Circuit Board, Periscope Camera Module and Its Application

Abstract

The present invention provides a circuit board, a periscope camera module and its application. The circuit board includes a flexible circuit board layer, a rigid circuit board layer, a chip connection part and a bending part. The chip connection part includes at least part of the flexible circuit board layer and at least part of the rigid circuit board layer overlapping the flexible circuit board layer. The bending part includes at least part of the flexible circuit board layer and at least part of the rigid circuit board layer overlapping the flexible circuit board layer. The bending part is flip-connectably connected to the chip connection part. When the bending part is flipped to the back side of the chip connection part, the flexible circuit board layer part of the bending part and the flexible circuit board layer part of the chip connection part are arranged face to face.

Description

Technical Field

[0001] The present invention relates to a periscope camera module, and particularly to a circuit board, a periscope camera module and its application. Background Art

[0002] The periscope camera module turns light through a light turning mechanism, so that while reducing the height dimension of the entire camera module, the entire periscope camera module can be designed with a relatively large effective focal length, thereby meeting the consumer's demand for a high zoom ratio.

[0003] However, currently, with the pursuit of thinner and lighter electronic devices, the installation space available for the periscope camera module in the electronic device is very limited. Especially for the periscope camera module, compared with its ordinary camera module, the height dimension of the periscope camera module is generally larger than that of the ordinary camera module, making it protrude significantly from the surface of the electronic device when installed in the electronic device. Therefore, how to reduce its size while ensuring the working quality of the periscope camera module is an issue that needs continuous attention.

[0004] The size of a circuit board of the periscope camera module has a great impact on the overall size of the periscope camera module, especially the height dimension, making the entire periscope camera module occupy too much space in the electronic device. The structure and installation method of the circuit board itself limit the reduction of its size.

[0005] Specifically, referring to Att Figure 1 and Att Figure 2 As shown, the current circuit board 10P of the periscope camera module 1000P is a type of T-shaped mechanism, mainly including a first bending part 11P, a second bending part 12P, a third bending part 13P and a connecting part 14P. Among them, the first bending part 11P is used for mounting a photosensitive chip 40P, the second bending part 12P is used for connecting a motor, the third bending part 13P is used for connecting an electronic device, and the connecting part 14P is simultaneously connected to the first bending part 11P, the second bending part 12P and the third bending part 13P. The first bending part 11P, the second bending part 12P, and the third bending part 13P can all be bent relative to the connecting part 14P, and both the first bending part 11P and the connecting part 14P are composed of three parts, a rigid part, a soft part, and another rigid part, where the soft part is located between the rigid parts, and the connecting part 14P is connected to the first bending part 11P, the second bending part 12P, and the third bending part 13P respectively through another soft part. Since the entire circuit board 10P is manufactured by a lamination process, the rigid parts need to be evenly arranged on both sides of the soft part for uniform stress consideration.

[0006] When the circuit board 10P is bent for assembly, the photosensitive chip 40P located at the first bent portion 11P is mounted at the corresponding position. Therefore, the other parts of the circuit board 10P need to be bent correspondingly along the soft part between the connecting portion 14P and the first bent portion 11P, and then along the soft part between the connecting portion 14P and the second bent portion 12P to bend the second bent portion 12P. Finally, in order to reduce the size of the circuit board 10P in the height direction, it is necessary to bend the soft part between the connecting portion 14P and the third bent portion 13P to bend the third bent portion 13P. During each bending process, on the one hand, it is necessary to avoid the hard part, and on the other hand, due to concerns about tearing the entire structure, a relatively large part of the bent soft part is still exposed, which is not conducive to reducing the size of the entire periscope camera module 1000P. Summary of the Invention

[0007] An object of the present invention is to provide a circuit board, a periscope camera module and its application, wherein the size of the periscope camera module can be reduced, especially the height size.

[0008] Another object of the present invention is to provide a circuit board, a periscope camera module and its application, wherein the size of a circuit board of the periscope camera module can be reduced.

[0009] Another object of the present invention is to provide a circuit board, a periscope camera module and its application, wherein the area size of the circuit board can be reduced.

[0010] Another object of the present invention is to provide a circuit board, a periscope camera module and its application, wherein the thickness size of the circuit board can be reduced.

[0011] Another object of the present invention is to provide a circuit board, a periscope camera module and its application, wherein when the circuit board is manufactured in a panel form, a circuit board panel can accommodate more circuit boards.

[0012] Another object of the present invention is to provide a circuit board, a periscope camera module and its application, wherein the production efficiency of the circuit board panel can be improved.

[0013] Another object of the present invention is to provide a circuit board, a periscope camera module and its application, wherein the overall size of the circuit board after being bent can be reduced.

[0014] Another object of the present invention is to provide a circuit board, a periscope camera module and its application, wherein the overall height size of the circuit board after being bent can be reduced.

[0015] Another object of the present invention is to provide a circuit board, a periscope camera module and its application, wherein the assembly accuracy of the circuit board during the assembly process can be reduced to reduce the assembly difficulty.

[0016] Another object of the present invention is to provide a circuit board, a periscope camera module and its application, wherein the number of bends of the circuit board during the assembly process can be reduced to reduce the manufacturing steps.

[0017] According to one aspect of the present invention, the present invention provides a circuit board, which includes: a rigid circuit board layer, wherein the rigid circuit board layer includes a first part of the rigid circuit board layer;

[0018] a flexible circuit board layer, wherein the rigid circuit board layer is disposed on a front surface of the flexible circuit board layer, wherein the flexible circuit board layer includes a first part of the flexible circuit board layer and a second part of the flexible circuit board layer, and the first part of the flexible circuit board layer extends over the second part of the flexible circuit board layer;

[0019] a chip connection portion, wherein the chip connection portion includes the first part of the rigid circuit board layer and a part of the first part of the flexible circuit board layer overlapping the first part of the rigid circuit board layer; and

[0020] a bending portion, wherein the bending portion includes at least a part of the second part of the flexible circuit board layer, and the bending portion is flip-connectably connected to the chip connection portion.

[0021] According to an embodiment of the present invention, the rigid circuit board layer further includes a second part of the rigid circuit board layer, and the bending portion includes the second part of the rigid circuit board layer and a part of the second part of the flexible circuit board layer overlapping the second part of the rigid circuit board layer.

[0022] According to an embodiment of the present invention, the part of the first part of the flexible circuit board layer of the chip connection portion near one end of the bending portion is separably connected to the first part of the rigid circuit board layer.

[0023] According to an embodiment of the present invention, the part of the first part of the flexible circuit board layer of the chip connection portion near one end of the bending portion is separably connected to the first part of the rigid circuit board layer.

[0024] According to an embodiment of the present invention, the part of the second part of the flexible circuit board layer of the bending portion near one end of the chip connection portion is separably connected to the second part of the rigid circuit board layer.

[0025] According to an embodiment of the present invention, the first part of the flexible printed circuit board layer of the chip connection part located at one end close to the bending part is detachably connected to the first part of the rigid printed circuit board layer.

[0026] According to an embodiment of the present invention, when the bending part is folded to the back side of the chip connection part, the bent part of the flexible printed circuit board layer located between the bending part and the chip connection part does not protrude from the rigid printed circuit board layer.

[0027] According to an embodiment of the present invention, when the bending part is folded to the back side of the chip connection part, the bent part of the flexible printed circuit board layer located between the bending part and the chip connection part does not protrude from the rigid printed circuit board layer.

[0028] According to an embodiment of the present invention, the flexible printed circuit board layer further includes a third part of the flexible printed circuit board layer, wherein the third part of the flexible printed circuit board layer is connected to the first part of the flexible printed circuit board layer through the second part of the flexible printed circuit board layer, wherein the printed circuit board further includes a lens assembly connection part, the rigid printed circuit board layer further includes a third part of the rigid printed circuit board layer, wherein the lens assembly connection part includes the third part of the rigid printed circuit board layer and the third part of the flexible printed circuit board layer overlapping the third part of the rigid printed circuit board layer, wherein the chip connection part, the bending part and the lens assembly connection part are located on the same straight line, and the lens assembly connection part is flip - reversibly connected to the bending part.

[0029] According to an embodiment of the present invention, the flexible printed circuit board layer further includes a third part of the flexible printed circuit board layer, wherein the first part of the flexible printed circuit board layer has a first side edge and a second side edge, the first side edge and the second side edge are adjacent, the second part of the flexible printed circuit board layer and the third part of the flexible printed circuit board layer respectively extend from the first side edge and the second side edge, wherein the printed circuit board further includes a lens assembly connection part, the rigid printed circuit board layer further includes a third part of the rigid printed circuit board layer, wherein the lens assembly connection part includes the third rigid printed circuit board layer and the third part of the flexible printed circuit board layer overlapping the third part of the rigid printed circuit board layer, wherein the bending part and the lens assembly connection part are respectively located on adjacent sides of the chip connection part, and the lens assembly connection part is flip - reversibly connected to the chip connection part.

[0030] According to an embodiment of the present invention, the flexible printed circuit board layer further includes a fourth part of the flexible printed circuit board layer, the circuit board further includes a connection belt connecting portion, wherein the connection belt connecting portion is adapted to connect a connection belt, wherein the connection belt connecting portion includes at least a part of the fourth part of the flexible printed circuit board layer, wherein the fourth part of the flexible printed circuit board layer extends over the chip connecting portion, and the extending direction of the fourth part of the flexible printed circuit board layer is perpendicular to the extending direction from the chip connecting portion to the bending portion, and wherein the connection belt connecting portion is flip-connectably connected to the chip connecting portion.

[0031] According to an embodiment of the present invention, the flexible printed circuit board layer further includes a fourth part of the flexible printed circuit board layer, the circuit board further includes a connection belt connecting portion, wherein the connection belt connecting portion is adapted to connect a connection belt, wherein the connection belt connecting portion includes at least a part of the fourth part of the flexible printed circuit board layer, wherein the fourth part of the flexible printed circuit board layer extends over the chip connecting portion, and the extending direction of the fourth part of the flexible printed circuit board layer is perpendicular to the extending direction from the chip connecting portion to the bending portion, and wherein the connection belt connecting portion is flip-connectably connected to the chip connecting portion.

[0032] According to an embodiment of the present invention, the flexible printed circuit board further includes a fourth part of the flexible printed circuit board layer, wherein the circuit board further includes a connection belt connecting portion, wherein the connection belt connecting portion is adapted to connect a connection belt, wherein the connection belt connecting portion includes at least a part of the fourth part of the flexible printed circuit board layer, wherein the fourth part of the flexible printed circuit board layer extends over the bending portion, and the extending direction of the fourth part of the flexible printed circuit board layer is perpendicular to the extending direction from the chip connecting portion to the bending portion.

[0033] According to an embodiment of the present invention, the flexible printed circuit board layer further includes a fourth part of the flexible printed circuit board layer, the circuit board further includes a connection belt connecting portion, wherein the connection belt connecting portion is adapted to connect a connection belt, wherein the connection belt connecting portion includes at least a part of the fourth part of the flexible printed circuit board layer, wherein the fourth part of the flexible printed circuit board layer extends over the bending portion, and the extending direction of the fourth part of the flexible printed circuit board layer is perpendicular to the extending direction from the chip connecting portion to the bending portion.

[0034] According to an embodiment of the present invention, the circuit board further includes a reinforcement member, wherein the reinforcement member is disposed at the bending portion to fix the second part of the flexible printed circuit board layer at the end far from the chip connecting portion to the second part of the rigid printed circuit board layer.

[0035] According to another aspect of the present invention, the present invention provides a panel of printed circuit boards, which includes: a plurality of the above-mentioned printed circuit boards, wherein the panel of printed circuit boards includes one of the flexible printed circuit board layers and a plurality of the rigid printed circuit board layers, and wherein one of the rigid printed circuit board layers and the corresponding flexible printed circuit board layer portion form a single printed circuit board.

[0036] According to another aspect of the present invention, the present invention provides a periscope camera module, which includes:

[0037] A periscope lens assembly; and

[0038] A photosensitive component, wherein the photosensitive component includes a lens holder, a photosensitive chip, and a printed circuit board, wherein the periscope lens assembly is held by the lens holder in a light sensing path of the photosensitive chip, wherein the photosensitive chip is conductively connected to the printed circuit board, and wherein the printed circuit board includes:

[0039] A rigid printed circuit board layer, wherein the rigid printed circuit board layer includes a first part of the rigid printed circuit board layer;

[0040] A flexible printed circuit board layer, wherein the flexible printed circuit board layer includes a first part of the flexible printed circuit board layer and a second part of the flexible printed circuit board layer;

[0041] A chip connection portion, wherein the chip connection portion includes the first part of the rigid printed circuit board layer and a portion of the first part of the flexible printed circuit board layer overlapping the first part of the rigid printed circuit board layer; and

[0042] A bending portion, wherein the bending portion includes at least a part of the second part of the flexible printed circuit board layer, wherein the bending portion is flip-connectably connected to the chip connection portion, wherein the photosensitive chip connection portion is mounted on a front surface of the chip connection portion, and wherein the bending portion is folded to a back side of the photosensitive chip connection portion.

[0043] According to an embodiment of the present invention, the rigid printed circuit board layer further includes a second part of the rigid printed circuit board layer, and wherein the bending portion includes the second part of the rigid printed circuit board layer and a portion of the second part of the flexible printed circuit board layer overlapping the second part of the rigid printed circuit board layer.

[0044] According to an embodiment of the present invention, a portion of the first part of the flexible printed circuit board layer of the chip connection portion near one end of the bending portion is separably connected to the first part of the rigid printed circuit board layer.

[0045] According to an embodiment of the present invention, a portion of the first part of the flexible printed circuit board layer of the chip connection portion near one end of the bending portion is separably connected to the first part of the rigid printed circuit board layer.

[0046] According to an embodiment of the present invention, the second partial flexible printed circuit board layer portion of the bending portion located at one end close to the chip connection portion is detachably connected to the second partial rigid printed circuit board layer.

[0047] According to an embodiment of the present invention, the first partial flexible printed circuit board layer portion of the chip connection portion located at one end close to the bending portion is detachably connected to the first partial rigid printed circuit board layer.

[0048] According to an embodiment of the present invention, the bent flexible printed circuit board layer portion located between the bending portion and the chip connection portion does not protrude from the rigid printed circuit board layer.

[0049] According to an embodiment of the present invention, the bent flexible printed circuit board layer portion located between the bending portion and the chip connection portion does not protrude from the rigid printed circuit board layer.

[0050] According to an embodiment of the present invention, the flexible printed circuit board layer further includes a third partial flexible printed circuit board layer, wherein the third partial flexible printed circuit board layer is connected to the first partial flexible printed circuit board layer through the second partial flexible printed circuit board layer, wherein the circuit board further includes a lens assembly connection portion, the rigid printed circuit board layer further includes a third partial rigid printed circuit board layer, wherein the lens assembly connection portion includes the third partial rigid printed circuit board layer and the third partial flexible printed circuit board layer portion overlapping the third partial rigid printed circuit board layer, wherein the chip connection portion, the bending portion, and the lens assembly connection portion are located on the same straight line, and wherein the lens assembly connection portion is flipped relative to the chip connection portion and is connected to the periscope lens assembly.

[0051] According to an embodiment of the present invention, the flexible printed circuit board layer further includes a third partial flexible printed circuit board layer, wherein the first partial flexible printed circuit board layer has a first side edge and a second side edge, wherein the first side edge and the second side edge are adjacent, the second partial flexible printed circuit board layer and the third partial flexible printed circuit board layer respectively extend from the first side edge and the second side edge, wherein the circuit board further includes a lens assembly connection portion, the rigid printed circuit board layer further includes a third partial rigid printed circuit board layer, wherein the lens assembly connection portion includes the third rigid printed circuit board layer and the third partial flexible printed circuit board layer portion overlapping the third partial rigid printed circuit board layer, wherein the bending portion and the lens assembly connection portion are respectively located on adjacent sides of the chip connection portion, and wherein the lens assembly connection portion is flipped relative to the chip connection portion and is connected to the periscope lens assembly.

[0052] According to an embodiment of the present invention, the flexible printed circuit board layer further includes a fourth part of the flexible printed circuit board layer. The circuit board further includes a connection tape connecting portion, wherein the connection tape connecting portion is adapted to connect a connection tape, and the connection tape connecting portion includes at least a part of the fourth part of the flexible printed circuit board layer. The fourth part of the flexible printed circuit board layer extends over the chip connecting portion, and the extending direction of the fourth part of the flexible printed circuit board layer is perpendicular to the extending direction from the chip connecting portion to the bending portion. The connection tape connecting portion is flipped to the back side of the chip connecting portion.

[0053] According to an embodiment of the present invention, the flexible printed circuit board layer further includes a fourth part of the flexible printed circuit board layer. The circuit board further includes a connection tape connecting portion, wherein the connection tape connecting portion is adapted to connect a connection tape, and the connection tape connecting portion includes at least a part of the fourth part of the flexible printed circuit board layer. The fourth part of the flexible printed circuit board layer extends over the chip connecting portion, and the extending direction of the fourth part of the flexible printed circuit board layer is perpendicular to the extending direction from the chip connecting portion to the bending portion. The connection tape connecting portion is flipped to the back side of the chip connecting portion.

[0054] According to an embodiment of the present invention, the flexible printed circuit board further includes a fourth part of the flexible printed circuit board layer. The circuit board further includes a connection tape connecting portion, wherein the connection tape connecting portion is adapted to connect a connection tape, and the connection tape connecting portion includes at least a part of the fourth part of the flexible printed circuit board layer. The fourth part of the flexible printed circuit board layer extends over the bending portion, and the extending direction of the fourth part of the flexible printed circuit board layer is perpendicular to the extending direction from the chip connecting portion to the bending portion. The connection tape connecting portion is flipped to the back side of the chip connecting portion.

[0055] According to an embodiment of the present invention, the flexible printed circuit board layer further includes a fourth part of the flexible printed circuit board layer. The circuit board further includes a connection tape connecting portion, wherein the connection tape connecting portion is adapted to connect a connection tape, and the connection tape connecting portion includes at least a part of the fourth part of the flexible printed circuit board layer. The fourth part of the flexible printed circuit board layer extends over the bending portion, and the extending direction of the fourth part of the flexible printed circuit board layer is perpendicular to the extending direction from the chip connecting portion to the bending portion. The connection tape connecting portion is flipped to the back side of the chip connecting portion.

[0056] According to an embodiment of the present invention, the circuit board further includes a reinforcement member, wherein the reinforcement member is disposed at the bending portion to fix the second part of the flexible printed circuit board layer at the end far from the chip connecting portion to the second part of the rigid printed circuit board layer.

[0057] According to another aspect of the present invention, the present invention provides an electronic device, which includes:

[0058] An electronic device body; and

[0059] A periscope camera module according to the above, wherein the periscope camera module is disposed on the electronic device body.

[0060] According to an embodiment of the present invention, it further includes a connecting belt, wherein the connecting belt is mounted on the circuit board of the periscope camera module, and the periscope camera module is electrically connected to the electronic device body through the connecting belt.

[0061] According to another aspect of the present invention, the present invention provides an installation method for the circuit board according to the above, which includes the following steps:

[0062] Mount a photosensitive chip on a front surface of the chip connection portion of the circuit board;

[0063] Fix the chip connection portion to a lens holder of a periscope camera module; and

[0064] Flip the bent portion of the circuit board to the back side of the chip connection portion.

[0065] According to an embodiment of the present invention, it further includes the following steps:

[0066] Flip a lens assembly connection portion of the circuit board to be connected to a periscope lens assembly of the periscope camera module, wherein the flexible circuit board layer further includes a third part of the flexible circuit board layer, wherein the first part of the flexible circuit board layer has a first side edge and a second side edge, wherein the first side edge and the second side edge are adjacent, the second part of the flexible circuit board layer and the third part of the flexible circuit board layer respectively extend from the first side edge and the second side edge, wherein the circuit board further includes a lens assembly connection portion, and the lens assembly connection portion includes at least part of the third part of the flexible circuit board layer.

[0067] According to an embodiment of the present invention, it further includes the following steps:

[0068] Flip a lens assembly connection portion of the circuit board to be connected to a periscope lens assembly of the periscope camera module, wherein the flexible circuit board material layer further includes a third part of the flexible circuit board layer, wherein the third flexible circuit board layer is connected to the first flexible circuit board layer through the second flexible circuit board layer, wherein the first part of the flexible circuit board layer, the second part of the flexible circuit board layer, and the third part of the flexible circuit board layer are located on the same straight line, wherein the circuit board further includes a lens assembly connection portion, and the lens assembly connection portion includes at least part of the third part of the flexible circuit board layer.

[0069] According to an embodiment of the present invention, after the bending portion is flipped, at least part of the flexible circuit board layer located at the bending portion and close to one end of the chip connection portion is separated from the first part of the rigid circuit board layer.

[0070] According to an embodiment of the present invention, after the bending portion is flipped, at least part of the flexible circuit board layer located at the chip connection portion and close to one end of the bending portion is separated from the second part of the rigid circuit board layer.

[0071] According to an embodiment of the present invention, after the bending portion is flipped, the bent part of the flexible circuit board layer located between the bending portion and the chip connection portion does not protrude from the first part of the rigid circuit board layer or the second part of the rigid circuit board layer.

[0072] According to another aspect of the present invention, the present invention provides a mounting method of the circuit board according to the above, including the following steps:

[0073] Mount a photosensitive chip on a front surface of the chip connection portion of the circuit board;

[0074] Fix the chip connection portion to a lens holder of a periscope camera module; and

[0075] Flip a lens assembly connection portion of the circuit board to be connected to a periscope lens assembly of the periscope camera module.

[0076] According to an embodiment of the present invention, the flexible circuit board layer further includes a third part of the flexible circuit board layer, wherein the first part of the flexible circuit board layer has a first side edge and a second side edge, wherein the first side edge and the second side edge are adjacent, the second part of the flexible circuit board layer and the third part of the flexible circuit board layer respectively extend from the first side edge and the second side edge, and the lens assembly connection portion includes at least part of the third part of the flexible circuit board layer.

[0077] According to an embodiment of the present invention, the flexible circuit board layer further includes a third flexible circuit board layer, wherein the third flexible circuit board layer is connected to the first flexible circuit board layer through the second flexible circuit board layer, wherein the first flexible circuit board layer, the second flexible circuit board layer, and the third flexible circuit board layer are located on the same straight line, and wherein the lens assembly connection portion includes at least a part of the third flexible circuit board layer.

[0078] According to an embodiment of the present invention, the following steps are further included:

[0079] Flip the bent portion of the circuit board to the back side of the chip connection portion.

[0080] According to another aspect of the present invention, the present invention provides an installation method of the circuit board as described above, including the following steps:

[0081] Flip a lens assembly connection portion of the circuit board to be connected to a periscope lens assembly of a periscope camera module; and

[0082] Flip the chip connection portion so that the chip connection portion with a photosensitive chip connection portion is connected to a lens holder of the periscope camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0083] Figure 1 is an installation schematic diagram of a circuit board according to the prior art.

[0084] Figure 2 is a schematic diagram of a periscope camera module according to the prior art.

[0085] Figure 3 is a schematic diagram of a circuit board according to a preferred embodiment of the present invention.

[0086] Figure 4 is a schematic diagram of a circuit board layout according to a preferred embodiment of the present invention.

[0087] Figure 5 is a schematic diagram of a circuit board assembly process according to a preferred embodiment of the present invention.

[0088] Figure 6 is a schematic diagram of a circuit board assembly process according to a preferred embodiment of the present invention.

[0089] Figure 7 is a schematic diagram of a circuit board assembly process according to a preferred embodiment of the present invention.

[0090] Figure 8 is a schematic diagram of a periscope camera module according to a preferred embodiment of the present invention.

[0091] Figure 9 It is a schematic diagram of a circuit board according to a preferred embodiment of the present invention.

[0092] Figure 10 It is a schematic diagram of a periscope camera module according to a preferred embodiment of the present invention.

[0093] Figure 11 It is a schematic diagram of a circuit board according to a preferred embodiment of the present invention.

[0094] Figure 12 It is a schematic diagram of a periscope camera module according to a preferred embodiment of the present invention.

[0095] Figure 13 It is a schematic diagram of an electronic device according to a preferred embodiment of the present invention. Detailed implementation manners

[0096] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles defined in the following description of the present invention can be applied to other implementation schemes, variant schemes, improvement schemes, equivalent schemes, and other technical schemes that do not deviate from the spirit and scope of the present invention.

[0097] Those skilled in the art should understand that in the disclosure of the present invention, the orientation or positional relationships indicated by the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limitations on the present invention.

[0098] It can be understood that the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in other embodiments, the number of the element can be multiple. The term "a" should not be construed as a limitation on the number.

[0099] Refer to attached Figure 3 to attached Figure 5 As shown, and at the same time refer to attached Figure 8 and attached Figure 13 As shown, a circuit board 10 according to a preferred embodiment of the present invention is illustrated.

[0100] The size of the circuit board 10 can be designed to be smaller. When applied to a periscope camera module 1000, the size of the periscope camera module 1000, especially a height dimension, can be reduced to adapt to the current development trend of thinner and lighter electronic devices. Figure 2 The Z-axis of the coordinate axes in Figure 2 represents the height direction.

[0101] Specifically, the circuit board 10 includes a flexible circuit board layer 10A and a rigid circuit board layer 10B. The flexible circuit board layer 10A has a front side, and the rigid circuit board layer 10B is disposed on the front side of the flexible circuit board layer 10A. The flexible circuit board layer 10A can be bent relatively easily, while the rigid circuit board layer 10B cannot be bent. Once bent, its rigid structure will be damaged, resulting in the fracture of the rigid circuit board layer 10B.

[0102] The circuit board 10 provided in this embodiment is a two-layer structure. Compared with the circuit board 10P with a three-layer structure shown in Figure 1 The thickness of the circuit board 10 in this embodiment can be designed to be thinner. More specifically, for the circuit board 10P with a three-layer structure shown in Figure 1 Hard boards need to be symmetrically arranged on both sides of a flexible board to make the force uniform. However, for the circuit board 10 provided in this example, the structure that may not play a functional role but is only arranged for force uniformity can be omitted. Therefore, the circuit board 10 can be designed to be thinner.

[0103] Further, the circuit board 10 includes a chip connection portion 11, a bending portion 12, a lens assembly connection portion 13, and a connection band connection portion 14. The bending portion 12 is located between the chip connection portion 11 and the connection band connection portion 14, and the chip connection portion 11 is connected between the bending portion 12 and the lens assembly connection portion 13. The bending portion 12 can be bent with respect to the chip connection portion 11. Preferably, the bending portion 12 can be bent to be parallel to the chip connection portion 11.

[0104] The chip connection portion 11 is adapted to be electrically connected to a photosensitive chip 40 of the periscope camera module 1000, the lens assembly connection portion 13 is adapted to be electrically connected to a periscope lens assembly 20 of the periscope camera module 1000, and the connection band connection portion 14 is adapted to be electrically connected to a connection band 50.

[0105] The rigid circuit board layer 10B includes a first part of the rigid circuit board layer 10B' and a second part of the rigid circuit board layer 10B", wherein the bending part 12 includes the second part of the rigid circuit board layer 10B" and the part of the flexible circuit board layer 10A overlapping the second part of the rigid circuit board layer 10B", and the chip connection part 11 includes the first part of the rigid circuit board layer 10B' and the part of the flexible circuit board layer 10A overlapping the first part of the rigid circuit board layer 10B'. The second part of the rigid circuit board layer 10B" and the first part of the rigid circuit board layer 10B' are spaced apart and disposed on the flexible circuit board layer 10A. The flexible circuit board layer 10A has a front side and a back side, and the rigid circuit board layer 10B is disposed on the front side of the flexible circuit board layer 10A. That is to say, the first part of the rigid circuit board layer 10B' and the second part of the rigid circuit board layer 10B" are both on the same side of the flexible circuit board layer 10A.

[0106] More specifically, the flexible circuit board layer 10A includes a first part of the flexible circuit board layer 10A', a second part of the flexible circuit board layer 10A", and a third part of the flexible circuit board layer 10A"', wherein the first part of the flexible circuit board layer 10A' is respectively connected to the second part of the flexible circuit board layer 10A" and the third part of the flexible circuit board layer 10A"'.

[0107] Further, the first part of the flexible circuit board layer 10A' has a first side 111 and a second side 112, wherein the first side 111 and the second side 112 are adjacent. In this example, the first part of the flexible circuit board layer 10A' is a rectangular structure, and the first part of the flexible circuit board layer 10A' further has a third side 113 and a fourth side 114. The first side 111 and the third side 113 are opposite, and the second side 112 and the fourth side 114 are opposite. The first side 111 is respectively connected to the second side 112 and the fourth side 114, and the third side 113 is respectively connected to the fourth side 114 and the second side 112.

[0108] In this example, the second flexible circuit board layer 10A" extends outward from the first side 111 of the first flexible circuit board layer 10A', and the third flexible circuit board layer 10A"' extends outward from the second side 112 of the first flexible circuit board layer 10A', where there is an included angle between the second flexible circuit board layer 10A" and the first flexible circuit board layer 10A'. Preferably, the included angle is a right angle to facilitate the flipping of the second flexible circuit board layer 10A" relative to the first flexible circuit board layer 10A' and the flipping of the third flexible circuit board layer 10A"' relative to the first flexible circuit board layer 10A'.

[0109] Or rather, the flexible circuit board layer has an L-shaped structure, where the first flexible circuit board layer 10A' is located at a corner position.

[0110] In other examples of the present invention, when the second flexible circuit board layer 10A" extends outward from the first side 111 of the first flexible circuit board layer 10A', the third flexible circuit board layer 10A"' can be partially arranged to extend outward from the fourth side 114 of the first flexible circuit board layer 10A'. In other examples of the present invention, when the second flexible circuit board layer 10A" extends outward from the third side 113 of the first flexible circuit board layer 10A', the third flexible circuit board layer 10A"' can be arranged to extend outward from the fourth side 114 of the first flexible circuit board layer 10A'. In other examples of the present invention, when the second flexible circuit board layer 10A" extends outward from the third side 113 of the first flexible circuit board layer 10A', the third flexible circuit board layer 10A"' can be arranged to extend outward from the second side 112 of the first flexible circuit board layer 10A'.

[0111] The first part of the rigid circuit board layer 10B, i.e., the rigid circuit board layer 10B', is disposed on the second flexible circuit board layer 10A" of the flexible circuit board layer 10A, and the second part of the rigid circuit board layer, i.e., the rigid circuit board layer 10B", is disposed on the first flexible circuit board layer 10A'.

[0112] The bending portion 12 includes the second part of the rigid circuit board layer 10B" and the part of the second flexible circuit board layer 10A" that overlaps the second part of the rigid circuit board layer 10B".

[0113] The chip connection part 11 includes the first part of the rigid circuit board layer 10B' and the first part of the flexible circuit board layer 10A' overlapping the first part of the rigid circuit board layer 10B'.

[0114] The lens assembly connection part 13 includes at least a part of the third part of the flexible circuit board layer 10A''', and the lens assembly connection part 13 is flip-connectably connected to the chip connection part 11 relative to the chip connection part 11.

[0115] Bending part 12 Bending part 12 Bending part 12 Chip connection part 11

[0116] The flexible circuit board layer 10A further includes a fourth part of the flexible circuit board layer 10A''' ', wherein the fourth part of the flexible circuit board layer 10A''' 'extends from the second part of the flexible circuit board layer 10A'', the second part of the flexible circuit board layer 10A'' is located between the fourth part of the flexible circuit board layer 10A''' 'and the first flexible circuit board layer 10A', and the first part of the flexible circuit board layer 10A', the second part of the flexible circuit board layer 10A'' and the fourth part of the flexible circuit board layer 10A''' 'are on the same straight line, and the first part of the flexible circuit board layer 10A' and the third part of the flexible circuit board layer 10A''' 'are on the same straight line. Preferably, the circuit board 10 is an L-shaped structure.

[0117] The connection belt connection part 14 includes at least a part of the fourth part of the flexible circuit board layer 10A''' ', and the connection belt connection part 14 is flip-connectably connected to the bending part 12. The bending part 12 is located between the connection belt connection part 14 and the chip connection part 11.

[0118] Furthermore, the rigid circuit board layer 10B may further include a third part of the rigid circuit board layer 10B''' 'and a fourth part of the rigid circuit board layer 10B''' ', and the third part of the rigid circuit board layer 10B''' 'and the fourth part of the rigid circuit board layer 10B''' 'are respectively and spacedly arranged on the front side of the flexible circuit board layer 10A.

[0119] The lens assembly connection part 13 includes the third part of the rigid circuit board layer 10B''' 'and the part of the third part of the flexible circuit board layer 10A''' 'of the flexible circuit board layer 10A overlapping the third part of the rigid circuit board layer 10B''' '. The connection belt connection part 14 includes the fourth part of the rigid circuit board layer 10B''' 'and the part of the fourth part of the flexible circuit board layer 10A''' 'of the flexible circuit board layer 10A overlapping the fourth part of the rigid circuit board layer 10B''' '.

[0120] It is understandable that in some other examples of the present invention, the rigid circuit board layer 10B includes the second part of the rigid circuit board layer 10B" and the first part of the rigid circuit board layer 10B'. The rigid circuit board layer 10B can provide a flat mounting plane to facilitate subsequent installation. For example, when a photosensitive chip 40 is mounted on the chip connection portion 11, the second part of the rigid circuit board layer 10B" of the chip connection portion 11 facilitates the flat mounting of the photosensitive chip 40 on the chip connection portion 11.

[0121] Further, the bending portion 12 and the chip connection portion 11 are connected by a part of the flexible circuit board layer 10A and the bending portion 12 is bendably connected to the chip connection portion 11.

[0122] The lens assembly connection portion 13 and the chip connection portion 11 are connected by a part of the flexible circuit board layer 10A and the periscope lens assembly 20 is bendably connected to the chip connection portion 12.

[0123] The connection belt connection portion 14 and the bending portion 12 are connected by a part of the flexible circuit board layer 10A and the connection belt connection portion 14 is bendably connected to the bending portion 12.

[0124] The connection belt connection portion 14 is connected to the chip connection portion 11 through the bending portion 12. That is to say, the part of the flexible circuit board layer 10A between the connection belt connection portion 14 and the chip connection portion 11 can be bent twice. The connection belt connection portion 14 and the lens assembly connection portion 13 are located at both ends respectively.

[0125] The circuit board 10 can be manufactured by an additive method. For example, a flexible circuit board layer 10A can be provided first, and then a metal circuit is formed by copper plating or etching process. On this basis, an insulating layer is formed to form the rigid circuit board layer 10B. By repeating this process, a multi-layer circuit board 10 can be obtained, and the rigid circuit board layer 10 is formed only on one side of the flexible circuit board 10. Of course, the above steps are only for illustration and do not limit the present invention.

[0126] Further, in this example, the circuit board 10 has an L-shaped structure. That is to say, the flexible circuit board layer 10A extends from the position of the connection belt connection portion 14 towards the position of the bending portion 12, then along to the position of the chip connection portion 11, and then turns towards the position of the periscope lens assembly 20 and extends.

[0127] The extension direction of the portion of the flexible circuit board layer 10A extending between the lens assembly connection portion 13 and the chip connection portion 11 forms a 90-degree angle with the extension direction of the portion of the flexible circuit board layer 10A extending between the connection belt connection portion 14 and the chip connection portion 11. Relative to the Figure 1 For the T-shaped circuit board 10P shown in the attached Figure 1 , the size of the circuit board 10 provided in this embodiment can be designed to be smaller. The chip connection portion 11 can be mounted with the photosensitive chip 40 and is also directly connected to the lens assembly connection portion 13 and the connection belt connection portion 14, thereby improving the effective utilization rate of the entire circuit board 10. More specifically, relative to the

[0128] Further, when the circuit board 10 is bent for assembly, taking the bending between the connection belt connection portion 14 and the chip connection portion 11 as an example, when the connection belt connection portion 14 is bent with respect to the chip connection portion 11, especially when the back surface of the connection belt connection portion 14 facing the chip connection portion 11 is bent, the portion of the flexible circuit board layer 10A between the connection belt connection portion 14 and the chip connection portion 11 can not protrude from the chip connection portion 11.

[0129] More specifically, the chip connection portion 11 has a front surface and the back surface. The front surface and the back surface of the chip connection portion 11 are oppositely arranged, and the front surface of the chip connection portion 11 is used to mount the photosensitive chip 40.

[0130] A complete periscope camera module 1000 includes the periscope lens assembly 20 and a photosensitive assembly. The photosensitive assembly includes a lens holder 30, the photosensitive chip 40, and the circuit board 10. The photosensitive chip 40 is mounted on the circuit board 10. The lens holder 30 has a light window. The periscope lens assembly 20 is held on a photosensitive path of the photosensitive chip 40 through the lens holder 30. That is, light is turned by the periscope lens assembly 20 and then received by the photosensitive chip 40 through the light window.

[0131] The periscope lens assembly 20 includes a light turning mechanism 21 and a lens mechanism 22. The light turning mechanism 21 has a light entrance. After light enters through the light entrance, it turns about 90 degrees in the light turning mechanism 21 and then reaches the photosensitive chip 40 to be received after passing through the lens mechanism 22.

[0132] The optical steering mechanism 21 may further include an optical steering member and a first motor, wherein the optical steering member is drivably connected to the first motor. The lens mechanism 22 may further include a lens and a second motor, wherein the lens is drivably connected to the second motor. The lens assembly connection portion 13 adapted to be electrically connected to the periscope lens assembly 20 may be respectively conductively connected to the first motor and the second motor, and the periscope lens assembly 20 can receive or transmit some electrical signals through the circuit board 10.

[0133] When the circuit board 10 is mounted on the lens holder 30 of the photosensitive component of the periscope imaging module 1000, it is possible to bend the circuit board 10 to avoid increasing the height of the entire periscope imaging module 1000 when there are more components arranged in the height direction. It can be understood that the chip connection portion 11, the height direction at this time refers to the thickness direction of the electronic device when the periscope imaging module 1000 is mounted on the electronic device, which is the height direction of the electronic device when the electronic device is horizontally placed on the table.

[0134] The connection belt connection portion 14 is flipably connected to the chip connection portion 11. When the connection belt connection portion 14 is flipped relative to the chip connection portion 11 and is flipped towards the back surface of the chip connection portion 11, in order to reduce the size of the circuit board 10 in the height direction and thus reduce the size of the periscope imaging module 1000 in the height direction, the soft circuit board layer 10A between the connection belt connection portion 14 and the chip connection portion 11 is bent, even multiple times, on the back side of the chip connection portion 11 to reduce the size of the circuit board 10 in the height direction.

[0135] More specifically, when the connection belt connection portion 14 is folded relative to the chip connection portion 11, the bending portion 12 is folded on the back side of the chip connection portion 11. The setting of the first rigid circuit board layer 10B of the bending portion 12 is beneficial to the positioning of the circuit board 10 after bending.

[0136] The bending portion 12 includes the second part of the rigid circuit board layer 10B" and the second part of the soft circuit board layer 10A" of the soft circuit board layer 10A overlapping the second part of the rigid circuit board layer 10B". The chip connection portion 11 includes the first part of the rigid circuit board layer 10B' and the first part of the soft circuit board layer 10A' of the soft circuit board layer 10A overlapping the first part of the rigid circuit board layer 10B'.

[0137] When the second rigid circuit board layer 10B is folded relative to the first rigid circuit board layer 10B', that is, when the bending portion 12 is folded relative to the chip connection portion 11, the portion of the flexible circuit board layer 10A between the bending portion 12 and the chip connection portion 11 does not protrude beyond the bending portion 12 or the chip connection portion 11. Or rather, the bent portion of the flexible circuit board layer 10A between the first rigid circuit board layer 10B' and the second rigid circuit board layer 10B" does not protrude beyond the first rigid circuit board layer 10B' or the second rigid circuit board layer 10B", which is beneficial to reducing the overall size of the circuit board 10. Or rather, when the circuit board 1000 is bent, the lowest point of the flexible circuit board layer 10A in the height direction can be higher than the lowest point of the rigid circuit board layer 10B in the height direction, such that the flexible circuit board layer 10A does not contribute to the size of the circuit board 10 in the height direction.

[0138] More specifically, for the bending portion 12 and the chip connection portion 11, when the bending portion 12 is folded on the back facing the chip connection portion 11, the portion of the flexible circuit board layer 10A of the bending portion 12 faces the portion of the flexible circuit board layer 10A of the chip connection portion 11, such that there is no need to avoid the rigid circuit board layer 10B during the folding process, and thus the length of the portion of the flexible circuit board layer 10A extending outward between the bending portion 12 and the chip connection portion 11 can be reduced.

[0139] Furthermore, the portion of the flexible circuit board layer 10A of the chip connection portion 11 overlapping the first rigid circuit board layer 10B' is at least partially separably connected to the first rigid circuit board layer 10B', and the portion of the flexible circuit board layer 10A of the bending portion 12 overlapping the second rigid circuit board layer 10B" is at least partially separably connected to the second rigid circuit board layer 10B". Specifically refer to the enlarged schematic portion at the S position in the appendix Figure 8 which shows that at least part of the flexible circuit board layer 10A is separably connected to the rigid circuit board layer 10B.

[0140] Accordingly, at least a part of the flexible printed circuit board layer 10A of the chip connection portion 11 that overlaps the first part of the rigid printed circuit board layer 10B' is fixedly connected to the first part of the rigid printed circuit board layer 10B', and at least a part of the flexible printed circuit board layer 10A of the bending portion 12 that overlaps the second part of the rigid printed circuit board layer 10B'' is fixedly connected to the second part of the rigid printed circuit board layer 10B'', so that the length of the flexible printed circuit board layer 10A between the bending portion 12 and the chip connection portion 11 can be reduced.

[0141] Furthermore, the printed circuit board 10 further includes a reinforcement member 15. In this example, the reinforcement member 15 is disposed on the second part of the flexible printed circuit board layer 10A'' of the flexible printed circuit board layer 10A of the bending portion 12 to prevent the flexible printed circuit board layer 10A from being completely separated from the second part of the rigid printed circuit board layer 10B''. The reinforcement member 15 can also be disposed on the first part of the flexible printed circuit board layer 10A' of the flexible printed circuit board layer 10A of the chip connection portion 11 to prevent the flexible printed circuit board layer 10A from being completely separated from the first part of the rigid printed circuit board layer 10B'. Of course, it can be understood that the flexible printed circuit board layer 10A part of the bending portion 12 and the second part of the rigid printed circuit board layer 10B'' and the flexible printed circuit board layer 10A part of the chip connection portion 11 and the first part of the rigid printed circuit board layer 10B' can be reinforced by other means, and the above examples do not limit the present invention.

[0142] It can be understood that the flexible printed circuit board layer 10A part between the bending portion 12 and the chip connection portion 11 has a preset length so that the bending portion 12 can be flipped relative to the chip connection portion 11.

[0143] When the bending portion 12 is flipped relative to the chip connection portion 11, at least a part of the first soft printed circuit board layer 10A' of the soft printed circuit board layer 10A that overlaps the first hard printed circuit board layer 10B' and is close to the second hard printed circuit board layer 10B" is separated from the first hard printed circuit board layer 10B', and at least a part of the second soft printed circuit board layer 10A" of the soft printed circuit board layer 10A that overlaps the second hard printed circuit board layer 10B" and is close to the first hard printed circuit board layer 10B' is separated from the second hard printed circuit board layer 10B", so that when the bending portion 12 is flipped to the photosensitive chip 40, the portion of the soft printed circuit board layer 10A extending outward between the bending portion 12 and the chip connection portion 11 can be designed to be shorter. Here, "outward" is relative to the second hard printed circuit board layer 10B" of the bending portion 12 and the first hard printed circuit board layer 10B' of the chip connection portion 11. Preferably, the soft printed circuit board layer 10A between the bending portion 12 and the chip connection portion 11 can be completely flush with the second hard printed circuit board layer 10B" and the first hard printed circuit board layer 10B' in the Z direction, which is beneficial to reducing the size of the circuit board 10 in the height direction.

[0144] More specifically, the bending portion 12 has a first bending end and a second bending end, where the first bending end and the second bending end are located at both ends respectively. The chip connection portion 11 has a first connection end and a second connection end, where the first connection end and the second connection end are located at both ends respectively. The first connection end of the chip connection portion 11 is far from the bending portion 12, and the second connection end of the chip connection portion 11 is close to the bending portion 12. When the bending portion 12 is not flipped relative to the chip connection portion 11, the second bending end of the bending portion 12 is far from the chip connection portion 12, and the first bending end of the bending portion 12 is close to the chip connection portion 12.

[0145] When the bending portion 12 is flipped to the back side of the chip connection portion 11, the second bending end of the bending portion 12 and the first connection end of the chip connection portion 11 are arranged face to face, the first bending end of the bending portion 12 and the second connection end of the chip connection portion 11 are arranged face to face, and the bending of the soft printed circuit board layer 10A occurs between the first bending end of the bending portion 12 and the second connection end of the chip connection portion. It can be understood that the back side of the chip connection portion 11 refers to the side opposite to the side where the photosensitive chip 40 is mounted on the chip connection portion 11.

[0146] The second part of the flexible circuit board layer 10A” of the bending part 12 located at the first bending end is separably connected to the corresponding part of the second part of the rigid circuit board layer 10B”. When facing relatively large stress due to bending at this position, the second part of the flexible circuit board layer 10A” and the second part of the rigid circuit board layer 10B” of the bending part 12 are separated to reduce the stress at this position, thereby avoiding tearing.

[0147] The first part of the flexible circuit board layer 10A’ of the chip connection part 11 located at the second connection end is separably connected to the corresponding part of the first part of the rigid circuit board layer 10B’. When facing relatively large stress due to bending at this position, the second part of the rigid circuit board layer 10B’ and the second part of the flexible circuit board 10A” of the chip connection part 11 are separated to reduce the stress at this position, thereby avoiding tearing.

[0148] More specifically, the bending part 12 includes a first part of the bending part 12A and a second part of the bending part 12B, wherein the first part of the bending part 12A extends from the second part of the bending part 12B and the first part of the bending part 12A is closer to the chip connection part 11 than the second part of the bending part 12.

[0149] The chip connection part 11 includes a first part of the chip connection part 11A and a second part of the chip connection part 11B, wherein the first part of the chip connection part 11A extends from the second part of the chip connection part 11B and the second part of the chip connection part 11B is closer to the bending part 12 than the first part of the chip connection part 11A.

[0150] The first part of the bending part 12A includes at least part of the flexible circuit board layer 10A and at least part of the rigid circuit board layer 10B. More specifically, the first part of the bending part 12A includes at least part of the second part of the rigid circuit board layer 10B” and the part of the second part of the flexible circuit board layer 10A” overlapping the second part of the rigid circuit board layer 10B”. The second part of the bending part 12B includes at least the second part of the rigid circuit board layer 10B” and the part of the second part of the flexible circuit board layer 10A” overlapping the second rigid circuit board layer 10B”. The part of the second part of the rigid circuit board layer 10B” of the first part of the bending part 12A is separably connected to the part of the second part of the flexible circuit board layer 10A”.

[0151] The first part of the chip connection portion 11A includes at least a part of the flexible circuit board layer 10A and at least a part of the rigid circuit board layer 10B. More specifically, the first part of the chip connection portion 11A includes at least a part of the first part of the rigid circuit board layer 10B' and the part of the first part of the flexible circuit board layer 10A' that overlaps the first part of the rigid circuit board layer 10B'. The second part of the chip connection portion 11B includes at least the first part of the rigid circuit board layer 10B' and the part of the first part of the flexible circuit board layer 10A' that overlaps the first part of the rigid circuit board layer 10B', wherein the part of the first part of the rigid circuit board layer 10B' of the second part of the chip connection portion 11B is separably connected to the part of the first part of the flexible circuit board layer 10A'.

[0152] Furthermore, when the bending portion 12 is flipped relative to the chip connection portion 11, the flexible circuit board layer 10A parts of the adjacent second part of the chip connection portion 11B and the first part of the bending portion 12A can be separated from the corresponding rigid circuit board layer 10B parts.

[0153] It is worth mentioning that the length of the flexible circuit board layer 10A between the bending portion 12 and the chip connection portion 11 can be designed to be shorter, preferably not protruding in the Z direction from the bending portion 12 and the chip connection portion 11, which is beneficial to reducing the height dimension of the circuit board 10.

[0154] Optionally, after the bending portion 12 is flipped, the bending portion 12 and the chip connection portion 11 are oppositely arranged. Preferably, the size of the bending portion 12 is set to be smaller than the size of the chip connection portion 11 to be beneficial to reducing the size of the circuit board 10, especially the size in the height direction. Optionally, the flipped bending portion 12 and the chip connection portion 11 are relatively parallel.

[0155] When the periscope camera module 1000 is installed in the electronic device, the circuit board 10 is in a direction perpendicular to the electronic device, and the flexible circuit board layer 10A between the bending portion 12 and the chip connection portion 11 is in the vertical direction, so that shortening the part of the flexible circuit board layer 10A extending outward can reduce the size of the circuit board 10 in the height direction.

[0156] That is to say, the circuit board 10 provided in this embodiment itself has a relatively small size, both in terms of area size and thickness size, and the height dimension of the circuit board 10 during use can also be reduced.

[0157] Further, the circuit board 10 can be manufactured by a panel manufacturing method, manufacturing multiple circuit boards 10 at a time. Specifically, according to another aspect of the present invention, the present invention provides a circuit board panel 100, wherein the circuit board panel 100 includes multiple circuit boards 10, wherein the circuit board 10 includes the flexible circuit board layer 10A and multiple rigid circuit board layers 10B, and wherein the rigid circuit board layers 10B are spaced apart and disposed on the flexible circuit board layer 10A. Each rigid circuit board layer 10B includes the second part of the rigid circuit board layer 10B" and the first part of the rigid circuit board layer 10B', and may further include the third part of the rigid circuit board layer 10B'" and the fourth part of the rigid circuit board layer 10B""

[0158] The circuit board panel 100 can be cut into individual circuit boards 10, thereby manufacturing multiple circuit boards 10 in batches.

[0159] It is worth mentioning that due to the reduction in the size of the circuit board 10, more circuit boards 10 can be manufactured at a time in the same fixture, thereby improving the manufacturing efficiency of the circuit board 10 and saving manufacturing costs.

[0160] Refer to the attached Figure 5 As shown, the assembly process of the circuit board 10 according to the above embodiment of the present invention is illustrated. Other components of the periscope camera module 1000 are not shown in the attached Figure 5 Only the structural changes of the circuit board 10 itself are taken as an example for explanation, and the attached Figure 8 can be referred to at the same time.

[0161] A connection band 50 can be mounted on the circuit board 10, and the connection band 50 is used to connect to other devices, such as the electronic device, or other camera modules installed on the electronic device, etc.

[0162] A photosensitive chip 40 can be mounted on the circuit board 10, and then the circuit board 10 with the photosensitive chip 40 can be assembled to the lens holder 30 of the periscope camera module 1000, for example, in a mounting manner, so that the periscope lens assembly 20 of the periscope camera module 1000 is held in the photosensitive path of the photosensitive chip 40 through the lens holder 30.

[0163] The chip connection portion 11 is for the attached Figure 1For the circuit board 10P shown, during the installation process of the circuit board 10P, first flip the first bent portion 11P relative to the connecting portion 14P, and then flip the second bent portion 12P relative to the connecting portion 14P. The first bent portion 11P is used to connect to the photosensitive chip 40P, and the second bent portion 12P is used to connect to the motor. In this process, the accuracy of the second bend is based on the premise of the first bend. Therefore, in order to ensure the alignment accuracy between the second bend and the motor solder joints, the first bend requires an additional jig to limit and ensure the accuracy. In this example, the circuit board 10 is positioned on the lens holder 30, and as long as the lens assembly connecting portion 13 is flipped relative to the chip connecting portion 11, there is no need for an additional jig to position the chip connecting portion 11.

[0164] Then assemble the lens assembly connecting portion 13 to the periscope lens assembly 20 of the periscope imaging module 1000. Specifically, flip the lens assembly connecting portion 13 towards the front side of the flexible circuit board layer 10A, and then fix the periscope lens assembly 20 at the corresponding position of the periscope lens assembly 20. In this process, there is no need to position the bent portion 12 and the connecting band connecting portion 14.

[0165] Then flip the bent portion 12 towards the back side of the chip connecting portion 11. Preferably, flip it until the portion of the flexible circuit board layer 10A between the bent portion 12 and the chip connecting portion 11 does not protrude from the second part of the rigid circuit board layer 10B” and the first part of the rigid circuit board layer 10B’ of the bent portion 12.

[0166] Finally, flip the connecting band connecting portion 14 to an outward position for connecting to other electronic devices.

[0167] It should be noted that during the entire assembly process of the circuit board 10, there is no need to use jigs related to positioning, which is beneficial to reducing the manufacturing difficulty. Further, for the Figure 1 For the circuit board 10P shown, it needs to be flipped 4 times to complete the assembly during the assembly process, while the circuit board 10 provided in this embodiment only needs to be flipped 3 times to complete the assembly, and at the same time reduces the height dimension of the entire circuit board 10, which is beneficial to reducing the height dimension of the entire periscope imaging module 1000.

[0168] Refer to the Figure 6 Shown is another schematic diagram of the assembly process of the circuit board 10 according to another preferred embodiment of the present invention, and reference can also be made to the Figure 8 .

[0169] The circuit board 10 can be mounted with the connection tape 50, where the connection tape 50 is used to connect to other devices, such as the electronic device, or other camera modules installed on the electronic device, etc.

[0170] A photosensitive chip 40 can be mounted on the circuit board 10, and then the circuit board 10 with the photosensitive chip 40 can be assembled to the lens holder 30 of the periscope camera module 1000, for example, in a mounting manner, so that the periscope lens assembly 20 of the periscope camera module 1000 is held on the photosensitive path of the photosensitive chip 40 through the lens holder 30.

[0171] In this way, the circuit board 10 is positioned on the lens holder 30, so that no additional fixture is required to position the chip connection portion 11.

[0172] Then turn the bent portion 12 towards the back side of the chip connection portion 11. Preferably, turn it until the soft circuit board layer 10A part between the bent portion 12 and the chip connection portion 11 does not protrude from the second part of the hard circuit board layer 10B and the first part of the hard circuit board layer 10B of the bent portion 12.

[0173] Then turn the connection tape connection portion 14 to an outward position for connecting to other electronic devices.

[0174] Finally, assemble the lens assembly connection portion 13 to the periscope lens assembly 20 of the periscope camera module 1000. Specifically, turn the lens assembly connection portion 13 towards the front side of the soft circuit board layer 10A, and then fix the periscope lens assembly 20 at the corresponding position of the periscope lens assembly 20.

[0175] The circuit board 10 provided in this embodiment only needs to be turned over 3 times to complete the assembly, and at the same time reduces the height dimension of the entire circuit board 10, which is beneficial to reducing the height dimension of the entire periscope camera module 1000.

[0176] Refer to the attached Figure 7 As shown in the schematic diagram of another assembly process of the circuit board 10 according to another preferred embodiment of the present invention, and at the same time, refer to the attached Figure 8 .

[0177] The circuit board 10 can be mounted with the connection tape 50, where the connection tape 50 is used to connect to other devices, such as the electronic device, or other camera modules installed on the electronic device, etc.

[0178] The circuit board 10 can be mounted with the photosensitive chip 40.

[0179] In this example, first, the lens assembly connecting portion 13 is assembled to the periscope lens assembly 20 of the periscope imaging module 1000.

[0180] Then, the chip connecting portion 11 is assembled to the lens holder 30 so that the periscope lens assembly 20 is held in the light sensing path of the photosensitive chip 40. Specifically, the chip connecting portion 11 is flipped to a front side of the lens assembly connecting portion 13 until the chip connecting portion 11 is assembled to the lens holder 30, for example, in a mounting manner.

[0181] Next, the bent portion 12 is flipped to a back side of the chip connecting portion 11. Preferably, it is flipped until a portion of the flexible circuit board layer 10A between the bent portion 12 and the chip connecting portion 11 does not protrude from the second part of the rigid circuit board layer 10B and the first part of the rigid circuit board layer 10B' of the bent portion 12.

[0182] Finally, the connecting belt connecting portion 14 is flipped to an outward position for connecting other electronic devices.

[0183] The circuit board 10 provided in this embodiment only needs to be flipped 3 times to complete the assembly, while reducing the height dimension of the entire circuit board 10, which is beneficial to reducing the height dimension of the entire periscope imaging module 1000.

[0184] Attached Figure 8 shows the periscope imaging module 1000 according to a preferred embodiment of the present invention. The height dimension of the periscope imaging module 1000 to which the circuit board 10 is applied can be reduced, and the assembly process can be simplified. The manufacturing cost of the circuit board 10 itself can also be reduced. Further, the periscope lens assembly 20 of the periscope device module has two side surfaces, a top surface, and two bottom surfaces, where the photosensitive chip 40 is located on one of the bottom surfaces, and the top surface refers to a surface facing the object to be photographed. In this example, the lens assembly connecting portion 13 of the circuit board 10 is located on a left side surface, and the bent portion 12 is flipped from bottom to top. In other examples of the present invention, the lens assembly connecting portion 13 of the circuit board 10 can be located on a right side surface. In other examples of the present invention, the bent portion 12 of the circuit board 10 can be flipped from top to bottom.

[0185] Attached Figure 9Shows a modified embodiment of the circuit board 10 according to the present invention, wherein the circuit board 10 includes a flexible circuit board layer 10A and a rigid circuit board layer 10B, and the rigid circuit board layer 10B is disposed on a front surface of the flexible circuit board layer 10A.

[0186] The circuit board 10 further includes a chip connection portion 11, a bending portion 12, a lens assembly connection portion 13, and a connection belt connection portion 14. The chip connection portion 11 is used to connect to a photosensitive chip. The bending portion 12 is flip-connectably connected to the chip connection portion 11. The lens assembly connection portion 13 is adapted to connect to a periscope lens assembly of a periscope camera module. The connection belt connection portion is adapted to connect to a connection belt. The lens assembly connection portion 13 is flip-connectably connected to the chip connection portion 11, and the connection belt connection portion 14 is flip-connectably connected to the chip connection portion 11.

[0187] More specifically, the bending portion 12 is located between the chip connection portion 11 and the lens assembly connection portion 13. The two sides of the bending portion 12 are respectively connected to the chip connection portion 11 and the lens assembly connection portion 13. The connection belt connection portion 14 is connected to one side of the bending portion 12, such that the circuit board 10 is a T-shaped structure.

[0188] The bending portion 12 has a first edge 121, a second edge 122, a third edge 123, and a fourth edge 124. The first edge 121 is respectively connected to the second edge 122 and the fourth edge 124. The second edge 122 is respectively connected to the first edge 121 and the third edge 123. The third edge 123 is respectively connected to the second edge 122 and the fourth edge 124. The first edge 121 and the third edge 123 are oppositely disposed, and the second edge 122 and the fourth edge 124 are oppositely disposed.

[0189] The chip connection portion 11 extends along the fourth edge 124 of the bending portion 12. The connection belt connection portion 14 extends along the first edge 121 of the bending portion 12. The lens assembly connection portion 13 extends along the second edge 122 of the bending portion 12. Preferably, the chip connection portion 11, the bending portion 12, and the lens assembly connection portion 13 are located on the same straight line. Further, the connection belt connection portion 14 is perpendicular to the straight line where the chip connection portion 11, the bending portion 12, and the lens assembly connection portion 13 are located.

[0190] Further, the flexible printed circuit board layer 10A includes a first partial flexible printed circuit board layer 10A', a second partial flexible printed circuit board layer 10A", a third partial flexible printed circuit board layer 10A"', and a fourth partial flexible printed circuit board layer 10A"". The first partial flexible printed circuit board layer 10A' and the third partial flexible printed circuit board layer 10A"' are respectively connected to the second partial flexible printed circuit board layer 10A". The first partial flexible printed circuit board layer 10A', the second partial flexible printed circuit board layer 10A", and the third partial flexible printed circuit board layer 10A"' are located on the same straight line. The fourth partial flexible printed circuit board layer 10A"" extends outward from the second partial flexible printed circuit board layer 10A".

[0191] The rigid printed circuit board layer 10B includes a first partial rigid printed circuit board layer 10B', a second partial rigid printed circuit board layer 10B", a third partial rigid printed circuit board layer 10B"', and a fourth partial rigid printed circuit board layer 10B"". The first partial rigid printed circuit board layer 10B', the second partial rigid printed circuit board layer 10B", the third partial rigid printed circuit board layer 10B"', and the fourth partial rigid printed circuit board layer 10B"" are spaced apart and disposed on the flexible printed circuit board layer 10A.

[0192] The chip connection portion 11 includes the first partial rigid printed circuit board layer 10B' and the portion of the first partial flexible printed circuit board layer 10A' of the flexible printed circuit board layer 10A that overlaps the first partial rigid printed circuit board layer 10B'. The bending portion 12 includes the second partial rigid printed circuit board layer 10B" and the portion of the second partial flexible printed circuit board layer 10A" of the flexible printed circuit board layer 10A that overlaps the second partial rigid printed circuit board layer 10B". The lens assembly connection portion 13 includes the third partial rigid printed circuit board layer 10B"' and the portion of the third partial flexible printed circuit board layer 10A"' of the flexible printed circuit board layer 10A that overlaps the third partial rigid printed circuit board layer 10B"'. The connection belt connection portion 14 includes the fourth partial rigid printed circuit board layer 10B"" and the portion of the fourth partial flexible printed circuit board layer 10A"" of the flexible printed circuit board layer 10A that overlaps the fourth partial rigid printed circuit board layer 10B"".

[0193] It can be understood that in some other examples of the present invention, the connection belt connection portion 14 may include at least part of the flexible printed circuit board layer 10A portion.

[0194] Further referring to the attached Figure 10 , the circuit board 10 is mounted on a lens holder 30 of the periscope camera module 1000. The photosensitive chip 40 is mounted on the front surface of the chip connection portion 11 of the circuit board 10, that is, the side where the rigid printed circuit board layer 10B is located.

[0195] The bent portion 12 is folded to the back side of the chip connection portion 11. The lens assembly connection portion 13 is folded forward to be connected to a periscope lens assembly 20 of the periscope camera module 1000. The connection band connection portion 14 connected to the bent portion 12 is folded outwards and connected to a connection band 50, so as to be adapted to be connected to an electronic device body in subsequent installation processes.

[0196] It can be understood that the back side here refers to the side opposite to the side where the photosensitive chip 40 is installed.

[0197] When the bent portion 12 is folded to the back side of the chip connection portion 11, the size of the flexible printed circuit board layer 10A between the bent portion 12 and the chip connection portion 11 can be reduced. Specifically, when the bent portion 12 is folded, the second part of the rigid printed circuit board layer 10B'' of the bent portion 12 and the first part of the rigid printed circuit board layer 10B' of the chip connection portion 11 are respectively located on the outside, so that the second part of the flexible printed circuit board portion overlapping the second part of the rigid printed circuit board layer 10B'' and the first part of the flexible printed circuit board layer 10A' overlapping the first part of the rigid printed circuit board layer 10B' do not need to avoid the second part of the rigid printed circuit board layer 10B'' and the first part of the rigid printed circuit board layer 10B', so that the flexible printed circuit board layer 10A protruding from the first part of the rigid printed circuit board layer 10B' or protruding from the second part of the rigid printed circuit board layer 10B'' can be reduced.

[0198] Refer to the S position in the attached Figure 10 Further, the second part of the flexible printed circuit board layer 10A'' near the end of the bent portion 12 close to the chip connection portion 11 is separably connected to the second part of the rigid printed circuit board layer 10B'', which is beneficial to reducing the length of the flexible printed circuit board layer 10A between the bent portion 12 and the chip connection portion 11, and thus beneficial to reducing the area size of the printed circuit board 10 after assembly.

[0199] Further, the first part of the flexible printed circuit board layer 10A' near the end of the chip connection portion 11 close to the bent portion 12 is separably connected to the first part of the rigid printed circuit board layer 10B', which is beneficial to reducing the length of the flexible printed circuit board layer 10A between the bent portion 12 and the chip connection portion 11, and thus beneficial to reducing the area size of the printed circuit board 10 after assembly.

[0200] More specifically, the bent portion 12 includes a first partial bent portion 12A and a second partial bent portion 12B, wherein the first partial bent portion 12A extends over the second partial bent portion 12B and the first partial bent portion 12A is closer to the chip connection portion 11 than the second bent portion 12B.

[0201] The chip connection portion 11 includes a first partial chip connection portion 11A and a second partial chip connection portion 11B, wherein the first partial chip connection portion 11A extends over the second partial chip connection portion 11B and the second partial chip connection portion 11B is closer to the bent portion 12 than the first partial chip connection portion 11A.

[0202] The first partial bent portion 12A includes at least part of the flexible circuit board layer 10A and at least part of the rigid circuit board layer 10B. More specifically, the first partial bent portion 12A includes at least part of the second partial rigid circuit board layer 10B" and the portion of the second partial flexible circuit board layer 10A" that overlaps the second partial rigid circuit board layer 10B". The second partial bent portion 12B includes at least the second partial rigid circuit board layer 10B" and the portion of the second partial flexible circuit board layer 10A" that overlaps the second rigid circuit board layer 10B", wherein the portion of the second partial rigid circuit board layer 10B" of the first partial bent portion 12A is separably connected to the portion of the second partial flexible circuit board layer 10A".

[0203] The first partial chip connection portion 11A includes at least part of the flexible circuit board layer 10A and at least part of the rigid circuit board layer 10B. More specifically, the first partial chip connection portion 11A includes at least part of the first partial rigid circuit board layer 10B' and the portion of the first partial flexible circuit board layer 10A' that overlaps the first partial rigid circuit board layer 10B'. The second partial chip connection portion 11B includes at least the first partial rigid circuit board layer 10B' and the portion of the first partial flexible circuit board layer 10A' that overlaps the first partial rigid circuit board layer 10B', wherein the portion of the first partial rigid circuit board layer 10B' of the second partial chip connection portion 11B is separably connected to the portion of the first partial flexible circuit board layer 10A'.

[0204] Furthermore, when the bent portion 12 is flipped relative to the chip connection portion 11, the flexible circuit board layer 10A portions of the adjacent second partial chip connection portion 11B and the first partial bent portion 12A can be separated from the corresponding rigid circuit board layer 10B portions, which is conducive to reducing the size of the circuit board 10.

[0205] Refer to the appendix Figure 11As shown, a modified embodiment of the circuit board 10 according to the above-mentioned preferred embodiment of the present invention.

[0206] The circuit board 10 includes a flexible circuit board layer 10A and a rigid circuit board layer 10B, wherein the rigid circuit board layer 10B is disposed on a front surface of the flexible circuit board layer 10A.

[0207] The circuit board 10 further includes a chip connection portion 11, a bending portion 12, a lens assembly connection portion 13, and a connection belt connection portion 14. The chip connection portion 11 is used to connect to a photosensitive chip. The bending portion 12 is flip-connectably connected to the chip connection portion 11. The lens assembly connection portion 13 is adapted to connect to a periscope lens assembly of a periscope camera module. The connection belt connection portion is adapted to connect to a connection belt. The lens assembly connection portion 13 is flip-connectably connected to the chip connection portion 11, and the connection belt connection portion 14 is flip-connectably connected to the chip connection portion 11.

[0208] More specifically, the bending portion 12 is located between the chip connection portion 11 and the lens assembly connection portion 13. The two sides of the bending portion 12 are respectively connected to the chip connection portion 11 and the lens assembly connection portion 13. The connection belt connection portion 14 is connected to one side of the chip connection portion 11, such that the circuit board 10 is an L-shaped structure.

[0209] The bending portion 12 has a first edge 121, a second edge 122, a third edge 123, and a fourth edge 124. The first edge 121 is respectively connected to the second edge 122 and the fourth edge 124. The second edge 122 is respectively connected to the first edge 121 and the third edge 123. The third edge 123 is respectively connected to the second edge 122 and the fourth edge 124. The first edge 121 and the third edge 123 are oppositely disposed, and the second edge 122 and the fourth edge 124 are oppositely disposed.

[0210] The chip connection portion 11 extends along the fourth edge 124 of the bending portion 12. The connection belt connection portion 14 extends along one side of the chip connection portion 11. The lens assembly connection portion 13 extends along the second edge 122 of the bending portion 12. Preferably, the chip connection portion 11, the bending portion 12, and the lens assembly connection portion 13 are located on the same straight line. Further, the connection belt connection portion 14 is perpendicular to the straight line where the chip connection portion 11, the bending portion 12, and the lens assembly connection portion 13 are located.

[0211] Further, the flexible printed circuit board layer 10A includes a first partial flexible printed circuit board layer 10A', a second partial flexible printed circuit board layer 10A", a third partial flexible printed circuit board layer 10A"', and a fourth partial flexible printed circuit board layer 10A"". The first partial flexible printed circuit board layer 10A' and the third partial flexible printed circuit board layer 10A"' are respectively connected to the second partial flexible printed circuit board layer 10A". The first partial flexible printed circuit board layer 10A', the second partial flexible printed circuit board layer 10A", and the third partial flexible printed circuit board layer 10A"' are located on the same straight line. The fourth partial flexible printed circuit board layer 10A"" extends outward from the first partial flexible printed circuit board layer 10A'.

[0212] The rigid printed circuit board layer 10B includes a first partial rigid printed circuit board layer 10B', a second partial rigid printed circuit board layer 10B", a third partial rigid printed circuit board layer 10B"', and a fourth partial rigid printed circuit board layer 10B"". The first partial rigid printed circuit board layer 10B', the second partial rigid printed circuit board layer 10B", the third partial rigid printed circuit board layer 10B"', and the fourth partial rigid printed circuit board layer 10B"" are spaced apart and disposed on the flexible printed circuit board layer 10A.

[0213] The chip connection portion 11 includes the first partial rigid printed circuit board layer 10B' and the portion of the first partial flexible printed circuit board layer 10A' of the flexible printed circuit board layer 10A that overlaps the first partial rigid printed circuit board layer 10B'. The bending portion 12 includes the second partial rigid printed circuit board layer 10B" and the portion of the second partial flexible printed circuit board layer 10A" of the flexible printed circuit board layer 10A that overlaps the second partial rigid printed circuit board layer 10B". The lens assembly connection portion 13 includes the third partial rigid printed circuit board layer 10B"' and the portion of the third partial flexible printed circuit board layer 10A"' of the flexible printed circuit board layer 10A that overlaps the third partial rigid printed circuit board layer 10B"'. The connection belt connection portion 14 includes the fourth partial rigid printed circuit board layer 10B"" and the portion of the fourth partial flexible printed circuit board layer 10A"" of the flexible printed circuit board layer 10A that overlaps the fourth partial rigid printed circuit board layer 10B"".

[0214] It can be understood that in some other examples of the present invention, the connection belt connection portion 14 may include at least a part of the flexible printed circuit board layer 10A.

[0215] Further reference is made to the appendix Figure 12The circuit board 10 is mounted on a lens holder 30 of the periscope camera module 1000. The photosensitive chip 40 is mounted on the front side of the chip connection portion 11 of the circuit board 10, that is, on the side where the rigid circuit board layer 10B is located.

[0216] The bent portion 12 is folded to the back side of the chip connection portion 11, the lens assembly connection portion 13 is folded forward to be connected to a periscope lens assembly 20 of the periscope camera module 1000, and the connection belt connection portion 14 connected to the bent portion 12 is folded outward and connected to a connection belt 50, so as to be adapted to be connected to an electronic device body in a subsequent installation process.

[0217] It can be understood that the back side here refers to the side opposite to the side where the photosensitive chip 40 is mounted.

[0218] When the bent portion 12 is folded to the back side of the chip connection portion 11, the size of the flexible circuit board layer 10A part between the bent portion 12 and the chip connection portion 11 can be reduced. Specifically, when the bent portion 12 is folded, the second part of the rigid circuit board layer 10B" of the bent portion 12 and the first part of the rigid circuit board layer 10B' of the chip connection portion 11 are respectively located on the outside, so that the second part of the flexible circuit board layer 10A" part overlapping the second part of the rigid circuit board layer 10B" and the first part of the flexible circuit board layer 10A' part overlapping the first part of the rigid circuit board layer 10B' do not need to avoid the second part of the rigid circuit board layer 10B" and the first part of the rigid circuit board layer 10B', so that the flexible circuit board layer 10A part protruding from the first part of the rigid circuit board layer 10B' or protruding from the second part of the rigid circuit board layer 10B" can be reduced.

[0219] Refer to the S position in the attached Figure 12 Further, the second part of the flexible circuit board layer 10A" part near the chip connection portion 11 of the bent portion 12 is detachably connected to the second part of the rigid circuit board layer 10B", which is beneficial to reducing the length of the flexible circuit board layer 10A between the bent portion 12 and the chip connection portion 11, and thus beneficial to reducing the area size of the circuit board 10 after assembly.

[0220] Further, a portion of the first part of the flexible circuit board layer 10A' located near one end of the chip connection portion 11 close to the bending portion 12 is separably connected to the first part of the rigid circuit board layer 10B', which is beneficial to reducing the length of the flexible circuit board layer 10A between the bending portion 12 and the chip connection portion 11, and thus beneficial to reducing the area size of the circuit board 10 after assembly.

[0221] More specifically, the bending portion 12 includes a first part of the bending portion 12A and a second part of the bending portion 12B, wherein the first part of the bending portion 12A extends from the second part of the bending portion 12B and the first part of the bending portion 12A is closer to the chip connection portion 11 than the second part of the bending portion 12.

[0222] The chip connection portion 11 includes a first part of the chip connection portion 11A and a second part of the chip connection portion 11B, wherein the first part of the chip connection portion 11A extends from the second part of the chip connection portion 11B and the second part of the chip connection portion 11B is closer to the bending portion 12 than the first part of the chip connection portion 11A.

[0223] The first part of the bending portion 12A includes at least part of the flexible circuit board layer 10A and at least part of the rigid circuit board layer 10B. More specifically, the first part of the bending portion 12A includes at least part of the second part of the rigid circuit board layer 10B" and the part of the second part of the flexible circuit board layer 10A" overlapping the second part of the rigid circuit board layer 10B". The second part of the bending portion 12B includes at least the second part of the rigid circuit board layer 10B" and the part of the second part of the flexible circuit board layer 10A" overlapping the second rigid circuit board layer 10B". Among them, the part of the second part of the rigid circuit board layer 10B" of the first part of the bending portion 12A is separably connected to the part of the second part of the flexible circuit board layer 10A".

[0224] The first part of the chip connection portion 11A includes at least part of the flexible circuit board layer 10A and at least part of the rigid circuit board layer 10B. More specifically, the first part of the chip connection portion 11A includes at least part of the first part of the rigid circuit board layer 10B' and the part of the first part of the flexible circuit board layer 10A' overlapping the first part of the rigid circuit board layer 10B'. The second part of the chip connection portion 11B includes at least the first part of the rigid circuit board layer 10B' and the part of the first part of the flexible circuit board layer 10A' overlapping the first part of the rigid circuit board layer 10B'. Among them, the part of the first part of the rigid circuit board layer 10B' of the second part of the chip connection portion 11B is separably connected to the part of the first part of the flexible circuit board layer 10A'.

[0225] Furthermore, when the bending portion 12 is flipped relative to the chip connection portion 11, the soft circuit board layer 10A portions of the adjacent second partial chip connection portion 11B and the first partial bending portion 12A can be separated from the corresponding hard circuit board layer 10B portions, which is conducive to reducing the size of the circuit board 10.

[0226] Further, when the connection belt connection portion 14 is folded, the soft circuit board layer 10A portion between the connection belt connection portion 14 and the chip connection portion 11 can not protrude from the chip connection portion 11. That is to say, the lowest point of the circuit board 10 in the height direction can be determined by the size of the chip connection portion 11, and the connection belt connection portion 14 can have no influence on it.

[0227] After the circuit board 10 is installed, the bending portion 12 and the chip connection portion 11 are arranged face to face, and the connection belt connection portion 14 is wound around the back side of the bending portion 12. The dimensions of the bending portion 12 and the connection belt connection portion 14 in the height direction can both be smaller than those of the chip connection portion 11, which is conducive to reducing the size of the circuit board 10 after installation, especially the height dimension.

[0228] Appendix Figure 13 FIG. shows the electronic device 1 according to a preferred embodiment of the present invention, wherein the electronic device 1 includes the periscope camera module 1000 and an electronic device body 2000, and the periscope camera module 1000 is disposed on the electronic device body 2000. Optionally, the connection belt connection portion 14 of the circuit board 10 of the periscope camera module 1000 is conductively connected to the electronic device body 2000. Optionally, the connection belt connection portion 14 of the circuit board 10 of the periscope camera module 1000 is plugged into the electronic device body 2000. A connection belt 50 is installed on the connection belt connection portion 14, so that the periscope camera module 1000 can be electrically connected to the electronic device body 2000 through the connection belt 50.

[0229] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the drawings are only examples and do not limit the present invention. The object of the present invention has been fully and effectively achieved. The functions and structural principles of the present invention have been shown and described in the embodiments, and the embodiments of the present invention can have any deformation or modification without departing from the principle.

Claims

1. A circuit board is applied to a periscope camera module, and is characterized in that, The circuit board includes: A rigid circuit board layer, wherein the rigid circuit board layer includes a first part of the rigid circuit board layer; A flexible circuit board layer, wherein the rigid circuit board layer is disposed on a front side of the flexible circuit board layer, wherein the flexible circuit board layer includes a first part of the flexible circuit board layer and a second part of the flexible circuit board layer, and wherein the first part of the flexible circuit board layer extends over the second part of the flexible circuit board layer; A chip connection portion, wherein the chip connection portion includes the first part of the rigid circuit board layer and a portion of the first part of the flexible circuit board layer that overlaps the first part of the rigid circuit board layer; and A bending portion, wherein the bending portion includes at least a part of the second part of the flexible circuit board layer, and wherein the bending portion is flip - reversibly connected to the chip connection portion; Wherein, the rigid circuit board layer further includes a second part of the rigid circuit board layer, and wherein the bending portion includes the second part of the rigid circuit board layer and a portion of the second part of the flexible circuit board layer that overlaps the second part of the rigid circuit board layer, and both the first part of the rigid circuit board layer and the second part of the rigid circuit board layer are on the same side of the flexible circuit board layer; Wherein, when the bending portion is folded to a back side of the chip connection portion, a bent portion of the flexible circuit board layer located between the bending portion and the chip connection portion does not protrude from the rigid circuit board layer; The flexible circuit board layer has an L - shaped structure, and wherein the first part of the flexible circuit board layer is located at a corner position; The flexible circuit board layer further includes a third part of the flexible circuit board layer and a fourth part of the flexible circuit board layer, the fourth part of the flexible circuit board layer extends over the second part of the flexible circuit board layer, the second part of the flexible circuit board layer is located between the fourth part of the flexible circuit board layer and the first part of the flexible circuit board layer, and the first part of the flexible circuit board layer, the second part of the flexible circuit board layer, and the fourth part of the flexible circuit board layer are on the same straight line, the first part of the flexible circuit board layer and the third part of the flexible circuit board layer are on the same straight line, or, the first part of the flexible circuit board layer and the third part of the flexible circuit board layer are respectively connected to the second part of the flexible circuit board layer, and wherein the first part of the flexible circuit board layer, the second part of the flexible circuit board layer, and the third part of the flexible circuit board layer are on the same straight line, and the fourth part of the flexible circuit board layer extends outward from the first part of the flexible circuit board layer; The circuit board further includes a lens assembly connection portion, the rigid circuit board layer further includes a third part of the rigid circuit board layer, and wherein the lens assembly connection portion includes the third part of the rigid circuit board layer and a third part of the flexible circuit board layer that overlaps the third part of the rigid circuit board layer; The circuit board further includes a connection band connection portion, and the connection band connection portion includes at least a part of the fourth part of the flexible circuit board layer; The chip connection portion is adapted to be electrically connected to a photosensitive chip of the periscope camera module, the lens assembly connection portion is adapted to be electrically connected to a periscope lens assembly of the periscope camera module, and the connection tape connection portion is adapted to be electrically connected to a connection tape.

2. The circuit board according to claim 1, wherein a portion of the first soft circuit board layer of the chip connection portion located at one end close to the bending portion is separably connected to the first hard circuit board layer.

3. The circuit board according to claim 1, wherein a portion of the second soft circuit board layer of the bending portion located at one end close to the chip connection portion is separably connected to the second hard circuit board layer.

4. The circuit board according to claim 3, wherein a portion of the first soft circuit board layer of the chip connection portion located at one end close to the bending portion is separably connected to the first hard circuit board layer.

5. The circuit board according to any one of claims 1 to 4, wherein the third soft circuit board layer is connected to the first soft circuit board layer through the second soft circuit board layer, wherein the chip connection portion, the bending portion, and the lens assembly connection portion are located on the same straight line, and the lens assembly connection portion is flip-ably connected to the bending portion.

6. The circuit board according to any one of claims 1 to 4, wherein the first soft circuit board layer has a first side edge and a second side edge, the first side edge and the second side edge are adjacent, the second soft circuit board layer and the third soft circuit board layer respectively extend along the first side edge and the second side edge, the bending portion and the lens assembly connection portion are respectively located on two adjacent sides of the chip connection portion, and the lens assembly connection portion is flip-ably connected to the chip connection portion.

7. The circuit board according to any one of claims 1 to 4, wherein the fourth soft circuit board layer extends along the chip connection portion, and the extending direction of the fourth soft circuit board layer is perpendicular to the extending direction from the chip connection portion to the bending portion, and the connection tape connection portion is flip-ably connected to the chip connection portion.

8. The circuit board according to claim 5, wherein the fourth soft circuit board layer extends along the chip connection portion, and the extending direction of the fourth soft circuit board layer is perpendicular to the extending direction from the chip connection portion to the bending portion, and the connection tape connection portion is flip-ably connected to the chip connection portion.

9. The circuit board according to any one of claims 1 to 4, wherein the fourth soft circuit board layer extends along the bending portion, and the extending direction of the fourth soft circuit board layer is perpendicular to the extending direction from the chip connection portion to the bending portion.

10. The circuit board according to claim 6, wherein the fourth soft circuit board layer extends along the bending portion, and the extending direction of the fourth soft circuit board layer is perpendicular to the extending direction from the chip connection portion to the bending portion.

11. The circuit board according to claim 3 or 4, wherein the circuit board further comprises a reinforcement member, and the reinforcement member is disposed at the bent portion to fix the second portion of the flexible circuit board layer of the bent portion at one end away from the chip connection portion to the second portion of the rigid circuit board layer.

12. A circuit board panel, characterized in that, Comprising: A plurality of circuit boards according to any one of claims 1 to 11, wherein the circuit board layout comprises the flexible circuit board layer and a plurality of the rigid circuit board layers, and a rigid circuit board layer and a corresponding portion of the flexible circuit board layer form a single circuit board.

13. A periscope camera module, characterized in that, Comprising: A periscope lens assembly; and A photosensitive component, wherein the photosensitive component comprises a lens holder, a photosensitive chip and a circuit board, the periscope lens assembly is held in a photosensitive path of the photosensitive chip through the lens holder, the photosensitive chip is conductively connected to the circuit board, and the circuit board comprises: A rigid circuit board layer, wherein the rigid circuit board layer comprises a first portion of the rigid circuit board layer; A flexible circuit board layer, wherein the flexible circuit board layer comprises a first portion of the flexible circuit board layer and a second portion of the flexible circuit board layer, and the first portion of the flexible circuit board layer extends over the second portion of the flexible circuit board layer; A chip connection portion, wherein the chip connection portion comprises the first portion of the rigid circuit board layer and a portion of the first portion of the flexible circuit board layer overlapping the first portion of the rigid circuit board layer; and A bent portion, wherein the bent portion comprises at least a portion of the second portion of the flexible circuit board layer, the bent portion is flip-connectably connected to the chip connection portion, the photosensitive chip connection portion is mounted on a front surface of the chip connection portion, the bent portion is folded to a back side of the photosensitive chip connection portion, and the bent portion of the flexible circuit board layer between the bent portion and the chip connection portion does not protrude from the rigid circuit board layer; Wherein, the rigid circuit board layer further comprises a second portion of the rigid circuit board layer, the bent portion comprises the second portion of the rigid circuit board layer and a portion of the second portion of the flexible circuit board layer overlapping the second portion of the rigid circuit board layer, and both the first portion of the rigid circuit board layer and the second portion of the rigid circuit board layer are on the same side of the flexible circuit board layer; The flexible circuit board layer has an L-shaped structure, and the first portion of the flexible circuit board layer is located at a corner position; The flexible printed circuit board layer further includes a third partial flexible printed circuit board layer and a fourth partial flexible printed circuit board layer. The fourth partial flexible printed circuit board layer extends from the second partial flexible printed circuit board layer. The second partial flexible printed circuit board layer is located between the fourth partial flexible printed circuit board layer and the first partial flexible printed circuit board layer. And the first partial flexible printed circuit board layer, the second partial flexible printed circuit board layer, and the fourth partial flexible printed circuit board layer are located on the same straight line. The first partial flexible printed circuit board layer and the third partial flexible printed circuit board layer are located on the same straight line. Or, the first partial flexible printed circuit board layer and the third partial flexible printed circuit board layer are respectively connected to the second partial flexible printed circuit board layer, wherein the first partial flexible printed circuit board layer, the second partial flexible printed circuit board layer, and the third partial flexible printed circuit board layer are located on the same straight line, and the fourth partial flexible printed circuit board layer extends outward from the first partial flexible printed circuit board layer; The circuit board further includes a lens assembly connection portion. The rigid printed circuit board layer further includes a third partial rigid printed circuit board layer. Wherein the lens assembly connection portion includes the third partial rigid printed circuit board layer and the third partial flexible printed circuit board layer overlapping the third partial rigid printed circuit board layer; The circuit board further includes a connection belt connection portion. The connection belt connection portion includes at least a part of the fourth partial flexible printed circuit board layer; The photosensitive chip is mounted on the side of the first partial rigid printed circuit board layer of the chip connection portion of the circuit board. The lens assembly connection portion is connected to the periscope lens assembly. The connection belt connection portion is connected to a connection belt.

14. The periscope imaging module according to claim 13, wherein a part of the first partial flexible printed circuit board layer of the chip connection portion located at one end close to the bending portion is detachably connected to the first partial rigid printed circuit board layer.

15. The periscope imaging module according to claim 13, wherein a part of the second partial flexible printed circuit board layer of the bending portion located at one end close to the chip connection portion is detachably connected to the second partial rigid printed circuit board layer.

16. The periscope imaging module according to claim 15, wherein a part of the first partial flexible printed circuit board layer of the chip connection portion located at one end close to the bending portion is detachably connected to the first partial rigid printed circuit board layer.

17. The periscope imaging module according to any one of claims 13 to 16, wherein the third partial flexible printed circuit board layer is connected to the first partial flexible printed circuit board layer through the second partial flexible printed circuit board layer. Wherein the chip connection portion, the bending portion, and the lens assembly connection portion are located on the same straight line. And the lens assembly connection portion is flipped relative to the chip connection portion and is connected to the periscope lens assembly.

18. The periscope camera module according to any one of claims 13 to 16, wherein the first flexible printed circuit board layer has a first side edge and a second side edge, the first side edge and the second side edge are adjacent, the second flexible printed circuit board layer and the third flexible printed circuit board layer respectively extend along the first side edge and the second side edge, the bending portion and the lens assembly connection portion are respectively located on two adjacent sides of the chip connection portion, and the lens assembly connection portion is flipped relative to the chip connection portion and connected to the periscope lens assembly.

19. The periscope camera module according to any one of claims 13 to 16, wherein the fourth flexible printed circuit board layer extends along the chip connection portion, and the extending direction of the fourth flexible printed circuit board layer is perpendicular to the extending direction from the chip connection portion to the bending portion, and the connection belt connection portion is flipped to the back side of the chip connection portion.

20. The periscope camera module according to claim 19, wherein the fourth flexible printed circuit board layer extends along the chip connection portion, and the extending direction of the fourth flexible printed circuit board layer is perpendicular to the extending direction from the chip connection portion to the bending portion, and the connection belt connection portion is flipped to the back side of the chip connection portion.

21. The periscope camera module according to any one of claims 13 to 16, wherein the fourth flexible printed circuit board layer extends along the bending portion, and the extending direction of the fourth flexible printed circuit board layer is perpendicular to the extending direction from the chip connection portion to the bending portion, and the connection belt connection portion is flipped to the back side of the chip connection portion.

22. The periscope camera module according to claim 18, wherein the fourth flexible printed circuit board layer extends along the bending portion, and the extending direction of the fourth flexible printed circuit board layer is perpendicular to the extending direction from the chip connection portion to the bending portion, and the connection belt connection portion is flipped to the back side of the chip connection portion.

23. The periscope camera module according to claim 15 or 16, wherein the circuit board further includes a reinforcement member, and the reinforcement member is disposed at the bending portion to fix the second flexible printed circuit board layer at one end far from the chip connection portion to the second rigid printed circuit board layer.

24. An electronic device, characterized in that, Comprising: An electronic device body; And The periscope camera module according to any one of claims 13 to 23, wherein the periscope camera module is disposed on the electronic device body.

25. The electronic device according to claim 24, further comprising a connection belt, wherein the connection belt is mounted on the circuit board of the periscope camera module, and the periscope camera module is electrically connected to the electronic device body through the connection belt.

26. The mounting method of a circuit board according to claim 1, characterized in that, Comprising the following steps: Mount a photosensitive chip on a front surface of the chip connection portion of the circuit board; Fix the chip connection portion to a lens holder of a periscope camera module; and Flip the bending portion of the circuit board to the back side of the chip connection portion.

27. The installation method according to claim 26 further comprises the following steps: Flipping a lens assembly connection portion of the circuit board to be connected to a periscope lens assembly of the periscope camera module, wherein the flexible circuit board layer further comprises a third partial flexible circuit board layer, wherein the first partial flexible circuit board layer has a first side edge and a second side edge, wherein the first side edge and the second side edge are adjacent, the second partial flexible circuit board layer and the third partial flexible circuit board layer respectively extend from the first side edge and the second side edge, wherein the circuit board further comprises a lens assembly connection portion, and wherein the lens assembly connection portion comprises at least a part of the third partial flexible circuit board layer.

28. The installation method according to claim 26 further comprises the following steps: Flipping a lens assembly connection portion of the circuit board to be connected to a periscope lens assembly of the periscope camera module, wherein the flexible circuit board layer further comprises a third partial flexible circuit board layer, wherein the third partial flexible circuit board layer is connected to the first partial flexible circuit board layer through the second partial flexible circuit board layer, wherein the first partial flexible circuit board layer, the second partial flexible circuit board layer and the third partial flexible circuit board layer are located on the same straight line, wherein the circuit board further comprises a lens assembly connection portion, and the lens assembly connection portion comprises at least a part of the third partial flexible circuit board layer.

29. The installation method according to any one of claims 26 to 28, wherein after the bending portion is flipped, at least a part of the flexible circuit board layer located at the bending portion and near one end of the chip connection portion is separated from the first partial rigid circuit board layer.

30. The installation method according to any one of claims 26 to 28, wherein after the bending portion is flipped, at least a part of the flexible circuit board layer located at the chip connection portion and near one end of the bending portion is separated from the second partial rigid circuit board layer.

31. The installation method according to any one of claims 26 to 28, wherein after the bending portion is flipped, the bent part of the flexible circuit board layer located between the bending portion and the chip connection portion does not protrude from the first partial rigid circuit board layer or the second partial rigid circuit board layer.

32. The mounting method of a circuit board according to claim 1, characterized in that, Comprising the following steps: Mounting a photosensitive chip on a front surface of the chip connection portion of the circuit board; Fixing the chip connection portion to a lens holder of a periscope camera module; and Flipping a lens assembly connection portion of the circuit board to be connected to a periscope lens assembly of the periscope camera module.

33. The mounting method according to claim 32, wherein the flexible printed circuit board layer further includes a third part of the flexible printed circuit board layer, wherein the first part of the flexible printed circuit board layer has a first side edge and a second side edge, wherein the first side edge and the second side edge are adjacent, the second part of the flexible printed circuit board layer and the third part of the flexible printed circuit board layer respectively extend along the first side edge and the second side edge, and wherein the lens assembly connection portion includes at least a part of the third part of the flexible printed circuit board layer.

34. The mounting method according to claim 32, wherein the flexible printed circuit board layer further includes a third part of the flexible printed circuit board layer, wherein the third part of the flexible printed circuit board layer is connected to the first part of the flexible printed circuit board layer through the second part of the flexible printed circuit board layer, wherein the first part of the flexible printed circuit board layer, the second part of the flexible printed circuit board layer and the third part of the flexible printed circuit board layer are located on the same straight line, and wherein the lens assembly connection portion includes at least a part of the third part of the flexible printed circuit board layer.

35. The mounting method according to any one of claims 32 to 34, further comprising the following steps: Flipping the bent portion of the circuit board to the back side of the chip connection portion.

36. The mounting method of a circuit board according to claim 1, characterized in that, Comprising the following steps: Flipping a lens assembly connection portion of the circuit board to be connected to a periscope lens assembly of a periscope camera module; and Flipping the chip connection portion so that the chip connection portion with a photosensitive chip connection portion is connected to a lens holder of the periscope camera module.

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