Preparation process of a floor heating tile

Abstract

The present invention relates to the technical field of floor heating equipment, and discloses a floor heating tile with an electric heating chip fired in a tile body, which includes a tile body and an electric heating chip. The electric heating chip is electrically connected to a plug-in connector. The tile body is provided with a first groove for embedding the electric heating chip and a second groove for embedding the plug-in connector. The plug-in connector is electrically connected to an external power supply, and the surface of the tile body protrudes or is flush with the surfaces of the electric heating chip and the plug-in connector. With such a setting, the electric heating chip is directly embedded in the tile body, and the heat transfer distance between the electric heating chip and the tile body is minimized. There is no need for a cement layer, so the heat conduction efficiency is high, the heating speed is fast, the energy consumption is low, no complex structure needs to be set, and the cost is low; moreover, there is no need for organic compounds such as insulating materials, thermal insulation materials, and adhesives, and no toxic substances will be emitted and no harm to human health will be caused; the pressure-bearing capacity of the laid tiles is the same, and the tiles will not be broken, settled, or collapsed, ensuring the flatness of the ground and making it not easy to trip and injure people.

Description

Technical Field

[0001] The invention relates to the technical field of floor heating equipment, and more specifically, to a preparation process of floor heating tiles. Background Art

[0002] Existing floor heating technologies mainly include hot water floor heating technology and electric floor heating technology.

[0003] 1. Hot water floor heating technology mainly uses coal, oil, and gas equipment to heat water, and then transports the hot water to the water circulation floor heating pipe system laid under the surface decoration materials. The heat of the hot water is transferred to the floor heating pipe to achieve the purpose of indoor temperature increase and insulation. However, this floor heating technology uses the method of burning fossil fuels, which will cause environmental pollution; moreover, heating with water as the medium requires secondary heat exchange, which has large heat loss, low heat conduction efficiency, and slow indoor temperature increase; in addition, pipe blockage and water leakage problems often occur.

[0004] 2. Electric floor heating technology includes two methods:

[0005] The first method is to lay heating cables on a large area under the floor decoration materials. The heating cables are covered with cement mortar, and the heating cables are powered to generate heat, and then the heat is transferred to the floor decoration materials. Although compared with hot water heating technology, it does not require the burning of fossil fuels, will not pollute the environment, and does not require water as a medium and secondary exchange. However, there is a cement layer between the heating cable and the surface, and the distance between them is large, which still results in low heat conduction efficiency, slow heating speed, high energy consumption, and high cost of use.

[0006] Second, composite electric heating floor heating tiles. These tiles are made by integrating an electric heating layer (heating cable or carbon crystal electric heating film), an insulating layer, a heat-conducting layer, etc. into a heat-insulating layer of polyurethane foam material, and then bonding them to ordinary tiles with an adhesive. However, its disadvantages are as follows: 1. The insulating materials, heat-insulating materials, adhesives, etc. used are all organic compounds, which will continuously release and emit toxic and harmful substances into the room during long-term use in a warm environment of 30-40 degrees Celsius, causing harm to human health. 2. The electric heating layer is outside the ordinary tile, and the distance from the heat dissipation surface of the ordinary tile is relatively large, resulting in low heat conduction efficiency, slow heating rate, and high energy consumption. 3. The thickness of the composite floor heating tile is 1-2 times that of the ordinary tile, which will increase the construction difficulty when laid in a mixed way with ordinary tiles. 4. The composite floor heating tile has a structural defect. After the tile is laid, the structure from top to bottom is ordinary tile (rigid material) / composite body (plastic material) / cement layer (rigid material). During long-term use, due to objective reasons such as the movement and trampling of people and the large difference in the area ratio between the sole of a person's foot and the area of a single tile, the pressure borne by the tile must be uneven, and it is extremely easy to cause the tile to break. 5. In order to ensure the indoor heating temperature requirement and control the material and use costs, the laying area of the floor heating tile usually accounts for about 40% of the total laying area of the tiles. That is to say, there will inevitably be adjacent and joint areas between the floor heating tile and the ordinary tile during laying; while the ordinary tile is directly laid on the cement, and its structure from top to bottom is tile (rigid material) / cement (rigid material). Therefore, after the overall laying is completed, the pressure-bearing capacity of the ordinary tile is much higher than that of the composite electric heating floor heating tile. After a period of use, due to the irregular movement and trampling of people and the large difference in the pressure-bearing capacity of the two types of tiles, compared with the area where ordinary tiles are laid, the area where the composite electric heating floor heating tile is laid will definitely have settlement and collapse, and there will be a height difference at the joint with the area where ordinary tiles are laid, destroying the overall flatness of the ground, affecting the overall beauty of the ground, and increasing the risk of people being tripped and injured.

[0007] Therefore, how to solve the problems in the prior art of hot water and electric floor heating technologies, such as low heat conduction efficiency, slow heating rate, high energy consumption, high cost, and the composite electric heating floor heating tile is easy to emit toxic and harmful substances, endanger human health, difficult to construct, easy to cause tile breakage, settlement and collapse, and increase the risk of people being tripped and injured, has become an important technical problem to be solved by those skilled in the art. Summary of the Invention

[0008] The object of the present invention is to provide a floor heating tile with an electric heating chip fired inside the tile body, so as to solve the technical problems in the prior art that the heat conduction efficiency of hot water and electric floor heating technologies is low, the heating rate is slow, the energy consumption is large, the cost is high, and the composite electric floor heating tile is prone to emitting toxic and harmful substances, endangering human health, the construction is difficult, and it is easy to cause tile fracture, settlement and collapse, increasing the risk of tripping and falling for people. The preferred technical solutions among the many technical solutions provided by the present invention and the many technical effects that can be produced are described in detail below.

[0009] The present invention provides a floor heating tile, including a tile body and an electric heating chip. The electric heating chip is electrically connected to a plug-in member. The tile body is provided with a first groove for embedding the electric heating chip and a second groove for embedding the plug-in member. The plug-in member is electrically connected to an external power supply, and the surface of the tile body protrudes or is flush with the surfaces of the electric heating chip and the plug-in member.

[0010] Preferably, the electric heating chip is a square loop structure. The loop structure includes a first coiling structure and a second coiling structure. There is a symmetry plane between the first coiling structure and the second coiling structure. The first coiling structure and the second coiling structure are symmetrical about the symmetry plane. The first end of the first coiling structure is connected to the first end of the second coiling structure. The second end of the first coiling structure and the second end of the second coiling structure are both electrically connected to the plug-in member.

[0011] Preferably, the first groove is opened inside the tile body, and the second groove is opened on the lower end surface of the tile body. The structure and size of the first groove are the same as those of the electric heating chip. The lower surface of the plug-in member is higher than or flush with the lower end surface of the tile body.

[0012] Preferably, the plug-in member includes a male plug joint and a female plug joint that can cooperate with each other. The male plug joint is electrically connected to the electric heating chip, and the female plug joint is electrically connected to an external power supply. The second groove includes a groove portion for accommodating the male plug joint and a hole groove for accommodating the female plug joint. The groove portion, the hole groove and the first groove are all communicated with each other.

[0013] Preferably, the male plug joint includes two plug teeth and is respectively connected to both ends of the electric heating chip. The female plug joint is provided with a jack for partially inserting the plug teeth. The outer surface of the plug teeth fits with the wall surface of the groove portion. The hole groove is arranged at the side end of the tile body, and the lower surface of the female plug joint is higher than the lower end surface of the tile body. The side surface of the female plug joint is recessed from the side surface of the tile body.

[0014] Preferably, it further includes a power lead wire, one end of the power lead wire is connected to the female plug connector, and the other end is connected to a parallel sealing joint, and the parallel sealing joint is electrically connected to an external power source.

[0015] Preferably, the material of the electric heating chip is nickel-chromium alloy foil material.

[0016] The present invention provides a floor heating tile assembly, including a plurality of the above-mentioned floor heating tiles and a thermostat. The plug connectors of each floor heating tile are electrically connected to the thermostat, and the thermostat is electrically connected to an external power source. When the thermostat detects that the air temperature reaches a first preset value, the thermostat controls the electric heating chip to cut off the power supply so that the electric heating chip stops heating. When the thermostat detects that the air temperature drops to a second preset value, the thermostat controls the electric heating chip to be powered on so that the electric heating chip is powered on and heats up.

[0017] Preferably, the thermostat is electrically connected to a power bus, and the plug connectors of each floor heating tile are electrically connected to the power bus.

[0018] The present invention provides a preparation process for floor heating tiles, including:

[0019] Laser-cut the electric heating chip, and weld the male plug connector on the electric heating chip by laser;

[0020] Open holes on a filler block made of silicone rubber material for mating with the teeth of the male plug connector, and the shape and size of the filler block are the same as those of the hole groove. Then insert the teeth of the male plug connector into the holes of the filler block;

[0021] Put the first part of the brick blank material in powder form into the square groove of the stamping die, then put the electric heating chip, the male plug connector, and the filler block into the square groove of the stamping die, and align the outer side surface of the filler block with the side wall of the square groove to position the electric heating chip;

[0022] Continue to put the second part of the brick blank material in powder form into the square groove of the stamping die, and then stamp the second part of the brick blank material so that the first part of the brick blank material and the second part of the brick blank material jointly form a tile body;

[0023] Perform processes such as drying, glazing, glaze grinding, printing, firing, and edge grinding on the tile body. During the firing process, the filler block loses crystal water and becomes silicon dioxide powder. After cleaning the silicon dioxide powder, a hole groove is formed.

[0024] In the technical solution provided by the present invention, the floor heating tile includes a tile body and an electric heating chip. The electric heating chip is electrically connected to a plug-in component. The tile body is provided with a first groove and a second groove. The first groove is used for embedding the electric heating chip, and the second groove is used for embedding the plug-in component. The plug-in component is electrically connected to an external power supply, so as to realize the electrical connection between the electric heating chip and the external power supply, and can realize the energization and power-off of the electric heating chip. The surface of the tile body is convex or flush with the surfaces of the electric heating chip and the plug-in component, that is, the surfaces of the electric heating chip and the plug-in component do not protrude from the surface of the tile body. The thickness of the floor heating tile is the thickness of the tile body, which is no different from the thickness of ordinary tiles. In this way, by the method of energizing and heating the electric heating chip, the electric heating chip directly transfers heat to the tile body to achieve heat supply.

[0025] With such a setting, 1. The structure is reasonable: the electric heating chip is directly embedded in the tile body, and the electric heating chip and the tile body become one body, without increasing the thickness and installation layers of the floor heating tile; it eliminates the structural defects of the rigid material and plastic material mixed in the composite electric heating floor tile. The pressure borne by the floor heating tile is uniform, and it will not cause the fracture of the floor heating tile. Even at the places where the floor heating tile is adjacent to and jointed with ordinary tiles, the heights of the two tiles are the same, there is no height difference, and the pressure-bearing capacity is the same, effectively avoiding the fracture and breakage of the composite electric heating floor tile caused by uneven stress on the tile due to long-term trampling and the local settlement and collapse of the floor heating tile laying area, and avoiding the danger of people being tripped and injured. 2. The installation is convenient: the shape and material of this floor heating tile are basically the same as those of ordinary tiles, and the installation process is also the same as that of ordinary tiles, without increasing the installation difficulty; installers do not need special training, and it will not increase the labor and installation costs. 3. The use is environmentally friendly: it does not require organic chemical materials such as rubber, polyester, polyurethane, and adhesives used in the composite insulation layer, heat conduction layer, and moisture preservation layer, does not require burning fossil fuels, and does not require covering with cement mortar. It will not emit and release toxic substances into the room during long-term use, will not cause environmental pollution, and will not harm human health. 4. The heat conduction is fast and efficient: it does not use water as the medium for heating, does not require secondary exchange, has small heat loss, and there are no problems of pipeline blockage and water leakage; and the distance between the electric heating chip and the heat dissipation surface of the tile body reaches the minimum, with high heat conduction efficiency, fast heating speed, and small energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0027] Figure 1 It is a schematic structural diagram of the floor heating tile in the embodiment of the present invention;

[0028] Figure 2 is a schematic structural view of the electrothermal chip in an embodiment of the present invention;

[0029] Figure 3 is a schematic structural view of the tile body in an embodiment of the present invention;

[0030] Figure 4 is a top view of the stamping die in an embodiment of the present invention.

[0031] Figures 1-4 In:

[0032] 1. Tile body; 101. Upper end face; 102. Lower end face; 2. Electrothermal chip; 201. First coiling structure; 202. Second coiling structure; 3. First groove; 4. Second groove; 401. Groove part; 402. Hole groove; 5. Male plug connector; 6. Female plug connector; 7. Power supply lead; 8. Parallel sealing joint; 9. Power supply busbar; 10. Thermostat; 11. Stamping die; 1101. Square groove; 12. Filler block. Detailed implementation manners

[0033] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other implementation manners obtained by those of ordinary skill in the art without creative efforts shall fall within the scope protected by the present invention.

[0034] The purpose of this detailed implementation manner is to provide a floor heating tile with an electrothermal chip fired in the tile body, to solve the problems in the prior art that the heat conduction efficiency of hot water and electrothermal floor heating technologies is low, the heating speed is slow, the energy consumption is large, the cost is high, and the composite electrothermal floor heating tile is prone to emit toxic and harmful substances, endangering human health, the construction is difficult, and it is easy to cause the tile to break, settle and collapse, increasing the risk of tripping and falling for people.

[0035] Hereinafter, the embodiments will be described with reference to the drawings. In addition, the embodiments shown below do not limit the content of the invention described in the claims in any way. Additionally, all the contents of the configurations shown in the following embodiments are not necessarily essential for the solution of the invention described in the claims.

[0036] Please refer to Figures 1-3, in this embodiment, the floor heating tile includes a tile body 1 and an electric heating chip 2. The electric heating chip 2 is electrically connected to a plug-in component. The tile body 1 is provided with a first groove 3 and a second groove 4. The first groove 3 is used for embedding the electric heating chip 2, and the thickness of the electric heating chip 2 is much smaller than that of the tile body 1. The second groove 4 is used for embedding the plug-in component, and the plug-in component is electrically connected to an external power supply, so that an electrical connection is achieved between the electric heating chip 2 and the external power supply, and the energization and de-energization of the electric heating chip 2 can be realized. Specifically, the plug-in component is composed of two parts, namely a plug and a socket. In a normal state, the two can be completely separated. The plug-in component has only two states: insertion and removal. The electrical connection is achieved by inserting the plug into the socket, and the power is cut off by removing the plug from the socket. The surface of the tile body 1 is convex or flush with the surfaces of the electric heating chip 2 and the plug-in component, that is, the surfaces of the electric heating chip 2 and the plug-in component do not protrude from the surface of the tile body 1, and the thickness of the floor heating tile will not increase due to the embedding of the electric heating chip 2. Therefore, the thickness of the floor heating tile is the thickness of the tile body 1, which is no different from the thickness of ordinary tiles. Optionally, the first groove 3 and the second groove 4 can be provided on the lower end surface 102 of the tile body 1, or can be provided inside the tile body 1, that is, neither the electric heating chip 2 nor the plug-in component is exposed from the surface of the tile body 1. In this way, by energizing and heating the electric heating chip 2, the electric heating chip 2 directly transfers heat to the tile body 1 to achieve heat supply. It should be noted that the "lower end surface 102" of the tile body 1 mentioned here is the reverse side of the tile usually used. Similarly, the upper end surface 101 of the tile body 1 is the front side of the tile usually used.

[0037] With such a setting, 1. Rational structure: The electric heating chip 2 is directly embedded in the ceramic tile body 1, and the electric heating chip 2 and the ceramic tile body 1 become an integral whole without increasing the thickness and installation layers of the floor heating ceramic tile; eliminating the structural defects of the mixed structure of rigid materials and plastic materials in the composite electric heating floor heating ceramic tile, the pressure borne by the floor heating ceramic tile is uniform, and it will not cause the fracture of the floor heating ceramic tile. Even at the adjacent and joint places of the floor heating ceramic tile and the ordinary ceramic tile, the heights of the two ceramic tiles are the same, without height difference, and the pressure-bearing capacity is the same, effectively avoiding the fracture and damage of the ceramic tile caused by uneven stress on the ceramic tile due to long-term trampling and the local settlement and collapse of the floor heating ceramic tile laying area, and avoiding the danger of people being tripped and injured. 2. Convenient installation: The appearance and material of this floor heating ceramic tile are the same as those of ordinary ceramic tiles, and the installation process is also the same as that of ordinary ceramic tiles, without increasing the installation difficulty; installers do not need special training, and it will not increase the labor and installation costs. 3. Environmentally friendly in use: There is no need for organic chemical materials such as rubber, polyester, polyurethane and adhesives used in the composite insulation layer, heat conduction layer and moisture preservation layer, no need to burn fossil fuels, and no need to cover with cement mortar. It will not emit and release toxic substances into the room during long-term use, will not cause environmental pollution, and will not harm human health. 4. Fast and efficient heat conduction: It does not use water as the heating medium, does not require secondary exchange, has small heat loss, and there are no problems of pipeline blockage and water leakage; and the spacing distance between the electric heating chip 2 and the upper end surface 101 (heat dissipation surface) of the ceramic tile body 1 reaches the minimum, with high heat conduction efficiency, fast heating speed and small energy consumption.

[0038] As an optional implementation manner, as Figure 2 shown, the electric heating chip 2 is a square loop structure as a whole. The loop structure includes a first coiled structure 201 and a second coiled structure 202. There is a symmetry plane between the first coiled structure 201 and the second coiled structure 202. The first coiled structure 201 and the second coiled structure 202 are symmetric about the symmetry plane, and the first end of the first coiled structure 201 is connected to the first end of the second coiled structure 202. The second end of the first coiled structure 201 and the second end of the second coiled structure 202 are both electrically connected to the plug-in part. Of course, the electric heating chip 2 can also be a graphic of other shapes, and mainly the distribution area needs to be determined. For how to determine the size of the electric heating chip 2 on a floor heating ceramic tile, first determine the total ceramic tile area in a fixed space. Usually, the area of laying floor heating ceramic tiles accounts for 40% of the total laying area, and the laying area of the floor heating ceramic tile can be determined; the heat of the floor heating ceramic tile continuously exchanges heat with the air in the space to realize indoor heating. According to the requirement that the surface temperature of the floor heating is greater than or equal to 35 °C and less than or equal to 50 °C, heat balance calculation can be carried out to determine the power range of the electric heating chip 2 on a floor heating ceramic tile. The resistivity of the electric heating chip 2 is related to its material. By using a certain material, the resistivity can be known. At the same time, according to the actual voltage, the total resistance can be known, and then the length of the electric heating chip 2 can be known, and the graphic of the electric heating chip 2 can be designed.

[0039] With such a setting, this kind of circuit pattern makes the distribution of the electrothermal chip 2 uniform, and the heat generation at each part is relatively uniform and consistent, so as to uniformly transfer the heat to the ceramic tile body 1.

[0040] As an alternative implementation manner, the first groove 3 is opened inside the ceramic tile body 1. The structure and size of the first groove 3 are the same as those of the electrothermal chip 2, that is, the electrothermal chip 2 is embedded inside the ceramic tile body 1 and does not protrude from the surface of the ceramic tile body 1; the second groove 4 is opened on the lower end surface 102 of the ceramic tile body 1, and the lower surface of the plug-in part is higher than or flush with the lower end surface 102 of the ceramic tile body 1, that is, the lower surface of the plug-in part is flush with or recessed from the lower end surface 102 of the ceramic tile body 1. In short, the plug-in part does not protrude from the surface of the ceramic tile body 1, and the thickness of the ceramic tile body 1 is the thickness of the floor heating ceramic tile.

[0041] With such a setting, the electrothermal chip 2 is arranged inside the ceramic tile body 1, and the ceramic tile body 1 completely surrounds the electrothermal chip 2. The heat generated by the electrothermal chip 2 when it is energized will ultimately be uniformly transferred to the ceramic tile body 1, causing the temperature of the ceramic tile body 1 to rise. Usually, the human body and the indoor air come into contact with the upper end surface 101 of the floor heating ceramic tile, that is, the heat dissipation surface. The plug-in part is arranged close to the lower end surface 102 of the ceramic tile body 1 to avoid the risk of electric shock caused by being close to the heat dissipation surface.

[0042] Specifically, the plug-in part includes a male plug 5 and a female plug 6, which can cooperate with each other. Among them, the male plug 5 is electrically connected to the electrothermal chip 2, and the female plug 6 is electrically connected to an external power supply. The second groove 4 includes a groove part 401 and a hole groove 402. The groove part 401 is used to accommodate the male plug 5, and the hole groove 402 is used to accommodate the female plug 6. The groove part 401, the hole groove 402 and the first groove 3 are all connected and communicated. Among them, the male plug 5 and the electrothermal chip 2 are fixedly connected by welding. Specifically, the male plug 5 is connected to the second end of the first circuit structure and the second end of the second circuit structure by welding. The electrothermal chip 2 and the male plug 5 are respectively fixedly arranged in the first groove 3 and the groove part 401. In this way, the energization and de-energization of the electrothermal chip 2 are realized by the insertion and extraction of the female plug 6.

[0043] As an alternative implementation, the male plug connector 5 includes two plug teeth, which are respectively connected to the second ends of the first circuit structure and the second circuit structure. The female plug connector 6 is provided with two jacks, which are respectively used for the partial insertion of the two plug teeth. The length of the plug teeth is relatively long, and the length of the jacks is less than that of the plug teeth. The plug teeth will not be completely inserted into the jacks, and the remaining part of the plug teeth will be surrounded by the tile body 1, that is, the outer surface of this part of the plug teeth fits against the wall surface of the groove part 401. Specifically, the thickness of the male plug connector 5 is about 0.8 mm to 1 mm. The hole groove 402 is located at the side end of the tile body 1. The lower surface of the female plug connector 6 is higher than the lower end surface 102 of the tile body 1, and the side surface of the female plug connector 6 is recessed from the side surface of the tile body 1, that is, the lower surface and the side surface of the female plug connector 6 will not protrude from the lower end surface 102 and the side surface of the tile body 1 respectively, and the volume of the female plug connector 6 is smaller than the volume of the hole groove 402.

[0044] In a preferred embodiment, the outer surface of the female plug connector 6 and the wall surface of the hole groove 402 are sealed by 704 silica gel resistant to a temperature of 250 °C, and the surface of the silica gel is flush with the surface of the tile body 1, that is, after the silica gel is filled, the lower surface of the silica gel is flush with the lower end surface 102 of the tile body 1, and the side surface of the silica gel is flush with the side surface of the tile body 1, and the silica gel fills the remaining space of the hole groove 402.

[0045] With such a setting, the interface of the female plug connector 6 is completely sealed to ensure the waterproof and insulation of the interface.

[0046] In a preferred embodiment, the floor heating tile further includes a power supply lead 7, which is equivalent to the wire mentioned above. The power of the power supply lead 7 is matched with the power of the electric heating chip 2. One end of the power supply lead 7 is connected to the female plug connector 6, and the other end is connected to the parallel sealing joint 8. The power supply lead 7 is arranged and laid under the tile body 1, and the parallel sealing joint 8 is electrically connected to an external power supply. Among them, the parallel sealing joints 8 connected to other floor heating tiles are connected in parallel to connect to the same external power supply for power supply.

[0047] In a preferred embodiment, the material of the electric heating chip 2 is nickel-chromium alloy foil material. Specifically, the electric heating chip 2 uses nickel-chromium alloy foil material with a metal grade of Cr20Ni80 and a thickness of 0.04 mm. Cr20Ni80 is a resistance heating alloy. Such alloys have a stable structure, stable electrical and physical properties, good high-temperature mechanical properties, good cold deformation plasticity, good weldability, and will not produce brittle fracture during long-term use. The melting point of this material is 1400 °C, and the firing temperature of the tile is less than 1250 °C. Therefore, the electric heating chip 2 will not fuse during the firing process of the floor heating tile. It is completely feasible to inlay the electric heating chip 2 made of this material into the tile body 1 and then fire it into a floor heating tile. Optionally, the male plug connector 5 is also made of nickel-chromium alloy foil material.

[0048] In addition, compared with nickel-chromium alloy, other alloy materials such as iron-chromium alloy have a lower melting point, shorter lifespan, and become brittle after repeated heating. Compared with ordinary electric heating wires and heating cable materials, under the condition of the same volume of electric heating materials, the effective heating area of the nickel-chromium alloy foil of the electric heating chip 2 is 25 times that of the electric heating wire and the heating cable, which exponentially increases its heating rate. Almost no useless work is done from the moment the power is turned on until the set temperature is reached, making it more energy-efficient.

[0049] Combined with the above various embodiments, the local heating tile will be specifically described. In this embodiment, the floor heating tile includes a tile body 1, an electric heating chip 2, and a power lead 7. The electric heating chip 2 is electrically connected to a male plug 5, and the male plug is matched with a female plug 6. The female plug 6 is electrically connected to the power lead 7. One end of the power lead 7 is connected to the female plug 6, and the other end is connected to a parallel sealing joint 8. The parallel sealing joint 8 is electrically connected to an external power supply. A first groove 3 for embedding the electric heating chip 2 and a groove part 401 for embedding the male plug 5 are provided in the tile body 1. A hole groove 402 for accommodating the female plug 6 is further provided on the lower end surface 102 of the tile body 1. The groove part 401 is communicated with the hole groove 402 and the first groove 3. The structure and size of the first groove 3 are the same as those of the electric heating chip 2. The outer surface of the male plug 5 fits against the wall surface of the groove part 401. The hole groove 402 is located at the side end of the tile body 1. The lower surface of the female plug 6 is higher than the lower end surface 102 of the tile body 1, and the side surface of the female plug 6 is recessed from the side surface of the tile body 1. And the outer surface of the female plug 6 is sealed with the wall surface of the hole groove 402 by silicone, and the surface of the silicone is flush with the surface of the tile body 1. The electric heating chip 2 has a square loop structure, and the loop structure includes a first coiling structure 201 and a second coiling structure 202. A symmetry plane is provided between the first coiling structure 201 and the second coiling structure 202. The first coiling structure 201 and the second coiling structure 202 are symmetric about the symmetry plane, and the first end of the first coiling structure 201 is connected to the first end of the second coiling structure 202. The second end of the first coiling structure 201 and the second end of the second coiling structure 202 are both electrically connected to the male plug 5. The material of the electric heating chip 2 is nickel-chromium alloy foil material.

[0050] With such a setting, the electric heating chip 2 is directly embedded in the tile body 1 without a cement layer, so it has high heat conduction efficiency, fast heating rate, low energy consumption, and low cost; moreover, there is no need for organic compounds such as insulating materials, thermal insulation materials, and adhesives, and no toxic substances will be emitted and it will not harm human health; the bearing capacity of the laid tiles is the same, and it will not cause tile fracture, settlement, and collapse, ensuring the flatness of the ground and making it not easy to trip and injure people.

[0051] The present invention also provides a floor heating tile assembly, which includes a plurality of the floor heating tiles in the above embodiments, and also includes a thermostat 10, as Figure 3As shown, each floor heating tile is respectively laid on the ground, and the plug-in connectors of each floor heating tile are electrically connected to the thermostat 10, and the thermostat 10 is electrically connected to an external power supply. Specifically, the thermostat 10 is equivalent to a controller, and a temperature sensor is provided on the controller. The temperature sensor can detect the temperature in the air. When the temperature sensor detects that the air temperature reaches the first preset value, the thermostat 10 controls the plug-in connector to cut off the power, so that the electric heating chip 2 stops heating; when the temperature sensor detects that the air temperature drops to the second preset value, the thermostat 10 controls the plug-in connector to be powered on, so that the electric heating chip 2 is powered on and heated. It should be noted that the first preset value is higher than the second preset value. For example, the first preset value is 20 degrees and the second preset value is 10 degrees. When the temperature sensor detects that the room temperature reaches 20 degrees, the thermostat 10 will control the power between the electric heating chips 2 to be cut off, and the electric heating chip 2 will no longer continue to heat; when the temperature sensor detects that the room temperature drops to 10 degrees, the thermostat 10 will control the power between the electric heating chips 2 to be turned on, and the electric heating chip 2 will continue to heat. Specifically, the thermostat 10 of the UJIA 629 / 20SD model can actually be used.

[0052] With such a setting, a temperature control system is formed between the floor heating tile and the thermostat 10, and the thermostat 10 can automatically control the room temperature.

[0053] As an optional implementation manner, the thermostat 10 is electrically connected to a power bus 9, and the parallel sealed joints 8 of each floor heating tile are electrically connected to the power bus 9. Specifically, the thermostat 10 is electrically connected to the power bus 9 and an external power supply, so the thermostat 10 can control the power on and off between the power bus 9 and the external power supply to realize the power on and off of the electric heating chip 2.

[0054] With such a setting, the heating temperature of the electric heating chip 2 on all the floor heating tiles in the room can be controlled by one thermostat 10 and one external power supply.

[0055] The present invention also provides a preparation process for a floor heating tile, including:

[0056] In the first step, the electric heating chip 2 is cut by laser, and the male plug connector 5 is welded to the electric heating chip 2 by laser. Specifically, first, the electric heating chip 2 is processed. According to the introduction content of the above electric heating chip 2, the resistance value data of the electric heating chip 2 needs to be calculated in advance to determine the distribution area of the electric heating chip 2 on each floor heating tile, that is, the cutting size of the electric heating chip 2. Then, according to the designed loop graphic pattern, the laser cutting process is used to remove the redundant material to obtain the electric heating loop required by the electric heating chip 2; then, the preset interface between the electric heating chip 2 and the power lead 7, that is, the male plug connector 5, is set. The male plug connector 5 made of Cr20Ni80 material with a standard cross-sectional size is used, and the two plug teeth of the male plug connector 5 are respectively welded to both ends of the loop of the electric heating chip 2 through the laser welding process to complete the interface setting between the electric heating chip 2 and the power lead 7.

[0057] Step 2: Fabricate the filler block 12 to prepare for forming the hole groove 402 later. The shape and size of the filler block 12 are the same as those of the hole groove 402, that is, the hole groove 402 is formed by the filler block 12. The material of the filler block 12 is silicone rubber. Fabricate the filler block 12 according to the size of the required hole groove 402, and set openings at corresponding positions of the filler block 12 for mating with the insertion teeth of the male plug connector 5. Then insert the insertion teeth of the male plug connector 5 into the openings of the filler block 12. In this way, the electrothermal chip 2, the male plug connector 5, and the filler block 12 are connected as a whole.

[0058] Specifically, the molecular formula of silicone rubber is mSIO2•nH2O. When the temperature reaches 400ºC, it will lose its crystal water and decompose into silicon dioxide powder. Since the melting point of silicon dioxide is between 1600ºC and 1700ºC, which is much higher than the firing temperature of the ceramic tile, it will neither melt during the firing process of the ceramic tile nor agglomerate after cooling. Moreover, the powder is extremely easy to clean, and the powder can be removed by blowing, thus forming the hole groove 402.

[0059] Step 3: As Figure 4 shown, put the first part of the brick blank material in powder form into the square groove 1101 of the stamping die 11, and then put the electrothermal chip 2, the male plug connector 5, and the filler block 12 into the square groove 1101 of the stamping die 11. The electrothermal chip 2, the male plug connector 5, and the filler block 12 are all located on the upper surface of the first part of the brick blank material. The upper surfaces of the electrothermal chip 2 and the male plug connector 5 are both lower than the notch position of the square groove 1101. In this way, the depth value of the square groove 1101 is the thickness value of the floor heating ceramic tile, which does not affect the overall thickness of the floor heating ceramic tile. Since the electrothermal chip 2, the male plug connector 5, and the filler block 12 are put in before the next feeding, the brick blank material will directly form the first groove 3, the groove part 401, and the hole groove 402. Then align the outer side surface of the filler block 12 with the side wall of the square groove 1101, thereby positioning the electrothermal chip 2. Of course, in other embodiments, the position of the filler block 12 can be determined first, that is, the outer side surface of the filler block 12 is first aligned with the side wall of its square groove 1101, and then the insertion teeth of the male plug connector 5 are inserted into the insertion holes of the filler block 12, which can also position the electrothermal chip 2.

[0060] Specifically, the stamping die 11 is the one used in the prior art and does not need to be modified. Only the traditional one-time feeding is changed to two-time feeding. It should be noted that the "upper surface" of the electric heating chip 2 and the "upper surface" of the male plug connector 5 mentioned here are both the surfaces close to the notch of the square groove 1101; for the ceramic tile body 1 processed in the square groove 1101, the surface of the ceramic tile body 1 corresponding to the bottom of the square groove 1101 is the upper end surface 101 of the ceramic tile body 1 in the laying state, and the surface of the ceramic tile body 1 corresponding to the notch of the square groove 1101 is the lower end surface 102 of the ceramic tile body 1 in the laying state. Therefore, the electric heating chip 2 and the plug-in part are located at the upper position of the square groove 1101, which is equivalent to using it upside down when laying the floor heating ceramic tile.

[0061] Fourth step, continue to put the second part of the brick blank material in powder form into the square groove 1101 of the stamping die 11. The electric heating chip 2 and the male plug connector are not exposed, and the filler block 12 is exposed. Then stamp the second part of the brick blank material, so that the first part of the brick blank material and the second part of the brick blank material jointly form the required ceramic tile body 1.

[0062] Fifth step, perform processes such as drying, glazing, grinding the glaze, printing, firing, and edge grinding on the ceramic tile body 1 to make a floor heating ceramic tile integrating the electric heating chip 2 and the ceramic tile body 1. During the firing process, the filler block 12 is in an environment of about 1250 °C. The filler block 12 will directly lose the crystal water and become silicon dioxide powder. After the silicon dioxide powder is cleaned by means such as blowing, a hole groove 402 will be formed at this place. In this way, during the firing process of the ceramic tile blank embedded with the electric heating chip 2, the filler block 12 made of silicone rubber material will decompose into silicon dioxide powder due to water loss and naturally form a hole groove 402 at the side end of the ceramic tile body 1, and there is no need to remove the filler block 12 with effort.

[0063] With such a setting, the whole manufacturing process has two-time feeding, and the hole groove 402 is naturally formed by using the special material of the filler block 12, which reduces the manufacturing difficulty of the whole process and is easy to manufacture.

[0064] It can be understood that the same or similar parts in the above embodiments can be referred to each other. The content not detailed in some embodiments can be seen in the same or similar content in other embodiments. The multiple solutions provided by the present invention include the basic solutions of themselves, which are independent of each other and do not restrict each other. However, they can also be combined with each other without conflict to achieve the co-realization of multiple effects.

[0065] As described above, it is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims described above.

Claims

1. A preparation process of a floor heating tile, characterized in that, For preparing a floor heating tile for firing an electrothermal chip into a tile body, the floor heating tile includes a tile body (1) and an electrothermal chip (2). The electrothermal chip (2) is electrically connected to a plug-in connector. The tile body (1) is provided with a first groove (3) for embedding the electrothermal chip (2) and a second groove (4) for embedding the plug-in connector. The plug-in connector is electrically connected to an external power supply, and the surface of the tile body (1) protrudes or is flush with the surfaces of the electrothermal chip (2) and the plug-in connector. The plug-in connector includes a male plug (5) and a female plug (6) that can cooperate with each other. The second groove (4) includes a groove portion (401) for accommodating the male plug (5) and a hole groove (402) for accommodating the female plug (6). The groove portion (401) communicates with the hole groove (402) and the first groove (3); Including: laser cutting the electrothermal chip (2) and welding the male plug (5) to the electrothermal chip (2) by laser; Opening an opening for cooperating with the teeth of the male plug (5) on a filler block (12) made of silicone rubber material, and the shape and size of the filler block (12) are the same as those of the hole groove (402), and then inserting the teeth of the male plug (5) into the opening of the filler block (12); Putting a first part of brick blank material in powder form into the square groove (1101) of a stamping die (11), then putting the electrothermal chip (2), the male plug (5), and the filler block (12) into the square groove (1101) of the stamping die (11), and aligning the outer side surface of the filler block (12) with the side wall of the square groove (1101) to position the electrothermal chip (2); Continuing to put a second part of brick blank material in powder form into the square groove (1101) of the stamping die (11) and stamping the second part of the brick blank material so that the first part of the brick blank material and the second part of the brick blank material jointly form the tile body (1); Performing processes of drying, glazing, grinding the glaze, printing, firing, and edge grinding on the tile body (1). During the firing process, the filler block (12) loses crystal water and becomes silicon dioxide powder, and after cleaning the silicon dioxide powder, the hole groove (402) is formed.

2. The preparation process of the floor heating tile according to claim 1, characterized in that, The electrothermal chip (2) is a square loop structure. The loop structure includes a first coiling structure (201) and a second coiling structure (202). There is a symmetry plane between the first coiling structure (201) and the second coiling structure (202). The first coiling structure (201) and the second coiling structure (202) are symmetric about the symmetry plane, and the first end of the first coiling structure (201) is connected to the first end of the second coiling structure (202). The second end of the first coiling structure (201) and the second end of the second coiling structure (202) are both electrically connected to the plug-in connector.

3. The preparation process of the floor heating tile according to claim 1, characterized in that, The first groove (3) is formed in the tile body (1), and the second groove (4) is formed on the lower end surface (102) of the tile body (1). The structure and size of the first groove (3) are the same as those of the electrothermal chip (2). The lower surface of the plug-in member is higher than or flush with the lower end surface (102) of the tile body (1).

4. The preparation process of the floor heating tile according to claim 3, characterized in that, The male plug connector (5) is electrically connected to the electrothermal chip (2), and the female plug connector (6) is electrically connected to an external power supply.

5. The preparation process of the floor heating tile according to claim 4, characterized in that, The male plug connector (5) includes two insertion teeth which are respectively connected to both ends of the electrothermal chip (2). The female plug connector (6) is provided with insertion holes for the insertion teeth to partially insert. The outer surface of the insertion teeth is in contact with the groove wall surface of the groove portion (401). The hole groove (402) is provided at the side end of the tile body (1). The lower surface of the female plug connector (6) is higher than the lower end surface (102) of the tile body (1), and the side surface of the female plug connector (6) is recessed from the side surface of the tile body (1).

6. The preparation process of the floor heating tile according to claim 4, characterized in that, It further includes a power lead (7). One end of the power lead (7) is connected to the female plug connector (6), and the other end is connected to a parallel sealing joint (8). The parallel sealing joint (8) is electrically connected to an external power supply.

7. The preparation process of the floor heating tile according to claim 1, characterized in that, The electrothermal chip (2) is made of a nickel-chromium alloy foil material.

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