A measurement environment control device for VP vertical pendulum inclinometer

Abstract

The invention provides a measurement environment control device for a VP vertical pendulum inclinometer, comprising a base, a pendulum body, a first box, a second box, an insulating component and a constant temperature module, wherein the pendulum body is arranged on the base; the first box is hollow inside, and one end of the first box has a first opening; the second box is hollow inside, and one end of the second box has a second opening; the insulating component has a first end face and a second end face, and the first end face of the insulating component is fixedly connected to the base; the second end face of the insulating component is fixedly connected to the pendulum body; the first box and the second box are both fixedly arranged on the base, and the first box and the base are combined to form a first cavity, the insulating component and the pendulum body are both located in the first cavity, and the insulating component is sealed and connected to the first opening of the first box; the second box and the base are combined to form a second cavity, and the first box is located in the second cavity; the constant temperature module is arranged on the base, and keeps the temperature in the first cavity in a working state constant.

Description

Technical Field

[0001] The invention relates to the technical field of vertical pendulum inclinometers, and in particular to a measurement environment control device for a VP vertical pendulum inclinometer. Background Art

[0002] Inclinometer is a basic instrument for measuring solid tide and earthquake observation, and is also the most commonly used geophysical field observation instrument among deformation instruments. The observation data of crustal deformation by high-precision inclinometers show that the earth has elastic properties and crustal deformation is affected by many factors, including solid tide, ocean tide, geological deformation, meteorological pressure, hydrological disturbance, and crustal movement caused by the action of the earth's interior. As a geodynamic instrument, high-precision inclinometer plays an important role in observing and studying crustal deformation.

[0003] At present, more than 200 sets of vertical pendulum inclinometers have been promoted and applied in my country's seismic system. The instrument parameter indicators of some stations in operation are good, while some cannot reach the expected indicators. The main reason is the influence of the working environment on the instrument. These influencing factors include the size and integrity of the mountain bedrock, the daily change of the cave environment temperature, and the influence of changes in environmental air pressure and humidity. Among them, the size and integrity of the mountain bedrock are conditions that have been determined long ago when the station was selected, and are uncontrollable factors. Other factors such as changes in ambient temperature, air pressure and humidity will also directly affect the performance and working life of the instrument. Changes in air pressure and temperature cause zero bias drift in the instrument, poor zero bias stability, and increased measurement errors; while high humidity will directly lead to problems such as corrosion of the sensor wire, increase in capacitance medium, and even instrument failure. Therefore, the control of the measurement environment is the basis for achieving high-precision measurement, which has basic research significance. It ensures that changes in the external environment will not affect the pendulum and sensor, and can improve the scope of application and reliability of the vertical pendulum. Summary of the invention

[0004] In view of this, the present invention proposes a measurement environment control device for a VP vertical pendulum inclinometer which can maintain a relatively stable measurement environment and is free from environmental interference.

[0005] The technical solution of the present invention is implemented as follows: The present invention provides a measurement environment control device for a VP vertical pendulum inclinometer, comprising a base (1) and a pendulum body (2), wherein the pendulum body (2) is arranged on the base (1); characterized in that it also comprises a first box body (3), a second box body (4), a heat insulating component (5) and a constant temperature module (6);

[0006] The first box body (3) is hollow inside, and one end of the first box body (3) has a first opening;

[0007] The second box body (4) is hollow inside, and one end of the second box body (4) has a second opening;

[0008] The heat insulating component (5) has a first end surface and a second end surface, the first end surface of the heat insulating component (5) is fixedly connected to the base (1); the second end surface of the heat insulating component (5) is fixedly connected to the pendulum body (2);

[0009] The first box (3) and the second box (4) are both fixedly arranged on the base (1), and the first box (3) and the base (1) are combined to form a first cavity, the heat insulating component (5) and the pendulum (2) are both located in the first cavity, and the heat insulating component (5) is sealedly connected to the first opening of the first box (3); the second box (4) and the base (1) are combined to form a second cavity, and the first box (3) is located in the second cavity; the constant temperature module (6) is arranged on the base (1) and keeps the temperature in the first cavity in a working state constant.

[0010] On the basis of the above technical solution, preferably, the constant temperature module (6) includes a voltage-stabilized power supply unit, a temperature measuring element, a signal conditioning unit, an MCU and a temperature control unit; the output end of the voltage-stabilized power supply unit is electrically connected to the temperature measuring element, the signal conditioning unit, the MCU and the temperature control unit respectively; the signal conditioning unit receives the output signal of the temperature measuring element, outputs it to the MCU after AD conversion, the output end of the MCU is electrically connected to the temperature control unit, and the MCU maintains or switches the working state of the temperature control unit to keep the temperature in the first cavity constant.

[0011] Further preferably, the voltage-stabilized power supply unit includes a first dual-channel precision operational amplifier U1, a second dual-channel precision operational amplifier U2 and an electric heater H; the positive power supply terminal of the second dual-channel precision operational amplifier U2 and the collector of the transistor Q1 are both electrically connected to the +15V power supply, and the inverting input terminal of the second dual-channel precision operational amplifier U2 is grounded; the output terminal of the second dual-channel precision operational amplifier U2 is electrically connected to its in-phase input terminal and the base and collector of the transistor Q2, respectively, and the collector of the transistor Q2 is electrically connected to the first dual-channel precision operational amplifier The non-inverting input terminal of U1 is electrically connected, the base of the transistor Q2 is also electrically connected to the inverting input terminal of the first dual-channel precision operational amplifier U1, the output terminal of the first dual-channel precision operational amplifier U1 is electrically connected to the base of the transistor Q1, and the emitter of the transistor Q1 is electrically connected to the inverting input terminal of the second dual-channel precision operational amplifier U2; the inverting input terminal and the output terminal of the second dual-channel precision operational amplifier U2 are respectively connected in parallel with the two ends of the electric heater H; the output terminal of the second dual-channel precision operational amplifier U2 serves as the output terminal of the voltage-stabilized power supply unit.

[0012] Further preferably, the voltage-stabilized power supply unit also includes a transistor Q3 and a voltage-stabilizer D2, the negative electrode of the voltage-stabilizer D2 is electrically connected to the output end of the second dual-channel precision operational amplifier U2, the positive electrode of the voltage-stabilizer D2 is electrically connected to the base of the transistor Q3, the collector of the transistor Q3 is electrically connected to the in-phase input end of the second dual-channel precision operational amplifier U2, and the emitter of the transistor Q3 is grounded.

[0013] Further preferably, the signal conditioning unit includes an AD conversion module U3, one end of the temperature measuring element is connected in parallel with one end of the voltage-dividing resistor R10 and one end of the capacitor C4 and then electrically connected to the analog signal input end of the AD conversion module U3; the other end of the resistor R10 and the other end of the capacitor C4 are connected in parallel and then grounded; the output end of the AD conversion module U3 is electrically connected to the input end of the MCU.

[0014] Still further preferably, the temperature measuring element is an NTC thermistor, and the MCU is an STM32 single chip microcomputer.

[0015] More preferably, the temperature control unit includes an H-bridge circuit U4 and a semiconductor cooler TEC, the PMW input end of the H-bridge circuit U4 is electrically connected to the PMW output end of the MCU, and the output end of the H-bridge circuit U4 is electrically connected to the semiconductor cooler TEC; the semiconductor cooler TEC is fixedly arranged on the inner surface of the first box (3).

[0016] Further preferably, the second cavity between the first box (3) and the second box (4) is a vacuum.

[0017] The measurement environment control device of a VP vertical pendulum inclinometer provided by the present invention has the following beneficial effects compared with the prior art:

[0018] (1) The present invention isolates the pendulum body by using two mutually separated first and second boxes to prevent the pendulum body from being directly affected by the external environment; in addition, a heat insulating component and a constant temperature module are arranged in the first box, so that the working environment of the pendulum body in the first box remains relatively stable;

[0019] (2) The constant temperature module is equipped with a voltage-stabilized power supply unit to provide a stable reference voltage and operating voltage for subsequent equipment;

[0020] (3) The signal conditioning unit performs AD conversion on the temperature change signal detected by the temperature measuring element and then inputs it into the MCU;

[0021] (4) The MCU controls the temperature control unit to maintain or switch the working state according to the result of the AD conversion to maintain the temperature inside the first box;

[0022] (5) There is a vacuum between the first box and the second box, which can provide good heat insulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A half-section front view of a measuring environment control device of a VP vertical pendulum inclinometer of the present invention;

[0025] Figure 2 A top view of a measuring environment control device of a VP vertical pendulum inclinometer according to the present invention;

[0026] Figure 3 A wiring diagram of a voltage-stabilized power supply unit of a constant temperature module of a measurement environment control device of a VP vertical pendulum inclinometer of the present invention;

[0027] Figure 4 A wiring diagram of a signal conditioning unit of a constant temperature module of a measurement environment control device of a VP vertical pendulum inclinometer of the present invention;

[0028] Figure 5 A wiring diagram of a signal conditioning unit and an MCU of a constant temperature module of a measurement environment control device of a VP vertical pendulum inclinometer of the present invention;

[0029] Figure 6 The present invention discloses a wiring diagram of the MCU and the temperature control unit of a constant temperature module of a measurement environment control device of a VP vertical pendulum inclinometer. DETAILED DESCRIPTION

[0030] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] like Figure 1 and Figure 2 As shown, the present invention provides a measurement environment control device for a VP vertical pendulum inclinometer, comprising a base 1, a pendulum body 2, a first box body 3, a second box body 4, an insulation component 5 and a constant temperature module 6; the pendulum body 2 is arranged on the base 1. The pendulum body 2 of the vertical pendulum inclinometer is a core detection component, and the postures of the base 1 and the pendulum body 2 can be adjusted by adjusting the legs on the base 1.

[0032] The first box body 3 is hollow inside, and one end of the first box body 3 has a first opening;

[0033] The second box body 4 is hollow inside, and one end of the second box body 4 has a second opening;

[0034] The above-mentioned heat insulating component 5 has a first end surface and a second end surface. The first end surface of the heat insulating component 5 is fixedly connected to the base 1; the second end surface of the heat insulating component 5 is fixedly connected to the pendulum body 2;

[0035] The first box 3 and the second box 4 are both fixedly arranged on the base 1, and the first box 3 and the base 1 are enclosed to form a first cavity, the heat insulating component 5 and the pendulum 2 are both located in the first cavity, and the heat insulating component 5 is sealed and connected to the first opening of the first box 3; the second box 4 and the base 1 are enclosed to form a second cavity, and the first box 3 is located in the second cavity; the constant temperature module 6 is arranged on the base 1, and keeps the temperature in the first cavity in the working state constant. Figure 1 As shown, the heat-insulating component 5 is arranged between the pendulum body 2 and the base 1, and the two are formed into a whole, and play the effect of preventing heat transfer. The first opening of the first box body 3 is buckled on the pendulum body 2 and the heat-insulating component 5, and a closed first cavity is formed inside. The second box body 4 is further buckled outside the first box body 3 to further insulate the first box body 3, the heat-insulating component 5 and the pendulum body 2. The constant temperature module 6 can adjust the temperature inside the first cavity.

[0036] In the present invention, the constant temperature module 6 includes a voltage-stabilized power supply unit, a temperature measuring element, a signal conditioning unit, an MCU and a temperature control unit; the output end of the voltage-stabilized power supply unit is electrically connected to the temperature measuring element, the signal conditioning unit, the MCU and the temperature control unit respectively; the signal conditioning unit receives the output signal of the temperature measuring element, and outputs it to the MCU after AD conversion, the output end of the MCU is electrically connected to the temperature control unit, and the MCU maintains or switches the working state of the temperature control unit to keep the temperature in the first cavity constant.

[0037] like Figure 3As shown, specifically, the voltage-stabilized power supply unit includes a first dual-channel precision operational amplifier U1, a second dual-channel precision operational amplifier U2 and an electric heater H; the positive power supply terminal of the second dual-channel precision operational amplifier U2 and the collector of the transistor Q1 are both electrically connected to the +15V power supply, and the inverting input terminal of the second dual-channel precision operational amplifier U2 is grounded; the output terminal of the second dual-channel precision operational amplifier U2 is electrically connected to its non-inverting input terminal and the base and collector of the transistor Q2, respectively, the collector of the transistor Q2 is electrically connected to the non-inverting input terminal of the first dual-channel precision operational amplifier U1, the base of the transistor Q2 is also electrically connected to the inverting input terminal of the first dual-channel precision operational amplifier U1, and the output terminal of the first dual-channel precision operational amplifier U1 is electrically connected to the inverting input terminal of the first dual-channel precision operational amplifier U1. The output end is electrically connected to the base of the transistor Q1, and the emitter of the transistor Q1 is electrically connected to the inverting input end of the second dual-way precision operational amplifier U2; the inverting input end and the output end of the second dual-way precision operational amplifier U2 are respectively connected in parallel with the two ends of the electric heater H; the output end of the second dual-way precision operational amplifier U2 serves as the output end of the voltage-stabilized power supply unit; in addition, the voltage-stabilized power supply unit also includes a transistor Q3 and a Zener diode D2, the negative electrode of the Zener diode D2 is electrically connected to the output end of the second dual-way precision operational amplifier U2, the positive electrode of the Zener diode D2 is electrically connected to the base of the transistor Q3, the collector of the transistor Q3 is electrically connected to the non-inverting input end of the second dual-way precision operational amplifier U2, and the emitter of the transistor Q3 is grounded.

[0038] Depend on Figure 3It can be seen that the second dual-channel precision operational amplifier U2 is powered by a +15V single power supply. The output signal of the second dual-channel precision operational amplifier U2 is input into the inverting input terminal of the first dual-channel precision operational amplifier U1 and the base of the transistor Q2 after voltage division by resistors R3, R8 and R4. After the transistor Q2 is turned on, the collector of the transistor Q2 amplifies the signal and enters the non-inverting input terminal of the first dual-channel precision operational amplifier U1. Subsequently, the output signal of the first dual-channel precision operational amplifier U1 is amplified by resistor R6 and transistor Q1 and then returned through resistor R1 as the inverting input signal of the second dual-channel precision operational amplifier U2, and as a negative feedback signal, it returns to the inverting input terminal of the first dual-channel precision operational amplifier U1 through capacitor C1 and resistor R5; resistors R2, R7 and R9 play a current limiting role. The output signal of the second dual-channel precision operational amplifier U2 is also input into the base of the transistor Q3 through the inverting voltage regulator D2, and the collector output signal of the transistor Q3 flows into the non-inverting input terminal of the second dual-channel precision operational amplifier U2. In order to ensure that the second dual-channel precision operational amplifier U2 and the first dual-channel precision operational amplifier U1 do not experience temperature drift, the voltage-stabilized power supply unit is equipped with a heater H, which can heat the second dual-channel precision operational amplifier U2 and the first dual-channel precision operational amplifier U1, so that the second dual-channel precision operational amplifier U2 can stably output a 7V DC voltage. The second dual-channel precision operational amplifier U2 and the first dual-channel precision operational amplifier U1 can be integrated in an LT1013 voltage amplifier. When the output voltage remains unchanged, the second dual-channel precision operational amplifier U2 plays a voltage follower role. Diodes D1 and D3 protect the circuit.

[0039] like Figure 4 and Figure 5As shown, the signal conditioning unit includes an AD conversion module U3, one end of the temperature measuring element is connected in parallel with one end of the voltage-dividing resistor R10 and one end of the capacitor C4, and then electrically connected to the analog signal input end of the AD conversion module U3; the other end of the resistor R10 and the other end of the capacitor C4 are connected in parallel and then grounded; the output end of the AD conversion module U3 is electrically connected to the input end of the MCU. The AD conversion module U3 can use AD7606, which is an 8-channel high-speed AD conversion chip. The temperature measuring element is an NTC thermistor, and the MCU is an STM32 microcontroller. As can be seen from the figure, the analog input terminals V1-V8 of the AD conversion module U3 are electrically connected to the output terminals of the temperature measuring element, and the DB0-DB15 ports, / RD / CLK port, / CS port, BUSY port, RESET port, OS2-OS0 ports of the AD conversion module U3 are electrically connected to the PC0-PC15 ports, PD4 port, PD5 port, PD6 port, PD7 port, PD8 port, PD9 port and PD10 port of the MCU respectively; CONVST_A and CONVST_B of the AD conversion module U3 are electrically connected to the PD11 port of the MCU. Of course, the selection of the above port connection methods is only for reference.

[0040] like Figure 6 As shown, the temperature control unit includes an H-bridge circuit U4 and a semiconductor cooler TEC, the PMW input end of the H-bridge circuit U4 is electrically connected to the PMW output end of the MCU, and the output end of the H-bridge circuit U4 is electrically connected to the semiconductor cooler TEC; the semiconductor cooler TEC is fixedly arranged on the inner surface of the first box (3). The H-bridge circuit U4 is a DRB592, which receives the PMW control signal sent by the MCUPB13 and PA8 ports, and outputs the PMW signal to the semiconductor cooler TEC through its OUT+ and OUT- ports. The capacitor C6 and inductor L1, capacitor C7 and inductor L2 in the circuit all play a frequency selection role.

[0041] In order to further improve the heat insulation effect of the second box body 4, the second cavity between the first box body 3 and the second box body 4 is vacuum. Of course, it can also be filled with inert gas, which will not be described in detail here.

[0042] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A measuring environment control device for a VP vertical pendulum inclinometer, comprising a base (1) and a pendulum body (2), wherein the pendulum body (2) is arranged on the base (1); characterized in that: It also includes a first box body (3), a second box body (4), a heat insulating component (5) and a constant temperature module (6); The first box body (3) is hollow inside, and one end of the first box body (3) has a first opening; The second box body (4) is hollow inside, and one end of the second box body (4) has a second opening; The heat insulating component (5) has a first end surface and a second end surface, the first end surface of the heat insulating component (5) is fixedly connected to the base (1); the second end surface of the heat insulating component (5) is fixedly connected to the pendulum body (2); The first box (3) and the second box (4) are both fixedly arranged on the base (1), and the first box (3) and the base (1) are enclosed to form a first cavity, the heat insulating component (5) and the pendulum (2) are both located in the first cavity, and the heat insulating component (5) is sealedly connected to the first opening of the first box (3); the second box (4) and the base (1) are enclosed to form a second cavity, and the first box (3) is located in the second cavity; the constant temperature module (6) is arranged on the base (1) and keeps the temperature in the first cavity in a working state constant; The constant temperature module (6) comprises a voltage-stabilized power supply unit, a temperature measuring element, a signal conditioning unit, an MCU and a temperature control unit; the output end of the voltage-stabilized power supply unit is electrically connected to the temperature measuring element, the signal conditioning unit, the MCU and the temperature control unit respectively; the signal conditioning unit receives the output signal of the temperature measuring element, outputs it to the MCU after AD conversion, the output end of the MCU is electrically connected to the temperature control unit, and the MCU maintains or switches the working state of the temperature control unit, so that the temperature in the first cavity is kept constant; The voltage-stabilized power supply unit includes a first dual-channel precision operational amplifier U1, a second dual-channel precision operational amplifier U2 and an electric heater H; the positive power supply terminal of the second dual-channel precision operational amplifier U2 and the collector of the transistor Q1 are both electrically connected to the +15V power supply, and the inverting input terminal of the second dual-channel precision operational amplifier U2 is grounded; the output terminal of the second dual-channel precision operational amplifier U2 is electrically connected to its inverting input terminal and the base and collector of the transistor Q2, respectively, and the collector of the transistor Q2 is electrically connected to the positive input terminal of the first dual-channel precision operational amplifier U1. The in-phase input terminal is electrically connected, the base of the transistor Q2 is also electrically connected to the inverting input terminal of the first dual-channel precision operational amplifier U1, the output terminal of the first dual-channel precision operational amplifier U1 is electrically connected to the base of the transistor Q1, and the emitter of the transistor Q1 is electrically connected to the inverting input terminal of the second dual-channel precision operational amplifier U2; the inverting input terminal and the output terminal of the second dual-channel precision operational amplifier U2 are respectively connected in parallel with the two ends of the electric heater H; the output terminal of the second dual-channel precision operational amplifier U2 serves as the output terminal of the voltage-stabilized power supply unit; The signal conditioning unit includes an AD conversion module U3, one end of the temperature measuring element is connected in parallel with one end of the voltage dividing resistor R10 and one end of the capacitor C4 and then electrically connected to the analog signal input end of the AD conversion module U3; the other end of the resistor R10 and the other end of the capacitor C4 are connected in parallel and then grounded; the output end of the AD conversion module U3 is electrically connected to the input end of the MCU; The temperature control unit comprises an H-bridge circuit U4 and a semiconductor cooler TEC, wherein a PMW input end of the H-bridge circuit U4 is electrically connected to a PMW output end of the MCU, and an output end of the H-bridge circuit U4 is electrically connected to the semiconductor cooler TEC; the semiconductor cooler TEC is fixedly arranged on the inner surface of the first box (3); The second cavity between the first box (3) and the second box (4) is vacuum.

2. The measurement environment control device of a VP vertical pendulum inclinometer according to claim 1, characterized in that: The voltage-stabilized power supply unit also includes a transistor Q3 and a voltage-stabilizing tube D2, the cathode of the voltage-stabilizing tube D2 is electrically connected to the output end of the second dual-channel precision operational amplifier U2, the anode of the voltage-stabilizing tube D2 is electrically connected to the base of the transistor Q3, the collector of the transistor Q3 is electrically connected to the in-phase input end of the second dual-channel precision operational amplifier U2, and the emitter of the transistor Q3 is grounded.

3. The measurement environment control device of a VP vertical pendulum inclinometer according to claim 1, characterized in that: The temperature measuring element is an NTC thermistor, and the MCU is an STM32 single-chip microcomputer.

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