Multi-stage selective wave soldering device

Abstract

The application discloses a multi-section selective wave-soldering device, which comprises at least two conveying devices, at least two blocking devices, at least two soldering devices and driving devices for driving the soldering devices to move, the conveying devices are arranged in sequence to form a conveying channel of a conveying plate, and the blocking devices are arranged at the ends of the conveying devices respectively; the soldering devices are arranged below the conveying channel, and the driving devices drive the soldering devices to move respectively. The multi-section selective wave-soldering device is small in size and high in production efficiency.

Description

Technical Field

[0001] This invention relates to a wave soldering equipment, and more particularly to a multi-stage selective wave soldering device with high production efficiency. Background Technology

[0002] Selective wave soldering is a downstream process in the SMT (Surface Mount Technology) industry. After selective wave soldering, repair of defective PCBs is often required. Traditional selective wave soldering repair equipment consists of a single soldering device on a single conveyor track, allowing only one PCB to be soldered or produced at a time, resulting in low production efficiency. Alternatively, some repair equipment features dual conveyor tracks, each with a soldering device, for a total of two devices. These two devices simultaneously repair PCBs on two different conveyor tracks. However, the XY axes driving the two soldering devices are integrated, limiting the equipment to producing only two identical PCBs. Since the defect locations on each PCB are different, this type of equipment cannot handle repairs, and dual-conveyor track equipment becomes very bulky. Summary of the Invention

[0003] The purpose of this invention is to provide a multi-stage selective wave soldering apparatus with high production efficiency.

[0004] To achieve the above objectives, the multi-segment selective wave soldering apparatus provided by the present invention includes at least two conveying devices, at least two blocking devices, at least two welding devices, and driving devices for moving the welding devices respectively. The conveying devices are arranged in sequence to form a conveying channel for conveying plates, and the blocking devices are respectively disposed at the end of each of the conveying devices. The welding devices are disposed below the conveying channel, and the driving devices drive the welding devices to move respectively.

[0005] Compared with existing technologies, this invention, by setting at least two conveying devices and arranging them sequentially to form a conveying channel, and by setting a blocking device at the end of each conveying device, allows the plates to be stopped on each conveying device, thus dividing the conveying channel into at least two areas, each capable of holding one plate. Furthermore, by setting at least two welding devices and a driving device, the driving device independently drives each welding device, enabling the welding devices to weld the plates located on each conveying device one-to-one. When the plate size is small, multiple welding devices can simultaneously weld different plates, greatly improving welding efficiency; similarly, when the plate size is large, multiple welding devices can simultaneously weld the plate on the first conveying device, also improving welding efficiency. In addition, since the conveying devices are arranged sequentially to form a conveying channel, the problem of excessively large equipment size caused by traditional parallel conveying channels is avoided, enabling the equipment to be miniaturized.

[0006] Preferably, the welding devices are arranged sequentially along the conveying direction of the conveying channel. This allows for a one-to-one correspondence between the welding devices and the conveying devices, facilitating the welding of the corresponding plates by each device and ensuring that the two welding devices do not interfere with each other during welding.

[0007] Preferably, the conveying device includes a first motor, a drive gear, and multiple rollers and drive gears. The rollers are horizontally placed and arranged sequentially. The edges of the roller sides are used to support the plate. The drive gears are coaxially mounted on the rollers, and adjacent drive gears mesh with each other. The output end of the first motor is connected to the drive gear, and the drive gear meshes with the drive gears. By configuring the rollers so that they are horizontally placed, the edges of the roller sides can support the plate, and the friction generated by the rotation of the rollers and the plate can be used to push the plate forward. This ensures that the conveying track does not deform when carrying the plate, and allows for rapid and smooth conveying with good results.

[0008] Specifically, the conveying device further includes a belt and multiple pulleys. The belt is wound around the pulleys, and the lower section of the belt is positioned along the conveying channel and above the edge of the roller side to press the plate against it. By setting the pulleys and belt, the plate is pressed against the roller by the belt, thereby making the conveying of the plate more stable.

[0009] Specifically, the conveying device further includes a second motor that drives the pulley to rotate. By using the second motor to drive the belt and the plate synchronously, large frictional resistance between the belt and the plate can be prevented, thereby improving the stability of the conveying process.

[0010] Preferably, the blocking device includes a base, a driver, and a stop bar. One end of the stop bar is disposed on the base, and the driver is disposed on the base with its telescopic end connected to the stop bar and driving the stop bar to move, causing it to block the conveying channel or leave the conveying channel. The blocking device allows the plate to remain on the conveying device, enabling simultaneous welding of multiple plates.

[0011] Specifically, the base is provided with a first elongated groove and a second elongated groove, the extension directions of the first and second elongated grooves being perpendicular to each other. One end of the stop rod is slidably disposed in the first elongated groove, and the telescopic end of the driver is pivotally connected to the middle of the stop rod via a pivot shaft, the pivot shaft being slidably inserted into the second elongated groove. By providing the first and second elongated grooves, one end of the stop rod can move under the drive of the driver, while the other end of the stop rod can swing relative to the conveying channel, thereby blocking or leaving the conveying channel, achieving the blocking or release of the plate.

[0012] Specifically, the telescopic end of the driver is provided with a slider, the slider is pivotally connected to the stop bar, and the slider is slidably disposed on the base.

[0013] Preferably, the welding apparatus includes a welding machine and a photographic component, which are located at the output end of the drive device. The photographic component can photograph and position the welding points on the plate, so that the control system can control the welding apparatus according to the position of the welding points, thereby improving welding efficiency.

[0014] Preferably, the driving device includes an X-axis driving mechanism and a Y-axis driving mechanism, with the Y-axis driving mechanism disposed at the output end of the X-axis driving mechanism.

[0015] Preferably, it also includes an output device, which is located at the end of the conveying channel.

[0016] Preferably, the device also includes a support frame, with crossbeams on both sides of the support frame to support the conveying device and the blocking device. The two crossbeams are slidably mounted on the support frame. By slidably mounting the crossbeams, the distance between the two crossbeams can be adjusted, thereby adjusting the width of the conveying channel to accommodate plates of different widths.

[0017] Specifically, it also includes a drive mechanism mounted on the support, which drives the two crossbeams to move closer or further apart. Attached Figure Description

[0018] Figure 1 This is a perspective view of the multi-segment selective wave soldering apparatus of the present invention.

[0019] Figure 2 This is a perspective view of the conveying device and blocking device of the multi-segment selective wave soldering apparatus of the present invention.

[0020] Figure 3 This is another perspective view of the conveying device and blocking device of the multi-segment selective wave soldering apparatus of the present invention.

[0021] Figure 4 This is a structural diagram of the conveying device of the multi-segment selective wave soldering apparatus of the present invention.

[0022] Figure 5 This is a structural diagram of the blocking device of the multi-segment selective wave soldering apparatus of the present invention.

[0023] Figure 6 This is a perspective view of the welding device and driving device of the multi-segment selective wave soldering apparatus of the present invention. Detailed Implementation

[0024] To illustrate the technical content, structural features, and effects of the present invention in detail, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0025] like Figures 1 to 3 As shown, the multi-stage selective wave soldering device 100 of the present invention is located at the end of the preheating spraying section of the selective wave soldering production line 200, and is used for defect repair of PCB boards (not shown in the figure). It includes at least two identical conveying devices 1, at least two identical blocking devices 2, at least two identical welding devices 3, driving devices 4 for driving the welding devices 3, and an output device 5. This embodiment uses two conveying devices 1 as an example, and the number of blocking devices 2, welding devices 3, and driving devices 4 is also two. The two conveying devices 1 are arranged sequentially to form a conveying channel 1a for conveying boards, and the conveying channel 1a is connected to the rear section of the selective wave soldering production line 200. The blocking devices 2 are respectively located at the end of each conveying device 1. The two welding devices 3 are located below the conveying channel 1a, and are arranged sequentially along the conveying direction of the conveying channel 1a. This allows them to correspond one-to-one with the conveying devices 1, facilitating the welding of the corresponding boards by the welding devices 3 and ensuring that the two welding devices 3 do not interfere with each other during welding. The two driving devices 4 drive the two welding devices 3 to move independently, thereby adapting to the defect positions on their corresponding plates. The output device 5 is located at the end of the conveying channel 1a to output the plates conveyed by the conveying device 1 to the next process.

[0026] Please see again Figure 2 and Figure 3The multi-segment selective wave soldering apparatus 100 further includes a support frame and a drive mechanism 6 mounted on the support frame. Crossbeams 7 supporting the conveying device 1 and the blocking device 2 are provided on both sides of the support frame. The two crossbeams 7 are slidably mounted on the support frame via a guide device 8. The drive mechanism 6 can drive the two crossbeams 7 to move closer or further apart. By allowing the crossbeams 7 to be slidably mounted, the distance between the two crossbeams 7 can be adjusted, thereby adjusting the width of the conveying channel 1a to accommodate plates of different widths.

[0027] like Figure 4 As shown, the conveying device 1 is symmetrically arranged on both sides of the crossbeam 7, with identical structures on both sides. One side includes a first motor 11, a drive gear 12, multiple rollers 13, multiple drive gears 14, a belt 15, multiple pulleys 16, and a second motor (not shown). The rollers 13 are horizontally placed and arranged sequentially along the conveying channel 1a. The edges of the rollers 13 support the plates. The drive gears 14 are coaxially mounted on the rollers 13, with adjacent drive gears 14 meshing. The output of the first motor 11 is connected to the drive gear 12, which meshes with one of the drive gears 14. The belt 15 is wound around the pulleys 16, which are arranged along the conveying channel 1a, such that the lower section of the belt 15 is positioned along the conveying channel 1a and above the edge of the roller 13 to press the plates. The second motor drives the pulleys 16 to rotate. By configuring the rollers 13 so that they are placed horizontally, the edges of the rollers 13 can support the plates. The friction generated by the rotation of the rollers 13 and the plates pushes the plates forward. This prevents the conveyor track from deforming when carrying the plates and allows for fast, smooth, and efficient transport. Furthermore, by configuring the pulleys 16 and belt 15, the belt 15 presses the plates against the rollers 13, making the transport of the plates even smoother. The second motor drives the belt 15 synchronously with the plates, preventing excessive frictional resistance and improving transport stability. Additionally, the first motors 11 of the two conveyor devices 1 operate independently, each controlling its own roller 13.

[0028] like Figure 5As shown, the blocking device 2 includes a base 21, a driver 22, and a stop rod 23, where the driver 22 is a cylinder. One end of the stop rod 23 is mounted on the base 21. The driver 22 is mounted on the base 21, and its telescopic end is connected to the stop rod 23, driving the stop rod 23 to move, causing it to block the conveying channel 1a or leave the conveying channel 1a. The blocking device 2 allows the plate to remain on the conveying device 1, enabling simultaneous welding of multiple plates. Specifically, the base 21 has a first elongated groove 21a and a second elongated groove 21b, the extension directions of which are perpendicular. One end of the stop rod 23 is slidably mounted on the first elongated groove 21a via a pivot pin. The telescopic end of the driver 22 has a slider 24, which is pivotally connected to the middle of the stop rod 23 via a pivot shaft, and the pivot shaft is slidably inserted into the second elongated groove 21b. The slider 24 is slidably disposed on the base 21. One end of the stop lever has an arc-shaped structure, and the other end has a straight structure. By providing the first elongated groove 21a and the second elongated groove 21b, one end of the stop lever 23 can move under the drive of the driver 22, while the other end of the stop lever 23 can swing relative to the conveying channel 1a, thereby blocking or leaving the conveying channel 1a, realizing the blocking or release of the plate. The drivers 22 of the two blocking devices 2 work independently of each other, thereby independently controlling the swing of their respective stop levers 23.

[0029] like Figure 6 As shown, the welding device 3 includes a welding machine 31 and a photographing component 32, which are located at the output end of the driving device 4. The photographing component 32 can photograph and position the welding points on the workpiece, so that the control system can control the welding device 3 according to the position of the welding points, thereby improving welding efficiency. The driving device 4 includes an X-axis driving mechanism 41 and a Y-axis driving mechanism 42, with the Y-axis driving mechanism 42 located at the output end of the X-axis driving mechanism 41. The welding machine 31 and the photographing component 32 are located at the output end of the Y-axis driving mechanism 42. The driving device 4 can drive the welding device 3 to move at any position below the workpiece on the conveying channel 1a, thereby ensuring effective photographing or welding repair of the workpiece.

[0030] Based on the above and in conjunction with the accompanying drawings, the welding mode of the multi-segment selective wave soldering apparatus 100 of the present invention will be described in detail below:

[0031] The multi-segment selective wave soldering device 100 has two soldering modes: the first is for repairing PCB board defects, and the second is for PCB board production.

[0032] In the first repair mode, after the PCB board passes through the insertion process, it flows into the wave soldering production line 200 for soldering. After soldering, it flows into the inspection equipment for testing. The inspection equipment can detect some defects in the PCB board, such as insufficient solder, missing solder, solder bridging, and short circuits. At the same time, the inspection equipment will send the defect type and relative location of the PCB board to the multi-stage selective wave soldering device 100 of this invention. In addition, the preheating spraying section of the selective wave soldering production line 200 will spray flux according to the defect location. After spraying, it flows into the multi-stage selective wave soldering device 100 of this invention for repair. When the PCB board flows into the selective wave soldering device, the control system will select whether to use two-stage or one-stage repair based on the size of the PCB board.

[0033] When the length of the PCB board is less than the length of one of the conveying devices 1, for example, less than 300mm*460mm, a two-stage mode will be adopted. The first PCB board first flows into the first conveying device 1 near the output device 5 through the second conveying device 1. The stop bar 23 of the first blocking device 2 is lowered to stop the first PCB board on the first conveying device 1. Then, when the second PCB board flows into the second conveying device 1, the stop bar 23 of the second blocking device 2 is lowered to stop the second PCB board on the second conveying device 1. At this time, the two welding devices 3 move independently along the XY direction. After the second PCB board stops, the multi-stage selective wave soldering device 100 controls the first welding device 3 to repair and weld various defects of the first PCB board on the first conveying device 1 according to the data sent by the detection equipment; the second welding device 3 repairs and welds various defects of the second PCB board on the second conveying device 1; after the two PCB boards are repaired and welded, they are output one by one through the output device 5.

[0034] When the length of the PCB board exceeds the length of one of the conveying devices 1, for example, greater than 300mm*460mm, a single-stage mode will be adopted. When the first PCB board flows into the conveying channel 1a, the stop bar 23 of the first blocking device 2 will be lowered to stop the first PCB board on the first conveying device 1, and then no second PCB board will be fed in. At this time, the control system, based on the location of the defect sent by the detection equipment, will optimize the calculation and assign the defects of the PCB board to two welding devices 3 for welding repair. The control system will ensure that the repair time of the two welding devices 3 is basically the same according to the number of defects in each area, so that one device is working while the other is waiting. The two welding devices 3 can move to any position below either conveying device 1 for repair. After welding is completed, the PCB board is discharged through the output device 5.

[0035] For the second production mode, before formal production, the multi-segment selective wave soldering device 100 uses the photographing component 32 on the welding device 3 to photograph a PCB sample. Based on the photograph, it determines which production mode (spot soldering or drag soldering) is required for each position of the PCB sample and creates a production program for the PCB. After the PCB passes through the insertion process, it flows directly into the selective wave soldering production line 200. The selective wave soldering production line 200 applies flux to the PCB based on previously collected data. After fluxing, it flows into the multi-segment selective wave soldering device 100 for repair. When the PCB flows into the multi-segment selective wave soldering device 100, the control system selects whether to use a two-segment or one-segment process based on the size of the PCB. The specific operating mode is the same as the first repair mode described above, except that the soldering position of the PCB in the production mode is consistent each time.

[0036] Compared with the prior art, this invention, by setting at least two conveying devices 1 and arranging them sequentially to form a conveying channel 1a, and by setting a blocking device 2 at the end of each conveying device 1, allows the plates to be stopped on each conveying device 1, thereby dividing the conveying channel 1a into at least two areas, each capable of holding one plate. Furthermore, by setting at least two welding devices 3 and a driving device 4, the driving device 4 independently drives the welding devices 3, enabling the welding devices 3 to weld the plates located on each conveying device 1 in a one-to-one correspondence. When the plate size is small, multiple welding devices 3 simultaneously welding different plates can greatly improve welding efficiency; similarly, when the plate size is large, multiple welding devices 3 simultaneously welding the plate on one conveying device 1 can also improve welding efficiency. In addition, since the conveying devices 1 are arranged sequentially to form a conveying channel 1a, the problem of excessively large equipment size caused by the traditional arrangement of multiple conveying channels 1a side by side is avoided, enabling the equipment to be miniaturized.

[0037] The specific structure and control principle of the welding device 3 and the photographing component 32 involved in the multi-segment selective wave soldering device 100 of the present invention are well known to those skilled in the art, and will not be described in detail here.

[0038] The above-disclosed examples are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, any equivalent variations made in accordance with the claims of the present invention shall still fall within the scope of the present invention.

Claims

1. A multi-stage selective wave soldering apparatus, characterized by: The multi-section selective wave crest welding device comprises at least two conveying devices, at least two blocking devices, at least two welding devices and driving devices for driving the welding devices to move, the conveying devices are arranged in sequence to form a conveying passage of a conveying plate, the blocking devices are arranged at the ends of the conveying devices respectively, the welding devices are arranged below the conveying passage, the welding devices are arranged in sequence along the conveying direction of the conveying passage, the driving devices drive the welding devices to move respectively, when the size of the plate is small, the welding devices weld different plates at the same time, when the size of the plate is large, the welding devices weld the same plate at the same time, the multi-section selective wave crest welding device further comprises output devices arranged at the ends of the conveying passage.

2. The multi-stage selective wave soldering apparatus of claim 1, wherein: The conveying device comprises a first motor, a driving gear and a plurality of rollers and driving gears, the rollers are arranged in sequence horizontally, the edges of the sides of the rollers are used for bearing the plates, the driving gears are coaxially arranged on the rollers, the adjacent two driving gears are engaged with each other, the output end of the first motor is connected with the driving gear, and the driving gear is engaged with the driving gears.

3. The multi-stage selective wave soldering apparatus of claim 2, wherein: The conveying device further comprises a belt and a plurality of belt wheels, the belt is wound on the belt wheels, and the lower section of the belt is arranged along the conveying passage and above the edges of the sides of the rollers for pressing the plates.

4. The multi-stage selective wave soldering apparatus of claim 3, wherein: The conveying device further comprises a second motor, and the second motor drives the belt wheels to rotate.

5. The multi-stage selective wave soldering apparatus of claim 1, wherein: The blocking device comprises a seat body, a driver and a blocking rod, one end of the blocking rod is arranged on the seat body, the driver is arranged on the seat body and connected with the other end of the blocking rod to drive the blocking rod to move so as to block or leave the conveying passage.

6. The multi-stage selective wave soldering apparatus of claim 5, wherein: The seat body is provided with a first long slot and a second long slot, the extension directions of the first long slot and the second long slot are perpendicular to each other, one end of the blocking rod is slidingly arranged in the first long slot, and the other end of the driver is pivotally connected with the middle part of the blocking rod through a pivot shaft which is slidingly inserted into the second long slot.

7. The multi-stage selective wave soldering apparatus of claim 6, wherein: The other end of the driver is provided with a sliding block, the sliding block is pivotally connected with the blocking rod, and the sliding block is slidingly arranged on the seat body.

8. The multi-stage selective wave soldering apparatus of claim 1, wherein: The welding device comprises a welding machine and a photographing assembly, and the welding machine and the photographing assembly are arranged on the output end of the driving device.

9. The multi-stage selective wave soldering apparatus of claim 1, wherein: The driving device comprises an X-direction driving mechanism and a Y-direction driving mechanism, and the Y-direction driving mechanism is arranged on the output end of the X-direction driving mechanism.

10. The multi-stage selective wave soldering apparatus of claim 1, wherein: The device further comprises a support, the two sides of the support are provided with cross beams for bearing the conveying devices and the blocking devices, and the two cross beams are slidingly arranged on the support.

11. The multi-stage selective wave soldering apparatus of claim 10, wherein: The device further comprises a driving mechanism arranged on the support, and the driving mechanism drives the two cross beams to move close to or away from each other.

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