Laser device and method for stabilizing emitted laser

Abstract

The present application discloses a laser device and a method for stabilizing the laser light emitted, and relates to the technical field of laser equipment. The laser device of the present application includes a support seat, a light-emitting component, a cylindrical lens, and a base heat sink. The support seat has an installation space; the light-emitting component is arranged in the installation space, and the light-emitting component includes a laser chip and a chip heat sink; the cylindrical lens is connected to the support seat and is located at the opening of the installation space; wherein the fast axis direction of the laser chip is toward the cylindrical lens, and the cylindrical lens is used to align the fast axis of the laser chip. The support seat and the chip heat sink are both welded to the base heat sink. The present application uses the cylindrical lens to fast-axis collimate the light emitted by the light-emitting component, thereby compressing the divergence angle in the fast axis direction of the laser chip, thereby improving the pumping efficiency and the uniformity of the pumping light. In addition, the present application welds the support seat and the chip heat sink to the same base heat sink, thereby making the light spot formed by the light-emitting component more stable after fast axis collimation, and the stability of the laser device is higher.

Description

Technical Field

[0001] The present application relates to the technical field of laser equipment, and more particularly to a laser device and a method for stabilizing the emitted laser. Background Art

[0002] A laser device is a device that can emit laser. Commonly used laser devices are semiconductor laser devices that pump solid laser crystals.

[0003] In the prior art, a laser device generally includes a support base and a light-emitting element disposed in the support base. The light emitted by the light-emitting element is generally emitted directly, resulting in a large fast axis divergence angle, low pumping efficiency and low uniformity of the pumping light.

[0004] Due to the change in the fast-axis divergence angle, the emitted laser light is not stable, thus causing the light spot formed by the light-emitting element to be unstable. Summary of the Invention

[0005] The purpose of the present application is to provide a laser device that can perform fast-axis collimation on light emitted by a light-emitting element through a cylindrical lens.

[0006] The present application also aims to provide a method for stabilizing the divergence angle of the laser in the fast axis direction, which can make the light spot formed by the light emitting element after fast axis collimation more stable.

[0007] The embodiment of the present application is implemented as follows:

[0008] A laser device includes a support base, a light-emitting component and a cylindrical lens, wherein the support base has an installation space; the light-emitting component is arranged in the installation space, and the light-emitting component includes a laser chip and a chip heat sink; the cylindrical lens is connected to the support base and is located at the opening of the installation space; wherein the emission direction of the light emitted by the laser chip is toward the cylindrical lens, and the cylindrical lens is used to perform fast-axis collimation on the light emitted by the laser chip.

[0009] In one embodiment, the support seat has a third surface and a fourth surface arranged opposite to each other; and a first surface and a second surface arranged opposite to each other; the installation space is a through groove that passes through the first surface, the second surface, the third surface and the fourth surface, so that the support seat is divided into a first bracket and a second bracket arranged at intervals by the installation space; wherein the length direction of the installation space is the direction from the third surface to the fourth surface.

[0010] In one embodiment, a plurality of chip heat sinks are provided and distributed in a linear array along the length direction of the installation space; a plurality of laser chips are provided and distributed in a linear array along the length direction of the installation space and are sandwiched between two adjacent chip heat sinks; a plurality of cylindrical lenses are provided and distributed in a linear array along the length direction of the installation space and correspond to each laser chip respectively.

[0011] In one embodiment, the installation space includes a first card slot and a second card slot that are arranged in communication with each other, and the slot width of the second card slot is smaller than the slot width of the first card slot; wherein, the first card slot is opened on the first surface, and the second card slot is opened on the second surface.

[0012] In one embodiment, the laser device includes a base heat sink, which is connected to the support base and to the chip heat sink; wherein the cylindrical lens is connected to the first surface, and the cylindrical lens and the base heat sink are respectively located on both sides of the light-emitting component.

[0013] In one embodiment, the support base and the chip heat sink are both welded to the base heat sink.

[0014] In one embodiment, the laser device includes a base plate connected to the basic heat sink; wherein the basic heat sink has a seventh surface and an eighth surface arranged opposite to each other, the seventh surface is connected to the second surface, and the eighth surface is connected to the base plate.

[0015] In one embodiment, a protrusion is provided on the seventh surface; the protrusion extends into the installation space and is connected to the light-emitting component.

[0016] In one embodiment, the thickness of the protrusion is 0.1-6 mm.

[0017] In one embodiment, the seventh surface is provided with an assembly groove, and the support seat is provided in the assembly groove; a protrusion is provided on the inner bottom surface of the assembly groove; the protrusion extends into the installation space and is connected with the light-emitting component.

[0018] In one embodiment, the laser device includes a base plate, which is connected to the basic heat sink and the support base at the same time; the basic heat sink is arranged in the installation space and connected to the light-emitting component in the installation space.

[0019] A method for stabilizing the emitted laser light, the method being applied to the above-mentioned laser device; the method comprising: welding the support base and the light-emitting component to the base heat sink, and reducing the height difference between the welding surface of the support base and the base heat sink and the welding surface of the light-emitting component and the base heat sink.

[0020] The beneficial effect of the present application compared with the prior art is that the present application uses a cylindrical lens to fast-axis collimate the light emitted by the light-emitting element, thereby compressing the fast-axis divergence angle of the laser chip, thereby improving the pumping efficiency and uniformity of the pumping light.

[0021] In addition, the present application welds the support base and the chip heat sink to the same base heat sink, so that when the temperature changes, the relative thermal expansion of the support base, the chip heat sink and the base heat sink is reduced, thereby reducing the relative position change of the light-emitting component and the cylindrical lens, making the light spot formed by the light-emitting component after fast-axis collimation more stable and the laser device more stable.

[0022] Furthermore, the present application reduces the height difference between the welding surface of the support base and the basic heat sink and the welding surface of the light-emitting component and the basic heat sink, thereby reducing the relative position change of the light-emitting component and the cylindrical lens when the temperature changes, so that the light spot formed by the light-emitting component after fast axis collimation is more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 This is a schematic structural diagram of a laser device according to an embodiment of the present application;

[0025] Figure 2 This is a schematic structural diagram of a light-emitting element and a cylindrical lens according to an embodiment of the present application;

[0026] Figure 3 This is a schematic structural diagram of a laser device according to an embodiment of the present application;

[0027] Figure 4 This is a schematic structural diagram of a laser device according to an embodiment of the present application;

[0028] Figure 5 This is a schematic structural diagram of a laser device according to an embodiment of the present application;

[0029] Figure 6 This is a schematic diagram showing the position changes of the light-emitting element and the cylindrical lens when the temperature changes according to an embodiment of the present application;

[0030] Figure 7 This is a front view of a laser device according to an embodiment of the present application;

[0031] Figure 8 This is a front view of a laser device according to an embodiment of the present application.

[0032] Icon: 100-laser device; 110-support seat; 110a-first surface; 110b-second surface; 110c-third surface; 110d-fourth surface; 110e-fifth surface; 110f-sixth surface; 111-first bracket; 112-second bracket; 113-installation space; 113a-first card slot; 113b-second card slot; 120-light-emitting part; 121-laser chip; 122-chip heat sink; 120a-light-emitting surface; 130-cylindrical lens; 140-base heat sink; 140a-seventh surface; 140b-eighth surface; 140c-ninth surface; 140d-tenth surface; 141-assembly groove; 142-protrusion; 150-base plate. DETAILED DESCRIPTION

[0033] The terms "first", "second", "third", etc. are only used to distinguish and describe, and do not indicate the order of arrangement, nor can they be understood as indicating or implying relative importance.

[0034] Furthermore, terms such as "horizontal," "vertical," and "overhanging" do not necessarily imply that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0035] In the description of this application, it should be noted that the terms "inside", "outside", "left", "right", "up", "down", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on this application.

[0036] In the description of this application, unless otherwise clearly specified and limited, the terms "set", "install", "connected" and "connect" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be a connection between the internal parts of two elements.

[0037] The technical solution of this application will be clearly and completely described below with reference to the accompanying drawings.

[0038] Please refer to Figure 1, which is a schematic structural diagram of a laser device 100 according to an embodiment of the present application. Laser device 100 includes a support base 110, a light-emitting element 120, and a cylindrical lens 130. Support base 110 has an installation space 113; light-emitting element 120 is disposed within installation space 113; cylindrical lens 130 can be fixedly connected to support base 110 by bonding, snapping, hemming, or ring fixing, and is located at the opening of installation space 113.

[0039] The support base 110 has a first surface 110a, a second surface 110b, a third surface 110c, a fourth surface 110d, a fifth surface 110e, and a sixth surface 110f. In one embodiment, the support base 110 may be a rectangular parallelepiped structure. The direction from the first surface 110a to the second surface 110b is defined as downward, the direction from the third surface 110c to the fourth surface 110d is defined as forward, and the direction from the fifth surface 110e to the sixth surface 110f is defined as rightward, thereby defining six directions: up, down, left, right, front, and back. The first surface 110a is the top surface of the support base 110, the second surface 110b is the bottom surface of the support base 110, the third surface 110c is the rear surface of the support base 110, the fourth surface 110d is the front surface of the support base 110, the fifth surface 110e is the left surface of the support base 110, and the sixth surface 110f is the right surface of the support base 110.

[0040] In this embodiment, the installation space 113 is a through groove that passes through the first surface 110a, the second surface 110b, the third surface 110c and the fourth surface 110d, so that the support base 110 is divided into a first bracket 111 and a second bracket 112 arranged at intervals by the installation space 113; wherein, the length direction of the installation space 113 is the direction from the third surface 110c to the fourth surface 110d, that is, the front and rear direction of the support base 110.

[0041] The installation space 113 is a stepped groove, including a first card groove 113a and a second card groove 113b arranged in communication with each other, and the groove width of the second card groove 113b is smaller than the groove width of the first card groove 113a; wherein, the first card groove 113a is located above the second card groove 113b, the first card groove 113a is opened on the first surface 110a, and the second card groove 113b is opened on the second surface 110b. When the installation space 113 is a stepped groove, the longitudinal cross-section of the first bracket 111 is in an "L" shape, and the second bracket 112 and the first bracket 111 are symmetrical structures.

[0042] In this embodiment, the cylindrical lens 130 is a cylindrical glass lens. The cylindrical lens 130 is bonded to the first surface 110a using an adhesive, which may be a UV adhesive (ultraviolet light-curing adhesive). In one embodiment, a groove is defined in the first surface 110a. The groove provides a reserve for the adhesive, thereby increasing the adhesive bonding surface and improving the reliability and firmness of the connection between the cylindrical lens 130 and the support base 110.

[0043] Please refer to Figure 2 , which is a structural diagram of the light emitting element 120 and the cylindrical lens 130 shown in an embodiment of the present application. The light emitting element 120 includes a laser chip 121 and a chip heat sink 122. The light emitted by the laser chip 121 is emitted in a direction toward the cylindrical lens 130, and the cylindrical lens 130 is used to perform fast axis collimation on the light emitted by the laser chip 121. There can be multiple chip heat sinks 122, and they are arranged along the installation space 113 (see Figure 1 ) are arranged in a linear array along the length of the mounting space 113; in one embodiment, multiple laser chips 121 may be provided and arranged in a linear array along the length of the mounting space 113 and sandwiched between two adjacent chip heat sinks 122; multiple cylindrical lenses 130 are arranged in a linear array along the length of the mounting space 113 and correspond to each laser chip 121. In one embodiment, the chip heat sink 122 may be made of independent ceramic or metal.

[0044] In this embodiment, cylindrical lens 130 is used to collimate the light emitted by light-emitting element 120 along the fast axis, thereby compressing the divergence angle of the laser chip 121 along the fast axis and improving the uniformity of the pump light. In one embodiment, the original 70-degree fast-axis divergence angle is compressed by cylindrical lens 130 to below 40 degrees, for example, to approximately 4 degrees or 27 degrees.

[0045] The dotted line indicates the divergence angle A1 in the fast axis direction when the cylindrical lens 130 is not provided, and the solid line indicates the divergence angle A2 in the fast axis direction after the cylindrical lens 130 is provided, and A1 is greater than A2.

[0046] Please refer to Figure 3 , which is a schematic structural diagram of a laser device 100 according to an embodiment of the present application. The laser device 100 includes a base heat sink 140, which is made of an independent ceramic or metal. The base heat sink 140 is connected to the support base 110 and the chip heat sink 122. A cylindrical lens 130 is connected to the first surface 110a. The cylindrical lens 130 and the base heat sink 140 are respectively located on the upper and lower sides of the light-emitting element 120.

[0047] The base heat sink 140 is a rectangular parallelepiped structure having a seventh surface 140a and an eighth surface 140b disposed opposite each other, as well as a ninth surface 140c and a tenth surface 140d disposed opposite each other. The seventh surface 140a is the top surface of the base heat sink 140, the eighth surface 140b is the bottom surface of the base heat sink 140, the ninth surface 140c is the left surface of the base heat sink 140, and the tenth surface 140d is the right surface of the base heat sink 140.

[0048] The laser device 100 includes a base plate 150, which is connected to both the base heat sink 140 and the support base 110. The base heat sink 140 is disposed within the mounting space 113 of the support base 110, that is, sandwiched between the second bracket 112 and the first bracket 111, and is connected to the light-emitting element 120 within the mounting space 113. The ninth surface 140c and the tenth surface 140d are respectively connected to the left and right inner walls of the mounting space 113. The seventh surface 140a is connected to the chip heat sink 122 of the light-emitting element 120. The eighth surface 140b extends through the mounting space 113 and connects to the base plate 150.

[0049] The support base 110 is welded to the upper surface of the base plate 150. The connection between the base heat sink 140 and the base plate 150 can be welded or integral. The chip heat sink 122 of the light-emitting element 120 is welded to the seventh surface 140a of the base heat sink 140. In one embodiment, a groove is provided at the weld between the support base 110 and the base plate 150 to accommodate solder and ensure a more stable connection.

[0050] Please refer to Figure 4 , which is a schematic structural diagram of the laser device 100 shown in one embodiment of the present application. The seventh surface 140a is connected to the second surface 110b, that is, the support base 110 is welded to the upper surface of the base heat sink 140. The eighth surface 140b is connected to the bottom plate 150. In this embodiment, the bottom plate 150 and the support base 110 are not directly connected. In one embodiment, the connection between the base heat sink 140 and the bottom plate 150 can be welded or integral.

[0051] A protrusion 142 is provided on the seventh surface 140a; the protrusion 142 can be a rectangular boss shape, the protrusion 142 extends into the installation space 113 of the support base 110 and is connected to the light-emitting component 120, and the chip heat sink 122 of the light-emitting component 120 is welded to the upper surface of the protrusion 142.

[0052] In this embodiment, the longitudinal cross-section of the basic heat sink 140 is convex-shaped. The second bracket 112 and the first bracket 111 are located on the seventh surface 140 a and on the left and right sides of the raised portion 142 .

[0053] In an embodiment, the thickness of the protrusion 142 is 0.1-6 mm. For example, the thickness of the protrusion 142 is 4.5 mm or 2 mm.

[0054] In this embodiment, the support base 110 and the chip heat sink 122 are welded to the same base heat sink 140. As a result, when the temperature changes, the relative thermal expansion of the support base 110, the chip heat sink 122 and the base heat sink 140 is reduced, thereby reducing the relative position change of the light-emitting element 120 and the cylindrical lens 130. As a result, the light spot formed by the light-emitting element 120 after fast-axis collimation is more stable, and the laser device 100 has higher stability.

[0055] In one embodiment, the seventh surface 140a does not include the raised portion 142. Specifically, the chip heat sink 122 of the light-emitting element 120 is directly soldered to the seventh surface 140a of the base heat sink 140. In this case, the support base 110 and the chip heat sink 122 are still soldered to the same base heat sink 140. This also allows for a more stable light spot formed by the light-emitting element 120 after fast-axis collimation during temperature fluctuations. In another embodiment, a groove is provided at the solder joint between the support base 110 and the base heat sink 140 to accommodate solder and provide a more secure connection.

[0056] Please refer to Figure 5 , which is a schematic structural diagram of a laser device 100 according to an embodiment of the present application. A rectangular assembly groove 141 is provided on the seventh surface 140a. The assembly groove 141 is a through groove that passes through the front and rear surfaces of the base heat sink 140.

[0057] The support base 110 is positioned within the mounting groove 141. The fifth surface 110e and the sixth surface 110f of the support base 110 are welded to the inner sidewalls of the mounting groove 141. In this embodiment, the longitudinal cross-section of the base heat sink 140 is concave, and the second bracket 112 and the first bracket 111 are positioned within the concave mounting groove 141 of the base heat sink 140.

[0058] In this embodiment, the inner bottom surface of the mounting groove 141 is not provided with a raised portion 142. That is, the chip heat sink 122 of the light emitting element 120 is directly welded to the inner bottom surface of the mounting groove 141. In this case, the support base 110 and the chip heat sink 122 are still welded to the same base heat sink 140. This also makes the light spot formed by the light emitting element 120 after fast-axis collimation more stable when the temperature changes.

[0059] In one embodiment, a protrusion 142 is protruded from the inner bottom surface of the assembly groove 141; the protrusion 142 extends into the installation space 113 and is connected to the light-emitting component 120, that is, the second bracket 112 and the first bracket 111 are assembled in the groove 141 and are respectively located on the left and right sides of the protrusion 142.

[0060] Please refer to Figure 6, which is a schematic diagram illustrating the positional changes of the light-emitting element 120 and cylindrical lens 130 during temperature changes, according to one embodiment of the present application. The laser device 100 operates within a temperature range of -40°C to 60°C. The thermal expansion coefficients of the support base 110 and cylindrical lens 130 are similar, with the thermal expansion coefficient being smaller than that of the base plate 150. The thermal expansion coefficients of the base plate 150, chip heat sink 122, and base heat sink 140 are similar, with the thermal expansion coefficient being larger than that of the cylindrical lens 130.

[0061] In one implementation, when the operating temperature of the laser device 100 rises, the thermal expansion of each component is different due to the dimensional variation = thermal expansion coefficient × temperature gradient × material size, which causes the light-emitting surface 120a of the light-emitting element 120 to shift slightly upward, and the cylindrical lens 130 to shift slightly in the height direction, resulting in a change in the relative position of the light-emitting element 120 and the cylindrical lens 130. The distance between the light-emitting surface 120a of the light-emitting element 120 and the cylindrical lens 130 is reduced, deviating from the specific point coupling position, resulting in a change in the divergence angle in the fast axis direction, resulting in a change in the light spot.

[0062] Please refer to Figure 6 The dotted line indicates the position of the light-emitting element 120 and the fast-axis divergence angle A3 when the temperature is low. The solid line indicates the position of the light-emitting element 120 and the fast-axis divergence angle A4 when the temperature is high, where A3 is greater than A4. When the temperature rises, the thermal expansion of the support base 110 is less than the thermal expansion of the base heat sink 140. The offset of the cylindrical lens 130 is relatively small, less than the offset of the light-emitting surface 120a. It is assumed here that the cylindrical lens 130 does not deviate. The light-emitting surface 120a moves upward relative to the cylindrical lens 130, causing the fast-axis divergence angle of the light-emitting element 120 to decrease. As a result, the light spot formed by the light-emitting element 120 after fast-axis collimation changes, becoming unstable.

[0063] Please refer to Figure 7 , which is a front view of a laser device 100 according to an embodiment of the present application. Figure 7 The embodiment shown is Figure 3 In this embodiment, the base heat sink 140 and the chip heat sink 122 are both made of materials with a large thermal expansion coefficient, such as copper, and the support base 110 is made of materials with a small thermal expansion coefficient, such as Kovar, glass, and copper-tungsten alloy.

[0064] The following table is a comparison table of height variation of corresponding components of the laser device 100 according to an embodiment:

[0065]

[0066]

[0067] The height variation of the corresponding component is calculated as follows: thermal expansion coefficient × temperature gradient × material size. ΔH1 is the sum of the height variations of the base heat sink 140 and the chip heat sink 122, indicating the height variation of the light-emitting surface 120a of the light-emitting element 120. ΔH2 is the height variation of the support base 110, indicating the height variation of the cylindrical lens 130.

[0068] According to the data in the above table, the dimensional change of the distance between the light emitting surface 120 a of the light emitting element 120 and the cylindrical lens 130 can be calculated as ΔH, where ΔH=ΔH1−ΔH2=2.84.

[0069] Please refer to Figure 8 , which is a front view of a laser device 100 according to an embodiment of the present application. Figure 8 The embodiment shown is Figure 4 In this embodiment, the base heat sink 140 and the chip heat sink 122 are both made of materials with a large thermal expansion coefficient, such as copper, and the support base 110 is made of materials with a small thermal expansion coefficient, such as Kovar, glass, and copper-tungsten alloy.

[0070] The following table is a comparison table of height variation of corresponding components of the laser device 100 according to an embodiment:

[0071]

[0072]

[0073] The height variation of the corresponding component = thermal expansion coefficient × temperature gradient × material size. ΔH1 is the sum of the height variation of the entire base heat sink 140 and the height variation of the chip heat sink 122. ΔH4 is the height variation of the base heat sink 140 excluding the raised portion 142. Therefore, (ΔH1 - ΔH4) is the height variation of the light-emitting surface 120a relative to the seventh surface 140a, indicating the height variation of the light-emitting surface 120a. ΔH3 is the height variation of the support base 110, indicating the height variation of the cylindrical lens 130.

[0074] According to the data in the table above, the dimensional change of the distance between the light emitting surface 120 a of the light emitting element 120 and the cylindrical lens 130 is calculated to be ΔH′, where ΔH′=ΔH1−ΔH3−ΔH4=0.87.

[0075] therefore, Figure 8 The embodiment shown is relative to Figure 7In the embodiment shown, when the temperature changes, the dimensional change of the distance between the light emitting surface 120a of the light emitting element 120 and the cylindrical lens 130 is reduced, thereby making the light spot formed by the light emitting element 120 more stable after fast axis collimation, and the laser device 100 has higher stability.

[0076] A method for stabilizing the emitted laser light is applied to the laser device 100 of the above embodiment; the method includes: welding the support base 110 and the light-emitting element 120 to the base heat sink 140, and reducing the height difference between the welding surface of the support base 110 and the base heat sink 140 and the welding surface of the light-emitting element 120 and the base heat sink 140.

[0077] Please refer to Figure 8 , reducing the height difference between the welding surface of the support base 110 and the basic heat sink 140, and the welding surface of the light emitting element 120 and the basic heat sink 140, that is, reducing the height of the protrusion 142. In this way, the size of the portion of the basic heat sink 140 where the protrusion 142 is removed increases, ΔH4 increases, and because (ΔH' = ΔH1 - ΔH3 - ΔH4), ΔH' decreases, and the dimensional change of the distance between the light emitting surface 120a of the light emitting element 120 and the cylindrical lens 130 is reduced, thereby making the light spot formed by the light emitting element 120 more stable after fast axis collimation, improving the stability of the laser device 100, and improving the emitted laser light.

[0078] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A laser device, characterized in that: include: A support base having an installation space; A light emitting component is provided in the installation space and includes a laser chip and a chip heat sink; as well as a cylindrical lens connected to the support base and located at the opening of the installation space; The light emitted by the laser chip is emitted in an emitting direction toward the cylindrical lens, and the cylindrical lens is used to perform fast-axis collimation on the light emitted by the laser chip; The support base has a first surface and a second surface that are oppositely disposed, and the installation space passes through the first surface and the second surface; A base heat sink connected to the support base and to the chip heat sink; The cylindrical lens is connected to the first surface, and the cylindrical lens and the basic heat sink are respectively located on both sides of the light-emitting element; a bottom plate connected to the base heat sink; Wherein, the basic heat sink has a seventh surface and an eighth surface arranged opposite to each other; The seventh surface is connected to the second surface, the eighth surface is connected to the base plate; the chip heat sink is connected to the seventh surface; Alternatively, the seventh surface is connected to the second surface, and the eighth surface is connected to the bottom plate; a protrusion is provided on the seventh surface; the protrusion extends into the installation space and is connected to the light-emitting element; Alternatively, the seventh surface is provided with an assembly groove, the support seat is provided in the assembly groove; the light-emitting element is connected to the inner bottom surface of the assembly groove; Alternatively, an assembly groove is provided on the seventh surface, and the support seat is provided in the assembly groove; a protrusion is provided on the inner bottom surface of the assembly groove; and the protrusion extends into the installation space and is connected to the light-emitting component.

2. The laser device according to claim 1, characterized in that The support seat has a third surface and a fourth surface that are arranged opposite to each other; The installation space is a through groove that passes through the first surface, the second surface, the third surface, and the fourth surface, so that the support base is divided into a first bracket and a second bracket that are spaced apart by the installation space; Wherein, the length direction of the installation space is the direction from the third surface to the fourth surface; and the support seat is a rectangular parallelepiped structure.

3. The laser device according to claim 2, characterized in that The chip heat sinks are provided in plurality and distributed in a linear array along the length direction of the installation space; There are multiple laser chips, which are distributed in a linear array along the length of the installation space and sandwiched between two adjacent chip heat sinks; There are multiple cylindrical lenses, which are distributed in a linear array along the length direction of the installation space and correspond to each of the laser chips respectively.

4. The laser device according to claim 2, characterized in that The installation space includes a first card slot and a second card slot that are arranged in communication with each other, and the width of the second card slot is smaller than the width of the first card slot; Wherein, the first card slot is opened on the first surface, and the second card slot is opened on the second surface.

5. A method for stabilizing emitted laser light, characterized in that: The method is applied to the laser device according to claim 1; the method comprises: The support base and the light emitting component are welded to the basic heat sink, and the height difference between the welding surface of the support base and the basic heat sink and the welding surface of the light emitting component and the basic heat sink is reduced.

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