Method and apparatus for terminating a cable to an integrated circuit

Abstract

The electrical components are configured to allow cables to be mounted directly to the package substrate, such that the electrical traces on the package substrate directly enable the cables to be electrically connected to the integrated circuit mounted to the package substrate, without passing through any separable interface of the electrical connector.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to U.S. Patent Application Serial No. 62 / 856,119, filed November 14, 2017, the disclosure of which is incorporated herein by reference as if fully set forth herein.

[0003] background

[0004] Data communication systems continuously demand higher data transmission speeds while maintaining adequate signal integrity. Some data communication system architectures include cables electrically connected to integrated circuits such as application-specific integrated circuits (ASICs). One such data communication system, described in U.S. Patent No. 9,660,364, includes a cable terminated to an electrical connector, such as a top-side connector or an edge connector. This electrical connector then electrically couples the cable to a package substrate and ultimately to an integrated circuit mounted on the package substrate. Summary of the Invention

[0005] In one example, this disclosure describes an electrical component. The electrical component may include: a substrate having a first layer and a second layer adjacent to the first layer; and an integrated circuit mounted to the first layer such that electrical signal traces on the substrate are electrically connected to the integrated circuit. An electrical signal conductor of a cable may be configured to be mounted to the first layer such that the electrical signal conductor is electrically connected to the integrated circuit along the electrical signal traces on the substrate, and an electrically grounding element of the cable, electrically insulated from the electrical signal conductor, may be configured to be mounted to the second layer. Brief description of the attached diagram

[0007] Any feature or combination of features described herein is included within the scope of this disclosure, provided that the features included in any combination are not contradictory from the context, the application, and the knowledge of one skilled in the art. Further advantages and aspects of this disclosure will become apparent from the following detailed description, claims, and accompanying drawings:

[0008] Figure 1 This is a schematic perspective view of an electrical component, which includes a multilayer packaging substrate and at least one integrated circuit mounted to the packaging substrate.

[0009] Figure 2 According to one embodiment Figure 1 An enlarged perspective cross-sectional view of a portion of the electrical component shown;

[0010] Figure 3 It is constructed according to another embodiment. Figure 2 An enlarged perspective view of a portion of the first layer of the packaging substrate shown, illustrating multiple cables mounted to the packaging substrate;

[0011] Figure 4A yes Figure 1 The side cross-sectional view of a portion of the electrical component shown illustrates the cable mounted to the package substrate;

[0012] Figure 4B yes Figure 4A A top view of a portion of the electrical component shown;

[0013] Figure 5A The manufacturing process includes... Figure 1 A schematic diagram of the first wafer processing step in the method for making an electrical connector for an electrical component shown;

[0014] Figure 5B A schematic diagram illustrating the second dicing step in a method for manufacturing an electrical connector;

[0015] Figure 5C A schematic diagram of the third molding step in a method for manufacturing an electrical connector is shown.

[0016] Figure 5D A schematic diagram of the fourth singulating step in the method of manufacturing an electrical connector is shown.

[0017] Figure 5E A schematic diagram of the fifth cable attachment step in a method for manufacturing an electrical connector is shown;

[0018] Figure 5F A schematic diagram illustrating the sixth protection step in a method for manufacturing an electrical connector; and

[0019] Figure 6 yes Figure 1 The electrical component shown includes a perspective view of a cover attached to the packaging substrate.

[0020] Detailed description

[0021] Reference Figures 1 to 4B The electrical component 20 can be configured as an integrated circuit package. The electrical component 20 may therefore include a first substrate, which may be referred to as a package substrate 22, and at least one integrated circuit 24 mounted to the package substrate 22. For example, the electrical component 20 may include multiple integrated circuits 24 mounted to the package substrate 22. The integrated circuit 24 may be configured as an application-specific integrated circuit (ASIC), but it should be understood that the integrated circuit 24 may be any suitable alternative integrated circuit as desired, such as a general-purpose integrated circuit.

[0022] The package substrate 22 may include a first layer 26 and a second layer 28 adjacent to the first layer along a first direction. The first direction may be oriented along a transverse direction T. The package substrate 22 may be flat along a plane defined by a longitudinal direction L and a lateral direction A, wherein the longitudinal direction L is perpendicular to the transverse direction T, and the lateral direction A is perpendicular to each of the longitudinal direction L and the transverse direction T. As shown, the transverse direction T may be oriented vertically, and both the longitudinal direction L and the lateral direction A may be oriented horizontally. However, it should be understood that these directions may vary depending on the orientation of the electrical component 20 during use.

[0023] The first layer 26 may define a corresponding first surface 26a facing away from the second layer 28. The second layer 28 defines a second surface 28b facing away from the first layer 26. The first surface 26a and the second surface 28b may be opposite to each other in the lateral direction. The first layer 26 and the second layer 28 may be separate from each other and fused together. Alternatively, the first layer and the second layer may be integral to each other. The first layer 26 may further define a corresponding second surface 26b facing the corresponding first surface 26a in the lateral direction T. Similarly, the second layer 28 may define a corresponding first surface 28a facing the second surface 28b in the first direction. The first surface 28a of the second layer 28 may face the second surface 26b of the first layer 26. For example, the first surface 28a of the second layer 28 may be adjacent to the second surface 26b of the first layer 26.

[0024] In one example, a package substrate 22 may be manufactured to define an interface between a first layer 26 and a second layer 28. In this respect, the package substrate 22 defines the interface between the first layer 26 and the second layer 28, regardless of whether the first and second layers are separate or integral. Furthermore, the first surface 26a of the first layer 26 can be considered the upper surface defining the package substrate 22, and the second surface 28b of the second layer 28 can be considered the lower surface defining the package substrate 22. It should be understood that the orientation of the package substrate 22 may differ from the orientation shown during use.

[0025] In one example, the encapsulation substrate 22 may be a glass substrate. Therefore, one or both of the first layer 26 and the second layer 28 may be made of glass. In one example, the glass substrate may be made of borosilicate. In another example, the glass substrate may be made of quartz. Alternatively, the glass substrate may be made of one or more, or all, of borosilicates, aluminosilicates, and quartz, wherein quartz includes single-crystal quartz and synthetic quartz. When the encapsulation substrate 22 is made of glass, it may alternatively be made of any suitable alternative glass substrate material or a combination thereof. Alternatively, the substrate 22 may be made of any suitable non-glass material as needed. Therefore, either or both of the first layer 26 and the second layer 28 may be made of a non-glass material. In other examples, the encapsulation substrate 22 may be made of sapphire, silicon, zinc oxide, zirconium oxide, ceramic, or a combination thereof, wherein zirconium oxide includes yttria-stabilized zirconia. In some examples, the encapsulation substrate 22 may be made of lead-free glass, meaning the glass substrate may be lead-free, including lead oxide, lead alloys, lead compounds, and all lead components. Alternatively, the glass substrate may contain a certain amount of lead as required. The terms "lead-free," "lead-free," and their derivatives therefore indicate that the lead content complies with the Restriction of Hazardous Substances Directive (RoHS). In one example, the terms "lead-free," "lead-free," and their derivatives may therefore indicate a lead content of less than 0.1% by weight. Alternatively or additionally, the terms "lead-free," "lead-free," and their derivatives may indicate a lead content of less than 0.1% by volume. In another example, the terms "lead-free," "lead-free," and their derivatives may indicate a lead content of less than 100 parts per million (ppm).

[0026] Integrated circuit 24 may be mounted to the first layer 26. Specifically, integrated circuit 24 may be mounted to a first surface 26a of the first layer 26, such that the first layer 26 is disposed between integrated circuit 24 and the second layer 28 relative to the lateral direction T. Electrical component 20 may also include a second substrate 23, which may be configured as a printed circuit board. As described in more detail below, package substrate 22 may be mounted to the second substrate 23 to establish an electrical connection between package substrate 22 and the second substrate 23.

[0027] The second layer 28, and specifically the second surface 28b, may be mounted to the second substrate 23 such that the second layer 28 is disposed between the second substrate 23 and the first layer 26. The package substrate 22 may include at least one electrical signal trace 30, such as a plurality of electrical signal traces 30, which are electrically connected to the integrated circuit 24. In one example, the first layer 26 may include at least one electrical signal trace 30. The electrical signal trace 30 may extend to the integrated circuit 24. That is, the integrated circuit 24 may be mounted to the package substrate 22 such that the electrical signal trace is in direct contact with the integrated circuit 24. In one example, at least a portion, up to the entire electrical signal trace 30, may extend along the first surface 26a of the first layer 26. However, it should be understood that the electrical signal trace 30 may be carried by the substrate 22 in any manner as needed. For example, alternatively or additionally, at least a portion of the electrical signal trace 30 may be carried by the substrate 22 between the first surface 26a and the second surface 26b of the first layer 26, and at a location including the first surface 26a and the second surface 26b of the first layer 26. Thus, at least a portion of the electrical signal trace 30 may be embedded within the first layer 26 between the first surface 26a and the second surface 26b. However, it should be understood that at least a portion of the electrical signal trace 30 may be disposed within the package substrate 22 at any location from the first surface 26a to the second surface 28b, and including both the first surface 26a and the second surface 28b.

[0028] The package substrate 22 may further include at least one electrical ground trace 45, such as a plurality of electrical ground traces 45, which are electrically connected to the integrated circuit 24. For example, the second layer 28 may include at least one electrical ground trace 45. The electrical ground trace 45 may extend to the integrated circuit 24. That is, the integrated circuit 24 may be mounted to the package substrate 22 such that the electrical ground trace 45 is in direct contact with the integrated circuit 24. In one example, at least a portion of the electrical ground trace 45, up to the entire electrical ground trace 45, may extend along the first surface 28a of the second layer 28. However, it should be understood that the electrical ground trace 45 may be carried by the substrate 22 in any manner as needed. For example, alternatively or additionally, at least a portion of the electrical ground trace 45 may be carried by the substrate 22 between the first surface 28a and the second surface 28b of the second layer 28, and at a location including the first surface 28a and the second surface 28b of the second layer 28. Therefore, at least a portion of the grounding trace 45 may be embedded within the second layer 28 between the first surface 28a and the second surface 28b. However, it should be understood that at least a portion of the grounding trace 30 may be disposed within the package substrate 22 at any location from the first surface 26a to the second surface 28b, including both the first and second surfaces 28b.

[0029] Electrical component 20 may include at least one cable 32 configured to be in electrical communication with a corresponding at least one integrated circuit 24. Specifically, at least one cable 32 may be mounted to a package substrate 22 such that the package substrate 22 provides electrical communication between the at least one cable 32 and the corresponding at least one integrated circuit 24. Cable 32 may include at least one electrical signal conductor 34 and at least one grounding element 36, which is electrically insulated from the electrical signal conductor 34. Each cable 32 may also include an electrical shield 33 that provides electrical shielding for the corresponding at least one electrical signal conductor 34. Cable 32 may be configured as a coaxial cable, biaxial cable, or multi-core cable as needed. Cable 32 may be configured as a single cable, a bundled cable, or a ribbon cable. For example, multiple cables up to all cables 32 may be configured as a flexible circuit.

[0030] Cable 32 may be mounted to package substrate 22 such that electrical signal conductor 34 is electrically connected to at least one corresponding integrated circuit 24 along at least one corresponding electrical signal trace 30. Furthermore, cable 32 may be mounted to package substrate 22 such that ground element 36 is electrically connected to at least one corresponding integrated circuit 24 along at least one corresponding electrical ground trace 45. Specifically, as will now be described, package substrate 22 may be configured such that electrical signal conductor 34 is mounted to a first layer 26 and electrical ground element 36 is mounted to a second layer 28.

[0031] The electrical signal conductor 34 is configured to be mounted on the first layer 26 so that the electrical signal conductor 34 is electrically connected to the corresponding electrical signal trace 30. Therefore, the electrical signal conductor 34 can be electrically connected to the integrated circuit 24 along at least one corresponding electrical signal trace 30. The electrical grounding element 36 is configured to be mounted on the second layer 28 so that the electrical grounding element 36 is electrically connected to the corresponding electrical grounding trace 45 of the second layer 28. Therefore, the electrical grounding element 36 can be further electrically connected to the integrated circuit 24 along at least one corresponding electrical grounding trace 45.

[0032] When multiple cables 32 are mounted to the package substrate 22, the signal traces 30 enable corresponding signal conductors 34 of the cables 32 to be electrically connected to corresponding integrated circuits 24. Therefore, the signal conductors 34 are configured to be electrically connected to the corresponding integrated circuits 24 along the corresponding signal traces 30 on the substrate 22. Similarly, when multiple cables 32 are mounted to the package substrate 22, the ground traces 45 enable corresponding grounding elements of the cables 32 to be electrically connected to the corresponding integrated circuits 24. Therefore, the grounding elements 36 are configured to be electrically connected to the integrated circuits 24 along the corresponding ground traces 45 on the substrate 22.

[0033] Specifically, the electrical signal conductor 34 is configured to be mounted to a corresponding electrical contact among a plurality of first or signal electrical contacts disposed on a first surface 26a of the first layer 26. The first electrical contact is configured to be in electrical communication with a corresponding electrical contact pad 38 of the corresponding electrical signal trace 30. For example, the electrical signal trace 30 may extend from the electrical contact pad 38 or alternatively constructed from the first electrical contact. In one example, the signal trace 30 may be integral with the first contact pad 38. Furthermore, in one example, the signal trace 30 and the first contact pad 38 do not define a separable interface. That is, the signal trace 30 is not designed to be separable from the contact pad 38 without rendering the package substrate 22 inoperable. The first electrical contact pad 38 may also be referred to as a signal contact pad. At least some, up to all, electrical signal traces 30 may extend from the corresponding electrical contact pad 38 to a corresponding integrated circuit 24 in at least one integrated circuit 24.

[0034] Advantageously, the signal conductor 34 of cable 32 can be mounted to a corresponding first electrical contact pad 38, such that electrical signals can be transmitted between cable 32 and integrated circuit 24 along electrical signal traces 30 of substrate 22 without passing through any separable interface of the electrical connector. Therefore, the electrical signals avoid the signal degradation that occurs across such separable interfaces in conventional systems. This advantage is useful, especially when transmitting signals at high data transmission rates. In this respect, it should be understood that the electrical signal traces 30 can establish corresponding electrical paths from the first contact pad 38 to integrated circuit 24 without passing through the separable interface of the electrical connector. Therefore, it can also be said that at least one electrical signal trace 30, and indeed all electrical signal traces 30, can extend continuously and uninterruptedly from the corresponding first contact pad 38 to the corresponding integrated circuit 24 in at least one integrated circuit 24. Data transmitted along the signal traces 30 can be transmitted between the corresponding cable and the integrated circuit along a continuous and uninterrupted corresponding data communication path.

[0035] It should be understood that some of the first contact pads 38, up to all of the first contact pads 38, can communicate with the integrated circuit 24 along the corresponding signal traces 30. Alternatively or additionally, some of the contact pads 38 can be electrically connected to the second contact pads 23. Specifically, as Figure 3As shown, the package substrate 22 may include a conductive signal via 50 extending from a corresponding signal trace 30 through the substrate 22 to mount to the second substrate 23. The conductive signal via 50 may extend in the lateral direction T through the first layer 26 and the second layer 28. Specifically, the conductive signal via 50 may extend from a first surface 26a of the first layer 26 to a second surface 26b of the second layer 28. The signal via 50 may extend from a corresponding signal trace 30, which extends from a first contact pad 38. The signal trace 30 extending from the first contact pad 38 to the corresponding signal via 50 may terminate at the signal via 50 without extending to the integrated circuit 24. The signal trace 30 extending to the corresponding integrated circuit 24 in at least one integrated circuit 24 may extend uninterruptedly to the corresponding integrated circuit 24 in at least one integrated circuit 24 without extending across, through, or through any signal via 50. Therefore, the signal trace 30 extending to the corresponding integrated circuit 24 in at least one integrated circuit 24 can extend uninterruptedly to the corresponding integrated circuit 24 in at least one integrated circuit 24 while maintaining electrical isolation from the signal via 50 with respect to data transmission.

[0036] The signal via 50 may be metallized and thus conductive along its entire length. Metallization can be achieved using thin-film techniques. Alternatively, thick-film techniques can be used. Alternatively, metal powder can be introduced into the via and sintered. In this regard, it should be understood that any suitable metallization of the signal via 50 may be considered. Examples of metallization are described in U.S. Patent Nos. 9,374,892 and 9,691,634, the disclosures of each of which are incorporated herein by reference as if fully set forth herein.

[0037] The first contact pads 38 may be arranged along corresponding rows and aligned with each other. In one example, the row of first contact pads 38 may be oriented in the lateral direction A. Therefore, the first contact pads 38 of corresponding rows may be aligned with each other in the lateral direction A. Furthermore, the row of electrical contact pads 38 may be disposed adjacent to the first edge or front edge 39 of the package substrate 22. The first edge or front edge 39 of the package substrate 22 may be opposite to the second edge or rear edge 41 of the package substrate 22 in the longitudinal direction L. It should be understood that the first edge or front edge 39 of the package substrate 22 may be defined by one or both edges of the first edge or front edge 44 of the first layer 26 and the first edge or front edge 46 of the second layer 28. The electrical contact pads 38 may be disposed adjacent to the first edge or front edge 44 of the first layer 26. In one example, the electrical contact pads 38 may extend to the first edge or front edge 44 of the first layer 26.

[0038] It should be understood that the first edge or front edge 44 of the first layer 26 may be recessed inward relative to the first edge or front edge 46 of the second layer 28. That is, the first edge or front edge 44 of the first layer 26 may define a first distance to the second edge or rear edge 41 of the package substrate 22, and the first edge or front edge 46 of the second layer 28 may define a second distance to the second edge or rear edge 41 of the package substrate 22, the second distance being greater than the first distance.

[0039] The first contact pad 38 and the electrical signal trace 30 can be defined by any suitable width as needed. For example, in one example, the first contact pad 38 can be defined by a width of approximately 250 micrometers along the lateral direction A or the row direction. Furthermore, the first contact pad 38 can be defined by a center-to-center spacing of approximately 500 micrometers along the lateral direction A. That is, adjacent contact pads 38 can be spaced apart by a distance of approximately 125 micrometers along the lateral direction. The terms “approximately” and “substantially” used herein with respect to distance, size, and shape acknowledge potential variations including manufacturing tolerances and other factors. Therefore, the terms “approximately” and “substantially” as used herein can include specified values, plus ±10% of the specified value. It should be understood that in some examples, the width of the first contact pad 38 can range from approximately 125 micrometers to approximately 1 millimeter. In other examples, the width of the first contact pad 38 can be outside this range. Furthermore, the center-to-center spacing of the first contact pad 38 can range from approximately 250 micrometers to approximately 2 millimeters.

[0040] The grounding element 36 of cable 32 is configured to be mounted to the second layer 28 so that the grounding element 36 is electrically connected to the second layer 28. Specifically, the grounding element 36 is configured to be electrically connected to a corresponding grounding trace 45 of a plurality of grounding traces 45 of a corresponding integrated circuit 24 in at least one integrated circuit 24 along the package substrate 22. Specifically, the grounding element 36 is configured to be mounted to a corresponding electrical contact of a plurality of second or grounding electrical contacts disposed on a first surface 28a of the second layer 28. The second electrical contacts may be configured as second electrical contact pads 40 electrically connected to the corresponding grounding traces 45. Thus, the second electrical contact pads 38 may also be referred to as grounding contact pads. At least some, up to all, of the grounding traces 45 may extend from the corresponding second electrical contact pads 40 to the corresponding integrated circuit 24 in at least one integrated circuit 24. Therefore, it should be understood that the cable 32 can be configured to be mounted to the substrate 22 such that the electrical signal conductor 34 is mounted to the corresponding first electrical contact pad 38 of the first layer 26, and the electrical grounding element 36 is configured to be mounted to the corresponding second electrical contact pad 40 of the second layer 28.

[0041] It should be recognized that, in one example, the first and second contacts may be configured as contact pad 38 and contact pad 40, and alternatively configured contacts are conceivable. For example, the contacts may alternatively be configured as disclosed in U.S. Patent Publication No. 2006 / 0035510, the disclosure of which is incorporated herein by reference as if fully set forth herein. In this respect, it should be understood that any suitable contact capable of being electrically connected to the respective signal conductor 34 and grounding element 36 and establishing contact paths to signal trace 30 and grounding trace 45, respectively, is conceivable.

[0042] Advantageously, the electrical grounding element 36 of the cable 32 can be mounted to a corresponding second electrical contact pad 40, such that the electrical grounding element 36 is electrically connected to the integrated circuit 24 along the electrical grounding trace 45 of the package substrate 22, without passing through any separable interface of the electrical connector. Therefore, the corresponding grounding paths established by the grounding trace 45 can be configured such that they do not degrade at separable interfaces. Thus, it can also be said that at least one electrical grounding trace 45, up to all electrical grounding traces 45, can extend continuously and uninterruptedly from the corresponding second contact pad 40 to the corresponding integrated circuit 24 in at least one integrated circuit 24.

[0043] It should be understood that some, up to all, of the second contact pads 40 may be connected to the integrated circuit 24 along the corresponding ground trace 45. Alternatively or additionally, some contact pads 38 may be electrically connected to the second substrate 23. Specifically, as Figure 3 As shown, the package substrate 22 may include a conductive grounding via constructed as described above with respect to via 50, the conductive grounding via extending from a corresponding grounding trace 45 through the substrate 22 to mount to the second substrate 23. The conductive grounding via may extend in the lateral direction T through the second layer 28. Specifically, the conductive grounding via may extend from a first surface 28a to a second surface 28b of the second layer 28. The grounding via may extend from a corresponding grounding trace 45, which extends from a second contact pad 40. The grounding trace 45 extending from the corresponding second contact pad 40 to the corresponding grounding via may terminate at the grounding via without extending to the integrated circuit 24. The grounding trace 45 extending to the corresponding integrated circuit 24 of at least one integrated circuit 24 may extend uninterruptedly to the corresponding integrated circuit 24 in at least one integrated circuit 24 without crossing, passing through, or through any grounding via. Alternatively, the grounding trace 45 extending to the corresponding integrated circuit 24 in at least one integrated circuit 24 may also be electrically connected to one or more, up to all, grounding vias. In this regard, it should be understood that two or more, up to all, grounding vias can be electrically connected to each other.

[0044] The second contact pads 40 may be arranged along corresponding rows and aligned with each other. In one example, the rows of second contact pads 40 may be oriented in the lateral direction A. Therefore, the second contact pads 40 in corresponding rows may be aligned with each other in the lateral direction A. Furthermore, the rows of second contact pads 40 may be spaced apart from the rows of first contact pads 38 in the lateral direction T. In addition, the rows of second contact pads 40 may still be disposed adjacent to the first or front edge 39 of the package substrate 22. Specifically, the second electrical contact pads 40 may be disposed adjacent to the first or front edge 46 of the second layer 28. In one example, the second electrical contact pads 40 may extend to the first or front edge 46 of the second layer 28.

[0045] The second contact pad 40 and the grounding trace 45 can be defined by any suitable width as needed. Furthermore, the second contact pad 40 and the grounding trace 45 can be spaced apart from each other by any distance as needed. In one example, the second electrical contact pad 40 can be coplanar with the first electrical contact pad 38 along a corresponding plane defined by the lateral direction T and the longitudinal direction L.

[0046] In one example, the leading edge 44 of the first layer 26 defines a portion of the outer perimeter of the first layer 26, which is recessed inward relative to the corresponding leading edge 46 of the second layer 28, which also defines a portion of the outer perimeter of the second layer 28. This recess can be inward along a plane substantially perpendicular to the lateral direction T. Therefore, the second layer 28 defines an offset region 48 that is offset outward relative to the first layer 36 along this plane. For example, the offset region 38 can be offset outward relative to the first layer 36 along a longitudinal direction away from a second or rear edge 41 of the package substrate 22. At least a portion of the second electrical contact pad 40 can be disposed in the offset region 48. The offset region 48 can define the leading edge 46 of the second layer 28.

[0047] Whether the first layer 26 and the second layer 28 are integral or separate and attached to each other, the offset region 48 defines the first surface 28a of the second layer 28 opposite to the second surface 28b. Furthermore, the first surface 28a may face the second surface 26b of the first layer 26 at a location adjacent to the offset region 48. The second contact pad 40 may be supported by the first surface 28a at the offset region 48. Therefore, the rows of the second contact pads 40 may be offset relative to the rows of the first contact pads 38 in the longitudinal direction L. Thus, the signal conductor 34 may be mounted to the first contact pad 38 adjacent to the leading edge 44, and the grounding element 36 may be mounted to the second contact pad 40 at the offset region 48.

[0048] In one example (see) Figure 2One or both of the first electrical contact pad 38 and the second electrical contact pad 40 may be substantially flat along their respective entirety. For example, the first electrical contact pad 38 and the second electrical contact pad 40 may be substantially flat along their respective planes substantially perpendicular to the lateral direction T. Thus, the first electrical contact pad 38 and the second electrical contact pad 40 define their respective lengths along the longitudinal direction L and their respective widths along the lateral direction.

[0049] Furthermore, the electrical signal traces 30 can extend in any direction as needed. For example, a portion of the electrical signal traces 30 can extend along the longitudinal direction L. One or more other portions of the first set of electrical signal traces 30 can extend to the corresponding integrated circuit 24 in a first direction that is angularly offset relative to the longitudinal direction L. One or more other portions of the second set of electrical signal traces 30 can extend to the corresponding other integrated circuit 24 in a second direction that is angularly offset relative to the longitudinal direction L and different from the first direction. In one example, the package substrate 22 may therefore include as many sets of electrical signal traces 30 as the integrated circuit 24, with the sets of electrical signal traces 30 extending to the corresponding integrated circuit 24.

[0050] Furthermore, the ground traces 45 can extend in any direction as needed. For example, a portion of the ground traces 45 can extend along the longitudinal direction L. One or more other portions of the first set of ground traces 45 can extend to the corresponding integrated circuit 24 in a first direction offset at an angle relative to the longitudinal direction L. One or more other portions of the second set of ground traces 45 can extend to the corresponding other integrated circuit 24 in a second direction offset at an angle relative to the longitudinal direction L and different from the first direction. In one example, the package substrate 22 may therefore include as many sets of ground traces 45 as integrated circuits 24, with the sets of ground traces 45 extending to the corresponding integrated circuits 24.

[0051] In another example (see Figure 3 The first layer 26 may define a plurality of recesses 42 configured to receive corresponding electrical signal conductors 34 to establish an electrical connection between the electrical signal conductors 34 and corresponding electrical signal traces 30. Therefore, a first electrical contact pad 38 may be disposed in the recess 42. In one example, the recess 42 may be defined by a first surface 26a of the first layer 26. The first electrical contact pad 38 may be supported by the first surface 26a within the recess 42. Thus, when an electrical signal conductor 34 is configured to be mounted to a corresponding first electrical contact pad 38 inside a corresponding recess 42...

[0052] The recess 42 may be substantially V-shaped or an alternative shape as required within a plane defined by the lateral direction A and the transverse direction T. Thus, the signal conductor 34 may be self-centered inside the recess 42 to rest against the corresponding contact pad 38. The recess 42 may further open the first or front edge 44 of the first layer 26 in the longitudinal direction. Furthermore, the first contact pad 38 may be spaced sufficiently from the second contact pad 40 in the transverse direction T such that when the signal conductor 34 of the cable 32 contacts the corresponding first contact pad 38, the grounding element 36 also contacts the second contact pad 40. The cable 32 may be mounted to the contact pads 38 and 40 respectively, and extends from the encapsulation substrate 22 through the corresponding first or front edge 44 of the first layer 26 and the corresponding or front edge 46 of the second layer 28.

[0053] In one example, signal trace 30 may use the same material as the first electrical contact pad 38. Alternatively, signal trace 30 and the first electrical contact pad 38 may be made of different materials. Similarly, ground trace 45 and second electrical contact pad 40 may be made of the same material. Alternatively, ground trace 45 and second electrical contact pad 40 may be made of different materials. It should be further understood that signal trace 30 and ground trace 45 may use the same material. Alternatively, signal trace 30 and ground trace 45 may be made of different materials. In one example, one or more, up to all, of signal trace 30, ground trace 45, first contact pad 38, and second contact pad 40 may be made of copper, gold, silver, or any suitable alternative conductive material. For example, in one example, contact pad 38 and contact pad 40 may be made of copper, and signal trace 30 and ground trace 45 may be made of gold or silver.

[0054] In another example, at least one cable 32 can be replaced by an optical fiber, and the substrate 22 can carry waveguides coupled to the optical fiber and the integrated circuit. Therefore, optical signals can be transmitted between the optical fiber and the integrated circuit along a continuous and uninterrupted corresponding data communication path as described above.

[0055] Now for reference Figures 5A to 5F A method for manufacturing an electrical connector 52 including an electrical component 20 has been considered. The electrical connector 52 may further include a cable 32. For example... Figure 5A As shown, the method may include the step of processing one or more wafers 58, wherein one or more wafers 58 define one or more package substrates 22. The method may include the step of metallizing the package substrates 22, thereby defining contact pads 38 and 40, signal traces 30 and ground traces 56, and electrical signal vias 50 and ground vias. Metallization may be achieved using thin-film technology. Alternatively, metallization may be achieved using thick-film technology. Alternatively, metal powder may be introduced and sintered. In this regard, it should be understood that any suitable metallization may be considered.

[0056] Next, the method may include: Figure 5A The step of dividing the wafer 58 into one or more glass strips 60, such as... Figure 5B As shown. Each glass strip 60 defines a corresponding package substrate 22 as described herein. The separation step can therefore produce multiple package substrates 22. Next, refer to Figure 5C The method may include the step of applying a resin transfer mold 62 to a glass ribbon 60. Next, in Figure 5D In this method, the step may include applying an electrically insulating material, such as resin, into a resin transfer mold 62. Thus, one or more encapsulation substrates 20 can be inserted and molded in the resin, thereby defining, for example, an electrically insulating material such as resin. Figure 5D The electrical connector 52 shown is thus manufactured. Specifically, the electrical connector 52 may include an electrically insulated connector housing 64 and at least one encapsulation substrate 22 supported by the electrically insulated connector housing 64. The connector housing 64 may be defined by resin. In one example, in addition to the first leading edge 44 and the second leading edge 46 described above, the connector housing 64 may at least partially surround all sides of the encapsulation substrate 22.

[0057] Next, as Figure 5E As shown, the cable 32 can be attached to the encapsulation substrate 22 in the manner described above. Specifically, the electrical signal conductor of the cable 32 can be mounted to the first layer 26, and the electrical grounding component of the cable 32 can be mounted to the second layer 28. Finally, electrical insulation material 66 can be applied to the first layer 26 and the second layer 28 respectively at the interface between the first layer 26 and the electrical signal conductor of the cable 32, and at the interface between the second layer 28 and the grounding component of the cable 32. Therefore, the interfaces can be embedded with electrical insulation material and are thus electrically insulated and protected from each other. Specifically, the electrical signal conductor 34 and the electrical grounding component 36 (see...) Figure 2 The electrical insulation material 66 can be embedded within it. Therefore, both the electrical signal conductor 34 mounted to the first layer 26 and the electrical signal conductor 36 mounted to the second layer 28 can be electrically isolated by the electrical insulation material. The electrical insulation material 66 can be resin or any suitable electrical insulator. For example, the electrical insulation material 66 can be the same material as the connector housing 64. Alternatively, the electrical insulation material 66 can be different from the material of the connector housing 64.

[0058] Now for reference Figure 6 Electrical component 20 may include a protective cover 56 attached to one or both of the packaging substrate 22 and the second substrate 23 to substantially encapsulate and protect the integrated circuit 24 and at least a portion of the signal trace 30 and the ground trace 45 (see [link to packaging substrate 20]). Figure 2The cover 56 defines a recess 68 configured to receive the cable 32 when it is mounted to the package substrate 22. Therefore, the cover 56 can be applied to the package substrate 22 before the cable 32 is mounted to it. Alternatively, the cover 56 can be applied to the package substrate 22 after the cable 32 has been mounted to it.

[0059] It should be understood that the method of manufacturing an electrical component may include the step of mounting at least one cable 32, such as multiple cables 32, to a package substrate 22 in the manner described herein. The method may further include the step of mounting the package substrate 22 to a second substrate 23 such that signal vias 50 and ground vias are electrically connected to the second substrate 23. The method may further include the step of attaching a cover 56 to one or both of the package substrate 22 and the second substrate 23, such that the cover substantially encapsulates at least one integrated circuit 24 and at least a portion of the electrical signal traces 30. The step of attaching the cover 56 may include aligning a recess with a first contact pad 38 in the lateral direction T.

[0060] Although preferred embodiments of this disclosure have been shown and described, it will be apparent to those skilled in the art that modifications can be made therein without departing from the scope of the appended claims. The embodiments described in conjunction with the illustrations have been given by way of illustration, and therefore the invention is not intended to be limited to the disclosed embodiments. Furthermore, the structures and features of each of the foregoing embodiments can be applied to other embodiments described herein. Therefore, those skilled in the art will recognize that the invention is intended to cover all modifications and alternative arrangements included within the spirit and scope of the invention as set forth in the appended claims.

Claims

1. An electrical component, comprising: A substrate having a first layer and a second layer adjacent to the first layer; as well as An integrated circuit is mounted on the upper surface of the first layer, such that multiple electrical signal traces on the substrate are electrically connected to the integrated circuit; A biaxial cable comprising an electrical signal conductor and an electrical grounding element, the electrical grounding element being electrically insulated from the electrical signal conductor, wherein the electrical signal conductor is mounted to an adjacent first contact pad on the upper surface of a first layer to be electrically connected to an electrical signal trace on the substrate, and the electrical grounding element is mounted to a second layer instead of the first layer.

2. The electrical component of claim 1, wherein the electrical signal trace extends along a first layer of the substrate.

3. The electrical component of claim 1, wherein the first layer and the second layer define respective electrical contact pads, and the electrical signal traces extend from the electrical contact pads of the first layer to the integrated circuit mounted to the substrate.

4. The electrical component of claim 3, wherein the electrical contact pads of one or both of the first layer and the second layer are substantially flat along the entirety of the first layer and the second layer, respectively.

5. The electrical component of claim 4, wherein the electrical signal conductor is configured to be mounted to an electrical contact pad of the first layer, and the electrical grounding element is configured to be mounted to an electrical contact pad of the second layer.

6. The electrical component of claim 4, wherein the first layer defines a recess, the recess includes an electrical contact pad of the first layer, and the recess accommodates the electrical signal conductor such that the electrical signal conductor is mounted to the electrical contact pad of the first layer inside the recess.

7. The electrical component of claim 6, wherein the groove of the first layer is defined by the surface of the first layer facing away from the second layer.

8. The electrical component of claim 7, wherein the groove opens the outer periphery of the first layer in a direction substantially perpendicular to the direction from the first layer toward the second layer.

9. The electrical component of claim 7, wherein the electrical signal trace extends along the surface of the first layer away from the second layer.

10. The electrical component of claim 6, wherein the electrical signal trace extends from the electrical contact pad of the first layer to the electrical component such that the electrical contact pad of the first layer is in electrical communication with the electrical component.

11. The electrical component according to claim 10, wherein: The first layer defines a corresponding first surface that is away from the second layer, and the second layer defines a second surface that is away from the first layer.

12. The electrical component of claim 11, wherein the first and second surfaces of the first and second layers are opposite each other in a lateral direction, and the first layer is recessed relative to the second layer along a plane oriented substantially perpendicular to the lateral direction, such that the second layer defines an offset region offset outward relative to the first layer along the plane.

13. The electrical component of claim 12, wherein the electrical contact pad of the second layer is disposed at the offset region.

14. The electrical component of claim 10, wherein an electrical contact pad of the first layer is disposed adjacent to the outer periphery of the first layer.

15. The electrical component according to any one of claims 1 to 2, further comprising a printed circuit board, wherein the substrate is mounted to the printed circuit board.

16. The electrical component of claim 15, wherein the second layer is mounted to the printed circuit board.

17. The electrical component of claim 10, further comprising a printed circuit board, wherein the substrate is mounted to the printed circuit board.

18. The electrical component of claim 17, wherein the second layer is mounted to the printed circuit board.

19. The electrical component of claim 17, wherein the first layer comprises a plurality of contact pads and a plurality of electrical signal traces extending from a respective electrical contact pad to the integrated circuit.

20. The electrical component of claim 17, wherein the first layer comprises a plurality of contact pads and a plurality of electrical vias, the plurality of electrical vias electrically connecting the respective electrical contact pads to the printed circuit board.

21. The electrical component of claim 20, wherein the via extends from the first layer through the second layer and is in electrical contact with the printed circuit board.

22. The electrical component according to any one of claims 1 to 10, wherein the substrate is a glass substrate.

23. The electrical component of claim 1, wherein the electrical grounding element of the biaxial cable is mounted on the electrical contact piece of the second layer, such that the electrical grounding element is electrically connected to the integrated circuit without passing through any separable interface of the electrical connector.

24. The electrical component of claim 21, wherein at least one or both of the first layer and the second layer are made of a non-glass material.

25. The electrical component according to any one of claims 1 to 10, wherein the substrate defines an interface between the first layer and the second layer.

26. The electrical component according to any one of claims 1 to 10, wherein the first layer and the second layer are integral with each other.

27. The electrical component of claim 26, wherein the electrical signal trace establishes an electrical path from the contact pad to the integrated circuit without passing through a separable interface of an electrical connector.

28. The electrical component of claim 27, wherein the electrical signal trace extends continuously and uninterruptedly from the contact pad to the integrated circuit.

29. The electrical component according to any one of claims 1 to 10, wherein the cable is configured to be mounted to the substrate such that the cable is electrically connected to the integrated circuit without signal transmission through a separable interface of an electrical connector.

30. An electrical connector, comprising: The electrical component according to claim 29; as well as An electrical insulator, the electrical insulator encapsulating 1) a corresponding interface between the electrical signal conductor and the substrate, and 2) a corresponding interface between the electrical grounding member and the second layer.

31. An electrical component, comprising: A packaging substrate, the packaging substrate defining a plurality of electrical signal contact pads; An integrated circuit is mounted on the upper surface of a first layer of the packaging substrate, such that a plurality of electrical signal traces on the packaging substrate are electrically connected to the integrated circuit. as well as A plurality of cables are mounted on the packaging substrate such that 1) the electrical signal conductors of the plurality of cables are mounted on adjacent contact pads on the upper surface and are electrically connected to the electrical signal traces, and 2) the electrical grounding elements of the plurality of cables are mounted on a first surface of a second layer of the packaging substrate, wherein the second layer is adjacent to the first layer, and the first surface of the second layer faces the first layer, and the electrical grounding element is mounted on the second layer rather than the first layer. The electrical signal traces extend continuously and uninterruptedly from the electrical signal contact pads to the integrated circuit without passing through any separable interface of the electrical connector.

32. The electrical component of claim 31, wherein the packaging substrate comprises a first layer and a second layer adjacent to the first layer. The integrated circuit is mounted on the first layer, and the electrical signal traces extend along the first layer.

33. The electrical component of claim 32, further comprising a plurality of grounding traces extending along the second layer.

34. The electrical component of claim 33, wherein the second layer defines an offset region extending outward relative to the front edge of the first layer.

35. The electrical component of claim 34, further comprising a plurality of contact pads in the offset region, wherein an electrical grounding element of the cable is configured to be mounted to a corresponding contact pad.

36. The electrical component of claim 35, wherein the first layer defines a plurality of corresponding electrical contact pads adjacent to the front edge of the first layer, wherein the electrical signal conductor of the cable is configured to be mounted to a corresponding contact pad of the first layer.

37. A method for manufacturing an electrical component, comprising: The electrical signal conductor of the cable is mounted to the first contact pad of the first layer of the package substrate, such that the electrical signal of the cable is continuously and uninterruptedly transmitted from the first contact pad to the integrated circuit of the package substrate along the electrical signal trace of the package substrate without passing through any separable interface. and The electrical grounding element of the cable is installed on the second contact pad of the second layer of the encapsulation substrate instead of the first layer, wherein the second layer is adjacent to the first layer.

38. The method of claim 37, wherein the first contact pads are arranged as adjacent rows of first contact pads oriented in a lateral direction, the second contact pads are arranged as rows of second contact pads oriented in a lateral direction, and the second contact pad rows are spaced apart from the first contact pad rows in a direction perpendicular to the lateral direction.

39. The method according to any one of claims 37 to 38, further comprising the following step: The packaging substrate is mounted onto the second substrate such that the electrical vias of the packaging substrate are electrically connected to the second substrate.

40. The method of claim 39, further comprising the step of: The protective cover is attached to one or both of the packaging substrate and the second substrate.

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