100 as described in the foregoing embodiment. The optical fingerprint module 100 is mounted on the device main body. Further, the flexible circuit board 130 in the optical fingerprint module 100 is used for electrical connection with the main board in the device main body, and the chip 140 realizes signal transmission through the flexible circuit board 130 and the main board of the device main body. Since the bracket 110 in the electronic device is attached to the reinforcing member 120, the mounting surface 121 for mounting the bracket 110 has higher accuracy, which is beneficial to improving the flatness of the attachment of the bracket 110 and preventing the inclination or deviation phenomenon of the bracket 110 after installation, thereby improving the overall quality of the electronic device.

[0050] In summary, the optical fingerprint module 100 and the electronic device provided in this embodiment have at least the following advantages:

[0051] An optical fingerprint module 100 provided in this embodiment mounts the bracket 110 on the reinforcement member 120, improving the mounting flatness of the bracket 110 and effectively preventing the deviation or inclination of the bracket 110 after installation. A groove 125 is formed in the reinforcement member 120. The groove 125 has a mounting notch 126 communicating with the outside. One end of the flexible circuit board 130 is mounted in the groove 125 of the reinforcement member 120, and the other end extends out from the mounting notch 126; the width of the mounting notch 126 is greater than the width of the flexible circuit board 130, which is beneficial to exhausting the gas in the accommodation space 115 of the bracket 110 from the mounting notch 126, solving the exhaust problem and greatly improving the quality of the optical fingerprint module 100. After the bracket 110 is installed, the mounting notch 126 is sealed with a sealant 170, achieving the effects of dust and water prevention and protecting the chip 140, the flexible circuit board 130, etc. in the accommodation space 115. In addition, by arranging the flexible circuit board 130 in the groove 125, the height of the entire optical fingerprint module 100 is reduced, more space is saved, and it is beneficial to the miniaturization and thinning development of the optical fingerprint module 100.

[0052] An electronic device provided in this embodiment includes the above-mentioned optical fingerprint module 100, which can not only prevent the deviation or inclination of the bracket 110 after installation, but also conveniently solve the exhaust problem in the bracket 110. It has a simple structure and convenient process, effectively improving the quality of the entire optical fingerprint module 100. At the same time, it can also reduce the height of the entire optical fingerprint module 100, which is beneficial to the miniaturization and thinning design of the optical fingerprint module 100.

[0053] As described above, only the specific embodiments of the present invention are given, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. An optical fingerprint module, characterized in that, It includes a bracket, a chip, a flexible circuit board and a reinforcement member; The bracket is connected to the reinforcement member, and an accommodation space is formed between the bracket and the reinforcement member. The chip is disposed in the accommodation space and is electrically connected to the flexible circuit board; The flexible circuit board is disposed on one side of the reinforcement member close to the bracket. One end of the flexible circuit board is located in the accommodation space, and the other end extends out of the accommodation space; A groove communicating with the accommodation space is formed on one side of the reinforcement member close to the bracket, and the flexible circuit board is disposed in the groove; An installation notch or a through hole is formed on the side wall of the groove. One end of the flexible circuit board is disposed in the groove, and the other end extends out from the installation notch or the through hole; A gap is left between the flexible circuit board and the reinforcement member at the installation notch or the through hole, and the gap can be used to discharge the gas in the bracket from the accommodation space.

2. The optical fingerprint module according to claim 1, characterized in that, The width of the installation notch is not less than the width of the flexible circuit board, or the aperture of the through hole is not less than the width of the flexible circuit board.

3. The optical fingerprint module according to claim 1, characterized in that, Sealant is provided at the installation notch or the through hole to seal the gap between the flexible circuit board and the reinforcement member.

4. The optical fingerprint module according to claim 1, characterized in that, The reinforcement member includes a bottom wall and a boss protruding from the surface of the bottom wall close to the bracket toward the bracket side. The bottom wall and the boss form the groove; the flexible circuit board is disposed on the bottom wall, and the bracket is connected to the boss.

5. The optical fingerprint module according to claim 4, characterized in that, The bracket is bonded to the boss.

6. The optical fingerprint module according to claim 4, characterized in that, The chip is disposed on the bottom wall or the flexible circuit board.

7. The optical fingerprint module according to claim 1, characterized in that, It further includes a lens and a filter. The lens is mounted on the bracket, and the filter is mounted on the side of the chip away from the reinforcement member, and the filter is disposed opposite to the lens.

8. The optical fingerprint module according to any one of claims 1 to 7, characterized in that, The reinforcement member is made of a steel sheet.

9. An electronic device, characterized in that, It includes a device main body and the optical fingerprint module according to any one of claims 1 to 8, and the optical fingerprint module is mounted on the device main body.

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