Chamber Cooling Device and Semiconductor Processing Equipment

Abstract

The present invention provides a chamber cooling device and semiconductor processing equipment, including: a cooling trough, arranged at the bottom of the chamber, for containing cooling liquid; a plurality of cooling pipes, arranged in the cooling trough, and outlets are arranged on the tube walls of the plurality of cooling pipes, and the water flow sprayed from the outlets on the plurality of cooling pipes can drive the cooling liquid in the cooling trough to form a rotating turbulent flow; a plurality of water inlet pipes, connected to the plurality of cooling pipes in a one-to-one correspondence; and an on-off valve and a flow regulating valve are arranged on each water inlet pipe. The chamber cooling device provided by the present invention can make the structure more compact, reduce the flow rate loss, and can also independently control the flow in the plurality of cooling pipes, thereby improving operability and water flow uniformity.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a chamber cooling device and semiconductor processing equipment. Background Art

[0002] Chemical Vapor Deposition (CVD) technology is a chemical technology used to produce high-purity, high-performance solid materials. A typical CVD process is to expose a wafer to one or more different precursors, and at a certain process temperature, chemical reactions and / or chemical decompositions occur on the wafer surface to produce a thin film on the wafer.

[0003] Temperature control is one of the most critical technologies for any CVD technology, especially the temperature control of the CVD reaction chamber. During the process stage, the temperature inside the reaction chamber is high, up to 1100°C. Even at the end of the process and the wafer removal stage, the temperature inside the reaction chamber will be 350°C, so the reaction chamber needs to be cooled at all times.

[0004] The existing chamber cooling device uses a coolant distribution device to distribute the coolant to two water inlet pipes, and then the two water inlet pipes transmit the coolant to multiple water outlet pipes, and the multiple water outlet pipes are used to spray the coolant evenly toward the chamber. However, the chamber cooling device inevitably has the following problems in practical applications:

[0005] First, the coolant distribution device, the water inlet pipe and the water outlet pipe have complex structures and occupy a large space.

[0006] Secondly, the coolant is sprayed out through the coolant distribution device, the water inlet pipe and the water outlet pipe in sequence, the flow path is long, and the flow rate loss is large.

[0007] Third, the flow rates in the multiple water outlet pipes are controlled by the coolant distribution device and cannot be controlled independently. Therefore, the operability is poor and there is no guarantee that a uniform water flow can be obtained. Summary of the invention

[0008] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a chamber cooling device and semiconductor processing equipment, which can make the structure more compact, reduce flow rate loss, and independently control the flow in multiple cooling pipes, thereby improving operability and water flow uniformity.

[0009] In order to achieve the purpose of the present invention, a chamber cooling device is provided, comprising:

[0010] A cooling tank, disposed at the bottom of the chamber, for containing cooling liquid;

[0011] A plurality of cooling pipes are arranged in the cooling trough, and outlets are arranged on the tube walls of the plurality of cooling pipes, and the water flow sprayed from the outlets on the plurality of cooling pipes can drive the cooling liquid in the cooling trough to form a rotating turbulent flow;

[0012] A plurality of water inlet pipes are connected to the plurality of cooling pipes in a one-to-one correspondence; and an on-off valve and a flow regulating valve are arranged on each of the water inlet pipes.

[0013] Preferably, the outlets on the plurality of cooling pipes are distributed on a circle with the center of the cooling groove as the center, and are located in the central area of ​​the cooling groove; and the jet direction of each outlet is the tangent direction of the circle.

[0014] Preferably, the axis of each cooling tube is arranged horizontally; and the jet direction of each outlet is arranged obliquely upward relative to the axis of the cooling tube.

[0015] Preferably, the angle between the jet direction of each outlet and the axis of the cooling pipe is in the range of 40° to 60°.

[0016] Preferably, there are multiple outlets on each cooling tube, and the outlets are spaced apart along the axial direction of the cooling tube.

[0017] Preferably, the angle between the line between the end of the cooling pipe away from the outlet and the center of the cooling groove and the axis of the cooling pipe is 0° or an acute angle.

[0018] Preferably, the angles corresponding to all the cooling tubes are the same; or, the angles corresponding to at least two of the cooling tubes are different.

[0019] Preferably, the plurality of cooling tubes are all bent tubes or straight tubes; or, there is at least one bent tube among the plurality of cooling tubes; and the remaining cooling tubes are straight tubes.

[0020] Preferably, the bent pipe includes a straight pipe portion and a bent pipe portion, wherein the bent pipe portion is close to the center of the cooling groove, and the outlet is arranged on the pipe wall of the bent pipe portion.

[0021] Preferably, each of the water inlet pipes is vertically arranged, and the upper end of the water inlet pipe is connected to the cooling pipe, and the lower end of the water inlet pipe passes through the bottom of the cooling tank and is connected to a cooling liquid source.

[0022] Preferably, the chamber cooling device further comprises:

[0023] A water baffle is arranged in the cooling trough and is located above the cooling pipe; and a through hole is arranged in the central area of ​​the water baffle for exposing at least the outlet of the cooling pipe.

[0024] Preferably, the chamber cooling device further comprises:

[0025] Two side plates are arranged opposite to each other in the cooling trough and are located on both sides of the baffle plate; and the top of the side plate is higher than the baffle plate, and water retaining strips are respectively arranged on the top of the two side plates to limit the maximum water level of the cooling liquid inside the side plates.

[0026] Preferably, two jet pipes are respectively provided on the inner sides of the two side plates, the two jet pipes are located above the water baffle and close to the diagonal positions of the water baffle respectively, and each of the jet pipes sprays cooling liquid toward the side plate on the opposite side to increase the rotational power of the cooling liquid in the cooling trough.

[0027] Preferably, the chamber cooling device further comprises:

[0028] A bottom plate is arranged in the cooling groove, and a central through groove is arranged in the bottom plate and passes through the bottom plate along the thickness thereof;

[0029] The mounting plate is stacked on the bottom plate, and the cooling pipe is fixed on the mounting plate. The water inlet pipe passes through the mounting plate from bottom to top and is connected with the cooling pipe.

[0030] The present invention also provides a semiconductor processing device, comprising a reaction chamber and a chamber cooling device for cooling the reaction chamber, wherein the chamber cooling device adopts the above-mentioned chamber cooling device.

[0031] The present invention has the following beneficial effects:

[0032] The chamber cooling device provided by the present invention has multiple cooling pipes arranged in a cooling tank, and outlets are arranged on the tube walls of the multiple cooling pipes, and the cooling liquid sprayed out from the outlets on the multiple cooling pipes forms a rotating water flow, which can drive the cooling liquid in the cooling tank to form a rotating turbulent flow, thereby improving the heat exchange efficiency and enhancing the cooling effect. At the same time, by using multiple water inlet pipes to connect with multiple cooling pipes one by one; and each water inlet pipe is provided with an on-off valve and a flow regulating valve, the on-off and flow of the multiple cooling pipes can be independently controlled, thereby improving operability and water flow uniformity, and further ensuring the effective formation of rotating turbulence. In addition, compared with the prior art, the chamber cooling device provided by the present invention omits the coolant distribution device, which can make the structure more compact, while shortening the flow path of the cooling liquid, thereby reducing the flow rate loss.

[0033] The semiconductor processing equipment provided by the present invention can make the structure more compact, reduce flow rate loss, and independently control the flow in multiple cooling tubes, thereby improving operability and water flow uniformity by adopting the above-mentioned chamber cooling device provided by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A top view of a chamber cooling device provided by an embodiment of the present invention without a water baffle;

[0035] Figure 2 A partial structural diagram of a chamber cooling device provided by an embodiment of the present invention;

[0036] Figure 3 A top view of a chamber cooling device provided by an embodiment of the present invention;

[0037] Figure 4 A top view of a cooling pipe used in an embodiment of the present invention;

[0038] Figure 5 A radial cross-sectional view of a cooling tube used in an embodiment of the present invention;

[0039] Figure 6 This is a structural diagram of the water inlet pipe used in an embodiment of the present invention. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the technical solution of the present invention, the chamber cooling device and semiconductor processing equipment provided by the present invention are described in detail below with reference to the accompanying drawings.

[0041] Please also read Figures 1 to 6 The chamber cooling device provided by the embodiment of the present invention comprises a cooling tank 5, a plurality of cooling pipes 2 and a plurality of water inlet pipes 7, wherein the cooling tank 5 is arranged at the bottom of the chamber for containing cooling liquid (such as coolant or cooling water). The bottom of the chamber (not shown in the figure) is immersed in the cooling liquid in the cooling tank 5, thereby cooling the chamber.

[0042] A plurality of cooling tubes 2 are arranged in a cooling trough 5, and outlets 21 are arranged on the tube walls of the plurality of cooling tubes 2, and the cooling liquid sprayed out from the outlets 21 on the plurality of cooling tubes 2 forms a rotating water flow, which can drive the cooling liquid in the cooling trough 5 to form a rotating turbulent flow. Compared with laminar flow, the rotating turbulent flow has a more sufficient heat exchange effect, thereby improving the heat exchange efficiency and enhancing the cooling effect.

[0043] In this embodiment, the outlets 21 on the plurality of cooling pipes 2 are distributed on a circle with the center of the cooling groove 5 as the center, and are located in the central area of ​​the cooling groove 5, and the jet direction of each outlet 21 is toward the tangent direction of the circle ( Figure 1Optionally, the outlet 21 may be a through hole that penetrates the wall of the cooling pipe 2 along the wall thickness direction of the cooling pipe 2, and the axial direction of the through hole is the jet direction of the outlet 21.

[0044] It should be noted that, in the present embodiment, the outlets 21 on the plurality of cooling tubes 2 are distributed on a circle with the center of the cooling groove 5 as the center, but the present invention is not limited to this. In practical applications, the outlets 21 on the plurality of cooling tubes 2 only need to surround the center of the cooling groove 5 to form an approximately circular shape, without making the distances between all the outlets 21 and the center of the cooling groove 5 the same, and ultimately achieving the effect of driving the cooling liquid in the cooling groove 5 to form a rotating turbulent flow.

[0045] It should also be noted that, in the present embodiment, the jet direction of each outlet 21 is toward the tangent direction of the circle, but the present invention is not limited to this. In practical applications, the jet direction of the outlet 21 may also deviate from the tangent direction of the circle to a certain extent, and ultimately achieve the effect of driving the cooling liquid in the cooling groove 5 to form a rotating turbulent flow.

[0046] In this embodiment, the first end of each cooling tube 2 is close to the center of the cooling groove 5, and the second end is close to the edge of the cooling groove 5, and the outlet 21 is arranged on the tube wall of the cooling tube 2 and close to the first end of the cooling tube 2. In this way, the cooling liquid sprayed from the outlet 21 on the multiple cooling tubes 2 can form a rotating water flow in the central area of ​​the cooling groove 5.

[0047] In this embodiment, if Figure 2 As shown, multiple water inlet pipes 7 are connected to multiple cooling pipes 2 in a one-to-one correspondence; and, as shown in FIG. Figure 6 As shown, an on-off valve 71 and a flow regulating valve 72 are provided on each water inlet pipe 7. The on-off valve 71 is used to connect or disconnect the water inlet pipe 7 in which it is located; the flow regulating valve 72 is used to adjust the flow of the cooling liquid in the water inlet pipe 7 in which it is located. In this way, the on-off and flow of multiple cooling pipes 2 can be independently controlled, thereby improving operability and water flow uniformity, and further ensuring the effective formation of rotating turbulence.

[0048] In addition, compared with the prior art, in the chamber cooling device provided in this embodiment, each cooling pipe 2 is independently led out by the water inlet pipe 7, eliminating the coolant distribution device, making the structure more compact and shortening the flow path of the cooling liquid, thereby reducing flow rate loss.

[0049] In this embodiment, if Figure 5As shown, the axis of each cooling pipe 2 is arranged horizontally; the jet direction of the outlet 21 is arranged obliquely upward relative to the axis of the cooling pipe 2. In this way, the "hollow" state of the rotating turbulence can be avoided, that is, the center of the cooling groove 5 lacks cooling liquid. Optionally, the angle c between the jet direction of each outlet 21 and the axis of the cooling pipe 2 ranges from 40° to 60°, preferably 50°.

[0050] In practical applications, the radial cross-sectional shape of the cooling tube 2 includes circular, triangular, rectangular, hexagonal or any other shape, preferably circular. The outlet 21 can be a through hole penetrating the tube wall of the cooling tube 2, and the radial cross-sectional shape of the through hole includes circular, triangular, rectangular, hexagonal or any other shape.

[0051] Optionally, in order to increase the liquid flow rate while ensuring that the flow rate of the cooling liquid sprayed from each cooling tube 2 remains constant, there are multiple outlets 21 on each cooling tube 2, and the outlets 21 are spaced apart along the axial direction of the cooling tube 2. Preferably, the number of the outlets 21 is 5.

[0052] Optionally, the multiple outlets 21 on the multiple cooling pipes 2 are distributed on multiple circles with different radii and with the center of the cooling groove 5 as the center. Of course, in practical applications, the multiple outlets 21 on the multiple cooling pipes 2 only need to surround the center of the cooling groove 5 to form an approximately circular shape.

[0053] Optional, such as Figure 1 As shown, the angle a between the line connecting the end of the cooling tube 2 away from the outlet 21 (i.e., the end close to the edge of the cooling groove 5) and the center of the cooling groove 5 and the axis of the cooling tube 2 is an acute angle, that is, the axis of the cooling tube 2 is inclined relative to the radial direction of the cooling groove 5, which is conducive to the formation of rotating turbulence. Of course, in practical applications, the above-mentioned angle a can also be 0°, that is, the axis of the cooling tube 2 coincides with the radial direction of the cooling groove 5. Optionally, the angle a corresponding to all cooling tubes 2 is the same; or, the angle a corresponding to at least two cooling tubes is different.

[0054] In this embodiment, there are two curved tubes among the plurality of cooling tubes 2; the remaining cooling tubes 2 are straight tubes. Figure 4 As shown, the curved pipe includes a straight pipe portion 2a and a curved pipe portion 2b, wherein the curved pipe portion 2b is close to the center of the cooling groove 5, and the outlet 21 is arranged on the pipe wall of the curved pipe portion 2b. By mixing curved pipes and straight pipes, it is beneficial to arrange more cooling pipes 2 in the circumferential direction of the cooling groove 5, and it is also beneficial to the arrangement design of the outlet 21. Of course, in actual applications, the cooling pipes 2 can also be straight pipes or curved pipes according to specific needs.

[0055] Optionally, the number of cooling tubes 2 is 10. Of course, in practical applications, the number may be any other number.

[0056] In this embodiment, if Figure 2 As shown, each water inlet pipe 7 is vertically arranged, and the upper end of the water inlet pipe 7 is connected to the cooling pipe 2, and the lower end of the water inlet pipe 7 passes through the bottom of the cooling tank 5 and is connected to the cooling liquid source (not shown in the figure). In this way, the cooling pipe is independently led out, the cooling liquid distribution device is omitted, the structure can be made more compact, and the flow path of the cooling liquid is shortened, thereby reducing the flow rate loss.

[0057] In this embodiment, if Figure 3 As shown, the chamber cooling device also includes a water baffle 3, which is arranged in the cooling groove 5 and is located above the cooling pipe 2; and a through hole 31 is arranged in the central area of ​​the water baffle 3, which is used to expose at least the outlet 21 of the cooling pipe 2, so that the central area of ​​the cooling groove 5 is in an open state, and the cooling liquid can overflow through the through hole 31, thereby ensuring that there is sufficient water flow in the main high-temperature area of ​​the corresponding chamber, thereby ensuring that the area is fully cooled.

[0058] In this embodiment, if Figure 2 As shown, the chamber cooling device also includes two side plates 9 ( Figure 2 Only one of the side plates 9 is shown. The two side plates 9 are arranged opposite to each other in the cooling tank 5 and are located on both sides of the water barrier 3 ( Figure 2 and, the top of the side plate 9 is higher than the baffle plate 3 , and water retaining strips 4 are respectively provided on the tops of the two side plates 9 to limit the maximum water level of the cooling liquid inside the side plates 9 .

[0059] Specifically, the accommodating space of the cooling tank 5 is divided into a central area and edge areas 51 located on both sides of the central area by two side plates 9, and all cooling pipes 2 are arranged in the central area. In the process of the cooling pipes 2 spraying cooling liquid, the water level in the central area of ​​the cooling tank 5 gradually rises. When the water level exceeds the water retaining bar 4, the cooling liquid in the central area overflows and pours into the edge areas 51 on both sides.

[0060] In this embodiment, if Figure 3 As shown, two jet pipes 6 are respectively arranged on the inner side of the two side plates 9, the two jet pipes 6 are located above the baffle 3, and are respectively close to the diagonal position of the baffle 3, and each jet pipe 6 sprays cooling liquid toward the opposite side plate 9, which is equivalent to spraying cooling liquid toward the tangential direction of the ring formed by the outlet 21, so as to increase the rotational power of the cooling liquid in the cooling tank 5. Optionally, the jet pipe 6 provides cooling liquid through a water inlet pipe alone, and the on-off and flow rate of the jet pipe 6 can be adjusted independently.

[0061] Optionally, the number of the jet pipes 6 disposed on the inner side of each side plate 9 may be one or more, and the plurality of jet pipes 6 are disposed at intervals in the horizontal direction.

[0062] In this embodiment, if Figure 1 and Figure 2 As shown, the chamber cooling device further includes a bottom plate 1 and a mounting plate 8, wherein the bottom plate 1 is arranged in the cooling groove 5, and a central through groove 11 is arranged in the bottom plate 1 that runs through the thickness thereof; the mounting plate 8 is stacked on the bottom plate 1, and the cooling pipe 2 is fixed on the mounting plate 8. With the help of the bottom plate 1 and the mounting plate 8, the cooling pipe 2 is installed and fixed. The water inlet pipe 7 runs through the mounting plate 8 from bottom to top and is connected to the cooling pipe 2.

[0063] As another technical solution, an embodiment of the present invention further provides a semiconductor processing equipment, which includes a reaction chamber and a chamber cooling device for cooling the reaction chamber, and the chamber cooling device adopts the above-mentioned chamber cooling device provided by the embodiment of the present invention.

[0064] The semiconductor processing equipment provided by the embodiment of the present invention can make the structure more compact, reduce flow rate loss, and independently control the flow in multiple cooling pipes by adopting the above-mentioned chamber cooling device provided by the embodiment of the present invention, thereby improving operability and water flow uniformity.

[0065] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A chamber cooling device, It is characterized in that include: A cooling tank, disposed at the bottom of the chamber, for containing cooling liquid; A plurality of cooling pipes are arranged in the cooling trough, and outlets are arranged on the tube walls of the plurality of cooling pipes, and the water flow sprayed from the outlets on the plurality of cooling pipes can drive the cooling liquid in the cooling trough to form a rotating turbulent flow; A plurality of water inlet pipes are connected to the plurality of cooling pipes in a one-to-one correspondence; and an on-off valve and a flow regulating valve are arranged on each of the water inlet pipes; The axis of each cooling pipe is arranged horizontally; the jet direction of each outlet is arranged obliquely upward relative to the axis of the cooling pipe; One end of each of the water inlet pipes is connected to the corresponding cooling pipe, and the other end of each of the water inlet pipes is connected to a cooling liquid source.

2. The chamber cooling device according to claim 1, It is characterized in that The outlets on the plurality of cooling pipes are distributed on a circle with the center of the cooling groove as the center, and are located in the central area of ​​the cooling groove; and the jet direction of each outlet is the tangent direction of the circle.

3. The chamber cooling device according to claim 1, It is characterized in that The angle between the jet direction of each outlet and the axis of the cooling pipe is in the range of 40° to 60°.

4. The chamber cooling device according to claim 1, It is characterized in that There are multiple outlets on each cooling pipe, and the outlets are distributed at intervals along the axial direction of the cooling pipe.

5. The chamber cooling device according to claim 1, It is characterized in that The angle between the line between the end of the cooling pipe away from the outlet and the center of the cooling groove and the axis of the cooling pipe is 0° or an acute angle.

6. The chamber cooling device according to claim 5, It is characterized in that The included angles corresponding to all the cooling tubes are the same; or, the included angles corresponding to at least two of the cooling tubes are different.

7. The chamber cooling device according to claim 1, It is characterized in that The plurality of cooling tubes are all bent tubes or straight tubes; or, there is at least one bent tube among the plurality of cooling tubes; and the remaining cooling tubes are straight tubes.

8. The chamber cooling device according to claim 7, It is characterized in that The bent pipe includes a straight pipe portion and a bent pipe portion, wherein the bent pipe portion is close to the center of the cooling groove, and the outlet is arranged on the pipe wall of the bent pipe portion.

9. The chamber cooling device according to claim 1, It is characterized in that Each of the water inlet pipes is vertically arranged, and the upper end of the water inlet pipe is connected to the cooling pipe, and the lower end of the water inlet pipe passes through the bottom of the cooling tank and is connected to a cooling liquid source.

10. The chamber cooling device according to any one of claims 1 to 9, It is characterized in that The chamber cooling device also includes: A water baffle is arranged in the cooling trough and is located above the cooling pipe; and a through hole is arranged in the central area of ​​the water baffle for exposing at least the outlet of the cooling pipe.

11. The chamber cooling device according to claim 10, It is characterized in that The chamber cooling device also includes: Two side plates are arranged opposite to each other in the cooling trough and are located on both sides of the baffle plate; and the top of the side plate is higher than the baffle plate, and water retaining strips are respectively arranged on the top of the two side plates to limit the maximum water level of the cooling liquid inside the side plates.

12. The chamber cooling device according to claim 11, It is characterized in that Two jet pipes are respectively arranged on the inner sides of the two side plates, the two jet pipes are located above the water baffle and close to the diagonal positions of the water baffle respectively, and each of the jet pipes sprays cooling liquid toward the side plate on the opposite side to increase the rotational power of the cooling liquid in the cooling trough.

13. The chamber cooling device according to claim 1, It is characterized in that The chamber cooling device also includes: A bottom plate is arranged in the cooling groove, and a central through groove is arranged in the bottom plate and passes through the bottom plate along the thickness thereof; The mounting plate is stacked on the bottom plate, and the cooling pipe is fixed on the mounting plate. The water inlet pipe passes through the mounting plate from bottom to top and is connected with the cooling pipe.

14. A semiconductor processing device comprising a reaction chamber and a chamber cooling device for cooling the reaction chamber, It is characterized in that The chamber cooling device adopts the chamber cooling device described in any one of claims 1-13.

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