Microfluidic actuator

Abstract

A microfluidic actuator includes a substrate, a cavity layer, a vibration layer, a lower electrode layer, a piezoelectric actuation layer, an upper electrode layer, an orifice plate layer, and a flow channel layer. The substrate forms an outflow hole, a first inflow hole, and a second inflow hole through an etching process. The cavity layer is formed on the substrate and forms a fluid storage chamber through an etching process. The vibration layer is formed on the cavity layer. The lower electrode layer is formed on the vibration layer. The piezoelectric actuation layer is formed on the lower electrode layer. The upper electrode layer is formed on the piezoelectric actuation layer. The orifice plate layer forms an outflow port and an inflow port through an etching process. The flow channel layer is formed on the orifice plate layer, forms an outflow channel and an inflow channel through a photolithography process, and is bonded to the substrate. A driving power supply is provided to the upper electrode layer and the lower electrode layer to drive and control the vibration layer to generate an up-and-down displacement to complete fluid transmission.

Description

[Technical field]

[0001] This case relates to an actuator, and more particularly to a microfluidic actuator made using a micro-electromechanical semiconductor film. [Background technology]

[0002] At present, in various fields, whether it is medicine, computer technology, printing, energy and other industries, products are developing in the direction of refinement and miniaturization. Among them, fluid actuators contained in products such as micro pumps, sprayers, inkjet heads, industrial printing devices, etc. are their key technologies.

[0003] With the rapid development of technology, the application of fluid delivery structures is becoming more and more diversified, including industrial applications, biomedical applications, healthcare, electronic cooling, etc., and even the recently popular wearable devices can all be seen. It can be seen that traditional fluid actuators have gradually tended towards device miniaturization and flow maximization.

[0004] In the prior art, although there are microfluidic actuators made using micro-electromechanical processes, the displacement of the piezoelectric layer of the known microfluidic actuators is too small when they are actuated, resulting in insufficient flow rate. Therefore, how to break through the technical bottleneck through innovative structures is an important part of development. [Summary of the invention]

[0005] The main purpose of this case is to provide a microfluidic actuator that is made using a micro-electromechanical semiconductor process and can transmit fluid. The microfluidic actuator of this case is made using a semiconductor film, and the depth of its fluid storage chamber can be designed to be very shallow, thereby increasing the fluid compression ratio during actuation to compensate for the disadvantage of too small displacement of the piezoelectric layer.

[0006] A general implementation of the present case is a microfluidic actuator, comprising a substrate, a cavity layer, a vibration layer, a lower electrode layer, a piezoelectric actuation layer, an upper electrode layer, an orifice plate layer and a flow channel layer. The substrate has a first surface and a second surface, and an outlet groove, two inlet grooves, an outflow hole, a plurality of first inflow holes and two second inflow holes are formed by an etching process. The outlet groove is connected to the outflow hole. Each inlet groove is connected to a portion of the plurality of first inflow holes and the corresponding second inflow holes. The inlet grooves are symmetrically arranged on both sides of the outlet groove. The plurality of first inflow holes are symmetrically arranged on both sides of the outflow hole. The second inflow holes are symmetrically arranged on both sides of the outflow hole and at one end of the plurality of first inflow holes. The cavity layer is formed on the first surface of the substrate by a deposition process, and a storage chamber is formed by an etching process. The storage chamber is connected to the outflow hole, the plurality of first inflow holes and the second inflow hole. The vibration layer is formed on the cavity layer by a deposition process. The lower electrode layer is formed on the vibration layer by a deposition process and an etching process. The piezoelectric actuation layer is formed on the lower electrode layer by a deposition process and an etching process. The upper electrode layer is formed on the piezoelectric actuation layer by a deposition process and an etching process. The orifice layer is formed by an etching process to form an outlet and two inlets. The inlets are symmetrically arranged on both sides of the outlet. The flow channel layer is formed on the orifice layer by a dry film material rolling process, an outlet channel, two inlet channels and a plurality of columnar structures are formed by a photolithography process, and the flow channel layer is bonded to the second surface of the substrate by a flip chip alignment process and a hot pressing process. The inlet channels are symmetrically arranged on both sides of the outlet channel. The plurality of columnar structures are symmetrically arranged on both sides of the outlet channel. The outlet of the orifice layer is connected to the outlet groove of the substrate through the outlet channel. The inlet of the orifice layer is connected to the inlet groove of the substrate through the inlet channel. A driving power source with different phase charges is provided to the upper electrode layer and the lower electrode layer to drive and control the vibration layer to produce up and down displacement, so that the fluid is sucked in from the inlet, flows to the flow storage chamber through multiple first inlet holes and second inlet holes, and is finally squeezed through the outlet holes and discharged from the outlet to complete the fluid transmission.

Brief Description of the Drawings

[0007] Figure 1 It is a cross-sectional schematic diagram of the first embodiment of the microfluidic actuator of the present invention.

[0008] Figure 2A Figure 2K is a schematic diagram of the decomposition of the manufacturing steps of the first embodiment of the present invention.

[0009] Figure 3 It is a schematic top view of the first embodiment of the present invention.

[0010] Figure 4 It is a bottom view schematically showing the first embodiment of the present invention.

[0011] FIG. 5A to FIG. 5C It is a schematic diagram of the etching steps of the inlet hole according to the first embodiment of the present invention.

[0012] FIG. 6A to FIG. 6B It is a schematic diagram of the operation of the first embodiment of this case.

[0013] Figure 7 It is a cross-sectional schematic diagram of the second embodiment of the microfluidic actuator of the present invention.

[0014] Figure 8 It is a bottom view schematic diagram of other embodiments of the present case. [Specific implementation method]

[0015] Some typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various variations in different aspects without departing from the scope of the present invention, and the descriptions and illustrations therein are essentially for illustrative purposes rather than for limiting the present invention.

[0016] The microfluidic actuator in this case is used to transport fluids. Figure 1 In the present embodiment,

[0017] The microfluidic actuator 100 includes: a substrate 1a, a cavity layer 1b, a vibration layer 1c, a lower electrode layer 1d, a piezoelectric actuation layer 1e, an upper electrode layer 1f, an orifice layer 1h, and a flow channel layer 1i. The flow channel layer 1i, the orifice layer 1h, the substrate 1a, the cavity layer 1b, the vibration layer 1c, the lower electrode layer 1d, the piezoelectric actuation layer 1e, and the upper electrode layer 1f are stacked and combined in sequence to form a whole, and the structure is described as follows. In the first embodiment of the present case, the microfluidic actuator 100 includes an actuation unit 10.

[0018] See also Figure 2AIn the first embodiment of the present case, the substrate 1a is a silicon substrate. The substrate 1a has a first surface 11a and a second surface 12a opposite to the first surface 11a. In the first embodiment of the present case, the cavity layer 1b is formed on the first surface 11a of the substrate 1a by a silicon dioxide material deposition process. The deposition process can be a physical vapor deposition process (PVD), a chemical vapor deposition process (CVD) or a combination of the two, but not limited thereto. In the first embodiment of the present case, the vibration layer 1c is formed on the cavity layer 1b by a silicon nitride material deposition process. In the first embodiment of the present case, the lower electrode layer 1d is formed on the vibration layer 1c by a metal material deposition process. The lower electrode layer 1d is a platinum metal material or a titanium metal material, but not limited thereto. In the first embodiment of the present case, the piezoelectric actuation layer 1e is formed on the lower electrode layer 1d by a piezoelectric material deposition process. In the first embodiment of the present case, the upper electrode layer 1f is formed on the piezoelectric actuation layer 1e by a metal material deposition process, and the upper electrode layer 1f is a gold metal material or an aluminum metal material, but not limited thereto. It is worth noting that, Figure 2A The structure shown can be manufactured using existing foundry technology and therefore has the advantage of low cost.

[0019] See also Figure 2B In the first embodiment of the present case, the lower electrode layer 1d, the piezoelectric actuation layer 1e and the upper electrode layer 1f are etched by a photolithography etching process to define an active area M. It is worth noting that in the first embodiment of the present case, the etching process can be a wet etching process, a dry etching process or a combination of the two, but is not limited thereto.

[0020] See also Figure 2C In the first embodiment of the present invention, the second surface 12a of the substrate 1a is etched by a dry etching process to form an outlet groove 13a and two inlet grooves 14a. The outlet groove 13a and the inlet groove 14a have the same etching depth, and the etching depth is etched between the first surface 11a and the second surface 12a and does not contact the cavity layer 1b. The inlet grooves 14a are symmetrically arranged on both sides of the inlet groove 13a.

[0021] See also Figure 2D and Figure 2EIn the first embodiment of the present case, a mask layer 1g is formed on the second surface 12a of the substrate 1a, and in the outlet groove 13a and the inlet groove 14a through a silicon dioxide material deposition process. The mask layer 1g is then formed into a first flow hole 11g in the outlet groove 13a through a precision perforation process, and a plurality of second flow holes 12g and a third flow hole 13g are formed in the inlet groove 14a. In the first embodiment of the present case, the aperture of the first flow hole 11g is larger than the aperture of the third flow hole 13g, and the aperture of the third flow hole 13g is larger than the aperture of each second flow hole 12g, but not limited thereto. The perforation depth of the first flow hole 11g, the plurality of second flow holes 12g, and the third flow hole 13g is until they contact with the substrate 1a, so that the substrate 1a is exposed. In the first embodiment of the present case, the precision perforation process is an excimer laser processing process, but not limited thereto.

[0022] See also Figure 2E , Figure 2F and Figure 3 In the first embodiment of the present case, the substrate 1a is etched by a low-temperature deep etching process to form a discharge hole 15a, a plurality of first inlet holes 16a and two second inlet holes 17a of the substrate 1a. The discharge hole 15a is formed by etching along the first flow hole 11g until it contacts the cavity layer 1b, the plurality of first inlet holes 16a are formed by etching along the plurality of second flow holes 12g until they contact the cavity layer 1b, and the second inlet holes 17a are formed by etching along the third flow holes 13g until they contact the cavity layer 1b. The plurality of first inlet holes 16a are symmetrically arranged on both sides of the discharge hole 15a. The second inlet holes 17a are symmetrically arranged on both sides of the discharge hole 15a and at one end of the plurality of first inlet holes 16a. In the first embodiment of the present case, the low temperature deep etching process is a deep reactive ion etching process (BOSCH Process), but is not limited thereto. Figure 2E and Figure 5AIn the first embodiment of the present case, when the mask layer 1g is formed into the first flow hole 11g, the plurality of second flow holes 12g and the third flow hole 13g by the excimer laser processing process, in order to avoid the deviation of the perforation position or the perforation angle, a buffer distance e is reserved on the side walls of the outlet groove 13a and the inlet groove 14a. In addition, the deep reactive ion etching process (BOSCH Process) is used to etch only the silicon substrate of the substrate 1a, so an over-etching depth t is left on the substrate 1a by the excimer laser processing process, which is beneficial for the substrate 1a to be able to accurately and easily etch from the over-etching depth t to form the outflow hole 15a, the plurality of first inflow holes 16a and the second inflow hole 17a. In the first embodiment of the present case, the minimum aperture of the outflow hole 15a, the plurality of first inflow holes 16a and the second inflow hole 17a is 5 to 50 microns (μm), and the aperture size depends on the properties of the fluid. Please refer to the following. Figure 2F and Figure 5B The outflow hole 15a, each first inflow hole 16a and each second inflow hole 17a have a perforation depth d and a perforation aperture s, and the aspect ratio d / s of the formed hole can reach 40. Considering the appropriate aspect ratio d / s of the hole in the implementation of this processing process can avoid the high temperature generated by the processing, which affects the polarity distribution of the rear-end piezoelectric material and causes a depolarization reaction.

[0023] See also Figure 2E As shown in FIG. 2G, in the first embodiment of the present invention, the cavity layer 1b is further etched by a wet etching process to form a reservoir chamber 11b inside. That is, the etching liquid flows in from the first flow hole 11g, the plurality of second flow holes 12g and the third flow hole 13g, flows to the cavity layer 1b through the outflow hole 15a, the plurality of first inflow holes 16a and the second inflow hole 17a, and then etches and releases the removed portion of the cavity layer 1b, thereby defining a reservoir chamber 11b. In this way, the reservoir chamber 11b is connected to the outflow hole 15a, the plurality of first inflow holes 16a and the second inflow hole 17a. In the first embodiment of the present invention, the wet etching process uses hydrofluoric acid (HF) etching liquid to etch the cavity layer 1b, but is not limited thereto. In the first embodiment of the present invention, the thickness of the cavity layer 1b is 1 to 5 micrometers (μm), but is not limited thereto. It is worth noting that when the reservoir chamber 11b is formed by the wet etching process, the mask layer 1g will also be removed. After the reservoir chamber 11b is formed and the mask layer 1g is removed, the outlet groove 13a of the substrate 1a is connected to the outlet hole 15a, and the inlet groove 14a is respectively connected to the first inlet holes 16a and the second inlet holes 17a. Please refer to Figure 2G and Figure 5CIn the first embodiment of the present case, the wet etching process is usually isotropic etching. In the first embodiment of the present case, when etching the liquid storage chamber 11b, the liquid storage chamber 11b has a cavity depth r, which is equal to the thickness of the cavity layer 1b, and the side etching distance generated by the wet etching is r', so the cavity depth r is equal to the side etching distance r', that is, an isotropic etching. In addition, since the apertures of the outflow hole 15a, each of the first inflow holes 16a, and each of the second inflow holes 17a are only between 5 and 50 microns (μm), and the cavity depth r is only between 1 and 5 microns (μm), an over-etching is required when etching the liquid storage chamber 11b to extend the etching time in order to remove the unetched residual material. In the first embodiment of the present case, when the liquid storage chamber 11b is formed by the wet etching process, an overetching distance L is generated, and the overetching distance L is greater than the side etching distance r', so that the silicon dioxide material within the liquid storage chamber 11b can be completely removed.

[0024] Please refer to FIG. 2H and FIG. 2I. In the first embodiment of the present case, an orifice plate layer 1h is provided, and an outlet 11h and two inlets 12h are etched out of the orifice plate layer 1h through an etching process. The inlets 12h are symmetrically arranged on both sides of the outlet 11h. In the first embodiment of the present case, the etching process of the orifice plate layer 1h can be a wet etching process, a dry etching process or a combination of the two, but is not limited thereto. In the first embodiment of the present case, the orifice plate layer 1h is a stainless steel material or a glass material, but is not limited thereto.

[0025] Please refer to Figures 2J, 2K and Figure 4 In the first embodiment of the present case, the flow channel layer 1i is formed on the orifice plate layer 1h by a dry film material rolling process, and an outlet channel 11i, two inlet channels 12i and a plurality of columnar structures 13i are formed on the flow channel layer 1i by a photolithography process, and the outflow channel 11i is connected to the outlet 11h of the orifice plate layer 1h, and the inlet channels 12i are respectively connected to the inlet 12h of the orifice plate layer 1h. The inlet channels 12i are symmetrically arranged on both sides of the outflow channel 11i. In the first embodiment of the present case, a plurality of columnar structures 13i are formed in the inlet channel 12i in a staggered arrangement (such as Figure 4 ) is used to filter impurities in the fluid. In the first embodiment of the present case, the dry film material is a photosensitive polymer dry film, but it is not limited thereto.

[0026] Please go back Figure 1Finally, the flow channel layer 1i is bonded to the second surface 12a of the substrate 1a through a flip chip alignment and a thermal compression process to form the actuating unit 10 of the microfluidic actuator 100 of the present invention. Thus, the outlet 11h of the orifice layer 1h is connected to the outlet groove 13a of the substrate 1a through the outlet channel 11i of the flow channel layer 1i; and the inlet 12h of the orifice layer 1h is connected to the inlet groove 14a of the substrate 1a through the inlet channel 12i of the flow channel layer 1i.

[0027] See also Fig. 6A and Figure 6B In the first embodiment of the present invention, the specific actuation method of the microfluidic actuator 100 is to provide a driving power source with opposite phase charges to the upper electrode layer 1f and the lower electrode layer 1d to drive and control the vibration layer 1c to generate an upward and downward displacement. Fig. 6A As shown, when a positive voltage is applied to the upper electrode layer 1f and a negative voltage is applied to the lower electrode layer 1d, the piezoelectric actuation layer 1e drives the vibration layer 1c to move in a direction away from the substrate 1a, thereby the external fluid is sucked into the microfluidic actuator 100 through the inlet 12h of the orifice layer 1h, and the fluid entering the microfluidic actuator 100 then passes through the inlet channel 12i of the flow channel layer 1i, the inlet groove 14a of the substrate 1a, and the multiple first inlet holes 16a and second inlet holes 17a of the substrate 1a in sequence, and finally gathers in the storage chamber 11b of the cavity layer 1b. Figure 6B As shown, the electrical properties of the upper electrode layer 1f and the lower electrode layer 1d are then converted, and a negative voltage is applied to the upper electrode layer 1f and a positive voltage is applied to the lower electrode layer 1d. In this way, the vibration layer 1c is displaced toward the direction close to the substrate 1a, so that the volume inside the flow storage chamber 11b is compressed by the vibration layer 1c, so that the fluid collected in the flow storage chamber 11b is able to pass through the outflow hole 15a of the substrate 1a, the outlet groove 13a of the substrate 1a and the outflow channel 11i of the flow channel layer 1i in sequence, and then be discharged from the outlet port 11h of the orifice layer 1h to the outside of the microfluidic actuator 100, thereby completing the fluid transmission.

[0028] It is worth noting that when the microfluidic actuator 100 inhales external fluid, part of the external fluid will be inhaled into the microfluidic actuator 100 through the outlet 11h of the orifice layer 1h. However, since the aperture of the outlet 11h of the orifice layer 1h is smaller than the aperture of the inlet 12h, the amount of external fluid inhaled from the outlet 11h is relatively small. When the microfluidic actuator 100 discharges fluid, the multiple columnar structures 13i of the flow channel layer 1i will have a damping effect on the backflowing fluid. In addition, the second inlet hole 17a of the substrate 1a corresponds to the edge position where the displacement of the piezoelectric actuation layer 1c is the smallest. Therefore, the amount of fluid discharged from the inlet 12h is relatively small.

[0029] Furthermore, it is worth noting that the problem of excessive flow resistance of the plurality of first inlet holes 16 a of the substrate 1 a can be improved by adjusting the voltage waveform or lengthening the actuation time of the microfluidic actuator 100 to absorb the external fluid.

[0030] See also Figure 7 The second embodiment of the present invention is substantially the same as the first embodiment, except that the microfluidic actuator 100' includes two actuating units 10 to increase the flow output.

[0031] See also Figure 8 In other embodiments of the present invention, the microfluidic actuator 100" includes a plurality of actuator units 10. The plurality of actuator units 10 may be arranged in series, in parallel, or in series-parallel to increase the flow output. The arrangement of the plurality of actuator units 10 may be designed according to usage requirements and is not limited thereto.

[0032] It is worth noting that in the first and second embodiments of the present invention, each actuating unit 10 has a symmetrical structure. In other embodiments of the present invention, the structural configuration of each actuating unit 10 can be designed according to usage requirements, and is not limited thereto.

[0033] This case provides a microfluidic actuator, which is mainly completed by micro-electromechanical semiconductor process, and by applying driving power with different phase charges to the upper electrode layer and the lower electrode layer, the vibration layer is displaced up and down, thereby achieving fluid transmission. In this way, the microfluidic actuator can increase the fluid compression ratio during actuation to compensate for the shortcoming of too small displacement of the piezoelectric layer, achieve the feasibility of transmitting fluid and generate great transmission efficiency in an extremely miniaturized structure, which is of great industrial utilization value, and therefore an application is filed in accordance with the law.

[0034] This case can be modified in various ways by those familiar with this technology, but all of them will not deviate from the scope of protection sought by the attached patent application.

[0035]

Explanation of symbols

[0036] 100, 100', 100": Microfluidic Actuators

[0037] 10: Actuation unit

[0038] 1a: Substrate

[0039] 11a: First surface

[0040] 12a: Second surface

[0041] 13a: Exit groove

[0042] 14a: Inlet groove

[0043] 15a: Outflow hole

[0044] 16a: First inlet hole

[0045] 17a: Second inlet hole

[0046] 1b: Cavity layer

[0047] 11b: Reservoir chamber

[0048] 1c: Vibration layer

[0049] 1d: Lower electrode layer

[0050] 1e: Piezoelectric actuation layer

[0051] 1f: Upper electrode layer

[0052] 1g: Mask layer

[0053] 11g: First flow hole

[0054] 12g: Second flow hole

[0055] 13g: Third flow hole

[0056] 1h: Orifice layer

[0057] 11h: Outlet

[0058] 12h: Inlet

[0059] 1i: Runner layer

[0060] 11i: Outflow channel

[0061] 12i: Inlet channel

[0062] 13i: Columnar structure

[0063] e: buffer distance

[0064] t: Overetching depth

[0065] d: Perforation depth

[0066] s: perforation diameter

[0067] r: cavity depth

[0068] r': side erosion distance

[0069] L: Over-erosion distance

[0070] M: Action area

Claims

1. A microfluidic actuator, characterized in that, it comprises: a substrate having a first surface and a second surface, on which an outlet groove, two inlet grooves, an outflow hole, a plurality of first inflow holes and two second inflow holes are formed by an etching process, the outlet groove is communicated with the outflow hole, each inlet groove is communicated with a part of the plurality of first inflow holes and the corresponding plurality of second inflow holes, the plurality of inlet grooves are symmetrically arranged on both sides of the outlet groove, the plurality of first inflow holes are symmetrically arranged on both sides of the outflow hole, the second inflow holes are symmetrically arranged on both sides of the outflow hole, and at one end of the plurality of first inflow holes; a cavity layer formed on the first surface of the substrate by a deposition process and having a fluid storage chamber formed by an etching process, the fluid storage chamber is communicated with the outflow hole, the plurality of first inflow holes and the plurality of second inflow holes; a vibration layer formed on the cavity layer by a deposition process; a lower electrode layer formed on the vibration layer by a deposition process and an etching process; a piezoelectric actuator layer formed on the lower electrode layer by a deposition process and an etching process; an upper electrode layer formed on the piezoelectric actuator layer by a deposition process and an etching process; an orifice plate layer having an outflow port and two inflow ports formed by an etching process, the plurality of inflow ports are symmetrically arranged on both sides of the outflow port; and a flow channel layer formed on the orifice plate layer by a dry film material rolling process, having an outflow channel, two inflow channels and a plurality of columnar structures formed by a photolithography process, and being bonded to the second surface of the substrate by a flip chip alignment and thermocompression bonding process, the plurality of inflow channels are symmetrically arranged on both sides of the outflow channel, the plurality of columnar structures are symmetrically arranged on both sides of the outflow channel, the outflow port of the orifice plate layer is communicated with the outlet groove of the substrate through the outflow channel, and the plurality of inflow ports of the orifice plate layer are respectively communicated with the plurality of inlet grooves of the substrate through the plurality of inflow channels; wherein, driving power supplies with different phase charges are provided to the upper electrode layer and the lower electrode layer to drive and control the vibration layer to generate vertical displacement, so that fluid is inhaled from the plurality of inflow ports, flows through the plurality of first inflow holes and the plurality of second inflow holes to the fluid storage chamber, and finally is extruded and discharged from the outflow port after passing through the outflow hole to complete fluid transmission.

2. The microfluidic actuator according to claim 1, characterized in that, after the fluid is inhaled from the plurality of inflow ports, it sequentially passes through the plurality of inflow channels, the plurality of inlet grooves, and the plurality of first inflow holes and the plurality of second inflow holes and flows into the fluid storage chamber.

3. The microfluidic actuator according to claim 1, characterized in that, the fluid in the fluid storage chamber is extruded and sequentially passes through the outflow hole, the outlet groove and the outflow channel and then is discharged from the outflow port.

4. The microfluidic actuator according to claim 1, characterized in that, the plurality of columnar structures are formed in the inflow channels.

5. The microfluidic actuator according to claim 1, characterized in that, the substrate is a silicon substrate.

6. The microfluidic actuator according to claim 1, characterized in that, the cavity layer is made of silica material.

7. The microfluidic actuator according to claim 1, characterized in that, the lower electrode layer is made of a platinum metal material.

8. The microfluidic actuator according to claim 1, characterized in that, the lower electrode layer is made of a titanium metal material.

9. The microfluidic actuator according to claim 1, characterized in that, the upper electrode layer is made of a gold metal material.

10. The microfluidic actuator according to claim 1, characterized in that, the upper electrode layer is made of an aluminum metal material.

11. The microfluidic actuator according to claim 1, characterized in that, the substrate forms the outflow hole, the plurality of first inflow holes and the plurality of second inflow holes through a deep reactive ion etching process.

12. The microfluidic actuator according to claim 1, characterized in that, the cavity layer forms the fluid storage chamber through a hydrofluoric acid wet etching process.

13. The microfluidic actuator according to claim 1, characterized in that, the orifice plate layer is made of a stainless steel material.

14. The microfluidic actuator according to claim 1, characterized in that, the orifice plate layer is made of a glass material.

15. The microfluidic actuator according to claim 1, characterized in that, the dry film material of the flow channel layer is a photosensitive polymer dry film.

16. The microfluidic actuator according to claim 1, characterized in that, applying a positive voltage to the upper electrode layer and a negative voltage to the lower electrode layer, such that the piezoelectric actuating layer drives the vibrating layer to displace in a direction away from the substrate.

17. The microfluidic actuator according to claim 1, characterized in that, applying a negative voltage to the upper electrode layer and a positive voltage to the lower electrode layer, such that the piezoelectric actuating layer drives the vibrating layer to displace in a direction close to the substrate.

18. The microfluidic actuator according to claim 1, characterized in that: applying a positive voltage to the upper electrode layer and a negative voltage to the lower electrode layer, such that the piezoelectric actuating layer drives the vibrating layer to displace in a direction away from the substrate, whereby, an external fluid is sucked into the microfluidic actuator through the plurality of inlets, and the fluid entering the microfluidic actuator flows sequentially through the plurality of inflow channels, the plurality of inlet grooves, and the plurality of first inflow holes and the plurality of second inflow holes, and then converges in the fluid storage chamber; and converting the electrical properties of the upper electrode layer and the lower electrode layer, applying a negative voltage to the upper electrode layer and a positive voltage to the lower electrode layer, so that the vibrating layer displaces in a direction close to the substrate, causing the volume in the fluid storage chamber to be compressed by the vibrating layer, such that the fluid converging in the fluid storage chamber can flow sequentially through the outflow hole, the outlet groove and the outflow channel and then be discharged out of the microfluidic actuator through the outlet, completing the transmission of the fluid.

19. A microfluidic actuator, characterized in that, comprising: a plurality of actuating units, each of the actuating units comprising: A substrate having a first surface and a second surface, on which at least one outlet groove, a plurality of inlet grooves, an outflow hole, a plurality of first inflow holes, and two second inflow holes are formed through an etching process. The outlet groove is in communication with the outflow hole. Each inlet groove is in communication with a part of the plurality of first inflow holes and the corresponding plurality of second inflow holes. The plurality of inlet grooves are symmetrically arranged on both sides of the outlet groove. The plurality of first inflow holes are symmetrically arranged on both sides of the outflow hole. The second inflow holes are symmetrically arranged on both sides of the outflow hole, and at one end of the plurality of first inflow holes; A cavity layer formed on the first surface of the substrate through a deposition process, and a flow storage chamber is formed on the cavity layer through an etching process. The flow storage chamber is in communication with the outflow hole, the plurality of first inflow holes, and the plurality of second inflow holes; A vibration layer formed on the cavity layer through a deposition process; A lower electrode layer formed on the vibration layer through a deposition process and an etching process; A piezoelectric actuation layer formed on the lower electrode layer through a deposition process and an etching process; An upper electrode layer formed on the piezoelectric actuation layer through a deposition process and an etching process; An orifice plate layer on which an outflow port and two inflow ports are formed through an etching process. The plurality of inflow ports are symmetrically arranged on both sides of the outflow port; and A flow channel layer formed on the orifice plate layer through a dry film material rolling process, an outflow channel, two inflow channels, and a plurality of columnar structures are formed through a photolithography process, and is bonded to the second surface of the substrate through a flip-chip alignment and thermocompression bonding process. The plurality of inflow channels are symmetrically arranged on both sides of the outflow channel. The plurality of columnar structures are symmetrically arranged on both sides of the outflow channel. The outflow port of the orifice plate layer is in communication with the outlet groove of the substrate through the outflow channel. The plurality of inflow ports of the orifice plate layer are respectively in communication with the plurality of inlet grooves of the substrate through the plurality of inflow channels; Wherein, drive power supplies with different phase charges are provided to the upper electrode layer and the lower electrode layer to drive and control the vibration layer to generate vertical displacement, so that fluid is inhaled from the plurality of inflow ports, flows through the plurality of first inflow holes and the plurality of second inflow holes to the flow storage chamber, and finally is extruded and discharged from the outflow port after passing through the outflow hole to complete fluid transmission; and the plurality of actuator units are connected and arranged in series, parallel, or series-parallel manners.

20. A microfluidic actuator, characterized in that, it comprises: A substrate having a first surface and a second surface, on which at least one outlet groove, at least one inlet groove, at least one outflow hole, at least one first inflow hole, and at least one second inflow hole are formed through an etching process. The at least one outlet groove is in communication with the at least one outflow hole. The at least one inlet groove is in communication with the at least one first inflow hole and the at least one second inflow hole; A cavity layer is formed on the first surface of the substrate through a deposition process, and at least one fluid storage chamber is formed through an etching process. The at least one fluid storage chamber communicates with the at least one outflow hole, the at least one first inflow hole, and the at least one second inflow hole; A vibration layer is formed on the cavity layer through a deposition process; At least one lower electrode layer is formed on the vibration layer through a deposition process and an etching process; At least one piezoelectric actuation layer is formed on the at least one lower electrode layer through a deposition process and an etching process; At least one upper electrode layer is formed on the at least one piezoelectric actuation layer through a deposition process and an etching process; An orifice plate layer forms at least one outflow port and at least one inflow port through an etching process; and A flow channel layer is formed on the orifice plate layer through a dry film material rolling process, forms at least one outflow channel, at least one inflow channel, and a plurality of columnar structures through a photolithography process, and is bonded to the second surface of the substrate through a flip-chip alignment and thermocompression bonding process. The at least one outflow port of the orifice plate layer is communicated with the at least one outlet groove of the substrate through the at least one outflow channel, and the at least one inflow port of the orifice plate layer is respectively communicated with the at least one inlet groove of the substrate through the at least one inflow channel; Wherein, a driving power source with different phase charges is provided to the at least one upper electrode layer and the at least one lower electrode layer to drive and control the vibration layer to generate an up-and-down displacement, so that the fluid is inhaled from the at least one inflow port, flows through the at least one first inflow hole and the at least one second inflow hole to the at least one fluid storage chamber, and finally is extruded and discharged from the at least one outflow port through the at least one outflow hole to complete fluid transmission.

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