Deposition apparatus including heat dissipation member

Abstract

A deposition device including a heat dissipation member is provided. The deposition device includes: a chamber; a deposition source; and a workbench disposed in the chamber, on which a target object is mounted. The deposition device also includes: a first plate coupled to the chamber; and a second plate disposed between the first plate and the workbench, wherein the second plate includes a plurality of diffusion holes. The deposition device also includes: a heat dissipation member in contact with the first plate and the second plate, wherein the heat dissipation member includes a plurality of side wall portions, wherein the plurality of side wall portions are connected to each other. The deposition device also includes: a gasket coupled to a first side wall portion of the plurality of side wall portions and disposed between the first plate and the second plate, wherein the gasket extends parallel to the first side wall portion.

Description

[0001] This patent application claims the priority benefit of Korean Patent Application No. 10-2018-0160248 filed on December 12, 2018 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a deposition apparatus, and more particularly, to a deposition apparatus including a heat dissipation member. Background Art

[0003] Glass substrates or plastic substrates are widely used in manufacturing display devices because they are transparent and are manufactured to have a larger surface area than that of silicon-based substrates. Since the transition temperature of glass substrates and plastic substrates is low, the film deposition process should be performed at a low temperature of about 200° C. to about 300° C. to prevent deformation of the substrate.

[0004] Plasma enhanced chemical vapor deposition (PECVD) technology can be used to deposit semiconductor and dielectric films over a large area even at a relatively low temperature, and therefore, the PECVD technology is widely used in display devices, solar cells, etc. In the PECVD technology, energy for separating a deposition source can be supplied based on an electric field rather than heat, and therefore, a substrate can be maintained at a relatively low temperature. Summary of the invention

[0005] According to an exemplary embodiment of the inventive concept, a deposition apparatus includes: a chamber; a deposition source including a deposition material; a workbench disposed in the chamber, on which a target object is mounted; a first plate coupled to the chamber to define a space; a second plate disposed between the first plate and the workbench, wherein the second plate includes a plurality of diffusion holes disposed in the second plate; a heat dissipation member in contact with the first plate and the second plate, wherein the heat dissipation member includes a plurality of sidewall portions, wherein the plurality of sidewall portions are connected to each other to form a frame shape surrounding outer side surfaces of the first plate and the second plate; and a gasket coupled to a first sidewall portion of the plurality of sidewall portions and disposed between the first plate and the second plate, wherein the gasket extends parallel to the first sidewall portion. An extension length of the gasket is shorter than an extension length of the first sidewall portion.

[0006] In an exemplary embodiment of the present inventive concept, the gasket is disposed in a central region of the first sidewall portion.

[0007] In an exemplary embodiment of the present inventive concept, the gasket is in direct contact with the first plate and the second plate.

[0008] In an exemplary embodiment of the present inventive concept, the second plate includes a first side and a second side, the first side faces each other and extends in a first direction, the second side faces each other and extends in a second direction intersecting the first direction, wherein the gasket is a plurality of gaskets. The plurality of gaskets include a first gasket and a second gasket, wherein the first gaskets extend along the first side and face each other, and the second gaskets extend along the second side and face each other. The extension length of each second gasket is shorter than the extension length of each first gasket.

[0009] In an exemplary embodiment of the present inventive concept, a ratio of an extension length of each first gasket to a length of the first side of the second plate ranges from about 60% to about 70%.

[0010] In an exemplary embodiment of the present inventive concept, a ratio of an extension length of each second gasket to a length of the second side of the second plate ranges from about 20% to about 30%.

[0011] In an exemplary embodiment of the present inventive concept, the second plate includes a diffusion portion including a plurality of diffusion holes and a peripheral portion surrounding the diffusion portion, wherein the gasket is disposed on the peripheral portion.

[0012] In an exemplary embodiment of the present invention, the heat dissipation member further includes a plurality of bottoms, wherein each of the plurality of bottoms is bent from a bottom end of each side wall portion and is disposed below the second plate, and each side wall portion includes: a first portion including an inner surface connected to the first plate; a second portion coupled to the bottom end of the first portion and including an inner surface coupled to the gasket; and a third portion connecting the bottom end of the second portion to the bottom of the heat dissipation member, wherein the inner surface of the third portion is connected to the second plate.

[0013] In an exemplary embodiment of the present inventive concept, the gasket includes a metal material.

[0014] In an exemplary embodiment of the present inventive concept, the gasket includes a material substantially the same as that of the heat dissipation member.

[0015] In an exemplary embodiment of the present inventive concept, the second plate and the heat dissipation member are a single object.

[0016] In an exemplary embodiment of the present inventive concept, the hole penetrates the first plate, and wherein the deposition apparatus further includes a cylinder connected to the deposition source and surrounding the hole.

[0017] In an exemplary embodiment of the present inventive concept, the deposition apparatus further includes a voltage generator electrically connected to the second plate and configured to provide a voltage to the second plate to generate an electric field between the second plate and the stage.

[0018] In an exemplary embodiment of the present inventive concept, the gasket has a hexahedral shape.

[0019] In an exemplary embodiment of the present inventive concept, the gasket includes a curved surface.

[0020] In an exemplary embodiment of the present inventive concept, the gasket includes a tapered end.

[0021] According to an exemplary embodiment of the inventive concept, a deposition apparatus includes: a chamber; a deposition source including a deposition material; a workbench disposed in the chamber, wherein a target object is disposed on the workbench and includes a deposition area; a first plate facing the workbench and coupled to the chamber to define a space; a second plate disposed between the first plate and the workbench, wherein the second plate has a rectangular shape; a heat dissipation member connected to the first plate and the second plate, wherein the heat dissipation member includes a plurality of sidewall portions forming a frame shape surrounding the outer side surfaces of the first plate and the second plate; and a plurality of gaskets disposed between the first plate and the second plate, wherein each of the plurality of gaskets is coupled to one of the plurality of sidewall portions, and each of the plurality of gaskets has a rod shape extending along the plurality of sidewall portions. The second plate includes: a diffusion portion overlapping the deposition area, wherein a plurality of diffusion holes are disposed in the diffusion portion; and a peripheral portion at least partially surrounding the diffusion portion. The plurality of gaskets are spaced apart from each other on the peripheral portion and are in direct contact with the first plate and the second plate.

[0022] In an exemplary embodiment of the present inventive concept, each gasket is disposed in a central area of ​​an inner side surface of a corresponding side wall portion among the plurality of side wall portions.

[0023] In an exemplary embodiment of the present inventive concept, the gasket includes a metal material.

[0024] According to an exemplary embodiment of the inventive concept, a deposition apparatus includes: a chamber; a deposition source including a deposition material; a workbench disposed in the chamber, wherein a target object is mounted on the workbench and includes a deposition area; a first plate overlapped with the workbench and coupled to the chamber to define a space; a second plate disposed between the first plate and the workbench, wherein the second plate includes a first side extending in a first direction and a plurality of diffusion holes overlapped with the deposition area; a heat dissipation member connected to the first plate and the second plate, wherein the heat dissipation member includes a first sidewall portion extending in the first direction; and a first gasket coupled to the first sidewall portion of the heat dissipation member and disposed between the first plate and the second plate, wherein the first gasket has a rectangular shape extending in the first direction. The length of the first gasket in the first direction is shorter than the length of the first side in the first direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] A more complete understanding of the present disclosure and its many attendant aspects will be readily obtained, while a more complete understanding of the present disclosure and its many attendant aspects become better understood, by referring to the following detailed description when considered in conjunction with the accompanying drawings, in which:

[0026] Figure 1 is a cross-sectional view schematically illustrating a deposition apparatus according to an exemplary embodiment of the present inventive concept;

[0027] Figure 2 is a diagram showing an exemplary embodiment according to the inventive concept Figure 1 An exploded perspective view of a deposition apparatus;

[0028] Figure 3 is a diagram showing an exemplary embodiment according to the inventive concept Figure 2 An enlarged perspective view of the gasket shown in ;

[0029] Figure 4 According to an exemplary embodiment of the present inventive concept Figure 1 A top plan view of the heat sink member and gasket shown in FIG.

[0030] Figure 5 is a diagram illustrating a second plate mounted on a heat dissipation member according to an exemplary embodiment of the present inventive concept;

[0031] Fig. 6A , Figure 6B and Figure 6C is a graph showing a temperature variation of a second plate according to an exemplary embodiment of the present inventive concept as a function of space;

[0032] Figure 7 is a cross-sectional view illustrating a deposition apparatus according to an exemplary embodiment of the present inventive concept;

[0033] Figure 8 is a diagram showing an exemplary embodiment according to the inventive concept Figure 7 an enlarged perspective view of a region of the diffusion structure shown in;

[0034] Fig. 9 is a top plan view illustrating a diffusion structure according to an exemplary embodiment of the present inventive concept;

[0035] Fig.10 is a top plan view illustrating a diffusion structure according to an exemplary embodiment of the present inventive concept; and

[0036] Fig.11 is a top plan view illustrating a diffusion structure according to an exemplary embodiment of the inventive concept. DETAILED DESCRIPTION

[0037] Exemplary embodiments of the present invention will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments of the present invention can be implemented in a variety of different forms and should not be construed as being limited to the exemplary embodiments set forth herein. In the accompanying drawings, the thickness of layers and regions may be exaggerated for clarity. The same reference numerals in the accompanying drawings may represent the same elements and therefore their descriptions may be omitted.

[0038] It will be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present.

[0039] It will be understood that, although the terms "first", "second", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the spirit and scope of the present invention, the first element, first component, first region, first layer or first part discussed below may be referred to as the second element, second component, second region, second layer or second part.

[0040] For ease of description, spatially relative terms such as "under", "below", "below", "above", and "above" may be used herein to describe the relationship of one element or feature to other elements or features as shown in the accompanying drawings. It will be understood that in addition to the orientation depicted in the figures, spatially relative terms are intended to include different orientations of the device in use or operation. For example, if the device in the accompanying drawings is turned over, an element described as "below" or "below" other elements or features will subsequently be positioned as "above" other elements or features. Therefore, the exemplary term "below" may include both above and below. The device may be positioned otherwise (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0041] Figure 1 is a cross-sectional view schematically illustrating a deposition apparatus according to an exemplary embodiment of the present inventive concept, and Figure 2 It is shown Figure 1 For ease of description and explanation, according to an exemplary embodiment of the inventive concept, in Figure 2 Only the Figure 1 Some of the components in.

[0042] Reference Figure 1 and Figure 2, the deposition device 1000 may be used to deposit a thin film on a target object SUB. As an example, the deposition device 1000 according to an exemplary embodiment of the inventive concept may be used to manufacture a liquid crystal display device or an organic light-emitting display device. For example, in this embodiment, the target object SUB may be a part of a display panel, and the thin film may be an amorphous silicon thin film of a thin film transistor included in the display panel. In addition, the inventive concept is not limited to this example or a specific use of the deposition device 1000.

[0043] In an exemplary embodiment of the present inventive concept, a deposition apparatus 1000 may include a chamber 100 , a deposition source 200 , a stage 300 , a first plate 400 , and a diffusion structure DAS.

[0044] The chamber 100 may form an outer surface of the deposition apparatus 1000. In the present embodiment, the chamber 100 may be coupled to a first plate 400 of a plate-like structure. The chamber 100 and the first plate 400 form a space in which the deposition material moves.

[0045] In an exemplary embodiment of the present inventive concept, the chamber 100 may include a bottom chamber 110 and a cover chamber 120 .

[0046] The bottom chamber 110 may constitute a bottom surface and sidewalls of the chamber 100. For example, the bottom chamber 110 provides a bottom surface and sidewalls of the deposition apparatus 1000.

[0047] The cover chamber 120 may be disposed on the bottom chamber 110. The cover chamber 120 may have a frame shape. The cover chamber 120 may be coupled to a sidewall of the bottom chamber 110.

[0048] The first plate 400 may be mounted on the cover chamber 120. The bottom chamber 110, the cover chamber 120, and the first plate 400 may be combined with each other to form a space in which the deposition material is disposed. The space may be maintained in a high vacuum state, and in this case, it may be possible to prevent the inflow of external contaminants and ensure directional propagation or anisotropic propagation of the deposition material.

[0049] In the present embodiment, the coupling structure of the chamber 100 and the first plate 400 may have a hexahedral shape, but the inventive concept is not limited to a specific shape of the coupling structure.

[0050] In an exemplary embodiment of the present inventive concept, the cover chamber 120 may be omitted, and in this case, the first plate 400 may be mounted on the sidewall of the bottom chamber 110 and may be combined with the chamber 100 .

[0051] In addition, in the present embodiment, the first plate 400 may be coupled to the chamber 100 to form an outer surface of the deposition apparatus 1000, but the present inventive concept is not limited to this example. For example, the first plate 400 and the chamber 100 may form a housing. In an exemplary embodiment of the present inventive concept, the chamber 100 may be separately provided to form an isolated space, in which case the first plate 400 may be provided on the chamber 100 and fixed to the chamber 100.

[0052] The deposition source 200 may be disposed above the first plate 400. The deposition source 200 may be connected to the first plate 400 to provide a deposition material to a space formed by the chamber 100 and the first plate 400. The present inventive concept is not limited to a specific location of the deposition source 200. For example, in an exemplary embodiment of the present inventive concept, the deposition source 200 may be disposed in the chamber 100.

[0053] For example, the deposition material may be a gaseous substance when the deposition material is disposed in a space formed by the chamber 100 and the first plate 400. The deposition apparatus 1000 may further include an evaporation chamber used to evaporate the liquid deposition material.

[0054] The inventive concepts are not limited to a particular type of deposition material.

[0055] The workbench 300 may be disposed below the first plate 400. The workbench 300 may include a support portion 310 and a moving portion 320. The support portion 310 may be disposed in a space provided by the chamber 100. For example, the support portion 310 may be disposed adjacent to a lower portion of the space formed by the chamber 100. The support portion 310 may have a flat plate-like structure, and a top surface of the support portion 310 is parallel to a first direction DR1 and a second direction DR2 intersecting the first direction DR1. The target object SUB may be loaded on the top surface of the support portion 310. The top surface of the support portion 310 may face the top of the chamber 100 and / or the rear surface of the first plate 400. In the present embodiment, the support portion 310 may be grounded. For example, as Figure 1 As shown in , the support portion 310 may be connected to the ground line GR.

[0056] Hereinafter, the third direction DR3 is substantially perpendicular to both the first direction DR1 and the second direction DR2. The third direction DR3 may be parallel to the upward direction and the downward direction to be described below. In addition, the third direction DR3 may be used as a reference direction for distinguishing the front surface and the rear surface of each element to be described below. However, the upward direction and the downward direction may be relative concepts, and in some embodiments, they may be used to indicate other directions.

[0057] As described above, the target object SUB may include a glass substrate or a plastic substrate as a part of a display panel. When viewed in a plan view, a deposition area DA and a non-deposition area NDA may be set in the target object SUB. The deposition area DA may be set in a central area of ​​the target object SUB. When viewed in a plan view, the deposition area DA may be an area on which a deposition material is to be deposited, and the non-deposition area NDA may be an area of ​​a frame shape at least partially surrounding the deposition area DA. The deposition material may not be deposited in the non-deposition area NDA. For example, the deposition device 1000 may further include a mask that may cover a predetermined area of ​​the deposition area DA and the non-deposition area NDA. The deposition material may not be deposited in the area covered by the mask. In an exemplary embodiment of the inventive concept, the non-deposition area NDA may be omitted.

[0058] The moving part 320 may be connected to the supporting part 310. The moving part 320 may be configured to change the position of the supporting part 310. In the case where the supporting part 310 reciprocates only in the third direction DR3, the moving part 320 may be disposed inside or outside the chamber 100 without being restricted in position. In addition, in the case where the supporting part 310 moves within a plane provided by the first direction DR1 and the second direction DR2, the moving part 320 may be disposed inside the chamber 100 together with the supporting part 310. Figure 1 An example is shown in which the moving part 320 is disposed outside the chamber 100 ; however, the inventive concept is not limited thereto.

[0059] As described above, the first plate 400 may be a plate-shaped structure. The first plate 400 may be mounted on the cover chamber 120 to form a space between the chamber 100 and the first plate 400.

[0060] In the present embodiment, a hole BR may be formed in the first plate 400 to penetrate the first plate 400. The hole BR may be used as a passage through which a deposition material provided from the deposition source 200 may move. In an exemplary embodiment of the present inventive concept, the deposition apparatus 1000 may further include a cylinder SD connected to the deposition source 200, in which case the hole BR may be provided in the cylinder SD. The cylinder SD may penetrate the first plate 400.

[0061] A plurality of distribution holes may be formed in the first plate 400. Each distribution hole may be an empty space branched from the cylinder SD. The distribution holes may be used to diffuse the deposition material provided from the deposition source 200 in a more efficient manner.

[0062] The diffusion structure DAS may be disposed under the first plate 400. The diffusion structure DAS may be combined with the first plate 400 to provide a diffusion space DSP. In the case where a deposition material is supplied from the deposition source 200 into the chamber 100, the deposition material may be diffused in the diffusion space DSP.

[0063] The diffusion structure DAS may include a second plate 500 , a heat dissipation member 600 , and a spacer SPC.

[0064] The second plate 500 may be disposed below the first plate 400 and may be spaced apart from the first plate 400. When viewed in a plan view, the second plate 500 may overlap the first plate 400. For example, the second plate 500 may include a metal material. As an example, the second plate 500 may include aluminum (Al).

[0065] For example, the second plate 500 may have a plate shape. As an example, the second plate 500 may have a first side S1 parallel to the first direction DR1 and a second side S2 parallel to the second direction DR2. The length of the first side S1 may be longer than the length of the second side S2.

[0066] The second plate 500 may include a diffusion portion 510 and a peripheral portion 520. When viewed in a plan view, the diffusion portion 510 may be disposed in a central region of the second plate 500. In the present embodiment, a plurality of diffusion holes DH may be disposed in the diffusion portion 510 to penetrate the second plate 500 in the third direction DR3. When viewed in a plan view, the diffusion holes DH may overlap with a deposition area DA of the target object SUB. When viewed in a plan view, the diffusion holes DH may be arranged in a matrix shape. The inventive concept is not limited to the number, size, or arrangement of the diffusion holes DH.

[0067] In the case where the deposition material is disposed in the diffusion space DSP, the deposition material may diffuse in the diffusion space DSP and may move to a region under the diffusion structure DAS through the diffusion hole DH.

[0068] The heat dissipation member 600 may have a frame shape extending along the side surface of the second plate 500. For example, the second plate 500 may be disposed in the heat dissipation member 600, and the heat dissipation member 600 may surround the second plate 500. The heat dissipation member 600 may connect the first plate 400 to the second plate 500.

[0069] The deposition apparatus 1000 may further include a connection member connecting the heat dissipation member 600 to the first plate 400 and the second plate 500. The inventive concept is not limited to a specific type of connection member. As an example, the connection member may include a tape, a screw, a nail, etc.

[0070] The heat dissipation member 600 may have inner side surfaces SA and SB that contact the side surfaces of the first plate 400 and the second plate 500. For example, the first plate 400 may be disposed in the heat dissipation member 600 and may be disposed on the second plate 500. The heat dissipation member 600 may include a thermally conductive material. As an example, the heat dissipation member 600 may include a metal material (e.g., aluminum).

[0071] The gasket SPC may be disposed between the first plate 400 and the second plate 500. For example, the top surface of the gasket SPC may be in direct contact with the bottom surface of the first plate 400, and the bottom surface of the gasket SPC may be in direct contact with the top surface of the second plate 500. For example, when measured in the third direction DR3, the height h of the gasket SPC (see, for example Figure 3 ) may be substantially equal to the distance between the first plate 400 and the second plate 500.

[0072] The gasket SPC may be combined with the heat dissipation member 600. The gasket SPC may be configured to discharge the heat provided to the second plate 500 to the outside. The gasket SPC may include a thermally conductive material. As an example, the gasket SPC may be formed of a material substantially the same as that of the heat dissipation member 600, or include a material substantially the same as that of the heat dissipation member 600. For example, the gasket SPC may include a metal material (e.g., aluminum). However, the inventive concept is not limited thereto.

[0073] In the present embodiment, a plurality of spacers SPC may be provided. However, the inventive concept is not limited to the number of spacers SPC.

[0074] Will refer to Figure 5 The heat dissipation member 600 and the spacer SPC are described in more detail.

[0075] According to an exemplary embodiment of the inventive concept, the deposition apparatus 1000 may be a plasma chemical vapor deposition apparatus configured to perform a plasma enhanced chemical vapor deposition (PECVD) process.

[0076] For example, the deposition apparatus 1000 may further include a voltage generator VG. The voltage generator VG may be electrically connected to the diffusion structure DAS. The voltage generator VG may apply a voltage to the second plate 500 of the diffusion structure DAS. As an example, the voltage applied to the second plate 500 may be an AC voltage.

[0077] In the present embodiment, an electric field may be generated in the plasma space PSP, which is an empty space formed between the diffusion structure DAS and the stage 300. The electric field may generate plasma by the deposition material disposed in the plasma space PSP through the diffusion hole DH of the second plate 500. In the case where the plasma of the deposition material is used to perform the deposition process, the deposition material may be deposited at a relatively low temperature.

[0078] In the present embodiment, the deposition apparatus 1000 may further include an insulating member DM. The insulating member DM may be disposed between the first plate 400 and the cover chamber 120 to electrically disconnect the first plate 400 from the chamber 100. For example, the first plate 400 may be insulated from the chamber 100. Therefore, the first plate 400 electrically connected to the second plate 500 through the heat dissipation member 600 and the gasket SPC is not electrically connected to the cover chamber 120.

[0079] In an exemplary embodiment of the present inventive concept, in a case where at least one of the heat dissipation member 600 and the second plate 500 contacts the chamber 100 , an insulating member DM may be additionally disposed between the heat dissipation member 600 and the chamber 100 or between the second plate 500 and the chamber 100 .

[0080] Figure 3 is a diagram showing an exemplary embodiment according to the inventive concept Figure 2 An enlarged perspective view of one of the gaskets shown in FIG. For ease of description, as an example, Figure 3 An area is shown where one of the plurality of spacers is provided.

[0081] Figure 4 According to an exemplary embodiment of the present inventive concept Figure 1 A top plan view of the heat sink and gasket shown in FIG. Figure 5 is a diagram illustrating a second plate mounted on a heat dissipation member according to an exemplary embodiment of the inventive concept.

[0082] Combination Figure 2 Reference Figures 3 to 5 , the heat dissipation member 600 may include a plurality of sidewall portions 610 and a plurality of bottom portions 620 .

[0083] When viewed in a plan view, the side wall portions 610 may be connected to each other to form a frame shape. For example, the side wall portions 610 may form a rectangular frame. When viewed in a plan view, the side wall portions 610 may extend along the first side edge S1 and the second side edge S2 of the second plate 500. The number of the side wall portions 610 may correspond to the number of the side edges constituting the second plate 500.

[0084] Each sidewall portion 610 may include a first portion 611, a second portion 612, and a third portion 613. Each of the first portion 611, the second portion 612, and the third portion 613 may extend parallel to a corresponding side of the sides S1 and S2 of the second plate 500.

[0085] The inner side surface of the first part 611 may be bonded to the gasket SPC. The second part 612 may be connected to the top end of the first part 611. The inner side surface of the second part 612 may contact the first plate 400. For example, the inner side surface of the second part 612 may be connected to the first plate 400. The third part 613 may be provided below the bottom end of the first part 611 to connect the first part 611 to the bottom 620. The inner side surface of the third part 613 may contact the second plate 500. For example, the inner side surface of the third part 613 may be connected to the second plate 500.

[0086] The bottom portion 620 may be connected to the side wall portion 610. For example, the number of the bottom portions 620 may correspond to the number of the side wall portions 610. The bottom portions 620 may be connected to each other to form a frame shape when viewed in a plan view. For example, the heat dissipation member 600 may have an opening OP provided in a central area of ​​the heat dissipation member 600 when viewed in a plan view.

[0087] Each bottom portion 620 may be bent from the bottom end of each side wall portion 610. For example, each bottom portion 620 may be bent from the bottom end of the third portion 613 to be parallel to a plane formed by the first direction DR1 and the second direction DR2, and may be disposed below the second plate 500. When viewed in a plan view, the bottom portion 620 may overlap the peripheral portion 520 of the second plate 500. For example, the peripheral portion 520 as an edge region of the second plate 500 may be mounted on the bottom portion 620. In an exemplary embodiment of the present inventive concept, the bottom portion 620 may be omitted.

[0088] When viewed in a plan view, the gasket SPC may overlap the peripheral portion 520 of the second plate 500. In the present embodiment, the gasket SPC may not overlap the diffusion portion 510 of the second plate 500.

[0089] When viewed in a plan view, the gasket SPC may have a rod-like structure extending along the peripheral portion 520. As an example, the gasket SPC may have a hexahedral shape. A side surface SS of the gasket SPC may have a rectangular shape.

[0090] The spacer SPC may include a first spacer SPC1 and a second spacer SPC2. The first spacer SPC1 and the second spacer SPC2 may be spaced apart from each other.

[0091] The first gaskets SPC1 may face each other in the second direction DR2. Each first gasket SPC1 may be disposed adjacent to the first side S1 of the second plate 500. Each first gasket SPC1 may extend along the first side S1. For example, the first gasket SPC1 may extend along the long side of the heat dissipation member 600.

[0092] The second gaskets SPC2 may face each other in the first direction DR1. Each second gasket SPC2 may be disposed adjacent to the second side S2 of the second plate 500. Each second gasket SPC2 may extend along the second side S2. For example, the extension length of each second gasket SPC2 may be shorter than the extension length of each first gasket SPC1. For example, the second gasket SPC2 may extend along the short side of the heat dissipation member 600.

[0093] According to an exemplary embodiment of the inventive concept, the extension length of the first gasket SPC1 may be shorter than the length of the first side S1. For example, the extension length of the first gasket SPC1 may be shorter than the extension length of one of the sidewall portions 610 of the heat dissipation member 600 coupled to the first gasket SPC1 in the first direction DR1. As an example, a ratio of the extension length D1 of the first gasket SPC1 to the length DL of the first side S1 may be in a range of about 60% to about 70%.

[0094] In addition, the extension length of the second gasket SPC2 may be shorter than the length of the second side S2. For example, the extension length of the second gasket SPC2 may be shorter than the extension length of one of the sidewall portions 610 of the heat dissipation member 600 coupled to the second gasket SPC2 in the second direction DR2. As an example, the ratio of the extension length D2 of the second gasket SPC2 to the length DS of the second side S2 may be in the range of about 20% to about 30%.

[0095] According to an exemplary embodiment of the inventive concept, each of the first gasket SPC1 and the second gasket SPC2 may be disposed in a central region of the inner side surface SA or SB of each side wall portion 610 connected to the first gasket SPC1 and the second gasket SPC2. For example, each first gasket SPC1 may be disposed on the peripheral portion 520 to overlap with the central region of the first side S1. Each second gasket SPC2 may be disposed on the peripheral portion 520 to overlap with the central region of the second side S2.

[0096] like Figure 5 As shown, the diffusion portion 510 of the second plate 500 may be divided into a plurality of regions when viewed in a plan view.

[0097] When viewed in a plan view, the central area AR_C may be disposed at the central area of ​​the diffuser 510. When viewed in a plan view, a center point CT located at the center of the diffuser 510 may be disposed in the central area AR_C. Each of the first peripheral areas AR_E, AR_W, AR_S, and AR_N may be disposed between the central area AR_C and the first side S1 of the second plate 500 and between the central area AR_C and the second side S2 of the second plate 500. The first peripheral areas AR_E, AR_W, AR_S, and AR_N may be spaced apart from each other. Each of the second peripheral areas AR_SE, AR_SW, AR_NE, and AR_NW may be disposed between adjacent first peripheral areas AR_E, AR_W, AR_S, and AR_N. When viewed in a plan view, the second peripheral areas AR_SE, AR_SW, AR_NE, and AR_NW may be positioned adjacent to the vertices of the second plate 500.

[0098] Unlike the exemplary embodiments of the present inventive concept, in the case where the deposition apparatus 1000 does not include the spacer SPC, due to the plasma space PSP (see, for example, Figure 1 ), in a plan view, the temperature of the central area AR_C of the second plate 500 may be relatively higher than the temperature of each of the first peripheral areas AR_E, AR_W, AR_S and AR_N and the second peripheral areas AR_SE, AR_SW, AR_NE and AR_NW. If the diffusion space DSP (see, for example, Figure 1 ) has a spatial variation in the internal temperature of the second plate 500, the kinetic energy of the deposited material will vary between the regions, which may lead to uneven diffusion of the deposited material. As an example, if the central region AR_C has a relatively high temperature, the mass density of the deposited material in the central region AR_C will be smaller than the mass density of the deposited material in the first peripheral regions AR_E, AR_W, AR_S and AR_N and the second peripheral regions AR_SE, AR_SW, AR_NE and AR_NW. In addition, according to an exemplary embodiment of the present inventive concept, the first gasket SPC1 and the second gasket SPC2 may overlap with the peripheral portion 520 of the second plate 500, and thus may be used to discharge the plasma heat transferred to the second plate 500 to the outside. For example, in addition to the heat dissipation member 600, by arranging the first gasket SPC1 and the second gasket SPC2 on the peripheral portion 520 that does not overlap with the diffusion portion 510, the heat dissipation efficiency of the deposition device 1000 may also be improved.

[0099] FIG. 6A to FIG. 6C 2 are graphs each showing a change in temperature of a second plate according to an exemplary embodiment of the inventive concept according to a position.

[0100] Hereinafter, for the convenience of description, an imaginary line passing through the center point CT in the second direction DR2 will be referred to as a first center line CX1, and an imaginary line passing through the center point CT in the first direction DR1 will be referred to as a second center line CX2. In addition, imaginary lines extending in a diagonal direction to connect opposite vertices of the diffusion portion 510 and passing through the center point CT will be referred to as a third center line CX3 and a fourth center line CX4.

[0101] Fig. 6A is a graph showing a temperature change of the diffusion portion 510 based on a region of the diffusion portion 510 in a direction parallel to the first side S1, and Figure 6B is a graph showing a temperature change of the diffusion portion 510 based on a region of the diffusion portion 510 in a direction parallel to the second side S2 . Figure 6C is a graph showing the temperature change of the region of the diffusion portion 510 in the direction parallel to the third center line CX3. The temperature change of the region of the diffusion portion 510 in the direction parallel to the fourth center line CX4 is shown in FIG. Figure 6C The temperature changes of the graphs shown in the figure are substantially the same, and their detailed descriptions may be omitted. Curves B, D, and F show temperature changes according to an exemplary embodiment of the inventive concept, while curves A, C, and E show temperature changes according to a comparative example.

[0102] Reference FIG. 6A to FIG. 6C, the first peripheral areas AR_E, AR_W, AR_S and AR_N may have a relatively higher temperature than the second peripheral areas AR_SE, AR_SW, AR_NE and AR_NW. For example, the temperature of the second peripheral areas AR_SE, AR_SW, AR_NE and AR_NW may be lower than that of the other areas. As described above, each of the first gasket SPC1 and the second gasket SPC2 according to an exemplary embodiment of the present invention may be disposed at a central area of ​​each side (e.g., S1 and S2) of the peripheral portion 520 extending in each direction (e.g., DR1 and DR2). For example, according to an exemplary embodiment of the present invention, the first gasket SPC1 and the second gasket SPC2 may be disposed adjacent to the first peripheral areas AR_E, AR_W, AR_S and AR_N. This may be able to more effectively improve the heat dissipation efficiency of the first gasket SPC1 and the second gasket SPC2. In addition, the first gasket SPC1 may partially overlap the second peripheral regions AR_SE, AR_SW, AR_NE, and AR_NW, and the second gasket SPC2 may not overlap the second peripheral regions AR_SE, AR_SW, AR_NE, and AR_NW; however, the inventive concept is not limited thereto. For example, the first gasket SPC1 and the second gasket SPC2 may not be adjacent to the second peripheral regions AR_SE, AR_SW, AR_NE, and AR_NW having a relatively low temperature. According to an exemplary embodiment of the inventive concept, when compared with the comparative example, as shown in FIG. FIG. 6A to FIG. 6C As shown in curves B, D, and F of FIG. 5 , the spatial variation of the temperature of the second plate 500 can be relatively reduced.

[0103] Therefore, according to exemplary embodiments of the inventive concept, it may be possible to improve deposition uniformity of the deposition apparatus 1000 .

[0104] Figure 7 is a cross-sectional view illustrating a deposition apparatus 1000 - 1 according to an exemplary embodiment of the present inventive concept, and Figure 8 is a diagram showing an exemplary embodiment according to the inventive concept Figure 7 An enlarged perspective view of a region of the diffuse structure DAS-1 is shown in FIG.

[0105] In order to reduce the complexity in the drawings and provide a better understanding of the inventive concept, some elements of the deposition apparatus that may be considered to be the same or substantially similar to the previously discussed elements may be omitted. For the sake of brevity of description, previously described elements may be represented by similar or identical reference numerals without repeated overlapping descriptions of the elements.

[0106] Reference Figure 7 and Figure 8, the second plate 500 and the heat dissipation member 600-1 may be provided to constitute a single object or a single body. In this case, a connection member connecting the bottom 620 and the second plate 500 to the heat dissipation member 600-1 may be omitted.

[0107] For example, the second plate 500 and the heat dissipation member 600-1 may be formed at the same time. In other words, the second plate 500 and the heat dissipation member 600-1 may include substantially the same material. As an example, the second plate 500 and the heat dissipation member 600-1 may include a metal material.

[0108] Fig. 9 is a top plan view illustrating a diffusion structure DAS-2 according to an exemplary embodiment of the inventive concept.

[0109] In order to reduce the complexity in the drawings and provide a better understanding of the inventive concept, some elements of the deposition apparatus that may be considered to be the same or substantially similar to the previously discussed elements may be omitted. For the sake of brevity of description, previously described elements may be represented by similar or identical reference numerals without repeated overlapping descriptions of the elements.

[0110] Reference Fig. 9 , each of the first gasket SPC1 - 2 and the second gasket SPC2 - 2 may include a plurality of sub-gaskets SSP1 and SSP2 .

[0111] For example, each first gasket SPC1-2 may include a plurality of first sub-gaskets SSP1. The first sub-gaskets SSP1 may be arranged on the peripheral portion 520 and arranged along the first direction DR1. The first sub-gaskets SSP1 may be spaced apart from each other. A length D1 of a region of the peripheral portion 520 where the first sub-gaskets SSP1 are disposed in the first direction DR1 may be shorter than a length DL of the first side S1.

[0112] Each second gasket SPC2-2 may include a plurality of second sub-gaskets SSP2. The second sub-gaskets SSP2 may be arranged on the peripheral portion 520 along the second direction DR2. The second sub-gaskets SSP2 may be spaced apart from each other. A length D2 of a region of the peripheral portion 520 where the second sub-gaskets SSP2 are disposed in the second direction DR2 may be shorter than a length DS of the second side S2.

[0113] Fig.10 and Fig.11 2 is a top plan view illustrating diffusion structures DAS- 3 and DAS- 4 according to an exemplary embodiment of the inventive concept.

[0114] In order to reduce the complexity in the drawings and provide a better understanding of the inventive concept, some elements of the deposition apparatus that may be considered to be the same or substantially similar to the previously discussed elements may be omitted. For the sake of brevity of description, previously described elements may be represented by similar or identical reference numerals without repeated overlapping descriptions of the elements.

[0115] Reference Fig.10 and Fig.11 , from a plan view, each of the first gaskets SPC1-3 and SPC1-4 and the second gaskets SPC2-3 and SPC2-4 according to an exemplary embodiment of the inventive concept may have a relatively reduced width at its opposite ends in its extending direction. For example, the width of each of the first gaskets SPC1-3 and SPC1-4 in the second direction DR2 may be smaller at its opposite ends in the first direction DR1 than at its central area. The width of each of the second gaskets SPC2-3 and SPC2-4 in the first direction DR1 may be smaller at its opposite ends in the second direction DR2 than at its central area.

[0116] As an example, Fig.10 As shown in , when viewed in a plan view, the side surface SS-3 of each of the first gasket SPC1-3 and the second gasket SPC2-3 may have a chamfered shape. For example, each of the first gasket SPC1-3 and the second gasket SPC2-3 may have a hexagonal shape or another polygonal shape.

[0117] In addition, if Fig.11 As shown in FIG. 5 , the side surface SS-4 of each of the first gasket SPC1 - 4 and the second gasket SPC2 - 4 may have a curved surface. For example, when viewed in a plan view, the side surface SS-4 may have a shape convex toward the diffusion part 510 .

[0118] According to exemplary embodiments of the inventive concept, uniformity of a film deposited by a deposition apparatus may be improved by improving deposition uniformity in a deposition process.

[0119] While the inventive concepts have been described with reference to exemplary embodiments of the inventive concepts, persons skilled in the art will recognize that various changes in form and details may be made therein without departing from the spirit and scope of the inventive concepts.

Claims

1. A deposition device, comprising: Chamber; Deposition sources, including deposition materials; a workbench, disposed in the chamber, on which a target object is mounted; a first plate coupled to the chamber to define a space; a second plate disposed between the first plate and the workbench, wherein the second plate includes a plurality of diffusion holes disposed therein; a heat dissipation member in contact with the first plate and the second plate, wherein the heat dissipation member includes a plurality of side wall portions, wherein the plurality of side wall portions are connected to each other to form a frame shape surrounding outer side surfaces of the first plate and the second plate; and a gasket coupled to a first side wall portion of the plurality of side wall portions and disposed between the first plate and the second plate, wherein the gasket extends parallel to the first side wall portion, Wherein, an extension length of the gasket is shorter than an extension length of the first side wall portion.

2. The deposition apparatus according to claim 1, wherein: The gasket is disposed in a central area of ​​the first side wall portion.

3. The deposition apparatus according to claim 1, wherein: The gasket is in direct contact with the first plate and the second plate.

4. The deposition apparatus according to claim 1, wherein: The second plate includes a first side and a second side, the first side faces each other and extends in a first direction, the second side faces each other and extends in a second direction intersecting the first direction, Wherein, the gasket is a plurality of gaskets, The plurality of gaskets include: first gaskets extending along the first side and facing each other; and second gaskets extending along the second side and facing each other, and Wherein, an extension length of each of the second gaskets is shorter than an extension length of each of the first gaskets.

5. The deposition apparatus of claim 4, wherein: A ratio of an extension length of each of the first spacers to a length of the first side of the second plate is in a range of 60% to 70%.

6. The deposition apparatus of claim 4, wherein: A ratio of an extension length of each of the second spacers to a length of the second side of the second plate is in a range of 20% to 30%.

7. The deposition apparatus of claim 1, wherein: The second plate comprises: a diffusion portion, comprising the plurality of diffusion holes; and The peripheral portion surrounds the diffusion portion, wherein the gasket is disposed on the peripheral portion.

8. The deposition apparatus of claim 1, wherein: The heat dissipation member further includes a plurality of bottom portions, wherein each of the plurality of bottom portions is bent from a bottom end of each of the plurality of side wall portions and is disposed below the second plate, and Each of the plurality of side wall portions includes: a first portion including an inner surface connected to the first plate; a second portion coupled to a bottom end of the first portion and including an inner surface coupled to the gasket; and a third portion connecting the bottom end of the second portion to the bottom of the heat dissipation member, wherein the inner surface of the third portion is connected to the second plate.

9. The deposition apparatus of claim 1, wherein: The second plate and the heat dissipating member are a single object. 10 . The deposition apparatus of claim 1 , further comprising a voltage generator electrically connected to the second plate and configured to provide a voltage to the second plate to generate an electric field between the second plate and the stage.

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