A fast film arrangement device and method

Abstract

The present invention discloses a fast film arrangement device and method, the method comprising step 1: placing a chip on a support film, and making the light-emitting surface of the chip contact the support film; step 2: testing and sorting the chips on the support film, and recording the parameter information of each chip; step 3: placing the support film with the chip on the top of the film arrangement film, and making the electrode of the chip face downward; step 4: obtaining the position point of the chip on the support film according to the parameter information of the chip; step 5: identifying one of the chips on the support film and importing the parameter information of the chip, and calculating the position required to adjust the chip and the required deflection angle according to the film arrangement requirements; step 6: adjusting and rotating the support film according to the above calculation results, so that the chip reaches the film arrangement position, and transferring the chip to the film arrangement film; step 7: repeating steps 5 and 6 until all chips are arranged. The present invention takes up less operating time and greatly improves work efficiency.

Description

Technical Field

[0001] The present invention relates to the field of CSP (Chip Scale Package), and in particular to a fast chip arrangement device and method. Background Art

[0002] Mini LED (sub-millimeter light-emitting diode, with a grain size of 100-200 microns) is mainly used in HDR, special-shaped and curved backlight sources. It can provide more precise HDR partitioning and its product is more cost-effective than traditional OLED. It has always attracted market attention. After years of research and development in the mainstream market, the technology has now entered the final stage and can be mass-produced using most existing equipment.

[0003] The ultra-small pitch of Mini LED enables the product to have better electrical performance and better heat dissipation, and the small size also tests the performance of the chip arrangement machine. The chip arrangement process is the first and most important step in the CSP process. The accuracy of the chip arrangement determines the yield of the subsequent cutting products. However, the Mini LED mass production arrangement on the market currently has the following problems: the traditional swing-arm chip arrangement machine needs to first identify whether the chip surface is intact, and then repeat the chip suction and swing arm operation. Due to the small size of the flip chip, it is not easy to arrange the chips quickly, and the chip arrangement accuracy is low, resulting in a low yield of subsequent products, which is time-consuming and costly. The traditional swing-arm chip arrangement machine will inevitably lose speed to ensure the accuracy of the arrangement, and increasing the arrangement speed cannot achieve the accuracy required by the product. Summary of the invention

[0004] The present invention provides a fast film arrangement device and method to solve the above-mentioned technical problems mentioned in the prior art.

[0005] To solve the above technical problems, the present invention provides a rapid chip arrangement method, comprising: step 1: placing the chip on a support film, and making the light-emitting surface of the chip contact the support film; step 2: testing and sorting the chips on the support film, and recording the parameter information of each chip; step 3: placing the support film with the chip on top of the arrangement film, and making the electrode of the chip face downward; step 4: obtaining the position point of the chip on the support film according to the parameter information of the chip; step 5: identifying one of the chips on the support film and importing the parameter information of the chip, and calculating the position to be adjusted and the required deflection angle of the chip according to the arrangement requirements; step 6: adjusting and rotating the support film according to the above calculation results, so that the chip reaches the arrangement position, and transferring the chip to the arrangement film; step 7: repeating steps 5 and 6 until all chips are arranged.

[0006] Preferably, the support film is a PET photolytic film with UV glue coated on one side, and the UV glue loses its stickiness after being exposed to light.

[0007] Preferably, the sheeting film is a PET film with one side coated with pyrolytic adhesive, and the pyrolytic adhesive is separated from the film at 150° C. under hot pressing.

[0008] Preferably, step 6 comprises:

[0009] Step 61: Adjust and rotate the support film to move the chip to the chip arrangement position;

[0010] Step 62: Move the platform ejector pin to the center of the chip and press down the support film;

[0011] Step 63: Use laser to irradiate the support film where the chip is located to release the stickiness between the support film and the chip. At the same time, use a suction nozzle to absorb the position on the discharge film corresponding to the chip so that the discharge film is adhered to the chip in a flat and tensioned state.

[0012] Preferably, the supporting film and the sheet-discharging film are both in a tensioned state and remain horizontal.

[0013] The present invention also provides a rapid chip sorting device, including: a test sorting machine, used to test and sort the chips on the support film, and record the parameter information of each chip; a stage, used to carry the support film with the chips after the test sorting; a chip sorting fixture, located below the stage and used to carry the chip sorting film; an identification mechanism, used to identify the chips on the support film; a platform ejector pin, used to press down the support film; and a suction nozzle, used to adsorb the chip sorting film.

[0014] Preferably, the test sorting machine comprises: an automatic detection mechanism for identifying and testing chips and a PC connected to the detection mechanism.

[0015] Preferably, the device further comprises a support frame for fixing the support film and a laser source for irradiating the support film.

[0016] Preferably, the automatic detection mechanism and the identification mechanism both use CCD.

[0017] Preferably, the stage has degrees of freedom in the X-axis, Y-axis and Rz-axis, and the platform ejector pin and suction nozzle have degrees of freedom in the X-axis, Y-axis and Z-axis.

[0018] Compared with the prior art, the present invention can directly connect the sorted data to accurately locate the position of the chip, without the need for fine identification again, eliminating the secondary sorting step. On the other hand, it eliminates the steps of the suction nozzle swinging back and forth to pick up and put, reducing the work intensity of the machine and the operator, and has strong operability. While ensuring the precision of the product solid crystal, it takes up less operating time, greatly improving the work efficiency, and this operation process can also be used for the arrangement of CSP lamp beads. The present invention effectively solves the problem of time-consuming operation and insufficient precision caused by the multi-step process of the suction nozzle, ejector and swing arm descending, pushing, sucking, rising, moving, descending, and releasing in the swing-arm type arrangement machine during the arrangement process. At the same time, it solves the problem that the actual production of mini LED requires a large amount of time-consuming and labor-consuming transfer due to small size. While ensuring the accuracy, the arrangement method of the present invention can reach an arrangement speed of 18K / h, which is 44% more efficient than the traditional arrangement method. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the installation of the support membrane in the present invention;

[0020] Figure 2 It is a schematic diagram of the installation of the sheet-discharging membrane in the present invention;

[0021] Figure 3 It is a schematic diagram of chip arrangement in the present invention;

[0022] Figure 4 It is a schematic diagram of the structure of the chip on the chip arrangement film in the present invention;

[0023] Figure 5 This is a schematic diagram of the arrangement of mini LEDs in the present invention;

[0024] Figure 6 It is a schematic diagram of the arrangement of CSP chips in the present invention. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings. It should be noted that the drawings of the present invention are all simplified and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0026] Reference Figures 1 to 6 The present invention provides a fast film arrangement method, comprising:

[0027] Step 1: Place the chip 1 on the support film 2, and make the light-emitting surface of the chip 2 contact the support film 2. Specifically, the support film 2 is a PET photolytic film with UV glue applied on one side, and the UV glue is released after being exposed to light. In other words, the chip 1 is bonded to the support film 2 through the UV glue on the support film 2, and the UV glue can be removed by light later, thereby separating the chip 1 from the support film 2.

[0028] Step 2: Test and sort the chips 1 on the support film 2, and record the parameter information of each chip 1. This step is specifically completed by using a test sorting machine, which includes: an automatic detection mechanism for identifying and testing chips and a PC connected to the automatic detection mechanism. Specifically, the automatic detection mechanism is a CCD with freedom in the horizontal direction. The CCD automatically identifies and tests chips in sequence. The test speed is 5k / h, and the parameter information of each chip is recorded through the PC, and the parameter information includes the photoelectric information, size information and position information of the chip.

[0029] Step 3: Place the support film 2 with the chip 1 on top of the row film 5, and make the electrode of the chip face downward. Specifically, first fix the support film 2 with the chip 1 after testing on the support frame 3, the support frame 3 is a frame structure, fix the four sides of the support film 2 so that the support film 2 is fixed, tensioned and kept horizontal, and the electrode faces downward, as shown in the following figure. Figure 1 As shown. That is to say, the support frame 3 flips the support film 2 by 180°, so that the chip 1 is located on the lower surface of the support film 2. Then, the support frame 3 with the chip 1 and the support film 2 is fixed on the stage 4, which has horizontal freedom. That is, the stage 4 can move along the X-axis and Y-axis directions, and can rotate along the Z-axis, with a rotation range of 0 to 360 degrees. Then, the film arrangement film 5 is tightly fitted on the film arrangement fixture 6. Similarly, the film arrangement film 5 is fixed, tensioned and kept horizontal. It should be noted that, in order to facilitate subsequent film arrangement, the film arrangement fixture 6 is located below the stage 4 and is fixed in position.

[0030] Furthermore, the sheet discharging film 5 is a PET film with one side coated with pyrolytic adhesive, and the pyrolytic adhesive can be easily separated from the film when hot-pressed at 150° C. without leaving any adhesive residue.

[0031] Step 4: Obtain the position of each chip 1 on the support film 2 according to the parameter information of the chip 1. At the same time, obtain the chip arrangement requirements, including the chip arrangement spacing, chip arrangement angle, etc.

[0032] Step 5: Identify one of the chips 1 on the support film 2 and import the parameter information of the chip 1, and calculate the position of the chip 1 that needs to be adjusted and the angle of deflection that needs to be rotated according to the film arrangement requirements. Specifically, similar to step 2, this step also uses CCD as the recognition mechanism 9 to identify the chip 1 on the support film 2. Since the recognition mechanism here is located above the support film 2, and the chip 1 is located below the support film 2, the recognition mechanism 9 at this time mainly identifies the chip 1 through the position point of the chip 1. After the chip 1 is identified, the parameter information corresponding to the chip 1 is imported, and its film arrangement position is determined in combination with the film arrangement requirements, thereby calculating the position of the chip 1 that needs to be adjusted and the angle of rotation that needs to be rotated.

[0033] Step 6: According to the above calculation results, the support film 2 is adjusted and rotated to make the chip 1 reach the chip discharge position, and the chip 1 is transferred to the chip discharge film 2. Specifically, Figure 2 and Figure 3 As shown, step 6 includes:

[0034] Step 61: The support film 2 is adjusted and rotated by moving and rotating the stage 4, so that the chip 1 is moved to the discharge position. That is, at this time, the chip 1 is just above the discharge position (of course, the discharge position is on the discharge film).

[0035] Step 62: Next, the platform ejector pin 7 is moved to the center point of the chip 1, and the platform ejector pin 7 presses down the support film 2. The contact point between the platform ejector pin 7 and the support film 2 is the center point of the chip 1.

[0036] Step 63: Use laser to irradiate the support film 2 where the chip 1 is located to release the stickiness of the UV glue between the support film 2 and the chip 1, and the chip 1 falls onto the discharge film 5 below. While the chip 1 is falling, use the suction nozzle 8 to adsorb the position on the discharge film 5 corresponding to the chip 1, so that the discharge film 5 at this position is adhered to the chip 1 in a sucked and tensioned state. It should be noted that in actual operation, the distance between the support film 2 and the discharge film 5 is relatively close, so the position error generated when the chip 1 falls is within a controllable range and can be almost ignored. During the whole process, the platform ejector pin 7 can move in the XY axis (horizontal and vertical) direction, and the suction nozzle 8 can move in the X-axis and Y-axis directions.

[0037] Step 7: Repeat steps 5 and 6 until all chips 1 are arranged. Figure 4 shown.

[0038] It should be noted that the fast chip arrangement method of the present invention can be applied to a variety of chips 1, such as mini LED and CSP chip. When arranging mini LED, different RGB (red chip, green chip, blue chip) matrix pre-arrangements can be made according to different needs, such as Figure 5As shown. The horizontal or vertical arrangement data of chip 1 can be set according to actual needs. When arranging CSP chips, you can also arrange dual-color temperature CSP chips in a horizontal or vertical matrix according to the required spacing, such as Figure 6 After the chip arrangement, the electrode of the CSP chip is in contact with the chip arrangement film 5, and the light-emitting surface of the CSP chip faces upward, and the chip can be directly shipped or pressed into a white wall to make a single-sided light-emitting CSP.

[0039] Continue to follow Figures 1 to 4 The present invention also provides a rapid chip sorting device, including: a test sorting machine for testing and sorting the chips 1 on the support film 2 and recording the parameter information of each chip 1, a stage 4 for carrying the support film 2 with the chips 1 after the test sorting, a chip sorting fixture 6 located below the stage 4 and used for carrying the chip sorting film 5, an identification mechanism 9 for identifying the chip 2, a platform ejector pin 7 for pressing down the support film 2, and a suction nozzle 8 for adsorbing the chip sorting film 5. Among them, the identification mechanism 9 adopts a CCD with freedom in the horizontal direction.

[0040] Preferably, the test sorting machine includes: an automatic detection mechanism for identifying and testing chips and a PC connected to the automatic detection mechanism. Specifically, the automatic detection mechanism also uses a CCD with freedom in the horizontal direction. The CCD automatically identifies and tests chips in sequence. The test speed is 5k / h, and the parameter information of each chip is recorded through the PC. The parameter information includes the chip's optoelectronic information, size information and position information.

[0041] Furthermore, the rapid film arrangement device also includes a laser source for irradiating the support film 2 , and the laser source illuminates the support film 2 at a specific position, causing the UV glue at the position to lose its viscosity, thereby separating the chip 1 from the support film 2 .

[0042] Obviously, those skilled in the art can make various changes and modifications to the invention without departing from the spirit and scope of the invention. Thus, if these modifications and variations of the invention fall within the scope of the claims of the invention and their equivalents, the invention is also intended to include these modifications and variations.

Claims

1. A fast film arrangement method, characterized in that: include: Step 1: Place the chip on the support film and make the light-emitting surface of the chip contact with the support film; Step 2: testing and sorting the chips on the support film, and recording the parameter information of each chip; the parameter information includes the photoelectric information, size information and position information of the chip; Step 3: Place the support film with the chip on top of the row film, with the chip's electrode facing downward; Step 4: Obtain the position of the chip on the support film according to the parameter information of the chip; Step 5: Identify one of the chips on the support film and import the parameter information of the chip, and calculate the position and deflection angle required for the chip according to the chip arrangement requirements; the chip arrangement requirements include the chip arrangement spacing and the chip arrangement angle; Step 6: According to the calculation result, the support film is adjusted and rotated to make the chip reach the discharge position, and the chip is transferred to the discharge film; Step 7: Repeat steps 5 and 6 until all chips are arranged.

2. A fast film arrangement method according to claim 1, characterized in that: The support film is a PET photolytic film with UV glue applied on one side, and the UV glue loses its stickiness after being exposed to light.

3. A fast film arrangement method according to claim 1, characterized in that: The sheeting film is a PET film with one side coated with pyrolytic adhesive, and the pyrolytic adhesive is separated from the film at 150° C. during hot pressing.

4. A fast film arrangement method according to claim 1, characterized in that: The step 6 comprises: Step 61: Adjust and rotate the support film to move the chip to the chip arrangement position; Step 62: Move the platform ejector pin to the center of the chip and press down the support film; Step 63: Use laser to irradiate the support film where the chip is located to release the stickiness between the support film and the chip. At the same time, use a suction nozzle to absorb the position on the discharge film corresponding to the chip so that the discharge film is adhered to the chip in a flat and tensioned state.

5. A fast film arrangement method according to claim 1, characterized in that: The supporting film and the sheet-discharging film are both in a tensioned state and kept horizontal.

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