Substrate post-processing apparatus and method

Abstract

The present application relates to the technical field of chemical mechanical polishing post-processing, and discloses a substrate post-processing device and method, which comprises a bearing unit for rotating a substrate, a supply unit for spraying fluid to the substrate, a fluid collecting unit and an annular baffle assembly. The baffle assembly is arranged around the bearing unit, and the distance between the inner wall of the baffle assembly and the edge of the substrate is set so that the fluid sputtered from the substrate to the inner wall of the baffle assembly cannot splash back to the surface of the substrate. Thus, the secondary pollution caused by the splash-back of the fluid scattered from the surface of the substrate to the substrate is avoided, and the cleaning effect is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chemical mechanical polishing post-processing, and in particular to a substrate post-processing device and method. BACKGROUND

[0002] Chemical mechanical polishing (CMP) is a kind of global planarization ultra-precision surface processing technology. Since the chemical reagent and abrasive used in chemical mechanical polishing can cause pollution on the surface of the substrate, a post-processing process is needed after chemical mechanical polishing, which generally consists of cleaning and drying to provide a smooth and clean substrate surface.

[0003] In a common post-processing process, wet cleaning is commonly used, which utilizes mechanical action to make the pollutants on the surface of the substrate separate and enter the cleaning liquid, and utilizes chemical reaction between the cleaning liquid and the pollutants on the surface of the substrate to dissolve the pollutants into the cleaning liquid, thereby removing the pollutants from the surface of the substrate.

[0004] Patent CN104956467B discloses a substrate cleaning device for chemical mechanical planarization, wherein the cleaning part includes several cleaning modules and drying modules arranged side by side to make the wafer pass through in sequence, and the wafer is vertically placed in the chamber of the cleaning module for brushing, and after brushing, the wafer is sent into the drying module for drying.

[0005] In the prior art, cleaning and drying are divided into multiple modules, which are relatively large in size. Moreover, the wet cleaning method generally rotates the substrate vertically placed in a container while spraying cleaning liquid to the substrate, and in this process, the cleaning liquid splashed from the surface of the substrate scatters to the inner wall of the container and then rebounds to fall on the surface of the substrate again, causing secondary pollution of the substrate, and the cleaning effect is poor. In order to eliminate the influence of secondary pollution, the substrate needs to be rinsed repeatedly, which increases the use amount of cleaning liquid, causes waste of consumables, increases production cost, and increases the cleaning time in the repeated rinsing process, thereby reducing the cleaning efficiency. SUMMARY

[0006] The embodiments of the present application provide a substrate post-processing device and method, which are intended to at least solve one of the technical problems existing in the prior art.

[0007] The first aspect of the embodiments of the present application provides a substrate post-processing device, which comprises a carrying unit for rotating a substrate, a supply unit for spraying fluid to the substrate, a fluid collecting unit, and an annular baffle assembly; the baffle assembly is arranged around the carrying unit, and the distance between the inner wall of the baffle assembly and the edge of the substrate is set so that the fluid splashed from the substrate to the inner wall of the baffle assembly will not rebound to the surface of the substrate.

[0008] In one embodiment, the carrier unit and the baffle assembly are both located in the fluid collection unit, the baffle assembly is located outside the carrier unit, and the carrier unit keeps the substrate horizontal.

[0009] In one embodiment, the horizontal distance between the inner wall of the baffle assembly and the edge of the substrate is 30-100 mm.

[0010] In one embodiment, the fluid collection unit comprises two or more annular chambers for collecting different types of fluid respectively.

[0011] In one embodiment, the baffle assembly comprises a first baffle having a vertical portion parallel to the outer wall of the fluid collection unit and an upper inclined portion and a lower inclined portion respectively extending upward and downward from the upper portion of the vertical portion toward the carrier unit, the upper and lower inclined portions guiding the fluid sputtered from the substrate to a first chamber of the fluid collection unit, the vertical portion guiding the fluid sputtered from the substrate to a second chamber of the fluid collection unit, and the first chamber being located inside the second chamber.

[0012] In one embodiment, the baffle assembly further comprises a second baffle located outside the first baffle and comprising a vertical portion parallel to the outer wall of the fluid collection unit and an inclined portion extending upward from the upper portion of the vertical portion toward the carrier unit.

[0013] In one embodiment, the substrate post-processing device further comprises a baffle lifting unit for controlling the independent lifting of the baffle assembly.

[0014] In one embodiment, the baffle lifting unit comprises a cylinder, a movable link plate, and a baffle support rod, one end of the cylinder being connected to the fluid collection unit, the other end of the cylinder being connected to the movable link plate, and the movable link plate being connected to the baffle assembly through the baffle support rod to drive the baffle assembly to lift by the cylinder.

[0015] In one embodiment, the supply unit comprises at least one upper surface spraying assembly and at least one lower surface spraying assembly.

[0016] In one embodiment, the upper surface spraying assembly comprises a nozzle, a mechanical arm, and a supply pipeline, the supply pipeline being connected to the nozzle, and the mechanical arm being connected to the nozzle to drive the nozzle to move.

[0017] A second aspect of the embodiment of the present application provides a substrate post-processing method applied to the substrate post-processing device as described above, the method comprising:

[0018] rotating the substrate by the carrier unit;

[0019] when the supply unit sprays fluid to the substrate, guiding the fluid sputtered from the substrate to the fluid collection unit by the baffle assembly and preventing the fluid sputtered to the inner wall of the baffle assembly from splashing back to the surface of the substrate.

[0020] The substrate post-processing device and method provided by the present application have the advantages that by setting the distance between the inner wall of the baffle assembly and the edge of the substrate, the fluid sputtered from the substrate is prevented from splashing back to the substrate while the baffle assembly blocks the fluid, thus avoiding secondary pollution caused by the splashing back of the fluid scattered from the surface of the substrate, improving the cleaning effect, reducing the number of fluid flushing, saving materials, shortening the processing time, and improving the efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0021] The advantages of the present application will become more apparent and more readily appreciated when considered in connection with the following detailed description, taken in conjunction with the accompanying drawings, which are merely illustrative and not restrictive of the present application, wherein:

[0022] Figure 1 A structural schematic diagram of a substrate post-processing device provided by an embodiment of the present application;

[0023] Figure 2 A relationship curve showing the horizontal distance, rotation speed, and liquid splashing back ratio;

[0024] Figures 3A to 3C A schematic diagram for illustrating the direction of fluid scattering when the baffle moves;

[0025] Figure 4 A sectional view of a substrate post-processing device provided by another embodiment of the present application in a vertical section;

[0026] Figure 5 A sectional view of a substrate post-processing device provided by another embodiment of the present application in another vertical section;

[0027] Figure 6 A simplified schematic diagram of a substrate post-processing device provided by yet another embodiment of the present application in a top view;

[0028] Figure 7 A schematic diagram of a box of a substrate post-processing device provided by an embodiment of the present application;

[0029] REFERENCE NUMERALS:

[0030] W, substrate;

[0031] 1, bearing unit; A1, central shaft; 11, substrate bearing disc; 111, clamping member; 12, rotating shaft; 13, power assembly; 14, base;

[0032] 2, supply unit; 21, upper surface spraying assembly; 211, nozzle; 212, movable mechanical arm; 213, fluid supply pipeline; 22, lower surface spraying assembly;

[0033] 3, fluid collection unit; 31, first chamber; 32, second chamber; 33, liquid discharge hole;

[0034] 4. Baffle assembly; 41. First baffle; 411. Upper inclined portion; 412. Lower inclined portion; 413. Vertical portion; 42. Second baffle; 421. Inclined portion; 422. Vertical portion;

[0035] 5. Baffle lifting unit; 51. Cylinder; 52. Movable connecting plate; 53. Baffle support rod. Detailed Implementation

[0036] The technical solutions of the present invention will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of the present invention, used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary, and should not be construed as limiting the implementation of the present invention or the scope of protection of the present invention. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein. It should be understood that, unless specifically stated otherwise, for ease of understanding, the following description of specific embodiments of the present invention is based on the premise that the relevant equipment, devices, components, etc., are in their original static state and are not given external control signals or driving forces.

[0037] like Figure 1 As shown, an embodiment of the present invention provides a substrate post-processing apparatus, comprising: a support unit 1 for rotating a substrate W, a supply unit 2 for spraying fluid onto the substrate W, a fluid collection unit 3, and an annular baffle assembly 4; the baffle assembly 4 is disposed around the support unit 1 and the distance between the inner wall of the baffle assembly 4 and the edge of the substrate W is set such that fluid splashed from the substrate W onto the inner wall of the baffle assembly 4 will not splash back onto the surface of the substrate W.

[0038] like Figure 1 As shown, both the support unit 1 and the baffle assembly 4 are located within the fluid collection unit 3, with the baffle assembly 4 located outside the support unit 1. The support unit 1 keeps the substrate W horizontal and drives the substrate W to rotate around the central axis A1. In this application, "inner side" and "outer side" are described with respect to the direction away from the central axis A1.

[0039] In the embodiment, the substrate W is horizontally rotated by the carrying unit 1, the supply unit 2 sprays fluid to the surface of the substrate W, and the baffle assembly 4 surrounds the substrate W to block the fluid splashed from the substrate W and guide the fluid to the fluid collecting unit 3. Further, the baffle assembly 4 is arranged far enough from the substrate W so that the fluid splashed from the substrate W to the inner wall of the baffle assembly 4 will not splash back to the surface of the substrate W. It can be understood that the fluid will not splash back means that only a small amount of fluid will splash back to the surface of the substrate W compared with the prior post-processing technology, in other words, at least 90% of the fluid splashed from the surface of the substrate W will not splash back, but not absolutely no splash back.

[0040] In the embodiment, the distance between the inner wall of the baffle assembly 4 and the edge of the substrate W is set, so that the fluid splashed from the substrate W is blocked by the baffle assembly 4 and will not splash back to the substrate W, thereby avoiding secondary pollution of the substrate W and improving the cleaning effect.

[0041] In an embodiment of the present application, in order to realize that the fluid splashed from the substrate W to the inner wall of the baffle assembly 4 will not splash back to the surface of the substrate W, the horizontal distance between the inner wall of the baffle assembly and the edge of the substrate is set to 30 mm to 100 mm, and correspondingly, the rotation speed of the substrate W driven by the carrying unit 1 during cleaning is limited to 300 rpm to 800 rpm. Preferably, the horizontal distance between the inner wall of the baffle assembly and the edge of the substrate can be set to 45 mm to 60 mm.

[0042] It should be noted that a lower rotation speed is generally used during cleaning to prevent the fluid splashed from the substrate W from accelerating due to high-speed rotation of the substrate W, thereby intensifying splash back. However, a higher rotation speed can be used during drying to improve the dehydration speed of the substrate W, and the rotation speed can even be increased to 3000 rpm.

[0043] As shown in FIG. 4, four groups of relationship curves of the horizontal distance L, the rotation speed and the liquid splash back ratio are illustrated. Figure 2

[0044] The liquid splash back ratio is an estimated value of the percentage of the liquid splashed back to the surface of the substrate W from the baffle to the total amount of the liquid splashed from the substrate W. The horizontal distance L and the rotation speed are measured values.

[0045] As shown in FIG. 4, four groups of relationship curves of the horizontal distance L, the rotation speed and the liquid splash back ratio are illustrated. Figure 2 It can be seen that the liquid splash back ratio is greatly reduced when the horizontal distance L increases, and the liquid splash back ratio also increases with the increase of the rotation speed. In order to meet the requirement that the liquid splash back ratio is not greater than 10%, appropriate horizontal distance and rotation speed should be selected. In addition, due to the limitation of the area of the production workshop of the wafer factory, the diameter of the device cannot be too large, so the horizontal distance cannot be increased indefinitely, and therefore the technical parameters in the embodiment are preferred. ​

[0046] In one embodiment, the supply unit 2 can spray different types of fluid to the substrate according to different cleaning and drying requirements, including cleaning liquid for cleaning the substrate and drying gas for drying the substrate to respectively implement cleaning and drying operations. In the cleaning operation, the cleaning liquid provided by the supply unit 2 is generally divided into water, acidic solution and alkaline solution, and the solution composition mainly includes pH adjuster, complexing agent and corrosion inhibitor, the pH adjuster is used to adjust the pH value of the solution, the complexing agent is mainly used to remove metal ions, and the corrosion inhibitor is used to prevent corrosion to the substrate W during cleaning. In the drying operation, the drying gas can be clean air, nitrogen, isopropyl alcohol vapor, etc.

[0047] In the present embodiment, cleaning and drying can be integrated in one chamber to reduce the size of the equipment.

[0048] As shown in Figure 1 In one embodiment, the fluid collection unit 3 includes two or more concentric annular chambers to respectively collect different types of fluid, for example, chambers for respectively collecting acidic liquid or alkaline liquid, which can prevent mixing of different types of liquid to cause safety hazards due to reaction.

[0049] Figure 1 An example in which the fluid collection unit 3 includes two chambers, a first chamber 31 located on the inner side and a second chamber 32 located on the outer side, is shown in

[0050] As shown in Figure 1 Each chamber is provided with a liquid discharge hole 33 on the bottom surface, and the liquid discharge hole 33 can discharge the liquid in the fluid collection unit 3 through a liquid discharge pipeline (not shown). The liquid discharge holes 33 of different chambers can be connected to different liquid discharge pipelines to respectively and individually recover different liquids.

[0051] As shown in Figure 1 In one embodiment, the baffle assembly 4 can include a plurality of baffles arranged concentrically and spaced apart. The baffles can be arranged to be individually liftable, and when different baffles are opposite to the peripheral end surface of the substrate W, different liquids sputtered from the substrate W can be guided to different chambers of the fluid collection unit 3. Figure 1 An example in which the baffle assembly 4 includes a first baffle 41 and a second baffle 42 is shown in, and it can be understood that the baffle assembly 4 can also include other numbers of baffles. The material of the baffle can be acid and alkali resistant plastic, such as polypropylene (PP) material, polyphenylene sulfide (PPS) material or polyvinyl chloride (PVC) material, etc.

[0052] As shown in Figure 1As shown, the first baffle 41 has a vertical portion 413 parallel to the outer wall of the fluid collection unit 3, and an upper inclined portion 411 and a lower inclined portion 412 respectively extending upwardly and downwardly from the upper portion of the vertical portion 413 toward the carrier unit 1.

[0053] As shown, the second baffle 42 is composed of a vertical portion 422 parallel to the outer wall of the fluid collection unit 3, and an inclined portion 421 extending upwardly from the upper portion of the vertical portion 422 toward the carrier unit 1. Figure 1

[0054] The first baffle 41 and the second baffle 42 can be integrally formed. The included angle between the upper inclined portion 411 and the lower inclined portion 412 of the first baffle 41 can be rounded. The included angle between the inclined portion 421 and the vertical portion 422 of the second baffle 42 can also be rounded.

[0055] The vertical portion 413 and the vertical portion 422 can also extend linearly in a direction generally parallel to the outer wall of the fluid collection unit 3, for example, at an included angle with the vertical plane, as long as it can prevent the backflow of fluid flowing from the outside into the chamber on the inside. The cross-sectional shape of the upper inclined portion 411 and the inclined portion 421 can be linear or smoothly convex arc-shaped, and the cross-sectional shape of the lower inclined portion 412 can be linear or smoothly concave arc-shaped.

[0056] As an implementation manner, the included angle between the upper inclined portion 411 of the first baffle 41 and the horizontal plane can be 15° to 45°, and the included angle between the lower inclined portion 412 and the horizontal plane can be 20° to 80°. The inclined portion 421 of the second baffle 42 is parallel to the upper inclined portion 411 of the first baffle 41. The lengths of the upper inclined portion 411, the lower inclined portion 412, the vertical portion 413, the inclined portion 421 and the vertical portion 422 can all be 30 to 80 mm. The horizontal distance between the inner wall of the first baffle 41 and the edge of the substrate is 45 mm to 55 mm. The horizontal distance between the bottom end of the second baffle 42 and the bottom end of the first baffle 41 can be 10 to 50 mm. The lifting stroke of the first baffle 41 or the second baffle 42, i.e. the distance between the highest position and the lowest position, can be 40 to 80 mm. The distance from the highest position to the surface of the substrate can be 20 to 40 mm.

[0057] For example, the included angle between the upper inclined portion 411 and the horizontal plane is 20°, the included angle between the lower inclined portion 412 and the horizontal plane is 45°, and the lengths of the upper inclined portion 411, the lower inclined portion 412, the vertical portion 413, the inclined portion 421 and the vertical portion 422 are 50 mm, 45 mm, 40 mm, 50 mm and 40 mm respectively. The horizontal distance between the bottom end of the second baffle 42 and the bottom end of the first baffle 41 is 15 mm.

[0058] Figures 3A to 3C The guiding directions of the fluid when the first baffle 41 and the second baffle 42 are at different positions are shown. ​

[0059] like Figure 3A As shown, when the first baffle 41 rises to face the peripheral end face of the substrate W, the upper inclined portion 411 and the lower inclined portion 412 of the first baffle 41 guide the liquid splashed from the substrate W to the first chamber 31 of the fluid collection unit 3. The distance from the top of the outer wall of the first chamber 31 to the central axis A1 is greater than the distance from the bottom of the lower inclined portion 412 to the central axis A1, so that the first chamber 31 can fully receive the liquid flowing down from the lower inclined portion 412.

[0060] like Figure 3B As shown, when the first baffle 41 descends and the second baffle 42 rises to face the peripheral end face of the substrate W, the inclined portion 421 and the vertical portion 422 of the second baffle 42 cooperate with the vertical portion 413 of the first baffle 41 to guide the liquid splashed from the substrate W to the second chamber 32 of the fluid collection unit 3. At this time, the vertical portion 413 of the first baffle 41 can prevent the liquid from flowing back into the first chamber 31. The distance from the outer wall of the second chamber 32 to the central axis A1 is greater than the distance from the bottom end of the vertical portion 422 to the central axis A1, so that the second chamber 32 can completely receive the liquid flowing down from the vertical portion 422.

[0061] like Figure 3C As shown, when both the first baffle 41 and the second baffle 42 are lowered below the substrate W, the outer wall of the fluid collection unit 3 can guide the liquid splashed from the substrate W into its chamber. The outer wall of the fluid collection unit 3 is higher than the surface of the substrate W to prevent the liquid splashed from the substrate W from flying out of the fluid collection unit 3.

[0062] like Figure 4 and Figure 5 As shown, in one embodiment of the present invention, the substrate post-processing apparatus further includes a baffle lifting unit 5 for controlling the independent lifting and lowering of the baffle assembly 4. Multiple baffle lifting units 5 may be provided to be connected one-to-one with multiple baffles.

[0063] like Figure 4 As shown, a baffle lifting unit 5 is provided, connected to the first baffle 41. The baffle lifting unit 5 includes a cylinder 51, a movable connecting plate 52, and a baffle support rod 53. The base 511 of the cylinder 51 is detachably fixed to the bottom wall of the fluid collection unit 3, making the cylinder base 511 fixed relative to the fluid collection unit 3. The piston rod 512 extending outward from the cylinder 51 is connected to the movable connecting plate 52. The movable connecting plate 52 is connected to a baffle via the baffle support rod 53, so that when the piston rod 512 moves, it can drive the baffle to move up and down vertically through the movable connecting plate 52 and the baffle support rod 53. Figure 4 As shown by the double-headed arrow AB, where A represents the upward direction and B represents the downward direction.

[0064] Similarly, as an alternative implementation, the piston rod 512 of the air cylinder 51 is detachably fixedly installed to the bottom wall of the fluid collecting unit 3, and the base 511 of the air cylinder 51 is fixedly connected with the movable connecting plate 52, so that the movable connecting plate 52 and the baffle supporting rod 53 can drive the baffle to move up and down along the vertical direction when the piston rod 512 moves.

[0065] As shown in Figure 5 , another baffle lifting unit 5 connected with the second baffle 42 is further provided for driving the second baffle 42 to move along the direction shown by the bidirectional arrow AB in the figure. The structure of the baffle lifting unit 5 is the same as that of the baffle lifting unit connected with the first baffle 41, and the movement principle is also the same. Figure 4 As shown in , the baffle lifting unit connected with the first baffle 41 can be arranged in parallel with

[0066] the other baffle lifting unit connected with the second baffle 42. That is to say, Figure 4 the air cylinder 51 in Figure 5 is arranged at a different position of the bottom wall of the fluid collecting unit 3 from the air cylinder 51 in Figure 4 , so that Figure 5 the movable connecting plate 52 in Figure 4 is arranged in parallel with the movable connecting plate 52 in Figure 5 .

[0067] As shown in Figure 4 , in one embodiment, the carrying unit 1 comprises a substrate carrying disc 11, a rotating shaft 12, a power assembly 13 and a base 14. The power assembly 13 is fixed in the base 14, and the substrate carrying disc 11, the rotating shaft 12 and the power assembly 13 are connected in sequence so that the power assembly 13 drives the rotating shaft 12 to rotate to drive the substrate carrying disc 11 to rotate. As a further improvement of the present embodiment, a plurality of clamping members 111 can be arranged at the edge of the substrate carrying disc 11 to detachably clamp and fix the substrate W on the substrate carrying disc 11, so that the carrying unit 1 drives the substrate W to rotate to realize post-processing operation. The plurality of clamping members 111 can be uniformly and equidistantly distributed along the edge of the substrate carrying disc 11.

[0068] As shown in Figure 4 , in one embodiment of the present application, the supply unit 2 comprises at least one upper surface spraying assembly 21 and at least one lower surface spraying assembly 22.

[0069] The lower surface spraying assembly 22 is arranged on the base 14 of the carrying unit 1, and the nozzle of the lower surface spraying assembly 22 sprays fluid to the lower surface of the substrate W through the through hole at the corresponding position of the substrate carrying disc 11, so as to clean and / or dry the lower surface of the substrate W.

[0070] As shown in Figure 6As shown, in one embodiment, the upper surface spray assembly 21 includes a nozzle 211, a movable robotic arm 212, and a supply pipe 213. The supply pipe 213 is connected to the nozzle 211, and the robotic arm 212 is connected to the nozzle 211 to move the nozzle 211. The base of the movable robotic arm 212 can be fixedly installed to the fluid collection unit 3. It is understood that... Figure 6 The example shown is of a supply unit 2 comprising 3 upper surface spraying assemblies 21. In practice, other numbers may be used, such as 1, 2 or 4.

[0071] like Figure 6 As shown, the movable robotic arm 212 can move the nozzle 211 to a working position above the surface of the substrate W and also return the nozzle 211 to its original position away from the surface of the substrate W, as indicated by the bidirectional arrow ab in the figure. When one upper surface spraying assembly 21 is in the working position, the other upper surface spraying assemblies 21 are in their original positions to avoid mutual interference. Furthermore, while the nozzle 211 sprays fluid, the robotic arm 212 drives the nozzle 211 to reciprocate around its axis. For example, during cleaning, the robotic arm 212 drives the nozzle 211 to reciprocate back and forth on both sides of the nozzle aligned with the center of the substrate, thereby increasing the contact area between the fluid and the substrate surface.

[0072] As an optional embodiment, the supply unit 2 may also be equipped with a transducer that emits megasonic waves or ultrasonic waves, so that the nozzle applies the acoustic energy to the substrate surface through the cleaning fluid, thereby improving the cleaning effect and realizing megasonic cleaning or ultrasonic cleaning.

[0073] like Figure 7 As shown, in one embodiment, the substrate post-processing apparatus is disposed within a closed housing 6. The carrier unit 1 (not shown), the supply unit 2 (not shown), the fluid collection unit 3, and the baffle assembly 4 are all encapsulated within the housing 6.

[0074] Figure 7 In the enclosure 6, an air supply unit 61 is provided at the top, and an exhaust unit (not shown) is provided at the bottom. The air supply unit 61 includes a fan and a filter layer to deliver clean air into the enclosure 6. The exhaust unit includes a gas-liquid separator and an exhaust device. The gas-liquid separator separates the fluid collected by the fluid collection unit 3 into gas and liquid. The separated liquid is discharged through a drain pipe (not shown), and the gas is extracted by the exhaust device and discharged through an exhaust pipe (not shown).

[0075] Figure 7 In the middle, the side wall of the enclosure 6 is also provided with an observation window 62 to facilitate the operator to observe the operation of the various components inside the enclosure. The observation window 62 can be sealed with a transparent material, such as glass.

[0076] The embodiment of the present application also provides a substrate post-processing method applied to the substrate post-processing device, and the method comprises the following steps:

[0077] The substrate is rotated by the bearing unit;

[0078] When the supply unit sprays the fluid to the substrate, the baffle assembly is used to guide the fluid sputtered from the substrate to the fluid collecting unit and prevent the fluid sputtered to the inner wall of the baffle assembly from splashing back to the surface of the substrate.

[0079] In order to facilitate understanding, the operation steps of the cleaning operation and the drying operation are described by taking one specific application scenario as an example.

[0080] In the first step, the second baffle 42 is raised to the highest position, the first baffle 41 is lowered to the lowest position, the second baffle 42 is opposite to the peripheral end surface of the substrate, the mechanical arm 212 swings the nozzle 211, the nozzle 211 sprays the deionized water to the surface of the substrate to form a surface water film, the substrate rotates at a low speed (for example, 600 rpm), and the second baffle 42 guides the deionized water scattered from the substrate to the second chamber 32.

[0081] In the second step, the first baffle 41 is raised to the highest position, the first baffle 41 is opposite to the peripheral end surface of the substrate, the mechanical arm 212 swings the nozzle 211, the nozzle 211 sprays the chemical solution to the surface of the substrate to clean the surface impurities, the substrate rotates at a low speed, and the first baffle 41 guides the chemical solution scattered from the substrate to the first chamber 31.

[0082] In the third step, the first baffle 41 is lowered to the lowest position, the second baffle 42 remains at the highest position, the mechanical arm 212 swings the nozzle 211, the nozzle 211 sprays the deionized water to the surface of the substrate to clean the surface chemical solution, the substrate rotates at a low speed for a period of time, then the water spraying is stopped, and then the substrate rotates at a high speed (for example, 2000 rpm) to perform spin-drying.

[0083] In the fourth step, after the spin-drying is performed for a period of time, the surface of the substrate is dried, at this time, the substrate is slowed down and stopped rotating, and the second baffle 42 is lowered.

[0084] The above first step to fourth step are repeatedly performed after the substrate is replaced. During the execution of the above four steps, the air supply unit and the exhaust unit in the box body continuously work to keep the airflow in the box body from top to bottom, the airflow drives various liquids and gases to move downward, and the substrate can be prevented from being contaminated again.

[0085] The above is only one optional embodiment, and obviously, those skilled in the art can know that in different actual demands, water, acid solution and / or alkaline solution can be sprayed to the substrate in different operation sequences, and different baffles can be used to guide different liquids into different chambers.

[0086] The drawings attached to this specification represent illustrative drawings that assist in the explanation of the concept of the present application, and schematically show the shape of each part and the relationship between the parts. It should be understood that, in order to clearly show the structure of each component of the embodiments of the present application, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0087] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" or the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Also, the specific features, structures, materials or characteristics described can be appropriately combined in any one or more embodiments or examples.

[0088] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made thereto without departing from the principles and spirit of the present application, the scope of which is defined by the claims and their equivalents.

Claims

1. A substrate post-processing apparatus, characterized in that, include: The system includes a support unit for rotating a substrate, a supply unit for injecting fluid into the substrate, a fluid collection unit, and an annular baffle assembly. The baffle assembly is arranged around the support unit and includes a first baffle having a vertical portion parallel to the outer wall of the fluid collection unit, an upper inclined portion extending upward toward the support unit from the upper part of the vertical portion, and a lower inclined portion extending downward toward the support unit. The fluid collection unit includes at least two concentric annular chambers. The upper inclined portion and the lower inclined portion guide the fluid sputtered from the substrate to the first chamber of the fluid collection unit, and the vertical portion guides the fluid sputtered from the substrate to the second chamber of the fluid collection unit. The first chamber is located inside the second chamber. The horizontal distance between the inner wall of the baffle assembly and the edge of the substrate is 30mm to 100mm. During cleaning, the speed at which the carrier unit drives the substrate to rotate is 300rpm to 800rpm, so that the fluid splashed from the substrate to the inner wall of the baffle assembly will not splash back onto the surface of the substrate.

2. The substrate post-processing apparatus as described in claim 1, characterized in that, Both the carrier unit and the baffle assembly are located inside the fluid collection unit, and the baffle assembly is located outside the carrier unit. The carrier unit keeps the substrate horizontal, and the outer wall of the fluid collection unit is higher than the substrate surface. It is used to guide the liquid sputtered from the substrate into the annular cavity so that the liquid sputtered from the substrate will not fly out of the fluid collection unit.

3. The substrate post-processing apparatus as described in claim 1, characterized in that, The at least two concentric annular chambers are used to collect different types of fluids respectively.

4. The substrate post-processing apparatus as described in claim 3, characterized in that, The baffle assembly includes at least two concentrically spaced annular baffles.

5. The substrate post-processing apparatus as described in claim 4, characterized in that, The baffle assembly also includes a second baffle located outside the first baffle, which is composed of a vertical portion parallel to the outer wall of the fluid collection unit and an inclined portion extending upward from the upper part of the vertical portion toward the support unit.

6. The substrate post-processing apparatus as described in claim 5, characterized in that, The inclined portion of the second baffle is parallel to the upper inclined portion of the first baffle, and the horizontal distance between the bottom end of the second baffle and the bottom end of the first baffle is 10 to 50 mm.

7. The substrate post-processing apparatus according to any one of claims 1 to 6, characterized in that, It also includes a baffle lifting unit for controlling the independent lifting and lowering of the baffle assembly.

8. The substrate post-processing apparatus as described in claim 7, characterized in that, The baffle lifting unit includes a cylinder, a movable connecting plate, and a baffle support rod. One end of the cylinder is connected to the fluid collection unit, and the other end of the cylinder is connected to the movable connecting plate. The movable connecting plate is connected to the baffle assembly through the baffle support rod so that the baffle assembly can be lifted and lowered by the cylinder.

9. The substrate post-processing apparatus according to any one of claims 1 to 6, characterized in that, The supply unit includes at least one upper surface spraying assembly and at least one lower surface spraying assembly.

10. The substrate post-processing apparatus as claimed in claim 9, characterized in that, The upper surface spraying assembly includes a nozzle, a robotic arm, and a supply pipe. The supply pipe is connected to the nozzle, and the robotic arm is connected to the nozzle to drive the nozzle to move.

11. A substrate post-processing method, applied to the substrate post-processing apparatus as described in any one of claims 1 to 10, characterized in that, The method includes: Rotate the substrate using the support unit; When the supply unit sprays fluid onto the substrate, a baffle assembly is used to guide the fluid sputtered from the substrate to the fluid collection unit and prevent the fluid sputtered onto the inner wall of the baffle assembly from splashing back onto the substrate surface.

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