Electrical box and heat exchange equipment equipped therewith

Abstract

The present invention relates to an electrical box and a heat exchange device provided with the same, the electrical box comprising: a main box body, provided with a receiving cavity for receiving electronic components; a heat-conducting structure, provided in the receiving cavity, one end of the heat-conducting structure being used for contacting with the surface of the electronic components, the other end of the heat-conducting structure being in contact with the cavity wall surface of the receiving cavity, the thermal conductivity of the heat-conducting structure being higher than the thermal conductivity of air; and a heat dissipation structure, provided on the outer side of the cavity wall of the receiving cavity contacting the heat-conducting structure. The above-mentioned electrical box utilizes the heat-conducting structure in contact with the surface of the electronic components to efficiently dissipate the heat of the electronic components, so that the electrical box can be completely sealed while avoiding the burning of the electronic components due to excessive temperature caused by untimely heat dissipation.

Description

Technical Field

[0001] The present invention relates to the technical field of heat exchange equipment, in particular to an electrical appliance box and heat exchange equipment provided with the same. Background Art

[0002] With the progress of society and the improvement of science and technology, the application of air conditioners that can adjust the indoor temperature is becoming more and more extensive, greatly improving the comfort of people's production and life. For air conditioner electrical boxes installed with a variety of electronic components, the working environment is more complex, and open electrical boxes are not enough to meet the protection needs of electronic components. Therefore, closed electrical boxes are increasingly widely used. Electronic components are sealed in closed electrical boxes to avoid damage and extend the service life of electronic components.

[0003] However, since the closed electrical box has a very poor heat dissipation effect and the electronic components generate a lot of heat, it is easy for the closed electrical box to heat up quickly. If the temperature of the closed electrical box is not reduced in time, the electronic components will easily burn out, thereby affecting the use of the air-conditioning equipment. Summary of the invention

[0004] Based on this, it is necessary to provide a closed electrical box with better heat dissipation effect and a heat exchange device equipped with the closed electrical box to address the problem of poor heat dissipation effect of the closed electrical box.

[0005] An electrical box for accommodating electronic components, the electrical box comprising:

[0006] The main box body is provided with a receiving cavity for receiving the electronic components;

[0007] a heat-conducting structure disposed in the accommodating cavity, wherein one end of the heat-conducting structure is used to contact the surface of the electronic component, and the other end of the heat-conducting structure is in contact with the cavity wall surface of the accommodating cavity, and the thermal conductivity of the heat-conducting structure is higher than the thermal conductivity of air; and

[0008] The heat dissipation structure is arranged on the outer side of the cavity wall of the accommodating cavity contacting the heat conducting structure.

[0009] The electrical box uses a heat-conducting structure in contact with the surface of the electronic components to efficiently dissipate heat from the electronic components, thereby making the electrical box completely sealed while preventing the electronic components from being burned due to excessive temperature due to untimely heat dissipation.

[0010] In one embodiment, the heat-conducting structure includes a first heat-conducting member, the first heat-conducting member includes a first heat-conducting portion, a first heat-conducting groove with a bottom wall is formed on a surface of the first heat-conducting portion facing the electronic component, the first heat-conducting groove is used to accommodate the electronic component, and the bottom wall of the first heat-conducting groove can be in surface contact with the electronic component.

[0011] In one embodiment, the heat-conducting structure also includes a second heat-conducting member, which is arranged on the side of the first heat-conducting member facing the electronic components. The second heat-conducting member includes a second heat-conducting member body and a heat-conducting filling portion. The second heat-conducting member body is penetrated by a second heat-conducting groove, and the second heat-conducting groove is used to accommodate the electronic components. The heat-conducting filling portion is formed by solidifying the heat dissipation medium poured into the second heat-conducting groove.

[0012] In one embodiment, the first heat-conducting member further includes a second heat-conducting portion, and a surface of the second heat-conducting portion facing the second heat-conducting member is in surface contact with the heat-conducting filling portion.

[0013] In one embodiment, a second avoidance groove is formed through the second heat-conducting member body, and the second avoidance groove allows the electronic component to extend out of the second heat-conducting member body.

[0014] In one embodiment, the first heat conducting member further includes a first avoidance portion, the first avoidance portion is penetrated by a first avoidance groove, and the first avoidance groove allows the electronic component to extend out of the first avoidance portion.

[0015] In one embodiment, the heat-conducting structure further includes a third heat-conducting member, and the third heat-conducting member is formed by solidifying a heat dissipation medium coated on the surface of the electronic component.

[0016] In one of the embodiments, the heat-conducting structure further includes a heat-conducting plate, which is located on a side of the heat-conducting structure away from the electronic components and in contact with a cavity wall surface of the accommodating cavity.

[0017] In one of the embodiments, the heat dissipation structure includes fins and a fin protection cover plate, the fin protection cover plate is spaced apart from the outer surface of the main box body, and a plurality of fins are installed between the fin protection cover plate and the outer surface of the main box body.

[0018] A heat exchange device comprises the above-mentioned electrical box.

[0019] In one of the embodiments, the heat exchange device includes an exhaust device, the exhaust device is directed toward the heat dissipation structure, and the airflow generated by the exhaust device flows through the heat dissipation structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the structure of an electrical box and an exhaust device according to an embodiment of the present invention;

[0021] Figure 2 for Figure 1 An exploded view of the electrical box shown;

[0022] Figure 3 It is a structural schematic diagram of an electrical box and an exhaust device according to another embodiment of the present invention;

[0023] Figure 4 A schematic structural diagram of a first heat conducting member according to an embodiment of the present invention;

[0024] Figure 5 A schematic structural diagram of a second heat conducting member according to an embodiment of the present invention;

[0025] Figure 6 for Figure 5 The schematic diagram of the installation of the second heat conducting member is shown;

[0026] Figure 7 FIG. 4 is a schematic diagram of installing a third heat conducting member according to an embodiment of the present invention.

[0027] Description of reference numerals:

[0028] 100, electrical box; 20, main box body; 21, bottom wall of box body; 23, side wall of box body; 25, top wall of box body; 40, heat conduction structure; 41, first heat conduction member; 412, first heat conduction part; 414, second heat conduction part; 416, first avoidance part; 4161, first avoidance groove; 43, second heat conduction member; 432, second heat conduction member main body; 4321, second heat conduction groove; 4323, second avoidance groove; 45, third heat conduction member; 47, heat conduction plate; 60, heat dissipation structure 60; 61, fin; 63, fin protection plate; 70, circuit board; 80, electronic components; 200, exhaust device. DETAILED DESCRIPTION

[0029] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0030] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0032] like Figure 1 and Figure 2 As shown, a heat exchange device (not shown) of an embodiment of the present invention includes an electrical box 100 for accommodating electronic components 80. The structure of the electrical box 100 in the present application is described below by taking the heat exchange device as an air conditioning system as an example. This embodiment is only used as an example and does not limit the technical scope of the present application. It can be understood that in other embodiments, the heat exchange device can also be specifically other equipment equipped with the electrical box 100, which is not limited here.

[0033] The electrical box 100 is arranged on one side of the exhaust device 200 of the heat exchange equipment, and includes a main box body 20, a heat-conducting structure 40 and a heat dissipation structure 60. The electronic components 80 are accommodated in the main box body 20, and the heat generated by the electronic components 80 is transferred to the heat dissipation structure 60 through the heat-conducting structure 40. The gas flow brought by the side negative pressure of the air-conditioning system and the air flow brought by the forced exhaust of the exhaust device 200 can quickly take away the heat of the electrical box 100 to prevent the electrical box 100 from overheating. Among them, the specific structure of the exhaust device 200 is not limited. Specifically, in one embodiment, the exhaust device 200 includes three fans arranged longitudinally.

[0034] like Figure 3 As shown, in some other embodiments, the electrical box 100 is provided with two main box bodies 20, the two main box bodies 20 share a heat dissipation structure 60, the two main box bodies 20 are stacked, and a heat dissipation structure 60 is located between the two main box bodies 20, so as to simultaneously dissipate heat for the two main box bodies 20. The exhaust device 200 is located on the same side of the two main box bodies 20 and faces the side of the heat dissipation structure 60 to quickly take away the heat of the electrical box 100.

[0035] Please refer again Figure 1 and Figure 2 The main box body 20 is generally in a cubic shell structure, including a box body bottom wall 21, a box body side wall 23 extending from the edge of the box body bottom wall 21 in the same direction, and a box body top wall 25 covering the box body side wall 23 away from the box body bottom wall 21. The box body bottom wall 21, the box body side wall 23 and the box body top wall 25 together enclose a closable accommodation cavity for accommodating electronic components 80. The electronic components 80 are mounted on the circuit board 70, and the circuit board 70 is fixed on the box body bottom wall 21. In this way, the electronic components 80 are completely accommodated in the accommodation cavity of the main box body 20.

[0036] Further, in some embodiments, the main box body 20 is at least partially formed of a semiconductor material, so as to have a higher thermal conductivity, further improving the heat dissipation speed of the electrical box 100. It is understood that the material forming the main box body 20 is not limited thereto, and can be set according to different needs, for example, it can be a metal material with good thermal conductivity.

[0037] The heat-conducting structure 40 is arranged in the accommodating cavity of the main box body 20. One end of the heat-conducting structure 40 is used to contact the surface of the electronic component 80, and the other end of the heat-conducting structure 40 contacts the cavity wall of the accommodating cavity. The thermal conductivity of the heat-conducting structure 40 is higher than the thermal conductivity of air.

[0038] In this way, while the accommodating cavity can be closed to reduce noise, the heat generated by the electronic component 80 can be transferred to the main box body 20 through the heat-conducting structure 40. Since the thermal conductivity of the heat-conducting structure 40 is greater than the thermal conductivity of air, the cooling speed of the electronic component 80 can be increased. Moreover, since the heat-conducting structure 40 and the electronic component 80 are in surface contact, there is a larger heat transfer area, which further increases the heat transfer speed.

[0039] Specifically, the heat-conducting structure 40 includes a first heat-conducting member 41, a second heat-conducting member 43, a third heat-conducting member 45 and a heat-conducting plate 47 of different shapes. The first heat-conducting member 41, the second heat-conducting member 43 and the third heat-conducting member 45 can cooperate with electronic components 80 of different shapes and distribution patterns to transfer the heat of the electronic components 80 to the heat-conducting plate 47, and then transfer the heat from the heat-conducting plate 47 to the cavity wall of the accommodating cavity, so that the electronic components 80 in the main box body 20 can be effectively cooled.

[0040] like Figure 2 and Figure 4 As shown, the first heat conductor 41 is used to dissipate heat from electronic components 80 such as large chokes with large structural spans and large curvature radii (for example, the diameter of a large choke is usually greater than 50 mm, and the distance between two large chokes is greater than 12 mm).

[0041] Specifically, the first heat-conducting member 41 includes a first heat-conducting portion 412, a second heat-conducting portion 414 and a first avoidance portion 416 that are interconnected. Among them, a first heat-conducting groove 4121 with a bottom wall is provided on a side surface of the first heat-conducting portion 412 facing the electronic component 80, and the shape of the first heat-conducting groove 4121 matches the shape of the corresponding electronic component 80. The second heat-conducting portion 414 is provided on one side of the first heat-conducting portion 412, and a side surface of the second heat-conducting portion 414 is in surface contact with the second heat-conducting member 43, thereby transferring the heat of the second heat-conducting member 43 to the cavity wall of the accommodating cavity. The first avoidance portion 416 is penetrated by a first avoidance groove 4323 that connects two opposite surfaces, and the first avoidance groove 4323 allows the electronic component 80 to extend out of the first avoidance portion 416 to contact other structures to dissipate heat.

[0042] In this way, electronic components 80 with a large structural span and a large curvature radius, such as a large choke, can be at least partially accommodated in the first heat-conducting groove 4121 and contact the groove wall surface of the first heat-conducting groove 4121. The heat generated by these electronic components 80 can be effectively transferred to the first heat-conducting portion 412, and then transferred to the heat-conducting plate 47 through the first heat-conducting portion 412. Electronic components 80 of other shapes located near electronic components 80 such as large chokes can contact the second heat-conducting member 43 to transfer heat to the first heat-conducting member 41 through the second heat-conducting member 43, or extend out of the first heat-conducting member 41 through the first avoidance portion 416 to directly contact the heat-conducting plate 47.

[0043] like Figure 2 , Figure 5 as well as Figure 6 As shown, the second heat conductor 43 is arranged on the side of the first heat conductor 41 facing the electronic components 80. The second heat conductor 43 is used to dissipate heat from small heat-generating components such as rectifier chips and resistors. These electronic components 80 are small in size (smaller than large chokes), widely distributed, and have a large height difference with other electronic components 80 (the height difference is greater than 10 mm), so it is difficult to match them with the first heat conductor 41.

[0044] The second heat-conducting member 43 includes a second heat-conducting member body 432 and a heat-conducting filling portion. The second heat-conducting member body 432 is penetrated by a second heat-conducting groove 4321 connecting two opposite surfaces of the second heat-conducting member body 432. The second heat-conducting groove 4321 is used to accommodate electronic components 80. The heat-conducting filling portion is formed by solidifying the heat dissipation medium poured into the second heat-conducting groove 4321.

[0045] In this way, the electronic component 80 can be accommodated in the second heat-conducting groove 4321 and completely covered by the heat-conducting filling part, so the electronic component 80 has a large contact area with the heat-conducting filling part, and the heat generated by the electronic component 80 can be efficiently transferred to the heat-conducting filling part. The second heat-conducting part 414 of the first heat-conducting member 41 is in surface contact with the heat-conducting filling part on one side facing the second heat-conducting member 43, and the heat generated by the electronic component 80 is quickly transferred to the second heat-conducting part 414 through the heat-conducting filling part, and then transferred to the cavity wall of the accommodating cavity. Therefore, by filling the heat-conducting filling part, the height difference between the electronic components 80 with smaller volumes such as rectifier chips and resistors and other electronic components 80 is eliminated to a certain extent, so that these electronic components 80 can also quickly dissipate heat.

[0046] Furthermore, the second heat-conducting member body 432 is penetrated by a second avoidance groove 4323 that communicates with two opposite surfaces, and the second avoidance groove 4323 is arranged corresponding to the first avoidance groove 4161 of the first heat-conducting member 41, thereby allowing the electronic components 80 to sequentially extend out of the second heat-conducting member body 432 and the first heat-conducting member 41 to directly contact the heat-conducting plate 47, or extend into the first heat-conducting groove 4121 of the first heat-conducting member 41. It can be understood that the electronic component 80 extending out of the second heat-conducting member body 432 and directly contacting the heat-conducting plate 47 can be a device with a regular shape such as a capacitor, which has a flat surface that can contact the heat-conducting plate 47, thereby eliminating the need to transfer heat through the first heat-conducting member 41 or the second heat-conducting member 43.

[0047] like Figure 2 and Figure 7 As shown, the third heat conducting member 45 is used to dissipate heat from electronic components 80 such as small chokes with special-shaped structures, small volumes, and small curvature radius. Specifically, the third heat conducting member 45 is formed by solidifying the heat dissipation medium applied to the surface of the electronic component 80, and the solidified third heat conducting member 45 is in surface contact with the electronic component 80, so that the heat generated by the electronic component 80 can be quickly transferred.

[0048] In the above embodiment, the heat dissipation medium may be heat dissipation gel or other heat dissipation materials with good fluidity, and the heat dissipation medium is easy to solidify when exposed to room temperature, so that it can form a fixed shape and contact with the heat conductive plate to transfer the heat generated by the electronic components 80.

[0049] The heat conducting plate 47 is located on the side of the heat conducting structure 40 away from the electronic components 80, and the shape of the heat conducting plate 47 is the same as the shape of the circuit board 70 provided with the electronic components 80. One side surface of the heat conducting plate 47 contacts the first heat conducting portion 412 of the first heat conducting member 41 and the electronic components 80 passing through the first heat conducting member 41 and the second heat conducting member 43, and the other side surface of the heat conducting plate 47 contacts the cavity wall surface of the accommodating cavity, thereby transferring the heat of the above structure to the cavity wall of the accommodating cavity. Specifically in one embodiment, the heat conducting plate 47 is formed of a semiconductor material, so that it has good thermal conductivity and effectively improves the thermal conductivity efficiency.

[0050] The heat dissipation structure 60 is arranged on the outer side of the cavity wall of the accommodating cavity in contact with the heat-conducting structure 40, and is used to increase the heat dissipation area of ​​the main box body 20. Specifically, the heat dissipation structure 60 includes fins 61 and a fin protection cover plate 63, the fin protection cover plate 63 is arranged at intervals from the outer surface of the main box body 20, and a plurality of fins 61 are installed between the fin protection cover plate 63 and the outer surface of the main box body 20. Since the arrangement of the fins 61 greatly increases the heat dissipation area, the heat dissipation structure 60 has good heat dissipation efficiency, and can quickly dissipate the heat of the box body top wall 25 into the air, thereby effectively preventing the electrical box 100 from having an excessively high temperature. Specifically in some embodiments, the heat dissipation structure 60 is integrally arranged with the box body top wall 25 of the main box body 20.

[0051] Thus, the exhaust device 200 faces the heat dissipation structure 60, and the airflow generated by the exhaust device 200 flows through the heat dissipation structure 60. Thus, the heat on the heat dissipation structure 60 can be quickly taken away by the internal and external negative pressure and the airflow generated by the exhaust device, thereby improving the heat dissipation effect of the heat dissipation structure 60.

[0052] The electrical box 100 and the heat exchange device equipped therewith can utilize the heat-conducting structure 40 to carry out targeted and efficient heat dissipation of electronic components 80 of different types and shapes, thereby making the electrical box 100 completely sealed while avoiding the burning of the electronic components 80 due to excessive temperature caused by untimely heat dissipation.

[0053] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0054] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An electrical box for accommodating electronic components (80), characterized in that: The electrical box comprises: A main box body (20) is provided with a receiving cavity for receiving the electronic component (80); a heat-conducting structure (40) disposed in the accommodating cavity, one end of the heat-conducting structure (40) being used for surface contact with the electronic component (80), and the other end of the heat-conducting structure (40) being in contact with a cavity wall surface of the accommodating cavity, and the heat conductivity of the heat-conducting structure (40) being higher than the heat conductivity of air; and A heat dissipation structure (60) disposed on the outer side of a cavity wall of the accommodating cavity in contact with the heat conducting structure (40); The heat-conducting structure (40) comprises a first heat-conducting member (41) and a second heat-conducting member (43); the first heat-conducting member (41) comprises a first heat-conducting portion (412); a first heat-conducting groove (4121) having a bottom wall is provided on a surface of the first heat-conducting portion (412) facing the electronic component (80); the first heat-conducting groove (4121) is used to accommodate the electronic component (80); the bottom wall of the first heat-conducting groove (4121) can be in surface contact with the electronic component (80); the second heat-conducting member (43) is provided on the first heat-conducting member (412); 41) is disposed on a side facing the electronic component (80), the second heat-conducting member (43) comprises a second heat-conducting member body (432) and a heat-conducting filling portion, the second heat-conducting member body (432) is penetrated by a second heat-conducting groove (4321), the second heat-conducting groove (4321) is used to accommodate the electronic component (80), the heat-conducting filling portion is formed by solidifying the heat dissipation medium poured into the second heat-conducting groove (4321), and the electronic component (80) can be accommodated in the second heat-conducting groove (4321) and completely covered by the heat-conducting filling portion.

2. The electrical box according to claim 1, characterized in that: The first heat conducting member (41) further comprises a second heat conducting portion (414), wherein a surface of the second heat conducting portion (414) facing the second heat conducting member (43) is in surface contact with the heat conducting filling portion.

3. The electrical box according to claim 1, characterized in that: The second heat-conducting member body (432) is provided with a second avoidance groove (4323) extending therethrough, and the second avoidance groove (4323) allows the electronic component (80) to extend out of the second heat-conducting member body (432).

4. The electrical box according to claim 1, characterized in that: The first heat conducting member (41) further comprises a first avoidance portion (416), the first avoidance portion (416) having a first avoidance groove (4161) extending therethrough, the first avoidance groove (4161) allowing the electronic component (80) to extend out of the first avoidance portion (416).

5. The electrical box according to claim 1, characterized in that: The heat-conducting structure (40) further comprises a third heat-conducting member (45), wherein the third heat-conducting member (45) is formed by solidifying a heat-dissipating medium applied to a surface of the electronic component (80).

6. The electrical box according to claim 1, characterized in that: The heat-conducting structure (40) further comprises a heat-conducting plate (47), wherein the heat-conducting plate (47) is located on a side of the heat-conducting structure (40) away from the electronic component (80) and in contact with a cavity wall surface of the accommodating cavity.

7. The electrical box according to claim 1, characterized in that: The heat dissipation structure (60) comprises fins (61) and a fin protection cover plate (63); the fin protection cover plate (63) is spaced apart from the outer surface of the main box body (20); and a plurality of fins (61) are installed between the fin protection cover plate (63) and the outer surface of the main box body (20).

8. The electrical box according to claim 1, characterized in that: The main box body (20) is at least partially formed of semiconductor material.

9. The electrical box according to claim 1, characterized in that: The electrical appliance box is provided with two main box bodies (20), the two main box bodies (20) are stacked, and a heat dissipation structure (60) is located between the two main box bodies (20).

10. A heat exchange device, characterized in that: It comprises the electrical box as claimed in any one of claims 1 to 9.

11. The heat exchange device according to claim 10, characterized in that: The heat exchange device comprises an exhaust device (200), the exhaust device (200) faces the heat dissipation structure (60), and the airflow generated by the exhaust device (200) flows through the heat dissipation structure (60).

Images