A probe switching circuit and B-ultrasound equipment

Abstract

The present invention discloses a probe switching circuit and a B-ultrasound device. The probe switching circuit includes a first probe switching unit and a second probe switching unit. The first probe switching unit controls the switching of its built-in analog switch chip according to the first probe enabling signal and the channel control signal output by the control circuit, and outputs the ultrasonic signal output by the signal circuit from the corresponding channel to the first socket circuit; the second probe switching unit controls the switching of its built-in analog switch chip according to the second probe enabling signal and the channel control signal output by the control circuit, and outputs the ultrasonic signal from the corresponding channel to the second socket circuit. The area occupied by the two analog switch chips on the printed circuit board is only equivalent to the area occupied by a relay, and the area of ​​the printed circuit board is greatly reduced, making the B-ultrasound device more miniaturized, thereby solving the problem that the existing notebook B-ultrasound device switches through relays, resulting in a large printed circuit board area.

Description

Technical Field

[0001] The invention relates to the field of electronic technology, and in particular to a probe switching circuit and B-ultrasound equipment. Background Art

[0002] At present, when B-ultrasound equipment switches between two different probe sockets, it is often achieved through two different paths of normally open and normally closed relays, such as Figure 1 The dual-channel relay shown (preferably G6H-2); when probe A is working, the dual-channel relay contacts are in a normally closed state, and the ultrasonic signal (HP1, HP2) outputs the probe A signal (AHP1, AHP2) from the 2nd and 9th pins to the socket of probe A; when probe B is working, the dual-channel relay contacts are in a normally open state, and the ultrasonic signal (HP1, HP2) outputs the probe B signal (BHP1, BHP2) from the 4th and 7th pins to the socket of probe B. Common B-ultrasound equipment has at least 16 channels (that is, the ultrasonic signal includes HP1~HP16), so 8 dual-channel relays and a driver chip (such as ULN2003AN) are required to control the path selection of the 8 dual-channel relays. However, this relay control method has the following disadvantages:

[0003] 1. The relay generates suction when the coil is energized, and the contacts switch between normally open and normally closed states, which determines that the size of the relay (9*15*5mm) is relatively large. When there are many signal channels, many relays are required, resulting in a large printed circuit board area and heavy weight, making it impossible to miniaturize and lighten the B-ultrasound equipment.

[0004] 2. When multiple groups of relays are driven together, a large current is required, and the on and off of the relays has a great impact on the power supply of the system, which greatly increases the complexity of the power supply system and the power consumption of the system is also very large.

[0005] 3. The socket end of the B-ultrasound equipment is a high-voltage signal. When switched multiple times, the relay contacts are easily oxidized due to discharge, which reduces the reliability of the system. In particular, the failure rate is relatively high at the end of the life of the B-ultrasound equipment. In addition, the aging of the contacts can easily cause the normally open and normally closed circuits to short-circuit and burn out the probe, which is also the bottleneck of the life of the B-ultrasound equipment.

[0006] 4. When multiple groups of relays are switched, the noise at the contacts is very loud, which is not conducive to creating a quiet inspection environment.

[0007] 5. The relay is composed of an energized coil, which has a large electromagnetic interference, which will affect the sensitive ultrasonic signal and increase the difficulty of EMC (electromagnetic compatibility) testing of the whole machine. It needs to be covered with a metal shielding cover.

[0008] Therefore the prior art still needs to be improved and enhanced. Summary of the invention

[0009] In view of the above-mentioned deficiencies in the prior art, an object of the present invention is to provide a probe switching circuit and a B-ultrasound device to solve the problem that the existing notebook B-ultrasound device switches through relays, resulting in a large printed circuit board area.

[0010] In order to achieve the above object, the present invention adopts the following technical solutions:

[0011] A probe switching circuit is connected to a control circuit, a signal circuit, a first socket circuit and a second socket circuit, and includes a first probe switching unit and a second probe switching unit, wherein the first probe switching unit is connected to a first probe through a first socket circuit, and the first probe switching unit is also connected to the control circuit and the signal circuit; the second probe switching unit is connected to a second probe through a second socket circuit, and the second probe switching unit is also connected to the control circuit and the signal circuit;

[0012] The first probe switching unit controls the switching of the built-in analog switch chip according to the first probe enabling signal and the channel control signal output by the control circuit, and outputs the ultrasonic signal output by the signal circuit from the corresponding channel to the first socket circuit;

[0013] The second probe switching unit controls the switching of the built-in analog switch chip according to the second probe enabling signal output by the control circuit and the channel control signal, and outputs the ultrasound signal from the corresponding channel to the second socket circuit.

[0014] In the probe switching circuit, the first probe switching unit includes a first analog switch chip, a first capacitor, a second capacitor and a third capacitor;

[0015] The SW0A pin to the SW15A pin of the first analog switch chip are connected to the signal circuit; the SW0B pin to the SW15B pin of the first analog switch chip are connected to the first socket circuit; the CLK pin, The GND pin of the first analog switch chip is grounded, the VPP pin of the first analog switch chip is grounded through the first capacitor, the VNN pin of the first analog switch chip is grounded through the second capacitor, the VDD pin of the first analog switch chip is grounded through the third capacitor, and the DIN pin of the first analog switch chip is connected to the power supply end.

[0016] In the probe switching circuit, the second probe switching unit includes a second analog switch chip, a fourth capacitor, a fifth capacitor and a sixth capacitor;

[0017] The SW0A pin to the SW15A pin of the second analog switch chip are connected to the signal circuit; the SW0B pin to the SW15B pin of the second analog switch chip are connected to the second socket circuit; the CLK pin, The GND pin of the second analog switch chip is grounded, the VPP pin of the second analog switch chip is grounded through the fourth capacitor, the VNN pin of the second analog switch chip is grounded through the fifth capacitor, the VDD pin of the second analog switch chip is grounded through the sixth capacitor, and the DIN pin of the second analog switch chip is connected to the power supply end.

[0018] In the probe switching circuit, the first probe switching unit further includes a first resistor;

[0019] The first resistor is connected between the DIN pin of the first analog switch chip and the power supply terminal.

[0020] In the probe switching circuit, the second analog switch chip further includes a second resistor;

[0021] The second resistor is connected between the DIN pin of the second analog switch chip and the power supply terminal.

[0022] A B-ultrasound device comprises at least two probes and a circuit board, wherein the circuit board is provided with a control circuit, a signal circuit and at least two socket circuits, and the circuit board is also provided with the probe switching circuit; each probe is connected to a corresponding socket circuit, the probe switching circuit is connected to the control circuit, the signal circuit and the socket circuit, and the control circuit is connected to the socket circuit;

[0023] The control circuit enables the corresponding socket circuit in turn, the socket circuit obtains the identification code of the connected probe and transmits it to the control circuit, and the control circuit outputs the corresponding probe enable signal and channel control signal according to the selection operation;

[0024] The probe switching circuit outputs the ultrasonic signal output by the signal circuit from the corresponding channel to the connected socket circuit according to the probe enabling signal and the channel control signal;

[0025] The socket circuit starts working according to the probe enable signal and outputs the ultrasonic signal to the corresponding probe; the socket circuit also drives the high-voltage switch control signal output by the control circuit and transmits it to the corresponding probe, controlling the probe to complete the transmission of the ultrasonic signal and the reception of the echo signal.

[0026] In the B-ultrasound device, the control circuit includes an MCU, the signal circuit includes an ultrasound transceiver chip, and the B-ultrasound device includes a first socket circuit, a second socket circuit, a first probe, and a second probe;

[0027] The first socket circuit connects the first probe, the first probe switching unit and the MCU; the second socket circuit connects the second probe, the second probe switching unit and the MCU; the ultrasound transceiver chip connects the first probe switching unit and the second probe switching unit.

[0028] In the B-ultrasound device, the first socket circuit includes a first probe socket, a first isolation drive chip and a second isolation drive chip;

[0029] The first isolation driver chip The first isolation driver chip has two pins, B1, B2, B3, B4, B5, B6, B7, and B8, which are connected one-to-one with the P4.0, P0.0 / AD0, P0.1 / AD1, P0.2 / AD2, P0.3 / AD3, P0.4 / AD4, P0.5 / AD5, P0.6 / AD6, and P0.7 / AD7 pins of the MCU; the DIR and GND pins of the first isolation driver chip are both grounded, and the VDD pin of the first isolation driver chip is connected to the power supply end; the A1, A2, A3, A4, A5, A6, A7, and A8 pins of the first isolation driver chip are connected one-to-one with the P1, P2, P3, P4, P5, P6, P7, and P8 pins of the first probe socket; the B7, B8, A1, A2, A3, and The pins are connected one-to-one with the P1.7 pin, P1.6 pin, P1.0 / T2 pin, P1.1 / T2EX pin, P1.2 pin, and P4.0 pin of the MCU; the B1 pin, B2 pin, B3 pin, A7 pin, and A8 pin of the second isolation driver chip are connected one-to-one with the M2 pin, M1 pin, M3 pin, M8 pin, and M7 pin of the first probe socket; the VDD pin of the second isolation driver chip is connected to the power supply end, and the DIR pin and GND pin of the second isolation driver chip are both grounded; the A8 pin, A7 pin, A6 pin, Pin A5, pin A4, pin A3, pin A2, pin A1, pin C8, pin C7, pin C6, pin C5, pin C4, pin C3, pin C2, and pin C1 are connected one-to-one with pin SW0B, pin SW1B, pin SW2B, pin SW3B, pin SW4B, pin SW5B, pin SW6B, pin SW7B, pin SW8B, pin SW9B, pin SW10B, pin SW11B, pin SW12B, pin SW13B, pin SW14B, and pin SW15B of the first analog switch chip in the first probe switching unit.

[0030] In the B-ultrasound device, the second socket circuit includes a second probe socket, a third isolation drive chip and a fourth isolation drive chip;

[0031] The third isolation driver chip The first pin, B1 pin, B2 pin, B3 pin, B4 pin, B5 pin, B6 pin, B7 pin, B8 pin are connected one-to-one with the P4.0 pin, P0.0 / AD0 pin, P0.1 / AD1 pin, P0.2 / AD2 pin, P0.3 / AD3 pin, P0.4 / AD4 pin, P0.5 / AD5 pin, P0.6 / AD6 pin, and P0.7 / AD7 pin of the MCU; the DIR pin and GND pin of the third isolation driver chip are both grounded, and the VDD of the third isolation driver chip is connected to the power supply end; the A1 pin, A2 pin, A3 pin, A4 pin, A5 pin, A6 pin, A7 pin, and A8 pin of the third isolation driver chip are connected one-to-one with the P1 pin, P2 pin, P3 pin, P4 pin, P5 pin, P6 pin, P7 pin, and P8 pin of the second probe socket; the B7 pin, B8 pin, A1 pin, A2 pin, A3 pin, The pins are connected one-to-one with the P1.7 pin, P1.6 pin, P1.0 / T2 pin, P1.1 / T2EX pin, P1.2 pin, and P4.1 pin of the MCU; the B1 pin, B2 pin, B3 pin, A7 pin, and A8 pin of the fourth isolation driver chip are connected one-to-one with the M2 pin, M1 pin, M3 pin, M8 pin, and M7 pin of the second probe socket; the VDD pin of the fourth isolation driver chip is connected to the power supply end, and the DIR pin and GND pin of the fourth isolation driver chip are both grounded; the A8 pin, A7 pin, A6 pin, Pin A5, pin A4, pin A3, pin A2, pin A1, pin C8, pin C7, pin C6, pin C5, pin C4, pin C3, pin C2, and pin C1 are connected one-to-one with pin SW0B, pin SW1B, pin SW2B, pin SW3B, pin SW4B, pin SW5B, pin SW6B, pin SW7B, pin SW8B, pin SW9B, pin SW10B, pin SW11B, pin SW12B, pin SW13B, pin SW14B, and pin SW15B of the second analog switch chip in the second probe switching unit.

[0032] In the B-ultrasound device, the A1 pin, A2 pin, A3 pin, A4 pin, A5 pin, A6 pin, A7 pin, and A8 pin of the first isolation driving chip and the third isolation driving chip are grounded through a resistor respectively.

[0033] In the B-ultrasound device, the first socket circuit further includes a seventh capacitor and an eighth capacitor;

[0034] One end of the seventh capacitor is connected to the VDD pin and the power supply end of the first isolation driver chip, and the other end of the seventh capacitor is grounded. One end of the eighth capacitor is connected to the VDD pin and the power supply end of the second isolation driver chip, and the other end of the eighth capacitor is grounded.

[0035] Compared with the prior art, the probe switching circuit and B-ultrasound device provided by the present invention include a first probe switching unit and a second probe switching unit. The first probe switching unit controls the switching of its built-in analog switch chip according to the first probe enable signal and the channel control signal output by the control circuit, and outputs the ultrasonic signal output by the signal circuit from the corresponding channel to the first socket circuit; the second probe switching unit controls the switching of its built-in analog switch chip according to the second probe enable signal and the channel control signal output by the control circuit, and outputs the ultrasonic signal from the corresponding channel to the second socket circuit. The area occupied by the two analog switch chips on the printed circuit board is only equivalent to the area occupied by a relay, the area of ​​the printed circuit board is greatly reduced, and the thickness of the chip is also greatly reduced, making the B-ultrasound device more miniaturized, thereby solving the problem that the existing notebook B-ultrasound device switches through relays, resulting in a large printed circuit board area. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 The circuit diagram of the existing dual-circuit relay.

[0037] Figure 2 This is a structural block diagram of the B-ultrasound device provided by the present invention.

[0038] Figure 3 This is a circuit diagram of the first probe switching unit provided by the present invention.

[0039] Figure 4 This is a circuit diagram of the second probe switching unit provided by the present invention.

[0040] Figure 5 This is a diagram of the internal circuit structure of the analog switch chip provided by the present invention.

[0041] Figure 6 A circuit diagram of a portion of the first socket circuit provided by the present invention.

[0042] Figure 7 Another partial circuit diagram of the first socket circuit provided by the present invention.

[0043] Figure 8 A circuit diagram of a portion of the second socket circuit provided by the present invention.

[0044] Fig. 9 Another partial circuit diagram of the second socket circuit provided by the present invention.

[0045] Fig.10 A circuit diagram of a control circuit provided by the present invention.

[0046] Fig.11 A circuit diagram of a signal circuit provided by the present invention. DETAILED DESCRIPTION

[0047] The present invention provides a probe switching circuit and a B-ultrasound device. In order to make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0048] See also Figure 2 The B-ultrasound device provided in the embodiment of the present invention includes at least two probes and a circuit board, on which a probe switching circuit 10, a control circuit, a signal circuit and at least two socket circuits 20 are arranged; each probe is connected to a corresponding socket circuit, the probe switching circuit 10 is connected to the control circuit, the signal circuit and the socket circuit, and the control circuit is connected to the socket circuit. After power-on, the control circuit enables the corresponding socket circuits in a preset order (such as the first probe first, then the second probe), the socket circuit obtains the identification code (A_PD0~A_PD2, B_PD0~B_PD2) of the connected probe and transmits it to the control circuit, the control circuit outputs the corresponding probe enable signal (A_EN and B_EN) and channel control signal (CLK and LE are used for channel control) according to the user's selection operation, the probe switching circuit 10 controls the switching of its built-in analog switch chip according to the probe enable signal and the channel control signal, and outputs the ultrasonic signal (HP1~HP16) output by the signal circuit from the corresponding channel to the connected socket circuit; the socket circuit starts working according to the probe enable signal, and outputs the ultrasonic signal (HP1~HP16) to the corresponding probe, the socket circuit also drives the high-voltage switch control signal (HD0~HD7, HVCK, HVLE) output by the control circuit and transmits it to the corresponding probe, and controls the ultrasonic transceiver module in the probe to complete the transmission of the ultrasonic signal and the reception of the echo signal.

[0049] Among them, the control circuit (such as using MCU and its peripheral circuits) and the signal circuit (such as using ultrasonic transceiver chip and its peripheral circuits) are existing technologies. This embodiment only uses the corresponding input and output signals thereof, and the specific circuit structures of the control circuit and the signal circuit are not described in detail here.

[0050] In this embodiment, two probes are taken as an example (a first probe and a second probe), and two socket circuits (a first socket circuit 210 and a second socket circuit 220) are correspondingly provided. The identification process of the probe information after power-on is as follows: the control unit first enables the first probe enable signal A_EN, and the first socket circuit 210 is enabled to obtain the identification code (A_PD0~A_PD2) of the connected first probe. If the first probe is not connected at this time, no identification code is output, and there is no data on the signal (PD0~PD2). The control circuit can detect that the first probe is not connected, and control the first probe enable signal A_EN to be invalid; if the first probe is connected, the identification code (A_PD0~A_PD2) of the first probe is transmitted to the control circuit through the signal (PD0~PD2), and the control circuit can detect that the first probe is connected, and then control whether the first probe enable signal A_EN is valid according to the switching demand (i.e., the selection operation input by the user). Then the control unit enables the second probe enable signal B_EN, and the second socket circuit 220 is enabled to obtain the identification code (B_PD0~B_PD2) of the connected second probe. If the second probe is not connected at this time, no identification code is output. At this time, there is no data on the signal (PD0~PD2), and the control circuit can detect that the second probe is not connected, and control the second probe enable signal B_EN to be invalid; if the second probe is connected, the identification code (B_PD0~B_PD2) of the second probe is transmitted to the control circuit through the signal (PD0~PD2), and the control circuit can detect that the second probe is connected, and then control whether the second probe enable signal B_EN is valid according to the switching requirements.

[0051] This embodiment takes the control circuit using the MCU U7 of model STC12LE5A60S2 and the signal circuit using the ultrasonic transceiver chip U8 of model HDL5587 as an example to illustrate the circuit connection relationship. The specific pins mentioned in the following circuit are only examples. In the specific implementation, the chip model and the corresponding pin name can be changed according to the needs, and they are not limited here.

[0052] The probe switching circuit 10 includes a first probe switching unit 110 and a second probe switching unit 120; the first socket circuit 210 connects the first probe, the first probe switching unit 110 and the control circuit; the second socket circuit 220 connects the second probe, the second probe switching unit 120 and the control circuit; the signal circuit connects the first probe switching unit and the second probe switching unit; the first socket circuit 210 obtains the identification code (A_PD0~A_PD2) of the first probe according to the first probe enable signal A_EN output by the control circuit and transmits it to the control circuit, and the second socket circuit obtains the identification code (B_PD0~B_PD2) of the second probe according to the second probe enable signal B_EN output by the control circuit and transmits it to the control circuit.

[0053] The first probe switching unit 110 controls the switching of its built-in analog switch chip according to the first probe enable signal A_EN and the channel control signal (LE and CLK) output by the control circuit, and outputs the ultrasonic signal (HP1~HP16) output by the signal circuit from the corresponding channel to the connected first socket circuit; the first socket circuit 210 outputs the ultrasonic signal (HP1~HP16) to the first probe when detecting that the first probe enable signal A_EN is valid, and also drives the high-voltage switch control signal (HD0~HD7, HVCK, HVLE) output by the control circuit to control the operation of the first probe (i.e., to transmit ultrasonic signals and receive echo signals).

[0054] The second probe switching unit 120 controls the switching of its built-in analog switch chip according to the second probe enable signal B_EN and the channel control signal output by the control circuit, and outputs the ultrasonic signal (HP1~HP16) from the corresponding channel to the connected second socket circuit; the second socket circuit 220 outputs the ultrasonic signal (HP1~HP16) to the second probe when detecting that the second probe enable signal B_EN is valid, and also drives the high-voltage switch control signal (HD0~HD7, HVCK, HVLE) to control the operation of the second probe.

[0055] It should be understood that if the number of probes is increased or decreased, the number of socket circuits and probe switching units will be increased or decreased accordingly. One socket circuit is connected to one probe and one probe switching unit, and the probe enable signal is increased or decreased accordingly. The number of other control signals remains unchanged, such as the channel control signals (CLK and LE) input into each probe switching unit, and the high-voltage switch control signals (HD0~HD7, HVCK, HVLE) input into each socket circuit.

[0056] Please also read Figure 3 , Fig.10 and Fig.11, the first probe switching unit 110 includes a first analog switch chip U1, a first capacitor C1, a second capacitor C2 and a third capacitor C3; the SW0A pin (pin 12), SW1A pin (pin 10), SW2A pin (pin 8), SW3A pin (pin 6), SW4A pin (pin 4), SW5A pin (pin 48), SW6A pin (pin 46), SW7A pin (pin 44), SW8A pin (pin 42), SW9A pin (pin 40), SW10A pin (pin 38), SW11A pin (pin 34), SW12A pin (pin 32), SW13A pin (pin 30), SW14A pin (pin 28), SW15A pin (pin 26) of the first analog switch chip U1 and the LVout0 pin, LVout1 pin, LVout2 pin, LVout3 pin, LVout4 pin, LVout5 pin, LVout6 pin of the ultrasonic transceiver chip U8 The 6th pin, LVout7 pin, LVout8 pin, LVout9 pin, LVout10 pin, LVout11 pin, LVout12 pin, LVout13 pin, LVout14 pin, and LVout15 pin of the first analog switch chip U1 are connected one by one; the SW0B pin (11th pin), SW1B pin (9th pin), SW2B pin (7th pin), SW3B pin (5th pin), SW4B pin (3rd pin), and SW5B pin ( The 47th pin of SW6B (45th pin), the 43rd pin of SW7B (43rd pin), the 41st pin of SW8B (41st pin), the 39th pin of SW9B (39th pin), the 37th pin of SW10B (37th pin), the 33rd pin of SW11B (33rd pin), the 31st pin of SW12B (31st pin), the 29th pin of SW13B (29th pin), the 27th pin of SW14B (27th pin), and the 25th pin of SW15B are all connected to the first socket circuit 210; the CLK pin of the first analog switch chip U1, The GND pin of the first analog switch chip U1 is grounded, the VPP pin of the first analog switch chip U1 is grounded through the first capacitor C1, the VNN pin of the first analog switch chip U1 is grounded through the second capacitor C2, the VDD pin of the first analog switch chip U1 is grounded through the third capacitor C3, and the DIN pin of the first analog switch chip U1 is connected to the power supply end (+5V).

[0057] The first analog switch chip U1 adopts a highly integrated 16-channel high-voltage analog switch chip, and the model is preferably ECN3293TF. The voltage on the VPP pin of the first analog switch chip U1 is +80V, and the first capacitor C1 is the positive high-voltage bypass filter capacitor of U1; similarly, the voltage on the VNN pin is -80V, and the second capacitor C2 is the negative high-voltage bypass filter capacitor of U1; the voltage on the VDD pin is +5V, and the third capacitor C3 is the bypass filter capacitor of the power supply of U1.

[0058] Preferably, the first probe switching unit 110 further includes a first resistor R1, which is connected between the DIN pin of the first analog switch chip U1 and the power supply terminal. The first resistor R1 is used to limit the current to protect the first analog switch chip U1.

[0059] Please also read Figure 4 , Fig.10 and Fig.11 , the second probe switching unit 120 includes a second analog switch chip U2, a fourth capacitor C4, a fifth capacitor C5 and a sixth capacitor C6; the SW0A pin (pin 12), SW1A pin (pin 10), SW2A pin (pin 8), SW3A pin (pin 6), SW4A pin (pin 4), SW5A pin (pin 48), SW6A pin (pin 46), SW7A pin (pin 44), SW8A pin (pin 42), SW9A pin (pin 40), SW10A pin (pin 38), SW11A pin (pin 34), SW12A pin (pin 32), SW13A pin (pin 30), SW14A pin (pin 28), SW15A pin (pin 26) of the second analog switch chip U2 and the LVout0 pin, LVout1 pin, LVout2 pin, LVout3 pin, LVout4 pin, LVout5 pin, LVout6 pin of the ultrasonic transceiver chip U8 The 6th pin, LVout7 pin, LVout8 pin, LVout9 pin, LVout10 pin, LVout11 pin, LVout12 pin, LVout13 pin, LVout14 pin, and LVout15 pin of the second analog switch chip U2 are connected one by one; the SW0B pin (11th pin), SW1B pin (9th pin), SW2B pin (7th pin), SW3B pin (5th pin), SW4B pin (3rd pin), and SW5B pin ( The 47th pin of SW6B (45th pin), the 43rd pin of SW7B (43rd pin), the 41st pin of SW8B (41st pin), the 39th pin of SW9B (39th pin), the 37th pin of SW10B (37th pin), the 33rd pin of SW11B (33rd pin), the 31st pin of SW12B (31st pin), the 29th pin of SW13B (29th pin), the 27th pin of SW14B (27th pin), and the 25th pin of SW15B are all connected to the second socket circuit 220; the CLK pin of the second analog switch chip U2, The pin and CLR pin are connected one-to-one with the P1.4 pin, P1.5 pin, and P4.1 pin of the MCU U7, the GND pin of the second analog switch chip U2 is grounded, the VPP pin of the second analog switch chip U2 is grounded through the fourth capacitor C4, the VNN pin of the second analog switch chip U2 is grounded through the fifth capacitor C5, the VDD pin of the second analog switch chip U2 is grounded through the sixth capacitor C6, and the DIN pin of the second analog switch chip U2 is connected to the power supply end (+5V).

[0060] The second analog switch chip U2 adopts a highly integrated 16-channel high-voltage analog switch chip, and the model is preferably ECN3293TF. The voltage on the VPP pin of the second analog switch chip U2 is +80V, and the fourth capacitor C4 is the positive high-voltage bypass filter capacitor of U2; similarly, the voltage on the VNN pin is -80V, and the fifth capacitor C5 is the negative high-voltage bypass filter capacitor of U2; the voltage on the VDD pin is +5V, and the sixth capacitor C6 is the bypass filter capacitor of the power supply of U2.

[0061] Preferably, the second analog switch chip U2 further includes a second resistor R2, which is connected between the DIN pin of the second analog switch chip U2 and the power supply terminal. The second resistor R2 is used to limit the current to protect the first analog switch chip U1.

[0062] The first analog switch chip U1 is used as the signal channel of the first probe, and the second analog switch chip U2 is used as the signal channel of the second probe, and the two together constitute a probe switching system. The working principle of the probe switching circuit 10 is:

[0063] When the B-ultrasound device selects the first probe, the first probe enable signal A_EN output by the control circuit is valid, and the ultrasonic signal (HP1~HP16) output by the signal circuit during transmission is output through the corresponding channel of the first analog switch chip U1 (AHP1~AHP16 is actually the ultrasonic signal HP1~HP16, which has not changed after passing through the analog switch chip, and is named AHP1~AHP16 here for the convenience of network distinction) to the first probe socket in the first socket circuit, and the first probe socket then transmits the ultrasonic signal to the sound head end of the first probe, thereby completing the transmission of the ultrasonic signal. The feedback echo signal is transmitted back to the signal circuit through the above path. At this time, the second probe enable signal B_EN is invalid, and the second analog switch chip U2 is turned off.

[0064] When the B-ultrasound device selects the second probe, the second probe enable signal B_EN output by the control circuit is valid, and the ultrasonic signal (HP1~HP16) is output through the corresponding channel of the second analog switch chip U2 (BHP1~BHP16 is actually the ultrasonic signal HP1~HP16, which does not change after passing through the analog switch chip. It is named BHP1~BHP16 here for the convenience of network distinction) to the second probe socket in the second socket circuit, and then transmitted to the acoustic head end of the second probe. At this time, the first analog switch chip U1 is closed, thereby completing the switching of the ultrasonic signal between the two sockets.

[0065] The control circuit outputs a clock signal CLK and a switch enable signal LE for controlling the number and channel number of channels opened in the analog switch chip, that is, selecting which channel to open or close. Here, all 16 channels are opened.

[0066] The internal circuit structure of the analog switch chip is as follows: Figure 5 As shown, DIN represents control data input, CLK represents clock, and DOUT represents control data output (used for chip cascading). Indicates latch enable, CLR indicates clear, VPP indicates positive high voltage, VNN indicates negative high voltage, SW0A~SW15A indicates channel input, and SW0B~SW15B indicates channel output. A high-voltage clamping diode (far right) is integrated internally, which effectively reduces accidental damage to the printed circuit board and probe when the system high voltage is abnormal; at the same time, a bleeder resistor is integrated at the output end of each channel to ensure the rapidity of switching. In addition, the analog switch chip uses a low on-resistance MOS tube switch (output switch), which can greatly reduce power consumption and reduce signal loss in the channel, making the background image more delicate and rich, and more convenient for later image processing. Based on the switching is achieved through the internal MOS tube switch, this method extends the service life and increases reliability compared to relays, thereby effectively extending the service life of the entire machine and reducing maintenance costs. The replacement of the chip is simpler than the relay, which greatly reduces the difficulty of maintenance.

[0067] Compared with the relay solution, the area occupied by two analog switch chips on the printed circuit board is only equivalent to the area occupied by one relay. The area of ​​the printed circuit board is greatly reduced, and the thickness of the chip is also greatly reduced, making the B-ultrasound equipment more compact, thereby reducing costs and improving the cost performance of the product. At the same time, the chip is silent when switching, which is very necessary in the ultrasound studio; since there is no relay coil, the electromagnetic environment of the entire printed circuit board is also cleaner, and the radiation of the whole machine is also reduced simultaneously. The metal shielding cover of this part of the circuit can be removed, further reducing the cost and difficulty of maintenance.

[0068] For B-ultrasound equipment, when using more channels (such as 32 channels, 64 channels or even 128 channels) or more probe sockets (such as 3 sockets, 4 sockets), the number of chips can be increased or decreased according to demand.

[0069] Please also read Figure 6 , Figure 7 and Fig.10 In this embodiment, the first socket circuit 210 includes a first probe socket JP1, a first isolation driver chip U3 and a second isolation driver chip U4; Pin B1, B2, B3, B4, B5, B6, B7, B8 and MCU The P4.0 pin, P0.0 / AD0 pin, P0.1 / AD1 pin, P0.2 / AD2 pin, P0.3 / AD3 pin, P0.4 / AD4 pin, P0.5 / AD5 pin, P0.6 / AD6 pin, and P0.7 / AD7 pin of U7 are connected one-to-one; the DIR pin and GND pin of the first isolation driver chip U3 are both grounded, and the VDD pin of the first isolation driver chip U3 is connected to the power supply end; the A1 pin, A2 pin, A3 pin, A4 pin, A5 pin, A6 pin, A7 pin, and A8 pin of the first isolation driver chip U3 are connected one-to-one with the P1 pin, P2 pin, P3 pin, P4 pin, P5 pin, P6 pin, P7 pin, and P8 pin of the first probe socket JP1; the B7 pin, B8 pin, A1 pin, A2 pin, A3 pin, The pins are connected one-to-one with the P1.7 pin, P1.6 pin, P1.0 / T2 pin, P1.1 / T2EX pin, P1.2 pin, and P4.0 pin of MCU U7; the B1 pin, B2 pin, B3 pin, A7 pin, and A8 pin of the second isolation driver chip U4 are connected one-to-one with the M2 pin, M1 pin, M3 pin, M8 pin, and M7 pin of the first probe socket JP1; the VDD pin of the second isolation driver chip U4 is connected to the power supply end, and the DIR pin and GND pin of the second isolation driver chip U4 are both grounded; the A8 pin, Pin A7, pin A6, pin A5, pin A4, pin A3, pin A2, pin A1, pin C8, pin C7, pin C6, pin C5, pin C4, pin C3, pin C2, and pin C1 are connected one-to-one with pin SW0B, pin SW1B, pin SW2B, pin SW3B, pin SW4B, pin SW5B, pin SW6B, pin SW7B, pin SW8B, pin SW9B, pin SW10B, pin SW11B, pin SW12B, pin SW13B, pin SW14B, and pin SW15B of the first analog switch chip U1.

[0070] Please also read Figure 8 , Fig. 9 and Fig.10The second socket circuit 220 includes a second probe socket JP2, a third isolation driver chip U5 and a fourth isolation driver chip U6; the third isolation driver chip U5 Pin B1, B2, B3, B4, B5, B6, B7, B8 and MCU The P4.0 pin, P0.0 / AD0 pin, P0.1 / AD1 pin, P0.2 / AD2 pin, P0.3 / AD3 pin, P0.4 / AD4 pin, P0.5 / AD5 pin, P0.6 / AD6 pin, and P0.7 / AD7 pin of U7 are connected one-to-one; the DIR pin and GND pin of the third isolation driver chip U5 are both grounded, and the VDD of the third isolation driver chip U5 is connected to the power supply end; the A1 pin, A2 pin, A3 pin, A4 pin, A5 pin, A6 pin, A7 pin, and A8 pin of the third isolation driver chip U5 are connected one-to-one with the P1 pin, P2 pin, P3 pin, P4 pin, P5 pin, P6 pin, P7 pin, and P8 pin of the second probe socket JP2; the B7 pin, B8 pin, A1 pin, A2 pin, A3 pin, The pins are connected one-to-one with the P1.7 pin, P1.6 pin, P1.0 / T2 pin, P1.1 / T2EX pin, P1.2 pin, and P4.1 pin of MCU U7; the B1 pin, B2 pin, B3 pin, A7 pin, and A8 pin of the fourth isolation driver chip U6 are connected one-to-one with the M2 pin, M1 pin, M3 pin, M8 pin, and M7 pin of the second probe socket JP2; the VDD pin of the fourth isolation driver chip U6 is connected to the power supply end, and the DIR pin and GND pin of the fourth isolation driver chip U6 are both grounded; the A8 pin, Pin A7, pin A6, pin A5, pin A4, pin A3, pin A2, pin A1, pin C8, pin C7, pin C6, pin C5, pin C4, pin C3, pin C2, and pin C1 are connected one-to-one with pin SW0B, pin SW1B, pin SW2B, pin SW3B, pin SW4B, pin SW5B, pin SW6B, pin SW7B, pin SW8B, pin SW9B, pin SW10B, pin SW11B, pin SW12B, pin SW13B, pin SW14B, and pin SW15B of the second analog switch chip U2.

[0071] Among them, the models of the first isolation driver chip U3 to the fourth isolation driver chip U6 are all MC74VHC245DT. After power-on, the socket circuit obtains the identification code (A_PD0~2, B_PD0~2) of the connected probe, and the MCU first makes the first probe enable signal A_EN valid, and the identification code (A_PD0~A_PD2) of the first probe on the first probe socket JP1 is transmitted to the MCU through the signal (PD0~PD2) on U4; then the MCU makes the second probe enable signal B_EN valid, and the identification code (B_PD0~B_PD2) of the second probe on the second probe socket JP2 is transmitted to the MCU through the signal (PD0~PD2) on U6, completing the identification of the probe information.

[0072] The MCU outputs the corresponding probe enable signal according to the user's selection operation. For example, if the first probe is used, the first probe enable signal A_EN is valid, and the high-voltage switch control signal (HD0~HD7 (channel selection), HVCK (clock), HVLE (enable)) output by the MCU is driven by the isolation driver chips U3 and U4 in the first socket circuit (the signal names after driving correspond to A_HD0~A_HD7, CLK_A, LE_A, for easy distinction) and then output to the first probe socket, controlling the first probe to complete the transmission of ultrasonic waves (i.e. AHP1~AHP16) and the reception of echo signals. Similarly, when the user switches to the second probe, the second probe enable signal B_EN is valid, and the high-voltage switch control signal (HD0~HD7, HVCK, HVLE) output by the MCU is driven by the driver isolation chips U5 and U6 in the second socket circuit (converted to B_HD0~B_HD7, CLK_B, LE_B) and then output to the second probe socket, controlling the second probe to complete the transmission of ultrasonic waves and the reception of echo signals.

[0073] U3 and U4 are used to isolate and drive the control signal of the first probe socket JP1, and U5 and U6 are used to isolate and drive the control signal of the second probe socket JP2. Since the control signal, the high-voltage transmission signal (AHP1~16, BHP1~16, which is a high-voltage pulse signal when transmitting) and the high voltage are all located on the socket, the pins of these control signals may be damaged when the probe is powered on, static electricity, or the customer accidentally inserts the probe in reverse. The control signal generally comes from a high-value FPGA. U3-U6 is set on the path between the corresponding probe socket and the FPGA. When an accident occurs, the isolation driver chip is damaged first, and then the signal path is broken. This can protect the high-value FPGA from damage in the event of an accident; at the same time, after each signal is driven by the isolation driver chip, it can be transmitted to a farther distance (generally the probe line is very long).

[0074] Preferably, the A1 pin, A2 pin, A3 pin, A4 pin, A5 pin, A6 pin, A7 pin, and A8 pin of the first isolation driver chip U3 and the third isolation driver chip U5 can also be grounded through a resistor (as shown in the figure); by pulling down the corresponding resistor, the malfunction of the high-voltage switch when the system power-on is not completed can be avoided, and the fast switching of the switch control signal can be ensured. The B1 pin, B2 pin, and B3 pin of the second isolation driver chip U4 and the fourth isolation driver chip U6 can also be connected to the power supply end through a resistor (a pull-up resistor of the identification code) respectively. The pull-up of the corresponding resistor can effectively limit the current of the chip pin, preventing the driver isolation chip from being damaged when the probe is plugged in and out.

[0075] Preferably, the first socket circuit 210 further includes a seventh capacitor C7 and an eighth capacitor C8; one end of the seventh capacitor C7 is connected to the VDD pin and the power supply terminal of the first isolation driver chip U3, and the other end of the seventh capacitor C7 is grounded; one end of the eighth capacitor C8 is connected to the VDD pin and the power supply terminal of the second isolation driver chip U4, and the other end of the eighth capacitor C8 is grounded. The seventh capacitor C7 is a bypass filter capacitor of U3, and the eighth capacitor C8 is a bypass filter capacitor of U4.

[0076] Preferably, the second socket circuit 220 further includes a ninth capacitor C9 and a tenth capacitor C10; one end of the ninth capacitor C9 is connected to the VDD pin and the power supply terminal of the third isolation driver chip U5, and the other end of the ninth capacitor C9 is grounded; one end of the tenth capacitor C10 is connected to the VDD pin and the power supply terminal of the fourth isolation driver chip U6, and the other end of the tenth capacitor C10 is grounded. The ninth capacitor C9 is a bypass filter capacitor of U5, and the tenth capacitor C10 is a bypass filter capacitor of U6.

[0077] In summary, the probe switching circuit and B-ultrasound equipment provided by the present invention adopt a highly integrated 16-channel high-voltage analog switch chip, which perfectly integrates logic control, high-voltage clamping, voltage discharge, high-voltage switch and drive in an area of ​​9×9mm (the size of the isolation driver chip). The peripheral support circuit is also simple and easy, and the high-voltage MOS tube switch has a low on-resistance. At the same time, the low-impedance path is eliminated through the dielectric isolation (determined by the technology of the MOS tube switch) technology, thereby providing an ideal signal channel for the ultrasound scanning line, greatly improving the reliability and stability of the machine.

[0078] The division of the above functional modules is only for illustration. In practical applications, the above functions can be assigned to different functional modules as needed, that is, divided into different functional modules to complete all or part of the functions described above.

[0079] It is understandable that those skilled in the art can make equivalent substitutions or changes based on the technical solution and inventive concept of the present invention, and all these changes or substitutions should fall within the protection scope of the claims attached to the present invention.

Claims

1. A probe switching circuit, connecting a control circuit, a signal circuit, a first socket circuit and a second socket circuit, characterized in that: The invention comprises a first probe switching unit and a second probe switching unit, wherein the first probe switching unit is connected to the first probe via a first socket circuit, and the first probe switching unit is also connected to a control circuit and a signal circuit; the second probe switching unit is connected to the second probe via a second socket circuit, and the second probe switching unit is also connected to a control circuit and a signal circuit; The first probe switching unit controls the switching of the built-in analog switch chip according to the first probe enabling signal and the channel control signal output by the control circuit, and outputs the ultrasonic signal output by the signal circuit from the corresponding channel to the first socket circuit; The second probe switching unit controls the switching of the built-in analog switch chip according to the second probe enabling signal output by the control circuit and the channel control signal, and outputs the ultrasonic signal from the corresponding channel to the second socket circuit; The first probe switching unit includes a first analog switch chip, a first capacitor, a second capacitor and a third capacitor; The SW0A pin to the SW15A pin of the first analog switch chip are connected one-to-one with the LVout0 pin to the LVout15 pin of the ultrasonic transceiver chip in the signal circuit; the SW0B pin to the SW15B pin of the first analog switch chip are connected to the first socket circuit; the CLK pin, The pin and CLR pin are connected one-to-one with the P1.4 pin, P1.5 pin, and P4.0 pin of the MCU in the control circuit; the GND pin of the first analog switch chip is grounded, the VPP pin of the first analog switch chip is grounded through the first capacitor, the VNN pin of the first analog switch chip is grounded through the second capacitor, the VDD pin of the first analog switch chip is grounded through the third capacitor, and the DIN pin of the first analog switch chip is connected to the power supply end; The second probe switching unit includes a second analog switch chip, a fourth capacitor, a fifth capacitor and a sixth capacitor; The SW0A pin to the SW15A pin of the second analog switch chip are connected one-to-one with the LVout0 pin to the LVout15 pin of the ultrasonic transceiver chip in the signal circuit; the SW0B pin to the SW15B pin of the second analog switch chip are connected to the second socket circuit; the CLK pin, The CLR pin is connected one-to-one with the P1.4 pin, P1.5 pin, and P4.1 pin of the MCU in the control circuit, the GND pin of the second analog switch chip is grounded, the VPP pin of the second analog switch chip is grounded through the fourth capacitor, the VNN pin of the second analog switch chip is grounded through the fifth capacitor, the VDD pin of the second analog switch chip is grounded through the sixth capacitor, and the DIN pin of the second analog switch chip is connected to the power supply end.

2. The probe switching circuit according to claim 1, characterized in that: The first probe switching unit also includes a first resistor; The first resistor is connected between the DIN pin of the first analog switch chip and the power supply terminal.

3. The probe switching circuit according to claim 1, characterized in that: The second analog switch chip also includes a second resistor; The second resistor is connected between the DIN pin of the second analog switch chip and the power supply terminal.

4. A B-ultrasound device, comprising at least two probes and a circuit board, wherein the circuit board is provided with a control circuit, a signal circuit and at least two socket circuits, characterized in that: The circuit board is also provided with a probe switching circuit as described in any one of claims 1 to 3; each probe is connected to a corresponding socket circuit, the probe switching circuit is connected to the control circuit, the signal circuit and the socket circuit, and the control circuit is connected to the socket circuit; The control circuit enables the corresponding socket circuit in turn, the socket circuit obtains the identification code of the connected probe and transmits it to the control circuit, and the control circuit outputs the corresponding probe enable signal and channel control signal according to the selection operation; The probe switching circuit outputs the ultrasonic signal output by the signal circuit from the corresponding channel to the connected socket circuit according to the probe enabling signal and the channel control signal; The socket circuit starts working according to the probe enable signal and outputs the ultrasonic signal to the corresponding probe; the socket circuit also drives the high-voltage switch control signal output by the control circuit and transmits it to the corresponding probe, controlling the probe to complete the transmission of the ultrasonic signal and the reception of the echo signal.

5. The B-ultrasound device according to claim 4, characterized in that: The control circuit includes an MCU, the signal circuit includes an ultrasound transceiver chip, and the B-ultrasound device includes a first socket circuit, a second socket circuit, a first probe and a second probe; The first socket circuit connects the first probe, the first probe switching unit and the MCU; the second socket circuit connects the second probe, the second probe switching unit and the MCU; the ultrasound transceiver chip connects the first probe switching unit and the second probe switching unit.

6. The B-ultrasound device according to claim 5, characterized in that: The first socket circuit includes a first probe socket, a first isolation driving chip and a second isolation driving chip; The first isolation driver chip The first isolation driver chip has the following pins: A1, A2, A3, A4, A5, A6, A7, and A8 of the first isolation driver chip: The first isolation driver chip has the following pins: A1, A2, A3, A4, A5, A6, A7, and A8 of the first isolation driver chip: The first isolation driver chip has the following pins: A1, A2, A3, A4, A5, A6, A7, and A8 of the first isolation driver chip: The first probe socket has the following pins: P1, P2, P3, P4, P5, P6, P7, and P8 of the first probe socket: The first probe socket has the following pins: P1, P2, P3, P4, P5, P6, P7, and P8 of the first probe socket: The first isolation driver chip has the following pins: A1, A2, A3, A4, A5, A6, A7, and A8 of the first isolation driver chip: The first probe socket has the following pins: P1, P2, P3, P4, P5, P6, P7, and P8 of the first probe socket: The first isolation driver chip has the following pins: P1, P2, P3, P4, P5, P6, P7, and P8 of the first probe socket: The first isolation driver chip has the following pins: P1, P2, P3, P4, P5, P6, P7, and P8 of the first probe socket: The first isolation driver chip has the following pins: P1, P2, P3, P4, P5, P6, P7, and P8 of the first probe socket: The first isolation driver chip has the following pins: The second isolation driver chip's B7, B8, A1, A2, A3, The pins are connected one-to-one with the P1.7 pin, P1.6 pin, P1.0 / T2 pin, P1.1 / T2EX pin, P1.2 pin, and P4.0 pin of the MCU; the B1 pin, B2 pin, B3 pin, A7 pin, and A8 pin of the second isolation driver chip are connected one-to-one with the M2 pin, M1 pin, M3 pin, M8 pin, and M7 pin of the first probe socket; The VDD pin of the second isolation driver chip is connected to the power supply end, and the DIR pin and GND pin of the second isolation driver chip are both grounded; the A8 pin, A7 pin, A6 pin, A5 pin, A4 pin, A3 pin, A2 pin, A1 pin, C8 pin, C7 pin, C6 pin, C5 pin, C4 pin, C3 pin, C2 pin, and C1 pin of the first probe socket are connected one-to-one with the SW0B pin, SW1B pin, SW2B pin, SW3B pin, SW4B pin, SW5B pin, SW6B pin, SW7B pin, SW8B pin, SW9B pin, SW10B pin, SW11B pin, SW12B pin, SW13B pin, SW14B pin, and SW15B pin of the first analog switch chip in the first probe switching unit.

7. The B-ultrasound device according to claim 6, characterized in that: The second socket circuit includes a second probe socket, a third isolation drive chip and a fourth isolation drive chip; The third isolation driver chip The B1, B2, B3, B4, B5, B6, B7 and B8 pins are connected one-to-one with the P4.0, P0.0 / AD0, P0.1 / AD1, P0.2 / AD2, P0.3 / AD3, P0.4 / AD4, P0.5 / AD5, P0.6 / AD6 and P0.7 / AD7 pins of the MCU; the DIR and GND pins of the third isolation driver chip are both grounded, and the VDD of the third isolation driver chip is connected to the power supply end; The A1 pin, A2 pin, A3 pin, A4 pin, A5 pin, A6 pin, A7 pin, and A8 pin of the third isolation driver chip are connected one-to-one with the P1 pin, P2 pin, P3 pin, P4 pin, P5 pin, P6 pin, P7 pin, and P8 pin of the second probe socket; The fourth isolation driver chip's B7, B8, A1, A2, A3, The pins are connected one-to-one with the P1.7 pin, P1.6 pin, P1.0 / T2 pin, P1.1 / T2EX pin, P1.2 pin, and P4.1 pin of the MCU; the B1 pin, B2 pin, B3 pin, A7 pin, and A8 pin of the fourth isolation driver chip are connected one-to-one with the M2 pin, M1 pin, M3 pin, M8 pin, and M7 pin of the second probe socket; The VDD pin of the fourth isolation driver chip is connected to the power supply end, and the DIR pin and GND pin of the fourth isolation driver chip are both grounded; the A8 pin, A7 pin, A6 pin, A5 pin, A4 pin, A3 pin, A2 pin, A1 pin, C8 pin, C7 pin, C6 pin, C5 pin, C4 pin, C3 pin, C2 pin, and C1 pin of the second probe socket are connected one-to-one with the SW0B pin, SW1B pin, SW2B pin, SW3B pin, SW4B pin, SW5B pin, SW6B pin, SW7B pin, SW8B pin, SW9B pin, SW10B pin, SW11B pin, SW12B pin, SW13B pin, SW14B pin, and SW15B pin of the second analog switch chip in the second probe switching unit.

8. The B-ultrasound device according to claim 7, characterized in that: Pins A1, A2, A3, A4, A5, A6, A7 and A8 of the first isolation driving chip and the third isolation driving chip are grounded via a resistor respectively.

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