Optical Fingerprint Unlock Module, Display Screen and Electronic Device

Abstract

The present invention discloses an optical fingerprint unlocking module, which includes a circuit board, an optical fingerprint chip, a reinforcing layer and a light-shielding layer. The optical fingerprint chip and the reinforcing layer are both disposed on the upper surface of the circuit board. The reinforcing layer is provided with a first through hole that cooperates with the optical fingerprint chip. The optical fingerprint chip is located within the first through hole and exposes from the first through hole. The light-shielding layer is disposed above the optical fingerprint chip. The light-shielding layer is provided with a second through hole that matches the optical fingerprint chip. The second through hole is smaller than the optical fingerprint chip and enables the light-shielding layer to block the dicing tracks located at the periphery of the optical fingerprint chip. The present invention blocks the dicing tracks located at the periphery of the optical fingerprint chip by providing the light-shielding layer, preventing the dicing tracks from reflecting light when encountering strong light, avoiding affecting the resolution of the optical fingerprint chip, and improving the fingerprint recognition accuracy and response speed. The present invention discloses a display screen and an electronic device.

Description

Technical Field

[0001] The present invention relates to the technical field of fingerprint recognition, and particularly to an optical fingerprint unlocking module, a display screen and an electronic device. Background Art

[0002] With the rapid development of the mobile Internet era, the information interaction between mobile terminal users has also increased exponentially.

[0003] In the interactive unlocking solutions of mobile smartphones, biometric recognition technology has become an emerging interactive technology under the leadership of the times and is gradually recognized by the public. Among them, fingerprint recognition unlocking technology has now become a very convenient and fast unlocking solution. With the continuous innovation of mobile phone technology and the birth of full-screen mobile phones, it is a serious test for the current capacitive fingerprint recognition technology. Due to the characteristics of capacitive fingerprints, the technology of penetrating the screen cannot be realized, and thus optical fingerprint unlocking technology has emerged.

[0004] However, due to the emergence of the current 5G solution and the requirement of product thinning, there is no longer a lens shield on the optical fingerprint chip in the existing optical fingerprint unlocking technology, and the optical fingerprint chip is directly exposed to the light source. When the cutting path (i.e., the peripheral edge of the optical fingerprint chip cutting) encounters strong light, it will reflect light, thereby affecting the resolution of the product and reducing the fingerprint recognition accuracy and response speed. Summary of the Invention

[0005] In order to overcome the disadvantages and deficiencies existing in the prior art, the purpose of the present invention is to provide an optical fingerprint unlocking module, a display screen and an electronic device to solve the problem that the optical fingerprint chip in the prior art reflects light at the cutting path, thereby affecting the resolution of the product and reducing the fingerprint recognition accuracy and response speed.

[0006] The purpose of the present invention is achieved by the following technical solutions:

[0007] The present invention provides an optical fingerprint unlocking module, including a circuit board, an optical fingerprint chip, a reinforcing layer and a light-shielding layer. The optical fingerprint chip and the reinforcing layer are both arranged on the upper surface of the circuit board. The reinforcing layer is provided with a first through hole matching the optical fingerprint chip. The optical fingerprint chip is located in the first through hole and exposed from the first through hole. The light-shielding layer is arranged above the optical fingerprint chip. The light-shielding layer is provided with a second through hole matching the optical fingerprint chip. The second through hole is smaller than the optical fingerprint chip and the light-shielding layer shields the cutting path located at the periphery of the optical fingerprint chip.

[0008] Further, the width of the light-shielding layer shielding the periphery of the optical fingerprint chip is 0.1-0.2 mm.

[0009] Further, the thickness of the reinforcing layer is greater than or equal to the thickness of the optical fingerprint chip.

[0010] Further, the light-shielding layer is disposed on the upper surface of the reinforcing layer. The optical fingerprint unlocking module further includes a buffer pad disposed on the upper surface of the light-shielding layer. The buffer pad is provided with a third through hole that cooperates with the optical fingerprint chip, and a portion of the optical fingerprint chip that is not blocked by the light-shielding layer is exposed from the third through hole.

[0011] Further, the light-shielding layer is disposed on the upper surface of the optical fingerprint chip and is located at the periphery of the optical fingerprint chip. The optical fingerprint unlocking module further includes a buffer pad disposed on the upper surface of the reinforcing layer. The buffer pad is provided with a third through hole that cooperates with the optical fingerprint chip, and a portion of the optical fingerprint chip that is not blocked by the light-shielding layer is exposed from the third through hole.

[0012] Further, the optical fingerprint unlocking module further includes a reinforcing sheet disposed on the lower surface of the circuit board.

[0013] Further, the reinforcing sheet is made of steel.

[0014] Further, a first mounting portion is provided on the circuit board, and a second mounting portion corresponding to the first mounting portion is provided on the light-shielding layer. Mounting holes are provided on both the first mounting portion and the second mounting portion.

[0015] The present invention also provides a display screen, and the lower surface of the display screen is provided with the optical fingerprint unlocking module as described above.

[0016] The present invention also provides an electronic device, and the electronic device includes the display screen as described above.

[0017] The beneficial effects of the present invention are as follows: The optical fingerprint unlocking module includes a circuit board, an optical fingerprint chip, a reinforcing layer, and a light-shielding layer. The optical fingerprint chip and the reinforcing layer are both disposed on the upper surface of the circuit board. The reinforcing layer is provided with a first through hole that cooperates with the optical fingerprint chip. The optical fingerprint chip is located within the first through hole and is exposed from the first through hole. The light-shielding layer is disposed above the optical fingerprint chip. The light-shielding layer is provided with a second through hole that matches the optical fingerprint chip. The second through hole is smaller than the optical fingerprint chip and the light-shielding layer blocks the dicing channels located at the periphery of the optical fingerprint chip. By providing the light-shielding layer, the present invention blocks the dicing channels located at the periphery of the optical fingerprint chip, preventing the dicing channels from reflecting light when exposed to strong light, avoiding affecting the resolution of the optical fingerprint chip, and improving the fingerprint recognition accuracy and response speed. Description of the Drawings

[0018] Figure 1It is a schematic exploded view of the optical fingerprint unlocking module in Embodiment 1 of the present invention;

[0019] Figure 2 It is a schematic cross-sectional view of the optical fingerprint unlocking module in Embodiment 1 of the present invention;

[0020] Figure 3 It is a schematic cross-sectional view of the optical fingerprint unlocking module in Embodiment 2 of the present invention.

[0021] In the figure: optical fingerprint unlocking module 10, circuit board 11, first mounting portion 111, flexible circuit board 112, connector 113, optical fingerprint chip 12, cutting track 121, reinforcing layer 13, first through hole 131, light-shielding layer 14, second through hole 141, second mounting portion 142, buffer pad 15, third through hole 151, reinforcing sheet 16, third mounting portion 161. Detailed implementation manners

[0022] To further elaborate on the technical means and effects adopted by the present invention to achieve the intended invention purpose, the following, in conjunction with the accompanying drawings and preferred embodiments, details the specific implementation manners, structures, features, and effects of the optical fingerprint unlocking module, display screen, and electronic device proposed according to the present invention as follows:

[0023] [Embodiment 1]

[0024] Figure 1 It is a schematic exploded view of the optical fingerprint unlocking module in Embodiment 1 of the present invention, Figure 2 It is a schematic cross-sectional view of the optical fingerprint unlocking module in Embodiment 1 of the present invention.

[0025] As Figures 1 to 2 shown, an optical fingerprint unlocking module 10 provided in Embodiment 1 of the present invention includes a circuit board 11, an optical fingerprint chip 12, a reinforcing layer 13, and a light-shielding layer 14;

[0026] The optical fingerprint chip 12 and the reinforcing layer 13 are both disposed on the upper surface of the circuit board 11. The reinforcing layer 13 is provided with a first through hole 131 that cooperates with the optical fingerprint chip 12. The first through hole 131 is larger than the optical fingerprint chip 12. The optical fingerprint chip 12 is located within the first through hole 131 and exposes from the first through hole 131, that is, the upper surface of the optical fingerprint chip 12 can be seen from above the first through hole 131. Among them, both the optical fingerprint chip 12 and the reinforcing layer 13 are bonded to the upper surface of the circuit board 11 through a bonding adhesive. The circuit board 11 has metal circuits. The optical fingerprint chip 12 is soldered on the circuit board 11 and electrically connected to the metal circuits on the circuit board 11 through gold wires. The circuit board 11 is further provided with a flexible circuit board 112 and a connector 113. The flexible circuit board 112 is electrically connected to the metal circuits on the circuit board 11. The connector 113 is connected to the mobile phone processor and is used to transmit the signals sensed by the optical fingerprint chip 12 to the processor for processing.

[0027] The light-shielding layer 14 is disposed above the optical fingerprint chip 12. The light-shielding layer 14 is provided with a second through hole 141 that matches the optical fingerprint chip 12. The second through hole 141 is smaller than the optical fingerprint chip 12 and enables the light-shielding layer 14 to block the dicing channels 121 located at the periphery of the optical fingerprint chip 12. The shape of the second through hole 141 may be the same as the shape of the optical fingerprint chip 12, for example, both are rectangular, but the second through hole 141 needs to be smaller than the optical fingerprint chip 12. Of course, the shape of the second through hole 141 may be different from the shape of the optical fingerprint chip 12, as long as the light-shielding layer 14 can block the dicing channels 121 located at the periphery of the optical fingerprint chip 12. The light-shielding layer 14 is made of a light-impermeable material, preferably a black material, such as a black light-shielding tape.

[0028] Further, the width d of the light-shielding layer 14 blocking the periphery of the optical fingerprint chip 12 is 0.1 - 0.2 mm, that is, the width d of the overlapping part of the projection areas of the light-shielding layer 14 and the optical fingerprint chip 12 on the circuit board 11 is 0.1 - 0.2 mm. The shape of the overlapping part area is a rectangular frame, and the width d is preferably 0.15 mm.

[0029] In this embodiment, the light-shielding layer 14 is disposed on the upper surface of the reinforcing layer 13. The optical fingerprint unlocking module 10 further includes a buffer pad 15. The buffer pad 15 is disposed on the upper surface of the light-shielding layer 14. The buffer pad 15 is provided with a third through hole 151 that cooperates with the optical fingerprint chip 12. The part of the optical fingerprint chip 12 not blocked by the light-shielding layer 14 exposes from the third through hole 151. Among them, the buffer pad 15 can be a foam adhesive to avoid damaging the optical fingerprint unlocking module 10 during installation. Among them, the thickness of the reinforcing layer 13 is greater than or equal to the thickness of the optical fingerprint chip 12. Preferably, the thickness of the reinforcing layer 13 is 0.02 mm greater than the thickness of the optical fingerprint chip 12.

[0030] In this embodiment, the optical fingerprint unlocking module 10 further includes a reinforcing sheet 16, which is disposed on the lower surface of the circuit board 11. The reinforcing sheet 16 is made of steel. The reinforcing sheet 16 can be electrically connected to the circuit board 11 through a conductive adhesive to increase the strength of the circuit board 11. At the same time, it can also prevent the circuit board 11 from generating static electricity and shield the interference of other signals to the optical fingerprint chip 12.

[0031] In this embodiment, a first mounting portion 111 is provided on the circuit board 11, a second mounting portion 142 corresponding to the first mounting portion 111 is provided on the light shielding layer 14, and mounting holes are provided on both the first mounting portion 111 and the second mounting portion 142. The number of the first mounting portions 111 on the circuit board 11 is two, one of the first mounting portions 111 corresponds to the second mounting portion 142, a third mounting portion 161 is provided on the reinforcing sheet 16, and the third mounting portion 161 is also provided with a mounting hole. The third mounting portion 161 corresponds to the other first mounting portion 111 on the circuit board 11.

[0032] [Embodiment 2]

[0033] Figure 3 is a schematic cross-sectional structure diagram of the optical fingerprint unlocking module in the second embodiment of the present invention. As Figure 3 shown, the optical fingerprint unlocking module 10 provided in the second embodiment of the present invention is basically the same as the optical fingerprint unlocking module 10 in Embodiment 1 ( Figure 1 and Figure 2 ). The difference is that, in this embodiment, the light shielding layer 14 is disposed on the upper surface of the optical fingerprint chip 12 and at the periphery of the optical fingerprint chip 12, that is, the light shielding layer 14 is also disposed in the first through hole 131 of the reinforcing layer 13. The light shielding layer 14 is smaller than the first through hole 131 and larger than the optical fingerprint chip 12.

[0034] The optical fingerprint unlocking module 10 further includes a buffer pad 15, which is disposed on the upper surface of the reinforcing layer 13. The buffer pad 15 is provided with a third through hole 151 that cooperates with the optical fingerprint chip 12. The portion of the optical fingerprint chip 12 that is not blocked by the light shielding layer 14 is exposed from the third through hole 151.

[0035] Compared with Embodiment 1, in this embodiment, by directly attaching the light shielding layer 14 to the periphery of the optical fingerprint chip 12, the overall thickness of the optical fingerprint unlocking module 10 can be reduced, which is more conducive to the development trend of the thin and light of mobile phones.

[0036] Those skilled in the art should understand that the rest of the structure and working principle of this embodiment are the same as those of Embodiment 1, and will not be described herein again.

[0037] The present invention also provides a display screen. The lower surface of the display screen is provided with the optical fingerprint unlocking module 10 as described above. The optical fingerprint unlocking module 10 is installed on the lower surface of the display screen through the installation parts (the first installation part 111, the second installation part 142, and the third installation part 161). Among them, the display screen is an OLED organic light-emitting screen, which is made of organic light-emitting diodes. Since it has self-luminescence and does not require an additional backlight source, for a more detailed introduction to the OLED organic light-emitting screen, please refer to the prior art and will not be elaborated here.

[0038] When actually performing fingerprint unlocking, press the finger above the OLED organic light-emitting screen. The fingerprint of the finger contacts the upper surface of the OLED organic light-emitting screen. After the OLED organic light-emitting screen is lit, the incident light is emitted upward from the self-light source layer. After the incident light hits the epidermis layer of the finger, it is reflected. The reflected light reaches the optical fingerprint unlocking module 10 on the lower surface after passing through the OLED organic light-emitting screen. The optical fingerprint unlocking module 10 collects the reflected light to realize the collection of the fingerprint pattern.

[0039] The present invention also provides an electronic device, which includes the display screen as described above. Among them, the electronic device can be an electronic device terminal such as a tablet computer, a palm computer, a notebook computer, or a mobile phone, and no specific limitation is made here.

[0040] In summary, the present invention blocks the dicing track 121 on the periphery of the optical fingerprint chip 12 by setting the light-shielding layer 14, preventing the dicing track 121 from reflecting light when encountering strong light, avoiding affecting the resolution of the optical fingerprint chip 12, and improving the fingerprint recognition accuracy and response speed.

[0041] In this article, the orientation terms such as up, down, left, right, front, and back are defined based on the positions of the structures in the drawings and the positions of the structures relative to each other, only for the sake of clarity and convenience in expressing the technical solution. It should be understood that the use of the orientation terms should not limit the scope of protection requested by the present application. It should also be understood that the terms "first" and "second" used in this article are only for distinction in name and do not limit the quantity and order.

[0042] The above is only a preferred embodiment of the present invention, and does not make any form of limitation to the present invention. Although the present invention has been disclosed above with the preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications within the scope of the technical solution of the present invention by using the above-disclosed technical content, which are equivalent embodiments of equivalent changes. However, as long as it does not depart from the technical solution content of the present invention, any simple modification, equivalent change, and modification made to the above embodiments according to the technical essence of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. An optical fingerprint unlocking module, characterized in that, It includes a circuit board (11), an optical fingerprint chip (12), a reinforcement layer (13) and a light-shielding layer (14). The optical fingerprint chip (12) and the reinforcement layer (13) are both arranged on the upper surface of the circuit board (11). The reinforcement layer (13) is provided with a first through hole (131) that cooperates with the optical fingerprint chip (12). The optical fingerprint chip (12) is located within the first through hole (131) and is exposed from the first through hole (131). The light-shielding layer (14) is arranged above the optical fingerprint chip (12). The light-shielding layer (14) is provided with a second through hole (141) that matches the optical fingerprint chip (12). The second through hole (141) is smaller than the optical fingerprint chip (12) and enables the light-shielding layer (14) to block the dicing channel (121) located at the periphery of the optical fingerprint chip (12) to prevent the dicing channel (121) from reflecting light when encountering strong light; The width of the light-shielding layer (14) blocking the periphery of the optical fingerprint chip (12) is 0.1 - 0.2 mm.

2. The optical fingerprint unlocking module according to claim 1, wherein The thickness of the reinforcement layer (13) is greater than or equal to the thickness of the optical fingerprint chip (12).

3. The optical fingerprint unlocking module according to claim 1, characterized in that The light-shielding layer (14) is arranged on the upper surface of the reinforcement layer (13). The optical fingerprint unlocking module (10) further includes a buffer pad (15). The buffer pad (15) is arranged on the upper surface of the light-shielding layer (14). The buffer pad (15) is provided with a third through hole (151) that cooperates with the optical fingerprint chip (12). The part of the optical fingerprint chip (12) not blocked by the light-shielding layer (14) is exposed from the third through hole (151).

4. The optical fingerprint unlocking module according to claim 1, wherein The light-shielding layer (14) is arranged on the upper surface of the optical fingerprint chip (12) and at the periphery of the optical fingerprint chip (12). The optical fingerprint unlocking module (10) further includes a buffer pad (15). The buffer pad (15) is arranged on the upper surface of the reinforcement layer (13). The buffer pad (15) is provided with a third through hole (151) that cooperates with the optical fingerprint chip (12). The part of the optical fingerprint chip (12) not blocked by the light-shielding layer (14) is exposed from the third through hole (151).

5. The optical fingerprint unlocking module according to claim 1, wherein The optical fingerprint unlocking module (10) further includes a reinforcement sheet (16). The reinforcement sheet (16) is arranged on the lower surface of the circuit board (11).

6. The optical fingerprint unlocking module according to claim 5, characterized in that, The reinforcement sheet (16) is made of steel.

7. The optical fingerprint unlocking module according to claim 1, wherein, The circuit board (11) is provided with a first mounting portion (111). The light-shielding layer (14) is provided with a second mounting portion (142) corresponding to the first mounting portion (111). Both the first mounting portion (111) and the second mounting portion (142) are provided with mounting holes.

8. A display screen, characterized in that, The lower surface of the display screen is provided with the optical fingerprint unlocking module (10) according to any one of claims 1 - 7.

9. An electronic device, characterized in that, The electronic device includes the display screen according to claim 8.

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