Silent Micro Switch and Mouse

Abstract

The present invention relates to the technical field of button switches, and in particular to a silent micro switch and a mouse, including an upper housing and a lower housing which are installed in a butted manner, a micro component disposed between the upper housing and the lower housing, and a pressing component disposed on the upper housing and used for pressing the micro component. A first sound-absorbing component and a first mounting seat for mounting the first sound-absorbing component are provided at the upper end of the micro component, and a second sound-absorbing component and a second mounting seat for mounting the second sound-absorbing component are provided at the lower end of the micro component. The silent structure of the present invention can be applied to micro switches with a pair of transistors or Hall for the circuit conduction mode; when the micro component moves downward, the second sound-absorbing component is used to reduce the sound generated by the vibration of the micro component, and when the micro component resets, the first sound-absorbing component is used to reduce the sound generated by the vibration of the micro component, so that the sound generated during the movement of the micro component tends to be silent, and thus the silent effect is achieved, and it can be applied to quiet use scenarios such as libraries and offices.

Description

Technical Field

[0001] The present invention relates to the technical field of key switches, and in particular to a silent micro switch and a mouse. Background Art

[0002] A micro switch is a contact mechanism with a tiny contact interval and a quick-acting mechanism, which performs switch actions with a specified stroke and a specified force, is covered with a housing, and has a drive rod on its outside. Because the contact spacing of its switch is relatively small, it is called a micro switch, also known as a sensitive switch.

[0003] Micro switches are classified into audible micro switches and silent micro switches according to whether they make noise. Audible micro switches can provide users with a better feel, however, the sound they emit will be noisy in certain situations; silent micro switches do not emit sound and can meet the needs of some users for silent pressing, but the feel of silent micro switches is poor. At present, the circuit conduction mode of silent micro switches is mostly through the contact between the contacts on the elastic sheet and the contacts on the welding feet. Such a circuit conduction mode results in poor waterproof and dustproof performance. With the development of the times, micro switches that achieve circuit conduction through a pair of tubes or Hall methods have emerged, but there is no silent structure applied to such micro switches on the market yet. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a silent micro switch and a mouse with a silent structure and applicable to the circuit conduction mode of a pair of tubes or Hall for the micro switch.

[0005] To solve the above technical problems, the present invention adopts the following technical solutions: A silent micro switch includes an upper housing and a lower housing that are installed in an opposing manner, a micro component disposed between the upper housing and the lower housing, and a pressing component disposed on the upper housing for pressing the micro component. A first sound-absorbing component and a first mounting seat for mounting the first sound-absorbing component are provided at the upper end of the micro component, and a second sound-absorbing component and a second mounting seat for mounting the second sound-absorbing component are provided at the lower end of the micro component.

[0006] Preferably, the first sound-absorbing component includes a first elastic platform, and a first elastic activity cavity for the first elastic platform to expand and contract is opened inside the first elastic platform; the first mounting seat is a mounting hole formed in the upper housing, and the first elastic platform is disposed in the mounting hole.

[0007] Preferably, the mounting hole includes a first stepped groove, a second stepped groove, and a third stepped groove that are stacked from top to bottom; the lower end of the first elastic platform penetrates through the third stepped groove, an installation snap ring installed in the second stepped groove is provided at the upper end of the first elastic platform, and a cover is provided in the first stepped groove.

[0008] Preferably, an exhaust hole is opened in the cover or the first elastic platform.

[0009] Preferably, the first sound-absorbing member includes a socket member; the first mounting base includes a mounting boss provided on the lower housing, and the socket member is sleeved on the mounting boss.

[0010] Preferably, the first mounting base includes a reinforcing member embedded in the lower housing. One end of the reinforcing member is bent and horizontally extended to form the mounting boss, and the other end of the reinforcing member extends downward to form a welding foot end.

[0011] Preferably, the second sound-absorbing member includes a second elastic platform, and the second elastic platform is provided with a second elastic activity cavity for the second elastic platform to expand and contract.

[0012] Preferably, the cross-sectional shape of the second elastic platform is arc-shaped.

[0013] Preferably, the second mounting base is a mounting cavity provided in the lower housing. The mounting cavity is slidably connected with a sliding seat and a slideway provided on the inner wall of the mounting cavity. The sliding seat is provided with a sliding protrusion that moves in the slideway, and the second sound-absorbing member is arranged on the sliding seat.

[0014] Preferably, the lower housing is provided with a second accommodation cavity and a soundproof channel located below the micro-component and communicating with the second accommodation cavity. The second accommodation cavity is provided with a third sound-absorbing member.

[0015] Preferably, a fourth sound-absorbing member is installed on the inner surface of the upper housing, and the fourth sound-absorbing member is located above the micro-component.

[0016] Preferably, a fifth sound-absorbing member is installed on the upper surface of the upper housing, and the fifth sound-absorbing member is provided with a first accommodation cavity for accommodating a pressing member.

[0017] A mouse with a silent micro switch includes a mouse body, a circuit board arranged in the mouse body, and an input component welded to the circuit board. The micro-component is provided with a switch component for cooperating with the input component.

[0018] Preferably, the input component includes a light-emitting element welded to the circuit board and a receiving element that forms an optical path in cooperation with the light-emitting element when energized. When the switch component moves downward, the switch component blocks or conducts the optical path to form a signal input.

[0019] Preferably, the input component includes a Hall element welded to the circuit board, and the switch component is provided with a magnet that forms a signal input in cooperation with the Hall element when it moves downward.

[0020] The beneficial effects of the present invention are as follows: The present invention provides a silent microswitch, and the silent structure of the present invention can be applied to microswitches with a transistor pair or Hall circuit conduction mode; when the moving member moves downward, the second sound-absorbing member reduces the sound generated by the vibration of the moving member, and when the moving member resets, the first sound-absorbing member reduces the sound generated by the vibration of the moving member, so that the sound generated during the movement of the moving member tends to be silent, thereby achieving a silent effect, and can be applied to quiet usage scenarios such as libraries and offices. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 FIG. 6 is a perspective structure schematic diagram of the first perspective of the first embodiment of the silent microswitch of the present invention.

[0022] Figure 2 FIG. 10 is a structure schematic diagram of the second perspective of the first embodiment of the silent microswitch of the present invention.

[0023] Figure 3 is Figure 2 the cross-sectional structure schematic diagram of A-A in FIG.

[0024] Figure 4 is Figure 2 the cross-sectional structure schematic diagram of B-B in FIG.

[0025] Figure 5 FIG. 26 is a three-dimensional structure exploded schematic diagram of the first embodiment of the silent microswitch of the present invention.

[0026] Figure 6 FIG. 30 is a three-dimensional structure schematic diagram of the first embodiment of the silent microswitch of the present invention applied to a mouse.

[0027] Figure 7 is Figure 6 the three-dimensional structure schematic diagram of hiding the mouse body.

[0028] Figure 8 FIG. 40 is a three-dimensional structure schematic diagram of the first perspective of the second embodiment of the silent microswitch of the present invention.

[0029] Figure 9 FIG. 44 is a structure schematic diagram of the second perspective of the second embodiment of the silent microswitch of the present invention.

[0030] Figure 10 is Figure 9 the cross-sectional structure schematic diagram of C-C in FIG.

[0031] Figure 11 is Figure 9 the cross-sectional structure schematic diagram of D-D in FIG.

[0032] Figure 12 FIG. 60 is a three-dimensional structure exploded schematic diagram of the second embodiment of the silent microswitch of the present invention.

[0033] Figure 13 This is a schematic cross-sectional structure diagram of the third embodiment of the silent microswitch of the present invention.

[0034] Figure 14 This is a schematic cross-sectional structure diagram of the fourth embodiment of the silent microswitch of the present invention.

[0035] Figure 15 This is a schematic cross-sectional structure diagram of the fifth embodiment of the silent microswitch of the present invention. Detailed implementation manners

[0036] For the convenience of those skilled in the art to understand, the present invention will be further described below in conjunction with embodiments. The content mentioned in the implementation manners is not a limitation to the present invention.

[0037] As Figures 1 to 5 shown in the first embodiment of the silent microswitch of the present invention, it includes an upper housing 1 and a lower housing 2 that are installed in an opposing manner, a micro-moving member 3 disposed between the upper housing 1 and the lower housing 2, and a pressing member 4 disposed on the upper housing 1 and used for pressing the micro-moving member 3. A first sound-absorbing member 5 and a first mounting seat for mounting the first sound-absorbing member 5 are provided at the upper end of the micro-moving member 3, and a second sound-absorbing member 6 and a second mounting seat for mounting the second sound-absorbing member 6 are provided at the lower end of the micro-moving member 3.

[0038] Preferably, the first sound-absorbing member 5 and the second sound-absorbing member 6 are sound-absorbing cotton or soft rubber blocks; preferably, the micro-moving member 3 is a spring piece.

[0039] The silent structure of the present invention can be applied to microswitches with a circuit conduction mode of diode or Hall; when the micro-moving member 3 moves downward, the second sound-absorbing member 6 is used to reduce the sound generated by the vibration of the micro-moving member 3, and when the micro-moving member 3 resets, the first sound-absorbing member 5 is used to reduce the sound generated by the vibration of the micro-moving member 3, so that the sound generated during the movement of the micro-moving member 3 tends to be silent, thereby achieving a silent effect and can be applied to quiet usage scenarios such as libraries and offices.

[0040] In this embodiment, the first sound-absorbing member 5 includes a first elastic platform 50, and a first elastic activity cavity 51 for the first elastic platform 50 to expand and contract is provided inside the first elastic platform 50; the first mounting seat is a mounting hole position opened on the upper housing 1, and the first elastic platform 50 is disposed in the mounting hole position. Preferably, the first elastic platform 50 is a soft rubber part and its shape is a frustum structure; after the first elastic platform 50 is assembled, the lower end surface of the first elastic platform 50 is close to the upper surface of the micro-moving member 3. When the micro-moving member 3 is pressed and then resets, it will squeeze the first elastic platform 50 to move and contract into the first elastic activity cavity 51, thereby reducing the sound generated by the vibration of the micro-moving member 3, and further achieving a silent effect.

[0041] In this embodiment, the mounting hole positions include a first stepped groove 10, a second stepped groove 11, and a third stepped groove 12 which are stacked from top to bottom; the lower end of the first elastic platform 50 passes through the third stepped groove 12, and an installation snap ring 52 installed in the second stepped groove 11 is provided at the upper end of the first elastic platform 50. A cover 13 is provided in the first stepped groove 10, and an exhaust hole 14 is provided in the cover 13 or the first elastic platform 50. When the micro-moving part is pressed and reset, the first elastic platform 50 will be squeezed, so that the space in the first elastic activity cavity 51 is compressed, and the gas located in the first elastic activity cavity 51 will be discharged from the exhaust hole 14. Such a structural design is to avoid the phenomenon that the first elastic platform 50 is difficult to be squeezed and the sound insulation effect is poor.

[0042] In this embodiment, the second sound-absorbing member 6 includes a second elastic platform 60, and a second elastic activity cavity 61 for the second elastic platform 60 to stretch and move is provided in the second elastic platform 60. After the second elastic platform 60 is assembled, the upper end surface of the second elastic platform 60 is close to the lower surface of the micro-moving part 3. When the micro-moving part 3 is pressed and moves downward, the second elastic platform 60 will be squeezed to move and contract towards the second elastic activity cavity 61, thereby reducing the sound generated by the vibration of the micro-moving part 3, and further achieving the sound insulation effect.

[0043] In this embodiment, the cross-sectional shape of the second elastic platform 60 is arc-shaped. The second elastic platform 60 with an arc-shaped structure has a large deformable space, thereby ensuring its vibration damping effect on the micro-moving part 3 and having strong practicability.

[0044] In this embodiment, the second mounting seat is an installation cavity 23 opened in the lower housing 2. A sliding seat 24 is slidably connected to the installation cavity 23, and a sliding groove 25 is opened on the inner wall of the installation cavity 23. The sliding seat 24 is provided with a sliding protrusion 26 that moves in the sliding groove 25, and the second sound-absorbing member 6 is provided on the sliding seat 24. The cooperation of the sliding protrusion 26 and the sliding groove 25 is used to ensure the accuracy of the installation position of the sliding seat 24; during assembly, first install the sliding seat 24 into the installation cavity 23. At this time, the sliding protrusion 26 at the left end of the sliding seat 24 is located in the sliding groove 25, and the right end surface of the sliding seat 24 is attached to the inner surface of the installation cavity 23, thereby realizing the fixation of the sliding seat 24. Subsequently, the second sound-absorbing member 6 is installed into the installation cavity 23. At this time, the fixing method of the second sound-absorbing member 6 and the installation cavity 23 can be clamping, buckling, etc.

[0045] In this embodiment, the lower housing 2 is provided with a second accommodation cavity 27 and a sound insulation channel 28 located below the micro-moving part 3 and communicating with the second accommodation cavity 27. A third sound-absorbing member 29 is provided in the second accommodation cavity 27. Preferably, the third sound-absorbing member 29 is sound-absorbing cotton. If the micro-moving part 3 vibrates to generate sound, part of the sound will be transmitted to the third sound-absorbing member 29 through the sound insulation channel 28. At this time, the third sound-absorbing member 29 absorbs the sound, thereby further improving the sound insulation effect of the micro switch.

[0046] As Figures 6 to 7 Figures 6 to 7

[0047]

[0047]

[0048] As Figures 8 to 12 Figures 8 to 12

[0049]

[0049]

[0050] In this embodiment, a fourth sound-absorbing member 15 is installed on the inner surface of the upper housing 1, and the fourth sound-absorbing member 15 is located above the micro-moving member 3. Preferably, the fourth sound-absorbing member 15 is sound-absorbing cotton. When the micro-moving member 3 vibrates to generate sound, part of the sound will be transmitted upward to the fourth sound-absorbing member 15, and at this time, the fourth sound-absorbing member 15 absorbs the sound, thereby further improving the sound insulation effect of the micro-switch.

[0051] In this embodiment, a fifth sound-absorbing member 16 is installed on the upper surface of the upper housing 1, and the fifth sound-absorbing member 16 is provided with a first accommodating cavity 17 for accommodating the pressing member 4. Preferably, the fifth sound-absorbing member 16 is sound-absorbing cotton. The fifth sound-absorbing member 16 absorbs the sound generated during the process of the pressing member 4 pressing the micro-moving member 3, thereby further improving the sound insulation effect of the micro-switch.

[0052] As Figure 13 shown in FIG. 3 is the third embodiment of the silent micro-switch of the present invention. The difference from the above embodiment is that the input component includes a light-emitting element 80 welded to the circuit board 8 and a receiving element 81 that cooperates with the light-emitting element 80 to form an optical path when powered on. When the switch member 30 moves downward, the switch member 30 conducts the optical path to form a signal input. Preferably, the switch member 30 is provided with a through hole 32; preferably, the light-emitting element 80 is an infrared emitting diode, and the receiving element 81 is a photosensitive receiving diode; when powered on, the infrared emitting diode emits infrared rays. At this time, the switch member 30 blocks the photosensitive receiving diode from receiving infrared rays. When the pressing member 4 is pressed, the micro-moving member 3 moves downward accordingly. When the through hole 32 is located between the infrared ray emitting diode and the photosensitive receiving diode, the photosensitive receiving diode receives the infrared rays, and the signal processing circuit sends an input signal to the control circuit, thereby realizing the input of the key. In this way, the situation that the performance becomes unstable due to the wear of the two contacts in the micro-switch after long-term contact is avoided. The service life of the micro-switch is longer and the working stability is stronger. In addition, since the micro-switch does not need to be manufactured by the plug-in welding method, the dust-proof and waterproof capabilities of the micro-switch are improved.

[0053] As Figure 14Shown is the fourth embodiment of the silent microswitch of the present invention. The difference from the above embodiment is that the input component includes a Hall element 82 welded to the circuit board 8, and the switch member 30 is provided with a magnet 31 that cooperates with the Hall element 82 to form a signal input when it moves downward. When the pressing member 4 is pressed, the micro-moving member 3 moves downward accordingly. At this time, a magnetic attraction effect is formed between the magnet 31 located on the micro-moving member 3 and the Hall element 82, and the Hall element 82 is turned on to achieve signal input. In this way, the situation where the performance becomes unstable due to the wear caused by the long-term contact between the two contacts in the microswitch is avoided. The microswitch has a longer service life and stronger working stability. In addition, since the microswitch does not need to be made by the plug-in welding method, the dust-proof and waterproof capabilities of the microswitch are improved.

[0054] As Figure 15 Shown is the fifth embodiment of the silent microswitch of the present invention. The difference from the above embodiment is that the mounting hole positions include a first stepped groove 10, a second stepped groove 11, and a third stepped groove 12 that are stacked from top to bottom; the lower end of the first elastic platform 50 passes through the third stepped groove 12, and the upper end of the first elastic platform 50 is provided with a mounting snap ring 52 mounted in the second stepped groove 11. The first stepped groove 10 is provided with a cover 13, and the first elastic platform 50 is provided with an exhaust hole 14. The exhaust hole 14 in this embodiment also serves to discharge the gas in the first elastic activity cavity 51. At the same time, by arranging the exhaust hole 14 on the first elastic platform 50, the waterproof and dust-proof performance is stronger compared to the above embodiment.

[0055] In the description of the present invention, it should be noted that for orientation terms, such as the terms "center", "horizontal (X)", "vertical (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the orientation and position relationships indicated are based on the orientation or position relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of the present invention.

[0056] In addition, such terms as "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "several" is two or more, unless otherwise specifically defined.

[0057] In the present invention, unless otherwise clearly specified and defined, terms such as "assembled", "connected", and "joined" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may also be a mechanical connection; it may be directly connected or connected through an intermediate medium, and it may be internally connected and communicated between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] The above-described embodiments merely represent several embodiments of the present invention, and the description thereof is relatively specific and detailed. However, it should not be construed as a limitation to the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several variations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the appended claims.

Claims

1. A silent microswitch, comprising an upper housing (1) and a lower housing (2) which are oppositely installed, a micro-component (3) disposed between the upper housing (1) and the lower housing (2), and a pressing member (4) disposed on the upper housing (1) and used for pressing the micro-component (3), characterized in that: The upper end of the micro-moving part (3) is provided with a first sound-absorbing part (5) and a first mounting seat for mounting the first sound-absorbing part (5), and the lower end of the micro-moving part (3) is provided with a second sound-absorbing part (6) and a second mounting seat for mounting the second sound-absorbing part (6); The first sound-absorbing part (5) includes a first elastic platform (50), and a first elastic activity cavity (51) for the first elastic platform (50) to expand and contract is opened inside the first elastic platform (50); the first mounting seat is a mounting hole position opened on the upper shell (1), and the first elastic platform (50) is arranged in the mounting hole position; The mounting hole position includes a first stepped groove (10), a second stepped groove (11) and a third stepped groove (12) which are stacked from top to bottom; the lower end of the first elastic platform (50) penetrates through the third stepped groove (12), a mounting snap ring (52) installed in the second stepped groove (11) is arranged at the upper end of the first elastic platform (50), and a cover body (13) is arranged in the first stepped groove (10); An exhaust hole (14) is opened on the cover body (13) or the first elastic platform (50); The second sound-absorbing part (6) includes a second elastic platform (60), and a second elastic activity cavity (61) for the second elastic platform (60) to expand and contract is opened in the second elastic platform (60).

2. A mouse with the silent micro switch described in claim 1, characterized in that: It includes a mouse body (7), a circuit board (8) arranged on the mouse body (7) and an input component welded to the circuit board (8), and a switch component (30) cooperating with the input component is arranged on the micro-moving part (3).

3. The mouse with a silent micro switch according to claim 2, characterized in that: The input component includes a light-emitting element (80) welded to the circuit board (8) and a receiving element (81) that forms an optical path in cooperation with the light-emitting element (80) when powered on. When the switch component (30) moves downward, the switch component (30) blocks or conducts the optical path to form a signal input.

4. The mouse with a silent micro switch according to claim 2, wherein: The input component includes a Hall element (82) welded to the circuit board (8), and a magnet (31) that forms a signal input in cooperation with the Hall element (82) when the switch component (30) moves downward is arranged on the switch component (30).

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