A board-level communication device and communication method based on DC carrier

Abstract

An embodiment of the present invention discloses a board-level communication device and a communication method based on DC carrier. The board-level communication device based on DC carrier includes: a first circuit board and a second circuit board connected to it through a power line; the first circuit board includes: an H-bridge circuit unit and a first single-chip microcomputer unit; the second circuit board includes an acquisition circuit unit, a rectification circuit unit, a second single-chip microcomputer unit, a buck circuit unit and a load unit; one end of the H-bridge circuit unit is connected to the signal output end of the first single-chip microcomputer unit; the other end of it is connected to one end of the acquisition circuit unit and one end of the rectification circuit unit; the other end of the acquisition circuit unit is connected to the signal input end of the second single-chip microcomputer unit; the other end of the rectification circuit unit is connected to one end of the buck circuit unit; the other end of the buck circuit unit is connected to the load unit and the power supply end of the second single-chip microcomputer unit. The invention realizes board-level communication by changing the direction of the current to transmit signals.

Description

Technical Field

[0001] The present invention relates to the technical field of board-level communication, and in particular, to a board-level communication device and a communication method based on direct current carrier. Background Art

[0002] In board-level MCU communication, there is often communication between board A and board B, and at the same time, board A also needs to provide power to board B. Generally, three wires, namely VCC, GND, and communication line, are required. Currently, in the existing direct current carrier technology, an alternating current waveform or a high-frequency pulse is usually superimposed on the direct current, and then an alternating current or a high-frequency signal is coupled out at the receiving end. However, this idea has relatively high cost and complex circuit. Summary of the Invention

[0003] An embodiment of the present invention provides a board-level communication device and a communication method based on direct current carrier. The board-level communication device and the communication method based on direct current carrier realize signal transmission by changing the direction of the current of the power supply in board-level communication, and the circuit structure is simple and the circuit cost is effectively reduced.

[0004] On the one hand, the present invention provides a board-level communication device based on direct current carrier, including a first circuit board, a second circuit board, and a power supply line. The first circuit board is connected to the second circuit board through the power supply line;

[0005] Wherein, the first circuit board includes: an H-bridge circuit unit and a first single-chip microcomputer unit;

[0006] The second circuit board includes: a collection circuit unit, a rectification circuit unit, a second single-chip microcomputer unit, a step-down circuit unit, and a load unit;

[0007] One end of the H-bridge circuit unit is connected to the signal output end of the first single-chip microcomputer unit;

[0008] The other end of the H-bridge circuit unit is connected to one end of the collection circuit unit; the other end of the H-bridge circuit unit is also connected to one end of the rectification circuit unit;

[0009] The other end of the collection circuit unit is connected to the signal input end of the second single-chip microcomputer unit;

[0010] The other end of the rectification circuit unit is connected to one end of the step-down circuit unit;

[0011] The other end of the step-down circuit unit is connected to the load unit, and the other end of the step-down circuit unit is also connected to the power supply end of the second single-chip microcomputer unit.

[0012] The H-bridge circuit unit is configured to convert the first direct current power supply of the first circuit board into a first current power supply;

[0013] The first single-chip microcomputer unit is used for sending level signals;

[0014] The acquisition circuit unit is used for acquiring the signal content of the first current power supply;

[0015] The rectification circuit unit is used for converting the first current power supply into a second DC power supply;

[0016] The second single-chip microcomputer unit is used for receiving level signals;

[0017] The buck circuit unit is used for reducing the voltage of the second DC power supply to obtain a third DC power supply;

[0018] The load unit is used for starting when the third DC power supply is connected.

[0019] In a second aspect, the present invention provides a communication method for a board-level communication device based on DC carrier, including:

[0020] Receiving a first current power supply output by a first circuit board;

[0021] Acquiring the voltage of the first current power supply to obtain voltage information;

[0022] Reading a level signal corresponding to the voltage information.

[0023] An embodiment of the present invention provides a board-level communication device and a communication method based on DC carrier. The first circuit board is connected to the second circuit board through a power line. On the first circuit board, different level signals are sent to the H-bridge circuit unit through the first single-chip microcomputer unit, so that the H-bridge circuit unit converts the first DC power supply into a first current power supply with a current direction corresponding to the level signal and outputs it to the second circuit board through the power line. Then, the acquisition circuit unit acquires the voltage of the first current power supply and outputs it to the second single-chip microcomputer unit to read the level signal sent by the first single-chip microcomputer unit to realize board-level communication; at the same time, the first current power supply is also rectified by the rectification circuit unit to obtain a second DC power supply, and the second DC power supply is then stepped down by the buck circuit unit to output a third DC power supply to supply power to the second circuit board. The invention realizes signal transmission by changing the current direction of the power supply in board-level communication, and the circuit structure is simple and the circuit cost is effectively reduced. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 It is a schematic block diagram of the principle of a board-level communication device based on DC carrier provided by an embodiment of the present invention;

[0026] Figure 2 It is a circuit diagram of the first circuit board of a board-level communication device based on DC carrier provided by an embodiment of the present invention;

[0027] Figure 3 It is a circuit diagram of the second circuit board of a board-level communication device based on DC carrier provided by an embodiment of the present invention;

[0028] Figure 4 It is a schematic flow chart of the communication method of a board-level communication device based on DC carrier provided by an embodiment of the present invention;

[0029] Figure 5 It is a schematic sub-flow chart of the communication method of a board-level communication device based on DC carrier provided by an embodiment of the present invention. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0031] It should be understood that when used in this specification and the appended claims, the terms "comprises" and "comprising" indicate the presence of the described features, wholes, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their combinations.

[0032] Please refer to Figures 1-3 , Figure 1 It is a schematic block diagram of the principle of a board-level communication device based on DC carrier provided by an embodiment of the present invention; Figure 2 It is a circuit diagram of the first circuit board of a board-level communication device based on DC carrier provided by an embodiment of the present invention; Figure 3 It is a circuit diagram of the second circuit board of a board-level communication device based on DC carrier provided by an embodiment of the present invention. In this embodiment, the board-level communication device based on DC carrier will be described in conjunction with Figures 1-3 As shown in Figures 1-3 , the board-level communication device based on DC carrier includes: a first circuit board A, a second circuit board B, and a power line, and the first circuit board A is connected to the second circuit board B through the power line;

[0033] Among them, the first circuit board A includes: an H-bridge circuit unit 11 and a first single-chip microcomputer unit 12;

[0034] The second circuit board B includes: a collection circuit unit 21, a rectification circuit unit 22, a second single-chip microcomputer unit 23, a buck circuit unit 24 and a load unit 25;

[0035] One end of the H-bridge circuit unit 11 is connected to the signal output end MCU-TX of the first single-chip microcomputer unit 12; the other end of the H-bridge circuit unit 11 is connected to one end of the collection circuit unit 21; the other end of the H-bridge circuit unit 11 is also connected to one end of the rectification circuit unit 22; the other end of the collection circuit unit 21 is connected to the signal input end MCU-RX of the second single-chip microcomputer unit 23; the other end of the rectification circuit unit 22 is connected to one end of the buck circuit unit 24; the other end of the buck circuit unit 24 is connected to the load unit 25, and the other end of the buck circuit unit 24 is also connected to the power supply end of the second single-chip microcomputer unit 23.

[0036] The H-bridge circuit unit 11 is used to convert the first DC power supply of the first circuit board A into a first current power supply;

[0037] The first single-chip microcomputer unit 12 is used to send a level signal;

[0038] The collection circuit unit 21 is used to collect the signal content of the first current power supply;

[0039] The rectification circuit unit 22 is used to convert the first current power supply into a second DC power supply;

[0040] The second single-chip microcomputer unit 23 is used to receive a level signal;

[0041] The buck circuit unit 24 is used to reduce the voltage of the second DC power supply to obtain a third DC power supply;

[0042] The load unit 25 is used to start when the third DC power supply is connected.

[0043] In this embodiment, in board-level MCU communication, the board-level communication device based on DC carrier improves the DC carrier idea in the prior art, and realizes signal transmission by changing the current direction of the power supply in a regular pattern in DC carrier communication. The first circuit board A is connected to the second circuit board B through the power line, where the power line is a DC power line. In board-level communication, the first circuit board A provides power to the second circuit board B through the power line, and at the same time, realizes one-way communication from the first circuit board A to the second circuit board B only through the power line. The board-level communication device based on DC carrier realizes one-way communication between the first circuit board A and the second circuit board B without the need for a communication line, effectively simplifies the circuit structure in board-level one-way communication, and is beneficial to reducing the circuit cost.

[0044] Specifically, the operating voltage range that the board-level communication device based on DC carrier can apply is between 3.3V and 28V. This solution can be used for the communication architecture in which the first circuit board A provides power to the second circuit board B and one-way communication is carried out from the first circuit board A to the second circuit board B within the operating voltage range. Specific examples are as follows: the main control board of a massage chair as the first circuit board A and the motor board of the massage chair as the second circuit board B; or, the dishwasher button as the first circuit board A and the control board of the dishwasher as the second circuit board B; or, the main control board of a refrigerator as the first circuit board A and the water pump board of the refrigerator as the second circuit board B.

[0045] The first circuit board A includes the H-bridge circuit unit 11 and the first single-chip microcomputer unit 12. One end of the H-bridge circuit unit 11 is connected to the signal output terminal MCU-TX of the first single-chip microcomputer unit 12; the other end of the H-bridge circuit unit 11 is connected to one end of the acquisition circuit unit 21; the other end of the H-bridge circuit unit 11 is also connected to one end of the rectification circuit unit 22; the H-bridge circuit unit 11 is used to convert the first DC power supply of the first circuit board A into a first current power supply with a regularly changed direction. In specific applications, the first terminal CN1 and the second terminal CN2 are used (the first terminal CN1 includes the first port CN1-1 and the second port CN1-2, and the second terminal includes the third port CN2-1 and the fourth port CN2-2). When the signal output terminal MCU-TX of the first single-chip microcomputer outputs logic 1, that is, a high-level signal, the H-bridge circuit unit 11 outputs the first current power supply, and the first current power supply has a specific current direction (at this time, the bus output is the first port CN1-1: VCC1, the second port CN1-2: GND1, and the current direction is from the first port CN1-1 to the second port CN1-2); when the signal output terminal MCU-TX of the first single-chip microcomputer 12 outputs logic 0, that is, a low-level signal, the H-bridge circuit unit 11 outputs the first current power supply, and the current direction of the first current power supply is opposite to the current direction when the signal output terminal MCU-TX of the first single-chip microcomputer 12 outputs a high-level signal (at this time, the bus output is the first port CN1-1: GND1, the second port CN1-2: VCC1, and the current direction is from the second port CN1-2 to the first port CN1-1).

[0046] When the H-bridge circuit unit 11 converts the first DC power supply into the first current power supply with a specific current direction regularly, the first current power supply on the first circuit board A will be output to the acquisition circuit unit 21 and the rectification circuit unit 22 on the second circuit board B through the power line. The rectification circuit unit 22 will rectify and convert the first current power supply into the second DC power supply, and then step down the second DC power supply into the third DC power supply that meets the operating voltages of the second single-chip microcomputer unit 23 and the load unit 25 through the step-down circuit unit 24 to supply power to the second single-chip microcomputer unit 23 and the load unit 25. At the same time, the acquisition circuit unit 21 acquires the voltage at the third port CN2-1 to obtain the signal content transmitted on the bus, and then transmits it to the signal input end MCU-RX of the second single-chip microcomputer unit 23, so that the second single-chip microcomputer unit 23 reads the level signal corresponding to the signal content transmitted on the bus. Specifically, when the first current power supply has a specific current direction (at this time, the bus output is the first port CN1-1: VCC1, the second port CN1-2: GND1, and the current direction is from the first port CN1-1 to the second port CN1-2), the voltage value at the third port CN2-1 is VCC1, and the second single-chip microcomputer unit 23 reads a high-level signal; when the first current power supply has a specific current direction opposite to that (at this time, the bus output is the first port CN1-1: GND1, the second port CN1-2: VCC1, and the current direction is from the second port CN1-2 to the first port CN1-1), the voltage value at the third port CN2-1 is GND1, and the second single-chip microcomputer unit 23 reads a low-level signal.

[0047] In this embodiment, the H-bridge circuit unit 11 includes: a first MOS transistor Q1, a second MOS transistor Q2, a third MOS transistor Q3, a fourth MOS transistor Q4, a first triode Q5, a second triode Q6, a third triode Q7, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8, a ninth resistor R9, and a tenth resistor R10; one end of the first resistor R1 is connected to the drain of the first MOS transistor Q1, and the other end of the first resistor R1 is connected to one end of the second resistor R2; the other end of the second resistor R2 is connected to the gate of the first MOS transistor Q1; the drain of the first MOS transistor Q1 is connected to the drain of the second MOS transistor Q2; the source of the first MOS transistor Q1 is connected to the drain of the third MOS transistor Q3 to form a first bridge arm; one end of the third resistor R3 is connected to the drain of the second MOS transistor Q2; the other end of the third resistor R3 is connected to the other end of the fourth resistor R4; one end of the fourth resistor R4 is connected to the gate of the second MOS transistor Q2; the source of the second MOS transistor Q2 is connected to the drain of the fourth MOS transistor Q4 to form a second bridge arm; one end of the fifth resistor R5 is connected to one end of the second resistor R2; the other end of the fifth resistor R5 is connected to the gate of the third MOS transistor Q3; the source of the third MOS transistor Q3 is grounded; one end of the sixth resistor R6 is connected to the gate of the fourth MOS transistor Q4; the other end of the sixth resistor R6 is connected to the other end of the fourth resistor R4; the source of the fourth MOS transistor Q4 is grounded; the collector of the first triode Q5 is connected to one end of the fifth resistor R5; the base of the first triode Q5 is connected in series with the seventh resistor R7 and the eighth resistor R8 to the base of the second triode Q6; the emitter of the first triode Q5 is grounded; the emitter of the second triode Q6 is connected to a first constant voltage power supply +5V; the collector of the second triode Q6 is connected in series with the ninth resistor R9 to the ground GND1; the collector of the third triode Q7 is connected to the other end of the sixth resistor R6; the base of the third triode Q7 is connected in series with the tenth resistor R10 to the collector of the second triode Q6; the emitter of the third triode Q7 is grounded to GND1.

[0048] In one embodiment, the power line includes a first line and the second line; one end of the first line is connected to the first bridge arm, and the other end of the first line is connected to the second terminal b; one end of the second line is connected to the second bridge arm, and the other end of the second line is connected to the fourth terminal d. Wherein, the first bridge arm is connected to the first line for output, the second bridge arm is connected to the second line for output, and the first line and the second line together form the output bus of the H-bridge circuit unit 11.

[0049] In board-level communication, when working normally, the first circuit board A supplies power to the second circuit board B, and at the same time, the first circuit board A also realizes one-way communication with the second circuit board B through the power line. Wherein, the H-bridge circuit unit 11 is used to convert the first DC power supply on the first circuit board A into a first current power supply that changes regularly, and the first current power supply has a specific current direction. The drain of the first MOS transistor Q1 and the drain of the second MOS transistor Q2 on the H-bridge circuit unit 11 are connected and commonly connected to the power supply terminal VCC1 of the first circuit board; the source of the first MOS transistor Q1 is connected to the drain of the third MOS transistor Q3 to form a first bridge arm; the source of the second MOS transistor Q2 is connected to the drain of the fourth MOS transistor Q4 to form a second bridge arm; the source of the third MOS transistor Q3 is grounded to GND1, and the source of the fourth MOS transistor Q4 is grounded to GND1; wherein, the first line of the power line is connected to the first bridge arm for output, and the second line of the power line is connected to the second bridge arm for output.

[0050] The first single-chip microcomputer unit 12 is mainly used for signal transmission, and sends a high-level signal or a low-level signal to the H-bridge circuit unit 11 according to the task instruction corresponding to the first circuit board A. In practical applications, the first single-chip microcomputer unit 12 will send a level signal corresponding to the task instruction to the H-bridge circuit unit 11 according to the task instruction of the first circuit board A, such as the main control board of a massage chair or the main button of a dishwasher or the task instruction of the main control board of a refrigerator. The H-bridge circuit unit 11 receives the level signal sent by the first single-chip microcomputer unit 12, converts the first DC power supply on the first circuit board A into the first current power supply with a specific current direction according to the rule for output, and realizes power supply and one-way communication to the second circuit board B.

[0051] In one embodiment, the signal output terminal MCU-TX of the first single-chip microcomputer unit 12 is connected between the seventh resistor R7 and the eighth resistor R8, and the task instruction of the first circuit board A can send a level signal corresponding to the task instruction to the H-bridge circuit unit 11 through the signal output terminal MCU-TX of the first single-chip microcomputer unit 12. During specific implementation, the first circuit board A realizes one-way communication while powering the second circuit board B through the power supply line. Among them, when working normally, the H-bridge circuit unit 11 on the first circuit board A is connected to the rectification circuit unit 22 and the acquisition circuit unit 21 on the second circuit board B to realize power supply and one-way communication from the first circuit board A to the second circuit board B.

[0052] On the first circuit board A, the first single-chip microcomputer unit 12 can communicate through encoding preset in the NEC format, and set different pulse width values to represent different logical values. When the signal output terminal MCU-TX of the first single-chip microcomputer unit 12 outputs a logic 1, the level signal output by the first single-chip microcomputer unit 12 is a high level. After receiving the high-level signal input, the H-bridge circuit unit 11 controls the first triode Q5, the second triode Q6, the third triode Q7, the second MOS transistor Q2, and the third MOS transistor Q3 to be cut off, and controls the first MOS transistor Q1 and the fourth MOS transistor Q4 to conduct. To clarify the current direction output by the first circuit board A, a first terminal CN1 is provided between the first line and the second line for the output of the H-bridge circuit unit 11. The first port CN1-1 is connected to the first line, and the second port CN1-2 is connected to the second line; when the signal output terminal MCU-TX of the first single-chip microcomputer unit 12 outputs a logic 1 and the level signal output by the first single-chip microcomputer unit 12 is a high level, the voltage value output by the first port CN1-1 is VCC1, and the voltage value output by the second port CN1-2 is GND1. At this time, the current direction of the first current source output by the H-bridge circuit unit 11 is from the first port CN1-1 to the second port CN1-2. When the signal output terminal MCU-TX of the first single-chip microcomputer unit 12 outputs a logic 0, the level signal output by the first single-chip microcomputer unit 12 is a low level, the voltage value output by the first port CN1-1 is GND1, and the voltage value output by the second port CN1-2 is VCC1. At this time, the current direction of the first current source output by the H-bridge circuit unit 11 is from the second port CN1-2 to the first port CN1-1.

[0053] In this embodiment, the rectifier circuit unit 22 includes: a first diode D1, a second diode D2, a third diode D3, and a fourth diode D4; one end of the first diode D1 is connected to one end of the fourth diode D4 to form a first connection terminal a of the rectifier circuit unit 22; the other end of the first diode D1 is connected to one end of the second diode D2 to form a second connection terminal b of the rectifier circuit unit 22; the other end of the second diode D2 is connected to the other end of the third diode D3 to form a third connection terminal c of the rectifier circuit unit 22; one end of the third diode D3 is connected to the other end of the fourth diode D4 to form a fourth connection terminal d of the rectifier circuit unit 22. The first connection terminal a and the third connection terminal c are connected to the buck circuit unit 24; the second connection terminal b and the fourth connection terminal d are connected to the H-bridge circuit unit 11.

[0054] During specific implementation, when the first current source outputs from the first circuit board A to the second circuit board B through the power line, the rectifier circuit unit 22 first converts the current with a regularly changing direction in the first current source into a direct current through a rectifier bridge, thereby obtaining the second DC power supply. Among them, the first diode D1, the second diode D2, the third diode D3, and the fourth diode D4 form the rectifier bridge B1 in the rectifier circuit unit. The second DC power supply becomes the third DC power supply after being bucked by the buck circuit unit 24 to serve as the working power supply for the second single-chip microcomputer unit 23 and the load unit 25.

[0055] In this embodiment, the acquisition circuit unit 21 includes: an eleventh resistor R11, a twelfth resistor R12, and a thirteenth resistor R13; one end of the eleventh resistor R11 is connected to the signal input terminal MCU-RX of the second single-chip microcomputer unit 23, and the other end of the eleventh resistor R11 is connected to one end of the twelfth resistor R12; the other end of the twelfth resistor R12 is grounded to GND2; one end of the thirteenth resistor R13 is connected to the second connection terminal b, and the other end of the thirteenth resistor R13 is connected to the other end of the eleventh resistor R11. While the first current source is being rectified by the rectifier circuit unit 22, the acquisition circuit unit 21 also collects the voltage of the first current source. During specific implementation, a second terminal CN2 is provided on the second circuit board B. The third port CN2-1 is connected to the acquisition circuit unit 21, and the third port CN2-1 is also connected to the second connection terminal b; the fourth port CN2-2 is connected to the fourth connection terminal d; the acquisition circuit unit 21 collects the voltage of the third port CN2-1 to obtain the information content transmitted on the bus.

[0056] When the specific current direction of the first current source flows from the first port CN1-1 to the second port CN1-2, the voltage value of the third port CN2-1 is VCC1. The voltage value of the third port CN2-1 is divided by the eleventh resistor R11 and the twelfth resistor R12 into the input range of the second microcontroller unit 23, and the signal input terminal MCU-RX of the second microcontroller unit R23 reads a high-level signal at this time. When the specific current direction of the first current source flows from the second port CN1-2 to the first port CN1-1, the voltage value of the third port CN2-1 is GND1, and the signal input terminal MCU-RX of the second microcontroller unit 23 reads a low-level signal at this time.

[0057] In this embodiment, the buck circuit unit 24 includes: a first capacitor C1 and a voltage regulator chip U1; one end of the first capacitor C1 is connected to the third terminal c, and one end of the first capacitor C1 is also connected to the voltage regulator chip U1; the other end of the first capacitor C1 is grounded. On the second circuit board B, when the first current source is rectified by the rectification circuit unit 22 into the second DC power supply, due to the diode voltage drop, the voltage value at one end of the first capacitor C1 is VCC1 + 0.7V at this time, which is 0.7V higher than the voltage value VCC1 of the first DC power supply. The voltage value at the other end of the first capacitor C1 grounded is GND1 - 0.7V, which is 0.7V lower than the voltage value of the ground GND1 on the first circuit board A. The second DC power supply will be stepped down by the buck circuit unit 24, and the buck circuit unit 24 is composed of the first capacitor C1 and the voltage regulator chip U1, and is used to step down the second DC power supply and output the third DC power supply to supply power to the second microcontroller unit 23 and the load unit 25.

[0058] In one embodiment, the voltage regulator chip U1 includes: a first pin 1, a second pin 2, and a third pin 3; the first pin 1 is connected to one end of the first capacitor C1; the second pin 2 is grounded to GND2; the third pin 3 of the voltage regulator chip U1 outputs a regulated third DC power supply, where the voltage of the third DC power supply is +5V. In specific applications, the voltage regulator chip U1 uses a fixed voltage (5V) three-terminal integrated voltage regulator of model 78L05. The voltage regulator chip U1 is a three-pin chip. The first pin 1 of the voltage regulator chip U1 is the input pin Vin, and the first pin 1 is connected to the positive electrode of the first capacitor C1. The second pin 2 is grounded; the third pin 3 is the output pin Vout, and the voltage value output by the third pin 3 to regulate the third DC power supply is +5V. The second DC power supply is reduced to the operating voltage range of the second single-chip microcomputer unit 23 and the load unit 25 through the action of the first capacitor C1 and the voltage regulator chip U1, so that the second single-chip microcomputer unit 23 and the load unit 25 can work normally when the first circuit board A supplies power to the second circuit board B.

[0059] An embodiment of the present invention also provides a communication method for a board-level communication device based on DC carrier. The communication method for the board-level communication device based on DC carrier is applied to the above-mentioned board-level communication device based on DC carrier, as Figure 4 shown, the method steps include S110 to S130.

[0060] S110. Receive the first current power supply output by the first circuit board A;

[0061] S120. Collect the voltage of the first current power supply to obtain voltage information;

[0062] S130. Read the level signal corresponding to the voltage information.

[0063] In one embodiment, as Figure 5 shown, before step S110, it further includes:

[0064] S1101. Receive the first level signal sent by the signal output end MCU-TX of the first single-chip microcomputer unit 12;

[0065] S1102. Judge whether the first level signal is a high level;

[0066] S1103. If the first level signal is a high level, the H-bridge circuit unit converts the first DC power supply into the first current power supply;

[0067] S1104. Output the first current power supply to the second circuit board B.

[0068] In this embodiment, the communication method of the board-level communication device based on DC carrier is applied to the above-mentioned board-level communication device based on DC carrier. In board-level communication, this method can establish user-level communication content based on the basic cells (0, 1) on the bus. The specific application of this method can select its own coding method for coding according to the actual application requirements of users. Specifically, when the first circuit board A and the second circuit board B perform board-level communication, this method can run communication encoded in NEC format, and use different pulse width values to represent different logical values. For example, a preset pulse width value of 0.56 ms low level + 1.69 ms high level is used to represent logic 1; a preset pulse width value of 0.56 ms low level + 0.56 ms high level is used to represent logic 0. When the first circuit board A needs to execute corresponding logical commands according to the task instructions, on the first circuit board A, the first level signal corresponding to the logical command sent by the signal output end MCU-TX of the first single-chip microcomputer unit 12 is received, and it is judged whether the first level signal is a high level. If the pulse width value is 0.56 ms low level + 1.69 ms high level, which is used to represent logic 1, and the first level signal is a high level, the H-bridge circuit unit 11 will control the opening or closing of relevant components according to the first level signal. Specifically, it controls the first triode Q5, the second triode Q6, the third triode W7, the second MOS tube W2, and the third MOS tube W3 to cut off, and controls the first MOS tube Q1 and the fourth MOS tube Q4 to conduct, so that the first DC power supply becomes the first current power supply and is then output through the power line. Among them, the first current power supply has a current direction corresponding to when the first level signal is a high level signal.

[0069] When the first current power supply outputs to the second circuit board B via the power line, first, the first current power supply will be processed by the rectifier bridge B1 of the rectification circuit unit 22 and converted into the second DC power supply and then transmitted to the buck circuit unit 24. While the first current power supply inputs to the rectification circuit unit 22, the acquisition circuit unit 21 will also acquire the voltage of the first current power supply, and after being divided by the eleventh resistor R11 and the twelfth resistor R12 in the acquisition circuit unit 21, it is output to the signal input end MCU-RX of the second single-chip microcomputer unit 23. Because the first power supply current has a specific direction, if the first level signal is a high level, the level signal read by the second single-chip microcomputer unit 23 is also a high level. If the pulse width value is 0.56 ms low level + 0.56 ms high level to represent logic 0, and the first level signal is a low level, the first triode Q5, the second triode Q6, the third triode Q7, the second MOS tube Q2 and the third MOS tube Q3 are controlled to conduct, and the first MOS tube Q1 and the fourth MOS tube Q4 are controlled to cut off. The specific current direction of the output first current power supply will also be opposite to that when the first level signal is a high level, and the level signal finally read by the second single-chip microcomputer unit 23 is a low level.

[0070] The board-level communication device and communication method based on DC carrier realize signal transmission by changing the current direction of the power supply in board-level communication. The circuit structure is simple and the circuit cost is effectively reduced.

[0071] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A board-level communication device based on DC carrier, characterized in that Comprising: A first circuit board, a second circuit board and a power cord, wherein the first circuit board is connected to the second circuit board through the power cord; Wherein, the first circuit board includes: an H-bridge circuit unit and a first single-chip microcomputer unit; The second circuit board includes: a collection circuit unit, a rectification circuit unit, a second single-chip microcomputer unit, a buck circuit unit and a load unit; One end of the H-bridge circuit unit is connected to the signal output end of the first single-chip microcomputer unit; The other end of the H-bridge circuit unit is connected to one end of the collection circuit unit; the other end of the H-bridge circuit unit is also connected to one end of the rectification circuit unit; The other end of the collection circuit unit is connected to the signal input end of the second single-chip microcomputer unit; The other end of the rectification circuit unit is connected to one end of the buck circuit unit; The other end of the buck circuit unit is connected to the load unit, and the other end of the buck circuit unit is also connected to the power supply end of the second single-chip microcomputer unit; The H-bridge circuit unit is used to convert the first DC power supply of the first circuit board into a first current power supply; The first single-chip microcomputer unit is used to send a level signal; The collection circuit unit is used to collect the signal content of the first current power supply; The rectification circuit unit is used to convert the first current power supply into a second DC power supply; The second single-chip microcomputer unit is used to receive a level signal; The buck circuit unit is used to reduce the voltage of the second DC power supply to obtain a third DC power supply; The load unit is used to start when the third DC power supply is connected; The H-bridge circuit unit includes: a first MOS transistor, a second MOS transistor, a third MOS transistor, a fourth MOS transistor, a first triode, a second triode, a third triode, a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, an eighth resistor, a ninth resistor, a tenth resistor; One end of the first resistor is connected to the drain of the first MOS transistor, and the other end of the first resistor is connected to one end of the second resistor; The other end of the second resistor is connected to the gate of the first MOS transistor; The drain of the first MOS transistor and the drain of the second MOS transistor are connected to the power supply end; The source of the first MOS transistor and the drain of the third MOS transistor are connected to form a first bridge arm; One end of the third resistor is connected to the drain of the second MOS transistor; The other end of the third resistor is connected to the other end of the fourth resistor; One end of the fourth resistor is connected to the gate of the second MOS transistor; The source of the second MOS transistor and the drain of the fourth MOS transistor are connected to form a second bridge arm; One end of the fifth resistor is connected to one end of the second resistor; The other end of the fifth resistor is connected to the gate of the third MOS transistor; The source of the third MOS transistor is grounded; One end of the sixth resistor is connected to the gate of the fourth MOS transistor; The other end of the sixth resistor is connected to the other end of the fourth resistor; The source of the fourth MOS transistor is grounded; The collector of the first triode is connected to one end of the fifth resistor; The base of the first triode is connected to the base of the second triode through the seventh resistor and the eighth resistor; The emitter of the first triode is grounded; The emitter of the second triode is connected to a first constant voltage power supply; The collector of the second triode is grounded through the ninth resistor; The collector of the third triode is connected to the other end of the sixth resistor; The base of the third triode is connected to the collector of the second triode through the tenth resistor; The emitter of the third triode is grounded.

2. The board-level communication device based on DC carrier according to claim 1, wherein The signal output terminal of the first single-chip microcomputer unit is connected between the seventh resistor and the eighth resistor.

3. The board-level communication device based on DC carrier according to claim 1, wherein The rectification circuit unit includes: a first diode, a second diode, a third diode, and a fourth diode; The positive poles of the first diode and the fourth diode are connected to form the first connection terminal of the rectification circuit unit; The negative pole of the first diode and the positive pole of the second diode are connected to form the second connection terminal of the rectification circuit unit; The negative poles of the second diode and the third diode are connected to form the third connection terminal of the rectification circuit unit; The positive pole of the third diode and the negative pole of the fourth diode are connected to form the fourth connection terminal of the rectification circuit unit; The first connection terminal and the third connection terminal are connected to the buck circuit unit; The second connection terminal and the fourth connection terminal are connected to the H-bridge circuit unit.

4. The board-level communication device based on DC carrier according to claim 3, characterized in that, The power supply line includes a first line and a second line; One end of the first line is connected to the first bridge arm, and the other end of the first line is connected to the second connection terminal; One end of the second line is connected to the second bridge arm, and the other end of the second line is connected to the fourth connection terminal.

5. The board-level communication device based on DC carrier according to claim 4, wherein The acquisition circuit unit includes: an eleventh resistor, a twelfth resistor, and a thirteenth resistor; One end of the eleventh resistor is connected to the signal input terminal of the second single-chip microcomputer unit, and the other end of the eleventh resistor is connected to one end of the twelfth resistor; The other end of the twelfth resistor is grounded; One end of the thirteenth resistor is connected to the second connection terminal, and the other end of the thirteenth resistor is connected to the other end of the eleventh resistor.

6. The board-level communication device based on DC carrier according to claim 5, characterized in that The buck circuit unit includes: a first capacitor and a voltage regulator chip; One end of the first capacitor is connected to the third connection terminal, and one end of the first capacitor is also connected to the voltage regulator chip; the other end of the first capacitor is grounded.

7. The board-level communication device based on DC carrier according to claim 6, characterized in that The voltage regulator chip includes: a first pin, a second pin, and a third pin; The first pin is connected to one end of the first capacitor; The second pin is grounded; The third pin outputs a regulated third DC power supply.

8. A communication method of a board-level communication device based on DC carrier as described in any one of claims 1-7, characterized in that, Including the following steps performed by the second circuit board: Receiving a first current power supply output by the first circuit board; Collecting the voltage of the first current power supply to obtain voltage information; Reading a level signal corresponding to the voltage information.

9. The communication method of the board-level communication device based on DC carrier according to claim 8, wherein It also includes the following steps performed by the first circuit board: Receiving a first level signal sent by the signal output terminal of the first single-chip microcomputer unit; Judging whether the first level signal is a high level; If the first level signal is a high level, control the H-bridge circuit unit to convert the first DC power supply into the first current power supply; Output the first current power supply to the second circuit board.

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