A semiconductor substrate continuous radial pressurizing device

Abstract

The present invention provides a continuous radial pressurizing device for semiconductor substrate sheets, characterized in that it includes: a base, a guide rail, a rigid support, a sample clamping mechanism, a pressurizing rigid member, a spring and a one-dimensional displacement platform; the guide rail is arranged on the upper surface of the base and extends in a direction parallel to the upper surface of the base; the one-dimensional displacement platform is connected to the pressurizing rigid member through a spring, and drives the pressurizing rigid member to translate in a direction parallel to the upper surface of the base; the rigid support is fixed on the side of the sample clamping mechanism away from the pressurizing rigid member; the positioning edge of the substrate sheet is parallel to the base, vertically placed in the sample clamping mechanism, and fixed in a plane perpendicular to the upper surface of the base. The above device converts the displacement into pressure by compressing the spring through the one-dimensional displacement platform, and the pressurizing process is gentle and has good controllability and continuity; the sample clamping device can ensure the pressurizing direction and avoid the substrate sheet fragmentation caused by the generation of bending torsion.

Description

Technical Field

[0001] The invention relates to a continuous radial pressurizing device for semiconductor substrate sheets, in particular to a continuous radial pressurizing device for stress calibration of semiconductor substrate sheets. Background Art

[0002] Semiconductor substrates are the basis of optoelectronic devices, and the new generation of semiconductor substrate technology is a strategic key technology in the fields of new energy vehicles, solar cells, and 5G communications. Substrate processing is accompanied by the generation of residual stress. Excessive residual stress can cause cracks or even breakage in the substrate. When characterizing the residual stress in semiconductor substrates, the measurement results need to be calibrated, and the calibration process is generally carried out in transmission mode, with continuous radial pressure on the substrate. At present, the mainstream sizes of semiconductor substrates are 4 inches and 6 inches, with a thickness of several hundred microns. For this type of large and thin hard and brittle material, the elastic strain that can be borne is very small. If the pressurization method is improper, it is easy to cause the substrate to break.

[0003] At present, among the relevant papers and patents that have been published, Theodore C. Oakberg of Hinds Company in the United States used an adhesive to pull a rope at both ends of a 60×20×6mm quartz glass, fixed one end, and suspended a weight block on the other end through a pulley to apply tension. This method is not suitable for semiconductor substrates because the thickness of the substrate is only a few hundred microns, and the adhesive is easy to fall off, and the tension cannot be effectively applied; Lan Hui used a weight to suspend one end of a lever to apply pressure in the "Determination of Stress Optical Constants of Glass by Radial Pressurization", which is also not suitable for semiconductor substrates. The reason is that the substrate is very thin, the contact between the lever and the circumference of the substrate is close to point contact, the direction of pressure application is unstable, the pressure generated is quite different from the theoretical value, and the bending torsion generated by the deflection of the pressurization direction can easily cause the semiconductor substrate to break.

[0004] In summary, there is currently a lack of a semiconductor substrate sheet continuous radial pressurization device for stress calibration. Summary of the invention

[0005] The main technical problem to be solved by the present invention is to provide a continuous radial pressurizing device suitable for stress calibration of semiconductor substrate sheets in a transmission mode.

[0006] In order to solve the above technical problems, the present invention provides a semiconductor substrate continuous radial pressurizing device, comprising: a base, a guide rail, a rigid support, a sample clamping mechanism, a pressurizing rigid member, a spring and a one-dimensional displacement stage;

[0007] The guide rail is arranged on the upper surface of the base and extends in a direction parallel to the upper surface of the base; the one-dimensional displacement platform is connected to the pressurized rigid member through a spring and drives the pressurized rigid member to translate in a direction parallel to the upper surface of the base;

[0008] The rigid support member is fixed to the side of the sample clamping mechanism away from the pressurizing rigid member; the positioning edge of the substrate sheet is parallel to the base, vertically placed in the sample clamping mechanism, and fixed in a plane perpendicular to the upper surface of the base;

[0009] The one-dimensional translation stage drives the pressurized rigid member to squeeze the substrate sheet, causing the spring to undergo elastic deformation x. The pressurized rigid member applies a pressure F of magnitude kx to the substrate sheet, where k is the elastic coefficient of the spring. The stress σ at the center of the substrate sheet can be calculated based on the pressure F:

[0010]

[0011] Where d is the thickness of the substrate sheet, D is the diameter of the substrate sheet, and K is a constant related to the material.

[0012] In a preferred embodiment: the one-dimensional displacement platform is connected to the spring via a one-dimensional displacement platform adapter.

[0013] In a preferred embodiment: the one-dimensional displacement platform adapter includes a first part parallel to the upper surface of the base, and a second part perpendicular to the upper surface of the base; the second part is placed on the upper surface of the first part; the lower surface of the first part is connected to the one-dimensional displacement platform, and the side of the second part is connected to the spring.

[0014] In a preferred embodiment: the bottom plate extends in a direction perpendicular to the upper surface of the base, and there are four spring pressing sheets, which are rotationally symmetrically distributed around the center of the substrate sheet.

[0015] The present invention provides a semiconductor substrate continuous radial pressurizing device, which converts the displacement into pressure by compressing the spring on a one-dimensional displacement platform. The pressurizing process is gentle and has good controllability and continuity. The sample clamping device can ensure the pressurizing direction and avoid the substrate breakage caused by the generation of bending torsion. At the same time, the pressure and stress at the center of the substrate can be quantified, and the range of pressure that can be applied can be changed by replacing springs with different elastic coefficients k according to actual needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention is further described below with reference to the accompanying drawings and examples.

[0017] Figure 1 This is an overall schematic diagram of the device. DETAILED DESCRIPTION

[0018] In order to further illustrate the technical solutions and features of the present invention, specific examples are provided below for illustration.

[0019] like Figure 1 As shown, the continuous radial pressurizing device for stress calibration of semiconductor substrate sheets comprises: a base adapter 1, a base 2, a guide rail adapter 3, a guide rail 4, a rigid support mechanism adapter 5, a rigid support 6, a sample clamping mechanism adapter 7, a sample clamping mechanism 8, a pressurizing rigid member adapter 9, a pressurizing rigid member 10, a spring 11, a one-dimensional displacement stage adapter 12, and a one-dimensional displacement platform 13.

[0020] The base adapter 1 is used to connect the base 2 of the pressurized workbench, and the base 2 is used to fix the one-dimensional displacement platform 13 and the sample clamping mechanism 8 and other components; the rigid support member 6 is fixed on the side of the sample clamping mechanism 8 away from the pressurized rigid member 10; the positioning edge of the substrate sheet is parallel to the base 2, vertically placed on the sample clamping mechanism 8, and fixed in a plane perpendicular to the upper surface of the base.

[0021] Specifically: the guide rail 4 is set on the upper surface of the base 2 through the guide rail adapter 3, and extends in a direction parallel to the upper surface of the base 2; the rigid support member 6 is fixed to the upper surface of the base 2 through the rigid support mechanism adapter 5, wherein the rigid support mechanism adapter 5 is parallel to the upper surface of the base 2, the rigid support member 6 extends in a direction parallel to the upper surface of the base 2, and is fixedly connected to the upper surface of the rigid support mechanism adapter 5.

[0022] The sample clamping mechanism 8 is fixedly connected to the upper surface of the base 2 through the sample clamping mechanism adapter 7; and the sample clamping mechanism 8 and the rigid support member 6 are located outside the same end of the guide rail 4. The sample clamping mechanism 8 includes a bottom plate 81 and a spring pressing piece 82 connected to the bottom plate 81 at one end, and the other end of the spring pressing piece 82 is a free end; the substrate sheet is clamped by the spring pressing piece 82 and the bottom plate 81.

[0023] The sample clamping mechanism adapter 7 is parallel to the upper surface of the base 2, and the bottom plate 81 extends in a direction perpendicular to the upper surface of the base 2 and is fixed to the upper surface of the sample clamping mechanism adapter 7. There are four spring pressing plates 82, which are rotationally symmetrically distributed around the center of the substrate.

[0024] The pressurized rigid component 10 is slidably connected to the guide rail 4 via a pressurized rigid component adapter 9. The pressurized rigid component adapter 9 extends in a direction parallel to the upper surface of the base 2. The pressurized rigid component 10 extends in a direction perpendicular to the upper surface of the base 2 and is fixedly connected to the upper surface of the pressurized rigid component adapter 9.

[0025] The one-dimensional displacement platform 13 is connected to the spring 11 and the pressurized rigid member 10 through the one-dimensional displacement platform adapter 12, and drives the pressurized rigid member 10 to translate along a direction parallel to the upper surface of the base 2; the spring 11 is sleeved outside a support shaft.

[0026] The one-dimensional displacement platform adapter 12 includes a first part parallel to the upper surface of the base 2, and a second part perpendicular to the upper surface of the base 2; the second part is placed on the upper surface of the first part; the lower surface of the first part is connected to the one-dimensional displacement platform 13, and the side surface of the second part is connected to the spring 11.

[0027] During measurement, the substrate sheet is placed vertically in parallel with the base with its positioning edge and clamped with the sample clamping mechanism 8, and the surface of the substrate sheet is coplanar with the axis of the spring 11. The rotating shaft of the one-dimensional displacement platform 13 is turned and the slider is slid to make the pressurized rigid component 10 away from the substrate sheet to be measured, and there is no contact between the two. This is the state when no load is applied; then the rotating shaft and the slider are adjusted so that the pressurized rigid component 10 is against the end face of the substrate sheet, and then the rotating shaft is continued to be turned to make the spring 11 slightly compressed, and the locking knob is tightened, and the scale of the one-dimensional displacement platform 13 is read and recorded as x0, and the result at this time is measured as the initial value; the rotating shaft of the one-dimensional displacement platform is continued to be turned, and the compression amount x of the spring 11 is gradually increased, and the corresponding result is measured; the stress value is calculated and compared and analyzed to verify the measurement method and results.

[0028] From the force analysis, it can be known that the pressure on the substrate is equal to the elastic contraction force of the spring. Therefore, when the spring undergoes elastic deformation x, the pressurized rigid member 10 applies a pressure F of magnitude kx to the substrate, where k is the elastic coefficient of the spring. Based on the pressure F, the stress σ at the center of the substrate can be calculated:

[0029]

[0030] Where d is the thickness of the substrate sheet, D is the diameter of the substrate sheet, and K is a constant related to the material.

[0031] The advantage of this pressurization method is that it avoids the one-dimensional displacement stage directly applying displacement to the hard and brittle sample to compress the substrate. Due to the hardness and brittleness of the substrate, the elastic limit is very small. If there is no spring to convert the displacement into pressure for buffering, the displacement mechanism will be required to have extremely high resolution, and the compressible range is also very small. The vibration of the environment is also relatively large. At the same time, it is easy to cause sample fragmentation due to misoperation. By using spring buffering, the displacement is converted into force, which reduces the possibility of sample damage and the requirements for the resolution of the displacement mechanism.

[0032] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor substrate continuous radial pressurization device, characterized in that include: Base, guide rail, rigid support, sample clamping mechanism, pressurized rigid part, spring and one-dimensional translation stage; The guide rail is arranged on the upper surface of the base and extends in a direction parallel to the upper surface of the base; the one-dimensional displacement stage is connected to the pressurized rigid member through a spring and drives the pressurized rigid member to translate in a direction parallel to the upper surface of the base; The rigid support member is fixed to the side of the sample clamping mechanism away from the pressurizing rigid member; the positioning edge of the substrate sheet is parallel to the base, vertically placed in the sample clamping mechanism, and fixed in a plane perpendicular to the upper surface of the base; The one-dimensional translation stage drives the pressurized rigid member to squeeze the substrate sheet, causing the spring to undergo elastic deformation x. The pressurized rigid member applies a pressure F of magnitude kx to the substrate sheet, where k is the elastic coefficient of the spring. The stress σ at the center of the substrate sheet can be calculated based on the pressure F: Where d is the thickness of the substrate, D is the diameter of the substrate, and K is a constant related to the material; The one-dimensional translation stage is connected to the spring via a one-dimensional translation stage adapter; The one-dimensional translation stage adapter comprises a first part parallel to the upper surface of the base, and a second part perpendicular to the upper surface of the base; the second part is placed on the upper surface of the first part; the lower surface of the first part is connected to the one-dimensional translation stage, and the side surface of the second part is connected to the spring; The sample clamping mechanism comprises a bottom plate and a spring pressing piece with one end connected to the bottom plate, and the other end of the spring pressing piece is a free end; the substrate sheet is clamped by the spring pressing piece and the bottom plate; The bottom plate extends in a direction perpendicular to the upper surface of the base, and there are four spring pressing sheets, which are rotationally symmetrically distributed around the center of the substrate sheet.

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