A magnetic field shielding structure for electronic chip

Abstract

The present invention relates to a magnetic field shielding structure of an electronic chip, which comprises a chip body, a packaging shell arranged outside the chip body, and a magnetic field guide arranged in the packaging shell. The present invention guides the magnetic field generated by the chip body by arranging a magnetic field guide in the electronic chip, limits the direction of the magnetic field within a certain space, or compresses the magnetic field diffusion space, thereby realizing the magnetic field shielding of the electronic chip and preventing the electronic devices around the electronic chip from being subjected to electromagnetic interference. Moreover, the magnetic field guide of the present invention is integrated or packaged in the electronic chip, avoiding the use of a shielding cover, thereby reducing the installation space of the electronic device and making the electronic product more miniaturized.

Description

Technical Field

[0001] The invention relates to the field of electronic chips, and in particular to a magnetic field shielding structure of an electronic chip. Background Art

[0002] The core of electronic products is the circuit board, and various electronic chips are generally installed on the circuit board. With the continuous upgrading of the functions of electronic products, the electronic chip modules installed on the circuit board are becoming more and more dense, and each electronic chip will have a certain magnetic field. If different electronic chips are too close, electromagnetic interference will occur between the electronic chips. Electromagnetic interference will seriously affect the performance of electronic products.

[0003] In the prior art, in order to overcome electromagnetic interference between various electronic chips, a shielding cover is generally provided to surround the electronic chip. However, the general shielding cover occupies a large space, which is not conducive to the current thin design of electronic products.

[0004] In view of the electromagnetic interference problem existing in existing electronic products, the designer conducted in-depth thinking and thus produced the present invention. Summary of the invention

[0005] In view of the problems existing in the prior art, the purpose of the present invention is to provide a magnetic field shielding structure for an electronic chip, which has a simple structure and can avoid the use of a shielding cover, thereby reducing the installation space of the electronic device.

[0006] To achieve the above object, the technical solution adopted by the present invention is:

[0007] A magnetic field shielding structure of an electronic chip comprises a chip body, a packaging shell arranged outside the chip body, and a magnetic field guide arranged in the packaging shell.

[0008] The magnetic field guide is made of magnetic conductive material and / or diamagnetic material.

[0009] The magnetic field guide is arranged on the inner side of the packaging shell, on the chip body and / or in the chip body.

[0010] The chip body is provided with a through hole, and the magnetic field guide is arranged in the through hole.

[0011] The magnetic field guide is plated on the outer surface of the chip body.

[0012] The chip body is provided with a plurality of circuit layers, and the magnetic field guide is arranged in a plane between two circuit layers.

[0013] The magnetic field guide is a coil assembly.

[0014] The magnetic field guide is arranged on the inner side of the packaging shell or on the chip body in a planar structure.

[0015] The magnetic field direction of the coil group is opposite to the magnetic field direction of the chip body.

[0016] The present invention provides a magnetic field guide in the electronic chip to guide the magnetic field generated by the chip body, limit the direction of the magnetic field within a certain space, or compress the magnetic field diffusion space, thereby realizing magnetic field shielding of the electronic chip and preventing the electronic devices around the electronic chip from being subjected to electromagnetic interference. Moreover, the magnetic field guide of the present invention is integrated or packaged in the electronic chip, avoiding the use of a shielding cover, thereby reducing the installation space of the electronic device and making the electronic product more miniaturized. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the magnetic field distribution of an electronic chip according to an embodiment of the present invention;

[0018] Figures 2 to 4 Schematic diagram of magnetic field distribution of an electronic chip when the magnetic field guide member is a diamagnetic material in Embodiment 1;

[0019] Figures 5 to 7 Schematic diagram of magnetic field distribution of an electronic chip when the magnetic field guide member is a magnetic conductive material in Embodiment 1;

[0020] Figures 8 to 9 Schematic diagram of magnetic field distribution of an electronic chip when the magnetic field guide member is a diamagnetic material in Embodiment 2;

[0021] Figure 10 to Figure 11 Schematic diagram of magnetic field distribution of an electronic chip when the magnetic field guide member is a magnetic conductive material in Embodiment 2;

[0022] Fig.12 Schematic diagram of magnetic field distribution of an electronic chip when the magnetic field guide member is a diamagnetic material in Embodiment 3;

[0023] Fig.13 Schematic diagram of magnetic field distribution of an electronic chip when the magnetic field guide member is a magnetic conductive material in Embodiment 3;

[0024] Fig.14 This is a schematic diagram of the structure of the chip body in the fourth embodiment;

[0025] Fig.15 Schematic diagram of magnetic field distribution of the electronic chip in Example 4;

[0026] Figure 16 to Figure 17 Schematic diagram of magnetic field distribution of the electronic chip in Example 5. DETAILED DESCRIPTION

[0027] The present invention discloses a magnetic field shielding structure of an electronic chip, which comprises a chip body 10, a packaging shell arranged outside the chip body 10, and a magnetic field guide 20 arranged inside the packaging shell.

[0028] The magnetic field guide 20 can be a magnetic conductive material, a diamagnetic material or a coil group, or a combination of any two or more thereof. To describe the present invention in detail, five embodiments are listed below.

[0029] Embodiment 1

[0030] In this embodiment, the magnetic field guide 20 is arranged in the packaging shell, which can be a magnetic conductive material or a diamagnetic material. The magnetic field guide 20 can be wrapped outside the chip body 10 in a closed or semi-closed form. When the magnetic field guide 20 is wrapped outside the chip body 10 in a closed form, the magnetic field generated by the chip body 10 is confined in the packaging shell and will not spread outward. When the magnetic field guide 20 is wrapped outside the chip body 10 in a semi-closed form, the magnetic field generated by the chip body 10 will not spread everywhere, and its diffusion direction is the direction in which the magnetic field guide 20 is not set in the packaging shell.

[0031] Figures 2 to 4 , a schematic diagram of the magnetic field of the chip body 10 when the magnetic field guide 20 is a diamagnetic material. Figure 1 compared to, Figure 2 The diamagnetic material is enclosed outside the chip body 10 in a closed form, and the magnetic field generated by the chip body 10 is confined to the space surrounded by the diamagnetic material. Figure 1 compared to, Figure 3 and Figure 4 The diamagnetic material is wrapped around the chip body 10 in a semi-closed form, and the magnetic field generated by the chip body 10 is mostly confined in the space surrounded by the diamagnetic material, and the magnetic field can only diffuse in the opening direction.

[0032] Figures 5 to 7 Schematic diagram of the magnetic field of the chip body 10 when the magnetic field guide 20 is a magnetic conductive material. Figures 2 to 4 Similarly, the magnetic field of the chip body 10 is confined in the space surrounded by the magnetic conductive material. The difference is that when the magnetic conductive material is used, the magnetic conductive material will absorb the magnetic lines of force, so that the magnetic lines of force are transmitted in the magnetic conductive material.

[0033] That is to say, when the electronic chip adopts the structure of this embodiment, the magnetic field generated by the chip body 10 will not diffuse outward, or will not diffuse in certain directions, so when other electronic devices are arranged in these directions, these electronic devices will not be disturbed by the magnetic field of the electronic chip.

[0034] Embodiment 2

[0035] In this embodiment, the magnetic field guide 20 is disposed inside the chip body 10 or on the surface of the chip body 10 , and can be a magnetic conductive material or a diamagnetic material.

[0036] Figure 8 and Fig. 9 In the embodiment, the magnetic field guide 20 is a diamagnetic material, which is arranged on or inside the chip body 10 in a columnar structure. At this time, the magnetic field generated by the chip body 10 will be repelled by the diamagnetic material and concentrated at other positions, so that there is no magnetic field at the position corresponding to the diamagnetic material. In this way, other electronic devices can be arranged around the diamagnetic material to avoid magnetic field interference of the electronic chip.

[0037] Fig.10 and Fig.11 In the embodiment, the magnetic field guide 20 is a magnetic conductive material, which is arranged on or inside the chip body 10 in a columnar structure. At this time, the magnetic field generated by the chip body 10 will be absorbed by the magnetic conductive material, resulting in the magnetic field being concentrated at the magnetic conductive material, and the magnetic field diffusion space is therefore compressed, thereby reducing the radiation range of the chip body 10.

[0038] Embodiment 3

[0039] When the magnetic field surrounding the electronic chip needs to act on other devices in a certain direction to achieve a certain function, the first embodiment and the second embodiment can be combined together, that is, a magnetic field guide 20 is arranged in the packaging shell, and the magnetic field guide 20 is wrapped around the chip body 10 in a semi-closed form, and a columnar magnetic conductive material 30 is also arranged inside or on the surface of the chip body 10, and the opening position of the magnetic field guide 20 corresponds to that of the magnetic conductive material 30.

[0040] like Fig.12 and Fig.13 As shown, the magnetic field guide 20 in this embodiment can be either a diamagnetic material or a magnetic conductive material. In this way, by arranging electronic devices in certain directions, electromagnetic interference from electronic chips can be avoided, and by arranging electronic devices in certain directions, they can interact with the magnetic field of the electronic chip to achieve certain functions, and by arranging the magnetic conductive material 30 at the position of the corresponding opening for guidance, the magnetic field in this direction can be strengthened, thereby strengthening the degree of interaction between the magnetic field of the chip body 10 and other electronic devices, and improving the effect of achieving the function.

[0041] Embodiment 4

[0042] like Fig.14 As shown, in this embodiment, the chip body 10 is provided with a plurality of circuit layers 11, so that the magnetic field guide 20 is provided in a plane between two circuit layers 11. The magnetic field guide 20 can be either a diamagnetic material or a magnetically conductive material.

[0043] like Fig.15As shown, the magnetic field guide 20 is made of diamagnetic material. At this time, the magnetic field generated by the chip body 10 will be compressed by the diamagnetic material, so that the magnetic field of the chip body 10 is concentrated upward instead of being dispersed everywhere, thereby reducing the magnetic field diffusion space of the electronic chip, thereby avoiding electromagnetic interference to peripheral electronic devices.

[0044] The magnetic field guide 20 can also be made of magnetic conductive material. In this case, the magnetic field generated by the chip body 10 will be absorbed by the magnetic conductive material and then reflected back, so that the magnetic field of the chip body 10 is concentrated upward instead of being dispersed everywhere, thereby reducing the magnetic field diffusion space of the electronic chip and avoiding electromagnetic interference to surrounding electronic devices.

[0045] Of course, the magnetic field guide 20 can also be disposed on the outer surface of the chip body 10 by sputtering, evaporation, etc., and the magnetic field change is similar to Fig.15 Similarly, the magnetic field space of the chip body 10 can also be compressed.

[0046] Embodiment 5

[0047] In this embodiment, the magnetic field guide 20 is a coil assembly, which is arranged in a planar structure in the packaging shell or on the chip body 10 . The magnetic field direction of the coil assembly is opposite to the magnetic field direction of the chip body 10 .

[0048] like Fig.16 and Fig.17 As shown, the magnetic field of the chip body 10 is compressed by the coil assembly, so that the magnetic field of the chip body 10 is concentrated upward instead of being dispersed everywhere, thereby reducing the magnetic field diffusion space of the electronic chip, thereby preventing peripheral electronic devices from being affected by electromagnetic interference.

[0049] In summary, the present invention guides the magnetic field generated by the chip body 10 by arranging a magnetic field guide 20 in the electronic chip, limits the direction of the magnetic field within a certain space, or compresses the magnetic field diffusion space, thereby realizing the magnetic field shielding of the electronic chip and preventing the electronic devices around the electronic chip from being subjected to electromagnetic interference. Moreover, the magnetic field guide 20 of the present invention is integrated or packaged in the electronic chip, avoiding the use of a shielding cover, thereby reducing the installation space of the electronic device and making the electronic product more miniaturized.

[0050] The above description is merely an embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A magnetic field shielding structure for an electronic chip, Features: It includes a chip body, a packaging shell arranged outside the chip body, and a magnetic field guide member arranged in the packaging shell; The magnetic field guide is wrapped outside the chip body in a semi-closed form. A magnetic conductive material is arranged inside or on the surface of the chip body, and the magnetic conductive material corresponds to the opening position of the magnetic field guide.

2. The magnetic field shielding structure of an electronic chip according to claim 1, Features: The magnetic field guide is made of magnetic conductive material and / or diamagnetic material.

3. The magnetic field shielding structure of an electronic chip according to claim 2, Features: The magnetic field guide is arranged on the inner side of the packaging shell and / or the chip body.

4. The magnetic field shielding structure of an electronic chip according to claim 3, Features: The magnetic field guide is plated on the outer surface of the chip body.

5. The magnetic field shielding structure of an electronic chip according to claim 1, Features: The magnetic field guide is a coil group; the magnetic field direction of the coil group is opposite to the magnetic field direction of the chip body.

6. The magnetic field shielding structure of an electronic chip according to claim 5, Features: The magnetic field guide is arranged on the inner side of the packaging shell or on the chip body in a planar structure.

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