Optical element drive mechanism frame

Abstract

The present invention discloses a frame of an optical element driving mechanism, which includes a base, a carrier, a first group of memory alloys and a second group of memory alloys. The frame includes two pairs of opposite first side portions of the frame and two pairs of opposite second side portions of the frame, the inner surface of the first side portion of the frame is provided with a first frame step portion to cooperate with the first group of memory alloys, and the inner surface of the second side portion of the frame is provided with a second frame step portion to cooperate with the second group of memory alloys. The first frame step portion extends laterally along the first side portion of the frame and has an arc-shaped structure protruding in a direction away from the base, and the second frame step portion extends laterally along the second side portion of the frame and has an arc-shaped structure protruding in a direction toward the base. The frame of the present invention assists the optical element driving mechanism in providing the maximum thrust, thereby solving the problem of insufficient thrust.

Description

Technical Field

[0001] The invention relates to the technical field of optical imaging equipment, and in particular to an optical element driving mechanism frame. Background Art

[0002] With the widespread popularity of smart phones, the application scope of mobile phone cameras is getting wider and wider. However, the current lens drive mechanism has electromagnetic interference, and auxiliary components such as balls and suspension wires have complex structures, complex assembly, and low reliability. At the same time, sensors are needed to assist in actual operation. As for the memory alloy drive solution, most of the current solutions use a single memory alloy, or two memory alloys distributed one up and one down, and the thrust in a single direction is not enough to support the current market demand. Summary of the invention

[0003] The purpose of the present invention is to provide an optical element driving mechanism frame to solve the above-mentioned problems in the prior art.

[0004] In order to solve the above problems, according to one aspect of the present invention, an optical element driving mechanism frame is provided, the optical element driving mechanism includes a base, a carrier, a first group of memory alloys and a second group of memory alloys, the frame includes two pairs of opposite frame first side portions and two pairs of opposite frame second side portions, the inner surface of the frame first side portion is provided with a first frame step portion to cooperate with the first group of memory alloys, the inner surface of the frame second side portion is provided with a second frame step portion to cooperate with the second group of memory alloys, wherein the first frame step portion extends laterally along the frame first side portion and has an arc structure protruding in a direction away from the base, and the second frame step portion extends laterally along the frame second side portion and has an arc structure protruding in a direction toward the base.

[0005] In one embodiment, the first frame step is disposed adjacent to a top portion of the frame first side portion, and the second frame step is disposed adjacent to a bottom portion of the frame second side portion.

[0006] In one embodiment, a frame first side driving avoidance groove is formed in the middle of the first side of the frame, the frame first side driving avoidance groove separates the first frame step portion, and the first frame step portion forms the highest point on both sides of the frame first side driving avoidance groove, and a frame second side driving avoidance groove is formed in the middle of the second side of the frame, the second frame step portion extends on both sides of the frame second side driving avoidance groove and forms the lowest point in the frame second side driving avoidance groove.

[0007] In one embodiment, two ends of the first side portion of the frame form a first side portion wire clamp avoidance groove, and the first frame step portion extends from the first side portion drive avoidance groove of the frame to the first side portion wire clamp avoidance groove.

[0008] In one embodiment, two ends of the second side portion of the frame form a second side portion wire clamp avoidance portion of the frame, and the second frame step portion extends from the second side portion wire clamp avoidance portion of the frame to the second side portion drive avoidance groove of the frame.

[0009] In one embodiment, a height of the second side wire clip avoidance portion is higher than a height of the first side wire clip avoidance groove.

[0010] In one embodiment, a corner portion is formed between the first side portion of the frame and the second side portion of the frame, and a side of each corner portion facing the housing forms a frame spring mounting portion.

[0011] In one embodiment, the frame spring installation portion forms a right-angled triangle block, and two right-angled sides of the right-angled triangle block are respectively connected to the inner surfaces of the first side portion of the frame and the second side portion of the frame.

[0012] In one embodiment, the bottom of the wire clamp avoidance portion on the second side of the frame is located in the same plane as the top of the second side of the frame, and the plane where the wire clamp avoidance portion on the second side of the frame is located is lower than the upper surface of the spring installation portion.

[0013] In one embodiment, each of the four corners of the frame is provided with a column, and the height of the column is higher than the height of the spring installation portion, the first side portion of the frame, and the second side portion of the frame.

[0014] The base of the present invention assists the optical element driving mechanism, so that the optical element driving mechanism can provide maximum thrust because it uses two memory alloys in each direction, a total of four memory alloys, to drive, thereby solving the problem of insufficient thrust. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a perspective exploded view of a lens driving mechanism according to an embodiment of the present invention;

[0016] Figure 2 is a perspective view of a frame of one embodiment of the present invention;

[0017] Figure 3 is a perspective view of a carrier according to an embodiment of the present invention, showing a surface of the carrier facing the base;

[0018] Figure 4 yes Figure 3 A top view of a carrier;

[0019] Figure 5is a three-dimensional diagram of a base according to an embodiment of the present invention;

[0020] Figure 6 is a three-dimensional diagram of an upper spring sheet according to an embodiment of the present invention;

[0021] Figure 7 is a three-dimensional diagram of a lower spring leaf according to an embodiment of the present invention;

[0022] Figure 8 is a top view of a base with a lower spring installed according to an embodiment of the present invention;

[0023] Figure 9A-9B is a stereoscopic diagram of a protective buckle from different viewing angles according to an embodiment of the present invention;

[0024] Fig.10 is a three-dimensional diagram of a wire clamp according to an embodiment of the present invention;

[0025] Fig.11 is a perspective view of a lens driving mechanism according to an embodiment of the present invention, wherein the upper spring and the housing are removed;

[0026] Fig.12 A top view of a lens drive mechanism according to an embodiment of the present invention, wherein the housing has been removed;

[0027] Fig.13 is a perspective view of a lens drive mechanism according to an embodiment of the invention, with the housing removed;

[0028] Fig.14 yes Fig.13 A front view of a lens drive mechanism; and

[0029] Fig.15 yes Fig.13 Right side view of the lens drive mechanism. DETAILED DESCRIPTION

[0030] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings so that the purpose, features and advantages of the present invention can be more clearly understood. It should be understood that the embodiments shown in the accompanying drawings are not intended to limit the scope of the present invention, but are only intended to illustrate the essential spirit of the technical solution of the present invention.

[0031] In the following description, certain specific details are set forth for the purpose of illustrating the various disclosed embodiments to provide a thorough understanding of the various disclosed embodiments. However, those skilled in the relevant art will recognize that the embodiments may be practiced without one or more of these specific details. In other cases, well-known devices, structures, and techniques associated with the present application may not be shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

[0032] References throughout the specification to "one embodiment" or "an embodiment" indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of "in one embodiment" or "in an embodiment" in various places throughout the specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any manner in one or more embodiments.

[0033] In the following description, in order to clearly show the structure and working mode of the present invention, many directional words will be used for description, but the words "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", "down", etc. should be understood as convenient terms and should not be understood as restrictive terms.

[0034] Figure 1 FIG. 1 is a perspective exploded view of a lens driving mechanism 100 according to an embodiment of the present invention. Figure 1 As shown, the lens driving mechanism of the present invention generally comprises a housing 10, an upper spring 20, a frame 30, a carrier 40, a protective buckle 50, a memory alloy assembly 60, a lower spring 70, a wire clamp 90, a base 80 and a base metal sheet 80B. The upper spring 20, the frame 30, the carrier 40, the protective buckle 50, the memory alloy assembly 60, the lower spring 70, and the wire clamp 90 are installed in a space defined by the housing 10 and the base 50. Specifically, the upper end of the carrier 40 is movably connected to the frame 30 through the upper spring 20, the first part of the upper spring 20 is connected to the upper end of the carrier 40, and the second part is connected to the frame 30, the base embedded metal sheet 80B is embedded in the base 80, and the lower end of the carrier 40 is movably connected to the base 80 through the lower spring 70. The memory alloy assembly 60 includes a first group of memory alloys 61 and a second group of memory alloys 62, which are respectively arranged on two opposite sides of the carrier 40, and are used to drive the carrier 40 to reciprocate relative to the base 80 and the frame 30 in a direction perpendicular to the base 80, thereby realizing the zoom function. Since two memory alloys are used in each direction for driving, a total of four memory alloys can be used to provide the maximum thrust, solving the problem of insufficient thrust. The various components of the lens driving mechanism 100 of an embodiment of the present invention are described in detail below.

[0035] Figure 2 is a perspective view of the frame 30, and the following reference Figure 2 The frame 30 is described in detail. Figure 2As shown, the frame 30 is formed into a rectangular frame or a square frame structure as a whole, and includes two pairs of opposite first frame side portions 31 and second frame side portions 32, and a corner portion 33 is formed between the first frame side portion 31 and the second frame side portion 32. A frame spring installation portion 34 is formed on one side of each corner portion 33 facing the housing 10, and the frame spring installation portion 34 is formed into a right-angled triangle block as a whole, and two right-angled sides of the right-angled triangle block are respectively connected to the inner surfaces of the first frame side portion 31 and the second frame side portion 32 and are preferably formed integrally.

[0036] The first side portion 31 of the frame cooperates with the first side portion of the base, the first side portion 41 of the carrier, and the first group of memory alloys 61. A first side drive avoidance groove 311 is formed at the approximate middle position of the first side portion 31 of the frame, and a first side wire clamp avoidance groove 312 is formed at both ends of the first side portion 31 of the frame. The inner surface of the first side portion 31 of the frame forms a first frame step portion, which is arranged adjacent to the bottom of the first side portion 31 of the frame and serves as a first group of memory alloy mounting portions 313 of the frame. The height of the first group of memory alloy mounting portions 313 of the frame gradually decreases from the middle to both ends, forming an arc-shaped structure protruding upward, the middle of the arc-shaped structure is separated by the first side drive avoidance groove 311 of the frame, and both ends of the arc-shaped structure extend to the first side wire clamp avoidance groove 312 of the frame. It can be understood by those skilled in the art that the memory alloy mounting portion 313 can also be formed as an inclined surface inclined from the middle to both ends or other similar structures.

[0037] The second side portion 32 of the frame cooperates with the second side portion of the carrier and the second group of memory alloys. A second side driving avoidance groove 321 is formed at the approximate middle position of the second side portion 32 of the frame, and a second side wire clamp avoidance portion 322 is formed at both ends of the second side portion 32 of the frame. The inner surface of the second side portion 32 of the frame (i.e., the surface close to the carrier) forms a step portion, which forms a second group of memory alloy mounting portion 323 of the frame. The second group of memory alloy mounting portion 323 of the frame is a downwardly concave arc surface. Specifically, the arc surface is concave from the second side wire clamp avoidance position 322 of the frame at both ends to the middle, and forms the lowest point at the second side driving avoidance groove 321 of the frame. The two ends of the second group of memory alloys 62 are connected to the wire clamp and cooperate with the second side wire clamp avoidance portion 322 of the frame, and the main part of the second group of memory alloys 62 cooperates with the second group of memory alloy mounting portion 323 of the frame. It will be further described in detail below.

[0038] Continue to refer to Figure 2The height of the frame spring installation part 34 is higher than the height of the frame second side part 32, and the bottom surface of the frame second side wire clamp avoidance part 322 is located at the same horizontal plane as the top surface of the frame second side part 32. In other words, the upper surface of the frame second side part 32 extends leftward and rightward to form the bottom surface of the frame second side wire clamp avoidance part 322. A column 331 is provided on each of the four corners 33. The column 331 is higher than the height of the frame first side part 31, the frame second side part 32 and the frame spring installation part 34. When the housing is installed on the frame, the column 331 can protect the upper spring and the like.

[0039] Figure 3 is a perspective view of the carrier 40, which shows the surface of the carrier 40 facing the base, and the following reference Figure 3 The carrier 40 is described in detail. Figure 3 As shown, a cylindrical opening 400 is formed inside the carrier 40, and the cylindrical opening 400 is used to install a lens (not shown in the figure). A relative carrier first side portion 41 and a carrier second side portion 42 are formed around the cylindrical opening 400. The carrier first side portion 41 corresponds to the frame first side portion 31 and the base first side portion 81 and is used to install a first group of memory alloys 61. The carrier second side portion 42 corresponds to the frame second side portion 32 and the base second side portion 82 and is used to install a second group of memory alloys 62.

[0040] The first side portion 41 of the carrier is provided with a first memory alloy mounting portion 411. In one embodiment, the first memory alloy mounting portion 411 is preferably arranged in the middle of the first side portion 41 of the carrier. The first memory alloy mounting portion 411 includes a first protruding portion 412 protruding outward from the side surface of the carrier, and a wire groove 413 is arranged on the surface of the first protruding portion 412 facing the base to accommodate the first group of memory alloys 61. A first straight groove 414 is arranged in the middle of the first protruding portion 412 to cooperate with the protective buckle 50. A first protrusion 415 is arranged in the first straight groove 414. The first protrusion 415 is used to cooperate with the fixing hole 53 of the protective buckle 50 to position and fix the protective buckle 50. First blocks 416 extending in the up-down direction are formed on both sides of the first straight groove 415, and a first arc portion 417 is formed in the middle of the first wire groove 413. The first group of memory alloys 61 is installed in the first wire groove 413 and arranged around the first arc portion 417. The first arc portion 417 protrudes in the direction of the base. A protective buckle fixing groove 418 is provided on the surface of the carrier 40 close to the first arc-shaped portion 417, and the protective buckle 50 is installed in the first straight groove 415, and the fixing hole 53 in the middle cooperates with the first protrusion 415, and the upper and lower ends thereof are respectively cooperated and fixed with the protective buckle fixing groove 418 and the corresponding end faces of the first protrusion 412, so that the protective buckle 50 is detachably connected to the first memory alloy mounting portion 411 and the first group of memory alloys 61 is confined in the first wire groove 413.

[0041] The two opposite first side portions 41 of the carrier 40 are respectively provided with a memory alloy mounting portion 411. The first memory alloy mounting portions 411 provided on the two first side portions 41 have substantially the same structure, shape and function. When the first group of memory alloys defined in the wire grooves thereof are energized, the carrier is cooperatively driven to move in a direction away from the base, i.e., toward the direction Figure 3 The lower side shown, that is, the direction of the housing, moves along the optical axis of the lens.

[0042] Continue to refer to Figure 3 The second side portion 42 is provided with a second memory alloy mounting portion 421, the second memory alloy mounting portion 421 includes a second protruding portion 422 protruding outward from the side surface of the carrier, and the end surface of the second protruding portion 422 away from the base (i.e. Figure 3 The lower end surface of the protrusion shown in the figure is provided with a second wire groove 423 to accommodate the second group of memory alloy 62, and the middle part of the second protrusion 422 is provided with a second straight groove 424 to cooperate with the protective buckle 50. A second protrusion 425 is provided in the second straight groove 424. The second protrusion 425 is used to cooperate with the fixing hole 53 of the protective buckle 50 to position and fix the protective buckle 50. Second blocks 426 extending in the up-down direction are formed on both sides of the second straight groove 425, and a second arc portion 427 is formed in the middle part of the second wire groove 423. The second arc portion 427 protrudes in a direction away from the base, that is, toward Figure 3 The second group of memory alloys 62 is installed in the wire groove 423 and arranged around the second arc portion 427. The bottom of the second straight groove 425 near the base is provided with a buckle fixing portion 428, and the buckle fixing portion 428 is provided from the surface of the carrier 40 facing the base (i.e. Figure 3 The protective buckle 50 is formed by extending outwardly as shown in the upper surface, and the protective buckle 50 is installed in the second straight groove 425, wherein the fixing hole 53 of the protective buckle 50 cooperates with the second protrusion 425 and the upper and lower ends thereof are respectively cooperated and fixed with the snap fixing portion 428 and the lower end surface of the second protrusion 422, thereby removably connecting the protective buckle 50 to the second memory alloy mounting portion 421 and confining the second group of memory alloys 62 in the second wire groove 423.

[0043] The two opposite second side portions 42 of the carrier 40 are respectively provided with a memory alloy mounting portion 421. The second memory alloy mounting portions 421 provided on the two second side portions 42 have substantially the same structure, shape and function. When the second group of memory alloys defined in the wire grooves thereof are energized, the carrier is cooperatively driven to move toward the base along the optical axis direction of the lens, i.e., toward the Figure 3 By driving the first group of memory alloys installed on the first side of the carrier and the second group of memory alloys installed on the second side of the carrier, the carrier can reciprocate along the optical axis, thereby realizing the function of optical zoom.

[0044] Continue to refer to Figure 3The surface of the carrier 40 facing the base is provided with a lower spring fixing portion 44, and a lower spring fixing column 441 is provided on the lower spring fixing portion 44. The lower spring fixing portion 44 is preferably provided on the lower surface of the second side portion 42 (the surface facing the base), and preferably two lower spring fixing columns 44 are provided on the lower surface of each side portion 22. A transition side portion 43 is provided between the first side portion 41 and the second side portion 42. The first side portion 41, the second side portion 42 and the transition side portion 43 form a regular hexagonal structure of the carrier 40 as a whole. Notches 431 are provided on the upper and lower surfaces of the transition side portion 43. A support portion 432 is provided in the notch 431 facing the base 80, and the support portion 432 protrudes toward the base 80.

[0045] Figure 4 4 is a top view of the carrier 40, which shows the surface of the carrier 40 away from the base 80, that is, the surface facing the housing 10. Figure 4 As shown, a plurality of carrier upper spring leaf mounting portions 45 are provided on the surface of the carrier 80 away from the base 80, and upper spring leaf positioning holes 451 are provided on the carrier upper spring leaf mounting portions 45. The upper spring leaf positioning holes 451 are aligned with the carrier fixing portion 211 of the upper spring leaf 20 to position the upper spring leaf 20 on the carrier 40. In one embodiment, the upper spring leaf positioning holes 451 are distributed on the upper surfaces of the first side portion 41 and the second side portion 42 of the carrier 40 (i.e., the surface away from the base). A avoidance block 46 is also provided on the surface of the carrier 40 away from the base 80, and when the upper spring leaf 20 is mounted on the carrier 40, it avoids the avoidance block 46. The avoidance block 46 is formed by protruding a certain distance from the upper surface of the carrier 40 toward the direction away from the base. In one embodiment, the avoidance block 46 is disposed above the first side portion 41 and the second side portion 42 of the carrier 40. In one embodiment, an upper spring positioning hole 451 and an avoidance block 46 are respectively disposed on the upper surfaces of the first side portion 41 and the second side portion 42. Preferably, the upper spring positioning hole 451 and the avoidance block 46 are arranged at intervals on the surface of the carrier 40 away from the base 80, that is, one positioning hole 451 is arranged around the cylindrical opening 400, and another avoidance block 46 is arranged. Preferably, the positioning hole 451 and the avoidance block 46 are evenly spaced around the cylindrical opening 400 on the surface of the carrier 40 away from the base.

[0046] Figure 5 It is a three-dimensional diagram of the base 80, and the following is combined with Figure 5 The base 80 is described in detail. Figure 5As shown, the base 80 forms a rectangular structure as a whole and includes a bottom plate 80A, a center hole 800 is formed in the middle of the bottom plate 80A to cooperate with the cylindrical opening 400 of the carrier 40, two base first side portions 81 facing each other and two base second side portions 82 facing each other are formed around the center hole 800, the base first side portion 81 cooperates with the carrier first side portion 41, the frame first side portion 31 and the first group of memory alloys 61, and the base second side portion 82 cooperates with the carrier second side portion 42, the frame second side portion 32 and the second group of memory alloys 62.

[0047] A first baffle 813 extending upward (i.e., toward the housing) from the bottom plate 80A is provided in the middle of the first side portion 81. A first middle notch 811 is formed in the middle of the first baffle 813, and first two side notches 812 are formed on both sides of the first baffle 813. The first middle notch 811 cooperates with the first memory alloy mounting portion 41 on the carrier 40, thereby avoiding the first memory alloy mounting portion 411. The width of the first two side notches 812 is smaller than that of the first middle notch 811, and is disposed adjacent to the corner 83. A first step portion 814 is provided on the inner wall of the baffle 813 near the center hole 800. The first step portion 814 extends from the first two side notches 812 to the first middle notch 811, and is inclined downward from the first two side notches 812 to the first middle notch 811, thereby forming an arrangement in which the portion near the first two side notches 812 is high and the portion near the first middle notch 811 is low. The first group of memory alloys 61 mounted on the first memory alloy mounting portion 411 of the carrier 40 is arranged on the step portion 814 and extends on the first step portion 814, and is fixed to the base 80 through the first wire clamps 91 at both ends and is connected to the circuit of the metal sheet 80B embedded in the base, so that current is introduced into the first group of memory alloys 61 through the metal sheet 80B embedded in the base to drive the carrier 40 to move along the optical axis in the direction away from the base, which will be described in detail below.

[0048] The second side portion 82 of the base 80 is similar to the first side portion 81 of the base, and the difference mainly lies in the inclination direction and degree of inclination of the step portion. Specifically, a second baffle 823 extending upward (i.e., toward the direction of the housing) from the bottom plate 80A is provided in the middle of the second side portion 82, a second middle notch 821 is formed in the middle of the second baffle 823, and second two side notches 822 are formed on both sides of the second baffle 823. The second middle notch 821 cooperates with the second memory alloy mounting portion 42 on the carrier 40, thereby avoiding the second memory alloy mounting portion 421. The width of the second two side notches 822 is larger than that of the second middle notch 821 and is disposed adjacent to the corner 83, so as to avoid the second wire clamp 92. A second step portion 824 is provided on the inner wall of the baffle 823 near the center hole 800. The second step portion 824 extends from the second side notches 822 to the second middle notch 821, and is inclined downward from the second middle notch 821 to the second side notches 822, so that the portion near the second middle notch 821 is high and the portion near the second side notches 822 is low. The second group of memory alloys 62 mounted on the second memory alloy mounting portion 421 of the carrier 40 is arranged on the second step portion 824 and extends on the second step portion 824, and is fixed to the base 80 at both ends through the wire clamps 90 and communicated with the base embedded metal sheet 80B, so that current is introduced into the second group of memory alloys 62 through the base embedded metal sheet 80B to drive the carrier 40 to move along the optical axis toward the base, which will be described in detail below.

[0049] In one embodiment, the inclination of the first step portion 814 is greater than the inclination of the second step portion 824 .

[0050] The first side portion of the base and the second side portion of the base are connected by a base corner portion 83. The structure and function of each base corner portion 83 are the same, and one of the base corner portions 83 will now be described. A wire clamp mounting portion 831 is provided on the inner side of the base corner portion 83, and a boss 832 is provided on the outer side of the wire clamp mounting portion 831 to serve as a lower spring mounting portion. The boss 832 is formed by extending upward from the bottom plate 80A for a certain distance, and the extension distance is less than the height of the first baffle 811 of the first side portion 81 and less than the height of the second baffle 821 of the second side portion 81. A wire clamp fixing column 833 is provided on the surface of the wire clamp mounting portion 831, and a base lower spring fixing column 834 is provided on the upper surface of the boss 832. The fixing hole 915 of the first wire clamp 91 or the fixing hole 925 of the second wire clamp 92 cooperates with the wire clamp fixing column 833, so that the wire clamp 90 is fixedly mounted on the wire clamp mounting portion 831. In one embodiment, the wire clamp 90 can be fixed to the base by means such as hot riveting. The base fixing hole 715 of the lower spring 70 cooperates with the lower spring fixing column 834 of the base 80, so that the base connecting portion of the lower spring 70 is fixedly mounted on the base 80. The base embedded metal sheet 80B is embedded in the base 80 and provides circuit connection for the memory alloy group 60.

[0051] Figure 6 It is a three-dimensional diagram of the upper spring 20, and the following reference Figure 6 The upper spring 20 is described in detail. Figure 6 As shown, the upper spring leaf 20 generally includes a first portion 21 located in the inner circle and a second portion 22 located in the outer circle, and the first portion 21 and the second portion 22 are connected by an elastic strip 23, so that the first portion 21 and the second portion 22 can move within a certain range. The first portion 21 located in the inner circle is connected to the carrier 40, and the second portion 22 located in the outer circle is connected to the frame 30, so that the carrier 40 and the frame 30 are movably connected through the upper spring leaf 20.

[0052] In one embodiment, the first part 21 includes a closed ring body 210, on which upper spring carrier connection parts 211 are arranged at equal distances, and the upper spring carrier connection parts 211 are provided with a plurality of connection holes 212, so as to be fixed to the position where the upper spring positioning holes 45 of the carrier 40 are located by means such as gluing. The second part 22 is composed of independent frame connection parts 221 located at the four corners of the upper spring 20, and the frame connection parts 221 are provided with frame connection holes 222. The frame connection parts 221 of the upper spring 20 cooperate with the frame spring installation parts 34 of the frame 30, and are fixed to each other by means such as gluing.

[0053] Figure 7 is a three-dimensional diagram of the lower reed 70, Figure 8 This is a top view of the base with the lower spring installed. Figure 7-Figure 8 The lower spring 70 is described in detail. Figure 7-8As shown, the lower spring leaf 70 as a whole includes a first part 71 and a second part 72 which are independent of each other. The first part 71 includes a carrier connection part 711 located in the middle and a base connection part 712 located at both ends. The carrier connection part 711 and the base connection part 712 are connected by an elastic strip 713, so that the carrier connection part 711 and the base connection part 712 can move relative to each other within a certain range. The carrier connection part 711 is installed on the lower spring leaf connection part 44 on the lower surface of the carrier 40. In one embodiment, the carrier connection part 711 is provided with a carrier connection hole 714 to cooperate with the lower spring leaf fixing column 441 on the carrier 40, so that the lower spring leaf fixing column 441 extends into the carrier connection hole 714, thereby fixing the first part 71 of the lower spring leaf 70 to the carrier 40. The base connection parts 712 located at both ends cooperate with the bosses 832 on the base 80. In one embodiment, the base connection portion 712 is provided with a base fixing hole 715, and the base fixing hole 715 cooperates with the lower spring fixing column 834 on the boss 832, and the lower spring fixing column 834 is inserted into the base fixing hole 715, so that the first part 71 of the lower spring 70 is fixedly connected to the base 80. Since the carrier connection portion 711 and the base connection portion 712 are connected by an elastic strip, the carrier 40 and the base 80 can move relative to each other.

[0054] The second part 72 includes a carrier connection part 721 located in the middle and a base connection part 722 located at both ends. The carrier connection part 721 and the base connection part 722 are connected by an elastic strip 723, so that the carrier connection part 721 and the base connection part 722 can move relative to each other within a certain range. The carrier connection part 721 is installed on the lower spring connection part 44 on the lower surface of the carrier 40. In one embodiment, the carrier connection part 721 is provided with a carrier connection hole 724, and the carrier connection hole 724 cooperates with the lower spring fixing column 441 on the carrier 40, and the lower spring fixing column 441 is extended into the carrier connection hole 724, so that the second part 72 of the lower spring 70 is fixedly connected to the carrier 40. The base connection parts 722 located at both ends cooperate with the bosses 832 on the base 80. In one embodiment, the base connection portion 722 is provided with a base fixing hole 725, and the base fixing hole 725 cooperates with the lower spring fixing column 834 on the boss 832, and the lower spring fixing column 834 is inserted into the base fixing hole 725, so that the second portion 72 of the lower spring 70 is fixedly connected to the base 80. Since the carrier connection portion 721 and the base connection portion 722 are connected by the elastic strip 723, the carrier 40 and the base 80 can move relative to each other.

[0055] In one embodiment, the second part 72 is completely identical in structure and shape to the first part 71 and is enclosed as a whole to form a rectangular structure, the base connection parts are located at the four corners, and the carrier connection parts are located at two opposite sides. In one embodiment, the carrier connection parts of the first part 71 and the second part 72 cooperate with the lower spring mounting part 44 provided on the lower surface of the second side part 42 of the carrier 40, and the base connection parts of the first part 71 and the second part 72 cooperate with the bosses 832 on the four corners of the base 80, so that the lower end of the carrier 40 is movably connected to the base 80 through the first part 71 and the second part 72.

[0056] Figure 9A-9B 50 are three-dimensional images from different viewing angles. Figure 9A-9B As shown, the protective buckle 50 includes a protective buckle body 51, and buckle parts 52 are provided at both ends of the protective buckle body 51. A mounting hole 53 is provided in the middle of the protective buckle body 51. The buckle parts 52 at both ends are respectively inserted into the protective buckle fixing groove 418 of the first memory alloy mounting part on the carrier 40 and the end close to the shell, or inserted into the buckle fixing part 428 of the second memory alloy mounting part and the end close to the base of the second memory alloy mounting part, so as to confine the memory alloy in the memory alloy mounting part. In one embodiment, the protective buckle is a metal protective buckle, which prevents the memory alloy from falling, etc., and the metal protective buckle can also help the memory alloy to dissipate heat.

[0057] Fig.10 90 is a three-dimensional diagram of the wire clamp. Fig.10 As shown, the wire clamp 90 includes a first wire clamp 91 and a second wire clamp 92. The wire clamp 90 is generally arranged at the wire clamp mounting portion 831 of the corner portion 83 of the base 80. Specifically, the first wire clamp 91 is mounted on the first side portion 81 of the base 80, and the second wire clamp 92 is mounted on the second side portion 82 of the base 80. Since the first side portion 81 of the base 80 is used to cooperate with the first side portion 41 of the carrier 40, and the second side portion 82 of the base 80 is used to cooperate with the second side portion 42 of the carrier 40, the memory alloy mounting portions arranged on the first side portion 41 and the second side portion 42 of the carrier 40 are different, the wire groove 413 of the first memory alloy mounting portion 411 on the first side portion 41 of the carrier 40 opens toward the base 80, and the wire groove 423 of the second memory alloy mounting portion 421 on the second side portion 42 of the carrier 40 opens away from the base 80, resulting in differences between the first wire clamp 91 and the second wire clamp 92.

[0058] Specifically, with reference to Fig.11 , Fig.14 and Fig.15, the height of the first wire clamp 91 is higher than that of the second wire clamp 92. This is because the middle part of the first group of memory alloys 61 installed on the first side portion 41 of the carrier 40 (i.e., the part located at the first memory alloy installation portion 411) is close to the base 80, and the parts close to the two ends, i.e., close to the wire clamp, are far away from the base 80. Therefore, when the base is located at the bottom and the shell is located at the top, the first memory alloy 61 installed on the first side portion 41 of the carrier forms a layout with high ends and low middle as a whole, so the height of the first wire clamp 91 needs to be higher.

[0059] Correspondingly, the second wire clamp 92 is installed on the second side 82 of the base 80. Since the second side 82 of the base 80 corresponds to the second side 42 of the carrier 40, the second side 42 of the carrier 40 is provided with a second memory alloy mounting portion 421. The opening of the wire groove 423 of the second memory alloy mounting portion 421 faces the direction away from the base 80, that is, the direction of the shell. Therefore, when the second group of memory alloys 62 is installed on the second alloy mounting portion 423, when the arrangement is described as the base is located at the bottom and the shell is located at the top, the second group of memory alloys 62 as a whole forms an arrangement with a high middle and low ends. Therefore, the height of the second wire clamps 92 at both ends of the second group of memory alloys 62 installed on the second side 42 of the carrier 40 is lower.

[0060] Return to reference Fig.10 The first wire clamp 91 includes a vertical portion 911 and a horizontal portion 912. The vertical portion 911 is formed by integrally extending upward from the horizontal portion 912 and provided with a protruding portion 913 protruding outward. A step 914 is formed between the protruding portion 913 and the outer surface of the vertical portion 911. The horizontal portion 912 extends along the inner wall of the first side portion 81 of the base 80 and is provided with a fixing hole 915. The fixing hole 915 cooperates with the wire clamp fixing column 833 on the wire clamp mounting portion 831 on the base 80 to fix the first wire clamp 91 to the base 80 by means such as hot riveting. The second wire clamp 92 includes a vertical portion 921 and a horizontal portion 922. The vertical portion 921 is formed by integrally extending upward from the horizontal portion 922 and provided with a protruding portion 923 protruding outward. A step 924 is formed between the protruding portion 923 and the outer surface of the vertical portion 921. The horizontal portion 922 extends along the inner wall of the second side portion 82 of the base 80 and is provided with a fixing hole 925, which cooperates with the wire clamp fixing column 833 on the wire clamp mounting portion 831 on the base 80 to fix the second wire clamp 92 to the base 80 by means such as hot riveting. It should be noted that the height of the vertical portion 911 of the first wire clamp 91 is higher than the height of the vertical portion 921 of the second wire clamp 92.

[0061] Refer to the following Figure 11-15 The assembly state of the lens driving mechanism 100 according to one embodiment of the present invention is described.

[0062] Fig.11is a perspective view of a lens driving mechanism 100 according to an embodiment of the present invention, wherein the upper spring and the housing are removed; Fig.12 A top view of a lens drive mechanism 100 according to an embodiment of the present invention, wherein the housing has been removed; Fig.13 is a perspective view of a lens driving mechanism 100 according to an embodiment of the invention, wherein the housing is removed; Fig.14 yes Fig.13 A front view of the lens driving mechanism 100; and Fig.15 yes Fig.13 A right side view of the lens driving mechanism 100 is shown in FIG.

[0063] like Figure 11-15 As shown, the base embedded metal sheet 80B is embedded in the base 80, and the wire clip 90 is fixed to the wire clip installation part 831 formed on the inner side of the corner 83 of the base 80, wherein the first wire clip 91 is arranged along the first side 81 of the base 80 and is electrically connected to the base embedded metal sheet 80B, and the second wire clip 92 is arranged along the second side 82 of the base 80 and is electrically connected to the base embedded metal sheet 80B, and the memory alloy component 60 includes a first group of memory alloys 61 and a second group of memory alloys 62, the first group of memory alloys 61 is installed on the first memory alloy installation part 411 arranged on the first side 41 of the carrier 40 and is fixed by the protective buckle 50, and is fixedly connected to the first wire clip 91 at both ends. The second group of memory alloys 62 is installed on the second memory alloy installation part 421 arranged on the second side 42 of the carrier 40 and is fixed by the protective buckle 50, and is fixedly connected to the second wire clip 92 at both ends. The first portion 71 and the second portion 72 of the lower spring 70 are disposed on the lower surface of the opposite second side portion 82 of the base 80 and the lower surface of the opposite second side portion 42 of the carrier 40 .

[0064] Specifically, refer to Figure 8 The arrangement shown in FIG. 1 shows a first portion 71 of the lower spring 70 disposed at Figure 8 In the upper part shown, the second portion 72 of the lower spring 70 is arranged at Figure 8 In the lower half shown, the carrier mounting portion 711 of the first portion 71 and the carrier mounting portion 721 of the second portion 72 are respectively used to connect the lower spring mounting portion 44 arranged on the lower surface of the second side portion 42 of the carrier 40, and the base mounting portion 712 of the first portion 71 and the base mounting portion 722 of the second portion 72 are respectively connected to the lower spring mounting portion 832 on the lower bottom surface of the base 80, and the lower spring fixing column 834 is accommodated in the base fixing hole 715 of the first portion 71 and the base fixing hole 725 of the second portion 72 of the lower spring 70, so that the base 80 and the bottom surface of the carrier 40 are movably connected through the lower spring 70.

[0065] Reference Fig.12, the inner circle (i.e., the first part) 21 of the upper spring sheet 20 is fixedly connected to the upper spring sheet mounting portion 45 on the upper surface of the carrier 40, and the outer circle (i.e., the second part) 22 of the upper spring sheet 20 is connected to the upper spring sheet mounting portion 34 at the corner of the frame 30, so that the carrier 40 and the frame 30 are movably connected. The first side driving avoidance groove 312 of the frame 30 is equal to the width of the first middle notch 811 of the base 80 and cooperates with each other to enclose a rectangular opening to avoid the first memory alloy driving portion 411 on the carrier 40. The first side wire clamp avoidance groove 312 of the frame 30 corresponds to the first two side notches 812 on the base 80 and forms an opening to avoid the first wire clamp 712. Similarly, the second side driving avoidance groove 322 of the frame 30 is equal to the width of the second middle notch 821 of the base 80 and cooperates with each other to enclose a rectangular opening to avoid the second memory alloy driving portion 421 on the carrier 40. The frame second side wire clamp avoidance groove 322 of the frame 30 corresponds to and cooperates with the second side notches 822 on the base 80 to form an opening for avoiding the second wire clamp 722 .

[0066] Reference Figure 13-Figure 15 When the first group of memory alloys 61 on the opposite side is energized, the carrier 40 is driven to move upward relative to the base 80 and the frame 30 (i.e., in a direction away from the base 80), and when the second group of memory alloys 62 on the other opposite side is energized, the carrier 40 is driven to move downward relative to the base 80 and the frame 30 (i.e., in a direction close to the base 80), so that by controlling the current in the first group of memory alloys 61 and the second group of memory alloys 62, the carrier 40 can be moved in the up and down directions. When a lens is installed in the carrier 40, by controlling the current in the first group of memory alloys 61 and the second group of memory alloys 62, the carrier 40 can drive the lens to reciprocate along the optical axis direction, thereby realizing the zoom function.

[0067] The preferred embodiments of the present invention have been described in detail above, but it should be understood that after reading the above teachings of the present invention, those skilled in the art may make various changes or modifications to the present invention. These equivalent forms also fall within the scope defined by the appended claims of this application.

Claims

1. An optical element driving mechanism frame, the optical element driving mechanism comprising a base, a carrier, a first group of memory alloys and a second group of memory alloys, characterized in that: The frame comprises two pairs of opposite first side portions of the frame and two pairs of opposite second side portions of the frame, the inner surface of the first side portion of the frame is provided with a first frame step portion to match with the first group of memory alloys, the inner surface of the second side portion of the frame is provided with a second frame step portion to match with the second group of memory alloys, wherein the first frame step portion extends transversely along the first side portion of the frame and has an arc-shaped structure protruding in a direction away from the base, and the second frame step portion extends transversely along the second side portion of the frame and has an arc-shaped structure protruding in a direction toward the base; A first side driving avoidance groove is formed in the middle of the first side of the frame, the first side driving avoidance groove separates the first step portion of the frame, and the first step portion of the frame forms the highest point on both sides of the first side driving avoidance groove, a second side driving avoidance groove is formed in the middle of the second side of the frame, and the second step portion of the frame extends on both sides of the second side driving avoidance groove and forms the lowest point in the second side driving avoidance groove of the frame; The first frame step portion is disposed adjacent to the top of the first side portion of the frame, and the second frame step portion is disposed adjacent to the bottom of the second side portion of the frame; both ends of the first side portion of the frame form a first side portion wire clamp avoidance groove, and the first frame step portion extends from the first side portion of the frame to the first side portion wire clamp avoidance groove; Two ends of the second side portion of the frame form a second side portion wire clamp escape portion of the frame, and the second frame step portion extends from the second side portion wire clamp escape portion of the frame to the second side portion driving escape groove of the frame.

2. The frame according to claim 1, characterized in that The height of the second side wire clamp avoidance portion is higher than the height of the first side wire clamp avoidance groove.

3. The frame according to claim 1, characterized in that A corner portion is formed between the first side portion of the frame and the second side portion of the frame, and a frame spring installation portion is formed on a side of each corner portion facing the housing.

4. The frame according to claim 1, characterized in that The frame spring installation portion forms a right-angled triangle block, and two right-angled sides of the right-angled triangle block are respectively connected to the inner surfaces of the first side portion of the frame and the second side portion of the frame.

5. The frame according to claim 3, characterized in that The bottom of the wire clamp avoidance portion on the second side of the frame is located in the same plane as the top of the second side of the frame, and the plane where the wire clamp avoidance portion on the second side of the frame is located is lower than the upper surface of the leaf spring mounting portion.

6. The frame according to claim 3, characterized in that Each of the four corners of the frame is provided with a column, and the height of the column is higher than the height of the spring installation portion, the first side portion of the frame and the second side portion of the frame.

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