Image display device and method for manufacturing image display device

Abstract

Provided are an image display device and a method for manufacturing an image display device that improve the manufacturing yield. The image display device involved in the embodiment has a plurality of pixels including a plurality of first sub-pixels capable of emitting red, green and blue light and a second sub-pixel capable of emitting blue light. Any one of the plurality of first sub-pixels of at least one pixel among the plurality of pixels has a defective sub-pixel. In the case where the defective sub-pixel is a sub-pixel that should emit red or green light, the second sub-pixel includes a light-emitting element and a wavelength conversion layer that is provided on the light-emitting element and converts the light color of the light-emitting element into the color that the defective sub-pixel should emit.

Description

Technical Field

[0001] Embodiments of the present invention relate to an image display device and a method for manufacturing the image display device. Background Art

[0002] There is a demand for thin image display devices with high brightness, high viewing angle, high contrast and low power consumption. In response to such market demands, as shown in Patent Document 1, development of display devices using self-luminous elements is underway.

[0003] As a self-luminous element, the emergence of display devices using micro LEDs, which are fine light-emitting elements, is expected. When micro LEDs are used in image display devices, the number of elements increases as the image quality increases to full HD, 4K, 8K, etc., and how to improve the yield becomes a problem.

[0004] In the micro LED image display device, micro LEDs that are judged to be acceptable after electrical inspection are mounted on a panel module. The panel module with micro LEDs mounted thereon is again judged to be acceptable through display confirmation inspection or the like.

[0005] In this way, if multiple inspections are performed, the overall yield of the image display device is obtained by multiplying the yield of the inspection based on the micro LED monomer by the yield during and after the panel module is installed. Therefore, the higher the image quality, the greater the number of components installed, so it is difficult to fully improve the overall yield and it is difficult to have cost competitiveness with other image display devices.

[0006] Therefore, in an image display device using micro LEDs, it is necessary to suppress a decrease in yield and reduce manufacturing costs.

[0007] Prior Art Literature

[0008] Patent Literature

[0009] Patent Document 1: Japanese Patent Publication No. 2016-523450 Summary of the invention

[0010] One embodiment of the present invention provides an image display device having improved manufacturing yield.

[0011] An image display device according to one embodiment of the invention comprises a plurality of pixels including a plurality of first sub-pixels capable of emitting light in red, green and blue and a second sub-pixel capable of emitting light in blue. Any one of the plurality of first sub-pixels of at least one pixel among the plurality of pixels has a defective sub-pixel. When the defective sub-pixel is a sub-pixel that should emit light in red or green, the second sub-pixel comprises a light-emitting element and a wavelength conversion layer provided on the light-emitting element and converting the light-emitting color of the light-emitting element into the color that the defective sub-pixel should emit.

[0012] A manufacturing method of an image display device according to an embodiment of the invention is a manufacturing method of an image display device including a plurality of first sub-pixels capable of emitting light in red, green and blue, respectively, and a second sub-pixel capable of emitting light in blue. The manufacturing method comprises: a defective sub-pixel detection step, preparing a plurality of first light-emitting elements that respectively cause the plurality of first sub-pixels to emit light and a second light-emitting element that causes the second sub-pixel to emit light, lighting the plurality of first light-emitting elements, acquiring image data of the plurality of first light-emitting elements that are lit, performing image analysis on the image data, respectively setting the positions and luminous color data of the defective light-emitting elements and the remaining light-emitting elements without defects among the plurality of first light-emitting elements, and storing the positions and luminous color data; and a wavelength conversion layer forming step, forming a wavelength conversion layer on each of the plurality of first light-emitting elements. The wavelength conversion layer forming step comprises the following steps: when a sub-pixel that should emit light in red or green among the plurality of first light-emitting elements includes the defective light-emitting element, based on the positions and luminous color data, forming a wavelength conversion layer on the second light-emitting element that converts the wavelength into the luminous color that should be emitted at the position of the defective light-emitting element.

[0013] According to one embodiment of the present invention, an image display device having improved manufacturing yield is realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic block diagram illustrating the image display device according to the first embodiment.

[0015] Figure 2A It is a schematic plan view illustrating the arrangement of sub-pixels in the image display device according to the first embodiment.

[0016] Figure 2B It is a schematic plan view illustrating the arrangement of sub-pixels in the image display device according to the first embodiment.

[0017] Figure 2C It is a schematic plan view illustrating the arrangement of sub-pixels in the image display device according to the first embodiment.

[0018] Figure 3A This is a schematic cross-sectional view illustrating a part of the image display device according to the first embodiment.

[0019] Figure 3B This is a schematic cross-sectional view illustrating a part of the image display device according to the first embodiment.

[0020] Figure 3C This is a schematic cross-sectional view illustrating a part of the image display device according to the first embodiment.

[0021] Figure 3D This is a schematic cross-sectional view illustrating a part of the image display device according to the first embodiment.

[0022] Figure 4 This is a block diagram illustrating a part of the image display device according to the first embodiment.

[0023] Figure 5 This is a flowchart illustrating the method for manufacturing the image display device according to the first embodiment.

[0024] Figure 6 This is an example of a schematic block diagram for explaining a part of the method for manufacturing the image display device according to the first embodiment.

[0025] Figure 7 This is an example of a schematic block diagram for explaining a part of the method for manufacturing the image display device according to the first embodiment.

[0026] Figure 8 This is an example of a schematic block diagram for explaining a part of the method for manufacturing the image display device according to the first embodiment.

[0027] Fig. 9 This is a schematic block diagram illustrating an image display device according to the second embodiment.

[0028] Fig. 10A This is a schematic cross-sectional view illustrating a part of the image display device according to the second embodiment.

[0029] Fig. 10B This is a schematic cross-sectional view illustrating a part of the image display device according to the second embodiment.

[0030] Fig. 10C This is a schematic cross-sectional view illustrating a part of the image display device according to the second embodiment.

[0031] Fig.11 This is a flowchart illustrating a method for manufacturing the image display device according to the second embodiment.

[0032] Fig.12This is an example of a schematic block diagram for explaining a part of the method for manufacturing the image display device according to the second embodiment.

[0033] Fig.13 This is an example of a schematic block diagram for explaining a part of the method for manufacturing the image display device according to the second embodiment.

[0034] Fig.14 This is an example of a schematic block diagram for explaining a part of the method for manufacturing the image display device according to the second embodiment.

[0035] Fig.15 This is an example of a schematic block diagram for explaining a part of the method for manufacturing the image display device according to the third embodiment.

[0036] Fig.16 This is a block diagram illustrating an image display device according to a modification of the third embodiment.

[0037] -Explanation of symbols-

[0038] 1, 201, 401, 501: image display device, 2: substrate, 3: first wiring, 4: second wiring, 5: insulating layer, 10, 210: display area, 20, 220: pixel, 22d, 222d: defective sub-pixel, 22R, 22G, 22B, 222R, 222G: sub-pixel, 22s, 222s: redundant sub-pixel, 30, 230R, 230G: light-emitting element, 40R, 40G, 4 0B: phosphor layer, 40K: wavelength conversion layer, 50: driver IC, 52: driver circuit, 54: ROM, 100: defective sub-pixel detection system, 101: camera, 102: information processing device, 103: storage device, 104: display data, 105: lighting driver circuit, 110: wavelength conversion layer formation system, 111: inkjet coating device, 120: driver IC mounting system, 121: display unit drive system DETAILED DESCRIPTION

[0039] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0040] In addition, the drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the ratio of the size between the parts, etc. are not necessarily the same as in reality. In addition, even when representing the same part, there is a situation where the mutual size and ratio are represented differently according to the drawings.

[0041] In the present specification and each drawing, the same elements as those described in connection with the drawings already described are denoted by the same reference numerals, and detailed description thereof will be appropriately omitted.

[0042] (First embodiment)

[0043] Figure 1 This is a schematic block diagram illustrating the image display device according to this embodiment.

[0044] like Figure 1 As shown, the image display device 1 of this embodiment includes a display area 10 and a driver IC 50. The display area 10 and the driver IC 50 are provided on a substrate not shown. The substrate has a wiring pattern on one surface of an insulating base material, which is electrically connected to the light-emitting elements of each sub-pixel 22R, 22G, and 22B constituting each pixel 20.

[0045] As shown in the figure, the image display device 1 has a substantially rectangular shape in a plan view. Hereinafter, the direction in which the long side extends is referred to as the X axis, and the direction in which the short side extends is referred to as the Y axis.

[0046] The display area 10 occupies most of the area of ​​the image display device 1. Pixels 20 are formed in the display area 10. The pixels 20 are arranged in a grid pattern in the X-axis direction and the Y-axis direction, for example. The number of pixels 20 arranged in the X-axis direction and the Y-axis direction represents the resolution of the image display device 1. For example, in an image display device with full HD quality, 1920×1080≈2 million pixels 20 are arranged in the display area 10. In an image display device with 4K quality, 3840×2160≈8 million pixels 20 are arranged. In an image display device with 8K quality, 7680×4320≈33 million pixels 20 are arranged.

[0047] The pixels 20 formed in the display region 10 are driven respectively by the driving circuit 52 of the driving IC 50. The driving circuit 52 drives each pixel based on external image data and display control data (not shown).

[0048] The driver IC 50 is provided, for example, along the lower side of the display area 10 as in this example. The driver IC 50 is arranged at any appropriate position, not limited to the lower side of the display area 10, and may be provided at the upper side, or may be provided on a substrate different from the substrate on which the display area 10 is formed. The driver IC 50 has a ROM 54. As described in detail later, the ROM 54 stores the position of the defective sub-pixel, and the driver circuit 52 determines the luminous color of the normal sub-pixel based on the position of the defective sub-pixel and lights it.

[0049] exist Figure 1 2 shows an enlarged view of a portion A, which is a part of the matrix of pixels 20 arranged in the display region 10. In the portion A, 3×4 pixels 20 are shown.

[0050] The pixel 20 includes three sub-pixels 22R, 22G, and 22B. The sub-pixel 22R emits a red light color. The sub-pixel 22G emits a green light color. The sub-pixel 22B emits a blue light color. The brightness of the sub-pixels 22R, 22G, and 22B is adjusted by the driving circuit 52, thereby determining the light color and brightness of the pixel 20.

[0051] In the case of the present embodiment, electrical inspection of the light-emitting elements constituting each sub-pixel is not performed before forming the display area 10. Therefore, as shown in part A, the display area 10 sometimes includes a defective sub-pixel 22d. The defective sub-pixel 22d may be caused by the failure of the light-emitting element, or may be caused by a poor condition during the installation of the light-emitting element. As described later, there may be a case where the defective sub-pixel 22d is low brightness lower than the desired brightness and is not lit, sometimes a case where it becomes high brightness higher than the desired brightness, and there may also be a case where it is lit without relying on the drive signal of the drive circuit 52.

[0052] The pixel 20 includes at least one redundant sub-pixel 22s in addition to the three sub-pixels 22R, 22G, and 22B. When any one of the three sub-pixels 22R, 22G, and 22B is a defective sub-pixel 22d, the redundant sub-pixel 22s emits the original luminous color of the defective sub-pixel. The ROM 54 stores the position of the defective sub-pixel 22d. In the pixel 20 including the defective sub-pixel 22d, the driving circuit 52 drives the redundant sub-pixel 22s with the luminous color of the defective sub-pixel 22d based on the stored data of the ROM 54.

[0053] As in Figure 3A , Figure 3B , Figure 3C As described later in the description of , each normal sub-pixel has a light-emitting element and a wavelength conversion layer such as a fluorescent material. In the defective sub-pixel 22d, a wavelength conversion layer such as a fluorescent material is not formed in the light-emitting element. Alternatively, in the defective sub-pixel 22d, a wavelength conversion layer is formed on the light-emitting element by a non-transmitting color material.

[0054] In the pixel 20 in which the defective sub-pixel 22d does not exist, the redundant sub-pixel 22s is not driven by the driving circuit 52 and does not light up. In addition, the wavelength conversion layer is not formed in the light emitting element constituting the redundant sub-pixel 22s.

[0055] In one pixel 20, three sub-pixels 22R, 22G, and 22B are arranged in this order, for example, toward the positive direction of the X axis. The redundant sub-pixel 22s can be provided at any position in the pixel 20. In this example, it is arranged adjacent to and below the arrangement of the three sub-pixels 22R, 22G, and 22B.

[0056] The redundant sub-pixel 22 s is not limited to this case, but may be provided at any position.

[0057] Figure 2A to Figure 2C It is a schematic plan view illustrating the arrangement of sub-pixels in the image display device of this embodiment.

[0058] like Figure 2A As shown, the redundant sub-pixel 22s may also be disposed above the arrangement of the three sub-pixels 22R, 22G, and 22B.

[0059] like Figure 2B As shown, the redundant sub-pixel 22s may also be arranged side by side with the three sub-pixels 22R, 22G, and 22B.

[0060] like Figure 2C As shown, the redundant sub-pixel 22s may be arranged in a 2×2 grid pattern together with the three sub-pixels 22R, 22G, and 22B.

[0061] Specifically, the relationship between the defective sub-pixel 22d and the redundant sub-pixel 22s is as follows. For example, in the pixel 20 in the uppermost section and the leftmost column of the A section, the sub-pixel in the central column is the defective sub-pixel 22d. The sub-pixel 22G with a green luminous color should be configured in the central column of the pixel 20. Since the sub-pixel in the central column is the defective sub-pixel 22d, the sub-pixel 22G with a green luminous color is configured at the position of the redundant sub-pixel 22s. In other words, the redundant sub-pixel 22s emits light with a green luminous color instead of the sub-pixel in the central column.

[0062] In the pixel 20 in the third layer and the rightmost column from the top of the A portion, the sub-pixel in the left column is a defective sub-pixel 22d. The sub-pixel 22R of the red luminous color should be arranged in the sub-pixel in the left column of the pixel 20. Since the sub-pixel in the left column is the defective sub-pixel 22d, the sub-pixel 22R of the red luminous color is arranged at the position of the redundant sub-pixel 22s. In other words, the redundant sub-pixel 22s emits light with the red luminous color instead of the sub-pixel in the left column.

[0063] In the pixel 20 in the bottom section and the central column of the A section, the sub-pixel in the right column is a defective sub-pixel 22d. The sub-pixel 22B of the blue luminous color should be arranged in the sub-pixel in the right column of the pixel 20. Since the sub-pixel in the right column is the defective sub-pixel 22d, the sub-pixel 22B of the blue luminous color is arranged at the position of the redundant sub-pixel 22s. That is, the redundant sub-pixel 22s emits light with the blue luminous color instead of the sub-pixel in the right column.

[0064] In the pixel 20 without the defective sub-pixel 22d, the redundant sub-pixel 22s is set not to light up. For example, in the pixel 20 in the center column of the uppermost stage of the A section, the redundant sub-pixel 22s has no fluorescent layer formed thereon and is not driven by the driving circuit 52 but remains as a simple redundant element.

[0065] The ROM 54 of the driver IC 50 stores the position of the defective sub-pixel 22 d and sets the driver circuit 52 so as to drive the normal sub-pixel based on the data of the emission color corresponding to the position.

[0066] Figure 3A to Figure 3D This is a schematic cross-sectional view illustrating a part of the image display device according to this embodiment.

[0067] Figure 3A 2 is a cross-sectional view of a sub-pixel 22R of red light-emitting color. The light-emitting element 30 is connected to the first wiring 3 provided on one surface of the insulating substrate 2. The light-emitting element 30 is also connected to the second wiring 4 provided on the upper surface of the light-emitting element 30. The light-emitting element 30 is connected to the driving circuit 52 and the like via the first wiring 3 and the second wiring 4. The insulating layer 5 is provided between the first wiring 3 and the second wiring 4 to electrically insulate the first wiring 3 from the second wiring 4. A phosphor layer 40R is provided on the upper surface of the light-emitting element 30.

[0068] The light emitting element 30 is, for example, a blue light emitting element containing GaN. The phosphor layer 40R is a wavelength conversion layer of a wavelength conversion material that is excited by the wavelength of blue light and converts the wavelength into the wavelength of red light.

[0069] Figure 3B is a cross-sectional view of a sub-pixel 22G emitting green light. Figure 3A The phosphor layer 40G is a wavelength conversion layer of a wavelength conversion material that is excited by the wavelength of blue light and converted into the wavelength of green light.

[0070] Figure 3C 2 is a cross-sectional view of a sub-pixel 22B having a blue luminescent color. The light-emitting element 30 is a blue luminescent element, so as shown in this example, a wavelength conversion layer may not be provided. In order to adjust the chromaticity of blue and make the blue luminescent color in the display area 10 uniform, a blue phosphor layer 40B may be further provided as shown by the dotted line. By providing the blue phosphor layer 40B, the chromaticity change in the oblique direction can also be suppressed.

[0071] The redundant sub-pixel 22s that is not lit has the same structure as the blue sub-pixel 22B. Since it is not driven by the driving circuit 52 and is not lit, no wavelength conversion layer is provided.

[0072] Figure 3D2 is a cross-sectional view of a defective sub-pixel 22d. A fluorescent layer may not be provided in the defective sub-pixel 22d. In the defective sub-pixel 22d, the light-emitting element 30 emits light at a high brightness relative to the normal state, or is always on. Therefore, a wavelength conversion layer 40K that makes the light emitted by the light-emitting element 30 non-transmissive may be provided on the light-emitting element 30 as shown by the dotted line in the figure. The wavelength conversion layer 40K absorbs most of the wavelength of the light emitted by the light-emitting element 30. The light emission color of the wavelength conversion layer 40K is substantially black.

[0073] In the above, all the light-emitting elements 30 are blue light-emitting elements, but they can also be replaced by blue light-emitting elements and set to light-emitting elements of blue-violet light or ultraviolet light of about 405nm that are beneficial to the luminous efficiency. In the case of ultraviolet light-emitting elements, a phosphor layer that converts ultraviolet light into blue light is provided in the normal sub-pixel 22B. In the case where the sub-pixel becomes a defective sub-pixel 22d, a wavelength conversion layer may not be provided, a blue phosphor layer (wavelength conversion layer) may be provided, or a non-transmissive wavelength conversion layer may be provided.

[0074] The wavelength conversion layer of each luminescent color may be made of a quantum dot phosphor material in addition to a general phosphor material. When a quantum dot phosphor material is used, each luminescent color can be realized, and the monochromaticity is high, and the color reproducibility can be improved, which is preferred.

[0075] The operation of the image display device according to this embodiment will be described.

[0076] Figure 4 This is a block diagram illustrating a part of the image display device according to this embodiment.

[0077] As already described, the data of the position of each defective sub-pixel 22d is stored in the ROM 54 of the driver IC 50. The data of the position of each sub-pixel 22R, 22G, 22B of each pixel 20 is preset. For example, the position of each sub-pixel 22R, 22G, 22B of each pixel 20 is identified based on XY coordinate data virtually set in the display area 10. The original luminous color of the sub-pixel is pre-associated with the XY coordinate data.

[0078] like Figure 4 As shown, the data stored in the ROM 54 is transferred and stored by the information processing device 102 from the storage device 103 storing the data of the position of the defective sub-pixel 22 d obtained in one step of the manufacturing method of the image display device 1 , as described in detail later.

[0079] The ROM 54 is a read-only memory (ROM) that allows data to be written once or multiple times. This may also be an OTPROM (One Time Programmable ROM). Data is written to each image display device 1 according to the occurrence of the defective sub-pixel 22d of the image display device 1.

[0080] The driving circuit 52 operates based on image data and control data supplied from the outside. The driving circuit 52 refers to the data written in the ROM 54, converts the received image data into appropriate driving data, and drives appropriate sub-pixels.

[0081] More specifically, the driving circuit 52 drives the redundant sub-pixel 22s using the data of the original luminous color of the defective sub-pixel 22d when driving the data of the position of the defective sub-pixel 22d written in the ROM 54. In the pixel 20 where the defective sub-pixel 22d does not exist, the driving circuit 52 drives the sub-pixels 22R, 22G, and 22B using the data of the original luminous color. In this case, the driving circuit 52 does not drive the redundant sub-pixel 22s.

[0082] A method for manufacturing the image display device 1 according to the embodiment will be described.

[0083] Figure 5 This is a flowchart illustrating a method for manufacturing the image display device according to the embodiment.

[0084] like Figure 5 As shown, in the manufacturing method of the image display device 1, in the defective sub-pixel detection step S1, the defective sub-pixel 22d is detected. As will be described in detail later, at this time, the light-emitting element 30 is installed in the display area 10, and no phosphor layer is provided in any light-emitting element 30. That is, the defective sub-pixel 22d is determined by the brightness of the light-emitting element 30 that emits blue or ultraviolet light.

[0085] In the wavelength conversion layer forming step S2, phosphor layers 40R and 40G are formed in the light emitting elements 30 corresponding to the normal sub-pixels 22R and 22G, respectively. A blue phosphor layer may be formed in the light emitting element 30 corresponding to the sub-pixel 22B. In addition, a wavelength conversion layer 40K of a black, i.e., non-transmissive phosphor layer may be provided in the light emitting element 30 corresponding to the defective sub-pixel 22d. As described later, in the formation of the phosphor layer, an inkjet coating device is preferably used. The phosphor layer may also be formed by pasting a phosphor sheet.

[0086] In the driver IC mounting step S3, the data of the position of the defective sub-pixel 22d stored in the storage device 103 is written into the ROM 54 of the driver IC 50 via the information processing device 102. The driver IC 50 having the ROM 54 with the data written therein is mounted at a predetermined position near the display region 10.

[0087] The image display device 1 in which the driver IC 50 is mounted receives input of data including a predetermined inspection display pattern and the like, and determines whether the light emission of each pixel 20 is good or bad.

[0088] The details of each process are described.

[0089] Figure 6 This is an example of a schematic block diagram for explaining a part of the method for manufacturing the image display device according to the present embodiment.

[0090] Figure 6 The structure of the defective sub-pixel detection system 100 that performs the defective sub-pixel detection step S1 is schematically shown in detail.

[0091] like Figure 6 As shown, in the display area 10, the pixels 20 are arranged in a grid shape. Each pixel 20 includes four light-emitting elements 30 of blue light-emitting color. Three of the four light-emitting elements 30 are arranged in a row, and the other is arranged below the light-emitting elements 30 arranged in a row. The light-emitting element 30 arranged below is a light-emitting element that becomes a redundant sub-pixel 22s. In the figure, an enlarged view of the A part that is a part of the display area 10 is shown. Below, the details of each manufacturing process are described in the same way using the enlarged view of the A part of the display area 10.

[0092] The defective sub-pixel detection system 100 includes a camera 101, an information processing device 102, and a storage device 103. In this example, the camera 101 is connected to the information processing device 102. The information processing device 102 is connected to the storage device 103. The connection between the devices is not limited to the above, and can be set to any appropriate connection structure. For example, the camera 101, the information processing device 102, and the storage device 103 can also be connected on a common communication network, and can send and receive data to each other.

[0093] The defective sub-pixel detection process by the defective sub-pixel detection system 100 will be described in detail.

[0094] The information processing device 102 is, for example, a computer, and operates according to a program. The information processing device 102 has data of a pre-set photographing area. The data of the photographing area is, for example, an area that divides the display area 10 into four parts. The photographing environment is set based on the resolution of the camera 101. For example, the photographing area is set so that the brightness of each light emitting element 30 in the photographing area can be determined when it is turned on according to the resolution of the camera 101.

[0095] Data such as coordinates of the area divided into four and the order of photographing the areas divided into four are set in the program of the information processing device 102. The information processing device 102 supplies display data 104 of the photographing area to be photographed to the lighting drive circuit 105.

[0096] The lighting drive circuit 105 selects and causes the light emitting element 30 to emit light based on the set display data 104. The lighting drive circuit 105 may use the drive circuit 52 of the drive IC 50 or may prepare a separate drive circuit from the drive IC 50.

[0097] The camera 101 captures an image of a region including at least a capture region set by the information processing device 102 in the display region 10. When the light emitting element 30 emits ultraviolet light, the camera 101 uses a configuration having an image capturing element that is sensitive to ultraviolet light.

[0098] The information processing device 102 acquires image data captured by the camera 101. The information processing device 102 performs image processing on the image data acquired by the program, and compares the light emission brightness of each light emitting element 30 in the imaging area with a predetermined value.

[0099] When the brightness of the light-emitting element 30 is lower than the first specified value, the information processing device 102 determines that the light-emitting element 30 is a defective sub-pixel 22d. The information processing device 102 may have a plurality of specified values ​​related to the determination of brightness. For example, the second specified value has a value greater than the first specified value. When the brightness of the light-emitting element 30 is higher than the second specified value, the light-emitting element 30 is determined to be a defective sub-pixel 22d.

[0100] Even in the range from the first predetermined value to the second predetermined value, when all the drive signals of the lighting drive circuit 105 are turned off, the light-emitting element 30 that is lit is determined to be a defective sub-pixel 22 d .

[0101] The information processing device 102 determines the position of the detected defective sub-pixel 22 d.

[0102] The information processing device 102 sets the data on the positions of all defective sub-pixels 22 d in the image data of the photographic area, and transfers the data to the storage device 103 .

[0103] The information processing device 102 sets the display data 104 of the next imaging area through a program.

[0104] The information processing device 102 repeatedly executes the above-mentioned operations for all photographic areas.

[0105] Next, the wavelength conversion layer forming step will be described in detail.

[0106] Figure 7 This is an example of a schematic block diagram for explaining a part of the method for manufacturing the image display device according to the embodiment.

[0107] exist Figure 7 , the details of the structure of the wavelength conversion layer forming system 110 that performs the wavelength conversion layer forming step S2 are schematically shown.

[0108] like Figure 7 As shown, the wavelength conversion layer forming system 110 includes an inkjet coating device 111, an information processing device 102, and a storage device 103. The information processing device 102 and the storage device 103 can be the same devices as those used in the defective sub-pixel detection system 100 described above.

[0109] The inkjet coating device 111 has nozzles 112R and 112G. The nozzle 112R ejects fluorescent paint for forming a red phosphor layer. The nozzle 112G ejects fluorescent paint for forming a green phosphor layer. By mixing a red pigment or dye into the red fluorescent paint, the color purity can be improved. By mixing a green pigment or dye into the green fluorescent paint, the color purity can be improved. As shown by the dotted line, the inkjet coating device 111 may also have a nozzle 112B that ejects fluorescent paint for forming a blue phosphor layer. Instead of the nozzle 112B, or in addition to the nozzle 112B, a nozzle that ejects a black non-transmissive paint may be provided to make the light emitted by the defective sub-pixel 22d non-transmissive.

[0110] The information processing device 102 accesses the storage device 103 . The information processing device 102 obtains the data of the position of the defective sub-pixel 22 d stored in the storage device 103 and stored by the defective sub-pixel detection system 100 .

[0111] The information processing device 102 transmits the data of the position of the defective sub-pixel 22 d acquired from the storage device 103 to the inkjet coating device 111 .

[0112] The inkjet coating device 111 has in advance position data corresponding to the emission colors of the sub-pixels arranged in the display area 10. The inkjet coating device 111 replaces the original position data with the data on the defective sub-pixel 22d received from the information processing device 102.

[0113] For example, in the data sent from the information processing device 102, the sub-pixel at the center of the pixel 20 at the uppermost stage and the leftmost column of the A portion is a defective sub-pixel 22d. In the initial position data of the inkjet coating device 111, the luminous color of the sub-pixel in the center column of the pixel 20 is set to green. The inkjet coating device 111 does not eject green fluorescent paint at the position of the sub-pixel in the center column, but ejects green fluorescent paint at the position of the redundant sub-pixel 22s.

[0114] In the case of the pixel 20 in the third layer and the rightmost column from the top of the A portion, the data sent from the information processing device 102 indicates that the sub-pixel in the left column is a defective sub-pixel 22d. In the initial position data of the inkjet coating device 111, the luminous color of the sub-pixel in the left column is set to red. The inkjet coating device 111 does not spray red fluorescent paint at the position of the sub-pixel in the left column, but sprays red fluorescent paint at the position of the redundant sub-pixel 22s.

[0115] In the case of the pixel 20 in the lowermost section and the central column of the A part, the data sent from the information processing device 102 indicates that the sub-pixel in the right column is a defective sub-pixel 22d. In the initial position data of the inkjet coating device 111, the luminous color of the sub-pixel in the right column is blue. When the inkjet coating device 111 forms a blue fluorescent layer, the fluorescent paint is not ejected at the position of the right column, and the blue fluorescent paint is ejected at the position of the redundant sub-pixel 22s. When the blue fluorescent layer is not formed, the fluorescent paint is not ejected to any of the light-emitting element 30 in the right column and the redundant sub-pixel 22s.

[0116] When forming the fluorescent material layers of the above-mentioned respective colors, the inkjet coating device 111 may discharge non-transmissive ink at the position of the defective sub-pixel 22 d .

[0117] Figure 8 This is an example of a schematic block diagram for explaining a part of the method for manufacturing the image display device according to the embodiment.

[0118] exist Figure 8 , the details of the structure of the driver IC mounting system 120 that performs the driver IC mounting step S3 are schematically shown.

[0119] like Figure 8 As shown, the driver IC mounting system 120 includes an information processing device 102 and a storage device 103. The information processing device 102 and the storage device 103 can use the same system as that used in the defective sub-pixel detection system 100 and the wavelength conversion layer forming system 110.

[0120] The information processing device 102 accesses the storage device 103 to obtain data on the position of the defective sub-pixel 22 d .

[0121] The information processing device 102 writes the acquired data on the position of the defective sub-pixel 22 d into the ROM 54 .

[0122] The driver IC 50 is mounted at a predetermined position of the image display device 1 by an electronic component mounting system (not shown). Data may be written to the ROM 54 after the driver IC 50 is mounted.

[0123] The image display device 1 is connected to a display unit driving system 121 . The image display device 1 receives data such as a display pattern for inspection from the display unit driving system 121 , and determines whether each pixel 20 is good or bad.

[0124] In this way, the image display device 1 of this embodiment can be manufactured.

[0125] Effects of the image display device 1 of this embodiment will be described.

[0126] The image display device 1 of this embodiment has the light emitting element 30 mounted on the display region 10, and the position of the defective sub-pixel 22d is determined after lighting. Therefore, it is not necessary to perform a single inspection step before mounting the light emitting element 30. Therefore, the overall manufacturing yield of the image display device 1 can be improved.

[0127] In this embodiment, each pixel 20 includes at least one redundant sub-pixel 22s. When a defective sub-pixel 22d exists in the pixel 20, the luminous color of the redundant sub-pixel 22s is replaced with the original luminous color of the defective sub-pixel 22d. Therefore, most of all pixels 20 can include red, green, and blue, so that an image display device with good color reproducibility can be realized.

[0128] Instead of using a blue inorganic semiconductor light-emitting element in the light-emitting element 30, a light-emitting element that emits ultraviolet light can be made by forming a phosphor layer that emits blue light in a blue sub-pixel. By making a light-emitting element that emits ultraviolet light, the light-emitting efficiency of the phosphor can be improved, which can contribute to higher brightness and lower power consumption of the image display device.

[0129] (Second embodiment)

[0130] In the above-mentioned embodiment, a sub-pixel is formed by forming a phosphor layer of an appropriate color on a light-emitting element emitting blue or ultraviolet light to form a display area. In the present embodiment described below, by setting the light-emitting element itself to red, green and blue, and then providing a redundant sub-pixel for each pixel, the same effect as in the case of the above-mentioned other embodiments can be obtained.

[0131] Fig. 9 This is a schematic block diagram illustrating the image display device according to this embodiment.

[0132] like Fig. 9 As shown, the image display device 201 of this embodiment includes a display region 210 and a driver IC 50. The driver IC 50 is the same as that of the other embodiments described above. The display region 210 and the driver IC 50 are provided on, for example, a substrate not shown.

[0133] The pixels 220 are arranged in a grid pattern in the display area 210. Most of the pixels 220 include sub-pixels 222R, 222G, 22B and redundant sub-pixels 222s. A portion of the remaining pixels 220 include defective sub-pixels 222d and 22B, and either a sub-pixel 22R having a red phosphor layer or a sub-pixel 22G having a green phosphor layer. A portion of the remaining pixels 220 include sub-pixels 222R, 222G, 22B, and defective sub-pixel 22d. Here, sub-pixel 22B is in the above-mentioned other embodiments. Figure 3C The defective sub-pixel 22d is Figure 3D Defective sub-pixel as described in .

[0134] Figures 10A to 10C This is a schematic cross-sectional view illustrating a part of the image display device according to this embodiment.

[0135] Fig. 10A It is a cross-sectional view of a sub-pixel 222R of a red luminous color. The light-emitting element 230R is a light-emitting element that emits red light. For example, the light-emitting element 230R is an inorganic semiconductor light-emitting element including AlGaAs, GaAsP, etc. The light-emitting element 230R is connected to a first wiring 3 provided on one surface of an insulating substrate 2. The light-emitting element 230R is also connected to a second wiring 4 provided on the upper surface of the light-emitting element 230R. The light-emitting element 230R is connected to a driving circuit 52 and the like via these first wiring 3 and second wiring 4. The insulating layer 5 is provided between the first wiring 3 and the second wiring 4 to electrically insulate the first wiring 3 from the second wiring 4.

[0136] Fig. 10B 2 is a cross-sectional view of a sub-pixel 222G emitting green light. The light-emitting element 230G is a light-emitting element emitting green light. For example, the light-emitting element 230G is an inorganic semiconductor light-emitting element including InGaN, ZnSe, etc. Fig. 10A The same situation.

[0137] Fig. 10C is a cross-sectional view of a redundant sub-pixel 222s. The structure of the redundant sub-pixel 222s is similar to that of the other embodiments described above. Figure 3CIn addition, in this embodiment, the blue luminescent sub-pixel 22B is the same as that in the above-mentioned other embodiments. Figure 3C Same as described.

[0138] return Fig. 9 , the structure of each pixel 220 is described in more detail.

[0139] In this embodiment, when the sub-pixel 222R of the red luminous color or the sub-pixel 222G of the green luminous color becomes defective, it is called a defective sub-pixel 222d, and when the sub-pixel of the blue luminous color becomes defective, it is called a defective sub-pixel 22d.

[0140] Among the pixels 220 including the defective sub-pixel 222d, there are cases where a sub-pixel that originally emits red or green light becomes defective, such as the pixel 220 in the uppermost left column of the A portion and the pixel 220 in the rightmost column of the third layer from the top.

[0141] When the red sub-pixel 222R is defective, a sub-pixel 22R having a red fluorescent layer 40R formed on the light-emitting element 30 of the redundant sub-pixel 222s is used instead of the original red sub-pixel 222R. Figure 3A The structure of the red light-emitting sub-pixel described in is the same as that of the red light-emitting sub-pixel described in . In addition, in the figure, the defective red light-emitting sub-pixel 222R is shown as a defective sub-pixel 222d.

[0142] When the green luminescent sub-pixel 222G is defective, a sub-pixel 22G having a green fluorescent layer 40G formed on the light emitting element 30 of the redundant sub-pixel 222s is used instead of the original green sub-pixel 222R. Figure 3B The structure of the green light-emitting sub-pixel described in 2 is the same as that of the green light-emitting sub-pixel described in 2. In the figure, the defective green light-emitting sub-pixel 222G is shown as the defective sub-pixel 222d.

[0143] In addition to the above, in the pixel 220 including the defective sub-pixel 222d, there is also a case where the sub-pixel of the original blue luminescent color becomes defective, such as the pixel 220 in the lowermost center column of the A section. In this case, the redundant sub-pixel 222s is directly set as the sub-pixel 22B formed with the blue phosphor layer, replacing the original blue sub-pixel 22B. Here, the sub-pixel 22B is the same as the sub-pixel 22B in the Figure 3C The structure of the green light-emitting sub-pixel described in 2 is the same as that of the green light-emitting sub-pixel described in 2. In the figure, the blue light-emitting sub-pixel having a defect is shown as a defective sub-pixel 22d.

[0144] A method for manufacturing the image display device 201 according to this embodiment will be described.

[0145] Fig.11 This is a flowchart illustrating a method for manufacturing the image display device according to this embodiment.

[0146] like Fig.11 As shown, the driver IC mounting step S3 is the same as that of the other embodiments described above. The wavelength conversion layer forming step S202 is different from that of the other embodiments described above.

[0147] In this embodiment, a defective sub-pixel is detected in the defective sub-pixel detection step S1. As in the other embodiments described above, in the defective sub-pixel detection step S1, all sub-pixels in the imaging area are illuminated, and the position of the defective sub-pixel is detected based on the image data.

[0148] Each light-emitting element emits red, green, and blue light, respectively. Therefore, when all sub-pixels are lit at the same time, the determination of the defective position may become difficult due to color mixing, etc. For example, each luminous color may be lit in the order of red, green, and blue, and the defective sub-pixel may be detected for each luminous color.

[0149] In the wavelength conversion layer forming step S202 , while determining the emission color of the defective sub-pixels 222 d and 22 d , it is determined whether or not to form a wavelength conversion layer in the redundant sub-pixel 222 s .

[0150] Specifically, in step S202a, the original luminescent color of the defective sub-pixel 222d is determined. If the original luminescent color is red or green, in step S202b, a phosphor layer of the original luminescent color of the defective sub-pixel 222d is formed in the redundant sub-pixel 222s.

[0151] In step S202a, if the original luminous color of the defective sub-pixel 22d is blue, in step S202c, it is determined whether a blue wavelength conversion layer is formed. In the case where the wavelength conversion layer is formed, in step S202b, a phosphor layer of a blue luminous color is formed in the redundant sub-pixel 222s. In the case where the wavelength conversion layer is not formed, step S202b is not executed, and the process returns to step S202a.

[0152] In addition, whether or not to form a blue fluorescent layer in the redundant sub-pixel 222s depends on many pre-set circumstances, and therefore the determination in step S202c may be fixed to a certain one in advance.

[0153] In step S202 b , the process returns to step S202 a and the above steps are repeated until phosphor layers are formed for all redundant sub-pixels of the pixel 220 including the defective sub-pixel.

[0154] The details of each process are described.

[0155] Fig.12 This is an example of a schematic block diagram for explaining a part of the method for manufacturing the image display device according to the present embodiment.

[0156] exist Fig.12 , the structure of the defective sub-pixel detection system 100 that performs the defective sub-pixel detection step S1 is shown. The defective sub-pixel detection system 100 has the same structure as the other embodiments described above. Therefore, the detailed description of the defective sub-pixel detection system 100 is appropriately omitted.

[0157] like Fig.12 As shown, pixels 220 are arranged in a grid pattern in the display area 210. Each pixel 220 includes three sub-pixels 222R, 222G, and 22B and a redundant sub-pixel 222s. In this example, the sub-pixels 222R, 222G, and 22B are arranged in a row, and the redundant sub-pixel 222s is configured below the sub-pixels 222R, 222G, and 22B arranged in a row. In the figure, an enlarged view of part A, which is a part of the display area 210, is shown. Below, the details of each manufacturing process are described in the same way using the enlarged view of part A of the display area 210.

[0158] The details of the defective sub-pixel detection process of the defective sub-pixel detection system 100 will be described with reference to points different from those of the other embodiments described above.

[0159] The information processing device 102 has data of a preset photographing area, and the data of the photographing area is set to, for example, an area obtained by dividing the display area 210 into four. The photographing environment is set based on the resolution of the camera 101 .

[0160] The information processing device 102 supplies the display data 104 in the set photographic area to the lighting drive circuit 105. At this time, the information processing device 102 can light up all the sub-pixels 222R, 222G, and 22B at the same time, or can light up in sequence according to each luminous color. In the case of lighting up according to each luminous color, the settings of the camera 101, such as exposure, white balance, etc., can also be set according to each luminous color. In addition, the redundant sub-pixel 222s is a sub-pixel that is replaced when there is a defect in the pixel 220. Therefore, the display data 104 generated by the information processing device 102 does not include data for lighting up the redundant sub-pixel 222s.

[0161] The lighting drive circuit 105 selects the sub-pixels 222R, 222G, and 22B based on the set display data 104 and drives them to emit light.

[0162] The camera 101 captures an image of a region including at least a photographing region set by the information processing device 102 in the display region 10 .

[0163] The information processing device 102 acquires the image data captured by the camera 101. The information processing device 102 performs image processing on the image data acquired by the program, and compares the light emission brightness of each sub-pixel 222R, 222G, and 22B in the photographic area with a predetermined value.

[0164] When the brightness of each of the sub-pixels 222R, 222G, and 22B is lower than the first specified value, the information processing device 102 determines the sub-pixels 222R, 222G, and 22B as defective sub-pixels 222d. As in the case of the other embodiments described above, the information processing device 102 may also have a plurality of specified values ​​related to the determination of brightness. The second specified value has a value greater than the first specified value. When the brightness of the sub-pixels 222R, 222G, and 22B is higher than the second specified value, the sub-pixels are determined to be defective sub-pixels 222d.

[0165] Even in the range from the 1st predetermined value to the 2nd predetermined value, when all the driving signals of the lighting driving circuit 105 are turned off, the lit sub-pixel is determined to be a defective sub-pixel 222d.

[0166] The first predetermined value and the second predetermined value may be set for each luminous color, or may be set to the same value for all luminous colors.

[0167] The information processing device 102 determines the position of the detected defective sub-pixel 222d. The information processing device 102 sets the data of the positions of all defective sub-pixels 222d in the image data of the photographic area and transfers it to the storage device 103. The information processing device 102 sets the display data 104 of the next photographic area through a program. The information processing device 102 repeatedly performs the above operations on all photographic areas.

[0168] Next, the wavelength conversion layer forming step will be described in detail.

[0169] Fig.13 This is an example of a schematic block diagram for explaining a part of the method for manufacturing the image display device according to the present embodiment.

[0170] exist Fig.13 , the details of the structure of the wavelength conversion layer forming system 110 that performs the wavelength conversion layer forming step S202 are schematically shown.

[0171] In the present embodiment, a wavelength conversion layer forming system 110 including an inkjet coating device 111 different from the case of the above-mentioned other embodiments is used.

[0172] In this embodiment, the inkjet coating device 111 has a nozzle 112R for ejecting red fluorescent paint and a nozzle 112G for ejecting green fluorescent paint. The red fluorescent layer and the green fluorescent layer are used to form a fluorescent layer of the original luminous color of the defective sub-pixel 222d in the redundant sub-pixel 222s when there is a defective sub-pixel 222d in the pixel 220.

[0173] When a fluorescent material layer is formed in each of the sub-pixels 222R, 222G, and 22B, the inkjet application device 111 further includes a nozzle 112B for ejecting blue color as indicated by a dotted line.

[0174] The inkjet coating device 111 receives data on the position of the defective sub-pixel 222d from the information processing device 102. The inkjet coating device 111 determines whether the original luminescent color of the defective sub-pixel 222d is red or green.

[0175] When the original luminous color of the defective sub-pixel 222d is red, red fluorescent paint is ejected toward the redundant sub-pixel 222s of the pixel 220 in which the defective sub-pixel 222d exists. When the original luminous color of the defective sub-pixel 222d is green, green fluorescent paint is ejected toward the redundant sub-pixel 222s of the pixel 220 in which the defective sub-pixel 222d exists.

[0176] When the original luminous color of the defective sub-pixel 222d is blue, nothing is done to the pixel 220 where the defective sub-pixel 222d exists, and the luminous color of the next defective sub-pixel 222d is determined.

[0177] The inkjet coating device 111 repeatedly executes the processing related to all defective sub-pixels 222 d as described above.

[0178] Fig.14 This is an example of a schematic block diagram for explaining a part of the method for manufacturing the image display device according to the embodiment.

[0179] exist Fig.14 2 schematically shows the details of the structure of the driver IC mounting system 120 that performs the driver IC mounting step S3. The driver IC mounting system 120 can be the same as that in the case of the above-mentioned other embodiments.

[0180] Effects of the image display device of this embodiment will be described.

[0181] The image display device of this embodiment has the following effects in addition to the effects of the above-mentioned other embodiments.

[0182] As sub-pixels, light-emitting elements having red, green, and blue luminous colors are used, and as redundant sub-pixels 222s, blue light-emitting elements are used. Therefore, in the vast majority of pixels 220 without defective sub-pixels 222d, it is not necessary to form a phosphor layer, so the period of the wavelength conversion layer formation process is shortened, and by shortening the period of the entire manufacturing process, the image display device can be manufactured at a low cost.

[0183] When the fluorescent material layer is formed in all the sub-pixels 222R, 222G, and 22B, the chromaticity of each luminescent color can be further stabilized, and the chromaticity change in the oblique direction can be suppressed, thereby enabling higher-definition image display.

[0184] (Third embodiment)

[0185] The above-mentioned image display device can be provided as an image display module having an appropriate number of pixels, for example, a computer monitor, a television, a portable terminal such as a smartphone, or a car navigation system.

[0186] Fig.15 This is a block diagram illustrating the image display device according to this embodiment.

[0187] exist Fig.15 , a main part of the structure of a computer display is shown.

[0188] like Fig.15 As shown, the image display device 401 includes an image display module 1a. The image display module 1a includes the display area 10 and the driver IC 50 as in the other embodiments described above. The image display module 1a further includes a scanning circuit 60. The scanning circuit 60 sets the driving order of each sub-pixel together with the driver IC 50.

[0189] The image display device 401 further includes a controller 470. The controller 470 receives the separated and generated control signals via an interface circuit (not shown) and controls the driving and driving order of each sub-pixel with respect to the driver IC 50 and the scanning circuit.

[0190] (Variation Example)

[0191] Fig.16 This is a block diagram illustrating an image display device according to this modification.

[0192] exist Fig.16 , the structure of a high-definition thin-screen TV is shown.

[0193] like Fig.16As shown, the image display device 501 includes an image display module 1a. The image display device 501 includes a controller 570 and a frame memory 580. The controller 570 controls the driving order of each sub-pixel of the display area 10 based on the control signal supplied by the bus 540. The frame memory 580 stores display data of one frame for processing such as smooth dynamic image reproduction.

[0194] The image display device 501 has an I / O circuit 510. The I / O circuit 510 provides an interface circuit for connecting to an external terminal, device, etc. The I / O circuit 510 includes, for example, a USB interface for connecting to an external hard disk device, an audio interface, etc.

[0195] The image display device 501 includes a tuner 520 and a signal processing circuit 530. The antenna 522 is connected to the tuner 520, and separates and generates necessary signals from radio waves received by the antenna 522. The signal processing circuit 530 includes a DSP (Digital Signal Processor), a CPU (Central Processing Unit), etc. The signals separated and generated by the tuner 520 are separated by the signal processing circuit 530 and generated into image data, sound data, etc.

[0196] By setting the tuner 520 and the signal processing circuit 530 as a high-frequency communication module for mobile phone transceiver, WiFi, GPS receiver, etc., it can also be set as other image display devices. For example, an image display device with an image display module with appropriate screen size and resolution can be set as a portable information terminal such as a smart phone or a car navigation system.

[0197] In addition, the image display module used in the above-mentioned image display device is not limited to the case of the above-mentioned first embodiment, and may be the case of the second embodiment.

[0198] According to the above-described embodiments, an image display device and a method for manufacturing an image display device with improved manufacturing yield can be realized by partially eliminating pixels including defective light emitting elements and omitting the inspection step of light emitting elements alone.

[0199] Several embodiments of the present invention have been described above, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the scope of the main purpose of the invention. These embodiments and their variations are included in the scope and main purpose of the invention, and are included in the scope of the invention and its equivalents described in the claims. In addition, the above-mentioned embodiments can be combined with each other and implemented.

Claims

1. An image display device, wherein: have: A plurality of pixels each including a plurality of first sub-pixels capable of emitting light in red, green, and blue, respectively, and a second sub-pixel capable of emitting light in blue; as well as The driving circuit drives the plurality of first sub-pixels based on the data of the supplied image signal and reproduces the data of the image signal through the plurality of pixels. Any one of the plurality of first sub-pixels of at least one pixel among the plurality of pixels has a defective sub-pixel, When the defective sub-pixel is a sub-pixel that should emit red or green light, The second sub-pixel includes a light-emitting element and a wavelength conversion layer provided on the light-emitting element and converting the color of light emitted by the light-emitting element into a color that the defective sub-pixel should emit. The driving circuit has the positions of the defective sub-pixel and the remaining sub-pixels, and data for respectively determining the positions and luminous colors, and based on the positions and luminous color data, drives the second sub-pixel with the brightness of the luminous color that the defective sub-pixel should emit.

2. The image display device according to claim 1, wherein: The plurality of first sub-pixels respectively include: A first light-emitting element that emits blue light, and a first wavelength conversion layer that is provided on the first light-emitting element and converts the blue light emission color into red; A second light emitting element that emits blue light, and a second wavelength conversion layer that is provided on the second light emitting element and converts the blue light emission color into green; as well as The third light-emitting element emits blue light.

3. The image display device according to claim 1, wherein: The plurality of first sub-pixels respectively include: A light-emitting element that emits red, green, and blue light.

4. The image display device according to claim 1, wherein: The light emitting element is a light emitting element that emits ultraviolet light.

5. The image display device according to claim 1, wherein: The defective sub-pixel has a luminance lower than a prescribed luminance.

6. The image display device according to claim 1, wherein: The defective sub-pixel has a brightness higher than a prescribed brightness.

7. The image display device according to claim 6, wherein: The defective sub-pixel has a layer that does not transmit color.

8. The image display device according to claim 1, wherein: The plurality of first sub-pixels and the second sub-pixel include inorganic semiconductor light-emitting elements.

9. The image display device according to claim 1, wherein: The wavelength conversion layer provided in the second sub-pixel and converting the light emission color of the light-emitting element into the color that the defective sub-pixel should emit light includes a fluorescent material.

10. The image display device according to claim 1, wherein: The wavelength conversion layer provided in the second sub-pixel and converting the light emission color of the light-emitting element into the color that the defective sub-pixel should emit light includes a quantum dot material.

11. A method for manufacturing an image display device, the image display device comprising a plurality of first sub-pixels capable of emitting red, green and blue light respectively and a second sub-pixel capable of emitting blue light, wherein: The manufacturing method of the image display device comprises: a defective sub-pixel detection step, preparing a plurality of first light-emitting elements for respectively causing the plurality of first sub-pixels to emit light and a second light-emitting element for respectively causing the second sub-pixel to emit light, lighting the plurality of first light-emitting elements, acquiring image data of the plurality of first light-emitting elements that are lit, performing image analysis on the image data, respectively setting positions and light-emitting color data of defective light-emitting elements and remaining light-emitting elements without defects among the plurality of first light-emitting elements, and storing the positions and light-emitting color data; a wavelength conversion layer forming step of forming a wavelength conversion layer on each of the plurality of first light emitting elements; and a drive circuit connecting step of connecting a drive circuit for driving the plurality of first light emitting elements and the second light emitting elements, respectively, to the plurality of first light emitting elements and the second light emitting elements based on data of the supplied image signal, The wavelength conversion layer forming step includes: when a sub-pixel that should emit red or green light in the plurality of first light-emitting elements includes the defective light-emitting element, forming a wavelength conversion layer on the second light-emitting element that converts the wavelength into a light-emitting color that should be emitted at the position of the defective light-emitting element based on the position and the light-emitting color data; The driving circuit has the positions of the defective light-emitting element and the remaining light-emitting elements, and data for respectively determining the positions and light-emitting colors, and based on the positions and the light-emitting color data, drives the second light-emitting element with the brightness of the light-emitting color that the defective light-emitting element should emit.

12. The method for manufacturing an image display device according to claim 11, wherein: The plurality of first light emitting elements respectively include: A first wavelength conversion layer is provided on the light emitting element emitting blue light, and converts the light emission color into red; A second wavelength conversion layer is provided on the light emitting element emitting blue light, and converts the light emission color into green; as well as A light-emitting element that emits blue light.

13. The method for manufacturing an image display device according to claim 11, wherein: The plurality of first light emitting elements include light emitting elements that emit red, green, and blue light.

14. The method for manufacturing an image display device according to claim 11, wherein: The defective light emitting element has a luminance lower than a prescribed luminance.

15. The method for manufacturing an image display device according to claim 11, wherein: The defective light emitting element has a brightness higher than a prescribed brightness.

16. The method for manufacturing an image display device according to claim 15, wherein: The wavelength conversion layer forming step includes forming a non-transmitting color layer on the defective light emitting element.

17. The method for manufacturing an image display device according to claim 11, wherein: The plurality of first light emitting elements and the second light emitting element are inorganic semiconductor light emitting elements.

18. The method for manufacturing an image display device according to claim 11, wherein: In the wavelength conversion layer forming step, a method of forming the wavelength conversion layer for converting the wavelength of the second light emitting element into a light emitting color to be emitted at the position of the defective light emitting element is inkjet printing.

Images