TOP-LED package all-in-one bracket

Abstract

The TOP‑LED package all-in-one bracket of the present invention belongs to the technical field of LED package; it solves the problem that the same type of LED package brackets have low heat dissipation performance and high cost; a plurality of axially symmetrical bowls for fixing LED lamp beads are arranged on the bracket body, and the two bowls adjacent to each other on the left and right are connected by a common anode welding wire area, and the upper bowl cup and the lower bowl cup adjacent to each other on the upper and lower sides are connected by a green-blue light common crystal solid area and a red light common crystal solid area, the blue light and green light crystal solid points of the upper bowl cup are located in the green-blue light common crystal solid area, and the red light crystal solid point of the upper bowl cup and the red light, blue light and green light crystal solid points of the lower bowl cup are located in the red light common crystal solid area; each bowl cup is provided with a green light independent welding wire area; the present invention forms a passage between the chip electrode and the welding pad through the welding wire, the product design structure is good, the heat dissipation efficiency is improved, the reliability performance is good, and it has a high promotion value.

Description

Technical Field

[0001] The invention belongs to the technical field of LED packaging, and in particular relates to an all-in-one TOP-LED packaging bracket. Background Art

[0002] LEDs for display screens are developing in the direction of small pitch and high density. Mini and Micro will be the next generation of mainstream products. However, due to cost, product technology and other reasons, Mini and Micro LEDs are not popular yet, and small pitch transition products are urgently needed. Four-in-one came into being. At present, the market is mainly dominated by CHIP type four-in-one structure, but its cost is equivalent to that of independent devices, and the cost performance is not high. TOP type four-in-one is becoming more and more mature and has relatively lower cost and better reliability performance, so TOP four-in-one has inherent advantages and is of great promotion value. Summary of the invention

[0003] The present invention overcomes the shortcomings of the prior art and proposes an all-in-one TOP-LED packaging bracket, aiming to improve the reliability performance of TOP-LED small-pitch products and solve the problems of low heat dissipation performance and high cost of similar LED packaging brackets.

[0004] In order to achieve the above object, the present invention is implemented through the following technical solutions.

[0005] The TOP-LED package all-in-one bracket includes a bracket body, on which a plurality of axially symmetrical cups for fixing LED lamp beads are arranged, wherein each cup is fixed with three chips of red light, green light and blue light, and the two adjacent cups on the left and right are connected via a common anode welding wire area, and the upper cup and lower cup adjacent to each other are connected via a green-blue light common crystal bonding area and a red light common crystal bonding area, the blue light and green light crystal bonding points of the upper cup are located in the green-blue light common crystal bonding area, the red light crystal bonding point of the upper cup and the red, blue and green light crystal bonding points of the lower cup are located in the red light common crystal bonding area; the green-blue light common crystal bonding area also serves as a blue light welding wire area; and each cup is provided with an independent green light welding wire area.

[0006] Preferably, a four-in-one bracket for TOP-LED packaging is provided, wherein four cups are axially symmetrically arranged on the bracket body, and are arranged clockwise to form a first cup, a second cup, a third cup and a fourth cup, the second cup is located below the first cup, the third cup is located below the fourth cup, and common anode welding wire areas are respectively provided between the first cup and the fourth cup and between the second cup and the third cup, the blue light and green light crystal-bonding points of the first cup are located in the first green-blue light common crystal-bonding area, the red light crystal-bonding point of the first cup and the red light, blue light and green light crystal-bonding points of the second cup are located in the first red light common crystal-bonding area; the blue light and green light crystal-bonding points of the fourth cup are located in the second green-blue light common crystal-bonding area, the red light crystal-bonding point of the fourth cup and the red light, blue light and green light crystal-bonding points of the third cup are located in the second red light common crystal-bonding area.

[0007] Furthermore, each bowl and cup is isolated from each other by an insulating passage.

[0008] The beneficial effects of the present invention compared with the prior art are as follows.

[0009] 1. The present invention uses a symmetrical structure design with the least number of pins and a vertical control circuit design in the same direction, which is convenient for popularization and promotion with the general display system on the market to achieve vertical control. It ensures the design cost and operating efficiency of the splitter and tape machine and can be promoted to the market faster.

[0010] 2. During die bonding, the present invention designs a common channel in the R die bonding area, which is beneficial to the heat dissipation of the chip. A path is formed between the chip electrode and the pad through the bonding wire. The product design structure is better and the heat dissipation efficiency is improved.

[0011] 3. The front pad has a die-bonding area and a wire bonding area, both of which are isolated by insulating passages. The chip electrodes are connected to the bracket through the wire bonding process to form a passage, and the overall structure is simple.

[0012] 4. Compared with TOP independent devices and Chip-type four-in-one devices, the present invention has lower cost, better reliability and performance, inherent advantages, and higher promotion value. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the front structure of the TOP type 1212-4pin four-in-one bracket described in an embodiment of the present invention.

[0014] Among them, 1 is the first bowl cup, 2 is the second bowl cup, 3 is the third bowl cup, 4 is the fourth bowl cup, 5 is the common anode welding wire area, 6 is the blue light solid crystal point, 7 is the green light solid crystal point, 8 is the first green and blue light common solid crystal area, 9 is the red light solid crystal point, 10 is the first red light common solid crystal area, 11 is the second green and blue light common solid crystal area, 12 is the second red light common solid crystal area, 13 is the green light independent welding wire area, and 14 is the bracket body. DETAILED DESCRIPTION

[0015] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention is further described in detail in conjunction with the embodiments and the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. The technical solutions of the present invention are described in detail below in conjunction with the embodiments and the accompanying drawings, but the scope of protection is not limited thereto.

[0016] like Figure 1 As shown, it is a TOP type 1212-4pin-LED package four-in-one bracket, including a bracket body 14 made of PPA material, and four bowl cups are axially symmetrically arranged on the bracket body 14, arranged clockwise to form a first bowl cup 1, a second bowl cup 2, a third bowl cup 3 and a fourth bowl cup 4, the second bowl cup 2 is located below the first bowl cup 1, the third bowl cup 3 is located below the fourth bowl cup 4, the first bowl cup 1 and the fourth bowl cup 4 are adjacent to each other on the left and right, the second bowl cup 2 and the third bowl cup 3 are adjacent to each other on the left and right, and each bowl cup is isolated by an insulating aisle. A common anode wire bonding area 5 is provided between the first cup 1 and the fourth cup 4, and between the second cup 2 and the third cup 3, respectively. The blue light bonding point 6 and the green light bonding point 7 of the first cup 1 are located in the first green-blue light common bonding area 8, and the red light bonding point 9 of the first cup 1 and the red, blue and green light bonding points of the second cup 2 are located in the first red light common bonding area 10; the blue light bonding point 6 and the green light bonding point 7 of the fourth cup 4 are located in the second green-blue light common bonding area 11, and the red light bonding point 9 of the fourth cup 4 and the red, blue and green light bonding points of the third cup 3 are located in the second red light common bonding area 12. The first green-blue light common bonding area 8 and the second green-blue light common bonding area 11 also serve as blue light wire bonding areas; each cup is provided with a green light independent wire bonding area 13.

[0017] The TOP type 1212-4pin of the present invention adopts a symmetrical structure design with the least number of pins (10 pins) and a same-direction vertical control circuit design, which is convenient for popularization and promotion with the general display system on the market to achieve longitudinal control. The PPA material bracket adopts a four-in-one, 10-pin design structure, which ensures the design cost and operation efficiency of the splitter and taping machine, and can be promoted to the market faster. The front pad has a solid crystal area and a welding wire area, and the areas are isolated by insulating aisles. The chip electrode is connected to the bracket through the welding wire process to form a passage, and the overall structure is simple. Compared with TOP independent devices and Chip type four-in-one, the TOP four-in-one has lower cost and better reliability performance, has innate advantages, and has a higher promotion value. When solidifying the crystal, the R solid crystal area is designed with a common channel, which is conducive to the heat dissipation of the chip. The chip electrode and the pad are connected through the welding wire to form a passage. The product design structure is better and the heat dissipation efficiency is improved.

[0018] The above content is a further detailed description of the present invention in combination with a specific preferred embodiment. It cannot be determined that the specific embodiments of the present invention are limited to this. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the present invention, which should be regarded as belonging to the present invention and the scope of patent protection determined by the submitted claims.

Claims

1. TOP-LED packaging all-in-one bracket, characterized by: The bracket body (14) comprises a PPA material, wherein four cups are axially symmetrically arranged on the bracket body (14), and are arranged clockwise to form a first cup (1), a second cup (2), a third cup (3) and a fourth cup (4), wherein the second cup (2) is located below the first cup (1), and the third cup (3) is located below the fourth cup (4), the first cup (1) and the fourth cup (4) are adjacent to each other on the left and right, and the second cup (2) and the third cup (3) are adjacent to each other on the left and right, and each cup is isolated by an insulating passage; A common anode welding wire area (5) is provided between the first cup (1) and the fourth cup (4), and between the second cup (2) and the third cup (3), respectively; the blue light crystal bonding point (6) and the green light crystal bonding point (7) of the first cup (1) are located in a first green-blue light common crystal bonding area (8); the red light crystal bonding point (9) of the first cup (1) and the red light, blue light and green light crystal bonding points of the second cup (2) are located in a first red light common crystal bonding area (10); the fourth cup (1) and the fourth cup (4) are located in a first green-blue light common crystal bonding area (8); the blue light and green light crystal bonding points of the second cup (2) are located in a first red light common crystal bonding area (10); The blue light crystal-bonding point (6) and the green light crystal-bonding point (7) of the bowl cup (4) are located in the second green-blue light common crystal-bonding area (11); the red light crystal-bonding point (9) of the fourth bowl cup (4) and the red light, blue light and green light crystal-bonding points of the third bowl cup (3) are located in the second red light common crystal-bonding area (12); the first green-blue light common crystal-bonding area (8) and the second green-blue light common crystal-bonding area (11) also serve as blue light welding areas; each bowl cup is provided with a green light independent welding area (13).

Images