Grinding mold and quartz wafer grinding method

Abstract

The present invention provides a grinding mold and a grinding method for a quartz wafer. The grinding mold is used for grinding a quartz wafer. The grinding mold includes a first template and a second template. The first template is provided with a mounting hole, and the mounting hole is adapted to the quartz wafer. The second template includes a body and a mounting block. The body fits the first template. The mounting block is provided on the body and embedded in the mounting hole. The height of the mounting block is less than the height of the mounting hole. The grinding mold provided by the present invention, and because the thickness of the quartz wafer depends on the depth of the mounting groove, the depth of the mounting groove can be adjusted to obtain quartz wafers of different thicknesses. The thickness of the quartz wafer is no longer limited by the thickness of the grinding mold, and a thinner quartz wafer can be processed to increase the frequency of the quartz crystal resonator and reduce the volume of the quartz crystal resonator.

Description

Technical Field

[0001] The invention relates to the technical field of quartz wafers, and in particular to a grinding mold and a grinding method for a quartz wafer. Background Art

[0002] At present, with the development of 5G, the frequency of quartz crystal resonators is required to be higher and higher, and the frequency of the fundamental frequency is also required to be higher and higher, so the thickness of the quartz wafer needs to be thinner and thinner.

[0003] In the related art, the processing technology of quartz wafers is mainly grinding. When grinding quartz wafers, the quartz wafers need to be placed in a planetary wheel, and the planetary wheel drives the quartz wafers to move in the grinding equipment. However, since the final thickness of the quartz wafer depends on the thickness of the planetary wheel, when the quartz wafer is too thin, the strength of the planetary wheel is reduced and it is unable to stably drive the quartz wafer to move, which leads to an increase in the scrap rate of the quartz wafers. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0005] To this end, a first aspect of the present invention provides a grinding mold.

[0006] A second aspect of the present invention provides a method for grinding a quartz wafer.

[0007] In view of this, the first aspect of the present invention provides a grinding mold, which is used to grind quartz wafers. The grinding mold includes a first template and a second template; the first template is provided with a mounting hole, which is adapted to the quartz wafer; the second template includes a main body and a mounting block, the main body is fitted with the first template, the mounting block is arranged on the main body and embedded in the mounting hole; wherein the height of the mounting block is less than the height of the mounting hole.

[0008] The grinding mold provided by the present invention has a first template and a second template that fit together, a mounting block of the second template is inserted into the mounting hole from one side of the first template, and the height of the mounting block is less than the height of the mounting hole, so a mounting groove for placing a quartz wafer is formed on the other side of the first template, and after the quartz wafer is placed in the mounting groove, the quartz wafer can be ground; since the thickness of the quartz wafer depends on the depth of the mounting groove, that is, the difference between the height of the mounting block and the height of the mounting hole, the overall thickness of the first template and the second template is no longer dependent on the thickness of the quartz wafer, thereby making the grinding mold have higher strength, the grinding mold can stably drive the quartz wafer to move, improve the grinding pass rate of the quartz wafer, and thereby reduce the cost of the quartz wafer; and since the thickness of the quartz wafer depends on the depth of the mounting groove, the depth of the mounting groove can be adjusted to obtain quartz wafers of different thicknesses, and the thickness of the quartz wafer is no longer limited by the thickness of the grinding mold, thereby thinner quartz wafers can be processed to increase the frequency of the quartz crystal resonator and reduce the volume of the quartz crystal resonator.

[0009] In addition, the grinding mold in the above technical solution provided by the present invention may also have the following additional technical features:

[0010] In a technical solution of the present application, the grinding mold also includes a driving sleeve, which is connected to the first template and / or the second template to drive the first template and the second template to rotate.

[0011] In this technical solution, the driving sleeve is arranged on the outer sides of the first template and the second template, and cooperates with the driving component of the grinding equipment to drive the grinding mold and further grind the quartz wafer.

[0012] In a technical solution of the present application, the drive sleeve includes a drive ring and a plurality of teeth; the drive ring is clamped on the first template and / or the second template; the plurality of teeth are arranged on the outer wall of the drive ring and arranged along the circumference of the drive ring.

[0013] In this technical solution, the driving components of the grinding equipment include a sun gear and an inner gear ring. A plurality of teeth are arranged on the outer wall of the driving ring. The plurality of teeth can cooperate with the sun gear and the inner gear ring at the same time. The grinding mold is used as a planetary gear to form a planetary gear mechanism. The grinding mold rotates around the axis of the sun gear while also rotating around the circumference of the grinding mold itself, thereby making the thickness of the quartz wafer be ground more evenly and effectively improving the grinding efficiency of the quartz wafer.

[0014] In a technical solution of the present application, the first template includes a first discharge hole, which is arranged along the circumference of the mounting hole; the second template includes a second discharge hole, which is arranged on the main body and along the circumference of the mounting block; the first discharge hole is connected to the second discharge hole.

[0015] In this technical solution, by providing the first discharge hole and the second discharge hole, it is prevented that the waste material produced by grinding is accumulated in the mounting groove, thereby reducing the influence of the waste material on the grinding effect of the quartz wafer.

[0016] In a technical solution of the present application, a positioning groove is provided on one side of the first template, and the main body is embedded in the positioning groove.

[0017] In this technical solution, the positioning groove realizes the positioning between the first template and the second template, thereby improving the coaxiality between the first template and the second template.

[0018] In a technical solution of the present application, a protrusion is provided on the inner wall of the driving sleeve; a notch is provided on the side wall of the positioning groove; and a clamping groove is provided on the side wall of the body; wherein the protrusion passes through the notch and is embedded in the clamping groove.

[0019] In this technical solution, the protrusion passes through the notch and is embedded in the slot, so that the driving sleeve can drive the first template and the second template to rotate.

[0020] In a technical solution of the present application, the thickness of the body is smaller than the depth of the positioning groove.

[0021] In this technical solution, the thickness of the main body is smaller than the depth of the positioning groove, and after the first template and the second template are assembled, the main body is prevented from protruding from the positioning groove to cause interference.

[0022] In a technical solution of the present application, the difference between the height of the mounting block and the height of the mounting hole is equal to the preset thickness of the quartz wafer.

[0023] In a technical solution of the present application, the grinding mold also includes an adjustment pad, which is arranged between the first template and the second template. An avoidance position is arranged on the adjustment pad, and the avoidance position is adapted to the mounting block.

[0024] In this technical solution, the adjustment pad can adjust the depth of the mounting groove according to the preset thickness of the quartz wafer, thereby making the grinding mold suitable for grinding quartz wafers of different thicknesses.

[0025] The preset thickness of the quartz wafer is equal to the ratio of 1670 to the fundamental frequency of the quartz wafer, that is, the actual thickness of the finished quartz wafer.

[0026] In a technical solution of the present application, the grinding mold also includes a positioning pin, one end of which is plugged into the first template, and the other end of which is plugged into the second template.

[0027] In this technical solution, the locating pin is not coaxial with the axis of the first template and the second template. In this way, the locating pin can realize the circumferential positioning of the first template and the second template, so that multiple mounting blocks correspond to multiple mounting holes one by one, reducing the error caused by the cooperation between different mounting holes and mounting blocks, thereby improving the accuracy of the grinding mold.

[0028] A second aspect of the present invention provides a method for grinding a quartz wafer, wherein the quartz wafer is ground by a grinding mold according to any of the above technical solutions, and the method for grinding the quartz wafer includes: adjusting the difference between the height of the mounting block and the height of the mounting hole to a first preset value; grinding the quartz wafer for the first time; adjusting the difference between the height of the mounting block and the height of the mounting hole to a second preset value; grinding the quartz wafer for the second time; adjusting the difference between the height of the mounting block and the height of the mounting hole to a third preset value; grinding the quartz wafer for the third time to grind the quartz wafer to a preset thickness value; wherein the first preset value is greater than the second preset value, the second preset value is greater than the third preset value, and the third preset value is equal to the preset thickness value.

[0029] The grinding method of the quartz wafer provided by the present invention, since the thickness of the quartz wafer depends on the depth of the mounting groove, that is, the difference between the height of the mounting block and the height of the mounting hole, the overall thickness of the first template and the second template no longer depends on the thickness of the quartz wafer, thereby making the grinding mold have higher strength, the grinding mold can stably drive the quartz wafer to move, improve the grinding pass rate of the quartz wafer, and thereby reduce the cost of the quartz wafer; and since the thickness of the quartz wafer depends on the depth of the mounting groove, the depth of the mounting groove is adjusted to obtain quartz wafers of different thicknesses, the thickness of the quartz wafer is no longer limited by the thickness of the grinding mold, and then a thinner quartz wafer can be processed to increase the frequency of the quartz crystal resonator and reduce the volume of the quartz crystal resonator. And the quartz wafer is ground in multiple times, so that the thickness of the quartz wafer is more uniform, and the quality of the quartz wafer is effectively improved.

[0030] The first preset value and the second preset value depend on the blank thickness of the quartz wafer.

[0031] The first preset value may be two-thirds of the blank thickness of the quartz wafer; the second preset value may be one-half of the blank thickness of the quartz wafer.

[0032] The third preset value is equal to the preset thickness value, ie, the thickness value of the finished quartz wafer.

[0033] In addition, the quartz wafer grinding method in the above technical solution provided by the present invention may also have the following additional technical features:

[0034] In one technical solution of the present application, grinding a quartz wafer includes: placing the quartz wafer in a mounting hole; and driving a grinding mold to rotate.

[0035] In this technical solution, the quartz wafer is placed in the mounting hole, and the mounting holes cooperate with each other to form a mounting groove. While the grinding mold can drive the quartz wafer to move, the thickness of the quartz wafer is adjusted by changing the depth of the mounting groove, thereby obtaining a thinner quartz wafer.

[0036] In a technical solution of the present application, after grinding the quartz wafer to a preset thickness value for the third time, the grinding method of the quartz wafer further includes: recording the number of times the grinding mold is used; and inspecting the grinding mold when the number of uses reaches the preset number.

[0037] In this technical solution, during the grinding process, the grinding mold will also produce a certain amount of wear, so after a certain number of grindings, the grinding mold needs to be inspected and repaired to improve the dimensional accuracy of the grinding mold.

[0038] The preset number of times can be determined based on the wear state of the grinding mold, and can also be determined based on usage experience.

[0039] The preset number of times is 5 to 10 times.

[0040] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0042] Figure 1 An assembly diagram of a grinding mold according to an embodiment of the present invention is shown;

[0043] Figure 2 A schematic structural diagram of a first template according to an embodiment of the present invention is shown;

[0044] Figure 3 shows a cross-sectional view of a first template according to one embodiment of the present invention;

[0045] Figure 4 The main diagram of the second template according to one embodiment of the present invention is shown;

[0046] Figure 5 shows a cross-sectional view of a second template according to one embodiment of the present invention;

[0047] Figure 6 A schematic structural diagram of a driving sleeve according to an embodiment of the present invention is shown;

[0048] Figure 7 for Figure 6A cross-sectional view of a drive sleeve along AA according to an embodiment of the present invention is shown;

[0049] Figure 8 A rear view of a second template according to an embodiment of the present invention is shown;

[0050] Fig. 9 A flow chart of a method for grinding a quartz wafer according to an embodiment of the present invention is shown;

[0051] in, Figures 1 to 8 The corresponding relationship between the reference numerals and component names in the figure is:

[0052] 100 first template, 102 mounting hole, 104 first discharge hole, 106 positioning groove, 200 second template, 202 body, 204 mounting block, 206 second discharge hole, 300 drive sleeve, 302 drive ring, 304 teeth. DETAILED DESCRIPTION

[0053] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0054] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0055] Refer to the following Figures 1 to 9 The grinding method of the grinding mold and the quartz wafer according to some embodiments of the present invention is described.

[0056] In the first embodiment of the present invention, Figure 1 As shown, the present invention provides a grinding mold, which is used for grinding a quartz wafer. The grinding mold includes a first template 100 and a second template 200; Figure 2 and Figure 3 As shown, the first template 100 is provided with a mounting hole 102, and the mounting hole 102 is adapted to the quartz wafer; Figure 4 and Figure 5 As shown, the second template 200 includes a body 202 and a mounting block 204 . The body 202 fits the first template 100 . The mounting block 204 is disposed on the body 202 and embedded in the mounting hole 102 . The height of the mounting block 204 is smaller than the height of the mounting hole 102 .

[0057] In this embodiment, the first template 100 and the second template 200 are fitted together, and the mounting block 204 of the second template 200 is inserted into the mounting hole 102 from one side of the first template 100, and the height of the mounting block 204 is less than the height of the mounting hole 102, so a mounting groove for placing the quartz wafer is formed on the other side of the first template 100. After the quartz wafer is placed in the mounting groove, the quartz wafer can be ground; since the thickness of the quartz wafer depends on the depth of the mounting groove, that is, the difference between the height of the mounting block 204 and the height of the mounting hole 102, the first template 10 0 and the overall thickness of the second template 200 no longer depends on the thickness of the quartz wafer, so that the grinding mold has higher strength. The grinding mold can stably drive the quartz wafer to move, improve the grinding pass rate of the quartz wafer, and thus reduce the cost of the quartz wafer; and because the thickness of the quartz wafer depends on the depth of the mounting groove, quartz wafers of different thicknesses can be obtained by adjusting the depth of the mounting groove. The thickness of the quartz wafer is no longer limited by the thickness of the grinding mold, and thinner quartz wafers can be processed to increase the frequency of the quartz crystal resonator and reduce the volume of the quartz crystal resonator.

[0058] The grinding mold can be used to grind quartz wafers with a thickness of 0.015±0.001mm.

[0059] The first template 100 is an integrated structure.

[0060] The second template 200 is an integrated structure.

[0061] In one embodiment of the present application, Figure 1 As shown, the grinding mold further includes a driving sleeve 300 , which is connected to the first template 100 and / or the second template 200 to drive the first template 100 and the second template 200 to rotate.

[0062] In this embodiment, the driving sleeve 300 is sleeved on the outer sides of the first template 100 and the second template 200, and cooperates with the driving component of the grinding equipment to drive the grinding mold and further grind the quartz wafer.

[0063] The driving sleeve 300 is an integrated structure.

[0064] In one embodiment of the present application, Figure 6 and Figure 7 As shown, the drive sleeve 300 includes a drive ring 302 and a plurality of teeth 304 ; the drive ring 302 is clamped on the first template 100 and / or the second template 200 ; the plurality of teeth 304 are arranged on the outer wall of the drive ring 302 and along the circumference of the drive ring 302 .

[0065] In this embodiment, the driving components of the grinding equipment include a sun gear and an inner tooth circle 304. A plurality of teeth 304 are arranged on the outer wall of the driving ring 302. The plurality of teeth 304 can cooperate with the sun gear and the inner tooth circle 304 at the same time, and the grinding mold is used as a planetary gear to form a planetary gear mechanism. The grinding mold rotates around the axis of the sun gear while also rotating around the circumference of the grinding mold itself, thereby making the thickness of the quartz wafer be ground more evenly and effectively improving the grinding efficiency of the quartz wafer.

[0066] In one embodiment of the present application, Figure 2 As shown, the first template 100 includes a first discharge hole 104, and the first discharge hole 104 is arranged along the circumference of the mounting hole 102; Figure 8 As shown, the second template 200 includes a second discharge hole 206 , which is disposed on the body 202 and along the circumference of the mounting block 204 ; the first discharge hole 104 is communicated with the second discharge hole 206 .

[0067] In this embodiment, the first discharge hole 104 and the second discharge hole 206 are provided to prevent the waste materials from being ground from accumulating in the mounting groove, thereby reducing the influence of the waste materials on the grinding effect of the quartz wafer.

[0068] In one embodiment of the present application, Figure 3 As shown, a positioning groove 106 is provided on one side of the first template 100 , and the body 202 is embedded in the positioning groove 106 .

[0069] In this embodiment, the positioning groove 106 realizes the positioning between the first template 100 and the second template 200, and improves the coaxiality between the first template 100 and the second template 200.

[0070] In one embodiment of the present application, a protrusion is provided on the inner wall of the driving sleeve 300; a notch is provided on the side wall of the positioning groove 106; and a card slot is provided on the side wall of the body 202; wherein the protrusion passes through the notch and is embedded in the card slot.

[0071] In this embodiment, the protrusion passes through the notch and is embedded in the slot, so that the driving sleeve 300 can drive the first template 100 and the second template 200 to rotate.

[0072] In one embodiment of the present application, the thickness of the body 202 is smaller than the depth of the positioning groove 106 .

[0073] In this embodiment, the thickness of the body 202 is smaller than the depth of the positioning groove 106 , so that after the first template 100 and the second template 200 are assembled, the body 202 is prevented from protruding from the positioning groove 106 and causing interference.

[0074] In one embodiment of the present application, the difference between the height of the mounting block 204 and the height of the mounting hole 102 is equal to the preset thickness of the quartz wafer.

[0075] In one embodiment of the present application, the grinding mold further includes an adjustment pad, which is disposed between the first template 100 and the second template 200 , and an avoidance position is disposed on the adjustment pad, which is matched with the mounting block 204 .

[0076] In this embodiment, the adjustment pad can adjust the depth of the mounting groove according to the preset thickness of the quartz wafer, thereby making the grinding mold suitable for grinding quartz wafers of different thicknesses.

[0077] Different grinding dies can also be used to adjust the depth of the installation groove.

[0078] The preset thickness of the quartz wafer is equal to the ratio of 1670 to the fundamental frequency of the quartz wafer, that is, the actual thickness of the finished quartz wafer, where 1670 is an empirical constant derived from experience when estimating the thickness of the quartz wafer.

[0079] In one embodiment of the present application, the grinding mold further includes a positioning pin, one end of which is plugged into the first template 100 , and the other end of which is plugged into the second template 200 .

[0080] In this embodiment, the positioning pin is not coaxial with the axis of the first template 100, and is also not coaxial with the second template 200. In this way, the positioning pin can realize the circumferential positioning of the first template 100 and the second template 200, so that the multiple mounting blocks 204 correspond to the multiple mounting holes 102 one by one, thereby reducing the error caused by the cooperation between different mounting holes 102 and the mounting blocks 204, thereby improving the accuracy of the grinding mold.

[0081] In the second embodiment of the present invention, Fig. 9 As shown, the present invention provides a method for grinding a quartz wafer, wherein the quartz wafer is ground by a grinding mold as in any of the above embodiments, and the method for grinding the quartz wafer comprises:

[0082] Step 402, adjusting the difference between the height of the mounting block and the height of the mounting hole to a first preset value;

[0083] Step 404, grinding the quartz wafer for the first time;

[0084] Step 406, adjusting the difference between the height of the mounting block and the height of the mounting hole to a second preset value;

[0085] Step 408, grinding the quartz wafer for a second time;

[0086] Step 410, adjusting the difference between the height of the mounting block and the height of the mounting hole to a third preset value;

[0087] Step 412, grinding the quartz wafer for the third time to grind the quartz wafer to a preset thickness value;

[0088] Among them, the first preset value is greater than the second preset value, the second preset value is greater than the third preset value, and the third preset value is equal to the preset thickness value.

[0089] In this embodiment, since the thickness of the quartz wafer depends on the depth of the mounting groove, that is, the difference between the height of the mounting block and the height of the mounting hole, the overall thickness of the first template and the second template no longer depends on the thickness of the quartz wafer, thereby making the grinding mold have higher strength, and the grinding mold can stably drive the quartz wafer to move, improve the grinding pass rate of the quartz wafer, and thus reduce the cost of the quartz wafer; and since the thickness of the quartz wafer depends on the depth of the mounting groove, the depth of the mounting groove can be adjusted to obtain quartz wafers of different thicknesses, and the thickness of the quartz wafer is no longer limited by the thickness of the grinding mold, and thus a thinner quartz wafer can be processed to increase the frequency of the quartz crystal resonator and reduce the volume of the quartz crystal resonator. And the quartz wafer is ground in multiple times, so that the thickness of the quartz wafer is more uniform, which effectively improves the quality of the quartz wafer.

[0090] The first preset value and the second preset value depend on the blank thickness of the quartz wafer.

[0091] The first preset value may be two-thirds of the blank thickness of the quartz wafer; the second preset value may be one-half of the blank thickness of the quartz wafer.

[0092] The third preset value is equal to the preset thickness value, ie, the thickness value of the finished quartz wafer.

[0093] The first grinding of the quartz wafer can be ground by a planetary wheel or a grinding mold, and the second and third grinding of the quartz wafer are ground by a grinding mold.

[0094] In one embodiment of the present application, grinding the quartz wafer includes: placing the quartz wafer in the mounting hole; and driving the grinding mold to rotate.

[0095] In this embodiment, the quartz wafer is placed in the mounting hole, and the mounting holes cooperate with the mounting holes to form a mounting groove. While the grinding mold can drive the quartz wafer to move, the thickness of the quartz wafer is adjusted by changing the depth of the mounting groove, thereby obtaining a thinner quartz wafer.

[0096] In one embodiment of the present application, after grinding the quartz wafer to a preset thickness value for the third time, the grinding method of the quartz wafer further includes: recording the number of times the grinding mold is used; and inspecting the grinding mold when the number of uses reaches a preset number.

[0097] In this embodiment, during the grinding process, the grinding mold will also produce a certain amount of wear, so after a certain number of grindings, the grinding mold needs to be inspected and repaired to improve the dimensional accuracy of the grinding mold.

[0098] The preset number of times can be determined based on the wear state of the grinding mold, and can also be determined based on usage experience.

[0099] The preset number of times is 5 to 10 times.

[0100] In one embodiment of the present application, the fundamental frequency of the quartz wafer is 80000 KHz, then the thickness of the quartz wafer is 1670 / 80000 KHz≈0.021 mm, and 1670 is an empirical constant for technicians to estimate the thickness of the quartz wafer according to the fundamental frequency of the quartz wafer.

[0101] The blank thickness of the quartz wafer is 0.06 mm, the first preset value is 0.045 mm, the second preset value is 0.03 mm, and the third preset value is 0.021 mm.

[0102] In one embodiment of the present application, the depth of the mounting groove may also be adjusted to be smaller than the thickness of the quartz wafer.

[0103] After the first grinding, the thickness of the quartz wafer is required to be 0.045mm, after the second grinding, the thickness of the quartz wafer is required to be 0.030mm, and after the third grinding, the thickness of the quartz wafer is required to be 0.021mm; then the quartz wafer is first ground to 0.045mm using traditional processes to reduce the types of grinding molds, and then the depth of the mounting groove is adjusted to 0.027mm, that is, the second preset value is 0.027mm, to grind out a quartz wafer with a thickness of 0.030mm, and then the depth of the mounting groove is adjusted to 0.018mm, that is, the second preset value is 0.018mm, to grind out a quartz wafer with a thickness of 0.021mm.

[0104] In one embodiment of the present application, the height of the mounting hole is 7.980±0.001 mm, the height of the mounting block is 7.962±0.001 mm, and the depth of the mounting groove is 0.018±0.001 mm.

[0105] In the description of the present invention, the term "plurality" refers to two or more than two. Unless otherwise clearly defined, the orientation or positional relationship indicated by the terms "upper" and "lower" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention. The terms "connection", "installation", "fixation", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0106] In the description of the present invention, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In the present invention, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0107] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A grinding mold, characterized in that: The grinding mold is used for grinding a quartz wafer, and the grinding mold comprises: A first template, wherein a mounting hole is provided on the first template, and the mounting hole is adapted to the quartz wafer; A second template, the second template comprising a body and a mounting block, the body being fitted with the first template, the mounting block being arranged on the body and embedded in the mounting hole; The height of the mounting block is smaller than the height of the mounting hole, the mounting block of the second template is inserted into the mounting hole from one side of the first template, and a mounting groove for placing the quartz wafer is formed on the other side of the first template; The grinding mold also includes: A driving sleeve, the driving sleeve is connected to the first template and / or the second template to drive the first template and the second template to rotate; Wherein, the driving sleeve is arranged on the outer sides of the first template and the second template; A positioning groove is provided on one side of the first template, and the body is embedded in the positioning groove; A protrusion is provided on the inner wall of the driving sleeve; A notch is provided on the side wall of the positioning groove; A card slot is provided on the side wall of the body; Wherein, the protrusion passes through the notch and is embedded in the slot; The thickness of the body is smaller than the depth of the positioning groove; The difference between the height of the mounting block and the height of the mounting hole is equal to the preset thickness of the quartz wafer; The grinding mold further includes an adjustment pad, which is arranged between the first template and the second template, and a clearance position is arranged on the adjustment pad, and the clearance position is adapted to the mounting block; The grinding mold further includes a positioning pin, one end of which is plugged into the first template, and the other end of which is plugged into the second template; The positioning pin is not coaxial with the axis of the first template, and is also not coaxial with the axis of the second template; the adjustment pad adjusts the depth of the mounting groove according to the preset thickness of the quartz wafer; The first template includes a first discharge hole, and the first discharge hole is arranged along the circumference of the mounting hole; The second template includes a second discharge hole, and the second discharge hole is arranged on the body and along the circumference of the mounting block; The first discharge hole is communicated with the second discharge hole.

2. The grinding mold according to claim 1, characterized in that: The drive sleeve comprises: A driving ring, the driving ring is clamped on the first template and / or the second template; A plurality of teeth are arranged on the outer wall of the driving ring and along the circumference of the driving ring.

3. A method for grinding a quartz wafer, characterized in that: The quartz wafer is ground by the grinding mold as described in claim 1 or 2, and the grinding method of the quartz wafer comprises: Adjust the difference between the height of the mounting block and the height of the mounting hole to a first preset value; Grinding of quartz wafers for the first time; Adjust the difference between the height of the mounting block and the height of the mounting hole to a second preset value; Grinding the quartz wafer a second time; Adjusting the difference between the height of the mounting block and the height of the mounting hole to a third preset value; grinding the quartz wafer for a third time to grind the quartz wafer to a preset thickness value; The first preset value is greater than the second preset value, the second preset value is greater than the third preset value, and the third preset value is equal to the preset thickness value.

4. The method for polishing a quartz wafer according to claim 3, characterized in that: The ground quartz wafer comprises: Place the quartz crystal in the mounting hole; Drive the grinding mold to rotate.

5. The method for polishing a quartz wafer according to claim 3 or 4, characterized in that: After the third grinding of the quartz wafer to a preset thickness value, the grinding method of the quartz wafer further includes: Record the number of times the grinding mold is used; When the number of uses reaches a preset number, the grinding mold is inspected.

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