Substrate processing device and substrate processing method

Abstract

The present invention provides a substrate processing device and a substrate processing method. The substrate processing device (100) includes a processing tank (110), a substrate holding part (120), a fluid supply part (130) and a control part (140). The processing tank (110) stores a processing liquid for processing a substrate. The substrate holding part (120) holds the substrate in the processing liquid of the processing tank (110). The fluid supply part (130) supplies fluid to the processing tank (110). The control part (140) controls the fluid supply part (130). The control part (140) controls the fluid supply part (130) from the start of supplying fluid to the processing tank (110) storing the processing liquid for immersing the substrate (W) until the end of supplying fluid to the processing tank (110) storing the processing liquid for immersing the substrate (W) so that the fluid supply part (130) changes the supply of fluid. The substrate processing device and substrate processing method of the present invention can suppress the bias of substrate processing in the processing tank.

Description

Technical Field

[0001] The invention relates to a substrate processing device and a substrate processing method. Background Art

[0002] It is known that substrates used for electronic components such as semiconductor devices and liquid crystal display devices are processed by a substrate processing apparatus. The substrate is processed by immersing the substrate in a processing liquid in a processing tank (see, for example, Patent Document 1).

[0003] In the substrate processing apparatus of Patent Document 1, when a substrate is processed using a phosphoric acid aqueous solution, a mixed gas is blown into the phosphoric acid aqueous solution to generate bubbles, thereby aerating and stirring the phosphoric acid aqueous solution.

[0004] [Prior art literature]

[0005] [Patent Document]

[0006] Patent Document 1: Japanese Patent Application Publication No. 2018-56258 Summary of the invention

[0007] [Problems to be solved by the invention]

[0008] However, in the substrate processing apparatus described in Patent Document 1, substrate processing in the processing tank may be uneven.

[0009] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of suppressing the bias of substrate processing in a processing tank.

[0010] [Technical means to solve the problem]

[0011] According to one aspect of the present invention, a substrate processing device includes: a processing tank storing a processing liquid for processing a substrate; a substrate holding part holding the substrate in the processing liquid in the processing tank; a fluid supply part supplying a fluid to the processing tank; and a control part controlling the fluid supply part. The control part controls the fluid supply part to change the supply of the fluid from the start of supplying the fluid to the processing tank storing the processing liquid for immersing the substrate to the end of supplying the fluid to the processing tank storing the processing liquid for immersing the substrate.

[0012] In the substrate processing device of the present invention, the fluid supply unit includes: a first fluid supply unit, which is arranged at a first position in the processing tank and supplies fluid to the processing tank; and a second fluid supply unit, which is arranged at a second position in the processing tank and supplies fluid to the processing tank during a period different from the period during which the first fluid supply unit supplies the fluid.

[0013] In the substrate processing device of the present invention, the control unit controls the first fluid supply unit and the second fluid supply unit to switch the supply of the fluid by the first fluid supply unit and the supply of the fluid by the second fluid supply unit, and supplies at least one of the fluid of the first fluid supply unit and the fluid of the second fluid supply unit to the processing tank.

[0014] In the substrate processing apparatus of the present invention, the first fluid supply unit supplies gas as the fluid to the processing tank, and the second fluid supply unit supplies gas as the fluid to the processing tank.

[0015] In the substrate processing apparatus of the present invention, the first fluid supply unit includes a plurality of fluid supply pipes, and the plurality of fluid supply pipes of the first fluid supply unit are symmetrically arranged with respect to a vertical center axis of the substrate.

[0016] In the substrate processing apparatus of the present invention, the second fluid supply unit includes a plurality of fluid supply pipes, and the plurality of fluid supply pipes of the second fluid supply unit are arranged symmetrically with respect to a vertical center axis of the substrate.

[0017] In the substrate processing apparatus of the present invention, the substrate processing apparatus further includes: a liquid supply unit, which is arranged in the processing tank below the substrate held by the substrate holding unit and supplies the processing liquid to the processing tank.

[0018] In the substrate processing apparatus of the present invention, the liquid supply unit includes a plurality of liquid supply pipes, and the plurality of liquid supply pipes of the liquid supply unit are arranged symmetrically with respect to a vertical center axis of the substrate.

[0019] The substrate processing device of the present invention further includes: a liquid supply unit, which is arranged in the processing tank below the substrate held by the substrate holding unit to supply the processing liquid to the processing tank. The liquid supply unit includes a first liquid supply pipe and a second liquid supply pipe. The first fluid supply unit has a plurality of fluid supply pipes. At least one fluid supply pipe of the plurality of fluid supply pipes of the first fluid supply unit is located between the vertical center axis of the substrate and the first liquid supply pipe. At least another fluid supply pipe of the plurality of fluid supply pipes of the first fluid supply unit is located between the vertical center axis of the substrate and the second liquid supply pipe.

[0020] In the substrate processing apparatus of the present invention, the second fluid supply unit has a plurality of fluid supply pipes, at least one of the plurality of fluid supply pipes of the second fluid supply unit is located between the vertical center axis of the substrate and the first liquid supply pipe. At least another fluid supply pipe of the plurality of fluid supply pipes of the second fluid supply unit is located between the vertical center axis of the substrate and the second liquid supply pipe.

[0021] The substrate processing device of the present invention further includes: a liquid supply unit, which is arranged in the processing tank below the substrate held by the substrate holding unit to supply the processing liquid to the processing tank. The liquid supply unit includes a first liquid supply pipe and a second liquid supply pipe. The first fluid supply unit has a plurality of fluid supply pipes, and the plurality of fluid supply pipes of the first fluid supply unit include a first fluid supply pipe, a second fluid supply pipe, a third fluid supply pipe and a fourth fluid supply pipe. The first liquid supply pipe is located between the first fluid supply pipe and the second fluid supply pipe of the first fluid supply unit. The second liquid supply pipe is located between the third fluid supply pipe and the fourth fluid supply pipe of the first fluid supply unit.

[0022] In the substrate processing device of the present invention, the second fluid supply part has a plurality of fluid supply pipes, and the plurality of fluid supply pipes of the second fluid supply part include a fifth fluid supply pipe, a sixth fluid supply pipe, a seventh fluid supply pipe and an eighth fluid supply pipe. The first liquid supply pipe is located between the fifth fluid supply pipe and the sixth fluid supply pipe of the second fluid supply part. The second liquid supply pipe is located between the seventh fluid supply pipe and the eighth fluid supply pipe of the second fluid supply part.

[0023] In the substrate processing apparatus of the present invention, the first fluid supply unit supplies a processing liquid as the fluid to the processing tank, and the second fluid supply unit supplies a processing liquid as the fluid to the processing tank.

[0024] In the substrate processing apparatus of the present invention, the control unit controls the fluid supply unit to move the fluid supply unit in the processing tank.

[0025] In the substrate processing apparatus of the present invention, the substrates are arranged in a row in plurality, and the fluid supply portion extends in a direction intersecting the arrangement direction of the substrates and is located between two adjacent substrates among the plurality of substrates.

[0026] In the substrate processing apparatus of the present invention, the fluid supply unit supplies liquid to the two substrates.

[0027] In the substrate processing apparatus of the present invention, the fluid supply unit is arranged in the processing tank below the substrate held by the substrate holding unit.

[0028] In the substrate processing apparatus of the present invention, the substrate processing apparatus further includes: a rectifying plate facing at least a portion of the substrate.

[0029] In the substrate processing apparatus of the present invention, the rectifying plate is attached to the processing tank or the substrate holding portion.

[0030] According to another aspect of the present invention, a substrate processing method includes the following steps: immersing a substrate in a processing liquid stored in a processing tank; and supplying a fluid to the processing tank. The step of supplying the fluid includes the following steps, that is, changing the supply of the fluid during the period from when the supply of the fluid to the processing tank storing the processing liquid for immersing the substrate is started until when the supply of the fluid to the processing tank storing the processing liquid for immersing the substrate is ended.

[0031] [Effects of the Invention]

[0032] According to the present invention, it is possible to suppress unevenness in substrate processing in a processing bath. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of a substrate processing apparatus according to this embodiment.

[0034] Figure 2(a) to Figure 2(c) It is a schematic diagram for explaining the substrate processing method according to the present embodiment.

[0035] Figure 3 It is a schematic diagram of a substrate processing apparatus according to this embodiment.

[0036] Figure 4(a) to Figure 4(c) It is a schematic diagram for explaining the substrate processing method according to the present embodiment.

[0037] Figure 5(a) to Figure 5(d) It is a schematic diagram for explaining the substrate processing method according to the present embodiment.

[0038] Figure 6(a) to Figure 6(c) It is a schematic diagram for explaining the substrate processing method according to the present embodiment.

[0039] Figure 7(a) to Figure 7(d) It is a schematic diagram for explaining the substrate processing method according to the present embodiment.

[0040] Figure 8(a) to Figure 8(d) It is a schematic diagram for explaining the substrate processing method according to the present embodiment.

[0041] Figure 9(a) to Figure 9(c) It is a schematic diagram for explaining the substrate processing method according to the present embodiment.

[0042] Fig.10 It is a schematic diagram of a substrate processing apparatus according to this embodiment.

[0043] 11( a ) and 11 ( b ) are schematic perspective views of the substrate processing apparatus according to the present embodiment, showing before and after a substrate is put into a processing tank.

[0044] Fig.12 It is a schematic plan view of a first fluid supply unit, a second fluid supply unit, and a liquid supply unit in the substrate processing apparatus according to the present embodiment.

[0045] Fig.13 It is a schematic plan view of a first fluid supply unit, a second fluid supply unit, and a liquid supply unit in the substrate processing apparatus according to the present embodiment.

[0046] Fig.14 It is a schematic side view of the substrate processing apparatus according to this embodiment.

[0047] 15( a ) and 15 ( b ) are schematic diagrams for explaining the substrate processing method according to the present embodiment.

[0048] Fig.16 It is a schematic diagram of a substrate processing apparatus according to this embodiment.

[0049] Fig.17 It is a schematic diagram of a substrate processing apparatus according to this embodiment.

[0050] Figure 18(a) to Figure 18(c) It is a schematic diagram for explaining the substrate processing method according to the present embodiment.

[0051] Fig.19 It is a schematic diagram of a substrate processing apparatus according to this embodiment.

[0052] 20( a ) and 20 ( b ) are schematic diagrams of a substrate processing apparatus according to this embodiment.

[0053] 21( a ) and 21 ( b ) are schematic diagrams of a substrate processing apparatus according to this embodiment.

[0054] FIG. 22( a ) is a schematic diagram of a processing tank in a substrate processing apparatus according to the present embodiment, and FIG. 22( b ) and FIG. 22( c ) are schematic diagrams for explaining a substrate processing method according to the present embodiment.

[0055] Fig.23 It is a schematic diagram of a substrate holding portion in the substrate processing apparatus according to the present embodiment.

[0056] [Explanation of Symbols]

[0057] 100: Substrate processing device

[0058] 110: Processing tank

[0059] 112: Inner groove

[0060] 112a: Restriction

[0061] 114: External groove

[0062] 116: Cover

[0063] 116a, 116b: opening part

[0064] 118a: Drainage piping

[0065] 118b, 154, 166, 176, 186: valve

[0066] 120: Substrate holding part

[0067] 122: Body board

[0068] 124: Keep the stick

[0069] 126: Lifting unit

[0070] 130: Fluid supply unit

[0071] 132: First fluid supply unit

[0072] 132a to 132d, 134a to 134d: Fluid supply pipe

[0073] 134: Second fluid supply unit

[0074] 140: Control Department

[0075] 150: Gas transport unit

[0076] 152, 161, 174, 184: Piping

[0077] 156, 165: Adjustment valve

[0078] 158: Gas supply unit

[0079] 158a~158d:Gas supply pipe

[0080] 160: Circulation

[0081] 162: Pump

[0082] 163: Filter

[0083] 164: Heater

[0084] 168: Liquid supply unit

[0085] 168a, 168b, 168c, 168d: Liquid supply pipe

[0086] 170: Processing liquid supply unit

[0087] 172, 182: Nozzle

[0088] 180: Water supply department

[0089] 190: Rectifier

[0090] CL: Imaginary center line

[0091] F, F1, F2, Fa, Fb: Arrow

[0092] G: Bubble ejection port

[0093] Ga~Gd, Pa, Pb: ejection port

[0094] L: Treatment liquid

[0095] P: Treatment liquid outlet

[0096] W, W1, W2, W3, W4: substrate

[0097] Wa, Wb: Main surface

[0098] X, Y, Z: direction DETAILED DESCRIPTION

[0099] Hereinafter, embodiments of the substrate processing device and the substrate processing method of the present invention are described with reference to the accompanying drawings. In addition, the same reference symbols are marked for the same or equivalent parts in the figures and the description is not repeated. In addition, in the specification of this application, in order to facilitate the understanding of the invention, the X-axis, Y-axis and Z-axis that are orthogonal to each other are sometimes recorded. Typically, the X-axis and the Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0100] Reference Figure 1 An embodiment of a substrate processing apparatus 100 according to the present invention will be described. Figure 1 It is a schematic diagram of a substrate processing apparatus 100 according to this embodiment.

[0101] The substrate processing apparatus 100 processes the substrate W. The substrate processing apparatus 100 processes the substrate W to perform at least one of etching, surface treatment, property imparting, process film formation, removal of at least a portion of a film, and cleaning.

[0102] The substrate W is in the shape of a thin plate. Typically, the substrate W is in the shape of a thin, roughly circular plate. The substrate W includes, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, and a substrate for a solar cell.

[0103] The substrate processing apparatus 100 processes the substrate W using the processing liquid L. Here, the substrate processing apparatus 100 processes a plurality of substrates W at once. The processing liquid L performs at least one of etching, surface processing, property imparting, processing film formation, removal of at least a portion of a film, and cleaning on the substrate W.

[0104] The substrate processing apparatus 100 includes a processing tank 110, a substrate holding unit 120, a fluid supply unit 130, and a control unit 140. The processing tank 110 stores a processing liquid L for processing a substrate W.

[0105] The substrate holding portion 120 holds the substrate W. The normal direction of the main surface of the substrate W held by the substrate holding portion 120 is parallel to the Y direction. The substrate holding portion 120 moves the substrate W while holding the substrate W. For example, the substrate holding portion 120 moves vertically upward or vertically downward along the vertical direction while holding the substrate W.

[0106] Typically, the substrate holding part 120 collectively holds a plurality of substrates W. Here, the plurality of substrates W are arranged in a row along the Y direction. Alternatively, the substrate holding part 120 may hold only one substrate W.

[0107] The fluid supply unit 130 supplies fluid to the processing tank 110. Specifically, the fluid supply unit 130 supplies fluid to the processing tank 110 storing the processing liquid L. The fluid supply unit 130 supplies fluid to the processing tank 110, thereby facilitating the processing of the substrate W.

[0108] The fluid supply unit 130 may also supply gas as fluid to the processing tank 110. Gas is supplied to the processing tank 110 by the fluid supply unit 130, thereby forming bubbles in the processing liquid L. The bubbles formed in the processing liquid L float in the processing liquid L until they reach the interface between the processing liquid L in the processing tank 110 and the gas (e.g., air or a predetermined ambient gas).

[0109] When the bubbles float in the processing liquid L, the bubbles contact the surface of the substrate W. At this time, the bubbles squeeze out the contact portion of the processing liquid with the substrate W while moving the surface of the substrate W upward, and when the bubbles pass through, fresh processing liquid L located around them enters. In this way, by the bubbles contacting the surface of the substrate W, the surface of the substrate W can be stirred, thereby replacing the processing liquid on the surface of the substrate W with fresh processing liquid. As a result, the processing speed of the substrate W can be increased. In addition, when the substrate processing device 100 performs etching, it is preferred that the fluid supply unit 130 supplies gas as the fluid.

[0110] Alternatively, the fluid supply unit 130 may also supply liquid as the fluid to the processing tank 110. In this case, it is preferred that the fluid supply unit 130 supplies the liquid from a lower position toward the upper side with respect to the processing liquid L in the processing tank 110. As an example, the fluid may also be the same type of processing liquid L as the processing liquid L stored in the processing tank 110.

[0111] When the fluid supply unit 130 supplies the processing liquid L as the fluid, the processing liquid supplied upward will also squeeze out the portion of the processing liquid in contact with the substrate W, while moving the surface of the substrate W upward. When the processing liquid supplied upward passes through, fresh processing liquid L located around enters. In this way, the processing liquid supplied upward contacts the surface of the substrate W, thereby stirring the surface of the substrate W, and thus the processing liquid L on the surface of the substrate W can be replaced with fresh processing liquid. As a result, the processing speed of the substrate W can be increased.

[0112] The control unit 140 controls the fluid supply unit 130. Through the control of the control unit 140, the supply of the fluid by the fluid supply unit 130 is controlled. Figure 1 In FIG. 1 , the arrow F indicates the supply of fluid from the fluid supply unit 130 to the processing tank 110 under the control of the control unit 140 .

[0113] The control unit 140 controls the start and stop of the supply of fluid by the fluid supply unit 130. In addition, the control unit 140 may also directly control the fluid supply unit 130 disposed in the processing tank 110. Alternatively, the control unit 140 may also control the fluid flowing in the pipe connected to the fluid supply unit 130 disposed in the processing tank 110. For example, the control unit 140 may also control the nozzle (nozzle), the adjustment valve, etc., which are disposed outside the processing tank 110 and are connected to the fluid supply unit 130, thereby controlling the supply of fluid by the fluid supply unit 130.

[0114] In the substrate processing apparatus 100 of the present embodiment, the control unit 140 controls the fluid supply unit 130 to start supplying the fluid to the processing tank 110 storing the processing liquid in which the substrate W is immersed. Furthermore, the control unit 140 controls the fluid supply unit 130 to end supplying the fluid to the processing tank 110 storing the processing liquid in which the substrate W is immersed. The control unit 140 controls the fluid supply unit 130 during the period from when the fluid supply in the state starts to when the fluid supply in the state ends, so that the fluid supply unit 130 changes the supply of the fluid. Thus, when the substrate W is processed, the fluid supply to the substrate W is changed, so that the processing bias to the substrate W can be suppressed.

[0115] Next, refer to Figure 2(a) to Figure 2(c) The substrate processing method according to this embodiment will be described. Figure 2(a) to Figure 2(c) It is a schematic diagram for explaining the substrate processing method according to the present embodiment.

[0116] As shown in FIG2(a), in the substrate processing apparatus 100, the substrate W held by the substrate holding portion 120 is immersed in the processing liquid L in the processing tank 110. The fluid supply portion 130 supplies the fluid to the processing tank 110 while the substrate W is immersed in the processing liquid L. Here, the fluid supply portion 130 supplies the fluid to the processing tank 110 under the first condition. In FIG2(a), the supply of the fluid supplied from the fluid supply portion 130 to the processing tank 110 is indicated by an arrow Fa.

[0117] The control unit 140 controls the substrate holder 120 to move downward until the entire substrate W is immersed in the processing liquid L in the processing tank 110. Furthermore, the control unit 140 controls the fluid supply unit 130 to supply the fluid to the processing tank 110 under the first condition.

[0118] As shown in FIG2(b), while the substrate W held by the substrate holding portion 120 is still immersed in the processing liquid L in the processing tank 110, the fluid supply portion 130 changes the fluid supply to the substrate W. Here, the fluid supply portion 130 supplies the fluid to the processing tank 110 under the second condition. In FIG2(b), the supply of the fluid supplied from the fluid supply portion 130 to the processing tank 110 is indicated by an arrow Fb. In addition, the supply Fb of the fluid is different from the supply Fa of the fluid.

[0119] The control unit 140 controls the fluid supply unit 130 to supply the fluid to the processing tank 110 under the second condition while maintaining the entire substrate W immersed in the processing liquid L in the processing tank 110 .

[0120] As shown in FIG. 2( c ), in the substrate processing apparatus 100, the substrate holding unit 120 lifts the held substrate W from the processing liquid L in the processing tank 110. The fluid supply unit 130 ends the supply of the fluid before, at the same time, or after the substrate W is lifted from the processing liquid L in the processing tank 110. In addition, in the case where the substrate W is lifted from the processing liquid L in the processing tank 110 after the supply of the fluid by the fluid supply unit 130 is ended, the processing of the substrate W may also be continued after the supply of the fluid by the fluid supply unit 130 is ended.

[0121] The control unit 140 controls the substrate holding unit 120 to move the substrate holding unit 120 upward until the entire substrate W is lifted from the processing liquid L in the processing tank 110. In addition, the control unit 140 controls the fluid supply unit 130 to end the supply of the fluid by the fluid supply unit 130 before, at the same time, or after the substrate W is lifted from the processing liquid L in the processing tank 110. As described above, the substrate processing is completed.

[0122] As described above, the fluid supply from the fluid supply unit 130 is changed so that the fluid supply Fb is different from the fluid supply Fa. For the fluid supply from the fluid supply unit 130, the position of the fluid supply unit 130 that supplies the fluid may also be different. For example, it may be that: when the fluid supply unit 130 includes a plurality of components that can supply fluids respectively, under the first condition, the fluid is supplied from a certain component of the fluid supply unit 130, and under the second condition, the fluid is supplied from another component of the fluid supply unit 130.

[0123] Alternatively, the outflow from the fluid supply unit 130 may be changed. For example, the outflow of the fluid under the second condition may be different from the outflow of the fluid under the first condition. In one example, the outflow of the fluid under the second condition may be more or less than the outflow of the fluid under the first condition.

[0124] Alternatively, the fluid supply from the fluid supply unit 130 may also be changed by changing the type of the supplied fluid. For example, the main component of the fluid under the second condition may also be different from the main component of the fluid under the first condition. Alternatively, the concentration of the fluid under the second condition may also be different from the concentration of the fluid under the first condition. Alternatively, the additive of the fluid under the second condition may also be different from the additive of the fluid under the first condition.

[0125] Moreover, refer to Figure 2(a) to Figure 2(c) In the above description, the supply of the fluid is changed from the first condition to the second condition, but the present embodiment is not limited thereto. The supply of the fluid may be changed to three or more different conditions.

[0126] According to the substrate processing method of this embodiment, the control unit 140 controls the fluid supply unit 130 to change the supply of fluid while the substrate W is immersed in the processing liquid L in the processing tank 110. Thus, different fluids are supplied to the substrate W, so that the processing of the substrate W can be suppressed.

[0127] As described above, the fluid supply unit 130 may include a plurality of components that can supply fluids separately. In this case, under the first condition, the fluid is supplied from a certain component of the fluid supply unit 130, and under the second condition, the fluid supply unit 130 supplies the fluid from another component.

[0128] Next, refer to Figure 3 A substrate processing apparatus 100 according to this embodiment will be described. Figure 3 It is a schematic diagram of a substrate processing apparatus 100 according to this embodiment. Figure 3 In the substrate processing apparatus 100 shown in FIG. 1 , the fluid supply unit 130 includes a first fluid supply unit 132 and a second fluid supply unit 134. Figure 1 and Figure 2(a) to Figure 2(c) The above-mentioned substrate processing apparatus 100 is similar, so in order to avoid redundancy, repeated description is omitted.

[0129] The substrate processing apparatus 100 includes a processing tank 110, a substrate holding unit 120, a fluid supply unit 130, and a control unit 140. The fluid supply unit 130 includes a first fluid supply unit 132 and a second fluid supply unit 134.

[0130] The first fluid supply unit 132 supplies fluid to the treatment tank 110 storing the treatment liquid L. Furthermore, the second fluid supply unit 134 supplies fluid to the treatment tank 110 storing the treatment liquid L. In addition, the type and flow rate of the fluid of the first fluid supply unit 132 may be different from the type and flow rate of the fluid of the second fluid supply unit 134.

[0131] Here, the substrate W is in a thin, substantially disk-shaped form. The substrate W has a central axis that passes through the center of the substrate W and extends in the normal direction of the main surface. The central axis of the substrate W is parallel to the Y direction.

[0132] Figure 3 , an imaginary center line CL extending in the vertical direction through the center of the substrate W is shown. The imaginary center line CL extends in the Z direction. The imaginary center line CL is the vertical center axis of the substrate W. The imaginary center line CL of the substrate W is orthogonal to the center axis of the substrate W.

[0133] The first fluid supply part 132 and the second fluid supply part 134 are tubular. The first fluid supply part 132 and the second fluid supply part 134 extend parallel to the normal direction of the main surface of the substrate W (Y direction). The first fluid supply part 132 and the second fluid supply part 134 are arranged at the bottom of the processing tank 110. The first fluid supply part 132 and the second fluid supply part 134 are located below the substrate W held by the substrate holding part 120.

[0134] The first fluid supply unit 132 and the second fluid supply unit 134 are arranged at the bottom of the processing tank 110 in a manner of sandwiching the imaginary center line CL. The first fluid supply unit 132 and the second fluid supply unit 134 are arranged approximately symmetrically with respect to the imaginary center line CL when viewed from above. The distance from the imaginary center line CL to the first fluid supply unit 132 is approximately equal to the distance from the imaginary center line CL to the second fluid supply unit 134.

[0135] Next, refer to Figure 4(a) to Figure 4(c) The substrate processing method according to this embodiment will be described. Figure 4(a) to Figure 4(c) It is used to illustrate Figure 3 FIG. 1 is a schematic diagram of a substrate processing method of a substrate processing apparatus 100 shown in FIG.

[0136] As shown in FIG4(a), in the substrate processing apparatus 100, the substrate holding portion 120 immerses the held substrate W in the processing liquid L in the processing tank 110. The fluid supply portion 130 supplies the fluid to the processing tank 110 while the substrate W is immersed in the processing liquid L. Here, the first fluid supply portion 132 supplies the fluid to the processing tank 110. In FIG4(a), the supply of the fluid from the first fluid supply portion 132 to the processing tank 110 is indicated by an arrow Fa.

[0137] The control unit 140 controls the substrate holder 120 to move downward until the entire substrate W is immersed in the processing liquid L in the processing tank 110 . The control unit 140 also controls the fluid supply unit 130 to cause the first fluid supply unit 132 to supply fluid to the processing tank 110 .

[0138] As shown in FIG4(b), in a state where the substrate W held by the substrate holding part 120 is immersed in the processing liquid L in the processing tank 110, the fluid supply part 130 changes the fluid supply to the substrate W. Here, the second fluid supply part 134 supplies the fluid to the processing tank 110. In FIG4(b), the fluid supply from the second fluid supply part 134 to the processing tank 110 is indicated by an arrow Fb. In addition, the second fluid supply part 134 is arranged at a different position from the first fluid supply part 132. Therefore, the fluid supply Fb of the second fluid supply part 134 is different from the fluid supply Fa of the first fluid supply part 132.

[0139] The control unit 140 controls the fluid supply unit 130 to supply the fluid to the processing tank 110 under the second condition while maintaining the entire substrate W immersed in the processing liquid L in the processing tank 110 .

[0140] 4( c ), in the substrate processing apparatus 100 , the substrate holding unit 120 lifts the held substrate W from the processing liquid L in the processing tank 110 . Before, simultaneously with, or after lifting the substrate W from the processing liquid L in the processing tank 110 , the second fluid supply unit 134 ends the supply of the fluid.

[0141] The control unit 140 controls the substrate holding unit 120 to move upward until the substrate W is lifted up from the processing liquid L in the processing tank 110. In addition, the control unit 140 controls the fluid supply unit 130 to end the supply of the fluid by the fluid supply unit 130 before, at the same time, or after the substrate W is lifted up from the processing liquid L in the processing tank 110. As described above, the substrate processing is completed.

[0142] in addition, Figure 4(a) to Figure 4(c) In the substrate processing method shown, one of the first fluid supply unit 132 and the second fluid supply unit 134 supplies fluid to the processing tank 110 , but the present embodiment is not limited thereto.

[0143] Next, refer to Figure 5(a) to Figure 5(d) The substrate processing method according to this embodiment will be described. Figure 5(a) to Figure 5(d) It is a schematic diagram for explaining the substrate processing method according to the present embodiment. Figure 5(a) to Figure 5(d) The substrate processing method shown in FIG. 1 includes a step of simultaneously supplying fluid from the first fluid supply unit 132 and the second fluid supply unit 134. Figure 4(a) to Figure 4(c) The above-mentioned substrate processing method is the same. Therefore, in order to avoid redundancy, repeated description is omitted.

[0144] In FIG. 5( a), as described above with reference to FIG. 4( a), in the substrate processing apparatus 100, the substrate holding unit 120 immerses the held substrate W in the processing liquid L in the processing tank 110. The first fluid supply unit 132 supplies the fluid to the processing tank 110 while the substrate W is immersed in the processing liquid L. In addition, here, the period during which the first fluid supply unit 132 supplies the fluid to the processing tank 110 and the second fluid supply unit 134 does not supply the fluid to the processing tank 110 is sometimes referred to as one supply period.

[0145] In FIG5(c), as described above with reference to FIG4(b), the second fluid supply unit 134 supplies fluid to the processing tank 110 while the substrate W held by the substrate holding unit 120 is immersed in the processing liquid L in the processing tank 110. In addition, here, sometimes the second fluid supply unit 134 supplies fluid to the processing tank 110, and on the other hand, the period during which the first fluid supply unit 132 does not supply fluid to the processing tank 110 is referred to as the other supply period.

[0146] In this embodiment, as shown in FIG5(b), between one supply period (FIG5(a)) and the other supply period (FIG5(c)), the first fluid supply unit 132 and the second fluid supply unit 134 simultaneously supply fluid to the processing tank 110. Here, the period during which the first fluid supply unit 132 and the second fluid supply unit 134 respectively supply fluid to the processing tank 110 is sometimes referred to as a dual supply period.

[0147] For example, during the supply period of both sides, the first fluid supply unit 132 may also supply fluid to the processing tank 110 under the same conditions as during the supply period of one side, and similarly, the second fluid supply unit 134 may also supply fluid to the processing tank 110 under the same conditions as during the supply period of the other side. However, in the case where the first fluid supply unit 132 supplies fluid under the same conditions as during the supply period of one side, and the second fluid supply unit 134 supplies fluid under the same conditions as during the supply period of the other side, if the supply period of both sides is relatively long, the supply amount of the fluid will become excessive, and therefore, the processing liquid L may overflow from the processing tank 110. Therefore, in the case where the first fluid supply unit 132 supplies fluid under the same conditions as during the supply period of one side, and the second fluid supply unit 134 supplies fluid under the same conditions as during the supply period of the other side, it is preferred that the length of the supply period of both sides is shorter than each of the supply period of one side and the supply period of the other side.

[0148] Alternatively, during the dual supply period, the flow rate of the fluid supplied by the first fluid supply unit 132 may be less than during one supply period. Similarly, during the dual supply period, the flow rate of the fluid supplied by the second fluid supply unit 134 may be less than during the other supply period.

[0149] After the other supply period shown in FIG. 5( c ), in FIG. 5( d ), as described above with reference to FIG. 2( c ), in the substrate processing apparatus 100, the substrate holding unit 120 lifts the held substrate W from the processing liquid L in the processing tank 110. Before, simultaneously with, or after lifting the substrate W from the processing liquid L in the processing tank 110, the fluid supply unit 130 ends the supply of the fluid.

[0150] in addition, Figure 3 to Figure 5(d)In the embodiment, the first fluid supply part 132 supplies the fluid from a certain position in the processing tank 110, and the second fluid supply part 134 supplies the fluid from another position in the processing tank 110, but the present embodiment is not limited thereto.

[0151] Next, refer to Figure 6(a) to Figure 6(c) The substrate processing method according to this embodiment will be described. Figure 6(a) to Figure 6(c) It is a schematic diagram for explaining the substrate processing method according to the present embodiment. Figure 6(a) to Figure 6(c) In the substrate processing method shown in FIG. 1 , in the substrate processing apparatus 100, the first fluid supply unit 132 includes a fluid supply pipe 132a and a fluid supply pipe 132b, and the second fluid supply unit 134 includes a fluid supply pipe 134a and a fluid supply pipe 134b. Figure 4(a) to Figure 4(c) The above-mentioned substrate processing method is the same. Therefore, in order to avoid redundancy, repeated description is omitted.

[0152] As shown in Fig. 6(a), in the substrate processing apparatus 100, the fluid supply unit 130 includes a first fluid supply unit 132 and a second fluid supply unit 134. The first fluid supply unit 132 has a fluid supply pipe 132a and a fluid supply pipe 132b, and the second fluid supply unit 134 has a fluid supply pipe 134a and a fluid supply pipe 134b.

[0153] The fluid supply pipe 132a, the fluid supply pipe 132b, the fluid supply pipe 134a, and the fluid supply pipe 134b are respectively arranged at the bottom of the processing tank 110. Here, the fluid supply pipe 132a, the fluid supply pipe 132b, the fluid supply pipe 134a, and the fluid supply pipe 134b extend in parallel with the normal direction of the main surface of the substrate W (Y direction).

[0154] The fluid supply pipe 132a and the fluid supply pipe 132b are arranged approximately symmetrically with respect to the imaginary center line CL when viewed from above. The distance from the imaginary center line CL to the fluid supply pipe 132a is approximately equal to the distance from the imaginary center line CL to the fluid supply pipe 132b. Similarly, the fluid supply pipe 134a and the fluid supply pipe 134b are arranged approximately symmetrically with respect to the imaginary center line CL when viewed from above. The distance from the imaginary center line CL to the fluid supply pipe 134a is approximately equal to the distance from the imaginary center line CL to the fluid supply pipe 134b.

[0155] In the substrate processing apparatus 100, the substrate holding unit 120 immerses the held substrate W in the processing liquid L in the processing tank 110. While the substrate W is immersed in the processing liquid L, the first fluid supply unit 132 supplies fluid to the processing tank 110 from the fluid supply pipe 132a and the fluid supply pipe 132b of the first fluid supply unit 132. In FIG. 6(a), the supply of fluid from the fluid supply pipe 132a and the fluid supply pipe 132b to the processing tank 110 is indicated by arrows Fa.

[0156] The control unit 140 controls the substrate holding unit 120 to move the substrate holding unit 120 downward until the entire substrate W is immersed in the processing liquid L in the processing tank 110. In addition, the control unit 140 controls the fluid supply unit 130 to allow the first fluid supply unit 132 to supply fluid to the processing tank 110 from the fluid supply pipe 132a and the fluid supply pipe 132b.

[0157] As shown in FIG6(b), in a state where the substrate W held by the substrate holding portion 120 is immersed in the processing liquid L in the processing tank 110, the fluid supply portion 130 changes the fluid supply to the substrate W. Here, the second fluid supply portion 134 supplies fluid to the processing tank 110 from the fluid supply pipe 134a and the fluid supply pipe 134b. In FIG6(b), the fluid supply from the second fluid supply portion 134 to the processing tank 110 is indicated by an arrow Fb. In addition, the fluid supply pipe 134a and the fluid supply pipe 134b are arranged at a different position from the fluid supply pipe 132a and the fluid supply pipe 132b. Therefore, the fluid supply Fb performed from the fluid supply pipe 134a and the fluid supply pipe 134b is different from the fluid supply Fa performed from the fluid supply pipe 132a and the fluid supply pipe 132b.

[0158] As shown in FIG6(c), in the substrate processing apparatus 100, the substrate holding unit 120 lifts the held substrate W from the processing liquid L in the processing tank 110. Before, simultaneously with, or after the substrate W is lifted from the processing liquid L in the processing tank 110, the second fluid supply unit 134 ends the supply of the fluid. As described above, the substrate processing is completed.

[0159] In the description referred to Figure 2(a) to Figure 2(c) and Figure 4(a) to Figure 6(c) In the embodiment, the fluid supply unit 130 supplies the fluid to the processing tank 110 while the substrate W is immersed in the processing liquid L in the processing tank 110. In addition, the timing at which the fluid supply unit 130 starts to supply the fluid may be earlier than the timing at which the substrate W starts to be immersed in the processing liquid L in the processing tank 110.

[0160] Next, refer to Figure 7(a) to Figure 7(d) The substrate processing method according to this embodiment will be described. Figure 7(a) to Figure 7(d)Schematic diagram for explaining the substrate processing method of this embodiment. Figure 7(a) to Figure 7(d) In the substrate processing method described above, after the fluid supply unit 130 starts supplying the fluid, the substrate W starts to be immersed in the processing liquid L in the processing tank 110. Figure 4(a) to Figure 4(c) The above-mentioned substrate processing method is the same. Therefore, in order to avoid redundancy, repeated description is omitted.

[0161] As shown in FIG. 7( a), in the substrate processing apparatus 100, before the substrate W held by the substrate holding portion 120 is immersed in the processing liquid L in the processing tank 110, the fluid supply portion 130 supplies the fluid to the processing tank 110. Here, the first fluid supply portion 132 supplies the fluid to the processing tank 110. The control portion 140 controls the fluid supply portion 130 so that the first fluid supply portion 132 supplies the fluid to the processing tank 110. In FIG. 7( a), the supply of the fluid from the first fluid supply portion 132 to the processing tank 110 is indicated by an arrow Fa.

[0162] As shown in FIG7(b), in the processing tank 110 of the substrate processing apparatus 100, the substrate W held by the substrate holding part 120 is immersed in the processing liquid L to which the fluid supply part 130 starts to supply the fluid. The control part 140 controls the substrate holding part 120 so that the substrate holding part 120 moves downward until the entire substrate W is immersed in the processing liquid L in the processing tank 110.

[0163] In FIG. 7C , as described above with reference to FIG. 4B , the second fluid supply unit 134 supplies fluid to the processing tank 110 while the substrate W held by the substrate holding unit 120 is immersed in the processing liquid L in the processing tank 110 .

[0164] In FIG. 7( d ), as described above with reference to FIG. 4( c ), in the substrate processing apparatus 100 , the substrate W held by the substrate holding portion 120 is lifted from the processing liquid L in the processing tank 110 . Before, simultaneously with, or after the substrate W is lifted from the processing liquid L in the processing tank 110 , the second fluid supply portion 134 ends the supply of the fluid. As described above, the substrate processing is completed.

[0165] Reference Figure 7(a) to Figure 7(d) In the substrate processing method, the fluid supply unit 130 starts supplying the fluid before immersing the substrate W in the processing liquid L. Therefore, the processing of the substrate W using the fluid can be started at the timing of immersing the substrate W in the processing liquid L, thereby shortening the processing time.

[0166] In addition, in reference Figure 7(a) to Figure 7(d)In the above description, the timing when the fluid supply unit 130 starts to supply the fluid is earlier than the timing when the substrate W starts to be immersed in the processing liquid L in the processing tank 110, but the present embodiment is not limited to this. The timing when the substrate W starts to be immersed in the processing liquid L in the processing tank 110 may also be earlier than the timing when the fluid supply unit 130 starts to supply the fluid.

[0167] Next, refer to Figure 8(a) to Figure 8(d) The substrate processing method according to this embodiment will be described. Figure 8(a) to Figure 8(d) Schematic diagram for explaining the substrate processing method of this embodiment. Figure 8(a) to Figure 8(d) In the substrate processing method described above, after the substrate W is immersed in the processing liquid L in the processing tank 110, the fluid supply unit 130 starts to supply the fluid. Figure 4(a) to Figure 4(c) The above-mentioned substrate processing method is the same. Therefore, in order to avoid redundancy, repeated description is omitted.

[0168] 8(a), in the substrate processing apparatus 100, the substrate W held by the substrate holding part 120 is immersed in the processing liquid L in the processing tank 110. The control part 140 controls the substrate holding part 120 to move the substrate holding part 120 downward until the entire substrate W is immersed in the processing liquid L in the processing tank 110.

[0169] Subsequently, as shown in FIG8(b), the fluid supply unit 130 supplies the fluid to the processing tank 110 while the substrate W is immersed in the processing liquid L. Here, the first fluid supply unit 132 supplies the fluid to the processing tank 110. In FIG8(b), the supply of the fluid from the first fluid supply unit 132 to the processing tank 110 is indicated by an arrow Fa.

[0170] In FIG. 8C , as described above with reference to FIG. 4B , the second fluid supply unit 134 supplies fluid to the processing tank 110 while the substrate W held by the substrate holding unit 120 is immersed in the processing liquid L in the processing tank 110 .

[0171] 8( d ), as described above with reference to FIG. 4( c ), in the substrate processing apparatus 100 , the substrate W held by the substrate holding portion 120 is lifted from the processing liquid L in the processing tank 110 . Before, simultaneously with, or after the substrate W is lifted from the processing liquid L in the processing tank 110 , the second fluid supply portion 134 ends the supply of the fluid.

[0172] The control unit 140 controls the substrate holding unit 120 to move upward until the substrate W is lifted up from the processing liquid L in the processing tank 110. In addition, the control unit 140 controls the fluid supply unit 130 to end the supply of the fluid by the fluid supply unit 130 before, at the same time, or after the substrate W is lifted up from the processing liquid L in the processing tank 110. As described above, the substrate processing of this embodiment is completed.

[0173] In reference Figure 8(a) to Figure 8(d) In the present embodiment, the fluid supply unit 130 starts supplying the fluid after the substrate W is immersed in the processing liquid L. Therefore, the fluid supply starts after the substrate W has completed moving in the processing liquid L. Therefore, even if the processing liquid L in the processing tank 110 is relatively greatly shaken due to the supply of the fluid, since the substrate W is stopped during the supply of the fluid, it is possible to suppress the processing liquid L from overflowing from the processing tank 110.

[0174] In addition, in reference Figure 7(a) to Figure 7(d) and Figure 8(a) to Figure 8(d) In the description of FIG. 1 , one of the timing when the substrate W starts to be immersed in the processing liquid L in the processing tank 110 and the timing when the fluid supply unit 130 starts to supply the fluid is earlier than the other, but the present embodiment is not limited thereto. The timing when the substrate W starts to be immersed in the processing liquid L in the processing tank 110 and the timing when the fluid supply unit 130 starts to supply the fluid may also be substantially the same time.

[0175] in addition, Figure 1 to Figure 8(d) In the substrate processing apparatus 100 shown, the fluid supply unit 130 is disposed at the same position, but the present embodiment is not limited thereto. The fluid supply unit 130 may be movable within the processing tank 110 .

[0176] Next, refer to Figure 9(a) to Figure 9(c) The substrate processing method according to this embodiment will be described. Figure 9(a) to Figure 9(c) Schematic diagram for explaining the substrate processing method of this embodiment. Figure 9(a) to Figure 9(c) The substrate processing method described is similar to that of the reference except that the fluid supply unit 130 moves. Figure 1 The above-mentioned substrate processing method is the same. Therefore, in order to avoid redundancy, repeated description is omitted.

[0177] As shown in FIG9(a), in the substrate processing apparatus 100, the substrate holding unit 120 immerses the held substrate W in the processing liquid L in the processing tank 110. The fluid supply unit 130 supplies the fluid to the processing tank 110 while the substrate W is immersed in the processing liquid L. Here, the fluid supply unit 130 is located at a first position in the processing tank 110, and the fluid supply unit 130 supplies the fluid to the processing liquid L from the first position.

[0178] The control unit 140 can control the position of the fluid supply unit 130. For example, the fluid supply unit 130 moves along the X direction and / or the Y direction at the bottom of the processing tank 110 under the control of the control unit 140. In addition, the control unit 140 controls the fluid supply unit 130 so that the fluid supply unit 130 supplies the fluid to the processing tank 110.

[0179] As shown in FIG9(b), in a state where the substrate W held by the substrate holding part 120 is immersed in the processing liquid L in the processing tank 110, the fluid supply part 130 changes the fluid supply to the substrate W. Here, the fluid supply part 130 continues to supply the fluid while moving from the first position to the second position. Thus, the fluid supplied from the fluid supply part 130 at different positions contacts the substrate W, so that the wide surface of the substrate W can be processed uniformly.

[0180] The control unit 140 controls the fluid supply unit 130 to move the fluid supply unit 130 in the processing tank 110 and to supply the fluid to the processing tank 110 while maintaining the substrate W as a whole immersed in the processing liquid L in the processing tank 110. Here, the control unit 140 controls the fluid supply unit 130 to move from below one end portion of the substrate W in the X direction to below the other end portion of the substrate W in the X direction. In addition, the control unit 140 may also control the fluid supply unit 130 to reciprocate between below both ends of the substrate W in the X direction.

[0181] As shown in FIG9(c), in the substrate processing apparatus 100, the substrate holding unit 120 lifts the held substrate W from the processing liquid L in the processing tank 110. Before, simultaneously with, or after the substrate W is lifted from the processing liquid L in the processing tank 110, the fluid supply unit 130 ends the supply of the fluid. As described above, the substrate processing is completed.

[0182] in addition, Figure 9(a) to Figure 9(c) In the substrate processing method shown, one fluid supply unit 130 moves, but the present embodiment is not limited thereto. One fluid supply unit 130 may include a plurality of components that supply fluids respectively, and the plurality of components may move respectively.

[0183] Next, refer to Fig.10 A substrate processing apparatus 100 according to this embodiment will be described. Fig.10 2 is a schematic diagram of a substrate processing apparatus 100 according to the present embodiment. The substrate processing apparatus 100 according to the present embodiment processes a plurality of substrates W at once. For example, the substrate processing apparatus 100 etches a plurality of substrates W at once.

[0184] The substrate processing apparatus 100 of the present embodiment includes a processing tank 110, a substrate holding portion 120, a fluid supply portion 130, and a control portion 140. The processing tank 110 stores a processing liquid L. For example, the processing liquid L includes an etching liquid. The substrate holding portion 120 holds a substrate W. The substrate holding portion 120 includes a lifter. Through the substrate holding portion 120, a plurality of substrates W can be uniformly immersed in the processing liquid L stored in the processing tank 110. Here, the fluid supply portion 130 supplies gas as a fluid to the processing tank 110 storing the processing liquid L.

[0185] The substrate processing apparatus 100 further includes a gas transport unit 150 and a circulation unit 160. The gas transport unit 150 transports gas to the fluid supply unit 130. The circulation unit 160 circulates the processing liquid L stored in the processing tank 110.

[0186] The substrate processing apparatus 100 further includes a processing liquid supply unit 170 and a water supply unit 180. The processing liquid supply unit 170 supplies the processing liquid to the processing tank 110. The water supply unit 180 supplies water to the processing tank 110. The control unit 140 controls the substrate holding unit 120, the fluid supply unit 130, the circulation unit 160, the processing liquid supply unit 170, and the water supply unit 180.

[0187] The processing tank 110 has a double tank structure including an inner tank 112 and an outer tank 114. The inner tank 112 and the outer tank 114 each have an upper opening that is open upward. The inner tank 112 stores the processing liquid L and is configured to accommodate a plurality of substrates W. The outer tank 114 is provided on the outer side of the upper opening of the inner tank 112. The upper edge height of the outer tank 114 is higher than the upper edge height of the inner tank 112.

[0188] The inner groove 112 is provided with a limiting portion 112a. The limiting portion 112a is provided at both ends of the substrate W in the X direction when the substrate W is processed so as to face the two main surfaces of a substrate W. The position of the substrate W is limited by the limiting portion 112a. Therefore, the substrate W is processed uniformly at a predetermined position.

[0189] The processing tank 110 further includes a cover 116. The cover 116 can be opened and closed relative to the upper opening of the inner tank 112. When the cover 116 is closed, the upper opening of the inner tank 112 can be closed.

[0190] The cover 116 has an opening portion 116a and an opening portion 116b. The opening portion 116a is located on the -X direction side of the upper opening of the inner tank 112. The opening portion 116a is arranged near the upper edge of the inner tank 112 and can be opened and closed relative to the upper opening of the inner tank 112. The opening portion 116b is located on the +X direction side of the upper opening of the inner tank 112. The opening portion 116b is arranged near the upper edge of the inner tank 112 and can be opened and closed relative to the upper opening of the inner tank 112. By closing the opening portions 116a and 116b to cover the upper opening of the inner tank 112, the inner tank 112 of the processing tank 110 can be closed.

[0191] A drain pipe 118a is connected to the bottom wall of the inner tank 112. A valve 118b is disposed on the drain pipe 118a. The valve 118b is opened and closed by the control unit 140. When the valve 118b is opened, the treatment liquid stored in the inner tank 112 is discharged to the outside through the drain pipe 118a. The discharged treatment liquid is sent to a drainage treatment device (not shown) and treated.

[0192] The substrate holding part 120 holds the substrate W. The substrate holding part 120 moves vertically upward or vertically downward while holding the substrate W. When the substrate holding part 120 moves vertically downward, the substrate W held by the substrate holding part 120 is immersed in the processing liquid L stored in the inner tank 112 .

[0193] The substrate holding portion 120 includes a main body plate 122 and holding rods 124. The main body plate 122 is a plate extending in the vertical direction (Z direction). The holding rods 124 extend from one of the main surfaces of the main body plate 122 in the horizontal direction (Y direction). Here, three holding rods 124 extend from one of the main surfaces of the main body plate 122 in the Y direction. When the plurality of substrates W are arranged in the depth-forward direction of the paper, the plurality of holding rods 124 abut against the lower edge of each substrate W and are held in an upright position (vertical position).

[0194] The substrate holding portion 120 may further include a lifting unit 126. The lifting unit 126 is used to position the substrate W held by the substrate holding portion 120 at a processing position ( Fig.10 The main plate 122 is raised and lowered between the position shown in the figure) and the retreat position (not shown) where the substrate W held by the substrate holding portion 120 is located above the inner tank 112. Therefore, the main plate 122 is moved to the processing position by the lifting unit 126, thereby immersing the plurality of substrates W held by the holding rods 124 in the processing liquid. Thus, the etching process of the substrate W is performed.

[0195] The fluid supply unit 130 is disposed in the processing tank 110. Here, the fluid supply unit 130 is disposed at the bottom of the inner tank 112 of the processing tank 110. The fluid supply unit 130 is disposed in the processing liquid L stored in the inner tank 112.

[0196] Here, the fluid supply part 130 includes a first fluid supply part 132 and a second fluid supply part 134. The first fluid supply part 132 includes a fluid supply pipe 132a and a fluid supply pipe 132b, and the second fluid supply part 134 includes a fluid supply pipe 134a and a fluid supply pipe 134b. The fluid supply pipe 132a, the fluid supply pipe 132b, the fluid supply pipe 134a and the fluid supply pipe 134b supply gas as fluid to the processing tank 110. The gas is, for example, an inert gas. In one example, the gas includes nitrogen. Alternatively, the gas may also be air. Gas is supplied to the processing tank 110 from the fluid supply pipe 132a and the fluid supply pipe 132b at the same time. Moreover, gas is supplied to the processing tank 110 from the fluid supply pipe 134a and the fluid supply pipe 134b at the same time.

[0197] The gas transport unit 150 includes a pipe 152, a valve 154, and an adjustment valve 156. The valve 154 and the adjustment valve 156 are disposed on the pipe 152. The pipe 152 is connected to the fluid supply unit 130. The pipe 152 guides the gas to the fluid supply unit 130 in the processing tank 110. The valve 154 opens and closes the pipe 152. The opening of the pipe 152 is adjusted by the adjustment valve 156 to adjust the flow rate of the gas transported to the fluid supply unit 130.

[0198] in addition, Fig.10 In order to avoid the drawing becoming overly complicated, one valve 154 and one regulating valve 156 are shown, but a plurality of valves 154 and regulating valves 156 may be provided. Thus, the amount of gas supplied to the fluid supply pipe 132a, the fluid supply pipe 132b, the fluid supply pipe 134a, and the fluid supply pipe 134b can be appropriately adjusted.

[0199] The processing tank 110 is provided with a liquid supply unit 168. The liquid supply unit 168 supplies liquid to the inner tank 112 of the processing tank 110. Typically, the liquid supply unit 168 supplies the same type of processing liquid as the processing liquid L stored in the inner tank 112.

[0200] Here, the liquid supply unit 168 includes a plurality of liquid supply pipes 168a and a plurality of liquid supply pipes 168b. The liquid supply pipes 168a and the liquid supply pipes 168b are arranged at different positions.

[0201] The circulation unit 160 includes a pipe 161, a pump 162, a filter 163, a heater 164, an adjustment valve 165, and a valve 166. The pump 162, the filter 163, the heater 164, the adjustment valve 165, and the valve 166 are arranged in this order from the upstream to the downstream of the pipe 161.

[0202] The pipe 161 guides the processing liquid discharged from the processing tank 110 back to the processing tank 110. To the downstream end of the pipe 161, a liquid supply pipe 168a and a liquid supply pipe 168b are connected.

[0203] The pump 162 sends the processing liquid to the liquid supply pipe 168a and the liquid supply pipe 168b from the pipe 161. The filter 163 filters the processing liquid flowing through the pipe 161. The heater 164 heats the processing liquid flowing through the pipe 161. The heater 164 adjusts the temperature of the processing liquid.

[0204] The regulating valve 165 adjusts the opening of the piping 161 to adjust the flow rate of the processing liquid supplied to the liquid supply pipe 168a and the liquid supply pipe 168b. The regulating valve 165 adjusts the flow rate of the processing liquid. The regulating valve 165 includes a valve body (valve body) (not shown) with a valve seat provided inside, a valve body for opening and closing the valve seat, and an actuator (actuator) (not shown) for moving the valve body between an open position and a closed position. The same is true for other regulating valves. The valve 166 opens and closes the piping 161.

[0205] In addition, the regulating valve 165 may be omitted. In this case, the flow rate of the processing liquid supplied to the liquid supply pipe 168 a and the liquid supply pipe 168 b is adjusted by controlling the pump 162 .

[0206] The processing liquid supply unit 170 includes a nozzle 172, a pipe 174, and a valve 176. The nozzle 172 sprays the processing liquid into the inner tank 112. The nozzle 172 is connected to the pipe 174. The processing liquid is supplied from the processing liquid supply source to the pipe 174. The valve 176 is disposed on the pipe 174.

[0207] When the control unit 140 opens the valve 176, the processing liquid sprayed from the nozzle 172 is supplied to the inner tank 112. When the processing liquid overflows from the upper edge of the inner tank 112, the overflowed processing liquid is blocked by the outer tank 114 and recovered.

[0208] The water supply unit 180 includes a nozzle 182, a pipe 184, and a valve 186. The nozzle 182 sprays water into the outer tank 114. The nozzle 182 is connected to the pipe 184. The water supplied to the pipe 184 can be any one of deionized water (DIW), carbonated water, electrolytic ion water, hydrogen water, ozone water, and hydrochloric acid water of a diluted concentration (e.g., about 10ppm to 100ppm). The pipe 184 is supplied with water from a water supply source. The pipe 184 is provided with a valve 186. When the control unit 140 opens the valve 186, the water sprayed from the nozzle 182 is supplied to the outer tank 114.

[0209] For example, the substrate processing apparatus 100 performs etching processing of a silicon oxide film (oxide film) and a silicon nitride film (nitride film) on the surface of the pattern forming side of the substrate W including the silicon substrate. In such etching processing, the oxide film and the nitride film are selectively removed from the surface of the substrate W. For example, when an aqueous solution of phosphoric acid (H3PO4) (hereinafter referred to as "phosphoric acid") is used as the processing liquid supplied to the pipe 174, the nitride film is removed from the surface of the substrate W.

[0210] The fluid supply unit 130 generates bubbles in the processing liquid L in the inner tank 112 . Gas is supplied from the inert gas supply source through the pipe 152 and from the fluid supply unit 130 to the processing liquid L in the inner tank 112 .

[0211] The fluid supply unit 130 includes a first fluid supply unit 132 and a second fluid supply unit 134. The first fluid supply unit 132 includes a fluid supply pipe 132a and a fluid supply pipe 132b, and the second fluid supply unit 134 includes a fluid supply pipe 134a and a fluid supply pipe 134b. In addition, a plurality of bubble ejection ports G are formed in the fluid supply pipe 132a, the fluid supply pipe 132b, the fluid supply pipe 134a, and the fluid supply pipe 134b. A valve 154 and an adjustment valve 156 are arranged in the piping 152 of the gas transport unit 150. The valve 154 opens and closes the piping 152. The adjustment valve 156 adjusts the opening of the piping 152 to adjust the flow rate of the inactive gas supplied to the fluid supply pipe 132a, the fluid supply pipe 132b, the fluid supply pipe 134a, and the fluid supply pipe 134b.

[0212] The fluid supply pipe 132a is located between the liquid supply pipe 168a and the imaginary center line CL. Therefore, the fluid from the fluid supply pipe 132a will be supplied to the central part of the substrate W, so that a large area of ​​the substrate W can be efficiently processed. Similarly, the fluid supply pipe 132b is located between the liquid supply pipe 168b and the imaginary center line CL. Therefore, the fluid from the fluid supply pipe 132b will be supplied to the central part of the substrate W, so that a large area of ​​the substrate W can be efficiently processed.

[0213] For example, the first fluid supply unit 132 supplies fluid from the fluid supply pipe 132a and the fluid supply pipe 132b of the first fluid supply unit 132 to the processing tank 110 while the substrate W is immersed in the processing tank 110. Subsequently, while the substrate W held by the substrate holding unit 120 is immersed in the processing liquid L in the processing tank 110, the fluid supply from the fluid supply pipe 132a and the fluid supply pipe 132b is terminated, and the second fluid supply unit 134 supplies fluid to the processing tank 110 from the fluid supply pipe 134a and the fluid supply pipe 134b.

[0214] The control unit 140 is configured using, for example, a microcomputer. The control unit 140 includes a computing unit such as a central processing unit (CPU), a fixed memory element, a storage unit such as a hard disk drive, and an input / output unit. The storage unit stores a program executed by the computing unit.

[0215] The control unit 140 controls the operation of the lifting unit 126, the pump 162, the heater 164, etc. according to a predetermined program. In addition, the control unit 140 controls the opening and closing operations of the valve 118b, the valve 154, the valve 166, the valve 176, the valve 186, etc. Furthermore, the control unit 140 controls the opening adjustment operation of the adjustment valve 156, the adjustment valve 165, etc.

[0216] Next, the substrate processing apparatus 100 before and after the substrate W is immersed in the processing tank 110 will be described with reference to FIG. 11(a) and FIG. 11(b). FIG. 11(a) and FIG. 11(b) are schematic three-dimensional views of the substrate processing apparatus 100 of the present embodiment before and after the substrate W is put into the processing tank 110. In addition, in order to avoid making the drawings too complicated, the Fig.10 The cover 116 and the processing liquid L in the processing tank 110 are shown.

[0217] As shown in FIG11( a ), the substrate holding unit 120 holds a plurality of substrates W. The plurality of substrates W are arranged in a row along the horizontal direction (Y direction). For example, the substrate holding unit 120 holds 50 substrates W.

[0218] In FIG. 11( a ), the substrate holding portion 120 is located above the inner tank 112 of the processing tank 110 . The length of the body plate 122 in the X direction is slightly shorter than the length of the inner tank 112 of the processing tank 110 in the X direction. The substrate holding portion 120 is lowered vertically downward (in the Z direction) while holding a plurality of substrates W. Thus, the substrates W are put into the processing tank 110 .

[0219] As shown in FIG. 11( b ), when the substrate holding portion 120 is lowered to the processing tank 110, the substrate W is immersed in the processing liquid in the processing tank 110. In addition, although not shown in FIG. 11( a ) and FIG. 11( b ), as shown in FIG. Fig.10 As shown, the upper opening of the inner tank 112 is closed by a cover 116 .

[0220] Next, refer to Fig.12 ,right Fig.10 The structures of the first fluid supply unit 132, the second fluid supply unit 134, and the liquid supply unit 168 in the processing tank 110 of the substrate processing apparatus 100 shown in Figures 11(a) and 11(b) will be described. Fig.12 Yes means Fig.10 1 is a schematic plan view of the bottom of the inner tank 112 included in the substrate processing apparatus 100 shown. Fig.12 , a situation where the virtual center lines CL of a plurality of substrates W are continuous is shown.

[0221] like Fig.12 As shown, the liquid supply unit 168 includes a liquid supply pipe 168a and a liquid supply pipe 168b. The liquid supply pipe 168a and the liquid supply pipe 168b are respectively arranged in the following manner, that is, when viewed from above, the liquid supply pipe 168a and the liquid supply pipe 168b are sandwiched by the substrate holding unit 120 (see Fig.10 ) and extending in the Y direction from the center of the substrate W held by the inner tank 112. The liquid supply pipe 168a and the liquid supply pipe 168b are provided at the bottom of the inner tank 112 and extend in the horizontal direction along the arrangement direction (Y direction) of the substrates W. The liquid supply pipe 168a and the liquid supply pipe 168b are formed using cylindrical pipes.

[0222] like Fig.12 As shown, the liquid supply unit 168 is provided with a processing liquid outlet P. The liquid of the liquid supply unit 168 is supplied into the processing tank 110 from the processing liquid outlet P. The processing liquid outlet P is at the bottom of the inner tank 112 and discharges the processing liquid L toward the upper part of the inner tank 112.

[0223] The processing liquid outlet P includes an outlet Pa provided in the liquid supply pipe 168a, and an outlet Pb provided in the liquid supply pipe 168b. The outlet Pa and the outlet Pb are arranged in one or more rows (one row in the present embodiment) along the arrangement direction of the substrates W. The outlet Pa and the outlet Pb are arranged in such a manner that they are arranged one by one between the substrates W when viewed from above, and the processing liquid is supplied between the substrates W. The outlet Pa and the outlet Pb are arranged with the same interval as the interval between the substrates W. The outlet Pa and the outlet Pb are formed by opening holes in the tube walls of the liquid supply pipe 168a and the liquid supply pipe 168b, respectively. The outlet Pa and the outlet Pb are symmetrically arranged with respect to the imaginary center line CL. When the valve 166 ( Fig.10 ) is driven, the processing liquid is ejected from each ejection port Pa and the ejection port Pb at the ejection flow rate adjusted by the adjustment valve 165.

[0224] Here, the first fluid supply unit 132 includes a fluid supply pipe 132a and a fluid supply pipe 132b located at separate locations, and the second fluid supply unit 134 includes a fluid supply pipe 134a and a fluid supply pipe 134b located at separate locations.

[0225] When viewed from above, the fluid supply pipe 132a and the fluid supply pipe 132b are arranged between the liquid supply pipe 168a and the liquid supply pipe 168b. Therefore, the fluid supply pipe 132a and the fluid supply pipe 132b are also referred to as inner pipes. On the other hand, when viewed from above, the fluid supply pipe 134a is arranged on the opposite side of the inner pipe relative to the liquid supply pipe 168a. Similarly, the fluid supply pipe 134b is arranged on the opposite side of the inner pipe relative to the liquid supply pipe 168b. Therefore, the fluid supply pipe 134a and the fluid supply pipe 134b are also referred to as outer pipes.

[0226] In addition, the fluid supply pipe 132a and the fluid supply pipe 132b are respectively arranged in a manner of sandwiching the imaginary center line CL when viewed from above. The fluid supply pipe 132a and the fluid supply pipe 132b are arranged roughly symmetrically with respect to the imaginary center line CL when viewed from above. The distance from the imaginary center line CL to the fluid supply pipe 132a is roughly equal to the distance from the imaginary center line CL to the fluid supply pipe 132b. Similarly, the fluid supply pipe 134a and the fluid supply pipe 134b are arranged roughly symmetrically with respect to the imaginary center line CL when viewed from above. The distance from the imaginary center line CL to the fluid supply pipe 134a is roughly equal to the distance from the imaginary center line CL to the fluid supply pipe 134b.

[0227] The fluid supply pipes 132a, 132b, 134a, and 134b are provided at the bottom of the inner tank 112 (i.e., below the substrate W held by the substrate holding portion 120), respectively, along the arrangement direction of the substrates W ( Fig.12 The fluid supply pipe 132a, the fluid supply pipe 132b, the fluid supply pipe 134a, and the fluid supply pipe 134b are formed using cylindrical pipes (for example, made of quartz).

[0228] like Fig.12 As shown, the first fluid supply unit 132 and the second fluid supply unit 134 are provided with bubble ejection ports G. Gases of the first fluid supply unit 132 and the second fluid supply unit 134 are supplied from the bubble ejection ports G into the processing liquid L in the processing tank 110, so that bubbles are formed in the processing liquid L. When the control unit 140 opens the valve 154, bubbles are ejected from each bubble ejection port G at an ejection flow rate adjusted by the adjustment valve 156.

[0229] The bubble ejection port G includes an ejection port Ga provided in the fluid supply pipe 134a, an ejection port Gb provided in the fluid supply pipe 134b, an ejection port Gc provided in the fluid supply pipe 132a, and an ejection port Gd provided in the fluid supply pipe 132b. The ejection ports Ga to Gd are arranged in one or more rows (one row in the present embodiment) along the arrangement direction of the substrates W. The ejection ports Ga to Gd are arranged in the following manner, that is, they are arranged one by one between the substrates W when viewed from above, and bubbles are supplied between the substrates W. The ejection ports Ga to Gd are arranged with the same spacing as between the substrates W.

[0230] The jet outlet Ga to the jet outlet Gd are formed by opening holes in the tube walls of the fluid supply tubes 132a to 134b, respectively. The tube diameter of each fluid supply tube 132a to 134b is, for example, about 8.0 mm, and the diameter of each jet outlet Ga to the jet outlet Gd is, for example, about 0.3 mm. In addition, when the fluid supply tubes 132a to 134b supply gas as a fluid, bubbles are generated from the jet outlet Ga to the jet outlet Gd of the fluid supply tubes 132a to 134b. The diameter of the bubbles ejected from the jet outlet Ga to the jet outlet Gd (bubble diameter) is in the range of about 2.0 mm to about 3.5 mm. It can be considered that the smaller the bubble diameter, the greater the degree of stirring of the processing liquid near the surface of the substrate W by the bubbles, so it is preferred that the bubble diameter is small.

[0231] The ejection port Ga and the ejection port Gb are provided symmetrically with respect to the imaginary center line CL. Furthermore, the ejection port Gc and the ejection port Gd are provided symmetrically with respect to the imaginary center line CL.

[0232] In addition, when the substrate processing apparatus 100 processes the substrate W, the substrate processing apparatus 100 closes the cover 116 ( Fig.10 ) is opened, the substrate holding portion 120 immerses the substrate W in the processing tank 110, and then closes the cover 116 ( Fig.10 ), and the first fluid supply unit 132 and the second fluid supply unit 134 start supplying gas. In particular, when the substrate processing apparatus 100 supplies gas to the substrate W, the gas supply is started in a state where the cover 116 is closed, thereby preventing the processing liquid L from overflowing from the processing tank 110.

[0233] The substrate processing apparatus 100 of this embodiment supplies gas as fluid from the fluid supply pipes 132a and 132b of the first fluid supply unit 132 during a certain period. Also, supplies gas as fluid from the fluid supply pipes 134a and 134b of the second fluid supply unit 134 during another period. In addition, the liquid supply unit 168 can continuously supply liquid from the liquid supply pipes 168a and 168b regardless of the period.

[0234] Next, refer to Fig.13 A substrate processing apparatus 100 according to this embodiment will be described. Fig.13 1 is a schematic top view of the first fluid supply unit 132, the second fluid supply unit 134, and the liquid supply unit 168 in the substrate processing apparatus 100 of the present embodiment. Fig.13 In the substrate processing apparatus 100 shown in FIG. 1 , the ejection ports Ga to Gd of the fluid supply pipes 132a to 134b and the ejection ports Pa and Pb of the liquid supply pipes 168a and 168b are provided for each of the plurality of substrates W arranged in a row. Fig.12 The above-mentioned substrate processing apparatus 100 is similar, so in order to avoid redundancy, repeated description is omitted.

[0235] Fig.13 In the embodiment, a plurality of substrates W of the same type are arranged in a row along the Y direction. Adjacent substrates W face each other with the same surfaces facing each other.

[0236] The substrate W has a principal surface Wa and a principal surface Wb. The principal surface Wa is the front surface of the substrate, and the principal surface Wb is the back surface of the substrate W. Here, the principal surfaces Wa of the adjacent and opposing substrates W are opposite to each other, and the principal surfaces Wb of the adjacent and opposing substrates W are opposite to each other.

[0237] like Fig.13As shown, the bubble ejection port G includes an ejection port Ga provided in the fluid supply pipe 134a, an ejection port Gb provided in the fluid supply pipe 134b, an ejection port Gc provided in the fluid supply pipe 132a, and an ejection port Gd provided in the fluid supply pipe 132b. The ejection ports Ga to Gd are arranged in one or more rows (one row in this embodiment) along the X direction. Moreover, the ejection ports Ga to Gd and the ejection ports Pa and Pb are arranged every other one along the arrangement direction (Y direction) of the substrate W.

[0238] The jet outlet Ga, the jet outlet Gb, the jet outlet Gc, and the jet outlet Gd are provided in such a manner that, when viewed from above, they are arranged one by one between two substrates W whose main surfaces Wa are opposite to each other, and a processing liquid is supplied between the substrates W. On the other hand, the jet outlet Ga, the jet outlet Gb, the jet outlet Gc, and the jet outlet Gd are not provided between two substrates W whose main surfaces Wb are opposite to each other when viewed from above. For example, the jet outlet Ga, the jet outlet Gb, the jet outlet Gc, and the jet outlet Gd are provided in such a manner that, when viewed from above, they are arranged one by one between substrates W1 and W2 whose main surfaces Wa are opposite to each other, and a processing liquid is supplied between the substrates W. On the other hand, the jet outlet Ga, the jet outlet Gb, the jet outlet Gc, and the jet outlet Gd are not provided between substrates W2 and W3 whose main surfaces Wb are opposite to each other when viewed from above.

[0239] Similarly, the processing liquid discharge port P includes a discharge port Pa provided in the liquid supply pipe 168a and a discharge port Pb provided in the liquid supply pipe 168b. The discharge ports Pa and Pb are arranged every other one along the arrangement direction of the substrates W (Y direction).

[0240] The ejection port Pa and the ejection port Pb are provided in such a manner that, when viewed from above, they are arranged one by one between two substrates W whose main surfaces Wa are opposite to each other, and the processing liquid is supplied between the substrates W. On the other hand, the ejection port Pa and the ejection port Pb are not provided between two substrates W whose main surfaces Wb are opposite to each other when viewed from above. For example, the ejection port Pa and the ejection port Pb are provided in such a manner that, when viewed from above, they are arranged one by one between substrates W1 and W2 whose main surfaces Wa are opposite to each other, and the processing liquid is supplied between the substrates W. On the other hand, the ejection port Pa and the ejection port Pb are not provided between substrates W2 and W3 whose main surfaces Wb are opposite to each other when viewed from above.

[0241] Fig.13In the substrate processing apparatus 100 shown, the nozzles Pa, Pb and the nozzles Ga, Gb, Gc and Gd are arranged between two substrates W with opposite main surfaces Wa, and are not arranged between two substrates W with opposite main surfaces Wb. For example, when the flow rate flowing through the fluid supply pipe 132a, the fluid supply pipe 132b, the fluid supply pipe 134a and the fluid supply pipe 134b is fixed, the number of nozzles Ga, Gb, Gc and Gd is small, thereby increasing the amount of fluid ejected from the nozzles Ga, Gb, Gc and Gd. Similarly, when the flow rate flowing through the liquid supply pipe 168a and the liquid supply pipe 168b is fixed, the number of nozzles Pa and Pb is small, thereby increasing the amount of liquid ejected from the nozzles Pa and Pb. Therefore, a specific surface of the substrate W can be processed efficiently.

[0242] Next, refer to Fig.14 A substrate processing apparatus 100 according to this embodiment will be described. Fig.14 It is a schematic side view of the processing tank 110 in the substrate processing apparatus 100 according to the present embodiment.

[0243] The processing tank 110 is provided with a fluid supply pipe 132a, a fluid supply pipe 132b, a fluid supply pipe 134a, a fluid supply pipe 134b, and a liquid supply pipe 168a, a liquid supply pipe 168b. The ejection ports Ga, Gb, Gc, and Gd of the fluid supply pipes 134a, 134b, 132a, and 132b are arranged on the upper part of the fluid supply pipes 134a, 134b, 132a, and 132b so that the ejection direction thereof is along the vertical direction.

[0244] On the other hand, the ejection ports Pa and Pb of the liquid supply pipes 168a and 168b are provided at positions inclined with respect to the vertical direction (Z direction) so that the ejection direction thereof is directed toward the center of the substrate W. Therefore, when the liquid flow ejected from the ejection port Pa of the liquid supply pipe 168a and the liquid flow ejected from the ejection port Pb of the liquid supply pipe 168b converge with each other, a very strong upward upward flow can be formed inside the processing tank 110.

[0245] As described above, in the substrate processing apparatus 100, during a certain period, gas is supplied as fluid from the fluid supply pipes 132a and 132b of the first fluid supply unit 132. Also, during another period, gas is supplied as fluid from the fluid supply pipes 134a and 134b of the second fluid supply unit 134.

[0246] Next, a substrate processing method according to the present embodiment will be described with reference to Fig. 15(a) and Fig. 15(b). Fig. 15(a) and Fig. 15(b) are schematic diagrams for describing the substrate processing method according to the present embodiment.

[0247] As shown in FIG15(a), during a certain period, gas is not ejected from the ejection port Ga of the fluid supply pipe 134a and the ejection port Gb of the fluid supply pipe 134b, while gas is ejected from the ejection port Gc of the fluid supply pipe 132a and the ejection port Gd of the fluid supply pipe 132b. Furthermore, liquid is ejected from the ejection port Pa of the liquid supply pipe 168a and the ejection port Pb of the liquid supply pipe 168b.

[0248] At this time, the bubbles ejected from the ejection port Gc of the fluid supply tube 132a and the ejection port Gd of the fluid supply tube 132b float upward substantially vertically, so that the bubbles come into contact with the area around the virtual center line CL of the substrate W surface.

[0249] Liquid ejected from the ejection port Pa of the liquid supply pipe 168a and the ejection port Pb of the liquid supply pipe 168b does not approach the center of the substrate W due to bubbles. Therefore, relatively strong upward flows are formed from the ejection port Pa and the ejection port Pb.

[0250] In addition, here, since the gas is not ejected from the ejection port Ga of the fluid supply pipe 134a and the ejection port Gb of the fluid supply pipe 134b, a relatively weak downflow is formed above the ejection port Ga and the ejection port Gb.

[0251] As shown in FIG15(b), during another period, gas is ejected from the ejection port Ga of the fluid supply pipe 134a and the ejection port Gb of the fluid supply pipe 134b, while gas is not ejected from the ejection port Gc of the fluid supply pipe 132a and the ejection port Gd of the fluid supply pipe 132b. Furthermore, liquid is continuously ejected from the ejection port Pa of the liquid supply pipe 168a and the ejection port Pb of the liquid supply pipe 168b.

[0252] Here, gas is not ejected from the ejection port Gc of the fluid supply pipe 132a and the ejection port Gd of the fluid supply pipe 132b. Therefore, the liquid flow ejected from the ejection port Pa of the liquid supply pipe 168a and the liquid flow ejected from the ejection port Pb of the liquid supply pipe 168b merge, and a very strong upward flow is formed inside the processing tank 110.

[0253] Furthermore, the bubbles ejected from the ejection port Ga of the fluid supply pipe 134a and the ejection port Gb of the fluid supply pipe 134b float upward approximately vertically. Therefore, the bubbles ejected from the ejection port Ga of the fluid supply pipe 134a move upward and are supplied to one end region in the horizontal direction of the substrate W. Similarly, the bubbles ejected from the ejection port Gb of the fluid supply pipe 134b move upward and are supplied to the other end region in the horizontal direction of the substrate W.

[0254] 15(a) and 15(b) , it is understood that by switching the supply of fluid by the first fluid supply unit 132 and the supply of fluid by the second fluid supply unit 134 , the flow of the processing liquid and the bubbles relative to the substrate W can be switched. Therefore, the bias in the processing of the substrate W can be suppressed.

[0255] in addition, Fig.10 , Figure 12 to Figure 14 In the substrate processing apparatus 100 shown, the fluid supply pipe 132a and the fluid supply pipe 134a are arranged opposite to each other with the liquid supply pipe 168a interposed therebetween, and the fluid supply pipe 132b and the fluid supply pipe 134b are arranged opposite to each other with the liquid supply pipe 168b interposed therebetween, but the present embodiment is not limited thereto.

[0256] Next, refer to Fig.16 A substrate processing apparatus 100 according to this embodiment will be described. Fig.16 It is a schematic diagram of a substrate processing apparatus 100 according to this embodiment. Fig.16 In the substrate processing apparatus 100 shown in FIG. 1 , two fluid supply pipes, a first fluid supply unit 132 and a second fluid supply unit 134, are respectively arranged on both sides of the liquid supply pipe 168a, and two fluid supply pipes, a first fluid supply unit 132 and a second fluid supply unit 134, are respectively arranged on both sides of the liquid supply pipe 168b. Fig.10 The above-mentioned substrate processing apparatus 100 is similar, so in order to avoid redundancy, repeated description is omitted.

[0257] The substrate processing apparatus 100 includes a processing tank 110, a substrate holding portion 120, a fluid supply portion 130, and a control portion 140. The fluid supply portion 130 includes a first fluid supply portion 132 and a second fluid supply portion 134. The first fluid supply portion 132 includes a fluid supply pipe 132a, a fluid supply pipe 132b, a fluid supply pipe 132c, and a fluid supply pipe 132d. In this specification, the fluid supply pipe 132a, the fluid supply pipe 132b, the fluid supply pipe 132c, and the fluid supply pipe 132d of the first fluid supply portion 132 are sometimes referred to as the first fluid supply pipe 132a, the second fluid supply pipe 132b, the third fluid supply pipe 132c, and the fourth fluid supply pipe 132d.

[0258] The fluid supply pipe 132a, the fluid supply pipe 132b, the fluid supply pipe 132c, and the fluid supply pipe 132d extend in the Y direction. The second fluid supply unit 134 includes a fluid supply pipe 134a, a fluid supply pipe 134b, a fluid supply pipe 134c, and a fluid supply pipe 134d. The fluid supply pipe 134a, the fluid supply pipe 134b, the fluid supply pipe 134c, and the fluid supply pipe 134d extend in the Y direction. In this specification, the fluid supply pipe 134a, the fluid supply pipe 134b, the fluid supply pipe 134c, and the fluid supply pipe 134d of the second fluid supply unit 134 are sometimes referred to as the fifth fluid supply pipe 134a, the sixth fluid supply pipe 134b, the seventh fluid supply pipe 134c, and the eighth fluid supply pipe 134d.

[0259] If the focus is on the fluid supply pipes 132a to 134d arranged in the inner tank 112 of the processing tank 110, the fluid supply pipes 132a, 134a, 132b, 134b, 134c, 132c, 134d, and 132d are arranged in this order from the -X direction side to the +X direction side. Therefore, the fluid supply pipes 132a and 134a are arranged on the -X direction side relative to the liquid supply pipe 168a, and the fluid supply pipes 132b and 134b are arranged on the +X direction side relative to the liquid supply pipe 168a.

[0260] Furthermore, the fluid supply tube 132c and the fluid supply tube 134c are arranged on the -X direction side relative to the liquid supply tube 168b, and the fluid supply tube 132d and the fluid supply tube 134d are arranged on the +X direction side relative to the liquid supply tube 168b. Therefore, the fluid supply tube 132a, the fluid supply tube 132d and the fluid supply tube 134a, the fluid supply tube 134d are arranged on the outside relative to the liquid supply tube 168a and the liquid supply tube 168b, and the fluid supply tube 132b, the fluid supply tube 132c and the fluid supply tube 134b, the fluid supply tube 134c are arranged between the liquid supply tube 168a and the liquid supply tube 168b.

[0261] Furthermore, the first fluid supply pipe 132a and the second fluid supply pipe 132b are arranged opposite to each other in a manner of sandwiching the liquid supply pipe 168a, and the fifth fluid supply pipe 134a and the sixth fluid supply pipe 134b are arranged opposite to each other in a manner of sandwiching the liquid supply pipe 168a. Similarly, the third fluid supply pipe 132c and the fourth fluid supply pipe 132d are arranged opposite to each other in a manner of sandwiching the liquid supply pipe 168b, and the seventh fluid supply pipe 134c and the eighth fluid supply pipe 134d are arranged opposite to each other in a manner of sandwiching the liquid supply pipe 168b.

[0262] In this way, the fluid from the first fluid supply unit 132 and the fluid from the second fluid supply unit 134 are supplied on both sides of the liquid supply pipe 168a to the area on the -X direction side with respect to the imaginary center line of the substrate W. Similarly, the fluid from the first fluid supply unit 132 and the fluid from the second fluid supply unit 134 are supplied on both sides of the liquid supply pipe 168b to the area on the +X direction side with respect to the imaginary center line CL of the substrate W. Therefore, the entire surface of the substrate W can be fully processed.

[0263] In addition, in reference Figure 10 to Figure 16 In the above description, the first fluid supply unit 132 and the second fluid supply unit 134 of the fluid supply unit 130 supply gases as fluids, respectively, but the present embodiment is not limited thereto. The fluid supply unit 130 may also supply liquids as fluids.

[0264] Next, refer to Fig.17 A substrate processing apparatus 100 according to this embodiment will be described. Fig.17 It is a schematic diagram of a substrate processing apparatus 100 according to this embodiment. Fig.17 In the substrate processing apparatus 100 shown in FIG. 1 , the fluid supply unit 130 supplies liquid as the fluid. Fig.10 The above-mentioned substrate processing apparatus 100 is similar, so in order to avoid redundancy, repeated description is omitted.

[0265] The substrate processing apparatus 100 includes a processing tank 110, a substrate holding portion 120, a fluid supply portion 130, and a control portion 140. The fluid supply portion 130 includes a first fluid supply portion 132 and a second fluid supply portion 134. The first fluid supply portion 132 and the second fluid supply portion 134 are arranged at the bottom of the inner tank 112 of the processing tank 110. The first fluid supply portion 132 and the second fluid supply portion 134 are connected to the downstream end of the pipe 161. Here, the first fluid supply portion 132 and the second fluid supply portion 134 supply a circulating processing liquid as a fluid to the processing tank 110.

[0266] Fig.17 In the substrate processing apparatus 100 shown in FIG. 1 , the first fluid supply unit 132 and the second fluid supply unit 134 can independently adjust the supply of the processing liquid L. Fig.17 In order to avoid the drawing becoming too complicated, one adjustment valve 165 and one valve 166 are shown, but either the adjustment valve 165 or the valve 166 may be provided with a plurality of valves. Thus, the amount of liquid supplied from the first fluid supply unit 132 and the second fluid supply unit 134 can be appropriately adjusted.

[0267] For example, the first fluid supply unit 132 supplies the circulating processing liquid to the processing liquid L in the processing tank 110, while the second fluid supply unit 134 does not supply the circulating processing liquid to the processing liquid L in the processing tank 110. Subsequently, the first fluid supply unit 132 does not supply the circulating processing liquid to the processing liquid L in the processing tank 110, while the second fluid supply unit 134 supplies the circulating processing liquid to the processing liquid L in the processing tank 110. Thus, the bias in the processing of the substrate W can be suppressed.

[0268] Next, refer to Figure 18(a) to Figure 18(c) The substrate processing method according to this embodiment will be described. Figure 18(a) to Figure 18(c) Schematic diagram for explaining the substrate processing method of this embodiment. Figure 18(a) to Figure 18(c) In the substrate processing method shown in FIG. 1 , the first fluid supply unit 132 and the second fluid supply unit 134 continuously supply the fluid while changing the flow rate of the fluid. Figure 4(a) to Figure 4(c) The above-mentioned substrate processing method is the same. Therefore, in order to avoid redundancy, repeated description is omitted.

[0269] As shown in FIG18(a), in the substrate processing apparatus 100, the substrate holding part 120 immerses the held substrate W in the processing liquid L in the processing tank 110. The fluid supply part 130 supplies the fluid to the processing tank 110 while the substrate W is immersed in the processing liquid L. Here, the first fluid supply part 132 and the second fluid supply part 134 supply the liquid to the processing tank 110. In FIG18(a), the liquid supply from the first fluid supply part 132 to the processing tank 110 is indicated by arrow F1, and the liquid supply from the second fluid supply part 134 to the processing tank 110 is indicated by arrow F2.

[0270] As shown in FIG18(b), in a state where the substrate W held by the substrate holding part 120 is immersed in the processing liquid L in the processing tank 110, the fluid supply part 130 changes the fluid supply to the substrate W. Here, the first fluid supply part 132 and the second fluid supply part 134 change the flow rate of the liquid. In FIG18(b), the liquid supply from the first fluid supply part 132 to the processing tank 110 is indicated by arrow F2, and the liquid supply from the second fluid supply part 134 to the processing tank 110 is indicated by arrow F1.

[0271] As shown in FIG18( c ), in the substrate processing apparatus 100, the substrate W held by the substrate holding portion 120 is lifted from the processing liquid L in the processing tank 110. Before, simultaneously with, or after the substrate W is lifted from the processing liquid L in the processing tank 110, the first fluid supply portion 132 and the second fluid supply portion 134 terminate the supply of liquid.

[0272] in addition, Fig.17In the substrate processing apparatus 100 shown, gas is supplied from the fluid supply unit 130 to the processing liquid L in the processing tank 110, but the present embodiment is not limited thereto. Not only gas but also liquid may be supplied to the processing liquid L in the processing tank 110 from the fluid supply unit 130.

[0273] Next, refer to Fig.19 A substrate processing apparatus 100 according to this embodiment will be described. Fig.19 It is a schematic diagram of a substrate processing apparatus 100 according to this embodiment. Fig.19 In the substrate processing apparatus 100 shown in FIG. 1 , not only liquid but also gas is supplied from the fluid supply unit 130 to the processing tank 110. Fig.17 The above-mentioned substrate processing apparatus 100 is similar, so in order to avoid redundancy, repeated description is omitted.

[0274] The substrate processing apparatus 100 includes a gas supply unit 158 ​​in addition to the processing tank 110, the substrate holding unit 120, the fluid supply unit 130, the control unit 140, and the gas transport unit 150. The gas supply unit 158 ​​is disposed at the bottom of the inner tank 112 of the processing tank 110. The pipe 152 is connected to the gas supply unit 158. The pipe 152 guides the gas to the gas supply unit 158 ​​in the processing tank 110.

[0275] The gas supply unit 158 ​​includes a gas supply pipe 158a, a gas supply pipe 158b, a gas supply pipe 158c, and a gas supply pipe 158d. The gas supply pipe 158a is arranged on the -X direction side relative to the first fluid supply unit 132, and the gas supply pipe 158b is arranged on the +X direction side relative to the first fluid supply unit 132. The gas supply pipe 158c is arranged on the -X direction side relative to the second fluid supply unit 134, and the gas supply pipe 158d is arranged on the +X direction side relative to the second fluid supply unit 134.

[0276] Figure 18(a) to Figure 18(c) In the illustrated substrate processing apparatus 100, the first fluid supply unit 132 and the second fluid supply unit 134 supply liquid to the processing tank 110, and the gas supply unit 158 ​​supplies gas to the processing tank 110. Therefore, the substrate W can be fully processed.

[0277] in addition, Figures 1 to 19 In the substrate processing apparatus 100 shown, the fluid supply unit 130 is arranged parallel to the normal direction of the main surface of the substrate W, but the present embodiment is not limited thereto. The fluid supply unit 130 may extend in a direction perpendicular to the normal direction of the main surface of the substrate W.

[0278] Next, the substrate processing apparatus 100 of this embodiment is described with reference to Fig. 20(a) and Fig. 20(b). Fig. 20(a) is a schematic top view of the processing tank 110 in the substrate processing apparatus 100 of this embodiment, and Fig. 20(b) is a schematic side view of the processing tank 110 in the substrate processing apparatus 100 of this embodiment. Here, the fluid supply part 130 extends in a direction intersecting with the arrangement direction of the substrates W.

[0279] In the processing tank 110 of the substrate processing apparatus 100 shown in FIG. 20( a) and FIG. 20( b), with reference to FIG. Figure 10 to Figure 16 The substrate processing apparatus 100 described above is similarly provided with a fluid supply unit 130 and a liquid supply unit 168. Here, the fluid supply unit 130 extends in a direction intersecting the arrangement direction of the substrates W. The fluid supply unit 130 is located between two adjacent substrates among the plurality of substrates W. The fluid supply unit 130 includes a first fluid supply unit 132 and a second fluid supply unit 134.

[0280] Here, the first fluid supply part 132 and the second fluid supply part 134 supply gas to the processing tank 110. The first fluid supply part 132 includes a fluid supply pipe 132a and a fluid supply pipe 132b, and the second fluid supply part 134 includes a fluid supply pipe 134a and a fluid supply pipe 134b. In addition, the first fluid supply part 132 includes a fluid supply pipe other than the fluid supply pipe 132a and the fluid supply pipe 132b, and the second fluid supply part 134 includes a fluid supply pipe other than the fluid supply pipe 134a and the fluid supply pipe 134b, but in Figures 20 (a) and 20 (b), only the fluid supply pipe 132a, the fluid supply pipe 132b, the fluid supply pipe 134a, and the fluid supply pipe 134b are shown. The fluid supply pipe 132a, the fluid supply pipe 132b and the fluid supply pipe 134a, the fluid supply pipe 134b eject gas from the ejection port to the processing tank 110.

[0281] The liquid supply unit 168 supplies liquid to the processing tank 110. The liquid supply unit 168 includes a liquid supply pipe 168a, a liquid supply pipe 168b, a liquid supply pipe 168c, and a liquid supply pipe 168d. The liquid supply pipes 168a, 168b, 168c, and 168d spray liquid from the spray port to the processing tank 110.

[0282] The fluid supply tubes 132a and 132b of the first fluid supply section 132 are arranged every other along the arrangement direction (Y direction) of the substrates W. Similarly, the fluid supply tubes 134a and 134b of the second fluid supply section 134 are arranged every other along the arrangement direction (Y direction) of the substrates W at a position where the fluid supply tubes 132a and 132b are not arranged. For example, the fluid supply tube of the first fluid supply section 132 is arranged in such a manner that it is arranged between the substrate W2 and the substrate W3 when viewed from above, and supplies gas to the substrates W2 and W3. On the other hand, the fluid supply tube of the second fluid supply section 134 is arranged in such a manner that it is arranged between the substrate W1 and the substrate W2 when viewed from above, and supplies gas to the substrates W1 and W2.

[0283] On the other hand, the liquid supply pipes 168a, 168b, 168c, and 168d are provided in such a manner that they are disposed one by one between the substrates W when viewed from above, and supply the processing liquid between the substrates W. For example, one liquid supply pipe of the liquid supply unit 168 is disposed between the substrates W1 and W2 when viewed from above, and similarly, one liquid supply pipe is provided between the substrates W2 and W3 when viewed from above.

[0284] In the substrate processing apparatus 100 of the present embodiment, when only one of the first fluid supply unit 132 and the second fluid supply unit 134 supplies gas, gas is supplied to one of the two main surfaces of the substrate W. For example, when the first fluid supply unit 132 supplies gas, the main surface on the +Y direction side of the substrate W1, the main surface on the -Y direction side of the substrate W2, and the main surface on the +Y direction side of the substrate W3 are in contact with the gas. On the contrary, when the second fluid supply unit 134 supplies gas, the main surface on the -Y direction side of the substrate W1, the main surface on the +Y direction side of the substrate W2, the main surface on the -Y direction side of the substrate W3, and the main surface on the +Y direction side of the substrate W4 are in contact with the gas.

[0285] Furthermore, the liquid supply pipes 168a, 168b, 168c, and 168d of the liquid supply unit 168 all supply liquid, so that both liquid and gas are supplied to the substrate W, and the substrate W can be processed efficiently.

[0286] In addition, in the above description with reference to FIG. 20(a) and FIG. 20(b), the liquid is supplied to the processing tank 110 by the liquid supply unit 168, and the gas is supplied to the processing tank 110 by the fluid supply unit 130, but the present embodiment is not limited thereto. Alternatively, the gas may be supplied to the processing tank 110 by the gas supply unit, and the liquid may be supplied to the fluid supply unit 130. In this case, the fluid supply unit 130 may be as shown in FIG. Figure 1 As mentioned above, the supply of liquid can also be changed.

[0287] In the above description with reference to FIG. 20( a) and FIG. 20( b), the liquid is supplied to the treatment tank 110 by the liquid supply unit 168, and the gas is supplied by the first fluid supply unit 132 and the second fluid supply unit 134, but the present embodiment is not limited thereto. Alternatively, the gas supply unit may supply the gas to the treatment tank 110, and the liquid is supplied by the first fluid supply unit 132 and the second fluid supply unit 134. In this case, the first fluid supply unit 132 and the second fluid supply unit 134 are as shown in FIG. Fig.17 and Figure 18(a) to Figure 18(c) The above-mentioned method can also change the flow rate of the liquid.

[0288] Next, the substrate processing apparatus 100 of this embodiment is described with reference to Figures 21(a) and 21(b). Figure 21(a) is a schematic top view of a processing tank 110 in the substrate processing apparatus 100 of this embodiment, and Figure 21(b) is a schematic side view of the processing tank 110 in the substrate processing apparatus 100 of this embodiment.

[0289] Here, the principal surfaces Wa of the adjacent and opposing substrates W face each other, and the principal surfaces Wb of the adjacent and opposing substrates W face each other.

[0290] In the processing tank 110 of the substrate processing apparatus 100 shown in FIG. 21( a ), Fig.19 The substrate processing apparatus 100 shown in the figure is similarly provided with a fluid supply unit 130 and a gas supply unit 158. The fluid supply unit 130 includes a first fluid supply unit 132 and a second fluid supply unit 134.

[0291] Here, the first fluid supply unit 132 supplies liquid to the processing tank 110. The first fluid supply unit 132 includes a fluid supply pipe 132a, and the second fluid supply unit 134 includes a fluid supply pipe 134a. In addition, the first fluid supply unit 132 includes a fluid supply pipe other than the fluid supply pipe 132a, and the second fluid supply unit 134 includes a fluid supply pipe other than the fluid supply pipe 134a, but in Figure 21 (a), only the fluid supply pipe 132a and the fluid supply pipe 134a are shown. The fluid supply pipe 132a and the fluid supply pipe 134a eject gas from the ejection port to the processing tank 110.

[0292] The gas supply unit 158 ​​supplies gas to the processing tank 110. The gas supply unit 158 ​​includes a gas supply pipe 158a and a gas supply pipe 158b. Gas is ejected into the processing tank 110 from the gas supply pipe 158a, the gas supply pipe 158b, and the ejection port.

[0293] Any of the fluid supply tubes of the first fluid supply section 132 and the fluid supply tubes of the second fluid supply section 134 are arranged every other one along the arrangement direction (Y direction) of the substrates W. Furthermore, the fluid supply tubes of the first fluid supply section 132 are arranged every three along the arrangement direction (Y direction) of the substrates W, and the fluid supply tubes of the second fluid supply section 134 are arranged every three along the arrangement direction (Y direction) of the substrates W. For example, the fluid supply tube of the first fluid supply section 132 is arranged in such a manner that, when viewed from above, it is disposed between the substrate W1 and the substrate W2, and supplies gas to the main surface Wa of the substrate W1 and the main surface Wa of the substrate W2. On the other hand, the fluid supply tube of the second fluid supply section 134 is arranged in such a manner that, when viewed from above, it is disposed between the substrate W3 and the substrate W4, and supplies gas to the main surface Wa of the substrate W3 and the main surface Wa of the substrate W4.

[0294] On the other hand, the gas supply pipes of the gas supply unit 158 ​​are arranged in the following manner, that is, arranged every other one along the arrangement direction (Y direction) of the substrates W, and supply gas between the substrates W. For example, the gas supply pipe 158a of the gas supply unit 158 ​​is arranged between the substrates W1 and W2 in a plan view, and similarly, the gas supply pipe 158b is arranged between the substrates W3 and W4 in a plan view.

[0295] In the substrate processing apparatus 100 of the present embodiment, the first fluid supply unit 132 and the second fluid supply unit 134 supply liquids of different flow rates, and supply liquids to the main surfaces Wa of the adjacent substrates W. For example, when the liquid flow rate from the first fluid supply unit 132 is greater than the liquid flow rate from the second fluid supply unit 134, the main surfaces Wa of the substrate W1 and the main surfaces Wa of the substrate W2 can be fully processed. On the contrary, when the liquid flow rate from the second fluid supply unit 134 is greater than the liquid flow rate from the first fluid supply unit 132, the main surfaces Wa of the substrate W3 and the main surfaces Wa of the substrate W4 can be fully processed.

[0296] Furthermore, the gas supply pipes 158a, 158b, 158c, and 158d of the gas supply unit 158 ​​all supply gas. Therefore, both liquid and gas are supplied to the substrate W, and the main surface Wa of the substrate W can be processed efficiently.

[0297] In addition, referring to FIG. 21 (a) and FIG. 21 (b), in the above description, for the processing tank 110, the gas is supplied by the gas supply unit 158, and on the other hand, the liquid is supplied by the first fluid supply unit 132 and the second fluid supply unit 134, but the present embodiment is not limited to this. It can also be: for the processing tank 110, the liquid is supplied by the liquid supply unit, and on the other hand, the gas is supplied by the first fluid supply unit 132 and the second fluid supply unit 134.

[0298] 20(a) and 20(b) and 21(a) and 21(b), it is preferable to supply liquid and gas to at least a portion of each substrate W. Thus, each substrate W can be fully processed.

[0299] In addition, when a plurality of substrates W are arranged in a row and the substrates W are processed, the substrates W arranged at the ends of the substrates W arranged in a row may not be processed uniformly compared with other substrates. Therefore, it is preferable to provide a rectifying plate that faces the substrates W arranged at the ends of the substrates W arranged in a row.

[0300] Next, refer to Figure 22(a) to Figure 22(c) The substrate processing apparatus 100 having a processing tank 110 equipped with a rectifying plate 190 is described. Fig. 22(a) is a schematic diagram of the processing tank 110 in the substrate processing apparatus 100 of the present embodiment. Fig. 22(b) and Fig. 22(c) are schematic diagrams for describing the substrate processing method of the present embodiment.

[0301] As shown in FIG. 22( a), in the substrate processing apparatus 100, a rectifying plate 190 is installed in the processing tank 110. The rectifying plate 190 is installed at the bottom of the processing tank 110. The rectifying plate 190 is a plate extending vertically upward (Z direction). The rectifying plate 190 is provided with three recesses corresponding to the holding rods 124 of the substrate holding portion 120.

[0302] As shown in Fig. 22(b), the substrate holding part 120 holds the substrate W above the processing tank 110. The plurality of substrates W held by the substrate holding part 120 are arranged in a row.

[0303] As shown in FIG. 22( c ), the substrate holding part 120 is lowered to the processing tank 110 while holding the substrate W. Thus, in the substrate processing apparatus 100, a plurality of substrates W arranged in a row are immersed in the processing tank 110. The holding rod 124 of the substrate holding part 120 enters the recess of the rectifying plate 190. Therefore, when the substrate holding part 120 is lowered to the processing tank 110 while holding the substrate W, the rectifying plate 190 faces the substrate W at one end of the substrates W arranged in a row. Therefore, the substrate W at one end of the substrates W arranged in a row can be processed in the same manner as other substrates.

[0304] in addition, Figure 22(a) to Figure 22(c) In the substrate processing apparatus 100 shown in the figure, the rectifying plate 190 is mounted on the processing tank 110 , but the present embodiment is not limited thereto. The rectifying plate 190 may also be mounted on the substrate holding portion 120 .

[0305] Next, refer to Fig.23 , the substrate holding portion 120 in the substrate processing apparatus 100 of the present embodiment in which the rectifying plate 190 is mounted on the substrate holding portion 120 will be described. Fig.23 2 is a schematic diagram of the substrate holding portion 120 .

[0306] The substrate holding portion 120 includes a main body plate 122 and a holding rod 124. The holding rod 124 supports a plurality of substrates W arranged in a row along the Y direction. A rectifying plate 190 is mounted on the end of the holding rod 124 on the +Y direction side. The rectifying plate 190 faces the substrate W on the +Y direction side among the plurality of substrates W. The diameter, shape, and thickness of the rectifying plate 190 are preferably substantially equal to those of the substrate W. For example, when the substrate W is thin and circular, the rectifying plate 190 is preferably also thin and circular.

[0307] Furthermore, the number of substrates W held by the substrate holding portion 120 may be less than the maximum number of substrates that can be held. In this case, it is preferable that the rectifying plate 190 is movable in the Y direction along the holding rod 124 .

[0308] In addition, in reference Figures 1 to 23 In the above-mentioned substrate processing apparatus 100, the fluid supply unit 130 is arranged at the bottom of the processing tank 110 to supply the fluid to the processing liquid stored in the processing tank 110, but the present embodiment is not limited thereto. The fluid supply unit 130 may also be arranged at the side of the processing tank 110. Alternatively, the fluid supply unit 130 may also be arranged at a position higher than the height of the processing liquid stored in the processing tank 110 to supply the fluid to the processing tank 110 without being covered by the processing liquid.

[0309] in addition, Figures 1 to 23 The substrate processing apparatus 100 shown is a batch type that simultaneously processes a plurality of substrates W, but the present embodiment is not limited thereto. The substrate processing apparatus 100 may also be a single-wafer type that processes substrates W one by one.

[0310] The above, while referring to the attached Figure 1The embodiments of the present invention are described. However, the present invention is not limited to the embodiments, and can be implemented in various ways without departing from the main purpose thereof. Moreover, various inventions can be formed by appropriately combining the multiple constituent elements disclosed in the embodiments. For example, several constituent elements can be deleted from all the constituent elements shown in the embodiments. Furthermore, constituent elements across different embodiments can also be appropriately combined. For ease of understanding, the accompanying drawings schematically illustrate each constituent element in the main body, and in order to facilitate the preparation of the accompanying drawings, the thickness, length, number, spacing, etc. of each constituent element illustrated in the drawings are sometimes different from the actual ones. Moreover, the material, shape, size, etc. of each constituent element shown in the embodiments are examples, and are not particularly limited, and various changes can be made within the scope that does not substantially deviate from the effect of the present invention.

[0311] [Industrial Applicability]

[0312] The present invention is suitable for a substrate processing device and a substrate processing method for processing a substrate.

Claims

1. A substrate processing device, comprising: A processing tank storing a processing liquid for processing a substrate; a substrate holding portion for holding the substrate in the processing liquid in the processing tank; A fluid supply unit, supplying fluid to the processing tank; a liquid supply unit, disposed below the substrate held by the substrate holding unit, and supplying the processing liquid to the processing tank; as well as a control unit, controlling the fluid supply unit and the liquid supply unit, The control unit controls the fluid supply unit so that the fluid supply unit changes the supply of the fluid during a period from when the supply of the fluid to the processing tank storing the processing liquid for immersing the substrate is started until when the supply of the fluid to the processing tank storing the processing liquid for immersing the substrate is finished. The fluid supply unit comprises: A first fluid supply unit is disposed at a first position in the processing tank and supplies fluid to the processing tank; as well as A second fluid supply unit is disposed at a second position in the processing tank and supplies the fluid to the processing tank during a period different from a period during which the first fluid supply unit supplies the fluid. The liquid supply unit includes a first liquid supply pipe and a second liquid supply pipe. The first liquid supply pipe is arranged on one side relative to the vertical center axis of the substrate. The second liquid supply pipe is arranged on the other side of the vertical center axis of the substrate. The first liquid supply pipe is provided with a discharge port inclined toward the vertical center axis of the substrate on the vertical center axis side of the substrate. The second liquid supply pipe is provided with a discharge port inclined toward the vertical center axis of the substrate on the vertical center axis side of the substrate. The first fluid supply unit includes a first fluid supply pipe and a second fluid supply pipe. The first fluid supply pipe is located between the vertical center axis of the substrate and the first liquid supply pipe. The second fluid supply pipe is located between the vertical center axis of the substrate and the second liquid supply pipe. The second fluid supply unit includes a third fluid supply pipe and a fourth fluid supply pipe. The first liquid supply pipe is located between the third fluid supply pipe and the first fluid supply pipe, The second liquid supply pipe is located between the fourth fluid supply pipe and the second fluid supply pipe, The control unit: During a first period, the fluid supply unit and the liquid supply unit are controlled so that the first liquid supply pipe and the second liquid supply pipe supply the liquid, and the first fluid supply pipe and the second fluid supply pipe supply gas as the fluid. During the second period, the fluid supply unit and the liquid supply unit are controlled so that the first liquid supply pipe and the second liquid supply pipe supply the liquid, and the third fluid supply pipe and the fourth fluid supply pipe supply gas as the fluid.

2. The substrate processing apparatus according to claim 1, wherein The first fluid supply pipe and the second fluid supply pipe are arranged symmetrically with respect to a vertical center axis of the substrate.

3. The substrate processing apparatus according to claim 1, wherein The third fluid supply pipe and the fourth fluid supply pipe are arranged symmetrically with respect to a vertical center axis of the substrate.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein The control unit controls the first fluid supply unit and the second fluid supply unit to switch the supply of the fluid by the first fluid supply unit and the supply of the fluid by the second fluid supply unit, and supplies at least one of the fluid of the first fluid supply unit and the fluid of the second fluid supply unit to the processing tank.

5. The substrate processing apparatus according to any one of claims 1 to 3, wherein The first liquid supply pipe and the second liquid supply pipe are arranged symmetrically with respect to a vertical center axis of the substrate.

6. The substrate processing apparatus according to any one of claims 1 to 3, wherein The substrates are arranged in a row. The ejection port of the first liquid supply pipe is located between two adjacent substrates among the plurality of substrates. The ejection port of the second liquid supply pipe is located between two adjacent substrates among the plurality of substrates.

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