Pressure sensor modules and electronic equipment

Abstract

The present invention relates to a pressure sensor module and an electronic device. The pressure sensor module includes a bearing assembly, a circuit layer and a strain sensor. The bearing assembly includes at least two connecting parts, two adjacent connecting parts are rotatably connected, the circuit layer is arranged on the bearing assembly and is used to electrically connect a pressure detection device, the strain sensor is arranged on the circuit layer and is electrically connected to the circuit layer, and the strain sensor can produce deformation and change resistance when subjected to force. When the above-mentioned pressure sensor assembly is applied to an electronic device, the pressure sensor module can be arranged on the inner surface of the shell and correspond to the key area of ​​the shell. When the key area of ​​the shell is pressed, the key area produces elastic deformation, thereby transmitting pressure to the bearing assembly. This arrangement can avoid the need to provide a physical button and a mounting groove for installing the physical button on the shell, simplify the shell structure and improve the waterproof and dustproof performance of the electronic device.

Description

Technical Field

[0001] The present invention relates to the technical field of pressure sensing devices, and in particular to a pressure sensor module and an electronic device. Background Art

[0002] In electronic devices, such as mobile phones and tablets, full screens are the trend, with virtual buttons replacing physical buttons. In electronic devices, many operations cannot be performed by touch when the screen is off. In addition, many users are accustomed to directly pressing the volume button to adjust the music volume when the screen is off, such as when listening to music. In addition, some electronic devices have the function of taking photos quickly when the screen is off, which can be achieved by continuously operating multiple buttons or by operating multiple buttons at the same time when the screen is off.

[0003] Therefore, it is still necessary to set physical buttons in electronic devices, such as screen wake-up buttons, volume buttons, etc. Physical buttons usually include a press button located outside the electronic device housing and a pressure sensor located inside the electronic device housing. The press button directly acts on the pressure sensor to trigger the pressure sensing. This physical button structure requires a complex button installation slot to be opened on the electronic device housing, resulting in a complex housing structure. Summary of the invention

[0004] Based on this, it is necessary to provide a pressure sensor module and an electronic device to address the problem that the electronic device housing structure is complicated due to the provision of physical buttons in the electronic device.

[0005] A pressure sensor module, comprising a bearing assembly, a circuit layer and a strain sensor;

[0006] The bearing assembly comprises at least two connecting members, and two adjacent connecting members are rotatably connected;

[0007] The circuit layer is arranged on the bearing assembly and is used for electrically connecting to the pressure detection device;

[0008] The strain sensor is arranged on the circuit layer and is electrically connected to the circuit layer. The strain sensor can be deformed and produce a resistance change when subjected to force.

[0009] When the above-mentioned pressure sensor assembly is applied to the housing of an electronic device, the pressure sensor module is arranged on the inner surface of the housing and corresponds to the key area of ​​the housing. When the key area of ​​the housing is pressed, the key area produces elastic deformation, thereby transmitting the pressure to the bearing assembly. The bearing assembly bears the pressure and drives the strain sensor to deform, thereby producing a change in resistance. By utilizing the pressure sensor assembly of this embodiment, the housing can transmit the pressure acting on the surface of the housing to the inside of the housing in the absence of a physical button. Therefore, it is possible to avoid providing a physical button and a mounting groove for installing the physical button on the housing, simplifying the housing structure and improving the waterproof and dustproof performance of the electronic device.

[0010] In one embodiment, the connecting member includes a first connecting member and a second connecting member, the first connecting member includes a first main body and a first extension connected to the first main body, the thickness of the first extension is less than or equal to the thickness of the first main body; the second connecting member includes a second main body and a second extension connected to the second main body, the thickness of the second extension is less than or equal to the thickness of the second main body; the first extension is rotated to connect to the second extension, and the circuit layer is provided on the same side of the first main body and the second main body.

[0011] In one embodiment, one of the first extension portion and the second extension portion is provided with a rotating shaft, and the other of the first extension portion and the second extension portion is provided with an axial hole capable of rotatably cooperating with the rotating shaft; or,

[0012] The bearing assembly further includes a rotating shaft, and the rotating shaft passes through the first extension portion and the second extension portion, so that the first extension portion can rotate relative to the second extension portion.

[0013] In one embodiment, the second connecting member includes a third extension portion connected to the second main body portion, the third extension portion and the second extension portion are respectively located at opposite ends of the second main body portion, the thickness of the third extension portion is less than or equal to the thickness of the second main body portion, and the third extension portion is used to connect to another connecting member.

[0014] In one of the embodiments, on the side where the circuit layer is located, the first main body protrudes from the first extension portion, and the second main body protrudes from the second extension portion.

[0015] In one embodiment, on a side of the first connecting member facing away from the circuit layer, the first main body protrudes from the first extending portion; and on a side of the second connecting member facing away from the circuit layer, the second main body protrudes from the second extending portion.

[0016] In one of the embodiments, the circuit layer is connected to each of the connecting members, and the strain sensor is arranged between at least two of the connecting members.

[0017] In one embodiment, the circuit layer includes a first section and a second section arranged opposite to the first section; the first section is arranged on one side of the load-bearing component, the second section is arranged on the other side opposite to the load-bearing component, and the strain sensor is arranged in at least one of the first section and the second section.

[0018] In one embodiment, the first section and the second section are connected to form a closed shape.

[0019] In one embodiment, the strain sensor is a micro-electromechanical system sensor, and the micro-electromechanical system sensor is electrically connected to the circuit layer;

[0020] Alternatively, the strain sensor is a piezoresistive sensor, and the piezoresistive sensor is electrically connected to the circuit layer.

[0021] In one embodiment, the connecting member is in sheet shape.

[0022] An electronic device comprises a housing and the pressure sensor module described in any one of the above embodiments, wherein the pressure sensor module is arranged on the inner surface of the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic diagram of a housing with a pressure sensor module installed therein provided by an embodiment;

[0024] Figure 2 yes Figure 1 A partial cross-sectional view of a housing of the pressure sensor module installed therein;

[0025] Figure 3 yes Figure 1 A schematic diagram of the pressure sensor module shown;

[0026] Figure 4 yes Figure 3 A side view of the pressure sensor module shown;

[0027] Figure 5 yes Figure 3 A partial cross-sectional view of the pressure sensor module shown;

[0028] Figure 6 is a schematic diagram of a bearing assembly of a pressure sensor module in one embodiment;

[0029] Figure 7 yes Figure 6 A front view of the carrier assembly of the pressure sensor module shown;

[0030] Figure 8 is a partial cross-sectional view of a housing of a pressure sensor module installed in another embodiment;

[0031] Fig. 9 FIG. 1 is a partial cross-sectional view of a housing of a pressure sensor module installed in yet another embodiment. DETAILED DESCRIPTION

[0032] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0034] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "vertical", "horizontal", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the method or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] refer to Figure 1 In one embodiment, the electronic device includes a housing 1 and a pressure sensor module 2. The pressure sensor module 2 is disposed on the inner surface of the housing 1 and is used to sense a user's touch action. Figure 2In some embodiments, the housing 1 is provided with a key area 11, and the pressure sensor module 2 is provided corresponding to the key area 11. When the user presses the key area 11, the key area 11 can transmit the pressing force to the pressure sensor module 2, and the pressure sensor module 2 then generates a change in the electrical signal to sense the user's touch action. Further, in some embodiments, the inner surface of the housing 1 is processed with a mounting groove 13, and the pressure sensor module 2 is arranged in the mounting groove 13. In other embodiments, the housing 1 can be provided with a through groove, which runs through the inner and outer surfaces of the housing 1. The housing 1 also includes a cover plate provided in the through groove, and the cover plate can be fixedly connected to the housing 1 by welding, bonding, or threaded connection. The cover plate closes the end of the through groove facing the outer surface of the housing 1, and the cover plate and the housing 1 form a mounting groove 13 for installing the pressure sensor module 2. Of course, the installation of the mounting groove 13 is not necessary. For example, when the thickness of the housing 1 is relatively thin, the pressure sensor module 2 can be arranged on the inner surface of the housing 1.

[0036] refer to Figure 3 and Figure 4 The pressure sensor module 2 includes a bearing assembly 21, a circuit layer 23 and a strain sensor 25. The bearing assembly 21 includes at least two connecting members 210, and two adjacent connecting members 210 are rotatably connected. Figure 5 The circuit layer 23 is arranged on the bearing component 21 and is used to electrically connect the pressure detection device. For example, the circuit layer 23 can be electrically connected to the pressure detection device inside the electronic device. The strain sensor 25 is arranged on the circuit layer 23 and is electrically connected to the circuit layer 23, and the strain sensor 25 can be deformed and produce a change in resistance when subjected to force. Specifically, in some embodiments, the connector 210 is in the form of a sheet, and the connector 210 can be made by stamping and the like. The connector 210 can be connected to the inner surface of the shell 1 by welding, bonding, or threaded connection, and is arranged corresponding to the button area 11 of the shell 1. The bearing component 21 is a supporting structure and is used to support the circuit layer 23. The bearing component 21 is also a pressure-bearing component. Specifically, in combination with Figure 2When the bearing assembly 21 is subjected to a pressing force and the pressing force has a component force along the thickness direction of the connecting member 210, the two adjacent connecting members 210 corresponding to the pressing position can produce relative rotation, and the closer the point of action of the component force of the pressing force is to the connecting position of the two adjacent connecting members 210, the easier it is to drive the two adjacent connecting members 210 to produce relative rotation, so that the length difference between the side of the bearing assembly 21 facing the key area 11 and the side away from the key area 11 changes, and the circuit layer 23 arranged in the bearing assembly 21 is deformed accordingly, and then the strain sensor 25 arranged in the circuit layer 23 is deformed, and then the resistance value changes. The change in the resistance value of the strain sensor 25 will cause the change of the current or voltage signal in the circuit, that is, the change of the current or voltage signal can be detected by the pressure detection device in the electronic device to sense the user's pressing action.

[0037] Combination Figure 2 In some embodiments, when the bearing component 21 is not pressed, the two sides of the bearing component 21 are respectively located on two planes that are approximately parallel to each other. The force applied to the connecting member 210 along the thickness direction of the connecting member 210 can drive the connecting member 210 to rotate relative to each other. However, when a force is applied to the connecting member 210 along a direction perpendicular to the thickness of the connecting member 210, for example, along a direction parallel to the rotation axis, the two adjacent connecting members 210 are locked, and it is difficult for the circuit layer 23 to produce a large deformation. That is, the pressure sensor module 2 of this structure is more sensitive to the force in a specific direction. Specifically, in this embodiment, this specific direction is along the thickness direction of the connecting member 210, and the closer to the connection position of the two adjacent connecting members 210, the more sensitive it is. For a pressing force that deviates from a specific direction, such as a force along the extension direction of the rotating shaft, the connector 210 may produce a slight deformation, but the degree of deformation is small, and the resistance value of the strain sensor 25 also changes slightly. This situation is very likely to be an accidental touch by the user. Therefore, when the above-mentioned pressure sensor module 2 is applied to an electronic device, the electronic device can determine whether the user has touched it by mistake based on the change in the current or voltage signal, that is, the connector 210 of the above-mentioned structure can improve the convenience of use.

[0038] refer to Figure 3 , Figure 6 and Figure 7 , two or more connecting members 210 may be provided, and a strain sensor 25 may be provided between at least two connecting members 210. It is understandable that the strain sensor 25 may be connected to two adjacent connecting members 210, or may be provided across one or more connecting members 210. Figure 4The strain sensor 25 is arranged between the two connectors 210. It should be understood that the strain sensor 25 can be arranged on the side of the circuit layer 23 facing away from the connector 210, or on the side of the circuit layer 23 facing the connector 210, or can be arranged flush with the side of the connector 210 facing away from the key area 11.

[0039] Further, refer to Figure 3 The connector 210 includes a first connector 211 and a second connector 213. The first connector 211 includes a first main body 211a and a first extension 211b connected to the first main body 211a. The thickness of the first extension 211b is less than or equal to the thickness of the first main body 211a. The second connector 213 includes a second main body 213a and a second extension 213b connected to the second main body 213a. The thickness of the second extension 213b is less than or equal to the thickness of the second main body 213a. The first extension 211b rotates to connect to the second extension 213b. The circuit layer 23 is provided on the same side of the first main body 211a and the second main body 213a. It can be understood that the circuit layer 23 can be arranged on the side of the first main body 211a and the second main body 213a away from the key area 11, and the circuit layer 23 can also be arranged on the side of the first main body 211a and the second main body 213a facing the key area 11. Of course, the circuit layer 23 can be respectively arranged on the opposite sides of the supporting component 21, and the strain sensor 25 can be respectively arranged.

[0040] The rotational connection between the first extension 211b and the second extension 213b can have a variety of structural forms. In some embodiments, one of the first extension 211b and the second extension 213b is provided with a rotating shaft, and the other of the first extension 211b and the second extension 213b is provided with an axial hole that can be rotatably matched with the rotating shaft, and the first connecting member 211 and the second connecting member 213 can be rotatably connected by the rotational match between the rotating shaft and the axial hole. Of course, in other embodiments, the bearing assembly 21 may include an independent rotating shaft, and the rotating shaft passes through the first extension 211b and the second extension 213b, so that the first extension 211b can rotate relative to the second extension 213b. In this embodiment, the rotating shaft can be fixedly connected to one of the first extension 211b and the second extension 213b, and rotatably connected to the other. Of course, the rotating shaft can also be rotatably connected to the first extension 211b and the second extension 213b respectively. In addition, in other embodiments, the first extension portion 211b and the second extension portion 213b are respectively provided with mutually matching snap connectors, and are rotatably snap-connected through the snap connectors.

[0041] Furthermore, the second connecting member 213 includes a third extension portion 213c connected to the second main body portion 213a, the third extension portion 213c and the second extension portion 213b are respectively located at opposite ends of the second main body portion 213a, the thickness of the third extension portion 213c is less than or equal to the thickness of the second main body portion 213a, and the third extension portion 213c is used to connect another connecting member 210. In the first connecting member 211 and the second connecting member 213 of the above structure, the first connecting member 211 is generally arranged at the end of the bearing component 21, and the second connecting member 213 is generally arranged in the middle of the bearing component 21. One or more second connecting members 213 can be arranged. Of course, the second connecting member 213 can be replaced by the first connecting member 211, such as Figure 6 and Figure 7 shown.

[0042] Further, refer to Figure 3 and Figure 4 , on the side where the circuit layer 23 is located, the first main body portion 211a protrudes from the first extension portion 211b, or the second main body portion 213a protrudes from the second extension portion 213b. Figure 4 In the illustrated embodiment, the circuit layer 23 is disposed on the side of the first main body 211a and the second main body 213a away from the key area 11, and the first main body 211a protrudes the first extension 211b on the side of the first main body 211a and the second main body 213a facing the circuit layer 23, so as to form a groove structure near the connection position of the first connector 211 and the second connector 213. The groove structure can guide the relative rotation of the first connector 211 relative to the second connector 213, and can avoid the end of the rotating shaft or the first extension 211b away from the first main body 211a from interfering with the circuit layer 23, thereby protecting the circuit layer 23 and the strain sensor 25 connected thereto. The first connector 211 of this structure can also save materials and facilitate the realization of a light and thin design of the first connector 211. Of course, on the side of the first main body portion 211a and the second main body portion 213a facing the circuit layer 23, the second main body portion 213a may also protrude a second extension portion 213b, which will not be described in detail here.

[0043] Further, on the side of the first connector 211 away from the circuit layer 23, the first main body 211a protrudes from the first extension 211b, or, on the side of the second connector 213 away from the circuit layer 23, the second main body 213a protrudes from the second extension 213b. Figure 4In the illustrated embodiment, the circuit layer 23 is disposed on the side of the first main body 211a and the second main body 213a away from the key area 11. On the side of the first main body 211a and the second main body 213a away from the circuit layer 23, the first main body 211a protrudes the first extension part 211b to form a groove structure near the connection position of the first connector 211 and the second connector 213. The groove structure can guide the relative rotation of the first connector 211 relative to the second connector 213. The first connector 211 of this structure can also save materials and facilitate the thin and light design of the first connector 211. Of course, on the side of the first main body 211a and the second main body 213a away from the circuit layer 23, the second main body 213a can also protrude the second extension part 213b, which will not be repeated here.

[0044] refer to Figure 8 In some embodiments, the circuit layer 23 may be a whole section, and the circuit layer 23 is connected to each connector 210, and a strain sensor 25 is disposed between at least two connectors 210. Figure 3 and Figure 4 In other embodiments, the circuit layer 23 may also be a segmented structure, and a section of the circuit layer 23 is disposed between at least two connectors 210. For example, a section of the circuit layer 23 may be disposed between two adjacent connectors 210, or may span one or more than two connectors 210.

[0045] Further, refer to Figure 8 , circuit layers 23 may be provided on opposite sides of the bearing assembly 21, and the circuit layer 23 may include a first section 231 and a second section 233 arranged opposite to the first section 231. The first section 231 is arranged on one side of the bearing assembly 21, and the second section 233 is arranged on the other side opposite to the bearing assembly 21. The strain sensor 25 is arranged in at least one of the first section 231 and the second section 233. Specifically, in Figure 8 In the illustrated embodiment, the first section 231 is disposed on the side of the carrier assembly 21 facing away from the key area 11, and the second section 233 is disposed on the side of the carrier assembly 21 facing the key area 11. The circuit layer 23 of the first section 231 can be continuous or a multi-section structure arranged at intervals. The circuit layer 23 of the second section 233 can be continuous or a multi-section structure arranged at intervals.

[0046] Further, refer to Fig. 9, the first section 231 and the second section 233 can be connected to form a closed shape. The circuit layer 23 of this structure can be regarded as being arranged around the entire bearing assembly 21. It has a relatively simple structure and can be reliably fixed to the bearing assembly 21. It can be understood that in this embodiment, the circuit layer 23 can be connected to each connector 210, or to some of the connectors 210, as long as the circuit layer 23 can be reliably fixed to the bearing assembly 21. For example, in some embodiments, both ends of the circuit layer 23 are connected to the side of the bearing assembly 21 facing the key area 11. In other embodiments, both ends of the circuit layer 23 are connected to the side of the bearing assembly 21 facing away from the key area 11. Of course, in other embodiments, the both ends of the circuit layer 23 can be fixed to the opposite sides of the bearing assembly 21 respectively.

[0047] In one embodiment, the circuit layer 23 is a printed circuit board, which can be a flexible printed circuit board or a non-flexible printed circuit board. The strain sensor 25 is arranged on the printed circuit board, and the printed circuit board is a fixing structure and a tension applying structure of the strain sensor 25. A conductive circuit (copper foil) is arranged in the printed circuit board, and the printed circuit board can also be used as an electrical signal transmission structure of the strain sensor 25, reducing or avoiding the circuit layout.

[0048] In one embodiment, the strain sensor 25 is a micro-electromechanical system sensor, which is disposed on a flexible circuit board and electrically connected to the conductive circuit on the flexible circuit board. Specifically, the micro-electromechanical system sensor is welded on the flexible circuit board, and the flexible circuit board is connected to the force sensing pin in the micro-electromechanical system sensor. The flexible circuit board produces a slight deformation, which generates a pulling force on the force sensing pin in the micro-electromechanical system sensor, thereby triggering the micro-electromechanical system sensor to generate a sensing signal, thereby sensing the user's pressing action.

[0049] In one embodiment, the strain sensor 25 is a piezoresistive sensor, which is electrically connected to the conductive circuit on the flexible circuit board. The piezoresistive sensor is a sensor made using the piezoresistive effect of single crystal silicon material and integrated circuit technology. When the single crystal silicon material is subjected to force, the resistivity changes, and an electrical signal output proportional to the force change can be obtained by measuring the circuit. When the flexible circuit board produces elastic deformation or slight deformation, the flexible circuit board applies tension to the piezoresistive sensor, causing the piezoresistive sensor to produce elastic deformation, thereby causing the cross-section and length of the resistor to change, the resistance value of the piezoresistive sensor to change, and the current or voltage signal of the piezoresistive sensor to change. The pressure on the connector 210 is sensed by the change in the current or voltage signal of the piezoresistive sensor, and then the user's pressing action is sensed.

[0050] In one embodiment, the circuit layer 23 is in a taut state, or in a stretched state, so that it can more sensitively sense the pressing force on the key area 11 of the housing 1. The deformation produced by the key area 11 of the housing 1 is a small deformation, which can be considered as a micro deformation. When the key area 11 of the housing 1 is slightly deformed, the pressure is transmitted to the bearing component 21, and the bearing component 21 produces a micro deformation in response to the micro deformation produced by the key area 11. In this way, the circuit layer 23 in a taut or stretched state can sensitively sense the micro deformation of the bearing component 21.

[0051] In the specific application of the pressure sensor module 2 in this embodiment, the bearing component 21 is arranged in the shell 1 and attached to the inner surface of the shell 1 corresponding to the key area 11, or abuts the inner surface of the shell 1 corresponding to the key area 11. When the key area 11 of the shell 1 is pressed, the key area 11 produces elastic deformation, thereby transmitting the pressure to the bearing component 21. The bearing component 21 bears the pressure, and the bearing component 21 drives the circuit layer 23 to produce elastic deformation. After the circuit layer 23 is deformed, it drives the strain sensor 25 to produce deformation, thereby producing a change in resistance. The bearing component 21 in the pressure sensor module 2 bears the deformation of the shell 1 caused by pressing, and indirectly bears the pressing. The bearing component 21 realizes the first force transmission, so that the circuit layer 23 produces elastic deformation, and the circuit layer 23 realizes the second force transmission, so that the strain sensor 25 senses the user's pressing action. By using the pressure sensor module 2 of this embodiment, the shell 1 transmits the pressure acting on the surface of the shell 1 to the inside of the shell 1 without a physical button. Therefore, it is possible to avoid providing a physical key and a mounting groove 13 for mounting the physical key on the housing 1 , thereby simplifying the structure of the housing 1 and simplifying the processing technology of the housing 1 .

[0052] Optionally, the pressure sensor module 2 can also be applied to other areas except the key area to realize non-key control of the electronic device, for example, for controlling specific functions such as application control or mode switching of the electronic device.

[0053] In addition, the installation groove 13 of the physical key is usually connected to the inside and outside of the shell 1. The shell 1 does not need to be provided with a key installation groove 13, which can increase the sealing of the shell 1, prevent dust and moisture from entering the shell 1 through the key installation groove 13, and increase the dustproof and waterproof effect of the shell 1.

[0054] Another point is that when the electronic device is subjected to twisting, bending or other abnormal pressing forces, the bearing assembly 21 is locked, and the force transmitted to the strain sensor 25 will be greatly reduced, thereby effectively preventing the occurrence of false touches.

[0055] The strain sensor 25 generates elastic deformation driven by the circuit layer 23 and generates an induction signal. Specifically, the induction electric signal can be a new electric signal generated from nothing, or a changing electric signal generated by the change in the strength of the electric signal. In order to further shield the false touch signal, the present embodiment can also set a threshold value, such as when the new electric signal is greater than the threshold value, triggering pressure sensing. For another example, when the changing electric signal is greater than the threshold value, triggering pressure sensing.

[0056] The present invention also provides an electronic device. In one embodiment, the electronic device is a mobile terminal such as a mobile phone, a tablet computer, a PDA (Personal Digital Assistant), a POS (Point of Sales), etc. Examples of mobile terminals include, but are not limited to, satellite or cellular phones. A personal communication system (PCS) terminal that can combine a cellular phone with data processing, fax, and data communication capabilities. A PDA that can include a radio telephone, a pager, Internet / intranet access, a web browser, a notepad, a calendar, and / or a global positioning system (GPS) receiver. And conventional laptop and / or palmtop receivers or other electronic devices including a radio telephone transceiver.

[0057] In other embodiments, the electronic device may also be any electronic device such as a wearable device, an electronic scale, a headset, a household appliance, etc.

[0058] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A pressure sensor module, suitable for electronic equipment, the electronic equipment comprising a housing, the housing being provided with a key area, characterized in that: The pressure sensor module includes a bearing component, a circuit layer and a strain sensor; The bearing assembly includes at least two connecting members, two adjacent connecting members are rotatably connected, the connecting members are sheet-shaped, and the connecting members are arranged corresponding to the key area. The connecting members include a first connecting member and a second connecting member. The first connecting member includes a first main body and a first extension connected to the first main body, and the thickness of the first extension is less than or equal to the thickness of the first main body; the second connecting member includes a second main body and a second extension connected to the second main body, and the thickness of the second extension is less than or equal to the thickness of the second main body; the first extension is rotatably connected to the second extension, and the circuit layer is arranged on the same side of the first main body and the second main body, the first connecting member is arranged at the end of the bearing assembly, and the second connecting member is arranged in the middle of the bearing assembly; The circuit layer is arranged on the bearing assembly and is used to electrically connect the pressure detection device. The circuit layer is arranged on a side of the first main body and the second main body away from the key area, or the circuit layer is arranged on a side of the first main body and the second main body facing the key area; The strain sensor is arranged on the circuit layer and is electrically connected to the circuit layer. The strain sensor can be deformed and produce a resistance change when subjected to force.

2. The pressure sensor module according to claim 1, characterized in that: One of the first extension part and the second extension part is provided with a rotating shaft, and the other of the first extension part and the second extension part is provided with an axial hole capable of rotatably cooperating with the rotating shaft; or, The bearing assembly further includes a rotating shaft, and the rotating shaft passes through the first extension portion and the second extension portion, so that the first extension portion can rotate relative to the second extension portion.

3. The pressure sensor module according to claim 1, characterized in that: The second connecting member includes a third extension portion connected to the second main body portion, the third extension portion and the second extension portion are respectively located at opposite ends of the second main body portion, the thickness of the third extension portion is less than or equal to the thickness of the second main body portion, and the third extension portion is used to connect to another connecting member.

4. The pressure sensor module according to claim 1, characterized in that: On the side where the circuit layer is located, the first main body protrudes from the first extension portion, and the second main body protrudes from the second extension portion.

5. The pressure sensor module according to claim 4, characterized in that: On a side of the first connecting member facing away from the circuit layer, the first main body protrudes from the first extending portion; on a side of the second connecting member facing away from the circuit layer, the second main body protrudes from the second extending portion.

6. The pressure sensor module according to any one of claims 1 to 5, characterized in that: The circuit layer is connected to each of the connecting members, and the strain sensor is arranged between at least two of the connecting members.

7. The pressure sensor module according to any one of claims 1 to 5, characterized in that: The circuit layer includes a first section and a second section arranged opposite to the first section; the first section is arranged on one side of the bearing component, the second section is arranged on the other side opposite to the bearing component, and the strain sensor is arranged in at least one of the first section and the second section.

8. The pressure sensor module according to claim 7, characterized in that: The first section is connected to the second section in a closed shape.

9. An electronic device, characterized in that: The electronic device comprises a housing and the pressure sensor module according to any one of claims 1 to 8, wherein the pressure sensor module is arranged on the inner surface of the housing.

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