Workpiece holding method and workpiece handling method

Abstract

Provided are a workpiece holding method and a workpiece processing method. When a bowl-shaped warped workpiece is held and processed, foreign matter will not be attached due to the pressing of the workpiece, and the workpiece is sucked and held by a holding surface and properly processed. A method for holding a bowl-shaped warped workpiece comprises the following steps: a loading step, placing the workpiece (W) on a holding surface (31) of a holding unit (30), the holding unit (30) comprising: a holding surface (31) for holding the workpiece; a suction hole (320) opening on the holding surface (31); and a suction path (33) for selectively connecting the suction hole (320) to a suction source (339); a liquid supplying step, supplying liquid (L) to the workpiece (W) on the holding surface (31) so that the liquid (L) flows between the holding surface (31) and the workpiece (W); and a suctioning step, after the liquid supplying step is performed, connecting the suction hole (320) to the suction source (339) so that the workpiece (W) and the liquid (L) are sucked together, thereby holding the workpiece (W) using the holding surface (31).

Description

Technical Field

[0001] The present invention relates to a method for holding a bowl-shaped warped workpiece and a method for treating the held workpiece. Background Art

[0002] When the workpiece to be processed is warped in a bowl shape, if only a holding table having a flat holding surface is used for suction, the workpiece cannot be well sucked and held on the holding surface, and it is difficult to perform various processes such as cutting on the workpiece. Therefore, a method has been proposed in which a plate is used to press the workpiece placed on the holding table to flatten it and to suck and hold it (for example, refer to Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2018-117041

[0004] However, in the processing device described in Patent Document 1, when the workpiece is pressed by the plate, there is a possibility that foreign matter may adhere to the pressed surface of the workpiece, so there is a problem that it is difficult to adopt the above method depending on the type of workpiece. Summary of the invention

[0005] Therefore, an object of the present invention is to provide a workpiece holding method that can appropriately suck and hold a workpiece that is warped in a bowl shape using a holding table without causing foreign matter to adhere due to pressing of the workpiece.

[0006] Another object of the present invention is to provide a workpiece processing method that can appropriately hold and process a workpiece that is warped in a bowl shape using a holding table without causing foreign matter to adhere due to pressing of the workpiece.

[0007] According to one embodiment of the present invention, a method for holding a workpiece is provided, wherein the workpiece is bowl-shaped and has warping, wherein the method for holding the workpiece has the following steps: a loading step, wherein the workpiece is loaded on a holding surface of a holding unit, wherein the holding unit has: the holding surface, which holds the workpiece; a suction hole, which opens on the holding surface; and a suction path, which selectively connects the suction hole with a suction member; a liquid supplying step, wherein liquid is supplied to the workpiece on the holding surface so that the liquid flows into between the holding surface and the workpiece; and a suctioning step, wherein after the liquid supplying step is implemented, the suction hole is connected with the suction member so that the workpiece and the liquid are sucked together, thereby being held by the holding surface.

[0008] Preferably, in the placing step, the workpiece held by a conveying mechanism is placed on the holding surface, and in the liquid supplying step, water is supplied as the liquid from the conveying mechanism.

[0009] According to another aspect of the present invention, a method for processing a workpiece is provided, comprising the following steps: a loading step, loading the workpiece on a holding surface of a holding unit, the holding unit comprising: the holding surface for holding the workpiece; a suction hole, which opens on the holding surface; and a suction path, which selectively connects the suction hole with a suction member; a liquid supplying step, supplying liquid to the workpiece on the holding surface so that the liquid flows into between the holding surface and the workpiece; a suction step, after the liquid supplying step is performed, connecting the suction hole with the suction member to suck the workpiece together with the liquid, thereby holding the workpiece by the holding surface; a processing step, after the suction step is performed, processing the workpiece; and a carrying out step, after the processing step is performed, holding the workpiece by a conveying mechanism and carrying it out from the holding surface.

[0010] Preferably, the workpiece is a semiconductor wafer, and in the processing step, the semiconductor wafer is cut in an annular shape along an outer periphery by a cutting tool.

[0011] According to the method for holding a workpiece of the present invention, leakage of suction force does not occur, and the workpiece that is warped in a bowl shape can be held by suction without being pressed.

[0012] In the workpiece holding method of the present invention, in the placing step, the workpiece held by the conveying mechanism is placed on the holding surface, and in the liquid supplying step, water is supplied as liquid from the conveying mechanism, thereby enabling the placing step and the liquid supplying step to be performed smoothly.

[0013] According to the workpiece processing method of the present invention, the following steps are included: a processing step, in which the workpiece is processed after the suction step is implemented; and a moving-out step, in which the workpiece held by the conveying mechanism is moved out from the holding surface after the processing step is implemented, thereby enabling the workpiece to be smoothly moved out from the holding surface after appropriate processing is performed on the workpiece that is warped in a bowl shape.

[0014] In the workpiece processing method of the present invention, the workpiece is a semiconductor wafer. In the processing step, the semiconductor wafer is cut in an annular shape along the outer periphery by using a cutting tool, thereby being able to appropriately cut and remove the chamfered portion of the semiconductor wafer that has been chamfered on the outer periphery. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a top view schematically showing an example of a processing device.

[0016] Figure 2 It is a perspective view showing an example of a holding unit.

[0017] Figure 3It is a cross-sectional view showing an example of a holding unit.

[0018] Figure 4 It is a perspective view showing an example of the first transport mechanism.

[0019] Figure 5 It is a cross-sectional view for explaining a state in which the workpiece held by the first transport mechanism is placed on the holding surface of the holding unit in the placing step.

[0020] Figure 6 It is a cross-sectional view for explaining a state in which the first transport mechanism places the workpiece on the holding surface of the holding unit in the placing step.

[0021] Figure 7 This is a cross-sectional view for explaining a state in which liquid is supplied from the transport mechanism to the workpiece on the holding surface of the holding unit, and the liquid flows into a space between the holding surface and the workpiece.

[0022] Figure 8 This is a cross-sectional view for explaining a state in which the suction hole and the suction member are communicated to suck the workpiece together with the liquid, and the workpiece is held by the holding surface.

[0023] Fig. 9 This is a cross-sectional view for explaining a state in which a workpiece held by a holding surface of a holding unit is subjected to annular cutting processing along the outer peripheral edge using a cutting tool.

[0024] Fig.10 This is a cross-sectional view for explaining a state in which the workpiece subjected to cutting processing and held on the holding surface of the holding unit is held by the second transport mechanism.

[0025] Fig.11 This is a cross-sectional view for explaining a state in which the workpiece subjected to the cutting process is held by the second conveying mechanism and is carried out from the holding surface of the holding unit.

[0026] Description of symbols

[0027] W: workpiece; Wa: front of workpiece; Wb: back of workpiece; Wd: outer periphery of workpiece; W2: mold layer; 1: processing device; 10: base; A1: loading area; 150: first box loading part; 150a: first box; 151: second box loading part; 151a: second box; 13: robot; 130: hand; 131: arm; 132: moving member; A2: processing area; 141: temporary workbench; 440: linear axis; 441: first moving arm; 41: first conveyor Mechanism; 411: base; 412: guide platform; 413: support wall; 414: ball screw; 415: movable block; 416: claw member; 416a: claw tip; 418: liquid supply nozzle; 419: water supply source; 445: first lifting member; 14: door column; 16: indexing feed mechanism; 160: ball screw; 162: motor; 163: first movable plate; 164: second movable plate; 171: first cutting feed mechanism; 171a: first ball screw; 171b: first 1 movable table; 172: second cutting feed mechanism; 172a: second ball screw; 172b: second movable table; 61: first cutting unit; 610: spindle; 611: housing; 613: cutting tool; 62: second cutting unit; 65: alignment unit; 30: holding unit; 303: through passage; 31: holding surface; 310: central area; 311: support surface; 312: annular groove; 310c: entry port; 32: porous component; 320: suction hole; 33: suction passage; 33 9: suction member; 338: solenoid valve; 36: lifting mechanism; 360: lifting pin; 37: holding unit rotating member; 38a: bellows cover; 38b: supporting cover; 42: second conveying mechanism; 446: second lifting member; 452: second movable arm; 453: rotating shaft; A3: cleaning area; 43: third conveying mechanism; 447: third lifting member; 463: third movable arm; 461: direct-acting shaft; 50: back cleaning mechanism; 51: front cleaning mechanism; 511: rotating workbench. DETAILED DESCRIPTION

[0028] Figure 1 The processing device 1 shown is a fully automatic type cutting device that performs cutting processing on the workpiece W held on the holding unit 30 by the first cutting unit 61 or the second cutting unit 62, and is configured to perform a series of operations consisting of carrying the disk-shaped workpiece W into or out of the holding unit 30, cutting processing on the workpiece W, and cleaning the workpiece W in a fully automatic manner. In addition, the processing device 1 is not limited to a cutting device, and may also be a laser processing device that performs laser processing on the workpiece W by irradiating a laser beam or a grinding device that grinds the workpiece.

[0029] The processing device 1 has a rectangular base 10, the front side (-Y direction side) of the base 10 is set as the carrying-in area A1, the inner side (+Y direction side) of the base 10 is set as the processing area A2, and a cleaning area A3 is set adjacent to the carrying-in area A1 and the processing area A2.

[0030] A first box loading portion 150 and a second box loading portion 151 are provided on the front side surface of the base 10 so as to protrude forward from the loading area A1. A first box 150a for storing the workpieces W before processing is loaded on the first box loading portion 150, and a second box 151a for storing the workpieces W after processing is loaded on the second box loading portion 151. The first box loading portion 150 functions as a loading port for loading from other devices to the processing device 1, and the second box loading portion 151 functions as a loading port for unloading from the processing device 1 to other devices (for example, a grinding device).

[0031] Furthermore, a robot 13 is disposed near the first box 150a and the second box 151a, and the robot 13 takes out the workpiece W from the first box 150a before processing and stores the workpiece W into the second box 151a after processing. The robot 13 has a hand 130 that holds the workpiece W, a bendable arm 131 that is connected to the hand 130 and has multiple joints, and a moving member 132 that makes the hand 130 and the arm 131 move linearly in the X-axis direction and has a ball screw mechanism, etc.

[0032] A temporary table 141 for temporarily placing the workpiece W before processing is provided within the movable range of the robot 13 in the processing area A2, and a positioning member (not shown) is arranged on the temporary table 141. The positioning member (not shown) positions (centers) the workpiece W taken out from the first box 150a and placed on the temporary table 141 at a predetermined position, for example, by a positioning pin with a reduced diameter. As a result, the center position of the workpiece W can be grasped.

[0033] A holding unit 30 is provided on the inner side of the temporary workbench 141. The holding unit 30 reciprocates along the X-axis direction between the loading position and the cutting position of the workpiece W. An opening extending along the moving track of the holding unit 30 in the X-axis direction is formed on the base 10. A telescopic bellows 38a is provided in the opening. The bellows 38a and the support for the holding unit 30 are Figure 2 The support cover 38b shown is connected, and a ball screw type moving mechanism (not shown) for reciprocating the holding unit 30 in the X-axis direction is provided below the support cover 38b and the bellows cover 38a.

[0034] For example, Figure 2 and Figure 3 The holding unit 30 shown has at least: a holding surface 31, which holds the workpiece W; a suction hole 320 (in Figure 2 Not shown), which opens at the holding surface 31; and a suction passage 33, which selectively connects the suction hole 320 with Figure 3 The suction member 339 is shown in communication.

[0035] like Figure 2 As shown, the holding unit 30 is supported by the support cover 38 b via the holding unit rotating member 37 , and is rotatable around the axis in the Z-axis direction by the holding unit rotating member 37 .

[0036] The holding unit 30 is formed in a circular shape when viewed from above, for example, the central area 310 of the holding surface 31 is formed one level lower than the outer peripheral side. Therefore, in the holding surface 31 of the holding unit 30, only the annular support surface 311 on the outer peripheral side of the central area 310 is used to support the workpiece W, and the central area 310 is away from the back side Wb of the workpiece W. In addition, the holding unit 30 can also be configured so that the holding surface is a flat and coplanar holding surface, and the workpiece W is sucked and held by the entire holding surface.

[0037] An annular groove 312 is formed on the support surface 311 of the holding unit 30. A porous component 32 in the shape of an annular plate having fine suction holes 320 is embedded in the annular groove 312, and the upper surface of the porous component 32 is coplanar with the support surface 311. Considering the outer diameter of the workpiece W, the outer diameter of the porous component 32 is set to be slightly smaller than the outer diameter of the workpiece W, for example. In the processing device 1, for example, only the outer peripheral edge Wd portion of the workpiece W is cut into an annular shape, so the outer peripheral portion of the workpiece W is sucked and held by the porous component 32 having the suction holes 320 opened on the holding surface 31 of the holding unit 30, and appropriate cutting processing can be performed. In addition, the holding unit 30 may not have the porous component 32, but suction holes are formed at equal intervals in the circumferential direction on the support surface 311, or an annular suction groove is formed.

[0038] A plurality of through passages 303, for example, penetrating the holding unit 30 in the thickness direction are formed at the bottom of the annular groove 312, wherein the annular groove 312 is formed on the support surface 311 on the outer peripheral side of the holding surface 31 constituting the holding unit 30. The through passages 303 are arranged at equal angles centered on the center of the holding unit 30 and at equal intervals in the circumferential direction.

[0039] like Figure 3As shown, one end of a suction passage 33 composed of a metal pipe or a flexible resin tube is connected to the lower end side of the through passage 303 via a rotary joint (not shown). A suction member 339 such as a vacuum generator or an ejection mechanism is connected to the other end side of the suction passage 33. The suction passage 33 is provided with, for example, an electromagnetic valve 338 that selectively connects the suction hole 320 of the porous member 32 with the suction member 339. When the suction member 339 is operated in a state where the electromagnetic valve 338 is opened, the suction force generated by the suction member 339 is transmitted to the support surface 311 of the holding surface 31 of the holding unit 30 through the suction passage 33, the through passage 303, and the suction hole 320.

[0040] For example, a gas-liquid separator (not shown) is provided on the suction passage 33. When liquid is sucked into the suction member 339, although the suction force generated by the suction member 339 decreases, the reduction of the suction force of the suction member 339 can be prevented by separating the liquid from the air passing through the suction passage 33 using the gas-liquid separator.

[0041] like Figure 2 and Figure 3 As shown, a plurality of (three in this embodiment) inlet openings 310c are formed on the outer peripheral side of the central region 310 of the holding unit 30, penetrating the holding unit 30 in the thickness direction (Z-axis direction). The inlet openings 310c are arranged at equal angles centered on the center of the holding unit 30 and at equal intervals in the circumferential direction.

[0042] For example, a lifting mechanism 36 is provided inside the holding unit rotating member 37, and the lifting mechanism 36 lifts up the workpiece W held by the support surface 311 in the holding surface 31, so that the workpiece W is separated from the holding unit 30. The lifting mechanism 36 lifts up the back surface Wb of the workpiece W to a position above the support surface 311, so that the workpiece W can be separated from the holding unit 30.

[0043] The lift mechanism 36 is, for example, an electric cylinder or an air cylinder, and is configured to move the lift pin 360 accommodated in the inlet 310 c from the central area 310 of the holding unit 30 to a height position exceeding the height position of the support surface 311 .

[0044] In addition, the processing device 1 may also be configured not to include the lift mechanism 36 .

[0045] For example, the processing device 1 has a first conveying mechanism 41, which is Figure 1The workpiece W centered on the temporary workbench 141 shown is transported to the holding unit 30; the second transport mechanism 42 is arranged on the base 10 near the holding unit 30 positioned at the workpiece unloading position, and transports the workpiece W processed on the holding unit 30 from the holding unit 30 to the back cleaning mechanism 50 in the cleaning area A3; and the third transport mechanism 43 can move back and forth along the Y-axis direction in the cleaning area A3, and transports the workpiece W from the back cleaning mechanism 50 to the front cleaning mechanism 51 in the cleaning area A3.

[0046] For example, the first conveying mechanism 41 is fixed to the lower surface of the first movable arm 441 via the first lifting member 445. The first movable arm 441 can move freely in the processing area A2 in the Y-axis direction on the side surface of the linear axis 440 extending in the Y-axis direction.

[0047] Figure 4 1 is a perspective view showing an example of the first conveying mechanism 41 of the present embodiment. Figure 4 In addition, Figure 1 The structures of the second conveying mechanism 42 and the third conveying mechanism 43 shown are the same as the structure of the first conveying mechanism 41, and therefore the description thereof will be omitted.

[0048] The first conveying mechanism 41 is an edge-clamping conveying mechanism for holding the outer peripheral edge Wd of the workpiece W, and includes: a base 411, which is rectangular in plan view; and a long guide platform 412, which horizontally extends from the four sides of the base 411 to the surrounding areas. For example, the upper surface of the base 411 is connected to a first lifting member 445 composed of an electric cylinder or an air cylinder, and the first lifting member 445 is connected to the first moving arm 441. In this way, in the present embodiment, the first conveying mechanism 41 can move in the vertical direction (Z-axis direction) and the Y-axis direction through the first moving arm 441 and the first lifting member 445.

[0049] The support wall 413 is suspended at the front end side of each guide platform 412 in a manner opposite to each side surface of the base 411. Both ends of the ball screw 414 extending in the horizontal direction are supported by the side surface of the base 411 and the support wall 413. For example, a movable block 415 having a substantially rectangular shape is screwed with each ball screw 414 via a nut provided inside the movable block 415. In addition, each ball screw 414 is connected to a motor (not shown) disposed inside the base 411.

[0050] A claw member 416 is integrally provided on the lower surface of each movable block 415 so as to contact the outer peripheral edge Wd of the workpiece W. The claw member 416 is formed in a substantially L-shaped cross-sectional view with the claw tip 416a facing the base 411. In this way, the claw member 416 is annularly arranged on the first conveying mechanism 41 so as to hold the outer peripheral edge Wd of the back side Wb of the workpiece W.

[0051] The ball screw 414 is driven forward or reversely by a motor (not shown) so that the movable block 415 is guided by the lower surface of the guide table 412 and moves linearly in the horizontal direction while controlling the amount of movement. At this time, each claw member 416 provided on each movable block 415 moves between a standby position separated from the outer peripheral edge Wd of the workpiece W and an action position approaching the outer peripheral edge Wd of the workpiece W in the radial direction to hold the workpiece W. Figure 5 As shown, by the approach of the movable blocks 415 , the back surface Wb of the workpiece W is placed on the claw tip 416 a of the claw member 416 , so that the outer peripheral edge Wd of the workpiece W is held by the first conveying mechanism 41 .

[0052] For example, non-contact sensors (not shown) may be provided on each of the plurality of claw members 416, and the detection surface of the non-contact sensors may face the approach direction (inward) of the claw members 416. The non-contact sensors may be, for example, electrostatic capacitance sensors, which form a capacitor between the claw member 416 and the outer peripheral side of the workpiece W and detect the distance between the claw member 416 and the outer peripheral side of the workpiece W according to the change in the electrostatic capacitance of the capacitor, or laser sensors, which detect the distance between the claw member 416 and the outer peripheral side of the workpiece W according to the time of receiving the reflected light of the measuring light reflected by the outer peripheral side of the workpiece W after emitting the measuring light. Moreover, the non-contact sensors detect the approach to the outer peripheral side of the workpiece W, so that the claw members 416 do not contact the outer peripheral side of the workpiece W, causing the workpiece W to be bent toward the center and damaged. Therefore, the claw tip 416a of the claw member 416 does not abut against the outer peripheral side of the workpiece W, but can support the outer peripheral edge Wd of the back side Wb.

[0053] In addition, the structure of the first conveying mechanism 41 is not limited to the present embodiment. For example, the following structure may be adopted: three guide platforms 412 extend from the base 411 at 120 degrees in the circumferential direction, and the outer peripheral edge Wd of the back side Wb of the workpiece W is held by a total of three claw members 416 disposed on each guide platform 412.

[0054] Liquid supply nozzles 418 for supplying liquid to the workpiece W in a dripping manner are arranged at the four corners of, for example, the base 411 of the first conveying mechanism 41. The liquid supply nozzle 418, which is located above the claw member 416 for holding the workpiece W, is formed in a block shape in the illustrated example, but is not limited to this shape. The unillustrated water supply port of the liquid supply nozzle 418 opens toward the -Z direction on the lower surface of the liquid supply nozzle 418. The liquid supply nozzle 418 is connected to a water supply source 419 storing pure water, for example, via a flexible resin tube. In addition, the arrangement position of the liquid supply nozzle 418 is not limited to the present embodiment, and the number of the liquid supply nozzles 418 may be less than 3 or more than 5.

[0055] The first conveying mechanism 41 and Figure 1 The second conveying mechanism 42 and the third conveying mechanism 43 shown have the same structure, but the following structure may be adopted: the first conveying mechanism 41 does not have the liquid supply nozzle 418, and the second conveying mechanism 42 and the third conveying mechanism 43 have the liquid supply nozzle 418, so that water can be supplied downward.

[0056] like Figure 1 As shown, in the processing area A2, the gate column 14 is erected in a manner that straddles the moving path of the holding unit 30 in the X-axis direction. An indexing feed mechanism 16 is provided on the side surface of the gate column 14 on the +X direction side, for example, and the indexing feed mechanism 16 reciprocates the first cutting unit 61 or the second cutting unit 62 in the Y-axis direction perpendicular to the X-axis direction and the Z-axis direction.

[0057] The indexing feed mechanism 16 comprises: a ball screw 160 having an axis in the Y-axis direction; a pair of guide rails not shown in the figure, which are arranged parallel to the ball screw 160; a motor 162, which is connected to one end of the ball screw 160; a first movable plate 163, which is connected to the first cutting unit 61, the internal nut of which is screwed with the ball screw 160, and the side of which is in sliding contact with the guide rail not shown in the figure; and a second movable plate 164, which is connected to the second cutting unit 62, the internal nut of which is screwed with the ball screw 160, and the side of which is in sliding contact with the guide rail not shown in the figure. Moreover, when the motor (not shown) rotates the ball screw 160, the first movable plate 163 (the second movable plate 164) is guided by the guide rail and moves in the Y-axis direction, thereby causing the first cutting unit 61 (the second cutting unit 62) connected to the first movable plate 163 (the second movable plate 164) via the first cutting and feeding mechanism 171 (the second cutting and feeding mechanism 172) to move in the Y-axis direction (indexing feeding).

[0058] make Figure 1The first cutting and feeding mechanism 171 (second cutting and feeding mechanism 172) for reciprocating along the Z-axis direction of the first cutting unit 61 (second cutting unit 62) shown is, for example, a ball screw mechanism, which is configured to reciprocate along the Z-axis direction the first movable table 171b (second movable table 172b) to which the first cutting unit 61 (second cutting unit 62) is fixed by the first ball screw 171a (second ball screw 172a) rotating by a motor not shown.

[0059] The first cutting unit 61 includes: a spindle 610 whose axial direction is the Y-axis direction; a housing 611 fixed to the first movable table 171b and rotatably supports the spindle 610; a motor (not shown) that rotates the spindle 610; and a cutting tool 613 that is mounted on the front end of the spindle 610 and rotates as the motor drives the spindle 610. In addition, the first cutting unit 61 includes a nozzle (not shown) that sprays cutting water to the contact portion between the cutting tool 613 and the workpiece W. The second cutting unit 62 adopts the same structure as the first cutting unit 61, and is in a state where the cutting tool 613 of the second cutting unit 62 is opposed to the cutting tool 613 of the first cutting unit 61 in the Y-axis direction.

[0060] The processing device 1 includes an alignment unit 65, which can recognize, for example, the coordinate position of the outer peripheral edge Wd of the workpiece W and the coordinate position of the center of the workpiece W. The alignment unit 65 is mounted on, for example, the side surface of the housing 611 of the first cutting unit 61, and includes: a light irradiation member (not shown); and a camera, which is composed of an optical system for capturing reflected light from the workpiece W and an imaging element for outputting an image of the subject formed by the optical system.

[0061] Will be in Figure 1 The second conveying mechanism 42 for conveying the workpiece W processed on the holding unit 30 shown in the figure from the holding unit 30 to the back cleaning mechanism 50 in the cleaning area A3 adopts the same method as described above. Figure 4 The second conveying mechanism 42 has the same structure as the first conveying mechanism 41 shown in the figure. A second lifting member 446 composed of an electric cylinder or an air cylinder is connected to the upper surface of the base 411 of the second conveying mechanism 42, and the second conveying mechanism 42 can be lifted and lowered in the Z-axis direction. A second moving arm 452 extending in the horizontal direction is connected to the second lifting member 446, and the second moving arm 452 can be rotated and moved on the base 10 through a rotating shaft 453 having an axis in the Z-axis direction.

[0062] The cleaning area A3 is provided with a back cleaning mechanism 50 and a front cleaning mechanism 51. The back cleaning mechanism 50 cleans the back side Wb of the workpiece W, and the front cleaning mechanism 51 cleans the front side Wa of the workpiece W. Figure 2In the back cleaning mechanism 50, the back surface Wb of the workpiece W is cleaned by a friction body such as a sponge while spraying cleaning water from below.

[0063] For example, the third conveying mechanism 43 adopts the same method as described above. Figure 4 The third conveying mechanism 43 has the same structure as the first conveying mechanism 41 shown in FIG. A third lifting member 447 composed of an electric cylinder or an air cylinder is connected to the upper surface of the base 411 of the third conveying mechanism 43, and the third conveying mechanism 43 can be lifted and lowered in the Z-axis direction. A third moving arm 463 is connected to the third lifting member 447, and the third moving arm 463 can slide freely in the Y-axis direction on the side of the linear axis 461 extending in the Y-axis direction in the cleaning area A3.

[0064] Hereinafter, each step of the holding method and each step of the processing method will be described when the workpiece holding method and the processing method of processing the workpiece held by the holding method of the present invention are implemented using the processing apparatus 1 described above. Figure 2 and Figure 3 The workpiece W shown is, for example, a semiconductor wafer manufactured by a COW (Chip On Wafer) process. That is, the workpiece W is a circular semiconductor wafer made of a silicon base material, etc., and has a front surface Wa on which devices, electrode pads, bumps, etc., not shown, are arranged in a rectangular area divided by a predetermined dividing line. The front surface Wa is molded by a predetermined resin and a mold layer W2 of the same thickness is stacked. That is, a plurality of devices, electrode pads, bumps, etc. are sealed in the mold layer W2. In addition, in addition to silicon, the workpiece W may also use gallium arsenide, sapphire, gallium nitride, or silicon carbide as a base material.

[0065] Figure 2 and Figure 3 The exposed surface (lower surface) of the workpiece W shown in the figure becomes the back surface Wb of the workpiece W. Due to the heat effect when the mold layer W2 is formed (such as the shrinkage of the mold layer W2), the entire workpiece W is bent into a concave shape, that is, it has a bowl-shaped warp. In addition, the bowl-shaped warp refers to the following warp: when the workpiece W is placed on the workpiece with the back surface Wb facing downward, Figure 3 When the holding surface 31 of the holding unit 30 is shown, the workpiece W is on the holding surface 31 like a bowl, that is, the back side Wb of the workpiece W gradually becomes lower from the area on the outer peripheral side toward the central area. In this embodiment, the outer peripheral edge Wd of the workpiece W is chamfered to form a chamfered portion with a roughly arc-shaped cross section.

[0066] For example, a dicing tape (not shown) is attached to the back surface Wb of the workpiece.

[0067] The workpiece W is not limited to a semiconductor chip with a mold layer W2 stacked on the front side Wa as described above, but may also be a stacked chip in which a plurality of chips are stacked and bonded to each other using an adhesive layer composed of resin or the like, or a chip with a bowl-shaped warp such as a packaging substrate.

[0068] (1) Loading step of the holding method

[0069] first, Figure 1 The robot 13 shown in the figure pulls out one workpiece W stored in a shelf-like manner from the first box 150a, and moves the workpiece W to the temporary storage table 141. Next, the workpiece W is centered by a positioning means (not shown).

[0070] Next, the first conveying mechanism 41 is positioned above the temporary table 141 by moving the first moving arm 441 in the -Y direction, so that the center position of the first conveying mechanism 41 is aligned with the center position of the centered workpiece W. At this time, the claw members 416 located around the first conveying mechanism 41 are respectively located in the standby position, and the claw tips 416a of each claw member 416 are separated from the outer peripheral edge Wd of the workpiece W to the radial outside. Next, the first conveying mechanism 41 is lowered by the first lifting member 445 to approach the temporary table 141, and the claw tips 416a of each claw member 416 are positioned at a height that can enter the back side Wb side of the workpiece W.

[0071] Figure 4 The ball screw 414 shown in FIG. 1 is rotated to move each claw member 416, so that each claw member 416 approaches the outer peripheral side of the workpiece W. Moreover, the claw tip 416a of the claw member 416 enters the lower side of the outer peripheral edge Wd of the back side Wb of the workpiece W, as shown in FIG. Figure 5 As shown, the outer peripheral edge Wd of the back surface Wb of the workpiece W is supported from the bottom by four claw members 416 .

[0072] After the outer edge Wd of the back side Wb of the workpiece W abuts against the claw tip 416a of each claw member 416 so that the outer edge Wd of the workpiece W is supported by the first conveying mechanism 41, the first conveying mechanism 41 is raised by the first lifting member 445, thereby lifting the workpiece W from the temporary storage workbench 141 and conveying it toward the holding unit 30.

[0073] The first conveying mechanism 41 is positioned above the holding unit 30 by moving the first moving arm 441 in the +Y direction so that the center of the workpiece W held by the first conveying mechanism 41 is substantially consistent with the center position of the holding unit 30. Figure 5 As shown, the lift pin 360 of the lift mechanism 36 is lifted up, and the front end thereof is located above the support surface 311 of the holding unit 30 .

[0074] like Figure 5As shown, the first conveying mechanism 41 is lowered in the -Z direction by the first lifting member 445, and after the back surface Wb of the workpiece W abuts against the front end of the lift pin 360, the lowering of the first conveying mechanism 41 is stopped. Figure 6 The ball screw 414 shown in FIG. 1 rotates to move each claw member 416, and each claw member 416 is separated from the outer peripheral edge Wd of the back side Wb of the workpiece W. As a result, the workpiece W is lifted by the three lifting pins 360 (at Figure 6 Only two are shown in the figure) supports.

[0075] Next, the lift pin 360 descends in the entrance 310c until its front end reaches a height position lower than the height position of the support surface 311 in the holding surface 31 of the holding unit 30. As the lift pin 360 descends, the workpiece W also descends, so that the area on the outer peripheral side of the back side Wb of the workpiece W is supported by the annular support surface 311. At this time, since the central area 310 of the holding unit 30 is formed one level lower than the support surface 311 on the outer peripheral side, only the annular support surface 311 on the outer peripheral side of the holding surface 31 of the holding unit 30 is in contact with the workpiece W, so that dust can be suppressed from adhering to the back side Wb of the workpiece W. Since the workpiece W has a bowl-shaped warp, as shown in FIG. Figure 7 As shown, a gap is formed between the outer peripheral area of ​​the back surface Wb of the workpiece W and the support surface 311. In this way, the workpiece W is placed on the holding surface 31 of the holding unit 30, and the placing step is completed.

[0076] (2) Liquid supply step of the maintenance method

[0077] Next, liquid L (pure water) is supplied to the workpiece W on the holding surface 31 of the holding unit 30, and the liquid L is caused to flow between the holding surface 31 and the back surface Wb of the workpiece W ( Figure 7 Specifically, Figure 7 As shown, a proper amount of liquid L (pure water) is dripped from the liquid supply nozzle 418 of the first conveying mechanism 41 located above the workpiece W toward, for example, the central area of ​​the mold layer W2 of the workpiece W. In addition, when the first conveying mechanism 41 does not have the liquid supply nozzle 418, the liquid L (pure water) may be dripped from the liquid supply nozzle 418 of the first conveying mechanism 41 located above the workpiece W. Figure 1 The second transport mechanism 42 shown is positioned above the workpiece W held by the holding unit 30, and the liquid supply nozzle 418 of the second transport mechanism 42 supplies the liquid L to the workpiece W. In addition, for example, the liquid supply nozzle may be disposed adjacent to the outer periphery of the holding unit 30, and the liquid L ejected from the upper lateral side of the workpiece W by the liquid supply nozzle in a parabolic manner may be supplied to the mold layer W2.

[0078] The liquid L on the mold layer W2 accumulates on the mold layer W2 and expands radially outward, crossing the outer peripheral edge of the mold layer W2, as shown in FIG. Figure 8As shown, the liquid L enters the gap between the outer peripheral area of ​​the back surface Wb of the workpiece W and the support surface 311, thereby filling the gap with the liquid L. From this state, when the liquid L further accumulates a predetermined amount on the mold layer W2 by surface tension and the gap is continuously filled with the liquid L, the process proceeds to the following suction step.

[0079] When the workpiece W is held by the holding unit 30, for example, the following situation can be considered: before the workpiece W is placed on the holding surface 31, liquid L is supplied to the holding surface 31, the workpiece W is placed on the liquid L, and the gap between the outer peripheral area of ​​the back surface Wb of the workpiece W and the supporting surface 311 is filled with liquid L, so that suction leakage does not occur from the gap. However, before the workpiece W placed on the holding surface 31 is held by suction, the position of the workpiece W floating on the holding surface 31 may be shifted due to the liquid L. However, in the workpiece holding method of the present invention, in the liquid supply step, since liquid L is supplied from the workpiece W while the workpiece W is placed on the holding surface 31 to fill the gap with liquid L, positional shift of the workpiece W on the holding surface 31 can be prevented.

[0080] (3) Attraction step of the retention method

[0081] After the liquid supplying step is performed, the suction hole 320 of the porous component 32 is connected to the suction member 339, and the workpiece W is sucked together with the liquid L and held by the support surface 311 of the holding surface 31 of the holding unit 30. Preferably, in the suctioning step, the liquid L is continuously supplied to the workpiece W from the liquid supply nozzle 418 of the first transport mechanism 41 before the workpiece W is held by suction.

[0082] In the attraction step, Figure 8 As shown, the electromagnetic valve 338 is opened, and the suction hole 320 of the porous component 32 is connected to the suction member 339. Next, by operating the suction member 339, the suction force generated by the suction member 339 is transmitted to the support surface 311 through the suction path 33, the through-path 303 of the holding unit 30, and the suction hole 320 of the porous component 32. As a result, the liquid L is sucked into the suction path 33 from the suction hole 320, and the workpiece W is sucked and held by the support surface 311 in a manner that overcomes the bowl-shaped warping along with the sucked liquid L, so that the workpiece W is flat on the holding surface 31. During suction, the airtightness is improved by the liquid L filling the gap between the outer peripheral area of ​​the back side Wb of the workpiece W and the support surface 311, and the gap leaking the suction force is sealed, so that the workpiece W is reliably sucked and held by the holding surface 31. For example, after the workpiece W is sucked and held by the holding surface 31, the supply of the liquid L to the workpiece W from the first conveying mechanism 41 is stopped.

[0083] (4) Processing steps of the treatment method

[0084] Next, Figure 1 The holding unit 30 shown in the figure for sucking and holding the workpiece W is moved in the +X direction and positioned, for example, below the first cutting unit 61. In the processing steps of this embodiment, by using Fig. 9 For example, the cutting tool 613 of the first cutting unit 61 shown cuts the mold layer W2 and the workpiece W from the back surface Wb of the workpiece W, and removes the mold layer W2 and the workpiece W in, for example, a ring shape.

[0085] First, through Figure 1 The alignment unit 65 shown in the figure is used to perform edge alignment of the workpiece W. That is, the holding unit 30 is rotated so that the outer periphery Wd of the workpiece W held by the holding unit 30 is photographed at multiple locations by the camera of the alignment unit 65. Then, the coordinates of, for example, three separate points of the outer periphery Wd are detected from the photographed images, and the accurate center coordinates of the workpiece W on the holding unit 30 are obtained through geometric calculation processing based on the coordinates of the three points.

[0086] Then, based on the information of the center coordinates of the workpiece W and the pre-identified size information of the workpiece W, the holding unit 30 is moved along the X-axis direction, and the first cutting unit 61 is indexed and fed along the Y-axis direction, as shown in FIG. Fig. 9 As shown, the two are positioned so that a predetermined position inside a predetermined distance from the outer peripheral edge Wd of the workpiece W is located directly below the cutting tool 613. Through this positioning, for example, about 2 / 3 of the lower end surface of the cutting tool 613 in the thickness direction is in contact with the outer peripheral area of ​​the workpiece W including the outer peripheral edge Wd of the workpiece W.

[0087] Next, the main shaft 610 is rotated at high speed in the clockwise direction when viewed from the -Y direction side by a motor (not shown), so that the cutting tool 613 fixed to the main shaft 610 is rotated at high speed in the same direction. Figure 1 The first cutting and feeding mechanism 171 shown lowers the first cutting unit 61 in the -Z direction, and causes the cutting tool 613 to cut into the workpiece W from the mold layer W2 to a predetermined depth. The cutting depth of the cutting tool 613 is determined, for example, based on the grinding amount of the workpiece W in the grinding process performed after the edge trimming process of the workpiece W. After the cutting tool 613 is cut and fed to a predetermined height position, the workpiece W is cut in an annular shape along the outer peripheral edge Wd by rotating the holding unit 30 360 degrees in the counterclockwise direction when viewed from the +Z direction side while the cutting tool 613 is continuously rotated at a high speed. Cutting water is supplied from a nozzle (not shown) of the first cutting unit 61 to the contact portion between the workpiece W and the cutting tool 613, thereby cleaning and cooling the contact portion.

[0088] In addition, the processing steps are not limited to the removal of the chamfered portion by edge trimming the outer peripheral edge Wd of the workpiece W by the cutting tool 613 as in the present embodiment. For example, the workpiece W may also be half-cut or fully-cut along a predetermined dividing line not shown in the figure.

[0089] (5) Processing method and removal steps

[0090] After the processing steps are performed as described above, the Figure 1 The second conveying mechanism 42 shown in FIG. 4 carries out the held workpiece W from the holding surface 31 of the holding unit 30. In the carrying out step of the present embodiment, as shown in FIG. Fig.10 As shown, the liquid L is supplied to the mold layer W2 of the workpiece W from the liquid supply nozzle 418 of the second transport mechanism 42 .

[0091] Specifically, in the processing step, the workpiece W is sucked and held. Figure 1 The holding unit 30 shown in FIG. 1 is moved in the −X direction and positioned within the movable range of the second conveying mechanism 42. Fig.10 As shown, first, the electromagnetic valve 338 is closed, thereby cutting off the transmission of the suction force generated by the suction member 339 to the support surface 311. Therefore, the suction and holding of the workpiece W by the holding unit 30 is released. Thereafter, the lifting pin 360 of the lifting mechanism 36 rises, and the upper end of the lifting pin 360 protrudes from the central area 310 of the holding unit 30 to a height position higher than the height position of the support surface 311. The workpiece W attracted and held by the support surface 311 in the holding surface 31 is lifted by the three lifting pins 360 protruding from the central area 310, and the vacuum adsorption force remaining between the workpiece W and the support surface 311 is removed, and the workpiece W moves upward from the support surface 311. As a result, a gap is formed between the holding unit 30 and the workpiece W, into which the claw tip 416a of the claw member 416 of the second conveying mechanism 42 enters.

[0092] Next, if Fig.10 As shown in the figure, when the workpiece W leaves the support surface 311 of the holding unit 30, the second conveying mechanism 42 is rotated and moved in the horizontal direction by the second movable arm 452 and positioned above the holding unit 30 so that the center position of the second conveying mechanism 42 coincides with the center position of the workpiece W. At this time, each claw member 416 located around the second conveying mechanism 42 is located in the standby position, and the claw tip 416a of each claw member 416 is separated from the outer peripheral edge Wd of the workpiece W to the radial outside. In addition, the second conveying mechanism 42 descends and approaches the holding unit 30, and the claw tip 416a of each claw member 416 is positioned at a height that can enter the back side Wb of the workpiece W.

[0093] Liquid L (pure water) is appropriately dripped from the liquid supply nozzle 418 of the second conveying mechanism 42 located above the workpiece W toward, for example, the central area of ​​the mold layer W2 of the workpiece W. This is to prevent the workpiece W from being transported to the Figure 1 During the period before the back cleaning mechanism 50 shown, the mold layer W2 of the workpiece W is dried and the cutting chips generated in the processing steps adhere to it. Alternatively, the workpiece W may be transported by the second transport mechanism 42 without supplying the liquid L.

[0094] Fig.10 The ball screw 414 shown in FIG. 1 is rotated to make each claw member 416 approach the outer peripheral side of the workpiece W. Then, the claw tip 416a of the claw member 416 enters the lower side of the outer peripheral edge Wd of the back side Wb of the workpiece W, as shown in FIG. Fig.11 As shown, the outer peripheral edge Wd of the back surface Wb of the workpiece W is supported from the bottom by four claw members 416 .

[0095] After the outer peripheral edge Wd of the back side Wb of the workpiece W abuts against the claw tip 416a of each claw member 416 so that the outer peripheral edge Wd of the workpiece W is supported by the second conveying mechanism 42, the second conveying mechanism 42 is raised by the second lifting member 446, thereby lifting the workpiece W from the holding surface 31 of the holding unit 30 and moving it toward the second conveying mechanism 42. Figure 1 The back cleaning mechanism 50 shown is transported.

[0096] In the back cleaning mechanism 50, the back side Wb of the workpiece W is cleaned by a friction body such as a rotating sponge while spraying cleaning water from below. The workpiece W after the back side Wb is cleaned is picked up from the back cleaning mechanism 50 by the third conveying mechanism 43 and conveyed to the front cleaning mechanism 51 by the third moving arm 463. The third conveying mechanism 43 holds the workpiece W in the same manner as the second conveying mechanism 42 holds the workpiece W. For example, the third conveying mechanism 43 supplies liquid L (pure water) for preventing the adhesion of cutting chips caused by drying to the mold layer W2 of the workpiece W, and the workpiece W is placed on the rotary table 511 of the front cleaning mechanism 51 by the third conveying mechanism 43. In the front cleaning mechanism 51, the rotary table 511 holding the workpiece W is lowered into the cleaning chamber in the base 10, and after the mold layer W2 stacked on the front side Wa of the workpiece W is cleaned by spraying cleaning water, dry air is blown to dry the workpiece W. The workpiece W after the mold layer W2 is cleaned is picked up from the rotary table 511 by the robot 13 and stored in the second box 151 a in a shelf shape.

[0097] The holding method of the present invention for holding a workpiece W having a bowl-shaped warp places the workpiece W on a holding surface 31 of a holding unit 30, the holding unit 30 having: a holding surface 31 for holding the workpiece W; a suction hole 320 opening on the holding surface 31; and a suction path 33 for selectively connecting the suction hole 320 with a suction member 339. Then, a liquid L is supplied to the workpiece W placed on the holding surface 31, and the liquid L flows into between the holding surface 31 and the workpiece W, and the gap between the holding surface 31 and the workpiece W is filled with the liquid L. Thereafter, the suction hole 320 is connected with the suction member 339, and the workpiece W is held by the holding surface 31 while the liquid L is interposed between the workpiece W and the holding surface 31 by sucking the workpiece W together with the liquid L, so that the suction force does not leak, and the workpiece W having a bowl-shaped warp can be sucked and held without pressing.

[0098] In the method for holding a workpiece W of the present invention, in the loading step, for example, the workpiece W held by the first conveying mechanism 41 is loaded relative to the holding surface 31, and in the liquid providing step, for example, water is provided from the first conveying mechanism 41 as the liquid L, thereby enabling the loading step and the liquid providing step to be performed smoothly.

[0099] The processing method of the present invention for processing the workpiece W held by the holding method has the following steps: a processing step, processing the workpiece W after the suction step is implemented; and a moving-out step, after the processing step is implemented, for example, moving the workpiece W held by the second conveying mechanism 42 from the holding surface 31 of the holding unit 30, thereby, after appropriate processing is performed on the workpiece W warped in a bowl shape, the workpiece W can be smoothly moved out from the holding surface 31.

[0100] In the processing method of the present invention, the workpiece W is a semiconductor wafer. In the processing step, the workpiece W is cut in a circular shape along the outer peripheral edge Wd of the workpiece W which is a semiconductor wafer using a cutting tool 613, thereby being able to appropriately cut and remove the chamfered portion of the semiconductor wafer that has been chamfered on the outer peripheral edge Wd.

[0101] The workpiece holding method and workpiece processing method of the present invention are not limited to the above-described embodiments. Also, the configurations of the processing device 1 shown in the drawings are not limited thereto and can be appropriately modified within the scope of achieving the effects of the present invention.

Claims

1. A method for holding a workpiece, the workpiece being bowl-shaped and warped, wherein: The workpiece holding method has the following steps: a step of placing the workpiece on a holding surface of a holding unit, wherein a gap due to the warping is formed between an area on the outer peripheral side of the back side of the workpiece and the holding surface, the holding unit comprising: the holding surface for holding the workpiece; a suction hole opening on the holding surface; and a suction path selectively connecting the suction hole to the suction member; A liquid supplying step of supplying liquid to a central area of ​​an upper surface of the workpiece on the holding surface, so that the liquid accumulates on the workpiece and expands radially outward of the workpiece so that the liquid flows between the holding surface and the workpiece; as well as The suction step is to connect the suction hole with the suction member to suck the workpiece together with the liquid after the liquid supply step is implemented and the liquid is deposited on the upper surface of the workpiece by surface tension so that the gap is continuously filled with the liquid, thereby holding the workpiece with the holding surface.

2. The method for holding a workpiece according to claim 1, wherein: In the placing step, the workpiece held by the conveying mechanism is placed on the holding surface. In the liquid supplying step, water is supplied as the liquid from the transport mechanism.

3. A method for processing a workpiece, wherein the workpiece held by the holding method according to claim 1 or 2 is processed, wherein: The workpiece processing method has the following steps: a processing step of processing the workpiece after the attracting step is performed; and In the unloading step, after the processing step is performed, the workpiece is held by a conveying mechanism and unloaded from the holding surface.

4. The workpiece processing method according to claim 3, wherein: The workpiece is a semiconductor wafer, In the processing step, the semiconductor wafer is cut in a ring shape along the outer periphery using a cutting tool.

Images