Dust-proof structure, microphone packaging structure, and electronic device

Abstract

The present invention discloses a dustproof structure, a microphone packaging structure and an electronic device, comprising a carrier, a through hole formed in the middle of the carrier; a membrane, the membrane comprising a grid structure and a connecting portion arranged around the grid structure, the grid structure covers one end of the through hole, and the connecting portion is connected to the carrier; the carrier comprises an organic material and a filler, and the thermal expansion coefficient of the filler is lower than that of the organic material. One effect of the present invention is that by adding a filler with a thermal expansion coefficient lower than that of the organic material to the carrier, the thermal expansion coefficient of the carrier is reduced, and the deformation amount of the carrier after being heated is reduced, so as to protect the dustproof structure from falling off or being damaged.

Description

Technical Field

[0001] The present invention relates to the field of acoustic and electrical technology, and more specifically, to a dustproof structure, a microphone packaging structure and an electronic device. Background Art

[0002] The dustproof structure will be heated during the process of being assembled to the printed circuit board or during the use process after being assembled to the printed circuit board. The dustproof structure itself will expand after being heated. Due to the different thermal expansion coefficients between different parts, the deformation of the dustproof structure after being heated may cause it to fall off from the circuit board or be damaged.

[0003] Therefore, it is necessary to provide a new technical solution to solve the above problems. Summary of the invention

[0004] An object of the present invention is to provide a new technical solution for a dustproof structure, a microphone packaging structure and an electronic device.

[0005] According to a first aspect of the present invention, there is provided a dustproof structure, comprising:

[0006] A carrier, wherein a through hole is formed in the middle of the carrier;

[0007] A film body, the film body comprising a grid structure and a connecting portion arranged around the grid structure, the grid structure covers one end of the through hole, and the connecting portion is connected to the carrier;

[0008] The carrier includes an organic material and a filler, wherein the thermal expansion coefficient of the filler is lower than that of the organic material.

[0009] Optionally, the material of the film body is a single element metal or alloy.

[0010] Optionally, at least one layer of the film body is included.

[0011] Optionally, the carrier is a single layer, and the concentration of the filler is different along the thickness direction of the carrier.

[0012] Optionally, the filler concentration of the carrier gradually increases from the side where the membrane body is located to the side facing away from the membrane body.

[0013] Optionally, the carrier is multi-layered, and the composition and / or concentration of the filler are different layer by layer along the thickness direction of the carrier.

[0014] Optionally, the thermal expansion coefficient of the filler component of the carrier decreases layer by layer and / or the concentration of the filler increases layer by layer from the side where the membrane body is located to the side facing away from the membrane body.

[0015] Optionally, the thermal expansion coefficient of the filler in at least one layer is anisotropic, and the thermal expansion coefficient of the filler in a direction perpendicular to the plane direction of the layer is smaller than the thermal expansion coefficient of the filler in the plane direction of the layer.

[0016] Optionally, the filler is in a shape of at least one of a rod, a needle, a fiber, and a grid.

[0017] Optionally, the dustproof structure has a thickness of 45um-90um.

[0018] According to a second aspect of the present invention, there is provided a microphone packaging structure, comprising the above-mentioned dustproof structure, wherein the dustproof structure is fixed on the sound hole of the microphone packaging structure;

[0019] Alternatively, the dustproof structure covers the MEMS chip in the microphone packaging structure.

[0020] According to a third aspect of the present invention, there is provided an electronic device comprising the above-mentioned microphone packaging structure.

[0021] According to one embodiment of the present disclosure, by adding a filler with a lower thermal expansion coefficient than the organic material into the carrier, the thermal expansion coefficient of the carrier is reduced, and the deformation of the carrier after heating is reduced to protect the dustproof structure from falling off or being damaged.

[0022] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0024] Figure 1 It is a structural schematic diagram of a dustproof structure of an embodiment of the present disclosure.

[0025] Figure 2 It is a schematic diagram of the structure of a membrane body having three layers according to an embodiment of the present disclosure.

[0026] Figure 3 It is a schematic diagram of the structure of a carrier with different filler concentrations along the thickness direction according to an embodiment of the present disclosure.

[0027] Figure 4 It is a schematic structural diagram of a carrier according to an embodiment of the present disclosure in which the filler concentration is reduced along the thickness direction.

[0028] Figure 5 It is a schematic diagram of the structure of a carrier with three layers according to an embodiment of the present disclosure.

[0029] Figure 6It is a structural schematic diagram of an embodiment of the present invention in which the filler concentration in each layer of the carrier decreases along the thickness direction.

[0030] Figure 7 It is a structural schematic diagram of an embodiment of the present disclosure in which the filler concentration in each layer of the carrier increases along the thickness direction.

[0031] Figure 8 It is a structural schematic diagram of a carrier in which the thermal expansion coefficient of each layer of filler decreases along the thickness direction according to an embodiment of the present disclosure.

[0032] Fig. 9 It is a structural schematic diagram of a carrier in which the thermal expansion coefficient of each layer of filler increases along the thickness direction according to an embodiment of the present disclosure.

[0033] Fig.10 It is a schematic diagram of the CC sectioning position of a carrier according to an embodiment of the present disclosure.

[0034] Fig.11 It is a schematic diagram of the needle-shaped filler structure at the CC plane of an embodiment of the present disclosure.

[0035] Fig.12 It is a schematic diagram of the fibrous filler structure at the CC plane of an embodiment of the present disclosure.

[0036] Fig.13 It is a schematic diagram of the DD position of the layer structure of the carrier of one embodiment of the present disclosure.

[0037] Fig.14 It is a schematic diagram of the direction in which deformation will occur in the thickness direction at the DD position of an embodiment of the present disclosure.

[0038] Fig.15 It is a schematic diagram of the direction in which deformation will occur in the direction of the layer where the filler at the DD position is located in one embodiment of the present disclosure.

[0039] Fig.16 It is a deformation schematic diagram of the plane where the needle-shaped filler is located according to an embodiment of the present disclosure.

[0040] Fig.17 It is a deformation schematic diagram of the plane where the fibrous filler is located according to an embodiment of the present disclosure.

[0041] Fig.18 It is a deformation schematic diagram of a plane where regularly distributed needle-shaped fillers are located according to an embodiment of the present disclosure.

[0042] Fig.19 It is a deformation schematic diagram of the plane where the grid-like filler is located according to an embodiment of the present disclosure.

[0043] Fig. 20 It is a schematic diagram of the heat deformation process of the dustproof structure in the prior art.

[0044] Fig.21 It is a schematic diagram of the heat deformation process of the dustproof structure of an embodiment of the present disclosure.

[0045] Fig. 22 It is a schematic diagram of a dustproof structure provided in a sound hole on a microphone packaging structure substrate according to an embodiment of the present disclosure.

[0046] Fig.23 It is a schematic diagram of a dustproof structure provided at a MEMS chip on a microphone packaging structure substrate according to an embodiment of the present disclosure.

[0047] In the figure, 1 is a membrane, 11 is a first membrane layer, 12 is a second membrane layer, 13 is a third membrane layer, 2 is a carrier, 21 is a first carrier layer, 22 is a second carrier layer, 23 is a third carrier layer, 3 is a printed substrate, 31 is an acoustic hole, 32 is a MEMS chip, and 4 is an adhesive. DETAILED DESCRIPTION

[0048] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0049] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0050] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0051] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0052] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0053] According to one embodiment of the present disclosure, a dustproof structure is disclosed, such as Figure 1 As shown, the dustproof structure includes a carrier 2, and a through hole is formed in the middle of the carrier 2;

[0054] A membrane body 1, wherein the membrane body 1 comprises a grid structure and a connecting portion arranged around the grid structure, wherein the grid structure covers one end of the through hole, and the connecting portion is connected to the carrier 2;

[0055] The carrier 2 includes an organic material and a filler, and the thermal expansion coefficient of the filler is lower than that of the organic material. For example, at least a portion of the carrier 2 along the thickness direction includes an organic material and a filler. The material of the carrier 2 is mainly an organic material, and a filler with a low thermal expansion coefficient is added to the organic material.

[0056] In this embodiment, the film body and the carrier in the dustproof structure are fixed together so that the carrier supports the film body. For example, the carrier and the film body are fixed together using a thermal bonding process. The thermal bonding process can tightly bond different materials.

[0057] Generally, the material of the film body 1 has a lower thermal expansion coefficient than the material of the carrier 2. The material forming the carrier 2 is mainly an organic material, and a filler having a thermal expansion coefficient lower than that of the organic material is added to the carrier 2. This can reduce the thermal expansion coefficient of the entire carrier. For example, during the thermal bonding process, the thermal deformation of the carrier can be reduced, effectively suppressing the overall shape deformation of the dustproof structure.

[0058] By adding fillers to reduce the overall thermal expansion coefficient of the carrier, the ability of the carrier 2 to suppress thermal deformation is improved, and the thermal deformation of the carrier when heated can be reduced, thereby reducing the deformation of the dustproof structure after heating and preventing the dustproof structure from being damaged.

[0059] For example, the filler can be metal, metal oxide, glass, carbon, etc.

[0060] In one embodiment, the material of the film body 1 is a single element metal or alloy.

[0061] In this embodiment, the membrane body 1 having a grid structure can effectively improve the performance of the dustproof structure.

[0062] Single-element metals or alloys have high strength and lower thermal expansion coefficients than organic materials. When heated, the deformation is small and the structure of the dustproof structure itself will not be damaged.

[0063] In one embodiment, the dustproof structure includes at least one layer of the film body 1. For example, the number of layers of the film body 1 includes one layer, two layers, three layers, four layers, etc. Figure 2 As shown, the film body 1 has three layers, including a first film body layer 11 , a second film body layer 12 , and a third film body layer 13 .

[0064] For example, when the film 1 and the carrier 2 are thermally bonded, or when the dustproof structure and the printed substrate 3 are thermally bonded, heat is generated and the dustproof structure is heated. For example, the thermal bonding is performed using an adhesive 4. Since the metal has a low thermal expansion coefficient, the amount of deformation caused by heat is small. There will not be a large amount of deformation during the installation and fixing process, and the structure and performance of the dustproof structure itself will not be affected.

[0065] In one embodiment, Figure 3 As shown, the carrier 2 is a single layer, and the concentration of the filler along the thickness direction of the carrier 2 is different.

[0066] In this embodiment, the carrier 2 is configured as a single layer, and the single layer carrier 2 is a whole, so that the carrier 2 has a more stable structural strength. The filler in the carrier 2 is mixed with the organic material, and the filler content in the thickness direction of the carrier 2 is different, that is, the concentration of the filler in the thickness direction of the carrier is different.

[0067] For example, in the process of installing the dustproof structure on the printed substrate 3, thermal bonding is required. The heat received by each part of the carrier 2 is different, and the deformation amount generated at each part of the carrier 2 is also different. The concentration of the filler in the thickness direction of the carrier 2 is different, so that the filler reduces the thermal expansion coefficient at each part of the thickness direction of the carrier 2 to different degrees. In this way, the deformation of the carrier can be controlled, and the deformation amount at each position is gradually reduced to a similar degree, avoiding the problem of damage to the carrier due to different deformation amounts at different positions of the carrier 2.

[0068] Optionally, the filler concentration of the carrier 2 gradually increases from the side where the membrane body 1 is located to the side facing away from the membrane body 1 .

[0069] The filler concentration in the carrier 2 is set to gradually increase from the side where the film body 1 is located to the side facing away from the film body 1. In this way, the thermal expansion coefficient of the carrier 2 in this direction will gradually decrease, which can reduce the deformation of the carrier. The thermal expansion coefficient is lower at the location where the filler concentration is higher.

[0070] For example, the side of the carrier 2 far from the membrane body 1 is subjected to greater heat during installation and undergoes greater deformation. However, by gradually increasing the filler concentration in the carrier 2 from the side where the membrane body 1 is located to the side facing away from the membrane body 1, the thermal expansion coefficient at the position with greater deformation can be further reduced. This can effectively reduce the deformation degree of the carrier 2 and protect the dustproof structure from being damaged.

[0071] It can also be, Figure 4 As shown, the filler concentration of the carrier 2 gradually decreases from the side where the membrane body 1 is located to the side facing away from the membrane body 1 .

[0072] The filler concentration in the carrier 2 is set to gradually decrease from the side where the film body 1 is located to the side facing away from the film body 1. In this way, the thermal expansion coefficient of the carrier 2 is reduced, which can reduce the deformation of the carrier. The thermal expansion coefficient is lower at the location where the filler concentration is higher.

[0073] For example, the filler concentration on the side close to the membrane body 1 is higher. During the installation of the dustproof structure, the thermal expansion coefficient of this side is lower, and the ability to suppress deformation is better.

[0074] In one embodiment, the carrier 2 is multi-layered, and the filler has different composition and / or concentration layer by layer along the thickness direction of the carrier 2. For example, the carrier 2 has two, three, or four layers. Figure 5 As shown, the carrier 2 includes a first carrier layer 21 , a second carrier layer 22 , and a third carrier layer 23 .

[0075] In this embodiment, the carrier 2 is a multi-layer structure. Different filler materials are added to each layer structure and / or the filler concentrations in each layer structure are different, and the thermal expansion coefficients of different fillers are different. In this way, the thermal expansion coefficients of each layer structure of the carrier 2 can be different, and the deformation of each layer structure can be reduced to different degrees.

[0076] For example, during the process of installing the dustproof structure on the printed circuit board, each layer of the carrier 2 receives different amounts of heat, resulting in different amounts of deformation of each layer. Therefore, each layer has fillers with different components, or each layer has different filler concentrations, which can reduce the deformation of each layer to different degrees.

[0077] For example, a higher concentration of filler can be added to a layer structure that is subjected to greater heat, or the thermal expansion coefficient of the added filler can be lower than that of other layers. This can reduce the deformation of each layer to varying degrees, maintain the original shape of the carrier 2 to the greatest extent, and prevent the carrier 2 from being damaged due to thermal deformation.

[0078] Alternatively, if Figure 6 As shown, the filler concentration of the carrier 2 decreases layer by layer from the side where the membrane body 1 is located to the side facing away from the membrane body 1. The filler concentration of the first carrier layer 21 is greater than the filler concentration of the second carrier layer 22 and greater than the filler concentration of the third carrier layer 23.

[0079] In this way, during the installation process, the thermal expansion coefficient of the side of the carrier 2 close to the film body 1 is smaller, and the ability to suppress thermal deformation is stronger.

[0080] Alternatively, if Figure 7 As shown in FIG8 , the thermal expansion coefficient of the filler component of the carrier 2 decreases layer by layer and / or the concentration of the filler increases layer by layer from the side where the membrane body 1 is located to the side facing away from the membrane body 1 .

[0081] From the side of the carrier 2 that contacts the film body 1 to the side that faces away from the film body 1, the thermal expansion coefficient of the filler component decreases layer by layer and / or the concentration of the filler increases layer by layer. In this direction, the thermal expansion coefficient of the carrier 2 decreases layer by layer. In this way, the ability to suppress thermal deformation becomes stronger layer by layer.

[0082] As described above, the filler concentration increases layer by layer from the side of the carrier 2 that contacts the membrane body 1 to the side that faces away from the membrane body 1. Figure 7 As shown, the filler concentration of the first carrier layer 21 is less than the filler concentration of the second carrier layer 22.

[0083] As described above, from the side of the carrier 2 that contacts the film body 1 to the side that faces away from the film body 1, the thermal expansion coefficient of the filler component decreases layer by layer. Figure 8 As shown, the thermal expansion coefficient of the filler in the first carrier layer 21 is greater than the thermal expansion coefficient of the filler in the second carrier layer 22 and greater than the thermal expansion coefficient of the filler in the third carrier layer 23 .

[0084] For example, the side of the carrier away from the membrane body is subjected to greater heat during installation and thus undergoes greater deformation. In this embodiment, the expansion coefficient of the layer structure disposed on the side of the carrier away from the membrane body is lower, and the amount of deformation caused by heat is reduced. This can reduce deformation to a greater extent and maintain the original shape of the carrier.

[0085] Alternatively, the thermal expansion coefficient of the filler component increases layer by layer from the side of the carrier 2 that contacts the film body 1 to the side that faces away from the film body 1. Fig. 9 As shown, the thermal expansion coefficient of the filler in the first carrier layer 21 is less than the thermal expansion coefficient of the filler in the second carrier layer 22 and less than the thermal expansion coefficient of the filler in the third carrier layer 23 .

[0086] In one embodiment, the thermal expansion coefficient of the filler in at least one layer is anisotropic, and the thermal expansion coefficient of the filler in a direction perpendicular to the plane of the layer is smaller than the thermal expansion coefficient of the filler in a plane direction of the layer.

[0087] In this embodiment, in at least one layer of the carrier, the thermal expansion coefficient of the filler material is anisotropic. Specifically, the thermal expansion coefficient of the filler in a direction perpendicular to the plane direction of the layer is smaller than the thermal expansion coefficient of the filler in the plane direction of the layer, so that the structural strength in the plane direction of the layer can be enhanced and the deformation of the layer can be resisted.

[0088] For example, the filler is in at least one of a rod shape, a needle shape, a fiber shape and a grid shape. Fillers of these shapes can enhance the structural strength of the carrier layer and inhibit deformation.

[0089] like Fig.10 As shown, the carrier 2 is cut open from CC, and the filler is in a shape extending along the plane where CC is located. For example, Fig.11 In the case of a punctate filler, the filler is needle-shaped, and the long axis of the needle-shaped filler is distributed along the CC plane. Fig.12 In the embodiment, the filler is fibrous, and the fibrous seasoning is distributed along the CC plane.

[0090] like Fig.13 As shown, DD is a layer structure of carrier 2.

[0091] Fig.14 It is the direction in which DD will deform in the thickness direction when the carrier 2 is heated.

[0092] Fig.15 It is the direction in which DD will deform in the plane direction of the layer where the filler is located when the carrier 2 is heated.

[0093] In the embodiment of the present disclosure, the filler in at least one layer is set to a shape extending along the plane direction of the layer where the filler is located. This can drive the layer of the carrier 2 to deform along the plane where the filler is located during the deformation process ( Fig.15 direction indicated by the arrow).

[0094] like Fig.16 As shown, the filler is needle-shaped, and the long axis of the needle-shaped filler extends along a layer of the carrier 2 where the filler is located, and the needle-shaped fillers are irregularly distributed. In this case, the thermal deformation can drive the layer of the carrier 2 to deform along the plane where the filler is located during the deformation process. For example, as shown by the arrows in the figure, the deformation amount of the filler layer extends uniformly in all directions along the layer.

[0095] like Fig.17 As shown, the filler is fibrous, and the distribution direction of the fibrous filler extends along a layer of the carrier 2 where the filler is located. In this case, the thermal deformation can drive the layer of the carrier 2 to deform along the plane where the filler is located during the deformation process. For example, as shown by the arrows in the figure, the deformation amount of the filler layer extends uniformly in all directions along the layer.

[0096] like Fig.18 As shown, the filler is needle-shaped, and the long axis of the needle-shaped filler extends along a layer of the carrier 2 where the filler is located, and the needle-shaped fillers are regularly distributed. In this case, the thermal deformation can drive the layer of the carrier 2 to deform along the plane where the filler is located during the deformation process. For example, as shown by the arrows in the figure, the deformation amount of the filler layer is different in each direction of the layer.

[0097] like Fig.19 As shown, the filler is in a grid shape, and the grid-shaped filler extends along a layer of the carrier 2 where the filler is located. In this case, the thermal deformation can drive the layer of the carrier 2 to deform along the plane where the filler is located during the deformation process. For example, as shown by the arrows in the figure, the deformation amount of the filler layer extends uniformly in all directions along the layer.

[0098] Fig. 20 This is the process in which the existing dustproof structure is deformed by heat.

[0099] The adhesive 4 on the printed substrate 3 softens after being heated, and the carrier 2 and the film body 1 are deformed.

[0100] The temperature of the dustproof structure drops after being unheated, and the carrier 2 and the film body 1 return to their original state, but the adhesive 4 begins to solidify, fixing the carrier 2 and the film body 1 in the deformed structure. In this way, the dustproof structure maintains the deformed structure, which will cause damage to the dustproof structure.

[0101] Fig.21 This is the process in which the dustproof structure in one embodiment of the present disclosure is deformed by heat.

[0102] The adhesive 4 on the printed substrate 3 softens after being heated, and the carrier 2 and the film body 1 are deformed.

[0103] Fillers with a lower thermal expansion coefficient are added to the carrier 2, and the deformation of the carrier 2 is very small. After the dustproof structure is not heated, the temperature drops, the carrier 2 and the film body 1 return to their original state, and the adhesive 4 begins to solidify. After re-fixation, the deformation of the carrier 2 and the film body 1 is very small, and the dustproof structure will not be damaged.

[0104] In one embodiment, the dustproof structure has a thickness of 45um-90um.

[0105] Within this thickness range, it is possible to avoid the adhesive from affecting the dustproof structure after the dustproof structure is mounted on the printed circuit board.

[0106] Optionally, the thickness of the film body 1 is 45 um, and the thickness of the carrier 2 is 45 um. Under this thickness, the dustproof structure has a better ability to prevent the adhesive from affecting the performance.

[0107] Further optionally, the dustproof structure has a thickness of 45 um-65 um. Within this thickness range, it is possible to avoid the dustproof structure being affected by the adhesive after the dustproof structure is mounted on the printed substrate.

[0108] Optionally, the thickness of the film body 1 is 45 um, and the thickness of the carrier 2 is 20 um. Under this thickness, the dustproof structure has a better ability to prevent the adhesive from affecting the performance.

[0109] According to an embodiment of the present invention, there is provided a microphone packaging structure, the microphone packaging structure comprising the above-mentioned dustproof structure, wherein the dustproof structure is fixed on the sound hole 31 of the microphone packaging structure;

[0110] Alternatively, the dustproof structure covers the MEMS chip 32 in the microphone packaging structure.

[0111] Generally, the microphone packaging structure includes a shell forming a receiving cavity and a substrate fixed to the shell. The sound hole 31 can be arranged on the substrate or on the shell.

[0112] In this embodiment, the dustproof structure may be fixed to the sound hole 31 from the outside of the microphone packaging structure, thereby protecting the components in the microphone packaging structure from the outside.

[0113] It can also be, Fig. 22As shown, the dustproof structure is fixed on the sound hole 31 from the inside of the microphone packaging structure, thereby protecting the components of the microphone packaging structure from the inside.

[0114] It can also be, Fig.23 As shown, the dustproof structure is fixed on the substrate to protect the sound hole 31 and the interior of the microphone packaging structure. The MEMS chip 32 is fixed by the dustproof structure.

[0115] Alternatively, the dustproof structure is fixed inside the microphone packaging structure and covers the MEMS chip 32. This can protect the MEMS chip 32. In this structure, the carrier 2 can be fixed on the substrate where the MEMS chip 32 is located to form a cover. The carrier 2 can also be fixed on the substrate of the MEMS chip 32 to form a cover. The above structures can all protect the MEMS chip 32.

[0116] The microphone packaging structure can effectively prevent the dustproof structure from being damaged by heat during the installation and use of the microphone, and can also protect the components in the microphone, for example, protecting the MEMS chip 32 from being contaminated by external dust and other pollutants.

[0117] According to an embodiment of the present invention, an electronic device is provided, comprising the above-mentioned microphone packaging structure.

[0118] The electronic device includes the microphone and has all the advantages of the microphone packaging structure. For example, the electronic device can be an audio device, a mobile phone, a computer and other products.

[0119] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A dustproof structure, characterized in that: include: A carrier, wherein a through hole is formed in the middle of the carrier; A film body, the film body comprising a grid structure and a connecting portion arranged around the grid structure, the grid structure covers one end of the through hole, and the connecting portion is connected to the carrier; The carrier comprises an organic material and a filler, wherein the thermal expansion coefficient of the filler is lower than that of the organic material; The thermal expansion coefficient of the filler in at least one layer of the carrier is anisotropic, and the thermal expansion coefficient of the filler in a direction perpendicular to the plane direction of the layer is smaller than the thermal expansion coefficient of the filler in the plane direction of the layer.

2. The dustproof structure according to claim 1, characterized in that: The material of the film body is a single element metal or alloy.

3. The dustproof structure according to claim 2, characterized in that: The invention comprises at least one layer of the film body.

4. The dustproof structure according to any one of claims 1, characterized in that: The carrier is a single layer, and the concentration of the filler is different along the thickness direction of the carrier.

5. The dustproof structure according to claim 4, characterized in that: The filler concentration of the carrier increases gradually from the side where the membrane body is located to the side facing away from the membrane body.

6. The dustproof structure according to claim 1, characterized in that: The filler is in at least one of a rod shape, a needle shape, a fiber shape and a grid shape.

7. The dustproof structure according to any one of claims 1 to 6, characterized in that: The thickness of the dustproof structure is 45um-90um.

8. A microphone packaging structure, characterized in that: include: The dustproof structure of claim 7, wherein the dustproof structure is fixed to the sound hole of the microphone packaging structure; Alternatively, the dustproof structure covers the MEMS chip in the microphone packaging structure.

9. An electronic device, characterized in that: Including the microphone packaging structure as described in claim 8.

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