Transient temperature measurement device and method based on snapshot spectral imaging technology

Abstract

The present invention discloses a transient temperature measurement device and method based on snapshot spectral imaging technology, relates to the field of radiation temperature measurement technology, and solves the problems of a traditional multi-spectral temperature measurement system, such as a small number of spectral segments and poor time resolution. The present invention comprises a bandpass filter (1), an optical imaging objective lens (2), a snapshot spectral imaging module (3), a high-speed array image sensor (4), an image acquisition storage module (5), an image processing module (6) and a temperature inversion module (7). The snapshot spectral imaging module (3) is used to fuse the spectral information containing radiation of the measured object with the two-dimensional spatial information through the optical imaging objective lens (2) to form a two-dimensional image, and is used to realize the simultaneous detection of the two-dimensional spatial information and spectral information of the measured object in a single exposure. The present invention has a simple structure, high temperature measurement accuracy, a wide measurement range, and high time resolution, and is suitable for temperature field measurement in a transient change process.

Description

Technical Field

[0001] The present invention relates to the field of radiation temperature measurement technology, and in particular to a transient temperature measurement device and method based on snapshot spectrum imaging technology. Background Art

[0002] In many important fields such as industrial and agricultural production, scientific research, and aerospace, temperature has always been an important parameter that people pay close attention to as one of the most basic physical quantities. With the continuous development of science and technology, the diversification of temperature measurement methods and the requirements for the measurement accuracy achieved are getting higher and higher. According to the different measurement methods, the existing temperature measurement technology can generally be divided into two types: contact temperature measurement and non-contact temperature measurement. As a typical non-contact temperature measurement method, the multi-spectral temperature measurement system can obtain radiation information at different wavelengths without interfering with the temperature field of the object being measured. Combined with the emissivity model, a certain algorithm is used to reconstruct the temperature of the object being measured. The traditional multi-spectral temperature measurement system needs to adopt a camera array or spectral splitting method. Its optical acquisition system has a complex structure and is expensive. In addition, due to the consideration of volume and weight, it can generally only obtain information from a few or a dozen spectral channels. It is greatly limited in terms of temperature measurement range, measurement accuracy, and time resolution. The practicality and versatility need to be further improved. The construction of an appropriate multi-spectral acquisition system is still an important problem that plagues this field. Summary of the invention

[0003] The technical problems to be solved by the present invention are: the traditional multi-spectral temperature measurement system has a small number of spectrum segments, poor time resolution, etc. The present invention provides a transient temperature measurement device and method based on snapshot spectral imaging technology to solve the above problems.

[0004] The present invention is achieved through the following technical solutions:

[0005] A transient temperature measuring device based on snapshot spectral imaging technology, the measuring device for measuring the transient temperature of the measured object comprises a bandpass filter, an optical imaging objective lens, a snapshot spectral imaging module, a high-speed array image sensor, an image acquisition storage module, an image processing module and a temperature inversion module;

[0006] The bandpass filter is combined with the high-speed area array image sensor to limit the working band of the measuring device, and is used to select the light radiation within the working wavelength range and cut off the light radiation outside the working wavelength range. The high-speed area array image sensor is a near-infrared area array sensor. The bandpass filter and the high-speed area array image sensor limit the working wavelength range to 800nm~2500nm, and the corresponding temperature measurement range is 1160K~3600K;

[0007] Preferably, the high-speed area array image sensor may also be a mid-infrared area array sensor, and the bandpass filter and the high-speed area array image sensor limit the operating wavelength range to 2500nm to 5000nm, and the corresponding temperature measurement range is 580K to 1160K;

[0008] The high-speed area array image sensor may also be a single area array sensor or a sensor array composed of multiple area array sensors, and the high-speed area array image sensor is used to detect the instantaneous temperature field change process of the object under test with a time resolution better than microsecond level;

[0009] The optical imaging objective lens is used to collect the radiation of the measured object into the measuring device;

[0010] The snapshot spectral imaging module is used to fuse the spectral information containing radiation of the measured object with the two-dimensional spatial information through the optical imaging objective lens to form a two-dimensional image. The snapshot spectral imaging module uses a microlens array and a birefringent prism group to establish common optical path interference, performs polarized light interference on the light radiation containing multi-wavelength information from the measured object, obtains a two-dimensional interference pattern array, and inverts the spectral image sequence of the measured object through Fourier transform technology, so as to realize the simultaneous detection of the two-dimensional spatial information and spectral information of the measured object in a single exposure;

[0011] The high-speed area array image sensor is used to convert the two-dimensional image into a digital image, wherein the digital image includes light radiation information, and the maximum operating frame rate of the high-speed area array image sensor determines the time resolution capability of the system;

[0012] The image acquisition storage module stores the digital image and controls the high-speed area array image sensor at the same time, and the image acquisition storage module includes an electronic shutter, exposure time, frame rate, and image acquisition area for controlling the high-speed area array image sensor;

[0013] The image processing module is used to invert the two-dimensional image to obtain the spectral information and spatial distribution information of the object under test, wherein the spectral information and spatial distribution information include a spectral image sequence of the object under test at multiple wavelengths at the same time;

[0014] The temperature inversion module calculates the polynomial coefficients of the spectral reflectance model including the true temperature of the object under test and the spectral reflectance model based on the combination of the spectral image sequence, the spectral emissivity model described by a polynomial about the wavelength, and the least squares method. By performing the above processing on the image data at different times, the evolution process of the temperature field of the object under test over time is obtained. The spectral emission model is described by a polynomial about the wavelength to simulate the change of the emissivity of the object with the wavelength; the coefficients of the polynomial are determined by curve fitting at multiple wavelengths, thereby realizing the spectral emissivity measurement of the object.

[0015] The snapshot type spectral imaging module comprises a microlens array, a linear polarization polarizer, a Nomarski prism, an analyzer and a focal plane arranged in sequence;

[0016] The microlens array is used to decompose the incident light into M×N array sub-beams;

[0017] The linear polarization polarizer is used to generate linear polarized light, and the vibration direction is 45° with the optical axis of the Nomarski prism;

[0018] The linearly polarized light of the array sub-beam passes through two mutually perpendicular optical wedges of the Nomarski prism and is decomposed into two beams of light, namely, o light and e light. The o light in the first optical wedge of the Nomarski prism is sub-beam I, and the e light is sub-beam II. After entering the second optical wedge, the o light is converted into the e light, and the e light is converted into the o light.

[0019] The Nomarski prism is used to generate an optical delay difference δ between sub-beam I and sub-beam II;

[0020] The polarizer has a transmission direction parallel to the linear polarization polarizer, and is used to form interference fringes on the focal plane after passing through sub-beam I and sub-beam II.

[0021] The snapshot type spectral imaging module also includes an achromatic λ / 2 wave plate and another Nomarski prism;

[0022] An achromatic λ / 2 wave plate and another Nomarski prism are sequentially added between the Nomarski prism and the analyzer, wherein the achromatic λ / 2 wave plate is used to independently rotate the polarization directions of the sub-beam I and the sub-beam II, and the rotation magnitude is π / 2;

[0023] The other Nomarski prism is used to double the optical path difference between beamlet I and beamlet II. After doubling, the difference in optical delay between beamlet I and beamlet II is 2δ.

[0024] The transient temperature measurement method based on snapshot spectral imaging technology, the steps of implementing the transient temperature measurement method by the above device are as follows:

[0025] The measuring device for measuring the transient temperature of the measured object comprises a bandpass filter, an optical imaging objective lens, a snapshot type spectral imaging module, a high-speed array image sensor, an image acquisition storage module, an image processing module and a temperature inversion module;

[0026] The radiation from the object being measured is collected by an optical imaging objective lens and enters the measuring device;

[0027] The snapshot spectral imaging module processes the light radiation passing through the optical imaging objective lens, and fuses the spectral information containing the radiation of the measured object with the two-dimensional spatial information to form a two-dimensional image. Then, the high-speed area array image sensor converts the light radiation information into a digital image, and the image acquisition and storage module acquires and stores the digital image. The image acquisition and storage module controls the high-speed area array image sensor. The image processing module inverts the spectral information and spatial distribution information of the measured object from the two-dimensional image information generated by the snapshot spectral imaging module. The image processing module obtains the spectral image sequence of the measured object at multiple wavelengths at the same time. The temperature inversion module uses the spectral image sequence of the measured object obtained by the image processing module, the spectral emissivity model described by the polynomial of the wavelength, and the data fitting method based on the least squares method to obtain the real temperature of the measured object, and at the same time obtains the polynomial coefficients of the spectral reflectivity model. Among them, the bandpass filter combined with the high-speed area array image sensor will limit the working band of the temperature measuring device.

[0028] Furthermore, the bandpass filter is combined with a high-speed area array image sensor to limit the working range of the temperature measuring device to 800nm ​​to 2500nm.

[0029] Furthermore, the image acquisition and storage module includes an electronic shutter, exposure time, frame rate, and image acquisition area for controlling the high-speed area array image sensor.

[0030] Furthermore, the snapshot spectral imaging module further includes a sequentially arranged microlens array, a linear polarization polarizer, a Nomarski prism, an achromatic λ / 2 wave plate, another Nomarski prism, an analyzer and a focal plane, and also includes the following steps of a method for improving the temperature inversion accuracy of the snapshot spectral imaging module:

[0031] The microlens array decomposes the incident light radiation into M×N array sub-beams;

[0032] The array sub-beam light passes through the linear polarizer and enters the first wedge of the Nomarski prism and is decomposed into two beams, namely, o light and e light. The o light is sub-beam I, and the e light is sub-beam II.

[0033] After the two beams of light pass through the first wedge of the Nomarski prism and enter the second wedge, the difference in optical delay between beam I and beam II is δ;

[0034] The light radiation passes through the achromatic λ / 2 wave plate, and the polarization directions of beamlets I and II are independently rotated by π / 2;

[0035] After passing through another Nomarski prism and then passing through the analyzer to reach the focal plane, the optical delay difference between sub-beam I and sub-beam II will double to 2δ; thus, it is beneficial to improve the spectral resolution of the snapshot spectral imaging module, thereby obtaining a more accurate radiation value of the measured object at a single wavelength, improving the accuracy of temperature inversion, and forming interference fringes on the focal plane;

[0036] The image acquisition storage module, the image processing module and the temperature inversion module invert the spectrum information and the spatial distribution information of the measured object based on the Fourier transform and the wavelength information and the spatial distribution information of the light radiation contained in the stripes.

[0037] The present invention has the following advantages and beneficial effects:

[0038] The temperature measuring device of the present invention can set the temperature measuring interval according to the measurement needs, and the temperature measurement range can cover 580K~3600K, covering the low temperature zone and the high temperature zone. Compared with the traditional measurement technology, since the radiation measurement data under multiple wavelengths are used for data fitting, the influence of the radiation measurement error on the measurement result is reduced, and the temperature range that can be achieved is wider;

[0039] In the present invention, the spectral emissivity of the object to be measured is described by a polynomial about wavelength, and the least square method is used to fit the data of the radiation intensity measured at multiple wavelengths, which can eliminate the influence of the spectral emissivity changing with wavelength on the temperature measurement, thereby greatly improving the applicability.

[0040] The present invention uses a single optical imaging objective lens to achieve temperature field measurement of the transient process of the object being measured. Compared with the traditional multi-spectral temperature measurement method, the measuring device of the present invention has a simple optical system structure, high temperature measurement accuracy, a wide measurement range, and high time resolution, and is suitable for temperature field measurement in transient change processes.

[0041] The temperature measurement device of the present invention uses a high-speed image sensor or a high-speed camera system, which can achieve a time resolution better than microseconds and monitor the temperature field of the transient change process of the object being measured. This is of certain significance for broadening the application field of non-contact temperature measurement technology, improving the versatility of equipment, and promoting the development of multi-spectral radiation temperature measurement technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of this application, and do not constitute a limitation of the embodiments of the present invention. In the drawings:

[0043] Figure 1 It is a schematic diagram of a transient temperature measurement device based on snapshot spectral imaging technology of the present invention.

[0044] Figure 2 It is a schematic diagram of the snapshot type spectral imaging module of the present invention.

[0045] Description of reference numerals:

[0046] 1. Bandpass filter; 2. Optical imaging objective lens; 3. Snapshot spectral imaging module; 4. High-speed array image sensor; 5. Image acquisition and storage module; 6. Image processing module; 7. Temperature inversion module; 31. Microlens array; 32. Linear polarization polarizer; 33. Nomarski prism; 34. Achromatic λ / 2 wave plate; 35. Another Nomarski prism; 36. Analyzer; 37. Focal plane. DETAILED DESCRIPTION

[0047] Before any embodiment of the present invention is described in detail, it should be understood that the application of the present invention is not limited to the details of the structure shown in the following description or the accompanying drawings. The present invention may adopt other embodiments and may be implemented or executed in various ways. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative improvements are within the scope of protection of the present invention.

[0048] Transient temperature measurement device based on snapshot spectral imaging technology, such as Figure 1 , 2 As shown, the measuring device for measuring the transient temperature of the measured object includes a bandpass filter 1, an optical imaging objective lens 2, a snapshot spectral imaging module 3, a high-speed array image sensor 4, an image acquisition and storage module 5, an image processing module 6 and a temperature inversion module 7;

[0049] The bandpass filter 1 is combined with the high-speed array image sensor 4 to limit the working band of the measuring device, to select the light radiation within the working wavelength range, and to cut off the light radiation outside the working wavelength range. The high-speed array image sensor 4 is a near-infrared array sensor; the bandpass filter 1 and the high-speed array image sensor 4 limit the working wavelength range to 800nm~2500nm, and the corresponding temperature measurement range is 1160K~3600K, and the instantaneous temperature field change process of the measured object is detected with a time resolution better than microseconds, so as to realize the temperature field monitoring and diagnosis of transient phenomena. ;

[0050] Preferably, the high-speed area array image sensor 4 may also be a mid-infrared area array sensor, and the bandpass filter 1 and the high-speed area array image sensor 4 limit the operating wavelength range to 2500nm to 5000nm, and the corresponding temperature measurement range is 580K to 1160K;

[0051] The high-speed area array image sensor 4 may also be a single area array sensor or a sensor array composed of multiple area array sensors;

[0052] The optical imaging objective lens 2 is used to collect the radiation of the measured object into the measuring device;

[0053] The snapshot spectral imaging module 3 is used to fuse the spectral information containing radiation of the measured object with the two-dimensional spatial information through the optical imaging objective lens 2 to form a two-dimensional image. The snapshot spectral imaging module 3 uses a microlens array and a birefringent prism group to establish common optical path interference, and performs polarized light interference on the light radiation containing multi-wavelength information from the measured object to obtain a two-dimensional interference pattern array. The spectral image sequence of the measured object is inverted through the Fourier transform technology, which is used to realize two-dimensional spatial detection and spectral detection of the measured object at the same time of a single exposure;

[0054] The high-speed area array image sensor 4 is used to convert the two-dimensional image into a digital image, wherein the digital image includes light radiation information. The maximum operating frame rate of the high-speed area array image sensor 4 determines the time resolution capability of the system.

[0055] The image acquisition storage module 5 stores the digital image and controls the high-speed array image sensor 4 at the same time. The image acquisition storage module 5 includes an electronic shutter, exposure time, frame rate, and image acquisition area for controlling the high-speed array image sensor 4.

[0056] The image processing module 6 is used to invert the two-dimensional image to obtain the spectral information and spatial distribution information of the object under test, wherein the spectral information and spatial distribution information include a spectral image sequence of the object under test at multiple wavelengths at the same time;

[0057] The temperature inversion module 7 calculates the polynomial coefficients of the spectral reflectance model including the true temperature of the object under test and the spectral reflectance model based on the combination of the spectral image sequence, the spectral emissivity model described by a polynomial about the wavelength, and the least squares method. By performing the above processing on the image data at different times, the evolution process of the temperature field of the object under test with time is obtained. The spectral emission model is described by a polynomial about the wavelength to simulate the change of the emissivity of the object with the wavelength; the coefficients of the polynomial are determined by curve fitting at multiple wavelengths, thereby realizing the spectral emissivity measurement of the object.

[0058] The snapshot type spectral imaging module 3 comprises a microlens array 31, a linear polarization polarizer 32, a Nomarski prism 33, an analyzer 36 and a focal plane 37 which are arranged in sequence;

[0059] The microlens array 31 is used to decompose the incident light into M×N array sub-beams;

[0060] The linear polarization polarizer 32 is used to generate linear polarized light, and the vibration direction is 45° with the optical axis of the Nomarski prism 33; the linear polarized light passes through two mutually perpendicular wedges of the Nomarski prism 33, and is decomposed into o light and e light. The o light in the first wedge of the Nomarski prism 33 is sub-beam I, and the e light is sub-beam II. After entering the second wedge, the o light is converted into e light, and the e light is converted into o light.

[0061] The Nomarski prism 33 is used to generate an optical delay difference δ between the sub-beam I and the sub-beam II;

[0062] The polarizer 36 has a transmission direction parallel to the linear polarizer 32 and is used to form interference fringes on the focal plane 37 after transmitting sub-beams I and II.

[0063] The snapshot type spectral imaging module 3 further includes an achromatic λ / 2 wave plate 34 and another Nomarski prism 35;

[0064] An achromatic λ / 2 wave plate 34 and another Nomarski prism 35 are sequentially added between the Nomarski prism 33 and the focal plane 37, wherein the achromatic λ / 2 wave plate 34 is used to independently rotate the polarization directions of the sub-beams I and II, respectively, with a rotation magnitude of π / 2;

[0065] The other Nomarski prism 35 is used to double the optical path difference between beamlet I and beamlet II. After doubling, the difference in optical delay between beamlet I and beamlet II is 2δ.

[0066] The transient temperature measurement method based on snapshot spectral imaging technology, the steps of implementing the transient temperature measurement method by the above device are as follows:

[0067] The measuring device for measuring the transient temperature of the measured object comprises a bandpass filter 1, an optical imaging objective lens 2, a snapshot spectral imaging module 3, a high-speed array image sensor 4, an image acquisition storage module 5, an image processing module 6 and a temperature inversion module 7;

[0068] The radiation of the object to be measured enters the measuring device using an optical imaging objective 2;

[0069] The snapshot spectral imaging module 3 processes the light radiation passing through the optical imaging objective lens 2, and fuses the spectral information containing the radiation of the measured object with the two-dimensional spatial information to form a two-dimensional image. Then, the high-speed area array image sensor 4 converts the light radiation information into a digital image, and the image acquisition and storage module 5 acquires and stores the digital image. The image acquisition and storage module 5 controls the high-speed area array image sensor 4. The image processing module 6 inverts the spectral information and spatial distribution information of the measured object from the two-dimensional image information generated by the snapshot spectral imaging module 3. The image processing module 6 obtains the spectral image sequence of the measured object at multiple wavelengths at the same time. The temperature inversion module 7 uses the spectral image sequence of the measured object obtained by the image processing module 6, the spectral emissivity model described by the polynomial of the wavelength, and the data fitting method based on the least squares method to obtain the real temperature of the measured object, and at the same time obtains the polynomial coefficients of the spectral reflectivity model. Among them, the bandpass filter 1 combined with the high-speed area array image sensor 4 will limit the working section of the temperature measuring device.

[0070] Furthermore, the bandpass filter 1 is combined with the high-speed area array image sensor 4 to limit the working range of the temperature measuring device to 800nm ​​to 2500nm.

[0071] Furthermore, the image acquisition storage module 5 includes an electronic shutter, exposure time, frame rate, and image acquisition area that control the high-speed area array image sensor 4 .

[0072] Furthermore, the snapshot spectral imaging module 3 further includes a sequentially arranged microlens array 31, a linear polarization polarizer 32, a Nomarski prism 33, an achromatic λ / 2 wave plate 34, another Nomarski prism 35, an analyzer 36 and a focal plane 37, and also includes the snapshot spectral imaging module 3. The method steps for improving the temperature inversion accuracy are as follows:

[0073] The microlens array 31 decomposes the incident light radiation into M×N array sub-beams;

[0074] The array sub-beam light passes through the linear polarization polarizer 32 and enters the first optical wedge of the Nomarski prism 33 and is decomposed into two beams of light, namely, the o-light and the e-light. The o-light is sub-beam I, and the e-light is sub-beam II.

[0075] After the two beams of light pass through the first optical wedge of the Nomarski prism 33 and enter the second optical wedge, the difference in optical delay between sub-beam I and sub-beam II is δ;

[0076] The light radiation passes through the achromatic λ / 2 wave plate 34, and the polarization directions of sub-beam I and sub-beam II are independently rotated by π / 2;

[0077] After passing through another Nomarski prism 35 and passing through the analyzer 36, the optical delay difference between the sub-beam I and the sub-beam II will be doubled to 2δ, which is beneficial to improve the spectral resolution of the snapshot type spectral imaging module 3, thereby obtaining a more accurate radiation value of the measured object at a single wavelength, improving the accuracy of temperature inversion, and forming interference fringes on the focal plane 37;

[0078] The image acquisition and storage module 5, the image processing module 6 and the temperature inversion module 7 invert the spectrum information and spatial distribution information of the object under test based on the wavelength information and spatial distribution information of the light radiation contained in the Fourier transform and the interference fringes.

[0079] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A transient temperature measurement device based on snapshot spectral imaging technology, characterized in that: The measuring device for measuring the transient temperature of a measured object comprises a bandpass filter (1), an optical imaging objective lens (2), a snapshot spectral imaging module (3), a high-speed array image sensor (4), an image acquisition storage module (5), an image processing module (6) and a temperature inversion module (7); The bandpass filter (1) is combined with a high-speed area array image sensor (4) to limit the working wavelength band of the measuring device, to select light radiation within the working wavelength range, and to cut off light radiation outside the working wavelength range; The optical imaging objective lens (2) is used to collect the optical radiation of the object to be measured and enter it into the measuring device; The snapshot spectral imaging module (3) is used to fuse the spectral information and two-dimensional spatial information of the object under test through the optical imaging objective lens (2) to form a two-dimensional image, so as to realize simultaneous detection of the two-dimensional spatial information and spectral information of the object under test in a single exposure; The high-speed area array image sensor (4) is used to convert the two-dimensional image into a digital image, wherein the digital image includes light radiation information, and the high-speed area array image sensor (4) is used to detect the instantaneous temperature field change process of the object under test with a time resolution better than microsecond level; The image acquisition storage module (5) stores the digital image and controls the high-speed array image sensor (4) at the same time. The image acquisition storage module (5) includes an electronic shutter, exposure time, frame rate, and image acquisition area for controlling the high-speed array image sensor (4); The image processing module (6) is used to invert the two-dimensional image to obtain the spectral information and spatial distribution information of the object under test, wherein the spectral information and spatial distribution information include a spectral image sequence of the object under test at multiple wavelengths at the same time; The temperature inversion module (7) calculates the polynomial coefficients of the spectrum reflectance model including the real temperature of the measured object and the spectrum reflectance model based on the spectrum image sequence and in combination with the spectrum emissivity model described by the polynomial about the wavelength and the least square method; The snapshot type spectral imaging module (3) further comprises a microlens array (31), a linear polarization polarizer (32), a Nomarski prism (33), an analyzer (36) and a focal plane (37) which are arranged in sequence; The microlens array (31) is used to decompose incident light into M×N array sub-beams; The linear polarization polarizer (32) is used to generate linear polarized light, and the vibration direction is 45° with the optical axis of the Nomarski prism (33); The linearly polarized light of the array sub-beam passes through two mutually perpendicular optical wedges of the Nomarski prism (33) and is decomposed into two beams of light, namely, o light and e light. The o light in the first optical wedge of the Nomarski prism (33) is sub-beam I, and the e light is sub-beam II. After entering the second optical wedge, the o light is converted into e light, and the e light is converted into o light. The Nomarski prism (33) is used to generate an optical delay difference δ between sub-beam I and sub-beam II; The polarizer (36) has a transmission direction parallel to the linear polarizer (32) and is used to form interference fringes on the focal plane (37) after transmitting sub-beams I and II; The snapshot spectral imaging module (3) further comprises an achromatic λ / 2 wave plate (34) and another Nomarski prism (35); An achromatic λ / 2 wave plate (34) and another Nomarski prism (35) are sequentially added between the Nomarski prism (33) and the analyzer (36), wherein the achromatic λ / 2 wave plate (34) is used to independently rotate the polarization directions of the sub-beams I and II, respectively, with a rotation magnitude of π / 2; The other Nomarski prism (35) is used to double the optical path difference between sub-beam I and sub-beam II. After doubling, the difference in optical delay between sub-beam I and sub-beam II is 2δ.

2. A transient temperature measurement method based on snapshot spectral imaging technology, characterized in that: The steps of implementing the transient temperature measurement method using the measuring device described in claim 1 are as follows: The measuring device for measuring the transient temperature of a measured object comprises a bandpass filter (1), an optical imaging objective lens (2), a snapshot spectral imaging module (3), a high-speed array image sensor (4), an image acquisition storage module (5), an image processing module (6) and a temperature inversion module (7); The optical radiation of the object to be measured is collected by an optical imaging objective lens (2) and enters into a measuring device; The snapshot spectral imaging module (3) processes the light radiation transmitted through the optical imaging objective lens (2), and fuses the spectral information of the radiation of the measured object with the two-dimensional spatial information to form a two-dimensional image. Then, the high-speed array image sensor (4) converts the light radiation information into a digital image, and the image acquisition and storage module (5) acquires and stores the digital image. The image acquisition and storage module (5) controls the high-speed array image sensor (4). The image processing module (6) inverts the spectral information and spatial distribution information of the measured object from the two-dimensional image information generated by the snapshot spectral imaging module (3). The image processing module (6) obtains a spectral image sequence of the measured object at multiple wavelengths at the same time. The temperature inversion module (7) obtains the real temperature of the measured object using the spectral image sequence of the measured object obtained by the image processing module (6), a spectral emissivity model described by a polynomial about wavelength, and a data fitting method based on the least squares method, and simultaneously obtains the polynomial coefficients of the spectral reflectivity model. The bandpass filter (1) is combined with the high-speed array image sensor (4) to limit the working band of the temperature measuring device.

3. The transient temperature measurement method based on snapshot spectral imaging technology according to claim 2 is characterized in that: The bandpass filter (1) is combined with a high-speed area array image sensor (4) to limit the working range of the temperature measuring device to 800nm ​​to 2500nm.

4. The transient temperature measurement method based on snapshot spectral imaging technology according to claim 2 is characterized in that: The image acquisition storage module (5) comprises an electronic shutter, exposure time, frame rate and image acquisition area for controlling the high-speed area array image sensor (4).

5. The transient temperature measurement method based on snapshot spectral imaging technology according to claim 2 is characterized in that: The snapshot spectral imaging module (3) further comprises a microlens array (31), a linear polarization polarizer (32), a Nomarski prism (33), an achromatic λ / 2 wave plate (34), another Nomarski prism (35), an analyzer (36) and a focal plane (37) arranged in sequence, and further comprises a snapshot spectral imaging module (3). The method steps for improving the temperature inversion accuracy are as follows: The microlens array (31) decomposes the incident light radiation into M×N array sub-beams; The array sub-beam light passes through the linear polarization polarizer (32) and enters the first optical wedge of the Nomarski prism (33) and is decomposed into two beams of light, namely, o light and e light, wherein the o light is sub-beam I and the e light is sub-beam II; After the two beams of light pass through the first optical wedge of the Nomarski prism (33) and enter the second optical wedge, the difference in optical delay between sub-beam I and sub-beam II is δ; The light radiation passes through an achromatic λ / 2 wave plate (34), and the polarization directions of sub-beams I and II are independently rotated by π / 2; After passing through another Nomarski prism (35) and passing through the analyzer (36) to reach the focal plane (37), the optical delay difference between sub-beam I and sub-beam II will be doubled to 2δ; and interference fringes will be formed on the focal plane (37); The image acquisition storage module (5), the image processing module (6) and the temperature inversion module (7) invert the spectrum information and spatial distribution information of the measured object based on Fourier transformation and the wavelength information and spatial distribution information of the light radiation contained in the stripes.

Images