Cleaning device and method

Abstract

The present disclosure provides a cleaning device and method for removing residues on a chip stacking structure. The cleaning device comprises: a carrier for placing the chip stacking structure, and a two-fluid nozzle that can be moved relative to the carrier to align with the gap between two adjacent chips, wherein the two-fluid nozzle is used to apply a gas-liquid mixed fluid containing a chemical liquid and a gas to the chip stacking structure. The chemical liquid of the gas-liquid mixed fluid separates the residues in the gap from the surface to which it is attached, and the impact force exerted by the gas of the gas-liquid mixed fluid removes the residues from the gap.

Description

Technical Field

[0001] The present disclosure relates to a cleaning device and method, and more particularly to a cleaning device and method for removing residues on a chip stacking structure. Background Art

[0002] The general 3D integrated circuit packaging process includes four major steps: via formation, via filling, wafer thinning, and wafer bonding. Wafer cleaning must be performed before and after each step to avoid wafer contamination during processing. In other words, the wafer bonding steps can be roughly divided into three types: chip to wafer (C2W), chip to chip (C2C), and wafer to wafer (W2W). However, the gap formed by the bonding of wafer to wafer or wafer to chip is usually 20 to 50μm, so how to remove the residue in such a small gap is a technical bottleneck that urgently needs to be overcome.

[0003] Taiwan Patent Case No. TW I539515 has disclosed a chip stacking structure cleaning method and cleaning equipment, which can clean the flux or other impurities in the tiny gap between the wafer and the chip. However, in the patent case, a roller-type or brush-type sliding structure is set at the bottom of the liquid pumping device, so that the liquid pumping device slides on the substrate through the sliding structure to move to a position to be cleaned. In other words, the liquid pumping device will exert downward pressure on the chip stacking structure, which is easy to cause damage or breakage of the chip.

[0004] In view of this, it is necessary to propose a cleaning device and method to solve the problems existing in the prior art. Summary of the invention

[0005] In order to solve the above-mentioned problems of the prior art, the purpose of the present disclosure is to provide a cleaning device and method, wherein the cleaning device cleans the chip stacking structure in a non-contact manner, thereby avoiding the problem of applying downward pressure to the chip stacking structure to cause chip damage.

[0006] To achieve the above-mentioned purpose, the present disclosure provides a cleaning device for removing residues on a chip stacking structure, wherein the chip stacking structure includes a substrate and a plurality of chips, wherein the chips are separated from the substrate by a gap, and the residues are located in the gap between the chips and the substrate, wherein the cleaning device includes: a carrier for placing the chip stacking structure; a liquid supply device for providing a chemical liquid; a gas supply device for providing a gas; and a two-fluid nozzle that can be moved relative to the carrier to be aligned with the gap between two adjacent chips, wherein the two-fluid nozzle is connected to the liquid supply device and the gas supply device, and is used to apply a gas-liquid mixed fluid containing the chemical liquid and the gas to the substrate of the chip stacking structure, so that the gas-liquid mixed fluid flows into the gap along the first side of the gap, wherein the chemical liquid of the gas-liquid mixed fluid separates the residues in the gap from the surface to which they are attached, and the impact force applied by the gas of the gas-liquid mixed fluid brings the residues out through the second side of the gap.

[0007] In one of the preferred embodiments of the present disclosure, the cleaning device further comprises: a precision driving device for controlling the two-fluid nozzle to move along a vertical direction and a horizontal direction relative to the supporting platform.

[0008] In one preferred embodiment of the present disclosure, the precision driving device includes a vertical lifting mechanism for controlling the movement of the two-fluid nozzle along the vertical direction relative to the supporting platform, and the vertical lifting mechanism includes a stepping motor.

[0009] In one preferred embodiment of the present disclosure, the precision driving device includes a horizontal moving mechanism for controlling the two-fluid nozzle to move along the horizontal direction relative to the supporting platform, and the horizontal moving mechanism includes an XY axis coordinate working table (XY Table).

[0010] In one preferred embodiment of the present disclosure, the cleaning device further comprises a cavity, wherein the supporting platform and the two-fluid nozzle are disposed in the cavity, and a gas extraction port is provided at the bottom of the cavity.

[0011] In one of the preferred embodiments of the present disclosure, the cleaning device further comprises a gas-liquid separation device, wherein the gas-liquid separation device is connected to the gas suction port of the cavity, and is used for performing gas-liquid separation on the gas-liquid mixed fluid extracted through the gas suction port.

[0012] In one preferred embodiment of the present disclosure, the gas supply device includes a heater for heating the gas in the gas supply device to a temperature close to that of the chemical liquid.

[0013] In one preferred embodiment of the present disclosure, the gas supply device includes a humidifier for increasing the humidity of the gas in the gas supply device.

[0014] In one preferred embodiment of the present disclosure, the carrier includes another heater for heating the chip stack structure on the carrier to maintain it at a process temperature.

[0015] In one preferred embodiment of the present disclosure, the cleaning device comprises a plurality of two-fluid nozzles aligned in a row and arranged in parallel, and the plurality of two-fluid nozzles can be moved relative to the carrier to be aligned with the interval between two adjacent rows of chips.

[0016] In one preferred embodiment of the present disclosure, the front end of the two-fluid nozzle of the cleaning device is configured to be inclined at an angle relative to the surface of the cleaning chip stacking structure.

[0017] In one preferred embodiment of the present disclosure, the two-fluid nozzle comprises a high-pressure cleaning nozzle.

[0018] The present disclosure also provides a cleaning method, which is performed by a cleaning device, wherein the cleaning device includes a carrier, a liquid supply device, a gas supply device, a two-fluid nozzle, and a precision drive device, and the cleaning method is used to remove residues on a chip stacking structure, wherein the chip stacking structure includes a substrate and a plurality of chips, wherein the chip and the substrate are separated by a gap, and the residue is located in the gap between the chip and the substrate, wherein the cleaning method includes: placing the chip stacking structure on the carrier; controlling the precision drive device to move the two-fluid nozzle to align with the gap between two adjacent chips; the liquid supply device provides a chemical liquid to the two-fluid nozzle, and the gas supply device provides a gas to the two-fluid nozzle; applying a gas-liquid mixed fluid containing the chemical liquid and the gas to the substrate of the chip stacking structure, so that the gas-liquid mixed fluid flows into the gap along the first side of the gap, wherein the chemical liquid of the gas-liquid mixed fluid separates the residue in the gap from the surface to which it is attached, and the impact force applied by the gas of the gas-liquid mixed fluid brings the residue out through the second side of the gap.

[0019] In one of the preferred embodiments of the present disclosure, after placing the chip stacking structure on the carrier platform, it also includes: controlling the two-fluid nozzle to move horizontally above the carrier platform by a horizontal moving mechanism of the precision driving device, and controlling the two-fluid nozzle to move along a vertical direction relative to the carrier platform by a vertical lifting mechanism of the precision driving device to align the two-fluid nozzle with the first side of the gap.

[0020] In one preferred embodiment of the present disclosure, the horizontal moving mechanism includes an XY axis coordinate work table (X-YTable).

[0021] In one of the preferred embodiments of the present disclosure, the cleaning device further includes a cavity and a gas-liquid separation device, and a gas suction port is provided at the bottom of the cavity, the gas-liquid separation device is connected to the gas suction port of the cavity, and the cleaning method further includes: performing gas-liquid separation on the gas-liquid mixed fluid extracted through the gas suction port by the gas-liquid separation device.

[0022] In one of the preferred embodiments of the present disclosure, the gas supply device of the cleaning device also includes a heater, and before the gas supply device provides a gas to the two-fluid nozzle, the cleaning method further includes: heating the gas in the gas supply device to a temperature close to that of the chemical liquid by the heater.

[0023] In one of the preferred embodiments of the present disclosure, the gas supply device of the cleaning device further includes a humidifier, and before the gas supply device provides a gas to the two-fluid nozzle, the cleaning method further includes: increasing the humidity of the gas in the gas supply device by the humidifier.

[0024] In one preferred embodiment of the present disclosure, the carrier of the cleaning device further includes a heater, and the cleaning method further includes: heating the chip stacking structure on the carrier by the heater to maintain it at a process temperature.

[0025] In one of the preferred embodiments of the present disclosure, after the residue in the gap is removed by the gas-liquid mixed fluid, the cleaning method further includes: the liquid supply device provides a cleaning liquid to the two-fluid nozzle; and the two-fluid nozzle sprays the cleaning liquid on the chip stacking structure to remove the gas-liquid mixed fluid on the chip stacking structure.

[0026] In one of the preferred embodiments of the present disclosure, after removing the residue in the gap by the gas-liquid mixed fluid, the cleaning method further includes: spraying cleaning liquid on the back side of the substrate to remove the gas-liquid mixed fluid on the back side of the substrate.

[0027] In one preferred embodiment of the present disclosure, after removing the residue in the gap by the gas-liquid mixed fluid, the cleaning method further comprises: spraying a volatile solvent and a drying gas on the chip stacking structure to remove moisture from the surface of the chip stacking structure.

[0028] In one preferred embodiment of the present disclosure, after removing the residue in the gap by the gas-liquid mixed fluid, the cleaning method further includes: placing the chip stacking structure in an oven to remove moisture from the surface of the chip stacking structure.

[0029] Compared with the prior art, the present disclosure uses a two-fluid nozzle in a cleaning device to apply a gas-liquid mixed fluid to a chip stacking structure, and uses the gas-liquid mixed fluid to clean the residues in the gap of the chip stacking structure. During cleaning, the chemical liquid of the gas-liquid mixed fluid separates the residues in the gap from the surface to which it is attached, and the impact force exerted by the gas of the gas-liquid mixed fluid brings the residues out through the second side of the gap. With this design, the present disclosure can achieve non-contact cleaning of the chip stacking structure, thereby avoiding the problem of applying downward pressure to the chip stacking structure to cause chip damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram showing a cleaning device according to a first preferred embodiment of the present disclosure;

[0031] Figure 2 show Figure 1 A schematic diagram of a partial structure of a cleaning device;

[0032] Figure 3 A schematic diagram showing the moving mechanism of the cleaning device;

[0033] Figure 4 A schematic diagram showing a drying device used in the cleaning method disclosed herein;

[0034] Figure 5 A partial schematic diagram showing a cleaning device according to a second preferred embodiment of the present disclosure; and

[0035] Figure 6 A partial schematic diagram showing a cleaning device according to a third preferred embodiment of the present disclosure. DETAILED DESCRIPTION

[0036] In order to make the above and other purposes, features and advantages of the present disclosure more obvious and understandable, the preferred embodiments of the present disclosure will be specifically cited below and described in detail with reference to the accompanying drawings.

[0037] The chip of a microprocessor includes logic units and multiple cache memories. If the logic units and cache memories are configured in a two-dimensional (2-D) pattern, the physical size of the chip will limit the number of cache memories (due to poor process of large-area chips), thereby limiting the performance of the microprocessor. In order to solve the 2-D resource problem on the chip, three-dimensional (3-D) integrated circuits are currently being actively developed. Generally speaking, a typical 3D-IC process includes four major steps: via formation, via filling, wafer thinning, and wafer bonding. Wafer cleaning steps must be performed before and after each step to avoid contamination of the wafer during processing. Further, the wafer bonding steps can be roughly divided into three types: chip to wafer (C2W), chip to chip (C2C), and wafer to wafer (W2W). However, the gap formed by the bonding of wafers or wafers to chips is usually 20-50 μm. The cleaning device and cleaning method disclosed in the present invention can remove the residues in such a small gap.

[0038] Please refer to Figure 1 , which shows a schematic diagram of a cleaning device 1 of the first preferred embodiment of the present disclosure. The cleaning device 1 is used to remove residues R on a chip stacking structure 2, wherein the residues R may be substances left over from a previous process, such as flux, resin, adhesive, particles, organic matter, inorganic matter, etc. The chip stacking structure 2 is a three-dimensional integrated circuit board, which includes a substrate S and a plurality of chips C arranged in an array. A plurality of connectors B are provided between the chip C and the substrate S. The connector B may be a solder ball or any suitable element for soldering the substrate S and the chip C. The connector B is used to connect the substrate S and the chip C and separate the substrate S and the chip C by a gap G, wherein the substance to be removed by the cleaning device 1 is the residue R located in the gap G between the substrate S and the chip C.

[0039] like Figure 1 As shown, the cleaning device 1 mainly includes a cavity 100, a carrier 110, a liquid supply device 120, a gas supply device 130, a two-fluid nozzle 140, and a gas-liquid separation device 160, wherein the carrier 110 and the two-fluid nozzle 140 are arranged in the cavity 100. A gas extraction port 101 is provided at the bottom of the cavity 100, and the gas-liquid separation device 160 is connected to the gas extraction port 101 of the cavity 100. The carrier 110 is used to place the chip stacking structure 2. The carrier 110 includes a heater 111, which is used to heat the chip stacking structure 2 on the carrier 110 to maintain it at an appropriate process temperature.

[0040] Please refer to Figure 1 and Figure 2 ,in Figure 2 show Figure 1 Schematic diagram of the partial structure of the cleaning device 1. The liquid supply device 120 includes a liquid supply end 121 and a pipeline 122, wherein the liquid supply end 121 is filled with a chemical liquid 123. The gas supply device 130 includes a gas supply end 131 and a pipeline 132, wherein the gas supply end 131 is filled with a gas 133. Optionally, the gas 133 can be nitrogen, clean dry air (Clean Dry Air, CDA), etc. The two-fluid nozzle 140 is connected to the liquid supply device 120 and the gas supply device 130, and is used to mix the chemical liquid 123 provided by the liquid supply device 120 and the gas 133 provided by the gas supply device 130 to form a gas-liquid mixed fluid 150, and spray the gas-liquid mixed fluid 150 onto the substrate S of the chip stacking structure 2.

[0041] like Figure 2 As shown, the gas supply device 130 also includes a heater 134 and a humidifier 135. In order to remove the residue R on the chip stacking structure 2, the use of a chemical liquid 123 with a certain temperature can accelerate the reaction between the chemical liquid 123 and the residue R, so that the residue R is separated from the surface to which it is attached. However, when the gas 133 is mixed with the chemical liquid 123, the gas 133 will cause the temperature of the chemical liquid 123 to drop. Therefore, the present disclosure provides a heater 134 so that the gas 133 in the gas supply device 130 can be heated to a temperature close to that of the chemical liquid 123, thereby avoiding the problem of the temperature of the chemical liquid 123 dropping due to the influence of the low-temperature gas 133. In addition, the present disclosure increases the humidity of the gas 133 in the gas supply device 130 by providing a humidifier 135 to prevent the temperature of the chemical liquid 123 from changing due to the humidity of the gas 133.

[0042] Please refer to Figure 3 , which shows a schematic diagram of the moving mechanism of the cleaning device 1. The moving mechanism of the cleaning device 1 can be implemented by a precision driving device 170. The precision driving device 170 has a vertical lifting mechanism and a horizontal moving mechanism. The vertical lifting mechanism and the horizontal moving mechanism of the precision driving device 170 are respectively electrically connected to a main control device (such as a computer), and the actuation of the moving mechanism of the cleaning device 1 can be set by a control sequence in the main control device.

[0043] like Figure 3As shown, the precision drive device 170 is connected to the two-fluid nozzle 140. The vertical lifting mechanism has a connector connected to the two-fluid nozzle 140 and a precision drive element (such as a stepping motor) for controlling the two-fluid nozzle 140 to move in the vertical direction relative to the carrier 110 (i.e., the direction away from or close to the carrier 110). Through the setting of the precision drive element, the up and down movement position of the two-fluid nozzle 140 can be accurately controlled. Preferably, the precision drive device 170 can be equipped with a coordinate measurement mechanism to record the moving position and speed of the two-fluid nozzle 140 in the vertical direction. In addition, the horizontal movement mechanism is used to control the horizontal movement of the two-fluid nozzle 140. For example, the horizontal movement mechanism can use an XY axis coordinate worktable (XY Table) to accurately control the horizontal movement of the two-fluid nozzle 140, and then accurately align it to the cleaning position. In addition, the XY axis coordinate worktable can be equipped with a point recording device for recording the moving position of the two-fluid nozzle 140, so as to facilitate the rapid search for the positioning point of the two-fluid nozzle 140 required for the chip stacking structure 2 of the same pattern during mass production. It should be noted that, in order to cooperate with the above-mentioned precise point setting, the carrier 110 preferably uses vacuum adsorption to hold the chip stacking structure 2 thereon, thereby ensuring that the chip stacking structure 2 does not move relative to the carrier 110 during the cleaning process.

[0044] The purpose of the present disclosure is to provide a cleaning device and method, wherein the cleaning device 1 cleans the chip stack structure 2 in a non-contact manner, thereby avoiding the problem of applying downward pressure to the chip stack structure 2 to cause damage to the chip C. Some steps of the cleaning method disclosed in the present disclosure are performed by the cleaning device 1, wherein the specific steps of the cleaning method are described in detail below in conjunction with the above-mentioned cleaning device 1.

[0045] The cleaning method disclosed herein comprises the following steps. First, please refer to Figure 1 , a chip stacking structure 2 is placed on the carrier 110. The heater 111 on the carrier 110 is turned on to heat the chip stacking structure 2 on the carrier 110 to keep the chip stacking structure 2 at an appropriate process temperature. By maintaining the temperature, the chemical liquid 123 applied subsequently can be kept at an appropriate process temperature without being cooled, thereby accelerating the reaction between the chemical liquid 123 and the residue R to separate the residue R from the surface to which it is attached.

[0046] like Figure 1 and Figure 3 As shown, after the chip stacking structure 2 is placed, the two-fluid nozzle 140 is controlled by the precision drive device 170 to move above the carrier 110, so as to move the two-fluid nozzle 140 to align with the gap D between two adjacent chips C, and to align with the first side P1 of the gap G.

[0047] like Figure 1 and Figure 2 As shown, the humidity of the gas 133 in the gas supply device 130 is increased by the humidifier 135, and the gas 133 in the gas supply device 130 is heated to a temperature close to that of the chemical liquid 123 by the heater 134. Then, the gas supply device 130 and the liquid supply device 120 respectively transmit the gas 133 and the chemical liquid 123 to the two-fluid nozzle 140. The gas 133 and the chemical liquid 123 are mixed inside the two-fluid nozzle 140 to form a gas-liquid mixed fluid 150.

[0048] Then, if Figure 1 As shown, a gas-liquid mixed fluid 150 is applied to the substrate S of the chip stacking structure 2 through a two-fluid nozzle 140, so that the gas-liquid mixed fluid 150 flows into the gap G along the first side P1 of the gap G. The chemical liquid 123 of the gas-liquid mixed fluid 150 reacts with the residue R in the gap G to cause the residue R to separate from the surface to which it is attached, and the impact force exerted by the gas 133 of the gas-liquid mixed fluid 150 brings the residue R out through the second side P2 of the gap G. It should be noted that while the two-fluid nozzle 140 sprays the gas-liquid mixed fluid 150, the precision drive device 170 controls the two-fluid nozzle 140 to move in the horizontal direction. Preferably, the two-fluid nozzle 140 moves in parallel along the gap D between two adjacent chips C. However, in another embodiment, in order to simplify the process control sequence, the precision driving device 170 can be set to move the two-fluid nozzle 140 from the gap D between two adjacent chips C to the gap D between another two adjacent chips C when moving along the X direction. After the two-fluid nozzle 140 sprays the entire chip stacking structure 2 along the X direction, the carrier 110 is rotated 90 degrees. Then, when the precision driving device 170 sets the two-fluid nozzle 140 to move along the Y direction, the two-fluid nozzle 140 will correspond to the gap D between two adjacent chips C and move parallel to the direction in which the gap D extends. At this time, the spraying operation of the gas-liquid mixed fluid 150 will be performed synchronously, and the above-mentioned comprehensive spraying operation will be performed again, so as to ensure that the gap G of the chip stacking structure 2 will be cleaned.

[0049] In the present disclosure, the liquid supply device 120 can provide cleaning liquid, such as pure water, deionized water, etc., in addition to the chemical liquid 123. Moreover, after the residue R in the gap G is removed by the gas-liquid mixed fluid 150, the liquid supply device 120 can be switched to provide the cleaning liquid to the two-fluid nozzle 140, so that the two-fluid nozzle 140 sprays the cleaning liquid on the chip stacking structure 2 to remove the gas-liquid mixed fluid 150 on the chip stacking structure 2.

[0050] On the other hand, Figure 1As shown, when the two-fluid nozzle 140 sprays the gas-liquid mixed fluid 150 or the cleaning liquid on the chip stacking structure 2, the liquid and gas extracted through the extraction port 101 of the cavity 100 can be separated into gas and liquid by the gas-liquid separation device 160. Preferably, the gas-liquid separation device 160 is provided with a filter, which can first filter the extracted solid residue R, then separate the liquid and the gas, and finally introduce the liquid into the liquid recovery tank 161, and discharge the gas. Therefore, the liquid recovered after gas-liquid separation can be reused after appropriate treatment. In addition, a flow meter can be added to the liquid recovery tank 161 to record the liquid extraction flow value.

[0051] After the residues R in the gap G of the chip stacking structure 2 are removed, the chip stacking structure 2 is moved to a drying device to perform a final cleaning and drying step on the chip stacking structure 2. Figure 4 , which shows a schematic diagram of a drying device 3 used in the cleaning method disclosed herein. The drying device 3 includes a rotating clamping table 310, a first nozzle 320, and a two-fluid nozzle 330. The first nozzle 320 is connected to the liquid supply end, and the two-fluid nozzle 330 is connected to the volatile solvent supply end and the gas supply end. After the chip stacking structure 2 is moved into the drying device, the first nozzle 320 sprays a cleaning liquid on the back of the substrate S of the chip stacking structure 2 to remove the gas-liquid mixed fluid 150 remaining on the back of the substrate S, wherein the cleaning liquid can be pure water, deionized water, etc.

[0052] Next, after both the front and back sides of the chip stacking structure 2 are cleaned, a volatile solvent and a drying gas are simultaneously supplied to the chip stacking structure 2 through the two-fluid nozzle 330 to remove moisture from the surface of the chip stacking structure 2, wherein the volatile solvent may be isopropyl alcohol (IPA), and the drying gas may be nitrogen. Optionally, after both the front and back sides of the chip stacking structure 2 are cleaned, the chip stacking structure 2 may be placed in an oven to remove moisture from the surface of the chip stacking structure 2, but the present invention is not limited thereto.

[0053] Please refer to Figure 5 , which shows a partial schematic diagram of the cleaning device of the second preferred embodiment of the present disclosure. The cleaning device of the second preferred embodiment is substantially the same as the cleaning device 1 of the first preferred embodiment, except that the cleaning device of the second preferred embodiment is provided with a plurality of two-fluid nozzles 240, so that a plurality of gaps G between the chip C and the substrate S of the chip stacking structure 2 can be cleaned at one time. Specifically, the plurality of two-fluid nozzles 440 are aligned in a row and arranged in parallel, and the plurality of two-fluid nozzles 440 can be moved to align with the plurality of gaps G between two adjacent rows of chips C. With this design, the cleaning time of the chip stacking structure 2 can be effectively shortened to improve the cleaning efficiency.

[0054] Please refer to Figure 6 , which shows a partial schematic diagram of the cleaning device of the third preferred embodiment of the present disclosure. The cleaning device of the third preferred embodiment is substantially the same as the cleaning device 1 of the first preferred embodiment, except that, in the cleaning device of the third preferred embodiment, the front end of the two-fluid nozzle 540 is set to be inclined at an angle θ relative to the surface of the cleaning chip stacking structure 2. Preferably, the angle θ is 30 to 60 degrees. In addition, a precision driving device is used to control the two-fluid nozzle to move in a single direction and perform a spraying operation, so that the residue R can be moved in the same direction. For example, when the two-fluid nozzle 540 is tilted from the upper right to the lower left, and the precision driving device controls the two-fluid nozzle to move from the right to the left and performs a spraying operation, the residue R will be moved in the left direction. With this design, the residue R can be prevented from being washed back into the cleaned gap G.

[0055] In summary, the present disclosure applies a gas-liquid mixed fluid to the chip stacking structure by using a two-fluid nozzle in a cleaning device, and cleans the residues in the gap of the chip stacking structure by the gas-liquid mixed fluid. During cleaning, the chemical liquid of the gas-liquid mixed fluid separates the residues in the gap from the surface to which it is attached, and the impact force exerted by the gas of the gas-liquid mixed fluid brings the residues out through the second side of the gap. The present disclosure uses a two-fluid nozzle to apply a gas-liquid mixed fluid to the chip stacking structure, and a high-pressure cleaning (High Pressure Cleaner, HPC) nozzle can also be used to apply a high-pressure fluid to the chip stacking structure, and the residues in the gap of the chip stacking structure are cleaned by the high-pressure liquid. During cleaning, the high-pressure liquid separates the residues in the gap from the surface to which it is attached, and the impact force exerted by the high-pressure liquid brings the residues out through the second side of the gap. With this design, the present disclosure can achieve non-contact cleaning of the chip stacking structure, thereby avoiding the problem of chip damage caused by the cleaning nozzle directly applying downward pressure to the chip stacking structure.

[0056] The above are only preferred implementations of the present disclosure. It should be pointed out that technical personnel in the relevant field can make several improvements and modifications without departing from the principles of the present disclosure. These improvements and modifications should also be regarded as the protection scope of the present disclosure.

Claims

1. A cleaning device for removing residues on a chip stack structure, characterized in that: The chip stacking structure comprises a substrate and a plurality of chips, wherein the chips and the substrate are separated by a gap, and the residue is located in the gap between the chips and the substrate, wherein the cleaning device comprises: A carrier platform, used for placing the chip stacking structure; a liquid supply device for providing a chemical liquid; a gas supply device for providing a gas; and a two-fluid nozzle, moved relative to the carrier to be aligned with the gap between two adjacent chips, wherein the two-fluid nozzle is connected to the liquid supply device and the gas supply device, and is used to apply a gas-liquid mixed fluid containing the chemical liquid and the gas to the substrate of the chip stacking structure, so that the gas-liquid mixed fluid flows into the gap along a first side of the gap, wherein the chemical liquid of the gas-liquid mixed fluid separates the residue in the gap from the surface to which it is attached, and the impact force applied by the gas of the gas-liquid mixed fluid brings the residue out through the second side of the gap; wherein the gas supply device comprises a heater for heating the gas in the gas supply device to a temperature close to that of the chemical liquid; The gas supply device includes a humidifier for increasing the humidity of the gas in the gas supply device.

2. The cleaning device according to claim 1, characterized in that The cleaning device further comprises: a precision driving device for controlling the two-fluid nozzle to move along a vertical direction and a horizontal direction relative to the supporting platform.

3. The cleaning device according to claim 2, characterized in that The precision driving device includes a vertical lifting mechanism for controlling the two-fluid nozzle to move along the vertical direction relative to the supporting platform, and the vertical lifting mechanism includes a stepping motor.

4. The cleaning device according to claim 2, characterized in that The precision driving device includes a horizontal moving mechanism for controlling the two-fluid nozzle to move along the horizontal direction relative to the supporting platform, and the horizontal moving mechanism includes an XY axis coordinate working table (XY Table).

5. The cleaning device according to claim 1, characterized in that The cleaning device further comprises a cavity, wherein the supporting platform and the two-fluid nozzle are arranged in the cavity, and a gas extraction port is arranged at the bottom of the cavity.

6. The cleaning device according to claim 5, characterized in that The cleaning device further comprises a gas-liquid separation device, wherein the gas-liquid separation device is connected to the gas suction port of the cavity and is used for performing gas-liquid separation on the gas-liquid mixed fluid extracted through the gas suction port.

7. The cleaning device according to claim 1, characterized in that The carrier includes another heater for heating the chip stacking structure on the carrier to maintain it at a process temperature.

8. The cleaning device according to claim 1, characterized in that The cleaning device comprises a plurality of two-fluid nozzles which are aligned in a row and arranged in parallel, and the plurality of two-fluid nozzles are moved relative to the carrier to be aligned with the intervals between two adjacent rows of chips.

9. The cleaning device according to claim 1, characterized in that The front end of the two-fluid nozzle of the cleaning device is arranged to be inclined at an angle relative to the surface of the chip stacking structure.

10. The cleaning device according to claim 1, characterized in that The two-fluid nozzle comprises a high-pressure cleaning nozzle.

11. A cleaning method, performed by a cleaning device, the cleaning device comprising a carrier, a liquid supply device, an air supply device, a two-fluid nozzle, and a precision drive device, and the cleaning method is used to remove residues on a chip stacking structure, the chip stacking structure comprising a substrate and a plurality of chips, the chips and the substrate are separated by a gap, and the residues are located in the gap between the chips and the substrate, characterized in that: The cleaning method comprises: Placing the chip stacking structure on the carrier; Controlling the precision drive device to move the two-fluid nozzle to align with the interval between two adjacent chips; The liquid supply device provides a chemical liquid to the two-fluid nozzle, and the gas supply device provides a gas to the two-fluid nozzle; Applying a gas-liquid mixed fluid comprising the chemical liquid and the gas onto the substrate of the chip stacking structure, so that the gas-liquid mixed fluid flows into the gap along a first side of the gap, wherein the chemical liquid of the gas-liquid mixed fluid causes the residue in the gap to be separated from the surface to which it is attached, and the impact force applied by the gas of the gas-liquid mixed fluid causes the residue to be taken out through a second side of the gap; The gas supply device of the cleaning device further comprises a heater, and before the gas supply device provides a gas to the two-fluid nozzle, the cleaning method further comprises: heating the gas in the gas supply device to a temperature close to that of the chemical liquid by the heater; The gas supply device of the cleaning device further comprises a humidifier, and before the gas supply device provides a gas to the two-fluid nozzle, the cleaning method further comprises: increasing the humidity of the gas in the gas supply device by the humidifier.

12. The cleaning method according to claim 11, characterized in that After placing the chip stacking structure on the carrier platform, it also includes: controlling the two-fluid nozzle to move horizontally above the carrier platform through a horizontal moving mechanism of the precision driving device, and controlling the two-fluid nozzle to move along a vertical direction relative to the carrier platform through a vertical lifting mechanism of the precision driving device to align the two-fluid nozzle with the first side of the gap.

13. The cleaning method according to claim 12, characterized in that The horizontal moving mechanism includes an XY axis coordinate working table (XY Table).

14. The cleaning method according to claim 11, characterized in that The cleaning device also includes a cavity and a gas-liquid separation device, and a gas suction port is provided at the bottom of the cavity, the gas-liquid separation device is connected to the gas suction port of the cavity, and the cleaning method also includes: using the gas-liquid separation device to separate the gas-liquid mixed fluid extracted through the gas suction port.

15. The cleaning method according to claim 11, characterized in that The carrier of the cleaning device further includes a heater, and the cleaning method further includes: heating the chip stacking structure on the carrier by the heater to maintain it at a process temperature.

16. The cleaning method according to claim 11, characterized in that After removing the residue in the gap by the gas-liquid mixed fluid, the cleaning method further comprises: The liquid supply device provides a cleaning liquid to the two-fluid nozzle; and The two-fluid nozzle sprays the cleaning liquid onto the chip stacking structure to remove the gas-liquid mixed fluid on the chip stacking structure.

17. The cleaning method according to claim 11, characterized in that After the residue in the gap is removed by the gas-liquid mixed fluid, the cleaning method further includes: spraying a cleaning liquid on the back side of the substrate to remove the gas-liquid mixed fluid on the back side of the substrate.

18. The cleaning method according to claim 11, characterized in that After the residue in the gap is removed by the gas-liquid mixed fluid, the cleaning method further comprises: spraying a volatile solvent and a drying gas on the chip stacking structure to remove moisture on the surface of the chip stacking structure.

19. The cleaning method according to claim 11, characterized in that After the residue in the gap is removed by the gas-liquid mixed fluid, the cleaning method further includes: placing the chip stacking structure in an oven to remove moisture from the surface of the chip stacking structure.

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