Double-sided cooling power module

Abstract

The embodiment of the present invention provides a double-sided heat dissipation power module, including an upper bridge plate and a lower bridge plate which are stacked, a first chip is arranged on the surface of the upper bridge plate facing the lower bridge plate, a second chip is arranged on the surface of the lower bridge plate facing the upper bridge plate, the first chip and the second chip are arranged staggered with each other, the outer sides of the first chip and the second chip are also provided with a first electrode block and a second electrode block respectively, the upper bridge plate and the lower bridge plate are connected as a whole by pressing, and the first electrode block and the second electrode block are pressed against the lower bridge plate and the upper bridge plate respectively. The embodiment of the present invention transfers the heat generated by the first chip and the second chip during operation to the other bridge plate through the first electrode block and the second electrode block, thereby realizing double-sided heat dissipation, the pressing between the upper bridge plate and the lower bridge plate itself has a certain margin of motion, which has a significant buffering effect on the material deformation stress generated by each component, effectively protects the circuit components, and improves the working stability and service life of the module.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of semiconductor power devices, and in particular to a double-sided heat dissipation power module. Background Art

[0002] During operation, the power module will generate a large amount of heat, which may damage the internal components and needs to be cooled. Traditional power modules generally dissipate heat through a single side, but when the heat inside the module is too high, the single-side heat dissipation efficiency is too low, so a double-sided heat dissipation module is needed to dissipate the heat generated by the internal components. The double-sided heat dissipation module is generally composed of two upper and lower substrates with heat dissipation structures. The components are placed on one substrate, and the other substrate is placed on top of it. The internal components are cooled by the superposition of the two substrates. However, during the heat dissipation process, since the components are concentrated on the same substrate, the heat source is relatively concentrated, making it impossible for the other substrate to dissipate the heat generated by the internal components well. In addition, the two substrates are mostly connected rigidly, so that the components are easily squeezed and damaged between the two substrates when they are deformed by heat, affecting the operation of the internal circuit. Summary of the invention

[0003] The technical problem to be solved by the embodiments of the present invention is to provide a double-sided heat dissipation power module to effectively improve the heat dissipation efficiency and stability of the module.

[0004] In order to solve the above technical problems, an embodiment of the present invention provides the following technical solution: comprising an upper bridge plate and a lower bridge plate arranged in a stacked manner, a first chip is arranged on a surface of the upper bridge plate facing the lower bridge plate, a second chip is arranged on a surface of the lower bridge plate facing the upper bridge plate, the first chip and the second chip are staggered with each other, and the outer sides of the first chip and the second chip are further provided with a first electrode block and a second electrode block, respectively, the upper bridge plate and the lower bridge plate are connected as a whole by pressing, and the first electrode block and the second electrode block are pressed against the lower bridge plate and the upper bridge plate respectively.

[0005] Furthermore, a plurality of first chips are arranged on the upper bridge board, each first chip is correspondingly provided with a first electrode pressing block, and all the first electrode pressing blocks are correspondingly connected into one body.

[0006] Furthermore, a plurality of second chips are arranged on the lower bridge plate, each second chip is correspondingly provided with a second electrode pressing block, and all the second electrode pressing blocks are correspondingly connected into one body.

[0007] Furthermore, the first chip and the second chip are respectively welded to the corresponding upper bridge plate and lower bridge plate, and welding layers are provided between the first chip and the first electrode block, and between the second chip and the second electrode block. The first chip and the second chip are respectively welded and fixed to the corresponding first electrode block and the second electrode block through the welding layers.

[0008] Furthermore, the upper bridge plate includes an upper bridge substrate and an upper bridge frame fixed on the upper bridge substrate, and the lower bridge plate includes a lower bridge substrate and a lower bridge frame fixed on the lower bridge substrate. The lower bridge frame and the upper bridge frame are respectively provided with corresponding pins and sockets, and the upper bridge frame and the lower bridge frame are connected and fixed by correspondingly plugging the pins and sockets.

[0009] Furthermore, the upper bridge substrate and the lower bridge substrate are both ceramic substrates.

[0010] Furthermore, a first external terminal and a second external terminal are provided on one side of the upper bridge frame, and a first conductive circuit and a second conductive circuit isolated from each other are provided on the upper bridge substrate, the first chip and the first external terminal are both electrically connected to the first conductive circuit, the second external terminal is electrically connected to the second conductive circuit, and the second electrode pressing block is pressed and connected to the second conductive circuit; a third external terminal is provided on one side of the lower bridge frame, and the lower bridge substrate has a third conductive circuit, the second chip and the third external terminal are both electrically connected to the third conductive circuit, and the first electrode pressing block is pressed and connected to the third conductive circuit.

[0011] Furthermore, the upper bridge frame and the first external terminal and the second external terminal, and the lower bridge frame and the third external terminal are preformed into one piece.

[0012] Furthermore, packaging glue is filled between the upper bridge plate and the lower bridge plate.

[0013] After adopting the above technical scheme, the embodiment of the present invention has at least the following beneficial effects: the embodiment of the present invention can effectively disperse the heat source inside the module by dividing the module into an upper bridge board and a lower bridge board, and arranging the first chip and the second chip on the upper bridge board and the lower bridge board respectively, and the first electrode block and the second electrode block are pressed against the lower bridge board and the upper bridge board respectively, so that the heat generated by the first chip and the second chip during operation can be transferred to the other bridge board to achieve double-sided heat dissipation, and at the same time, the upper bridge board and the lower bridge board are connected as one by crimping, and the crimping itself will have a certain margin of activity, which has a significant buffering effect on the material deformation stress generated by the different expansion coefficients of the components in the module under the conditions of high heat generation and high heat dissipation during power cycle, effectively protecting the internal circuit components and improving the working stability and service life of the module. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional diagram of an optional embodiment of a double-sided heat dissipation power module of the present invention.

[0015] Figure 2 It is a three-dimensional diagram of an upper bridge plate of an optional embodiment of a double-sided heat dissipation power module of the present invention.

[0016] Figure 3 It is a three-dimensional view of the lower bridge plate of an optional embodiment of the double-sided heat dissipation power module of the present invention.

[0017] Figure 4 It is a cross-sectional view perpendicular to the chip arrangement direction of an optional embodiment of a double-sided heat dissipation power module of the present invention. DETAILED DESCRIPTION

[0018] The present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the following illustrative embodiments and descriptions are only used to explain the present invention and are not intended to limit the present invention. In addition, the embodiments and features in the embodiments of the present application may be combined with each other without conflict.

[0019] like Figure 1-Figure 4 As shown, an optional embodiment of the present invention provides a double-sided heat dissipation power module 1, including an upper bridge board 10 and a lower bridge board 12 which are stacked, a first chip 101 is arranged on a surface of the upper bridge board 10 facing the lower bridge board 12, a second chip 121 is arranged on a surface of the lower bridge board 12 facing the upper bridge board 10, the first chip 101 and the second chip 121 are staggered with each other, and the outer sides of the first chip 101 and the second chip 121 are further provided with a first electrode block 103 and a second electrode block 123 respectively, the upper bridge board 10 and the lower bridge board 12 are connected as a whole by pressing, and the first electrode block 103 and the second electrode block 123 are pressed against the lower bridge board 12 and the upper bridge board 10 respectively.

[0020] The embodiment of the present invention can effectively disperse the heat source inside the module by dividing the module into an upper bridge board 10 and a lower bridge board 12, and arranging a first chip 101 and a second chip 121 on the upper bridge board 10 and the lower bridge board 12 respectively. The first electrode pressing block 103 and the second electrode pressing block 123 are pressed against the lower bridge board 12 and the upper bridge board 10 respectively, so that the first chip 101 and the second chip 121 can transfer heat to the other bridge board through the first electrode pressing block 103 and the second electrode pressing block 123, thereby realizing double-sided heat dissipation. At the same time, the upper bridge board 10 and the lower bridge board 12 are connected as a whole by crimping. The crimping itself will have a certain margin of activity, which has a significant buffering effect on the material deformation stress generated by the different expansion coefficients of the components in the module under the conditions of high heat generation and high heat dissipation during power cycle, effectively protecting the internal circuit components and improving the working stability and service life of the module.

[0021] like Figure 2 As shown, in an optional embodiment of the present invention, a plurality of first chips 101 are arranged on the upper bridge board 10, and each first chip 101 is correspondingly provided with a first electrode pressing block 103, and all the first electrode pressing blocks 103 are correspondingly connected as one. In this embodiment, by arranging the first electrode pressing block 103 on the first chip 101, the heat of the first chip 101 can be transferred out through the first electrode pressing block 103, and the first electrode pressing block 103 is connected as one, which can effectively disperse the heat of the plurality of first chips 101. At the same time, the first electrode pressing block 103 can also evenly disperse the pressure on the internal components of the module during the crimping process, and can effectively protect the chip.

[0022] In an optional embodiment of the present invention, a plurality of second chips 121 are provided on the lower bridge plate 12, and each second chip 121 is provided with a corresponding second electrode pressing block 123, and all the second electrode pressing blocks 123 are connected together. In this embodiment, by providing the second electrode pressing block 123 on the second chip 121, the heat of the second chip 121 can be transferred out through the second electrode pressing block 123, and the second electrode pressing block 123 is connected together, which can effectively disperse the heat of the plurality of second chips 121. At the same time, the second electrode pressing block 123 can also evenly disperse the pressure on the internal components of the module during the crimping process, and can effectively protect the chip.

[0023] like Figure 2-Figure 4As shown, in an optional embodiment of the present invention, the first chip 101 and the second chip 121 are welded to the corresponding upper bridge board 10 and lower bridge board 12, respectively, and a welding layer 141 is provided between the first chip 101 and the first electrode pressing block 103, and between the second chip 121 and the second electrode pressing block 123, and the first chip 101 and the second chip 121 are welded and fixed to the corresponding first electrode pressing block 103 and the second electrode pressing block 123 respectively through the welding layer 141. In this embodiment, by providing a welding layer 141 between each chip and the electrode pressing block, it is possible to prevent the electrode pressing block from being deformed due to heat and directly squeezing the chip to cause damage while ensuring the conduction of the internal circuit, thereby effectively protecting the chip and improving the working stability of the module.

[0024] In an optional embodiment of the present invention, the upper bridge plate 10 includes an upper bridge substrate 105 and an upper bridge frame 107 fixed on the upper bridge substrate 105, and the lower bridge plate 12 includes a lower bridge substrate 125 and a lower bridge frame 127 fixed on the lower bridge substrate 125, and the lower bridge frame 127 and the upper bridge frame 107 are respectively provided with corresponding pins 1270 and sockets 1070, and the upper bridge frame 107 and the lower bridge frame 127 are connected and fixed by corresponding plugging of the pins 1270 and the sockets 1070. This embodiment can facilitate the disassembly and assembly of the upper bridge plate 10 and the lower bridge plate 12 by providing corresponding plugging sockets 1070 and pins 1270 on the upper bridge frame 107 and the lower bridge frame 127, and can effectively buffer the upper bridge plate 10 and the lower bridge plate 12 during the crimping process.

[0025] In an optional embodiment of the present invention, both the upper bridge substrate 105 and the lower bridge substrate 125 are ceramic substrates. In this embodiment, by setting the upper bridge substrate 105 and the lower bridge substrate 125 as ceramic substrates, due to the thermal stability of ceramics and the thermal conductivity of copper, the thermal conductivity of the substrate can be maintained while improving the stability of the substrate, making it difficult for the substrate to deform during the heat dissipation process, thereby improving the service life of the module.

[0026] In an optional embodiment of the present invention, a first external terminal 161 and a second external terminal 163 are provided on one side of the upper bridge frame 107, and a first conductive circuit 1050 and a second conductive circuit 1052 isolated from each other are provided on the upper bridge substrate 105, the first chip 101 and the first external terminal 161 are both electrically connected to the first conductive circuit 1050, the second external terminal 163 is electrically connected to the second conductive circuit 1052, and the second electrode pressing block 123 is pressed and connected to the second conductive circuit 1052; a third external terminal 165 is provided on one side of the lower bridge frame 127, and the lower bridge substrate 125 has a third conductive circuit 1250, the second chip 121 and the third external terminal 165 are both electrically connected to the third conductive circuit 1250, and the first electrode pressing block 103 is pressed and connected to the third conductive circuit 1250.

[0027] In this embodiment, by setting the first conductive circuit 1050 and the second conductive circuit 1052 on the upper bridge substrate, the two-terminal chips abutting the two conductive circuits can achieve circuit conduction with the first external terminal 161 and the second external terminal 163. By setting the third conductive circuit 1250 on the lower bridge frame 127, the two-terminal chips can achieve circuit conduction with the third external terminal 165. In specific implementation, the first conductive circuit 1050, the second conductive circuit 1052 and the third conductive circuit 1250 are composed of a copper-clad layer on a ceramic substrate, without the need to add other circuits. The structure is simple and can effectively conduct heat to improve heat dissipation efficiency.

[0028] In an optional embodiment of the present invention, further, the upper bridge frame 107 and the first external terminal 161 and the second external terminal 163, and the lower bridge frame 127 and the third external terminal 165 are preformed into one piece. In this embodiment, the upper bridge frame 107 and the first external terminal 161 and the second external terminal 163, and the lower bridge frame 127 and the third external terminal 165 are preformed into one piece, and then assembled and fixed to the upper bridge substrate 105 and the lower bridge substrate 125, respectively, so that the assembly structure of the upper bridge plate 10 and the lower bridge plate 12 is simple, and installation and processing are convenient.

[0029] In an optional embodiment of the present invention, a packaging glue is filled between the upper bridge plate 10 and the lower bridge plate 12. In specific implementation, the packaging glue can be made of soft silicone gel. In this embodiment, by filling the packaging glue between the upper bridge plate 10 and the lower bridge plate 12, various components in the module can be well protected and insulated. In addition, the packaging glue has good elastic deformation ability, which can play a good buffering role for the deformation force caused by the internal components due to temperature rise, protect the safety of the module structure, and improve the stability of the module.

[0030] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, which all belong to the protection scope of the present invention.

Claims

1. A double-sided heat dissipation power module, comprising an upper bridge board and a lower bridge board stacked together, wherein a first chip is arranged on a surface of the upper bridge board facing the lower bridge board, and a second chip is arranged on a surface of the lower bridge board facing the upper bridge board, characterized in that: The first chip and the second chip are staggered with each other, and the outer sides of the first chip and the second chip are respectively provided with a first electrode pressing block and a second electrode pressing block, the upper bridge plate and the lower bridge plate are connected as a whole by pressing, and the first electrode pressing block and the second electrode pressing block are respectively pressed against the lower bridge plate and the upper bridge plate; Wherein, the upper bridge plate includes an upper bridge substrate and an upper bridge frame fixed on the upper bridge substrate, and the lower bridge plate includes a lower bridge substrate and a lower bridge frame fixed on the lower bridge substrate; a first external terminal and a second external terminal are arranged on one side of the upper bridge frame, the first external terminal and the second external terminal are arranged staggered with each other, a first conductive circuit and a second conductive circuit isolated from each other are arranged on the upper bridge substrate, the first chip and the first external terminal are both electrically connected to the first conductive circuit, the second external terminal is electrically connected to the second conductive circuit, and the second electrode pressing block is pressed and connected to the second conductive circuit; a third external terminal is arranged on one side of the lower bridge frame, the lower bridge substrate has a third conductive circuit, the second chip and the third external terminal are both electrically connected to the third conductive circuit, and the first electrode pressing block is pressed and connected to the third conductive circuit; The upper bridge plate is provided with a plurality of first chips, each of which is provided with a first electrode pressing block, and all the first electrode pressing blocks are connected together, and the connection part between any two adjacent first electrode pressing blocks is thinner than the first electrode pressing block, and together with the first electrode pressing block, forms an outer surface with alternating concave and convex shapes; A plurality of second chips are arranged on the lower bridge plate, each second chip is correspondingly provided with a second electrode block, and all the second electrode blocks are correspondingly connected together, and the connection part between any two adjacent second electrode blocks is thinner than the second electrode blocks and forms a concave and convex outer surface together with the second electrode blocks.

2. The double-sided heat dissipation power module according to claim 1, characterized in that: The first chip and the second chip are welded to the corresponding upper bridge plate and lower bridge plate respectively, and welding layers are arranged between the first chip and the first electrode block, and between the second chip and the second electrode block. The first chip and the second chip are welded and fixed to the corresponding first electrode block and the second electrode block respectively through the welding layers.

3. The double-sided heat dissipation power module according to claim 1, characterized in that: The lower bridge frame and the upper bridge frame are respectively provided with corresponding plug posts and plug holes, and the upper bridge frame and the lower bridge frame are connected and fixed by corresponding plugging of the plug posts and the plug holes.

4. The double-sided heat dissipation power module according to claim 3, characterized in that: The upper bridge substrate and the lower bridge substrate are both ceramic substrates.

5. The double-sided heat dissipation power module according to claim 1, characterized in that: The upper bridge frame and the first external terminal and the second external terminal, and the lower bridge frame and the third external terminal are preformed into one piece.

6. The double-sided heat dissipation power module according to claim 1, characterized in that: The space between the upper bridge plate and the lower bridge plate is filled with packaging glue.

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