A current sensor

Abstract

The present invention provides a current sensor, which includes a conductor, a magnetic sensor chip and a signal processing chip. The magnetic sensor chip includes a first signal positive terminal, a first signal negative terminal and a second signal positive terminal. The first signal positive terminal and the second signal positive terminal are symmetrical about the center line of the conductor; the first signal negative terminal is located on the center line of the conductor; the signal processing chip includes a third signal positive terminal, a second signal negative terminal and a fourth signal positive terminal. The third signal positive terminal and the fourth signal positive terminal are symmetrical about the center line of the conductor; the second signal negative terminal is located on the center line of the conductor; a first bonding wire connecting the first signal positive terminal and the third signal positive terminal; a second bonding wire connecting the first signal negative terminal and the second signal negative terminal; a third bonding wire connecting the second signal positive terminal and the fourth signal positive terminal. Compared with the prior art, the present invention eliminates the inductive coupling in the current sensor by means of bonding wires, thereby improving the detection accuracy of the current sensor.

Description

Technical Field

[0001] The present invention relates to the technical field of current sensors, and in particular to a magnetoresistive current sensor that eliminates inductive coupling by wire bonding.

Background Art

[0002] Current sensors for measuring the magnitude of current are widely used in various electronic devices. In an existing current sensor, a U-shaped conductor is integrated inside, and two magnetoresistive sensors are placed around the conductor. The current to be measured flows through the U-shaped conductor integrated inside the sensor, and the two magnetoresistive sensors perform differential measurement on the magnetic field generated by the current in the conductor, so as to achieve the purpose of detecting (or measuring) the current to be measured.

[0003] However, for current sensors, high-frequency current will generate an induced voltage in a closed loop, thereby affecting the detection accuracy of the current. In order to reduce inductive coupling, usually the method of reducing the distance between the magnetic sensor chip and the signal processing chip to reduce the wire bonding enclosed area is adopted, but inductive coupling cannot be fundamentally eliminated.

[0004] Therefore, it is necessary to propose a solution to solve the above problems.

Summary of the Invention

[0005] One object of the present invention is to provide a current sensor that eliminates inductive coupling in the current sensor by wire bonding, thereby improving the detection accuracy of the current sensor.

[0006] According to one aspect of the present invention, the present invention provides a current sensor that detects a current to be measured based on the magnetic induction intensity generated by the current to be measured. The current sensor includes a conductor, a magnetic sensor chip, and a signal processing chip. The magnetic sensor chip and the signal processing chip are arranged on the same side of the conductor at intervals. The conductor is used to provide a flow channel for the current to be measured so that the current to be measured can flow through the conductor. The magnetic sensor chip includes a first signal positive terminal Vp11, a first signal negative terminal Vn11, and a second signal positive terminal Vp21. Among them, the first signal positive terminal Vp11 and the second signal positive terminal Vp21 are symmetric about the center line of the conductor. The first signal negative terminal Vn11 is located on the center line of the conductor. The signal processing chip includes a third signal positive terminal Vp12, a second signal negative terminal Vn12, and a fourth signal positive terminal Vp22. Among them, the third signal positive terminal Vp12 and the fourth signal positive terminal Vp22 are symmetric about the center line of the conductor. The second signal negative terminal Vn12 is located on the center line of the conductor. A first bonding wire 104c connecting the first signal positive terminal Vp11 and the third signal positive terminal Vp12; a second bonding wire 104d connecting the first signal negative terminal Vn11 and the second signal negative terminal Vn12; a third bonding wire 104e connecting the second signal positive terminal Vp21 and the fourth signal positive terminal Vp22.

[0007] Further, the first signal positive terminal Vp11 and the third signal positive terminal Vp12 are located on one side of the center line of the conductor; the second signal positive terminal Vp21 and the fourth signal positive terminal Vp22 are located on the other side of the center line of the conductor.

[0008] Further, the region surrounded by the first signal positive terminal Vp11, the third signal positive terminal Vp12, the first signal negative terminal Vn11, the second signal negative terminal Vn12, the first bonding wire 104c, and the second bonding wire 104d is called the first region; the region surrounded by the second signal positive terminal Vp21, the fourth signal positive terminal Vp22, the first signal negative terminal Vn11, the second signal negative terminal Vn12, the third bonding wire 104e, and the second bonding wire 104d is called the second region; the areas of the first region and the second region are equal and the directions are opposite.

[0009] Further, the first signal positive terminal Vp11 and the second signal positive terminal Vp21 are interconnected inside the magnetic sensor chip; the third signal positive terminal Vp12 and the fourth signal positive terminal Vp22 are interconnected inside the signal processing chip; the opposite directions of the first region and the second region are: the first region and the second region are symmetric about the center line of the conductor.

[0010] Further, the measured current flowing through the conductor generates a first magnetic field in the first region; the measured current flowing through the conductor generates a second magnetic field in the second region; wherein, the magnitudes of the first magnetic field and the second magnetic field are approximately or exactly equal, and the directions are the same.

[0011] Further, the conductor is a U-shaped conductor, and the U-shaped conductor includes a first leg, a second leg, and a connecting portion connecting the first leg and the second leg. The current directions on the first leg and the second leg are opposite, the first leg and the second leg are respectively located on both sides of the center line of the conductor, and the magnetic sensor chip is disposed opposite to the first leg and the second leg.

[0012] According to another aspect of the present invention, the present invention provides another current sensor, which detects the measured current according to the magnetic induction intensity generated by the measured current. It includes a conductor, a magnetic sensor chip, and a signal processing chip. The magnetic sensor chip and the signal processing chip are arranged at intervals on the same side of the conductor. The conductor is used to provide a flow channel for the measured current so that the measured current can flow through the conductor; the magnetic sensor chip includes a first signal positive terminal Vp11 and a first signal negative terminal Vn11, and the first signal positive terminal Vp11 and the first signal negative terminal Vn11 are symmetric about the center line of the conductor; the signal processing chip includes a second signal positive terminal Vp12 and a second signal negative terminal Vn12, and the second signal positive terminal Vp12 and the second signal negative terminal Vn12 are symmetric about the center line of the conductor; a fourth bonding wire 204c connecting the first signal positive terminal Vp11 and the second signal positive terminal Vp12; a fifth bonding wire 204d connecting the first signal negative terminal Vn11 and the second signal negative terminal Vn12.

[0013] Further, the first signal positive terminal Vp11 and the second signal negative terminal Vn12 are located on one side of the center line of the conductor 201; the second signal positive terminal Vp12 and the first signal negative terminal Vn11 are located on the other side of the center line of the conductor 201.

[0014] Further, the lower half region surrounded by the first signal positive terminal Vp11, the first signal negative terminal Vn11, the fourth bonding wire 204c, and the fifth bonding wire 204d is called the third region; the upper half region surrounded by the second signal positive terminal Vp12, the second signal negative terminal Vn12, the fourth bonding wire 204c, and the fifth bonding wire 204d is called the fourth region; the areas of the third region and the fourth region are equal and the directions are opposite.

[0015] Further, the opposite directions of the third region and the fourth region mean that the third region and the fourth region are symmetric about an axis of symmetry, and the axis of symmetry is perpendicular to the center line of the conductor.

[0016] Further, the measured current flowing through the conductor generates a third magnetic field in the third region; the measured current flowing through the conductor generates a fourth magnetic field in the fourth region; wherein, the magnitudes of the third magnetic field and the fourth magnetic field are approximately or exactly equal, and the directions are the same.

[0017] Further, the conductor is a U-shaped conductor, and the U-shaped conductor includes a first leg, a second leg, and a connecting portion connecting the first leg and the second leg. Among them, the current directions on the first leg and the second leg are opposite, the first leg and the second leg are respectively located on both sides of the center line of the conductor, and the magnetic sensor chip is disposed opposite to the first leg and the second leg.

[0018] Compared with the prior art, the present invention cancels the magnetic flux of the closed loop completely or approximately by setting the wire bonding method between the magnetic sensor chip and the signal processing chip, fundamentally eliminating the inductive coupling in the current sensor, thereby improving the detection accuracy of the current sensor.

Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to these drawings. Among them:

[0020] Figure 1 It is a schematic structural diagram of a current sensor with a first wire bonding method in an embodiment of the present invention;

[0021] Figure 2 It is a schematic structural diagram of a current sensor with a second wire bonding method in another embodiment of the present invention.

Detailed Description

[0022] To make the above objects, features, and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below with reference to the drawings and specific embodiments.

[0023] As used herein, the term "one embodiment" or "embodiment" refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The appearances of "in one embodiment" in different places in this specification do not all refer to the same embodiment, nor are they separate or alternative embodiments that exclude other embodiments. Unless otherwise specified, the terms indicating electrical connection such as "connected", "coupled", and "joined" herein all mean direct or indirect electrical connection.

[0024] Please refer to Figure 1As shown, it is a schematic structural diagram of a current sensor with a first wire bonding method in an embodiment of the present invention. Figure 1 The current sensor 100 shown includes: a conductor 101, a magnetic sensor chip 102, a signal processing chip 103, a signal output pin 106, a wire bonding group 104 located between the magnetic sensor chip 102 and the signal processing chip 103, and a wire bonding group 105 located between the signal processing chip 103 and the signal output pin 106. Among them, the magnetic sensor chip 102 and the signal processing chip 103 are arranged side by side at intervals on the same side of the conductor 101.

[0025] The conductor 101 is used to provide a flowing channel for the measured current I, so that the measured current I can flow through the conductor 101. Figure 1 In the shown embodiment, the conductor 101 is a U-shaped conductor, and the U-shaped conductor includes a first leg 101a, a second leg 101b, and a connecting portion 101c connecting the first leg 101a and the second leg 101b; the first leg 101a and the second leg 101b are respectively located on both sides of the center line of the conductor 101; the detected current I sequentially flows through the first leg 101a, the connecting portion 101c, and the second leg 101b, wherein the currents on the first leg 101a and the second leg 101b are opposite.

[0026] The magnetic sensor chip 102 is used to convert the magnetic field generated by the current flowing through the conductor 101 in the magnetic sensitive area of the magnetic sensor chip 102 into a voltage output. Figure 1 In the shown embodiment, the magnetic sensor chip 102 is disposed opposite to the first leg 101a and the second leg 101b; the magnetic sensor chip 102 includes five pads (or gaskets), specifically, a first power supply terminal VDD1, a first ground terminal GND1, a first signal positive terminal Vp11, a first signal negative terminal Vn11, and a second signal positive terminal Vp21 arranged at intervals in sequence from the first leg 101a to the second leg 101b. Among them, the first signal positive terminal Vp11 and the second signal positive terminal Vp21 are symmetric about the center line of the conductor 101 and are interconnected inside the magnetic sensor chip 102; the first signal negative terminal Vn11 is located on the center line of the conductor 101.

[0027] The signal processing chip 103 is used to process the voltage output by the magnetic sensor chip 102 to generate a detection signal.

[0028] In Figure 1In the illustrated embodiment, the signal processing chip 103 is disposed opposite to the first leg 101a and the second leg 101b, and is closer to the connecting portion 101c of the U-shaped conductor 101 than the magnetic sensor chip 102. The signal processing chip 103 includes eight pads (or gaskets), specifically, a second power supply terminal VDD2, a second ground terminal GND2, a third positive signal terminal Vp12, a second negative signal terminal Vn12, and a fourth positive signal terminal Vp22 that are sequentially arranged at intervals from the first leg 101a to the second leg 101b. Moreover, the second power supply terminal VDD2, the second ground terminal GND2, the third positive signal terminal Vp12, the second negative signal terminal Vn12, and the fourth positive signal terminal Vp22 are located on the side close to the magnetic sensor chip 102; a third power supply terminal VDD3, a third ground terminal GND3, and a signal output terminal VOUT1 are sequentially arranged at intervals from the first leg 101a to the second leg 101b. Moreover, the third power supply terminal VDD3, the third ground terminal GND3, and the signal output terminal VOUT1 are located on the side far from the magnetic sensor chip 102. Among them, the third positive signal terminal Vp12 and the fourth positive signal terminal Vp22 are symmetric about the center line of the conductor 101 and are interconnected inside the signal processing chip 103; the second negative signal terminal Vn12 is located on the center line of the conductor 101; the second power supply terminal VDD2 and the third power supply terminal VDD3 are interconnected inside the signal processing chip 103; the second ground terminal GND2 and the third ground terminal GND3 are interconnected inside the signal processing chip 103.

[0029] It should be specifically noted that in Figure 1 the illustrated embodiment, the first positive signal terminal Vp11 and the third positive signal terminal Vp12 are located on one side of the center line of the conductor 101 (for example, on the left side of the center line of the conductor 101 in Figure 1 ); the second positive signal terminal Vp21 and the fourth positive signal terminal Vp22 are located on the other side of the center line of the conductor 101 (for example, on the right side of the center line of the conductor 101 in Figure 1 ).

[0030] The wire bonding group 104 includes wire bonds (or leads) 104a, 104b, 104c, 104d, and 104e. Among them, the first power supply terminal VDD1 and the second power supply terminal VDD2 are interconnected through the wire bond 104a; the first ground terminal GND1 and the second ground terminal GND2 are interconnected through the wire bond 104b; the first positive signal terminal Vp11 and the third positive signal terminal Vp12 are interconnected through the wire bond 104c (which can be called the first wire bond); the first negative signal terminal Vn11 and the second negative signal terminal Vn12 are interconnected through the wire bond 104d (which can be called the second wire bond); the second positive signal terminal Vp21 and the fourth positive signal terminal Vp22 are interconnected through the wire bond 104e (which can be called the third wire bond).

[0031] For the convenience of description, in the present invention, the region surrounded by the first positive terminal Vp11 of the signal, the third positive terminal Vp12 of the signal, the first negative terminal Vn11 of the signal, the second negative terminal Vn12 of the signal, the bonding wire 104c and the bonding wire 104d is referred to as the first region; the region surrounded by the second positive terminal Vp21 of the signal, the fourth positive terminal Vp22 of the signal, the first negative terminal Vn11 of the signal, the second negative terminal Vn12 of the signal, the bonding wire 104e and the bonding wire 104d is referred to as the second region. Among them, the areas of the first region and the second region are equal and the directions are opposite. In Figure 1 In the illustrated embodiment, the opposite directions of the first region and the second region can be interpreted as: the first region and the second region are symmetric about the center line of the conductor 101.

[0032] The measured current I in the U-shaped conductor 101 generates a first magnetic field B in the area surrounded by Vp12, Vp11, Vn11, Vn12, 104c and 104d (i.e., the first region) 11 , and generates a second magnetic field B in the area surrounded by Vp22, Vp21, Vn11, Vn12, 104d and 104e (i.e., the second region) 12 , the first magnetic field B 11 and the second magnetic field B 12 are equal in magnitude and the same in direction, so that the net magnetic flux between the magnetic sensor chip 102 and the signal processing chip 103 is zero, eliminating the inductive coupling in the current sensor and improving the detection accuracy of the current sensor.

[0033] Please continue to refer to Figure 1 As shown, the bonding wire bundle 105 includes bonding wires 105a, 105b, and 105c.

[0034] The signal output pin 106 is used to output the detection signal generated by the signal processing chip 103. In Figure 1 In the illustrated embodiment, the signal output pin 106 is located outside the connecting portion 101c of the U-shaped conductor 101. The signal output pin 106 includes pins 106a (which can be referred to as the power supply pin VDD), pins 106b (which can be referred to as the ground pin GND), pins 106c (which can be referred to as the output pin VOUT), and pins 106d arranged at intervals in sequence from the first leg 101a to the second leg 101b. Among them, the third power supply terminal VDD3 and the pin 106a are interconnected through the bonding wire 105a; the third ground terminal GND3 and the pin 106b are interconnected through the bonding wire 105b, and the signal output terminal VOUT1 and the pin 106c are interconnected through the bonding wire 105c.

[0035] Please refer to Figure 2As shown, it is a schematic structural diagram of a current sensor with a second wire bonding method in another embodiment of the present invention. Figure 2 The current sensor 200 shown includes: a conductor 201, a magnetic sensor chip 202, a signal processing chip 203, a signal output pin 206, a wire bonding group 204 located between the magnetic sensor chip 202 and the signal processing chip 203, and a wire bonding group 205 located between the signal processing chip 203 and the signal output pin 206. Among them, the magnetic sensor chip 202 and the signal processing chip 203 are arranged at intervals on the same side of the conductor 201.

[0036] The conductor 201 is used to provide a flowing channel for the measured current I, so that the measured current I can flow through the conductor 201. Figure 2 In the embodiment shown, the conductor 201 is a U-shaped conductor, and the U-shaped conductor includes a first leg 201a, a second leg 201b, and a connecting portion 201c connecting the first leg 201a and the second leg 201b; the first leg 201a and the second leg 201b are respectively located on both sides of the center line of the conductor 201; the detected current I flows through the first leg 201a, the connecting portion 201c, and the second leg 201b in sequence, wherein the currents on the first leg 201a and the second leg 201b are opposite.

[0037] The magnetic sensor chip 202 is used to convert the magnetic field generated by the current flowing through the conductor 201 in the magnetic sensitive area of the magnetic sensor chip 202 into a voltage output. Figure 2 In the embodiment shown, the magnetic sensor chip 202 is disposed opposite to the first leg 201a and the second leg 201b; the magnetic sensor chip 202 includes four pads (or gaskets), specifically, a first power supply terminal VDD1, a first ground terminal GND1, a first signal positive terminal Vp11, and a first signal negative terminal Vn11 arranged at intervals in sequence from the first leg 201a to the second leg 201b. Among them, the first signal positive terminal Vp11 and the first signal negative terminal Vn11 are symmetric about the center line of the conductor 201.

[0038] The signal processing chip 203 is used to process the voltage output by the magnetic sensor chip 202 to generate a detection signal.

[0039] In Figure 2In the illustrated embodiment, the signal processing chip 203 is disposed opposite to the first leg 201a and the second leg 201b, and is closer to the connecting portion 201c of the U-shaped conductor 201 than the magnetic sensor chip 202. The signal processing chip 203 includes seven pads (or gaskets), specifically, a second power supply terminal VDD2, a second ground terminal GND2, a second positive signal terminal Vp12, and a second negative signal terminal Vn12 that are sequentially arranged at intervals from the first leg 201a to the second leg 201b, and the second power supply terminal VDD2, the second ground terminal GND2, the second positive signal terminal Vp12, and the second negative signal terminal Vn12 are located on the side close to the magnetic sensor chip 202; a third power supply terminal VDD3, a third ground terminal GND3, and a signal output terminal VOUT1 that are sequentially arranged at intervals from the first leg 201a to the second leg 201b, and the third power supply terminal VDD3, the third ground terminal GND3, and the signal output terminal VOUT1 are located on the side away from the magnetic sensor chip 202. Among them, the second positive signal terminal Vp12 and the second negative signal terminal Vn12 are symmetric about the center line of the conductor 201; the second power supply terminal VDD2 and the third power supply terminal VDD3 are interconnected inside the signal processing chip 203; the second ground terminal GND2 and the third ground terminal GND3 are interconnected inside the signal processing chip 203.

[0040] It should be particularly noted that in Figure 2 the illustrated embodiment, the first positive signal terminal Vp11 and the second negative signal terminal Vn12 are located on one side of the center line of the conductor 201 (for example, on the left side of the center line of the conductor 201 in Figure 2 ); the second positive signal terminal Vp12 and the first negative signal terminal Vn11 are located on the other side of the center line of the conductor 201 (for example, on the right side of the center line of the conductor 201 in Figure 2 ).

[0041] The wire bonding group 204 includes wire bonds (or leads) 204a, 204b, 204c, and 204d. Among them, the first power supply terminal VDD1 and the second power supply terminal VDD2 are interconnected through the wire bond 204a; the first ground terminal GND1 and the second ground terminal GND2 are interconnected through the wire bond 204b; the first positive signal terminal Vp11 and the second positive signal terminal Vp12 are interconnected through the wire bond 204c (which can be referred to as the fourth wire bond); the first negative signal terminal Vn11 and the second negative signal terminal Vn12 are interconnected through the wire bond 204d (which can be referred to as the fifth wire bond), where the wire bond 204c and the wire bond 204d cross, and the crossing point is O.

[0042] For the sake of convenience in description, in the present invention, the lower half region surrounded by the first positive signal terminal Vp11, the first negative signal terminal Vn11, the bonding wire 204c and the bonding wire 204d (i.e., the region surrounded by the first positive signal terminal Vp11, the first negative signal terminal Vn11 and the intersection point O) is called the third region; the upper half region surrounded by the second positive signal terminal Vp12, the second negative signal terminal Vn12, the bonding wire 204c and the bonding wire 204d (i.e., the region surrounded by the second positive signal terminal Vp12, the second negative signal terminal Vn12 and the intersection point O) is called the fourth region. Among them, the areas of the third region and the fourth region are equal and the directions are opposite. In Figure 2 In the illustrated embodiment, the fact that the third region and the fourth region have opposite directions can be interpreted as: the third region and the fourth region are symmetric about an axis of symmetry, and the axis of symmetry is perpendicular to the center line of the conductor 201.

[0043] The measured current I in the U-shaped conductor 201 generates a third magnetic field B in the area of the lower half region surrounded by Vp11, Vn11, 204c and 204d (i.e., the third region) 21 and generates a fourth magnetic field B in the area of the upper half region surrounded by Vp12, Vn12, 204c and 204d (i.e., the fourth region) 22 The third magnetic field B 21 and the fourth magnetic field B 22 are approximately equal in magnitude and the same in direction, so that the net magnetic flux between the magnetic sensor chip 202 and the signal processing chip 203 is zero, eliminating the inductive coupling in the current sensor and improving the detection accuracy of the current sensor.

[0044] Please continue to refer to Figure 2 As shown, the bonding wire bundle 205 includes bonding wires 205a, 205b, 205c.

[0045] The signal output pin 206 is used to output the detection signal generated by the signal processing chip 203. In Figure 2 In the illustrated embodiment, the signal output pin 206 is located outside the connection portion 201c of the U-shaped conductor 201. The signal output pin 206 includes pins 206a (which can be called the power supply pin VDD), pins 206b (which can be called the ground pin GND), pins 206c (which can be called the output pin VOUT) and pins 206d arranged at intervals in sequence from the first leg 201a to the second leg 201b. Among them, the third power supply terminal VDD3 and the pin 206a are interconnected through the bonding wire 205a; the third ground terminal GND3 and the pin 206b are interconnected through the bonding wire 205b, and the signal output terminal VOUT1 and the pin 206c are interconnected through the bonding wire 205c.

[0046] In summary, by setting the wire bonding method between the magnetic sensor chips 102 and 202 and the signal processing chips 103 and 203, the net magnetic flux between the magnetic sensor chips 102 and 202 and the signal processing chips 103 and 203 is made completely or approximately zero, so as to completely or approximately cancel the closed-loop magnetic flux, fundamentally eliminating the inductive coupling in the current sensor, thereby improving the detection accuracy of the current sensor.

[0047] In the present invention, words indicating electrical connection such as "connected", "linked", "joined", and "connected" mean direct or indirect electrical connection unless otherwise specified.

[0048] The above is only the preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiment. Any equivalent modification or change made by those of ordinary skill in the art according to the disclosure of the present invention should be included in the protection scope recorded in the claims.

Claims

1. A current sensor that detects a current to be measured based on the magnetic induction intensity generated by the current to be measured, characterized in that, It includes a conductor, a magnetic sensor chip, and a signal processing chip. The magnetic sensor chip and the signal processing chip are arranged on the same side of the conductor at intervals from each other. The conductor is used to provide a flowing channel for the current to be measured, enabling the current to flow through the conductor. The magnetic sensor chip includes a first signal positive terminal Vp11, a first signal negative terminal Vn11, and a second signal positive terminal Vp21. Among them, the first signal positive terminal Vp11 and the second signal positive terminal Vp21 are symmetric about the center line of the conductor; the first signal negative terminal Vn11 is located on the center line of the conductor. The signal processing chip includes a third signal positive terminal Vp12, a second signal negative terminal Vn12, and a fourth signal positive terminal Vp22. Among them, the third signal positive terminal Vp12 and the fourth signal positive terminal Vp22 are symmetric about the center line of the conductor; the second signal negative terminal Vn12 is located on the center line of the conductor. A first bonding wire 104c connecting the first signal positive terminal Vp11 and the third signal positive terminal Vp12; A second bonding wire 104d connecting the first signal negative terminal Vn11 and the second signal negative terminal Vn12; A third bonding wire 104e connecting the second signal positive terminal Vp21 and the fourth signal positive terminal Vp22, The area surrounded by the first signal positive terminal Vp11, the third signal positive terminal Vp12, the first signal negative terminal Vn11, the second signal negative terminal Vn12, the first bonding wire 104c, and the second bonding wire 104d is called the first region; the area surrounded by the second signal positive terminal Vp21, the fourth signal positive terminal Vp22, the first signal negative terminal Vn11, the second signal negative terminal Vn12, the third bonding wire 104e, and the second bonding wire 104d is called the second region; the areas of the first region and the second region are equal and the directions are opposite. The current to be measured flowing through the conductor generates a first magnetic field in the first region; the current to be measured flowing through the conductor generates a second magnetic field in the second region; among them, the magnitudes of the first magnetic field and the second magnetic field are equal and the directions are the same. The first signal positive terminal Vp11 and the second signal positive terminal Vp21 are interconnected inside the magnetic sensor chip; The third signal positive terminal Vp12 and the fourth signal positive terminal Vp22 are interconnected inside the signal processing chip; The directions of the first region and the second region being opposite means that the first region and the second region are symmetric about the center line of the conductor.

2. The current sensor according to claim 1, wherein The first signal positive terminal Vp11 and the third signal positive terminal Vp12 are located on one side of the center line of the conductor; The second signal positive terminal Vp21 and the fourth signal positive terminal Vp22 are located on the other side of the center line of the conductor.

3. The current sensor according to claim 1, wherein The conductor is a U-shaped conductor, and the U-shaped conductor includes a first leg, a second leg, and a connecting portion connecting the first leg and the second leg. Among them, the current directions on the first leg and the second leg are opposite, The first leg and the second leg are respectively located on both sides of the center line of the conductor. The magnetic sensor chip is disposed opposite to the first leg and the second leg.

4. A current sensor that detects a current to be measured based on the magnetic induction intensity generated by the current to be measured, characterized in that, It includes a conductor, a magnetic sensor chip, and a signal processing chip. The magnetic sensor chip and the signal processing chip are arranged at intervals on the same side of the conductor. The conductor is used to provide a flowing channel for the current to be measured, so that the current to be measured can flow through the conductor. The magnetic sensor chip includes a first signal positive terminal Vp11 and a first signal negative terminal Vn11, and the first signal positive terminal Vp11 and the first signal negative terminal Vn11 are symmetric about the center line of the conductor. The signal processing chip includes a second signal positive terminal Vp12 and a second signal negative terminal Vn12, and the second signal positive terminal Vp12 and the second signal negative terminal Vn12 are symmetric about the center line of the conductor. A fourth bonding wire 204c connecting the first signal positive terminal Vp11 and the second signal positive terminal Vp12. A fifth bonding wire 204d connecting the first signal negative terminal Vn11 and the second signal negative terminal Vn12. The lower half region enclosed by the first signal positive terminal Vp11, the first signal negative terminal Vn11, the fourth bonding wire 204c, and the fifth bonding wire 204d is called the third region; the upper half region enclosed by the second signal positive terminal Vp12, the second signal negative terminal Vn12, the fourth bonding wire 204c, and the fifth bonding wire 204d is called the fourth region; the areas of the third region and the fourth region are equal and the directions are opposite. The current to be measured flowing through the conductor generates a third magnetic field in the third region; the current to be measured flowing through the conductor generates a fourth magnetic field in the fourth region; wherein, the magnitudes of the third magnetic field and the fourth magnetic field are equal and the directions are the same. The fact that the third region and the fourth region have opposite directions means that the third region and the fourth region are symmetric about an axis of symmetry, and the axis of symmetry is perpendicular to the center line of the conductor.

5. The current sensor according to claim 4, wherein The first signal positive terminal Vp11 and the second signal negative terminal Vn12 are located on one side of the center line of the conductor 201. The second signal positive terminal Vp12 and the first signal negative terminal Vn11 are located on the other side of the center line of the conductor 201.

6. The current sensor according to claim 5, wherein The conductor is a U-shaped conductor, and the U-shaped conductor includes a first leg, a second leg, and a connecting portion connecting the first leg and the second leg. Among them, the current directions on the first leg and the second leg are opposite. The first leg and the second leg are respectively located on both sides of the center line of the conductor. The magnetic sensor chip is disposed opposite to the first leg and the second leg.

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