Probe tester and its stage

Abstract

The application discloses a probe testing machine and a carrier thereof. The carrier comprises a top base comprising a downward suction plane; a bottom base located below the suction plane and comprising an upward suction pipe; a bearing seat located between the suction plane and the bottom base and comprising a suction hole sleeved on the suction pipe and vertically penetrating through the bearing seat, and a suction port arranged below the suction plane and towards the suction plane; a first channel for connecting a vacuum source with the suction hole; and a second channel for connecting the vacuum source with the suction port; wherein the bearing seat is capable of sliding along the suction pipe, and the first channel is longer than the second channel. The probe testing machine adopting the carrier can avoid damage of the wafer or the probe caused by interaction between the probe and the wafer when the vacuum source fails during testing of the wafer.

Description

Technical Field

[0001] This invention generally relates to a technique for testing wafers, and more specifically, to a probe testing machine and its stage. Background Technology

[0002] Before being packaged into complete chips, wafers need to be tested to screen out defective wafers, thereby reducing packaging costs. Probe testers are used to perform electrical performance tests on unpackaged wafers. A probe tester consists of a stage and probes. The stage holds the wafer. The probes are the interface between the tester and the wafer. Multiple probes are typically provided, and these probes simultaneously make direct contact with multiple pads on the wafer to guide electrical signals. The test instruments on the probe tester analyze these electrical signals to obtain the wafer's electrical performance.

[0003] The wafer is fixed to the stage by vacuum adsorption. After the probe is lowered, the probe tip inserts into the wafer's pad from above. If the vacuum device malfunctions at this time, causing the vacuum adsorption to break, the wafer will float upward and / or move to one side under the pressure of the probe, resulting in damage to the probe and / or the wafer.

[0004] The information disclosed in the background section is only for enhancing the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] The summary section introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. This summary section is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0006] A primary objective of this invention is to overcome at least one deficiency of the prior art and provide a stage for a probe testing machine, comprising: a top base including a downwardly facing adsorption plane; a base located below the adsorption plane including an upwardly extending suction pipe; a support seat located between the adsorption plane and the base, including an adsorption hole fitted onto the first suction pipe and vertically penetrating the support seat, and an adsorption port disposed below the adsorption plane and facing the adsorption plane; a first channel for connecting a vacuum source and the adsorption hole; and a second channel for connecting the vacuum source and the adsorption port; wherein the support seat is slidable along the suction pipe, and the first channel is longer than the second channel.

[0007] According to one embodiment of the present invention, a throttling ring is provided inside the extraction pipe.

[0008] According to one embodiment of the present invention, the number of bends in the first channel is greater than the number of bends in the second channel.

[0009] According to one embodiment of the present invention, the top seat includes an adsorption plate that is horizontally arranged and has through holes, and the adsorption plane is the bottom surface of the adsorption plate; the support seat also includes a base plate that is parallel to the adsorption plate and whose center is aligned with the through holes; a plurality of adsorption ports are provided, and the plurality of adsorption ports are evenly distributed on the edge of the base plate.

[0010] According to one embodiment of the present invention, the support base further includes a boss that protrudes upward from the middle of the substrate and is inserted into the through hole, and the adsorption hole extends from the bottom surface of the substrate to the top surface of the boss; when the adsorption port is not the adsorption plane, the top surface of the boss is higher than or flush with the top surface of the adsorption plate.

[0011] According to one embodiment of the present invention, the through hole is a circular hole, and the boss is a frustum that is clearance-fitted with the through hole.

[0012] According to one embodiment of the present invention, the support includes a plurality of adsorption tubes extending from the substrate to the adsorption plane, and the adsorption port is a tube opening located at the top end of the adsorption tube.

[0013] According to one embodiment of the present invention, the stage further includes a spring fitted on the adsorption tube; the spring is longer than the adsorption tube when not compressed.

[0014] According to one embodiment of the present invention, the top seat further includes a plurality of side plates extending downward from the edge of the adsorption plate, and the base and the support seat are both accommodated in a box enclosed by the plurality of side plates and the adsorption plate.

[0015] According to one embodiment of the invention, the base further includes a pedestal, and the air extraction pipe extends upward from the top of the pedestal.

[0016] According to one embodiment of the present invention, the base is provided with an air extraction port at its bottom, and an air extraction channel is also provided inside the base, connecting the air extraction port to the air extraction pipe; an air intake channel is also provided on the substrate, penetrating vertically through the substrate; the stage further includes a first branch pipe with one end connected to the air intake channel, a second branch pipe with one end connected to the air extraction port, and a main pipe with one end connected to the vacuum source, the other end of the main pipe being connected to the other ends of the first branch pipe and the second branch pipe; wherein, the first channel includes the inner cavity of the air extraction pipe, the air extraction channel, the air extraction port, the second branch pipe, and the main pipe connected in sequence, and the second channel includes the inner cavity of the adsorption pipe, the air intake channel, the first branch pipe, and the main pipe connected in sequence.

[0017] The present invention also proposes a probe testing machine, which includes the stage as described above.

[0018] As can be seen from the above technical solution, the advantages and positive effects of the probe testing machine stage of the present invention are as follows:

[0019] During testing, if the vacuum source malfunctions, because the first channel is longer than the second channel, the time it takes for the pressure change to travel from the vacuum source to the adsorption orifice is longer than the time it takes to travel from the vacuum source to the adsorption port. Simultaneously, the first flow resistance is greater than the second flow resistance, and the pressure rise rate at the adsorption port is also faster than the pressure rise rate at the adsorption orifice. Therefore, the adsorption port will detach from the adsorption plane first, and the support will descend under gravity, causing the wafer to separate from the probe. Only after the probe separates from the wafer will the wafer detach from the adsorption orifice. Because the probe separates from the wafer first, and the wafer then detaches from the constraint of the adsorption orifice, the wafer and probe do not come into contact during detachment, thus avoiding damage to the wafer or probe caused by their interaction. Attached Figure Description

[0020] Various objects, features, and advantages of the invention will become more apparent from the following detailed description of preferred embodiments of the invention, taken in conjunction with the accompanying drawings. The drawings are merely illustrative of the invention and are not necessarily drawn to scale. In the drawings, the same reference numerals always denote the same or similar parts. Wherein:

[0021] Figure 1 This is a top view schematic diagram of a probe testing machine stage according to an exemplary embodiment;

[0022] Figure 2 This is a schematic cross-sectional view of a stage in an unattached wafer state, as shown in an exemplary embodiment, on plane AA.

[0023] Figure 3 This is a top view of a base according to an exemplary embodiment;

[0024] Figure 4 This is a top view schematic diagram of a support according to an exemplary embodiment;

[0025] Figure 5 This is a cross-sectional schematic diagram on the AA plane of a stage in an adsorbed wafer state, according to an exemplary embodiment.

[0026] The reference numerals in the attached figures are explained as follows:

[0027] 1. Stage; 11. Top seat; 111. Adsorption plate; 112. Side plate; 113. Adsorption plane; 114. Through hole; 12. Base; 121. Evacuation pipe; 122. Base; 123. Evacuation channel; 124. Evacuation port; 13. Support seat; 131. Substrate; 132. Boss; 133. Adsorption hole; 134. Adsorption tube; 135. Adsorption port; 136. Adsorption channel; 141. Main pipe; 142. First branch pipe; 143. Second branch pipe; 15. Spring; 16. First channel; 17. Second channel; 18. Throttling ring; 2. Wafer; 3. Vacuum source; 4. Probe. Detailed Implementation

[0028] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that the invention will be thorough and complete, and the concept of the exemplary embodiments will be fully conveyed to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore their detailed description will be omitted.

[0029] like Figure 1 , 2 As shown, Figure 1 , 2 This embodiment shows a stage 1 for a probe testing machine. The stage 1 includes a top seat 11, a base 12, a support seat 13, a main pipe 141, a first branch pipe 142, and a second branch pipe 143. The base 12 is disposed below the top seat 11, and the support seat 13 is disposed between the base 12 and the top seat 11. The support seat 13 is used to support and vacuum-adsorb the wafer 2. The support seat 13 can move up and down between the base 12 and the top seat 11, and can automatically descend before the vacuum adsorption is released to avoid damage to the wafer 2 and the probe 4.

[0030] The top seat 11 includes an adsorption plate 111. The adsorption plate 111 is a flat plate, preferably a square plate. The adsorption plate 111 is horizontally arranged. The adsorption plate 111 can be a metal plate or a plastic plate. The bottom surface of the adsorption plate 111 is an adsorption plane 113, which is flat and smooth. The adsorption plate 111 is provided with a through hole 114 that penetrates vertically through the adsorption plate 111. The through hole 114 can be a round hole. The through hole 114 is preferably located in the middle of the adsorption plate 111.

[0031] like Figure 3As shown, the base 12 is positioned below the adsorption plane 113. The base 12 includes a base 122 and an extraction pipe 121. The base 122 is circular. The base 122 is parallel to the adsorption plate 111. The extraction pipe 121 is a vertically arranged straight pipe. The extraction pipe 121 extends upward from the top of the base 122. Preferably, multiple extraction pipes 121 are provided, and the multiple extraction pipes 121 are evenly arranged on the top of the base 122. An extraction port 124 is provided at the bottom of the base 122, and an extraction channel 123 is provided inside the base 122. The extraction channel 123 connects the extraction port 124 to each extraction pipe 121.

[0032] like Figure 4 As shown, the support 13 includes a substrate 131, a boss 132, and an adsorption tube 134. The substrate 131 is a flat plate, preferably a circular plate. The substrate 131 is horizontally arranged. The boss 132 is disposed on the top of the substrate 131 and located in the middle of the substrate 131. The boss 132 is preferably a frustum. The top surface of the boss 132 is flat and is used to support the wafer 2. The boss 132 is inserted into the through hole 114 of the adsorption plate 111. The support 13 is also provided with an adsorption hole 133, which vertically penetrates the support 13. The adsorption hole 133 is preferably a circular hole. In this embodiment, the adsorption hole 133 extends from the bottom surface of the substrate 131 to the top surface of the boss 132. The diameter of the adsorption hole 133 is slightly larger than the outer diameter of the suction tube 121. The support base 13 is positioned above the base 12. The number of adsorption holes 133 is the same as the number of suction pipes 121, with each adsorption hole 133 corresponding to a suction pipe 121. Each suction pipe 121 is inserted from the bottom of the support base 13 into its corresponding adsorption hole 133. There is a clearance fit between each suction pipe 121 and its corresponding adsorption hole 133. Due to the fit between the suction pipe 121 and the adsorption hole 133, the support base 13 can slide up and down along the suction pipe 121.

[0033] An adsorption tube 134 is disposed on the substrate 131 and located below the adsorption plane 113. The adsorption tube 134 extends upward from the substrate 131 such that its top end faces the adsorption plane 113. The end face of the top end of the adsorption tube 134 is parallel to the adsorption plane 113. The opening at the top end of the adsorption tube 134 is an adsorption port 135. A suction channel 136 is also provided on the support 13. The adsorption channel is disposed on the substrate 131 and penetrates the substrate 131. The opening at the bottom end of the adsorption tube 134 extends downward to the bottom surface of the substrate 131.

[0034] One end of the main pipe 141 is connected to the vacuum source 3 of the probe testing machine, and the other end is connected to the first branch pipe 142 and the second branch pipe 143. The vacuum source 3 can be a vacuum tank with a pressure lower than atmospheric pressure or a vacuum pump. The first branch pipe 142 is used to connect the suction channel 136 on the base plate to the main pipe 141. The number of first branch pipes 142 is the same as the number of suction channels 136, and the first branch pipes 142 are set one-to-one with the suction channels 136. Each first branch pipe 142 connects its corresponding suction channel 136 to the main pipe 141. One end of the second branch pipe 143 is connected to the air extraction port 124 of the base 122, and the other end is connected to the main pipe 141.

[0035] After this connection, the adsorption port 133 is connected to the vacuum source 3 via the sequentially connected suction pipe 121, suction channel 123, suction port 124, second branch pipe 143, and main pipe 141. The first channel 16 connecting the vacuum source 3 and the adsorption port 133 is the inner cavity of the sequentially connected suction pipe 121, suction channel 123, suction port 124, second branch pipe 143, and main pipe 141. The adsorption port 135 is connected to the vacuum source 3 via the sequentially connected adsorption pipe 134, suction channel 136, first branch pipe 142, and main pipe 141. The second channel 17 connecting the vacuum source 3 and the adsorption port 135 is the inner cavity of the sequentially connected adsorption pipe 134, suction channel 136, first branch pipe 142, and main pipe 141. The length of the first channel 16 is greater than the length of the second channel 17. Alternatively, the length of the second branch pipe 143 can be much greater than the length of the first branch pipe 142.

[0036] For ease of description, the flow resistance of gas flowing from vacuum source 3 to adsorption port 133 is named the first flow resistance, and the flow resistance of gas flowing from vacuum source 3 to adsorption port 135 is named the second flow resistance. Since the first channel 16 is longer than the second channel 17, the first flow resistance is greater than the second flow resistance.

[0037] like Figure 2 As shown, when the vacuum source 3 is not turned on, the carrier 13 sits on the base 12. The wafer 2 is placed on the top surface of the carrier 13, covering the adsorption holes 133 on the carrier 13. After the vacuum source 3 is turned on, as shown... Figure 3As shown, the gas pressure at the adsorption orifice 133 and adsorption port 135 decreases. The adsorption orifice 133 adsorbs the wafer 2, causing the wafer 2 to adhere tightly to the carrier 13. The adsorption port 135 draws in gas and moves the carrier 13 upward until the adsorption port 135 adheres tightly to the adsorption plane 113. At this time, the wafer 2 is fixed on the carrier 13, and the carrier 13 is fixed on the top seat 11. After aligning and calibrating the wafer 2 with the probe 4, the probe 4 is lowered so that it is inserted into the corresponding wafer 2 pad. If the vacuum source 3 malfunctions, because the length of the first channel 16 is greater than the length of the second channel 17, the time for the gas pressure change to be transmitted from the vacuum source 3 to the adsorption orifice 133 will be longer than the time for it to be transmitted from the vacuum source 3 to the adsorption port 135. At the same time, the first flow resistance is greater than the second flow resistance, and the gas pressure rise rate at the adsorption port 135 will also be faster than the gas pressure rise rate at the adsorption orifice 133. Therefore, the adsorption port 135 will first detach from the adsorption plane 113, and the support 13 will descend under the action of gravity, causing the wafer 2 to separate from the probe 4. Only after the probe 4 separates from the wafer 2 will the wafer 2 detach from the adsorption port 133. Because the probe 4 separates from the wafer 2 first, and the wafer 2 then detaches from the constraint of the adsorption port 133, the wafer 2 and the probe 4 do not come into contact with each other when the wafer 2 detaches from the adsorption, thus avoiding damage to the wafer 2 or the probe 4 caused by their interaction.

[0038] Furthermore, a throttling ring 18 is provided inside the extraction pipe 121. When gas flows from the bottom to the top of the extraction pipe 121, the throttling ring 18 can impede the gas flow, increase the first flow resistance, and thus make the time when the wafer 2 leaves the adsorption hole 133 later than the time when the adsorption plane 113 leaves the adsorption port 135.

[0039] Furthermore, the number of bends in the first channel 16 is greater than the number of bends in the second channel 17. In this embodiment, the second branch pipe 143 is configured as a serpentine bend, making the number of bends in the first channel 16 much greater than the number of bends in the second channel 17.

[0040] Since the first channel 16 bends more times than the second channel 17, the first flow channel resistance is further greater than the second flow resistance, which causes the wafer 2 to detach from the adsorption hole 133 later than the adsorption plane 113 detaches from the adsorption port 135.

[0041] Furthermore, multiple adsorption ports 135 are provided, and the multiple adsorption ports 135 are evenly distributed on the edge of the substrate 131. The middle part of the substrate 131 is aligned with the through hole 114 in the middle of the adsorption plate 111.

[0042] Since multiple adsorption ports 135 are evenly arranged on the edge of the substrate 131, when multiple adsorption ports 135 are adsorbed on the adsorption plate 111, the force between each adsorption port 135 is more uniform. At the same time, the through hole 114 in the middle of the adsorption plate 111 is a window facing the top seat 11, so that the probe 4 can contact the wafer 2 when the wafer 2 is placed on the top of the top seat 11.

[0043] Furthermore, when the adsorption port 135 does not adsorb the plane 113, the support seat 13 sits on the base 12, and the top surface of the boss 132 is higher than or flush with the top surface of the adsorption plate 111.

[0044] With this configuration, since the top surface of the boss 132 is higher than or flush with the top surface of the adsorption plate 111 when it is not adsorbed, it is more convenient to place the wafer 2 on the top surface of the boss 132 and to remove the wafer 2 from the top surface of the boss 132.

[0045] Furthermore, the through hole 114 on the adsorption plate 111 is a round hole, and the boss 132 is a frustum. The boss 132 is inserted into the through hole 114 and has a clearance fit with the through hole 114.

[0046] With this configuration, due to the gap fit between the boss 132 and the through hole 114 of the adsorption plate 111, pollutants above the adsorption plate 111 are not easily able to enter the bottom of the adsorption plate 111 through the gap between the boss 132 and the adsorption plate 111.

[0047] Furthermore, the adsorption port 135 is the opening at the top of the adsorption tube 134, and the adsorption tube 134 extends out of the base 122 towards the adsorption plane 113. Since the contact area between the adsorption tube 134 and the adsorption plane 113 is small when the adsorption tube 134 abuts against the adsorption plane 113, the carrier 13 will not be unable to separate quickly under atmospheric pressure due to the excessive contact area between the carrier 13 and the adsorption plane 113 when they separate.

[0048] Furthermore, the stage 1 also includes multiple springs 15. The number of springs 15 is the same as the number of adsorption tubes 134, and each spring 15 is fitted onto its corresponding adsorption tube 134. The length of the spring 15 is longer than that of the adsorption tube 134.

[0049] When the adsorption tube 134 is adsorbed on the adsorption plane 113, the spring 15 is compressed by the pressure of the adsorption plate 111 and the substrate 131 because the length of the spring 15 is longer than the length of the adsorption tube 134. When the adsorption port 135 is separated from the adsorption plane 113, the restoring force of the spring 15 pushes the support seat 13 downward to accelerate the descent of the support seat 13 and the wafer 2.

[0050] Furthermore, the top seat 11 also includes multiple side plates 112. These side plates 112 are positioned along the edge of the adsorption plate 111 and extend downwards from its edge. The adsorption plate 111 and the multiple side plates 112 together form a box. This box houses the base 12 and the support seat 13. There can be four side plates 112, and the adsorption plate 111 can be a square plate; the four side plates 112 and the adsorption plate 111 together form a square box. Both the base 12 and the support seat 13 are housed within the box, making them less susceptible to impacts and contamination.

[0051] It should be understood that the various examples described above can be utilized in multiple directions (e.g., tilted, inverted, horizontal, vertical, etc.) and in multiple configurations without departing from the principles of the invention. The embodiments shown in the accompanying drawings are merely examples of effective application of the principles of the invention, and the invention is not limited to any specific details of these embodiments.

[0052] Of course, upon careful consideration of the above description of the representative embodiments, those skilled in the art will readily understand that various modifications, additions, substitutions, deletions, and other changes can be made to these specific embodiments, and that such changes are within the scope of the principles of the invention. Therefore, the foregoing detailed description should be clearly understood as being given by way of illustration and example only, and the spirit and scope of the invention are defined solely by the appended claims and their equivalents.

Claims

1. A stage for a probe testing machine, characterized in that, include: Top seat, including the downward-facing adsorption surface; The base located below the adsorption plane includes an upwardly extending suction pipe; The support seat located between the adsorption plane and the base includes an adsorption hole that is fitted onto the suction pipe and vertically penetrates the support seat, and an adsorption port that is located below the adsorption plane and faces the adsorption plane. A first channel for connecting the vacuum source and the adsorption pore; as well as A second channel for connecting the vacuum source and the adsorption port; The support seat can slide along the air extraction pipe, and the first channel is longer than the second channel.

2. The platform according to claim 1, characterized in that, A throttling ring is installed inside the extraction pipe.

3. The platform according to claim 1, characterized in that, The number of bends in the first channel is greater than the number of bends in the second channel.

4. The platform according to any one of claims 1 to 3, characterized in that, The top seat includes a horizontally arranged adsorption plate with through holes, and the adsorption plane is the bottom surface of the adsorption plate; The support base also includes a substrate that is parallel to the adsorption plate and whose center is aligned with the through hole; The adsorption ports are provided in multiple ways, and the multiple adsorption ports are evenly distributed on the edge of the substrate.

5. The platform according to claim 4, characterized in that, The support also includes a boss that protrudes upward from the center of the substrate and is inserted into the through hole, and the adsorption hole extends from the bottom surface of the substrate to the top surface of the boss; When the adsorption port is not on the adsorption plane, the top surface of the protrusion is higher than or flush with the top surface of the adsorption plate.

6. The platform according to claim 5, characterized in that, The through hole is a round hole, and the boss is a frustum that fits with the through hole with a clearance.

7. The platform according to claim 4, characterized in that, The support includes multiple adsorption tubes extending from the substrate toward the adsorption plane; The adsorption port is the opening located at the top of the adsorption tube.

8. The platform according to claim 7, characterized in that, The stage also includes a spring fitted onto the adsorption tube; The spring is longer than the adsorption tube when it is not compressed.

9. The platform according to claim 4, characterized in that, The top seat also includes multiple side plates extending downward from the edge of the adsorption plate. Both the base and the support seat are housed within a box formed by the multiple side plates and the adsorption plate.

10. The platform according to claim 7, characterized in that, The base also includes a pedestal, and the suction pipe extends upward from the top of the pedestal.

11. The platform according to claim 10, characterized in that, The base is provided with an air extraction port at its bottom, and an air extraction channel is also provided inside the base to connect the air extraction port and the air extraction pipe. The substrate is also provided with a vertical air intake channel that penetrates the substrate. The stage also includes a first branch pipe with one end connected to the air intake channel, a second branch pipe with one end connected to the air extraction port, and a main pipe with one end connected to the vacuum source. The other end of the main pipe is connected to the other ends of the first branch pipe and the second branch pipe. The first channel includes the inner cavity of the suction pipe, the suction channel, the suction port, the second branch pipe, and the main pipe connected in sequence, and the second channel includes the inner cavity of the adsorption pipe, the suction channel, the first branch pipe, and the main pipe connected in sequence.

12. A probe testing machine, characterized in that, Includes the platform as described in any one of claims 1 to 11.

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