Automatic welding system for flexible circuit board

Abstract

The present invention provides an automatic welding system for a flexible circuit board, wherein a plurality of loading and unloading platforms and welding platforms receive and position jigs, the jigs position the whole or partial components of a plurality of flexible circuit boards, and the welding mechanism is arranged above the welding platform to weld the flexible circuit board on the jig. A plurality of groups of automatic loading and unloading mechanisms automatically store, load and unload the subcomponents of each flexible circuit board and the welded flexible circuit board. A plurality of jig transfer mechanisms transfer jigs between the loading and unloading platforms and the welding platform, and a plurality of grabbing and transporting mechanisms grab and transport materials between the loading and unloading platforms, the welding platform and the automatic loading and unloading mechanisms. Thus, the fully automatic transport, loading, unloading, welding and storage of each subcomponent and finished product in the welding process of the flexible circuit board are realized, and through the use of jigs, not only automation is facilitated, but also large-scale automated production is realized.

Description

Technical Field

[0001] The invention relates to the field of automatic welding facilities, in particular to an automatic welding system for a flexible circuit board. Background Art

[0002] Flexible circuit board, also known as flexible circuit board, is a circuit board mainly composed of copper foil, acrylic, epoxy resin thermosetting adhesive and film, etc. It has many advantages such as space saving, weight reduction and high flexibility. Flexible circuit boards are usually used in various electronic products and equipment such as commercial electronic equipment, car dashboards, printers, hard disk drives, floppy disk drives, fax machines, car mobile phones, general phones, notebook computers, cameras, camcorders, CD-ROMs, hard disks, watches, computers, cameras, medical instruments and equipment. In the production process of flexible circuit boards, it is usually necessary to weld multiple components together. However, the existing technology has defects such as slow clamping speed and low welding productivity. In addition, the existing technology also has defects such as easy deformation, difficult positioning and low clamping efficiency of flexible circuit boards.

[0003] When processing small electronic components such as flexible circuit boards in factories, due to the small size of the components, they are usually placed on structures such as pallets, and then the pallets are stacked on shelves, or the pallets are clamped on workbenches by clamps. In the process of processing components, the prior art uses manual pallet transport between racks and workbenches, which is inefficient and places a heavy workload on operators. Although some automatic handling robots used in engineering can also automatically transport pallets between racks and workbenches by installing specially designed clamps, it is found in practice that it takes a lot of time for the robot to locate the pallet, grab the pallet, move the pallet, and release the pallet, resulting in low efficiency in loading and unloading. In addition, the robot's repeated movement between the empty pallet rack, workbench, and pallet recovery rack requires high-frequency word positioning and steering, which also takes time, further reducing the efficiency of loading and unloading.

[0004] In factories, suction cups are a common automated operating tool that replaces manual clamping and moving of workpieces by adsorption. The suction cup in the prior art includes a deformable disc body and an air suction hole located in the center of the disc body. When using the suction cup in the prior art to operate precision devices, especially small precision electronic devices, there are many defects. For example, the suction force is too large, positioning is difficult, and it is difficult to adsorb accurately. For example, the suction cup has a single function. For example, a single electronic device is adsorbed each time, resulting in very low efficiency. In addition, in the prior art, when it is necessary to assemble, combine and other linkage operations on the workpiece, the suction cup is usually installed on a mobile platform to facilitate the placement of materials. For a variety of operating actions, multiple devices need to be set up, which leads to high equipment costs and large space occupation. Summary of the invention

[0005] In order to overcome the deficiencies of the prior art, the present invention provides an automatic loading and unloading system for a pallet.

[0006] Specifically, the technical solution is as follows:

[0007] An automatic welding system for a flexible circuit board is used for automatic welding of a flexible circuit board preferably including a flexible circuit, a substrate, a tongue and a carrier plate, comprising:

[0008] A welding station, a welding mechanism and a plurality of loading and unloading stations, wherein the plurality of loading and unloading stations and the welding station are configured to receive and position a jig, the jig is configured to position the whole or partial components of a plurality of flexible circuit boards, and the welding mechanism is arranged above the welding station to weld the flexible circuit boards on the jig;

[0009] Multiple groups of automatic loading and unloading mechanisms are configured to automatically store, load and unload the sub-components of each flexible circuit board and the welded flexible circuit boards;

[0010] a plurality of jig transfer mechanisms configured to transfer jigs between the loading and unloading station and the welding station;

[0011] A plurality of grabbing and transporting mechanisms are configured to grab and transport materials between the loading and unloading platform, the welding platform and the automatic loading and unloading mechanism.

[0012] The present invention has at least the following beneficial effects:

[0013] According to an automatic welding system for a flexible circuit board provided by the present invention, compared with the prior art, multiple loading and unloading platforms and welding platforms all receive and position jigs, the jigs position the entire or partial components of multiple flexible circuit boards, and the welding mechanism is arranged above the welding platform to weld the flexible circuit board on the jig. Multiple groups of automatic loading and unloading mechanisms automatically store, load and unload the subcomponents of each flexible circuit board and the welded soft circuit board. Multiple jig transfer mechanisms transfer jigs between the loading and unloading platforms and the welding platforms, and multiple grabbing and transporting mechanisms grab and transport materials between the loading and unloading platforms, the welding platforms and the automatic loading and unloading mechanisms. In this way, the fully automatic handling, loading, unloading, welding and storage of each subcomponent and finished product in the welding process of the flexible circuit board are realized, and through the use of jigs, not only automation is facilitated, but also large-scale automated production is realized.

[0014] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0016] Figure 1 It is a three-dimensional diagram of an automatic soldering system for flexible circuit boards;

[0017] Figure 2 is an exploded view of the welding station in the embodiment;

[0018] Figure 3 is a schematic diagram of a fixture in an embodiment;

[0019] Figure 4 is a schematic diagram of a fixture and a flexible circuit board in an embodiment;

[0020] Figure 5 is a schematic diagram of a flexible circuit board in an embodiment;

[0021] Figure 6 yes Figure 5 A magnified image of the area in the middle;

[0022] Figure 7 yes Figure 5 A magnified image of the area at B in the middle;

[0023] Figure 8 It is a partial structural exploded diagram of the finalized structure of the flexible circuit board in the embodiment;

[0024] Fig. 9 yes Figure 8 A partial enlarged view of the area at C in the middle;

[0025] Fig.10 Schematic diagram of the rotating shaft in the embodiment;

[0026] Fig.11 is a partial structural schematic diagram of the locking assembly in the embodiment;

[0027] Fig.12 is a first schematic diagram of a pressure plate assembly in an embodiment;

[0028] Fig.13 is a second schematic diagram of a pressure plate assembly in an embodiment;

[0029] Fig.14 yes Fig.12 A partial enlarged view of the area at E in

[0030] Fig.15 is a three-dimensional diagram of the automatic loading and unloading system for pallets in the embodiment;

[0031] Fig.16 is a first stereoscopic view of the tray storage mechanism in the embodiment;

[0032] Fig.17 is a second stereoscopic view of the tray storage mechanism in the embodiment;

[0033] Fig.18 is a three-dimensional diagram of the automatic tray taking mechanism in the embodiment;

[0034] Fig.19 is a three-dimensional diagram of a first set of tray support mechanisms in an embodiment;

[0035] Fig. 20 is a first stereoscopic view of the tray recovery mechanism in the embodiment;

[0036] Fig.21 is a second stereoscopic view of the tray recovery mechanism in the embodiment;

[0037] Fig. 22 is a three-dimensional diagram of the automatic tray recovery mechanism in the embodiment;

[0038] Fig.23 is a three-dimensional diagram of a second set of tray support mechanisms in the embodiment;

[0039] Fig.24 is a three-dimensional diagram of a tray conveying mechanism in an embodiment;

[0040] Fig.25 is a three-dimensional diagram of a material picking and placing mechanism of a three-axis manipulator in an embodiment;

[0041] Fig.26 is a three-dimensional diagram of the first adsorption device, the lifting device, and the second adsorption device in a non-use state in the embodiment;

[0042] Fig. 27 yes Fig.26 A partial enlarged view of the area at A in the middle;

[0043] Fig.28 is an exploded view of the second adsorption device in the embodiment. DETAILED DESCRIPTION

[0044] Example

[0045] An automatic welding system for a flexible circuit board is used for automatic welding of a flexible circuit board preferably including a flexible circuit, a substrate, a tongue and a carrier plate, comprising: a welding table K1, a welding mechanism and a plurality of loading and unloading tables K2, K3, K4, wherein the plurality of loading and unloading tables K2, K3, K4 and the welding table K1 are all configured to receive and position jigs, the jigs are configured to position the entire or partial components of a plurality of flexible circuit boards, and the welding mechanism is arranged above the welding table K1 to weld the flexible circuit board on the jig; a plurality of groups of automatic loading and unloading mechanisms are configured to automatically store, load and unload the subcomponents of each flexible circuit board and the welded flexible circuit board; a plurality of jig transfer mechanisms are configured to transfer jigs between the loading and unloading tables K2, K3, K4 and the welding table K1; a plurality of grabbing and transporting mechanisms are configured to grab and transport materials between the loading and unloading tables K2, K3, K4, the welding table K1 and the automatic loading and unloading mechanisms.

[0046] The welding station K1 includes a first linear moving platform 15, a protective atmosphere mechanism 16 and a pressure plate mechanism. A plurality of groups of flexible circuit boards are positioned on the jig 18. A bracket assembly for supporting the jig 18 is provided on the first linear moving platform 15. The protective atmosphere mechanism 16 includes a nozzle body, a protective atmosphere delivery pipeline, and a nozzle pushing mechanism. The nozzle pushing mechanism is installed on the bracket assembly. The protective atmosphere delivery pipeline is connected to the nozzle body. The nozzle body is installed on the nozzle pushing mechanism so as to be inserted into the jig and inject the protective atmosphere under the drive of the nozzle pushing mechanism. The pressure plate mechanism includes a pressure plate assembly and a pressure plate driving assembly. The pressure plate driving assembly is connected to the pressure plate assembly to drive the pressure plate assembly to move downward and press the flexible circuit board. The pressure plate assembly is provided with through holes corresponding to the welding points of the flexible circuit board. The nozzle pushing mechanism can be a cylinder. The pressure plate driving assembly can be a cylinder, a linear motor, a hydraulic cylinder or an electric cylinder.

[0047] Preferably, the pressure plate driving assembly includes a cylinder, a limit seat, and a pulling plate. The pulling plate is parallel to the pressure plate assembly. The pulling plate is detachably or non-detachably fixedly connected to the pressure plate assembly. The limit seat is arranged under the pulling plate to support the pulling plate. The piston rod of the cylinder is connected to the pulling plate.

[0048] The first linear moving platform 15 includes a linear drive mechanism and a base 20. The output end of the linear drive mechanism is connected to the base 20 to drive the base 20 to move linearly, and the bracket assembly includes a first vertical frame 21, a second vertical frame 22 and a horizontal frame 23. The first vertical frame 21 and the second vertical frame 22 are arranged at both ends of the top of the base 20, and the two ends of the horizontal frame 23 are supported by the first vertical frame 21 and the second vertical frame 22 respectively, and the fixture 18 is arranged on the horizontal frame 23. Exemplarily, the linear drive mechanism includes a servo linear motor, or the linear drive mechanism includes a servo rotary motor and a lead screw.

[0049] Among them, the flexible circuit board includes a flexible circuit 1, a tongue 2 and a substrate 3 for being assembled together and welded into shape, each flexible circuit 1 is respectively configured with a flexible wire support sheet 5, the shape of the flexible wire support sheet 5 matches the flexible circuit so as to place the flexible circuit 1 on the upper surface of the flexible wire support sheet 5, and the flexible wire support sheet 5 extends from the head to the tail of the flexible circuit 1, the tongue 2 and the substrate 3 are stacked on the lower surface of the flexible wire support sheet 5, and a downwardly bent clamping foot 51 is provided on the flexible wire support sheet 5, and the clamping foot 51 passes through the opening 21 in the middle of the tongue 2 and is clamped on the lower surface of the tongue 2.

[0050] In this embodiment, the flexible circuit board shaping structure includes a carrier plate 4, each carrier plate 4 is configured to carry a plurality of flexible circuit boards, wherein, for each carried flexible circuit board, the carrier plate 4 has a carrier portion 41 for carrying a flexible wire support sheet 5, and the carrier plate 4 also has a splicing portion 42 for splicing with the tongue piece 2 and / or the base plate 3. Specifically, the carrier plate 4 is spliced ​​with at least one of the tongue piece 2 and the base plate 3 through the splicing portion 42, so as to facilitate subsequent welding of these components together.

[0051] The clamping foot 51 includes a T-shaped clamping foot 51 , and the T-shaped clamping foot 51 is bent downward from the flexible wire supporting piece 5 . Accordingly, the opening 21 in the middle of the tongue piece 2 includes a T-shaped opening 21 .

[0052] The fixture 18 includes a positioning platform 7, which is configured to place at least one carrier plate 4 and a plurality of flexible circuit boards corresponding to each carrier plate 4. A plurality of positioning posts 61 are provided on the positioning platform 7, and positioning holes corresponding to the positioning posts 61 and used for the positioning posts 61 to pass through are respectively provided on the tongue piece 2, the substrate 3, the flexible wire support sheet 5 and the carrier plate 4, so as to realize the positioning of the tongue piece 2, the substrate 3, the flexible wire support sheet 5 and the carrier plate 4 on the positioning platform 7.

[0053] In this embodiment, the fixture 18 also includes a support platform, the positioning platform 7 is supported on the support platform, the bottom of the positioning column 61 is fixed on the support platform, and the top of the positioning column 61 passes through the positioning platform 7 and cooperates with the corresponding positioning holes in the tongue 2, the base plate 3, the soft wire support plate 5 or the supporting plate 4.

[0054] In this embodiment, clamping type positioning columns 61 are further provided on the positioning platform 7 . The clamping type positioning columns 61 are provided in pairs, and a flexible circuit is placed in the gap between each pair of clamping type positioning columns 61 .

[0055] In this embodiment, the fixture 18 also includes a locking assembly for locking the positioning platform 7. This embodiment provides a specific locking assembly, which includes a motor (not shown in the figure), a rotating shaft 8, a plurality of push rods 13 and a plurality of locking columns 12, wherein the motor transmission connection rotates to drive the rotating shaft 8 to rotate, for example, the end of the rotating shaft 8 is provided with a connector 82 that is connected to the motor transmission. A toggle structure 81 (such as a toggle block or a toggle ball, etc.) is provided on the rotating shaft 8, and the locking column 12 is inserted into the corresponding opening 21 on the positioning platform 7. One end of the push rod 13 is connected to the locking column 12, and the other end cooperates with the toggle structure 81, so that when the rotating shaft 8 drives the toggle structure 81 to abut against the push rod 13, the push rod 13 pushes the locking column 12 to abut against the positioning platform 7.

[0056] A return spring 14 is disposed on the push rod 13 , and is used for driving the push rod 13 and the locking column 12 to return to their original positions when the rotating shaft 8 drives the toggle structure 81 to leave the push rod 13 .

[0057] In this way, the deformation of the flexible circuit can be well prevented, and effective shaping of the flexible circuit board can be achieved. In particular, the clamping foot 51 passes through the opening 21 in the middle of the tongue 2 and is clamped on the lower surface of the tongue 2, thereby achieving double-sided positioning of the tongue 2 and better preventing the tongue 2 from deforming or misaligning relative to the flexible circuit or substrate 3.

[0058] Furthermore, a clever positioning structure is designed on the fixture 18, which can realize the rapid positioning of multiple products on the positioning platform 7. Not only is the positioning effect good, but the productivity is also higher.

[0059] Furthermore, an ingenious locking structure is designed on the fixture 18 to facilitate quick locking or release of the positioning platform 7 .

[0060] The pressure plate assembly 17 includes an auxiliary pressure plate and a main pressure plate. The pressure plate driving assembly 19 is connected to the main pressure plate to drive the main pressure plate and the auxiliary pressure plate to move downward to press the soft circuit board. The auxiliary pressure plate is detachably embedded in the center hole of the main pressure plate. The main pressure plate is provided with multiple positioning grooves, each positioning groove is respectively provided with a detachable splicing block, each splicing block is respectively provided with a through hole, and the auxiliary pressure plate presses the splicing block from the top.

[0061] Preferably, the positioning groove is a step groove, a through hole is arranged on the top of the splicing block, and the top of the splicing block has a connecting edge, which is supported on the step of the step groove.

[0062] Preferably, there are at least two pressing plate driving assemblies 19 , which are distributed at at least two ends of the pressing plate assembly 17 .

[0063] Preferably, matching positioning columns and positioning holes are provided between the pressing plate assembly 17 and the fixture 18 to achieve rapid positioning.

[0064] According to the welding table in this embodiment, the linear moving platform 15 drives the jig 18 to move quickly to the specified position to wait for welding, the clamping mechanism presses the cover plate down to clamp the flexible circuit board, and the protective atmosphere mechanism 16 inserts the nozzle into the jig 18 to inject the protective atmosphere. After the welding is completed, the linear moving platform 15 drives the jig 18 to move quickly to the next workstation, thereby realizing the automated operations of loading, clamping, moving, etc., with better operation accuracy and higher production efficiency.

[0065] In this embodiment, the plurality of loading and unloading platforms include a first loading and unloading platform K2, a second loading and unloading platform K3, and a third loading and unloading platform K4, and the plurality of grabbing and transporting mechanisms include a first grabbing and transporting mechanism, a second grabbing and transporting mechanism, and a third grabbing and transporting mechanism. Among them, the first grabbing and transporting mechanism is used to transport the substrates, tongues, and carrier plates automatically unloaded from multiple groups of automatic loading and unloading mechanisms to the first loading and unloading platform, and to transport the soldered soft circuit boards from the first loading and unloading platform to one or more groups of automatic loading and unloading mechanisms for automatic storage. The second grabbing and transporting mechanism is used to transport the soft circuits and cover plates automatically unloaded from one or more groups of automatic loading and unloading mechanisms to the second loading and unloading platform. The third grabbing and transporting mechanism is used to grab the cover plates from the jig of the third loading and unloading platform and transport them to one or more groups of automatic loading and unloading mechanisms.

[0066] Exemplarily, there are two jig transfer mechanisms, one jig transfer mechanism is used to transfer jigs between the third loading and unloading station and the first loading and unloading station, and one jig transfer mechanism is used to transfer jigs between the first loading and unloading station and the second loading and unloading station.

[0067] Among the multiple groups of automatic loading and unloading mechanisms, at least one group of automatic loading and unloading mechanisms is used to receive and store the soft circuit boards that have completed welding, at least one group of automatic loading and unloading mechanisms is used to load and unload the substrate, at least one group of automatic loading and unloading mechanisms is used to load and unload the combination of the tongue and the carrier plate, and at least one group of automatic loading and unloading mechanisms is used to load and unload the soft circuit.

[0068] In a specific embodiment, the automatic loading and unloading mechanism includes a workbench, a pallet storage mechanism, a pallet recovery mechanism and a pallet conveying mechanism. The pallet storage mechanism 180 includes a first frame 1810, a first group of pallet support mechanisms 1820 and an automatic pallet taking mechanism 1830. Exemplarily, the first frame 1810 is a frame structure, and the frame structure includes side walls, a bottom wall, a top wall, etc. The first group of pallet support mechanisms 1820 are arranged on the first frame 1810 to support a pallet stack formed by pallets stacked up and down, and the automatic pallet taking mechanism 1830 is used to automatically take out the pallet 110 at the bottom of the pallet stack.

[0069] Specifically, there are multiple pallet support mechanisms in the first group of pallet support mechanisms 1820, which are distributed at different positions on the upper side of the first frame 1810, and the first group of pallet support mechanisms 1820 are located on the side of the pallet stack to support the pallet 110 from different directions and thereby support the pallet stack overhead on the first frame 1810.

[0070] In this embodiment, the number of automatic pallet taking mechanisms 1830 is at least two, one of which is installed on the left side of the first frame 1810 and is located below the pallet stack, and the other is installed on the right side of the first frame 1810 and is located below the pallet stack. The pallet conveying mechanism 190 is configured to be able to move between the two automatic pallet taking mechanisms 1830 on the left and right sides to take out the pallet.

[0071] Specifically, there is a gap formed by a convex strip or a groove between adjacent trays in the tray stack of the tray storage mechanism 180. Accordingly, the first group of tray support mechanisms 1820 includes a first horizontal driving mechanism 18210 and an insert plate 18220. The first horizontal driving mechanism 18210 is connected to the insert plate 18220 to drive the insert plate 18220 to horizontally insert the gap and then support the tray above the insert plate 18220. The first horizontal driving mechanism 18210 includes a cylinder, an electric cylinder or a linear motor. As an exemplary mounting structure, a base plate 18230 is provided on the top wall, the first horizontal driving mechanism 18210 is mounted on the base plate 18230, and the insert plate 18220 is mounted on the movable end of the first horizontal driving mechanism 18210.

[0072] The two automatic pallet picking mechanisms 1830 on the left and right sides have the same structure. One of the automatic pallet picking mechanisms 1830 includes a first lifting support mechanism and a second lifting support mechanism installed on the side wall of one side of the first frame 1810. The first lifting support mechanism is located on the outer side of the second lifting support mechanism and is used for the two to alternately lift and lower to support the pallet 110 at the bottom of the pallet stack.

[0073] Specifically, the automatic tray-taking mechanism 1830 further includes a base 18310, which is fixed on a side wall of the first frame 1810, a first lifting support mechanism including a first lifting mechanism 18320, a first connecting arm 18340 and a first support plate 18360 connected in sequence, and a second lifting support mechanism including a second lifting mechanism 18330, a second connecting arm 18350 and a second support plate 18370 connected in sequence, the first lifting mechanism 18320 is mounted on the front side surface of the base 18310, and the second lifting support mechanism is mounted on the rear side surface of the base 18310, one of the first connecting arm 18340 and the second connecting arm 18350 is closer to the side wall of the first frame 1810 relative to the other, so that one of the first support plate 18360 and the second support plate 18370 is closer to the side wall of the first frame 1810 relative to the other. Among them, the components of the first lifting mechanism 18320 and the second lifting mechanism 18330 include a cylinder, an electric cylinder or a linear motor.

[0074] In this embodiment, the pallet recovery mechanism 170 includes a second frame 1710, a second group of pallet support mechanisms 1720 and an automatic pallet recovery mechanism 1730. The second group of pallet support mechanisms 1720 are arranged on the second frame 1710 to support a pallet stack formed by pallets stacked up and down, and the automatic pallet recovery mechanism 1730 is used to automatically stack the pallet 110 to the bottom of the pallet stack.

[0075] Specifically, the second group of pallet support mechanisms 1720 includes multiple pallet support mechanisms distributed at different positions on the upper side of the second frame 1710, and the second group of pallet support mechanisms 1720 are located on the side of the pallet stack to support the pallets from different directions and thereby support the pallet stack overhead on the second frame 1710.

[0076] Among them, the number of automatic pallet recovery mechanisms 1730 is at least two, one of which is installed on the left side of the second frame 1710 and is located below the pallet stack, and the other automatic pallet recovery mechanism 1730 is installed on the right side of the second frame 1710 and is located below the pallet stack, and the pallet conveying mechanism 190 is configured to be able to move between the two automatic pallet recovery mechanisms 1730 on the left and right sides to transfer the pallet to the two automatic pallet recovery mechanisms 1730 on the left and right sides.

[0077] Specifically, the two automatic tray recovery mechanisms 1730 on the left and right sides have the same structure, one of the automatic tray recovery mechanisms 1730 includes a base and a third lifting support mechanism 170, the base is fixed to a side wall of the second frame 1710, the third lifting support mechanism 170 includes a third lifting mechanism 17320, a third connecting arm 17330 and a third support plate 17340 connected in sequence, the third lifting mechanism 17320 is installed on the base, and the support plate is used to receive the tray and stack it upwards. Among them, the third lifting mechanism 17320 includes a cylinder, an electric cylinder or a linear motor.

[0078] Specifically, the components and structures of each tray support mechanism in the second group of tray support mechanisms 1720 are the same, and the components and structures of one tray support mechanism include a connecting frame 17210, a rotating support block 17220, a reset spring 17240 and a stopper 17230, the connecting frame 17210 is fixed on the second frame 1710, the rotating support block 17220 is rotatably mounted on the connecting frame 17210, the top of one end of the rotating support block 17220 is used to support the tray, and the stopper 17230 is arranged on the connecting frame 17210 and stops the top of the other end of the rotating support block 17220 from above.

[0079] Specifically, one end of the return spring 17240 is arranged on the connecting frame 17210, and the other end is connected to the rotating support block 17220, which is used to contact the rotating support block 17220 and rotate to make way for the tray to pass through when the tray moves upward. After the tray passes, the return spring 17240 pushes the rotating support block 17220 to reset.

[0080] Specifically, at least one scale 200 is disposed on the first frame 1810 for marking the height of the pallet stack.

[0081] Specifically, at least one scale 200 is disposed on the second frame 1710 for marking the height of the pallet stack.

[0082] In this embodiment, the pallet conveying mechanism 190 is arranged between the workbench 160, the pallet storage mechanism 180 and the pallet recovery mechanism 170, and is used to convey the pallet taken out by the automatic pallet taking mechanism 1830 to the workbench 160 or convey the pallet on the workbench 160 to the automatic pallet recovery mechanism 1730.

[0083] Specifically, the pallet conveying mechanism 190 includes a first-level mobile platform 1910, a second-level mobile platform 1920 and a load-bearing platform 1930. The first-level mobile platform 1910 extends between the workbench 160, the first frame 1810 and the second frame 1710, and the moving direction is configured as a horizontal direction. The second-level mobile platform 1920 is installed on the first-level mobile platform 1910, and the moving direction is configured as a vertical direction. The load-bearing platform 1930 is installed on the second-level mobile platform 1920 for carrying pallets.

[0084] Therefore, compared with the manual handling in the prior art, the pallets are automatically taken from the pallet storage mechanism 180 and placed on the workbench 160, and the pallets on the workbench 160 are automatically taken away and stacked on the pallet recovery mechanism 170, thereby realizing automatic loading and unloading of pallets on the workbench 160, which has a higher degree of automation, higher productivity, and reduces the workload of the operator. Compared with the handling robot in the prior art, the time of each handling process can be significantly reduced, the productivity and stability of the system operation are improved, and the difficulty of operation is reduced. Moreover, there is no need to reserve space for the movement of the robot, and the system is more compact.

[0085] In a specific embodiment, the jig transfer mechanism includes a first-level mobile platform, a second-level mobile platform and a carrying platform. The moving direction of the first-level mobile platform is configured to be horizontal, the second-level mobile platform is installed on the first-level mobile platform, and the moving direction is configured to be vertical, and the carrying platform is installed on the second-level mobile platform for carrying the jig.

[0086] In a specific embodiment, the first grabbing and handling mechanism and the second grabbing and handling mechanism are three-axis grabbing and handling mechanisms. This embodiment provides a three-axis grabbing and handling mechanism, including: a support frame 013, a first-level linear moving platform 01, a second-level linear moving platform 02, a third-level linear moving platform 03, a first adsorption device 04, a lifting device 08 and a second adsorption device 05.

[0087] The first-stage linear moving platform 01 is installed on the support frame 013 , and its moving direction is horizontal.

[0088] The second-stage linear moving platform 02 is installed on the first-stage linear moving platform 01 , and the moving direction of the second-stage linear moving platform 02 is horizontal and perpendicular to the moving direction of the first-stage linear moving platform 01 .

[0089] Among them, the third-level linear moving platform 03 is installed on the second-level linear moving platform 02, and the moving direction of the third-level linear moving platform 03 is the vertical direction.

[0090] Among them, the first-level linear moving platform 01, the second-level linear moving platform 02, and the third-level linear moving platform 03 are all driven by a linear drive mechanism, such as an electric cylinder, a screw mechanism, a linear motor, etc.

[0091] Therefore, the three-axis grabbing and handling mechanism has a three-level linear moving platform, which can provide three-dimensional movement of X-axis, Y-axis and Z-axis, making it easy to pick up and place materials in three-dimensional space. Moreover, since the moving platform moves in a linear manner, the moving structure is more reliable and less difficult to control.

[0092] In this embodiment, the first adsorption device 04 is installed on the third-level linear moving platform 03, the lifting device 08 is installed on the third-level linear moving platform 03, and the second adsorption device 05 is installed on the lifting device 08, so that the second adsorption device 05 can move up and down relative to the first adsorption device 04. Among them, the lifting device 08 can be a cylinder. Therefore, the same three-axis grabbing and handling mechanism has two sets of adsorption devices, which can be respectively applied to different operating actions. The second adsorption device 05 can move up and down relative to the first adsorption device 04, and can adapt to the adsorption of various workpieces on different height surfaces.

[0093] As a specific first adsorption device 04, the first adsorption device 04 includes a first air circuit plate 041, a second air circuit plate 042 and at least one elastic suction cup 043, the first air circuit plate 041 is arranged on the rear surface of the second air circuit plate 042, the elastic suction cup 043 is arranged on the front surface of the second air circuit plate 042, a plurality of suction holes 045 are arranged on the elastic suction cup 043, a plurality of ventilation holes are arranged on the second air circuit plate 042, and the ventilation holes are connected to the suction holes 045 one by one, an air groove is arranged on the rear surface of the second air circuit plate 042, the ventilation hole corresponding to each elastic suction cup 043 is arranged in the air groove, and an air circuit for connecting the air groove is arranged on the first air circuit plate 041.

[0094] As a specific second adsorption device 05, the second adsorption device 05 includes a third air circuit plate 051, a fourth air circuit plate 052 and at least one elastic suction cup 053, the third air circuit plate 051 is arranged on the rear surface of the fourth air circuit plate 052, the elastic suction cup 053 is arranged on the front surface of the fourth air circuit plate 052, a plurality of suction holes 055 are arranged on the elastic suction cup 053, a plurality of ventilation holes 057 are arranged on the fourth air circuit plate 052, and the ventilation holes 057 are connected with the suction holes 055 in a one-to-one correspondence, an air groove 056 is arranged on the rear surface of the fourth air circuit plate 052, the ventilation hole 057 corresponding to each elastic suction cup 053 is arranged in the air groove 056, and an air path for connecting the air groove 056 is arranged on the third air circuit plate 051.

[0095] In this embodiment, the lowest working surface of the second adsorption device 05 is lower than the lowest working surface of the first adsorption device 04 .

[0096] Preferably, in the first adsorption device 04 , there are multiple elastic suction cups 043 , and the multiple elastic suction cups 043 are arranged at intervals along a straight line direction on the front surface of the second air path plate 042 .

[0097] Preferably, in the second adsorption device 05 , there are multiple elastic suction cups 053 , and the multiple elastic suction cups 53 are arranged at intervals along a straight line direction on the front surface of the fourth air path plate 052 .

[0098] Based on the above design, since each elastic suction cup is provided with a plurality of suction holes, when performing the adsorption operation, a plurality of adsorption points are formed between each elastic suction cup and the corresponding workpiece, thereby realizing the precise adsorption of small workpieces such as small electronic devices. Moreover, since each elastic suction cup is provided with a plurality of suction holes, for multiple electronic devices that are staggered and stacked together, each electronic device can have a corresponding suction hole, thereby realizing the ability of the same elastic suction cup to adsorb multiple electronic devices at the same time.

[0099] Furthermore, each adsorption device has a plurality of elastic suction cups, which enables batch adsorption of small electronic components and can significantly improve operational efficiency.

[0100] Preferably, a linear guide rail (not shown in the figure) is provided between the first adsorption device 04 and the third-stage linear movable platform 03, and the first adsorption device 04 is movably mounted on the third-stage linear movable platform 03 via the linear guide rail.

[0101] Preferably, a buffer spring 06 is provided between the first adsorption device 04 and the third-stage linear motion platform 03 .

[0102] Preferably, a linear guide rail (not shown in the figure) is provided between the second adsorption device 05 and the lifting device 08, and the second adsorption device 05 is movably mounted on the lifting device 08 via the linear guide rail.

[0103] Preferably, a buffer spring 07 is provided between the second adsorption device 05 and the lifting device 08 .

[0104] Based on the above design, the process of contacting electronic devices has a buffering capability, which can prevent fragile workpieces from being damaged.

[0105] In this embodiment, the working principle of the three-axis grasping and transporting mechanism includes: 1. The first adsorption device 04 absorbs the first workpiece 010 from the fixture and places it in a special tray; 2. The first adsorption device 04 then absorbs the second workpiece 011 from another tray and places it in the fixture; 3. The lifting device 08 drives the second adsorption device 05 to move downward, the working surface of the second adsorption device 05 is lower than the first adsorption device 04, and the second adsorption device 05 absorbs the third workpiece 012 from the tray and places it in the fixture.

[0106] In a specific embodiment, the third grabbing and handling mechanism is a two-axis grabbing and handling mechanism, including a support frame, a first-level linear moving platform, a second-level linear moving platform and an adsorption mechanism. The first-level linear moving platform is mounted on the support frame and moves in a horizontal direction, the second-level linear moving platform is mounted on the first-level linear moving platform, and the second-level linear moving platform moves in a vertical direction, and the adsorption mechanism is mounted on the second-level linear moving platform.

[0107] In a specific embodiment, the welding mechanism includes a laser welding mechanism.

[0108] Those skilled in the art will appreciate that the accompanying drawings are only schematic diagrams of a preferred implementation scenario, and the modules or processes in the accompanying drawings are not necessarily necessary for the implementation of the present invention. Those skilled in the art will appreciate that the modules in the devices in the implementation scenario can be distributed in the devices of the implementation scenario according to the description of the implementation scenario, or can be changed accordingly and located in one or more devices different from the present implementation scenario. The modules of the above-mentioned implementation scenarios can be combined into one module, or can be further split into multiple sub-modules. The above-mentioned serial numbers of the present invention are for description only and do not represent the pros and cons of the implementation scenarios.

[0109] Disclosed above are only several specific implementation scenarios of the present invention, but the present invention is not limited thereto, and any changes that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. An automatic soldering system for a flexible circuit board, used for automatic soldering of a flexible circuit board including a flexible circuit, a substrate, a tongue and a carrier plate, characterized in that: include: A welding station, a welding mechanism and a plurality of loading and unloading stations, wherein the plurality of loading and unloading stations and the welding station are configured to receive and position a jig, the jig is configured to position the whole or partial components of a plurality of flexible circuit boards, and the welding mechanism is arranged above the welding station to weld the flexible circuit boards on the jig; Multiple groups of automatic loading and unloading mechanisms are configured to automatically store, load and unload subcomponents of each flexible circuit board and the flexible circuit board that has been welded; among the multiple groups of automatic loading and unloading mechanisms, at least one group of the automatic loading and unloading mechanisms is used to receive and store the flexible circuit board that has been welded, at least one group of the automatic loading and unloading mechanisms is used to load and unload the substrate, at least one group of the automatic loading and unloading mechanisms is used to load and unload the combination of the tongue piece and the carrier plate, and at least one group of the automatic loading and unloading mechanisms is used to load and unload the flexible circuit; A plurality of jig transfer mechanisms are configured to transfer jigs between the loading and unloading platform and the welding platform; the jig transfer mechanism comprises a first-level mobile platform, a second-level mobile platform and a bearing platform, the first-level mobile platform is configured to move in a horizontal direction, the second-level mobile platform is mounted on the first-level mobile platform, and the moving direction is configured in a vertical direction, and the bearing platform is mounted on the second-level mobile platform for carrying jigs; A plurality of grabbing and transporting mechanisms are configured to grab and transport materials between the loading and unloading platform, the welding platform and the automatic loading and unloading mechanism.

2. The automatic soldering system for flexible circuit boards according to claim 1, characterized in that: The welding station comprises a first linear movable platform, a protective atmosphere mechanism and a pressing plate mechanism, and a bracket assembly for supporting the jig is arranged on the first linear movable platform; The protective atmosphere mechanism comprises a nozzle body, a protective atmosphere delivery pipeline, and a nozzle pushing mechanism, wherein the nozzle pushing mechanism is mounted on the bracket assembly, the protective atmosphere delivery pipeline is connected to the nozzle body, and the nozzle body is mounted on the nozzle pushing mechanism, so as to be inserted into the fixture and injected with the protective atmosphere under the drive of the nozzle pushing mechanism; The pressing plate mechanism includes a pressing plate assembly and a pressing plate driving assembly. The pressing plate driving assembly is connected to the pressing plate assembly to drive the pressing plate assembly to move downward to press the flexible circuit board. The pressing plate assembly is provided with through holes corresponding to the welding points of the flexible circuit board.

3. The automatic soldering system for flexible circuit boards according to claim 1, characterized in that: The plurality of loading and unloading platforms include a first loading and unloading platform, a second loading and unloading platform, and a third loading and unloading platform; the plurality of grabbing and transporting mechanisms include a first grabbing and transporting mechanism, a second grabbing and transporting mechanism, and a third grabbing and transporting mechanism; The first grabbing and transporting mechanism is used to transport the substrates, tongues and carrier plates automatically unloaded from multiple groups of the automatic loading and unloading mechanisms to the first loading and unloading platform, and to transport the soldered flexible circuit boards from the first loading and unloading platform to one or more groups of the automatic loading and unloading mechanisms for automatic storage; The second grabbing and transporting mechanism is used to transport the soft circuits and cover plates automatically unloaded from one or more groups of the automatic loading and unloading mechanisms to the second loading and unloading platform; The third grabbing and transporting mechanism is used to grab the cover plate from the fixture of the third loading and unloading platform and transport it to one or more sets of the automatic loading and unloading mechanisms; One of the jig transfer mechanisms is used to transfer jigs between the third loading and unloading platform and the first loading and unloading platform, and one of the jig transfer mechanisms is used to transfer jigs between the first loading and unloading platform and the second loading and unloading platform.

4. The automatic soldering system for flexible circuit boards according to claim 1, characterized in that: The automatic loading and unloading mechanism comprises a workbench, a pallet storage mechanism, a pallet recovery mechanism and a pallet conveying mechanism, the pallet storage mechanism comprises a first frame, a first group of pallet support mechanisms and an automatic pallet taking mechanism, the first group of pallet support mechanisms being arranged on the first frame for supporting a pallet stack formed by pallets stacked up and down, and the automatic pallet taking mechanism being used for automatically taking out the pallet at the bottom of the pallet stack; The pallet recovery mechanism comprises a second frame, a second group of pallet support mechanisms and an automatic pallet recovery mechanism, wherein the second group of pallet support mechanisms is arranged on the second frame for supporting a pallet stack formed by pallets stacked up and down, and the automatic pallet recovery mechanism is used to automatically stack the pallets to the bottom of the pallet stack; The tray conveying mechanism is arranged between the workbench, the tray storage mechanism and the tray recovery mechanism, and is used to convey the tray taken out by the automatic tray taking mechanism to the workbench or convey the tray on the workbench to the automatic tray recovery mechanism.

5. The automatic soldering system for flexible circuit boards according to claim 3, characterized in that: The first grabbing and transporting mechanism and the second grabbing and transporting mechanism are three-axis grabbing and transporting mechanisms, including a support frame, a first-level linear moving platform, a second-level linear moving platform, a third-level linear moving platform and an adsorption mechanism; The first-level linear moving platform is installed on the support frame, and its moving direction is horizontal. The second-level linear moving platform is installed on the first-level linear moving platform, and its moving direction is horizontal and perpendicular to the moving direction of the first-level linear moving platform. The third-level linear moving platform is installed on the second-level linear moving platform, and its moving direction is vertical. The adsorption mechanism is installed on the third-level linear moving platform.

6. The automatic soldering system for flexible circuit boards according to claim 5, characterized in that: The adsorption mechanism includes a first adsorption device, a lifting device and a second adsorption device. The first adsorption device is installed on the third-level linear moving platform, the lifting device is installed on the third-level linear moving platform, and the second adsorption device is installed on the lifting device, so that the second adsorption device can move up and down relative to the first adsorption device.

7. The automatic soldering system for flexible circuit boards according to claim 3, characterized in that: The third grabbing and transporting mechanism is a two-axis grabbing and transporting mechanism, including a support frame, a first-stage linear moving platform, a second-stage linear moving platform and an adsorption mechanism; The first-level linear moving platform is installed on the support frame, and its moving direction is horizontal. The second-level linear moving platform is installed on the first-level linear moving platform, and its moving direction is vertical. The adsorption mechanism is installed on the second-level linear moving platform.

8. The automatic soldering system for flexible circuit boards according to claim 1, characterized in that: The welding mechanism comprises a laser welding mechanism.

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