Strengthening mechanism and post-processing device

By strengthening the heating and cooling processes of the mechanism and post-processing device, the problem of weak adhesion between layers in 3D printed products was solved, thereby improving the structural strength of the products.

CN110948875BActive Publication Date: 2026-04-17SHENZHEN 7TH TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN 7TH TECH CO LTD
Filing Date
2018-09-26
Publication Date
2026-04-17

AI Technical Summary

Technical Problem

3D printed products often have low physical strength due to weak adhesion between layers, making them prone to separation between layers.

Method used

The product is heated to a preset temperature by using a strengthening mechanism and post-processing device, and the heating element and control module melt and re-bond the layers, resulting in a stronger bond. The product heating and cooling process is realized by combining a heat exchange mechanism and a cooling mechanism.

Benefits of technology

It improves the structural strength of 3D printed products, ensures a strong bond between layers, and enhances the overall physical properties of the products.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to a reinforcing mechanism and a post-processing device, the post-processing device comprising a heat exchange mechanism and the reinforcing mechanism, the heat exchange mechanism being used for placing products, the reinforcing mechanism comprising a shell, a heating element and a control module, the shell being internally provided with a cavity, the heat exchange mechanism and the heating element being arranged in the cavity, and the heating element being used for heating the heat exchange mechanism. The control module is connected with the heating element, the control module can make the heating element heat up to a preset temperature, so that the heating element can heat the heat exchange mechanism placed in the reinforcing mechanism, and then heat the products placed in the heat exchange mechanism, after the products heat up to the preset temperature, the layers can be fused and re-adhered, so that the structural strength of the products can be improved.
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Description

Technical Field

[0001] This invention relates to the field of 3D printing technology, and in particular to a strengthening mechanism and a post-processing device. Background Technology

[0002] 3D printing, a type of rapid prototyping technology, connects a printer to a computer. Under the computer's control, the printer uses powder, metal, or plastic—materials that can be bonded—to construct a physical object from a digital model file on the computer, layer by layer. With the development of 3D printing technology, its applications are becoming increasingly widespread, including mold making, industrial design, automotive, and medical fields. However, because products manufactured using 3D printing are created by bonding layers together, weak adhesion between layers can lead to lower physical strength, and even layer separation. Summary of the Invention

[0003] Therefore, it is necessary to provide a strengthening mechanism and post-processing device that can improve the strength of traditional 3D printed products, addressing the issue of low physical strength.

[0004] A reinforcement mechanism, comprising:

[0005] The outer shell has an internal cavity for accommodating a heat exchange mechanism, which is used to hold the product.

[0006] A heating element is disposed within the cavity, and the heating element is used to heat the heat exchange mechanism; and

[0007] A control module is connected to the heating element, and the control module enables the heating element to be heated to a preset temperature.

[0008] In one embodiment, a heat insulation cover is also included, which is disposed within the cavity and connected to the control module. The heating element is disposed within the heat insulation cover, which also serves to house the heat exchange mechanism.

[0009] In one embodiment, a first temperature detector is also included, which is located inside the cavity and connected to the control module.

[0010] A post-processing apparatus includes a heat exchange mechanism and any of the aforementioned strengthening mechanisms.

[0011] In one embodiment, the heat exchange mechanism includes an outer casing and an inner casing, the inner casing being located inside the outer casing, and the inner casing having a accommodating cavity for accommodating the product and heat-conducting particles;

[0012] The inner box includes a box body and a partition. The partition is disposed in the box body to divide the accommodating cavity into multiple interconnected chambers. The partition is used to place the product.

[0013] In one embodiment, the outer casing includes a body and fins, the inner casing is located inside the body, and the fins are disposed on the outside of the body.

[0014] In one embodiment, a cooling mechanism is also included for cooling the heat exchange mechanism after it has been heated by the strengthening mechanism, thereby cooling the product.

[0015] In one embodiment, the cooling mechanism includes a housing with a cavity inside for accommodating the heat exchange mechanism and the cooling medium.

[0016] In one embodiment, the cooling mechanism further includes a circulation pipe and a circulation assembly, with both ends of the circulation pipe connected to the housing and the circulation assembly, respectively, and the circulation assembly used to circulate the cooling medium.

[0017] In one embodiment, the cooling mechanism further includes a control module and a second temperature detector, the second temperature detector being located within the cavity and connected to the control module.

[0018] The post-processing device described above has a strengthening mechanism control module that can raise the heating element to a preset temperature. The heating element can then heat the heat exchange mechanism placed in the strengthening mechanism, and in turn, heat the product placed in the heat exchange mechanism. After the product is heated to the preset temperature, the layers will melt and re-bond, thereby improving the structural strength of the product. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] in:

[0021] Figure 1 A schematic diagram of the reinforcing mechanism in one embodiment;

[0022] Figure 2 for Figure 1 A cross-sectional view showing the cooperation between the strengthening mechanism and the heat exchange mechanism;

[0023] Figure 3 for Figure 2A cross-sectional view of the heat exchange mechanism shown;

[0024] Figure 4 This is a cross-sectional view of the cooling mechanism and heat exchange mechanism in one embodiment. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Please refer to Figure 2 and Figure 4 One embodiment of the post-processing apparatus includes a strengthening mechanism 10, a heat exchange mechanism 20, and a cooling mechanism 30. The heat exchange mechanism 20 is used to hold the product and can be used in conjunction with either the strengthening mechanism 10 or the cooling mechanism 30. When the heat exchange mechanism 20 is located within the strengthening mechanism 10, the strengthening mechanism 10 heats the heat exchange mechanism 20, which then transfers heat to the product to raise its temperature. When the heat exchange mechanism 20 is located within the cooling mechanism 30, the cooling mechanism 30 cools the heat exchange mechanism 20, thereby cooling the product placed within it. The product referred to here is primarily a completed 3D printed product. After the product is printed, it can be placed in the heat exchange mechanism 20 first, and then the heat exchange mechanism 20 can be placed into the strengthening mechanism 10. After the strengthening mechanism 10 heats the heat exchange mechanism 20 for a period of time, the heat exchange mechanism 20 is removed and placed in the cooling mechanism 30 for cooling. After being heated by the strengthening mechanism 10, the layers of the product will initially melt and re-bond, so that the contact surfaces between the layers will be fully integrated and the bond between the layers will become stronger.

[0027] In other embodiments, the post-processing unit can also be used to process products other than 3D printed products. Additionally, during the cooling stage, the product can be cooled by allowing it to stand still, thus omitting the cooling mechanism 30.

[0028] Please refer to Figure 1 and Figure 2 The strengthening mechanism 10 includes a housing 110, a heating element 120, and a control module 130. The housing 110 has a cavity 112, and the heat exchange mechanism 20 and the heating element 120 are both located in the cavity 112. The control module 130 is connected to the heating element 120 and can heat the heating element 120 to a preset temperature. At this preset temperature, the layers of the product will initially melt and then re-bond.

[0029] In this specific embodiment, the outer casing 110 includes a body 114 and an observation window 116. The body 114 and the observation window 116 are connected to form a cavity 112. The observation window 116 is transparent, allowing operators to observe the interior of the reinforcing mechanism 10 during operation. In other embodiments, the observation window 116 may be omitted.

[0030] The heating element 120 supports the heat exchange mechanism 20. After the heating element 120 heats up, it directly transfers heat to the heat exchange mechanism 20, reducing heat loss. It is understood that in other embodiments, the heating element 120 may also be spaced apart from the heat exchange mechanism 20, and the heat generated by the heating element 120 can be transferred to the heat exchange mechanism 20 through air or a thermally conductive object.

[0031] The reinforcing mechanism 10 also includes a heat insulation cover 140 connected to the outer shell 110. The heat insulation cover 140 is disposed within the cavity 112 and connected to the control module 130. The heating element 120 and the heat exchange mechanism 20 are disposed within the heat insulation cover 140. The heat insulation cover 140 has a heat preservation function. After the heating element 120 heats the ambient temperature inside the heat insulation cover 140 to a preset temperature, the control module 130 can maintain the ambient temperature of the heat exchange mechanism 20 at the preset temperature within a preset time, thereby improving energy utilization. In addition, the heat insulation cover 140 can also isolate the heating element 120 from at least a part of the structure of the outer shell 110. Therefore, to a certain extent, the heat insulation cover 140 can prevent the outer shell 110 from being severely heated, thereby preventing workers from being burned when touching the outer shell 110.

[0032] like Figure 2 As shown, the strengthening mechanism 10 also includes a first temperature detector 150, which is located inside the cavity 112 and connected to the control module 130. Specifically, in this embodiment, the first temperature detector 150 is disposed on the inner wall of the insulation cover 140, mainly used to detect the temperature of the internal environment of the insulation cover 140 and feed the detected temperature back to the control module 130. When the temperature detected by the first temperature detector 150 reaches a preset temperature, the control module 130 will stop the heating element 120 to prevent the product from over-melting and deforming.

[0033] It is worth mentioning that in other embodiments, the heat insulation cover 140 can be omitted, and the outer shell 110 can be made into a structure with heat insulation function, or a layer of heat insulation material, such as asbestos, can be coated on the inner wall of the outer shell 110. In this case, the first temperature detector 150 can be set on the inner wall of the outer shell 110.

[0034] Please refer to Figures 2 to 4The heat exchange mechanism 20 includes an outer casing 210 and an inner casing 220. The inner casing 220 is located inside the outer casing 210 and has a receiving cavity 222 for accommodating the product. The receiving cavity 222 also accommodates heat-conducting particles. After the product is placed in the inner casing 220, heat-conducting particles are added to the inner casing 220. The heat-conducting particles completely envelop the product, not only evenly transferring heat to the product but also providing support and fixation to prevent heat deformation. In other embodiments, the inner casing 220 may be omitted.

[0035] The outer casing 210 has a through hole 212, which communicates with the accommodating cavity 222. The through hole 212 mainly allows heat-conducting particles to pass through. Before the heat exchange mechanism 20 is placed inside the strengthening mechanism 10, the through hole 212 is in the open state, allowing heat-conducting particles to be added into the accommodating cavity 222. When the heat exchange mechanism 20 is located inside the strengthening mechanism 10 and the cooling mechanism 30, the through hole 212 is in the closed state.

[0036] The inner casing 220 includes a casing 224 and partitions 226. The partitions 226 are disposed within the casing 224 to divide the accommodating cavity 222 into multiple interconnected chambers 228. The partitions 226 are used to hold products. The partitions 226 allow the heat exchange mechanism 20 to simultaneously hold multiple products, thereby improving the product strengthening and cooling efficiency. Furthermore, the chambers 228 are interconnected, allowing heat-conducting particles to move between chambers 228.

[0037] In this embodiment, a partition 226 is provided, dividing the accommodating cavity 222 into an upper chamber 228a and a lower chamber 228b, which are connected. A through hole 212 communicates with the lower chamber 228b. The heat exchange mechanism 20 can simultaneously accommodate two products, one of which is placed on the partition 226, i.e., located in the upper chamber 228a, and the other product is located in the lower chamber 228b. When heat-conducting particles are added to the heat exchange mechanism 20, the particles pass through the through hole 212, then through the lower chamber 228b, and enter the upper chamber 228a. It is understood that in other embodiments, the number of partitions 226 may be two or more.

[0038] Furthermore, in this embodiment, the partition 226 is provided with an opening for connecting the upper chamber 228a and the lower chamber 228b. Of course, in other embodiments, the partition 226 can also be omitted, and a certain gap can be left between the partition 226 and part of the inner wall of the housing 224.

[0039] The outer casing 210 includes a body 214 and fins 216. The inner casing 220 is located inside the body 214. The fins 216 are located on the outside of the body 214. When the heat exchange mechanism 20 is located inside the reinforcing mechanism 10, the fins 216 can increase the heat-receiving area and improve the heat transfer efficiency. When the heat exchange mechanism 20 is located inside the cooling mechanism 30, the fins 216 can increase the cooling area and improve the cooling efficiency. It is understood that in other embodiments, the fins 216 may be omitted.

[0040] Please refer to Figure 4 The cooling mechanism 30 includes a housing 310, a circulation pipe 320, and a circulation assembly (not shown). The housing 310 contains a cavity 312, which houses the heat exchange mechanism 20 and the cooling medium, which can be a fluid liquid such as water. The two ends of the circulation pipe 320 are connected to the housing 310 and the circulation assembly, respectively. The circulation assembly circulates the cooling medium to improve the product's cooling efficiency. The circulation assembly mainly includes a power source to provide power for the circulation of the cooling medium.

[0041] In other embodiments, the cooling mechanism 30 can also employ a static cooling method, omitting the circulation pipe 320 and circulation components. For example, a cooling medium can be injected into the housing 310, allowing the heat exchange mechanism 20 to remain statically within the cooling medium for a period of time. Alternatively, in other embodiments, the circulation components can be externally connected to the cooling mechanism 30. That is, the circulation components are omitted during the production of the cooling mechanism 30, and when the cooling mechanism 30 is in use, the circulation components are simply connected to the circulation pipe 320. This not only reduces the size of the cooling mechanism 30 but also lowers its production cost.

[0042] To further improve cooling efficiency, the cooling mechanism 30 also includes a support 340, which is located within the cavity 312 and connected to the housing 310. The support 340 supports the heat exchange mechanism 20. The support 340 increases the contact area between the bottom of the heat exchange mechanism 20 and the cooling medium, thereby accelerating the cooling of the heat exchange mechanism 20 and increasing the product's cooling rate. Furthermore, the support 340 has a perforated structure, which not only does not obstruct the flow of the cooling medium but also further increases the contact area between the heat exchange mechanism 20 and the cooling medium. Of course, in other embodiments, the support 340 may be omitted.

[0043] The cooling mechanism 30 also includes a control module 350 and a second temperature detector 360 connected to the control module 350. The second temperature detector 360 is located inside the cavity 312 and is specifically disposed on the inner wall of the housing 310. The second temperature detector 360 is used to detect the temperature of the cooling medium and feeds the detected temperature back to the control module 350. The control module 350 then determines whether to stop the operation of the circulation component or whether to remind the operator that the cooling work is complete. In this embodiment, when the temperature detected by the second temperature detector 360 reaches a preset temperature, the circulation component will stop operating under the action of the control module 350. It is worth mentioning that since the initial temperature of the cooling medium is lower than the temperature of the heated heat exchange mechanism 20, the heat exchange mechanism 20 will transfer heat to the cooling medium. The second temperature detector 360 can determine the cooling status of the heat exchange mechanism 20 by detecting the temperature of the cooling medium.

[0044] In other embodiments, a cooling time can be preset. After the cooling mechanism 30 has been working for a preset cooling time, the control module 350 can directly stop the operation of the circulation component or directly give the operator a prompt that cooling is complete. In this way, the second temperature detector 360 can be omitted.

[0045] comprehensive Figures 1 to 4 The post-processing apparatus of this embodiment mainly includes three working stages: a preparation stage, a strengthening stage, and a cooling stage. In the preparation stage, the heat exchange mechanism 20 operates independently of the strengthening mechanism 10 and the cooling mechanism 30. In this stage, the product is first placed in the receiving cavity 222, and then heat-conducting particles are added to the receiving cavity 222 through the through-hole 212. In the strengthening stage, the heat exchange mechanism 20 is located within the strengthening mechanism 10; specifically, the heat exchange mechanism 20 is located within the insulation cover 140. In this stage, the heating element 120 heats the environment inside the insulation cover 140 and the heat exchange mechanism 20. Simultaneously, the control module 130 activates the insulation function of the insulation cover 140. When the temperature detected by the first temperature detector 150 reaches the preset temperature, the control module 130 stops the operation of the heating element 120, but the insulation cover 140 continues to perform its insulation function. After a preset insulation time, the control module 130 stops the operation of the insulation cover 140 and removes the heat exchange mechanism 20. During the cooling phase, the heat exchange mechanism 20, which has undergone the strengthening phase, is placed inside the cooling mechanism 30. Specifically, the heat exchange mechanism 20 is placed on the support 340. Next, a cooling medium is introduced into the cooling mechanism 30. Under the control of the control module 350, the circulation component repeatedly circulates the cooling medium until the detection result of the second temperature detector 360 reaches the preset temperature. Finally, the cooling medium is discharged, and the heat exchange mechanism 20 is removed.

[0046] It is worth mentioning that while the cooling mechanism 30 cools one heat exchange mechanism 20, the strengthening mechanism 10 can heat another heat exchange mechanism 20 to improve product processing efficiency.

[0047] The above description discloses only preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, equivalent variations made in accordance with the claims of the present invention are still within the scope of the present invention.

Claims

1. An aftertreatment device, characterized by, It includes a heat exchange mechanism and a strengthening mechanism; the strengthening mechanism includes: The outer shell has an internal cavity for accommodating a heat exchange mechanism, which is used to hold the product. A heating element is disposed within the cavity, and the heating element is used to heat the heat exchange mechanism; and A control module is connected to the heating element, and the control module enables the heating element to be heated to a preset temperature. The heat exchange mechanism includes an outer casing and an inner casing, the inner casing being located inside the outer casing, and the inner casing having a accommodating cavity for accommodating the product and heat-conducting particles; The inner box includes a box body and a partition. The partition is disposed in the box body to divide the accommodating cavity into multiple interconnected chambers. The partition is used to place the product.

2. The aftertreatment device of claim 1, wherein, It also includes a heat insulation cover, which is disposed in the cavity and connected to the control module. The heating element is disposed in the heat insulation cover, and the heat insulation cover is also used to accommodate the heat exchange mechanism.

3. The aftertreatment device of claim 1, wherein, It also includes a first temperature detector, which is located inside the cavity and connected to the control module.

4. The aftertreatment device of claim 1, wherein, The outer casing includes a body and fins, the inner casing is located inside the body, and the fins are located on the outside of the body.

5. The aftertreatment device of claim 1, wherein, It also includes a cooling mechanism for cooling the heat exchange mechanism after it has been heated by the strengthening mechanism, thereby cooling the product.

6. The aftertreatment device of claim 5, wherein, The cooling mechanism includes a housing with a cavity inside, which is used to accommodate the heat exchange mechanism and the cooling medium.

7. The aftertreatment device of claim 6, wherein, The cooling mechanism further includes a circulation pipe and a circulation assembly. The two ends of the circulation pipe are respectively connected to the housing and the circulation assembly. The circulation assembly is used to circulate the cooling medium.

8. The aftertreatment device of claim 6, wherein, The cooling mechanism also includes a control module and a second temperature detector, the second temperature detector being located inside the cavity and connected to the control module.

Citation Information

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