Transport unit and transport method

Abstract

A conveying unit and a conveying method are provided, which can suppress chips from falling from the conveying unit. The conveying unit (70) conveys a plurality of CSPs. The conveying unit (70) includes: a suction and holding pad (71) that suctions and holds the CSPs and has a plurality of suction holes (75) formed at positions corresponding to the plurality of CSPs; an air supply source (79) and an air suction source (78) that are connected to the suction holes (75); and a chip contact sheet (80) that is disposed on a lower surface (741) of the suction and holding pad (71) and has a plurality of holes (81) at positions corresponding to the suction holes (75). The outer edge of the chip contact sheet (80) is fixed to the suction and holding pad (71).

Description

Technical Field

[0001] The present invention relates to a transport unit and a transport method for transporting singulated chips. Background Art

[0002] The following packaging substrate is known: a plurality of semiconductor devices are mounted on a resin or metal substrate with electrodes wired thereon, and the semiconductor devices are covered with a molded resin. When the packaging substrate is divided along a predetermined dividing line for each semiconductor device, a chip called a CSP (Chip Size Package) or the like is formed.

[0003] A dividing device is used to divide the package substrate into individual chips along the predetermined dividing line (for example, see Patent Document 1). The dividing device shown in Patent Document 1 separates the package substrate into a plurality of chips, and then transports the plurality of chips to a storage tray through a transport unit, causing the chips to fall into the storage tray for recovery. The recovered chips are transported to the next process.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2013-65603

[0005] The above-mentioned dividing device blows air from the conveying unit to the chip, thereby causing the chip to fall into the storage tray. However, if the burr of the chip is hooked on the holding surface of the conveying unit or the holding surface is firmly in contact with the chip, there is a problem that the chip will not fall even if the air is blown. Summary of the invention

[0006] Therefore, an object of the present invention is to provide a transfer unit and a transfer method capable of suppressing chips from falling from the transfer unit.

[0007] According to one embodiment of the present invention, a transport unit is provided for transporting a plurality of chips, characterized in that the transport unit comprises: a suction and holding pad for attracting and holding the chips, and having a plurality of suction holes formed at positions corresponding to the plurality of chips; an air supply source selectively connected to the suction holes; an air suction source selectively connected to the suction holes; and a chip contact sheet arranged on the lower surface of the suction and holding pad, having a plurality of holes at positions corresponding to the suction holes, and an outer edge of the chip contact sheet being fixed to the suction and holding pad.

[0008] Preferably, in the transport unit, the hole is smaller than the suction hole.

[0009] Preferably, in the transport unit, the hole is formed so as to partially overlap with the suction hole.

[0010] According to another aspect of the present invention, a conveying method is provided, which utilizes the conveying unit, wherein the conveying method has the following steps: a chip holding step, in which the plurality of holes of the chip contact sheet are brought into contact with the plurality of chips, and the air is sucked by an air suction source while the connection with the air supply source is cut off to hold the chips; a conveying step, in which the plurality of chips are conveyed to an upper portion of a storage tray while the chips are held; and a chip storage step, in which the plurality of chips are dropped into the storage tray while air is supplied from the air supply source and supplied between the suction holding pad and the chip contact sheet while the connection with the air suction source is cut off.

[0011] The present invention has an effect of being able to suppress chips from falling from the transport unit into the storage tray. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a perspective view showing an example of a workpiece to be transported by the transport method according to the first embodiment.

[0013] Figure 2 It is along Figure 1 Cross-sectional view along line II-II.

[0014] Figure 3 It is a perspective view showing a configuration example of a dividing device including a conveying unit according to the first embodiment.

[0015] Figure 4 It is shown Figure 3 A three-dimensional view of the holding workbench of the dividing device is shown.

[0016] Figure 5 This is a perspective view of the transport unit according to the first embodiment as seen from below.

[0017] Figure 6 It is a figure which shows the structure of the conveyance unit of 1st Embodiment in a partial cross-section.

[0018] Figure 7 This is a plan view of the transport unit according to the first embodiment as seen from below.

[0019] Figure 8 This is a flowchart showing the conveying method according to the first embodiment.

[0020] Fig. 9 It is shown Figure 8 A partial cross-sectional side view of a dividing step of the transport method shown.

[0021] Fig.10 It is shown Figure 8 A partial cross-sectional side view of a dividing step of the transport method shown.

[0022] Fig.11 It is shown Figure 8 A cross-sectional view of a chip holding step in the transfer method shown.

[0023] Fig.12 It is shown Figure 8 A cross-sectional view of a transport step of the transport method shown.

[0024] Fig.13 It is shown Figure 8 Another cross-sectional view of the transport step of the transport method shown.

[0025] Fig.14 It is shown Figure 8 A cross-sectional view of a chip storage step in the transfer method shown.

[0026] Fig.15 This is a plan view of the transport unit according to the second embodiment as seen from below.

[0027] Fig.16 It is a cross-sectional view of a main part of the transport unit according to the second embodiment.

[0028] Description of symbols

[0029] 60: storage tray; 70: conveying unit; 71: suction and holding pad; 75: suction hole; 78: air suction source; 79: air supply source; 80: chip contact piece; 81, 81-2: hole; 204: CSP (chip); 741: lower surface; ST2: chip holding step; ST3: conveying step; ST4: chip storage step. DETAILED DESCRIPTION

[0030] With reference to the accompanying drawings, the embodiments of the present invention are described in detail. The present invention is not limited by the contents described in the following embodiments. In addition, the constituent elements described below include contents that can be easily thought of by those skilled in the art, and substantially the same contents. In addition, the structures described below can be appropriately combined. In addition, various omissions, substitutions or changes in the structure can be made within the scope of the gist of the present invention.

[0031] [First embodiment]

[0032] A transport unit and a transport method according to a first embodiment of the present invention will be described with reference to the drawings. Figure 1 This is a perspective view showing an example of a workpiece to be transported by the transport method according to the first embodiment. Figure 2 It is along Figure 1 Cross-sectional view along line II-II. Figure 3 It is a diagram showing a configuration example of a dividing device including a conveying unit according to the first embodiment. Figure 4 It is shown Figure 3 A three-dimensional view of the holding workbench of the dividing device is shown. Figure 5 This is a perspective view of the transport unit according to the first embodiment as seen from below. Figure 6 It is a figure which shows the structure of the conveyance unit of 1st Embodiment in a partial cross-section. Figure 7 This is a plan view of the transport unit according to the first embodiment as seen from below.

[0033] The first embodiment of the conveying method is to Figure 1 and Figure 2 The method of transporting the workpiece 200 shown.

[0034] like Figure 1 and Figure 2 As shown, the workpiece 200, which is the conveying object of the conveying method of the first embodiment, has a planar shape formed into a rectangular flat plate. The workpiece 200 has an electrode plate 201, and a plurality of predetermined dividing lines 203 are formed in a grid shape on the front side 202 of the electrode plate 201. The workpiece 200 has a plurality of regions divided by the plurality of predetermined dividing lines 203, and CSPs (Chip Size Packages) 204 that are divided into chips are respectively arranged in these regions. At least a portion of the outer surface of the CSP 204 is covered with a molded resin 205 from the back side of the electrode plate 201. That is, the CSP 204 is a packaged device chip of each package. In this way, in the first embodiment, the workpiece 200 is a so-called package substrate including a plurality of CSPs 204 covered with a molded resin 205.

[0035] The workpiece 200 constructed as described above is Figure 3 The dividing device 1 shown in the figure cuts along the dividing line 203 to divide into a plurality of CSPs 204. The CSPs 204 are formed by Figure 3 Since the cutting blade 21 of the illustrated dividing device 1 is obtained by cutting along the planned dividing line 203 , a burr (not shown) is formed on the CSP 204 . The burr is a protrusion protruding from the front surface of the CSP 204 .

[0036] Next, a dividing device 1 for dividing the workpiece 200 into CSPs 204 will be described. The dividing device 1 is a device that holds the workpiece 200 on a holding table 10 and divides the workpiece 200 along a plurality of predetermined dividing lines 203. Figure 3 As shown, the dividing device 1 includes: a holding table 10 that holds the workpiece 200 by suction using a holding surface 11 ; a cutting unit 20 that cuts the workpiece 200 held by the holding table 10 along a planned dividing line 203 ; and a control unit 100 .

[0037] like Figure 4As shown, the holding table 10 is formed in a rectangular shape and has a holding surface 11 for holding the workpiece 200. A suction port 12 for sucking the workpiece 200 and the CSP 204 and a tool relief groove 13 for allowing the cutting tool 21 to retreat are provided on the holding surface 11. The suction port 12 is provided at a position corresponding to the CSP 204 and opens on the holding surface 11. The tool relief groove 13 is provided at a position corresponding to the predetermined dividing line 203 and is formed recessed from the holding surface 11. In addition, in this specification, the corresponding position refers to the position overlapping in the Z-axis direction.

[0038] The holding table 10 connects the suction port 12 to the vacuum suction source 14, and the suction port 12 is sucked by the vacuum suction source 14, so that the workpiece 200 is sucked and held on the holding surface 11. In addition, the holding table 10 is provided to be movable in the X-axis direction by a processing feed unit not shown in the figure and to be rotatable around an axis parallel to the Z-axis direction by a rotation drive source not shown in the figure.

[0039] The cutting unit 20 cuts the workpiece 200. The cutting unit 20 includes a main spindle (not shown) on which a cutting tool 21 for cutting the workpiece 200 held by the holding table 10 is mounted.

[0040] The cutting tool 21 is an extremely thin cutting tool having a substantially ring shape. The spindle rotates the cutting tool 21 to cut the workpiece 200. The spindle is housed in a spindle housing. The spindle of the cutting unit 20 and the axis of the cutting tool 21 are set parallel to the Y-axis direction.

[0041] The cutting unit 20 is provided to be movable in the Y-axis direction by an indexing feed unit (not shown) and in the Z-axis direction by a plunge feed unit (not shown) relative to the workpiece 200 held by the holding table 10. The cutting unit 20 can position the cutting tool 21 at any position of the holding surface 11 of the holding table 10 by the indexing feed unit and the plunge feed unit. The cutting unit 20 moves in the Y-axis direction and the Z-axis direction by the indexing feed unit and the plunge feed unit, thereby cutting the predetermined dividing line 203 of the workpiece 200 held by the holding table 10 moving in the X-axis direction by the machining feed unit, and dividing the workpiece 200 into a plurality of CSPs 204.

[0042] In addition, the dividing device 1 has: a box 30, which stores a plurality of workpieces 200 before processing; a carry-out unit 40, which takes the workpieces 200 out of the box 30; a packaging conveying unit 50, which conveys the workpieces 200 before processing taken out of the box 30 to the holding workbench 10; a storage tray 60, which stores the CSPs 204 obtained by each division; and a conveying unit 70, which conveys the plurality of CSPs 204 obtained by each division from the holding workbench 10 to the storage tray 60.

[0043] The cassette 30 stores a plurality of workpieces 200. The cassette 30 stacks the plurality of workpieces 200 at intervals in the Z-axis direction. The cassette 30 has an opening 31 through which the workpieces 200 can be freely introduced. The cassette 30 is provided so as to be freely raised and lowered in the Z-axis direction by a cassette elevator (not shown).

[0044] The unloading unit 40 includes: an unloading member 41 that takes out a workpiece 200 before processing from the box 30; and a pair of rails 42 that temporarily place the workpiece 200 taken out from the box 30. The packaging conveying unit 50 sucks the workpiece 200 on the pair of rails 42. The packaging conveying unit 50 places the sucked workpiece 200 on the holding table 10. The storage tray 60 is formed in a box shape with an opening 61 at the top.

[0045] The transport unit 70 transports the plurality of CSPs 204 obtained by cutting each of the CSPs 204 on the holding table 10 to the storage tray 60. Figure 5 and Figure 6 As shown, the conveying unit 70 comprises: a suction and holding pad 71 for sucking and holding the plurality of CSPs 204 obtained by each division on the holding table 10; a moving mechanism 72 ( Figure 6 ), which causes the suction and holding pad 71 to move in the Z-axis direction and the Y-axis direction; an air supply source 79 and an air suction source 78 ( Figure 6 and a chip contact sheet 80.

[0046] like Figure 5 and Figure 6 As shown, the suction and holding pad 71 includes: a pad body 73 which is made of metal such as stainless steel and is formed in a relatively thick flat plate shape; and a buffer sheet 74 which is attached to the lower surface of the pad body 73 .

[0047] The upper and lower surfaces of the pad body 73 are formed flat, and the plane shape is formed into a rectangular shape. The plane shape of the buffer sheet 74 is formed into a rectangular shape, and is formed to be the same size as the lower surface 731 of the pad body 73. In the first embodiment, the lower surface 731 of the pad body 73 and the buffer sheet 74 are overlapped with each other as a whole. The lower surface 741 of the buffer sheet 74 is flat and parallel to the horizontal direction. The buffer sheet 74 is made of a synthetic resin having airtightness and elasticity. In the first embodiment, the buffer sheet 74 is made of rubber, but is not limited to being made of rubber.

[0048] In addition, the suction and holding pad 71 has a plurality of suction holes 75 opened on the lower surface 741 of the buffer sheet 74. The suction holes 75 penetrate the buffer sheet 74 and are formed at positions corresponding to the CSP 204 in a one-to-one manner. That is, the suction holes 75 are arranged at positions that will be sealed by the corresponding CSP 204 when the suction and holding pad 71 attracts the CSP 204. In the first embodiment, the suction holes 75 correspond to the CSP 204 in a one-to-one manner, but a plurality of suction holes 75 may correspond to one CSP 204. In the first embodiment, the plane shape of the suction holes 75 is formed to be circular.

[0049] The suction hole 75 is connected to an air supply source 79 and an air suction source 78 via a suction passage 76 and a switching valve 77 provided in the pad body 73. The switching valve 77 allows one of the air supply source 79 and the air suction source 78 to communicate with the suction passage 76. The air supply source 79 and the air suction source 78 are connected to the suction hole 75 via the switching valve 77. The air supply source 79 is a device that supplies pressurized air through the suction passage 76 and ejects air from the suction hole 75. The air suction source 78 is a device that sucks air through the suction passage 76 and sucks air from the suction hole 75.

[0050] The chip contact sheet 80 is made of a synthetic resin having airtightness and is formed into a sheet with uniform thickness. In the first embodiment, the chip contact sheet 80 is made of PEEK (polyetheretherketone), but in the present invention, the synthetic resin constituting the chip contact sheet 80 is not limited to PEEK.

[0051] The planar shape of the chip contact sheet 80 is formed into a rectangular shape, and in the first embodiment, is formed to be the same size as the lower surface 731 of the pad body and the lower surface 741 of the buffer sheet 74. The chip contact sheet 80 is arranged on the lower surface 741 of the buffer sheet 74 of the suction and holding pad 71. In the first embodiment, the chip contact sheet 80 and the buffer sheet 74 of the suction and holding pad 71 overlap each other as a whole.

[0052] like Figure 6As shown, the chip contact sheet 80 is disposed on the lower surface 741 of the buffer sheet 74 of the suction and holding pad 71, and has a plurality of holes 81 at positions corresponding to the suction holes 75. The holes 81 penetrate the chip contact sheet 80 and are disposed at positions corresponding to the CSP 204 in a one-to-one manner. That is, the holes 81 are disposed at positions that will be sealed by the corresponding CSP 204 when the suction and holding pad 71 suctions the CSP 204. In the first embodiment, the holes 81 correspond to the CSP 204 in a one-to-one manner, but a plurality of holes 81 may correspond to one CSP 204.

[0053] In addition, in the first embodiment, the planar shape of the hole 81 is formed into a circle. In the first embodiment, the hole 81 is formed to have an inner diameter smaller than the inner diameter of the suction hole 75. Figure 7 As shown in the figure, it is arranged at a position coaxial with the suction hole 75, and the whole overlaps with the suction hole 75. In the first embodiment, the so-called "hole 81 is arranged at a position corresponding to the suction hole 75" means that at least a part of the hole 81 is arranged at a position overlapping with the suction hole 75 in the Z-axis direction when the hole 81 is smaller than the suction hole 75.

[0054] In addition, the outer edge of the chip contact sheet 80 is fixed to the outer edge of the buffer sheet 74 of the suction and holding pad 71, and the position of the chip contact sheet 80 other than the outer edge is not fixed to the buffer sheet 74. In the first embodiment, the outer edge of the chip contact sheet 80 is fixed to the outer edge of the buffer sheet 74 by an adhesive or a double-sided tape having an adhesive paste layer laminated on both surfaces of the base layer. In addition, the outer edge of the chip contact sheet 80 and the outer edge of the buffer sheet 74 fixed to each other are the parts closer to the outer edge than the hole 81 and the suction hole 75 closest to the outer edge.

[0055] The air suction source 78 is connected to the suction passage 76 by the switching valve 77, and the suction hole 75 and the hole 81 are sucked by the air suction source 78, so that the suction holding pad 71 sucks and holds the CSP 204 on the chip contact sheet 80. In addition, the suction holding pad 71 connects the air supply source 79 and the suction passage 76 by the switching valve 77, and the pressurized air from the air supply source 79 is ejected from the suction hole 75 and the hole 81, so that the ejected air enters between the chip contact sheet 80 and the buffer sheet 74 of the suction holding pad 71, so that the chip contact sheet 80 is stretched in a downward bulging manner, so that the sucked and held CSP 204 is separated from the chip contact sheet 80 and falls.

[0056] The conveying unit 70 attracts the individually segmented CSP 204 on the holding workbench 10 via the chip contact sheet 80, and moves the suction holding pad 71 attracting the CSP 204 from the holding workbench 10 to the top of the storage tray 60 via the moving mechanism 72, and then transports the CSP 204 to the storage tray 60 by spraying air from the suction holes 75 and the holes 81.

[0057] The control unit 100 controls each component of the splitting device 1 so that the splitting device 1 performs a processing operation on the workpiece 200. In addition, the control unit 100 is a computer. The control unit 100 has: an operation processing device having a microprocessor such as a CPU (central processing unit); a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory); and an input / output interface device. The operation processing device of the control unit 100 performs operation processing according to the computer program stored in the storage device, and outputs the control signal for controlling the splitting device 1 to the above-mentioned components of the splitting device 1 via the input / output interface device.

[0058] The control unit 100 is connected to a display device 101 composed of a liquid crystal display device or the like that displays the state or image of the processing operation, and an input device 102 that is used when the operator registers the processing content information, etc. The input device 102 is composed of an external input device 103 such as a touch panel and a keyboard provided on the display device 101. In addition, the conveying unit 70, the switching valve 77, the air suction source 78, the air supply source 79 and the control unit 100 constitute Figure 6 The transport device 300 shown in the figure transports the plurality of CSPs 204 obtained by dividing each of the plurality of CSPs 204 to the storage tray 60 .

[0059] Next, the conveying method according to the first embodiment will be described. Figure 8 This is a flowchart showing the conveying method according to the first embodiment. Fig. 9 It is shown Figure 8 An explanatory diagram of the dividing step of the transport method shown. Fig.10 It is shown Figure 8 Another explanatory diagram of the dividing step of the transport method shown. Fig.11 It is shown Figure 8 An explanatory diagram of a chip holding step of the transport method shown. Fig.12 It is shown Figure 8 An explanatory diagram of the transport steps of the transport method shown. Fig.13 It is shown Figure 8 Another explanatory diagram of the transport step of the transport method shown. Fig.14 It is shown Figure 8 An explanatory diagram of a chip storage step of the transport method shown.

[0060] The conveying method of the first embodiment is a method of conveying the plurality of CSPs 204 obtained by separation to the storage tray 60 by using the conveying unit 70. In the first embodiment, it is also a method of dividing the workpiece 200 into the packaging substrates of the individual CSPs 204. Figure 8 As shown, the transport method includes a dividing step ST1, a chip holding step ST2, a transport step ST3, and a chip storing step ST4.

[0061] In the conveying method, the operator first places the box 30 containing the workpiece 200 on the splitting device 1, and the operator operates the input device 102 to register the processing content information in the control unit 100. When there is a start instruction of the processing action from the operator, the conveying method is started by the control unit 100 from the splitting step ST1.

[0062] The splitting step ST1 is a step of holding the workpiece 200 on the holding table 10 and splitting it along a plurality of predetermined splitting lines 203. In the splitting step ST1, the control unit 100 takes out a workpiece 200 from the box 30 through the unloading unit 40, and transports the workpiece 200 from the track 42 to the holding table 10 through the packaging transport unit 50. In the splitting step ST1, the control unit 100 sucks and holds the workpiece 200 on the holding surface 11 of the holding table 10 through a vacuum suction source.

[0063] Next, the control unit 100 moves the holding table 10 toward the bottom of the imaging unit 90 through the processing feed unit, and performs alignment by imaging the workpiece 200 through the imaging unit 90 .

[0064] Furthermore, the control unit 100 moves the cutting unit 20 and the holding table 10 relatively along the planned splitting line 203 through the processing feed unit, the indexing feed unit, the cutting feed unit and the rotation drive source according to the processing content information, while causing the cutting tool 21 to cut into the planned splitting line 203 .

[0065] When each planned dividing line 203 is cut, the control unit 100 rotates the cutting tool 21 by the spindle of the cutting unit 20 as shown in FIG. Fig. 9 The cutting tool 21 is positioned above one end of the predetermined dividing line 203 as shown by the double-dashed line in FIG. 1 , and the cutting tool 21 is lowered along the arrow Z1 direction to Fig. 9The solid line in the middle reaches the position of the undercut 13. Then, the control unit 100 moves the holding table 10 along the arrow X1 so that the cutting tool 21 moves toward the other end of the predetermined dividing line 203, thereby cutting the predetermined dividing line 203. Fig.10 When the cutting tool 21 reaches the other end of the predetermined dividing line 203 as shown by the solid line, the control unit 100 causes the cutting tool 21 to rise along the arrow Z2 direction to Fig.10 The position indicated by the two-dot chain line is far from the workpiece 200. When all the planned dividing lines 203 are cut, the holding table 10 holds the plurality of CSPs 204 obtained by each division. When the cutting tool 21 cuts all the planned dividing lines 203, the conveying method enters the chip holding step ST2.

[0066] The chip holding step ST2 is a step of making the plurality of holes 81 of the chip contact sheet 80 contact the plurality of CSPs 204 after the separation step ST1 is performed and the air suction source 78 is used to suck air while disconnecting the air supply source 79 to suck and hold the CSPs 204 on the chip contact sheet 80. In the chip holding step ST2, as shown in FIG. Fig.11 As shown, the control unit 100 causes the chip contact sheet 80 on the lower surface 741 of the buffer sheet 74 provided on the suction and holding pad 71 of the transport unit 70 to overlap and contact with a plurality of CSPs 204 while the CSPs 204 are suctioned and held on the holding table 10. At this time, the control unit 100 positions the suction and holding pad 71 at a position where the corresponding CSPs 204 seal the suction holes 75 provided on the buffer sheet 74 of the suction and holding pad 71 and the holes 81 provided on the chip contact sheet 80.

[0067] In the chip holding step ST2, the control unit 100 connects the air suction source 78 with the suction hole 75 and the hole 81 through the switching valve 77, and sucks air from the suction hole 75 and the hole 81 through the air suction source 78 in a state where the air supply source 79 is disconnected from the suction hole 75 and the hole 81. In the chip holding step ST2, the control unit 100 suctions and holds the CSP 204 through the chip contact sheet 80 provided on the lower surface 741 of the buffer sheet 74 of the suction holding pad 71, and releases (also referred to as releasing or stopping) the suction of the holding stage 10 by the vacuum suction source 14. When the CSP 204 is suctioned and held by the chip contact sheet 80 and the suction of the holding stage 10 is released, the conveying method enters the conveying step ST3.

[0068] The transport step ST3 is a step of transporting a plurality of CSPs 204 to the upper part (top part) of the storage tray 60 while the CSPs 204 are held by suction on the suction and holding pads 71 ​​by the chip contact sheet 80. Fig.12As shown in FIG. 1 , the control unit 100 moves the suction and holding pad 71 that suctions and holds the CSP 204 via the chip contact sheet 80 to the top of the storage tray 60. In the transport step ST3, as shown in FIG. Fig.13 As shown, the control unit 100 stops the suction and holding pad 71 sucking and holding the CSP 204 via the chip contact sheet 80 above the storage tray 60, and positions the suction and holding pad 71 above the storage tray 60. When the suction and holding pad 71 is positioned above the storage tray 60, the transport method enters the chip storage step ST4.

[0069] The chip storage step ST4 is a step of dropping a plurality of CSPs 204 into the storage tray 60 while supplying air from the air supply source 79 to the suction holes 75 and the holes 81 and supplying air between the suction holding pad 71 and the chip contact sheet 80 while disconnecting the air suction source 78. In the chip storage step ST4, the control unit 100 connects the air supply source 79 to the suction holes 75 and the holes 81 through the switching valve 77, and disconnects the air suction source 78 from the suction holes 75 and the holes 81, as shown in FIG. Fig.14 As shown, the air supply source 79 ejects air from a plurality of suction holes 75 and holes 81. The holes 81 are smaller than the suction holes 75 and the suction holes 75 and 81 are arranged at coaxial positions, so the air ejected from the suction holes 75 is supplied from the inner edge of the suction holes 75 to between the buffer sheet 74 and the chip contact sheet 80. Fig.14 As shown in FIG. 1 , each position of the chip contact sheet 80 except for the fixed outer edge is stretched so that the chip contact sheet 80 bulges downward, and vibrates so that it sometimes moves away from the buffer sheet 74 and sometimes contacts the buffer sheet 74. As a result, the contact area between the chip contact sheet 80 and the CSP 204 is reduced, so the transfer unit 70 causes the CSP 204 attracted and held by the buffer sheet 74 to fall toward the storage tray 60.

[0070] Furthermore, in the chip storage step ST4, even if a portion of the CSP 204 generates burrs during the division and the burrs are caught on the chip contact sheet 80, the chip contact sheet 80 is stretched and vibrated in a downwardly bulging manner, and thus the burrs are released, so that the CSP 204 previously caught on the chip contact sheet 80 by the burrs falls toward the storage tray 60. In the chip storage step ST4, when the air is ejected from the suction holes 75 and the holes 81 for a predetermined time, the conveying method is terminated.

[0071] In the conveying unit 70 of the first embodiment, the suction holes 75 of the buffer sheet 74 provided on the suction and holding pad 71 and the holes 81 of the chip contact sheet 80 provided on the lower surface 741 of the buffer sheet 74 are provided at corresponding positions. In addition, in the conveying unit 70 of the first embodiment, the outer edge of the chip contact sheet 80 is fixed to the outer edge of the buffer sheet 74, and the chip contact sheet 80 is not fixed to the buffer sheet 74 at positions other than the outer edge. Therefore, in the conveying unit 70, when air from the air supply source 79 is supplied to the suction holes 75 in a state where the CSP 204 is sucked and held by the chip contact sheet 80, the air with nowhere to go enters between the chip contact sheet 80 and the buffer sheet 74 of the suction and holding pad 71, and the chip contact sheet 80 is stretched in a manner of bulging in the downward direction. As a result, the conveying unit 70 has the effect of reducing the contact area between the chip contact sheet 80 and the CSP 204, thereby making it easier for the CSP 204 to fall into the storage tray 60, and preventing the CSP 204 from falling from the conveying unit.

[0072] In addition, in the conveying unit 70 of the first embodiment, the hole 81 is smaller than the suction hole 75 and is arranged at a coaxial position with the suction hole 75, so that the air supplied from the suction hole 75 enters between the chip contact sheet 80 and the buffer sheet 74 to vibrate the chip contact sheet 80, thereby facilitating the CSP 204 to fall into the storage tray 60.

[0073] In the conveying method of the first embodiment, when air is supplied from the air supply source 79 to the suction hole 75 in the chip storage step ST4, since the suction hole 75 and the hole 81 are provided at corresponding positions and the outer edges of the chip contact sheet 80 and the buffer sheet 74 are fixed to each other, the air having nowhere to go enters between the chip contact sheet 80 and the buffer sheet 74 of the suction and holding pad 71, and the chip contact sheet 80 is stretched in a manner of swelling in the downward direction. As a result, the conveying unit 70 has the following effect: the contact area between the chip contact sheet 80 and the CSP 204 is reduced, so that the CSP 204 is easily dropped into the storage tray 60, and the chip that does not drop from the conveying unit can be suppressed.

[0074] [Second embodiment]

[0075] A transport unit and a transport method according to a second embodiment of the present invention will be described with reference to the drawings. Fig.15 This is a plan view of the transport unit according to the second embodiment as seen from below. Fig.15 In the present invention, the same parts as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

[0076] The conveying unit 70 and the conveying method of the second embodiment are the same as those of the first embodiment except that the size of the hole 81 - 2 and the relative arrangement of the suction hole 75 and the hole 81 - 2 are different from those of the first embodiment.

[0077] The suction holes 75 of the conveying unit 70 of the second embodiment are the same as those of the first embodiment. In the conveying unit 70 of the second embodiment, a plurality of holes 81-2 are provided at positions corresponding to the suction holes 75 of the chip contact sheet 80 on the lower surface 741 of the buffer sheet 74 provided on the suction and holding pad 71. The holes 81-2 of the conveying unit 70 of the second embodiment penetrate the chip contact sheet 80 and are provided at positions corresponding to the CSP 204 in a one-to-one manner, similarly to the first embodiment. That is, the holes 81-2 are provided at positions that will be sealed by the corresponding CSP 204 when the CSP 204 is sucked by the suction and holding pad 71. In the second embodiment, the holes 81-2 correspond to the CSP 204 in a one-to-one manner, but a plurality of holes 81-2 may correspond to one CSP 204.

[0078] In the second embodiment, the planar shape of the hole 81-2 is formed into a circle and the inner diameter is formed to be equal to the inner diameter of the suction hole 75. Fig.15 As shown, the hole 81-2 is arranged at a position with a gap between the center and the center of the suction hole 75, and is formed so that a portion overlaps with the suction hole 75, and the hole 81-2 is offset from the suction hole 75. In the second embodiment, the so-called "the hole 81-2 is arranged at a position corresponding to the suction hole 75" means that when the hole 81-2 and the suction hole 75 are equal in size, the hole 81-2 is arranged so as to be offset relative to the suction hole 75 in such a manner that a portion of the hole 81-2 overlaps with the suction hole 75 in the Z-axis direction.

[0079] The suction and holding pad 71 of the second embodiment connects the air supply source 79 and the suction passage 76 through the switching valve 77, and the pressurized air from the air supply source 79 is ejected from the suction hole 75 and the hole 81-2, so that the ejected air enters between the chip contact piece 80 and the buffer piece 74 of the suction and holding pad 71, so that the chip contact piece 80 is stretched in a manner of bulging in the downward direction, so that the sucked and held CSP 204 is separated from the chip contact piece 80 and falls.

[0080] The conveying unit 70 and the conveying method of the second embodiment are similar to the first embodiment, and the suction holes 75 and the holes 81-2 are set at corresponding positions, and the outer edges of the chip contact sheet 80 and the buffer sheet 74 are fixed to each other. Therefore, when the air from the air supply source 79 is supplied to the suction hole 75 in the state where the CSP 204 is sucked and held by the chip contact sheet 80, the air with nowhere to go enters between the chip contact sheet 80 and the buffer sheet 74 of the suction and holding pad 71, and the chip contact sheet 80 is stretched in a bulging manner in the downward direction. As a result, the conveying unit 70 has the following effects: the contact area between the chip contact sheet 80 and the CSP 204 is reduced, and the CSP 204 is easily dropped into the storage tray 60, and the chip that does not drop from the conveying unit can be suppressed.

[0081] In the conveying unit 70 of the second embodiment, the hole 81 - 2 is equal in size to the suction hole 75 and is arranged offset, so that the air supplied from the suction hole 75 enters between the chip contact sheet 80 and the buffer sheet 74 to vibrate the chip contact sheet 80, thereby making it easy for the CSP 204 to fall into the storage tray 60.

[0082] [Modifications]

[0083] A conveying unit and a conveying method according to a modification of the first embodiment and the second embodiment of the present invention will be described with reference to the drawings. Fig.16 It is a cross-sectional view of a main part of a transport unit according to a modified example. Fig.16 In the present invention, the same reference numerals are used to denote the same parts as those in the first embodiment and the second embodiment, and description thereof will be omitted.

[0084] The transfer unit 70 of the modified example is the same as the first and second embodiments except that the method of fixing the chip contact sheet 80 to the suction and holding pad 71 is different from that of the first and second embodiments.

[0085] In the transfer unit 70 of the modified example, the planar shape of the chip contact sheet 80 is formed to be larger than the planar shape of the buffer sheet 74, such as Fig.16 As shown, the outer edge of the chip contact sheet 80 is bent to overlap with the outer side surface 732 of the attraction and holding pad 71. The conveying unit 70 of the modified example overlaps the outer edge of the chip contact sheet 80 with the plate member 82 made of sheet metal, etc., inserts the bolt 83 into the hole provided in the plate member 82 and the hole provided in the outer edge of the chip contact sheet 80, and screws the bolt 83 into the threaded hole provided in the pad body 73 of the attraction and holding pad 71, thereby fixing the outer edge of the chip contact sheet 80 to the attraction and holding pad 71.

[0086] The conveying unit 70 and the conveying method of the modified example are similar to the first and second embodiments, and the suction holes 75 and the holes 81 and 81-2 are provided at corresponding positions, and the outer edges of the chip contact sheet 80 and the buffer sheet 74 are fixed to each other. Therefore, when the air from the air supply source 79 is supplied to the suction hole 75 in a state where the CSP 204 is sucked and held by the chip contact sheet 80, the air with nowhere to go enters between the chip contact sheet 80 and the buffer sheet 74 of the suction and holding pad 71, and the chip contact sheet 80 is stretched in a manner of bulging in the downward direction. As a result, the conveying unit 70 has the following effect: the contact area between the chip contact sheet 80 and the CSP 204 is reduced, so that the CSP 204 is easily dropped into the storage tray 60, and the chips that do not drop from the conveying unit can be suppressed.

[0087] The present invention is not limited to the above-described embodiment, and can be implemented with various modifications within the scope of the present invention.

Claims

1. A transport unit for transporting a plurality of chips, characterized in that: The transport unit has: A suction and holding pad that sucks and holds the chips and has a plurality of suction holes formed at positions corresponding to the plurality of chips; an air supply source selectively connected to the suction hole; an air suction source selectively connected to the suction hole; as well as A chip contact sheet is disposed on the lower surface of the suction and holding pad and has a plurality of holes at positions corresponding to the suction holes. The outer edge of the chip contact piece is fixed to the attraction and retention pad, The air from the air supply source enters between the chip contact sheet and the attraction and holding pad to stretch the chip contact sheet in a bulging manner, so that the attracted and held chip is separated from the chip contact sheet and falls.

2. The transport unit according to claim 1, characterized in that: The hole is smaller than the suction hole.

3. The transport unit according to claim 1, characterized in that: The hole is formed so as to partially overlap with the suction hole.

4. A transport method, the transport method utilizing the transport unit according to claim 1, characterized in that: The conveying method has the following steps: a chip holding step of making the plurality of holes of the chip contact sheet contact the plurality of chips, and holding the chips by sucking air with an air suction source while cutting off the connection with the air supply source; A conveying step of conveying the plurality of chips to an upper portion of a storage tray while the chips are held; as well as The chip storage step is to drop the plurality of chips into the storage tray while supplying air from the air supply source and supplying the air between the suction and holding pad and the chip contact sheet in a state where the communication with the air suction source is cut off.

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