MEMS intelligent detection chips, detection devices and smart wearable devices

Abstract

The embodiment of the present invention provides a micro-electromechanical intelligent detection chip, a detection device and a smart wearable device, wherein the micro-electromechanical intelligent detection chip comprises: a substrate; a micro-electromechanical microphone chip and a non-contact temperature sensor, wherein the micro-electromechanical microphone chip and the non-contact temperature sensor are integrated on the front side of the substrate. The technical solution provided by the embodiment of the present invention realizes a micro-electromechanical intelligent detection chip that can be used for non-contact temperature detection.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of microphone technology, and in particular to a micro-electromechanical intelligent detection chip, a detection device and an intelligent wearable device. Background Art

[0002] Existing smart wearable devices integrate functions such as sound detection and blood pressure detection, and have a portable and miniaturized design, and are increasingly being used in people's lives.

[0003] Faced with the high infectiousness of respiratory infectious diseases and generally accompanied by fever symptoms, users have the need to know their own temperature and the temperature of people around them. However, existing micro-electromechanical intelligent detection chips, detection devices and smart wearable devices cannot perform temperature detection, which brings inconvenience to people's lives. Summary of the invention

[0004] In view of this, the embodiments of the present invention provide a micro-electromechanical intelligent detection chip, a detection device and a smart wearable device, which realize a micro-electromechanical intelligent detection chip that can be used for non-contact temperature detection.

[0005] In a first aspect, an embodiment of the present invention provides a micro-electromechanical intelligent detection chip, comprising:

[0006] substrate;

[0007] A micro-electro-mechanical microphone chip and a non-contact temperature sensor are integrated on the front side of the substrate.

[0008] Optionally, it further comprises a signal processing unit, wherein the signal processing unit is located on the front side of the substrate;

[0009] The micro-electromechanical microphone chip is located on one side of the signal processing unit, and the non-contact temperature sensor is located on a surface of the signal processing unit that is away from the substrate;

[0010] The signal processing unit includes a plurality of signal input terminals;

[0011] The output end of the micro-electromechanical microphone chip and the output end of the non-contact temperature sensor are electrically connected to one of the signal input ends respectively.

[0012] Optionally, at least one environmental parameter sensor is further included, and at least one of the environmental parameter sensors is integrated on the front side of the substrate.

[0013] Optionally, the environmental parameter sensor includes one or more of a micro-electromechanical pressure sensor, a micro-electromechanical acceleration sensor and a micro-electromechanical humidity sensor.

[0014] Optionally, the non-contact temperature sensor comprises a thermopile structure.

[0015] Optionally, the thermopile structure includes a semiconductor substrate;

[0016] at least one temperature detection unit, located on the surface of the semiconductor substrate;

[0017] The heat absorbing unit is located on a surface of the temperature detecting unit that is away from the semiconductor.

[0018] Optionally, the heat absorbing unit comprises an infrared absorbing layer.

[0019] Optionally, the temperature detection unit includes a thermocouple.

[0020] In a second aspect, an embodiment of the present invention provides a micro-electromechanical intelligent detection device, including any micro-electromechanical sound detection chip described in the first aspect;

[0021] It also includes a protective shell, on which a sound inlet hole is arranged.

[0022] In a third aspect, an embodiment of the present invention further provides an intelligent wearable device, comprising any micro-electromechanical intelligent detection device described in the second aspect.

[0023] In the technical solution provided in this embodiment, the micro-electromechanical microphone chip can detect the user's voice signal and at the same time detect the temperature of the user himself or the people around him through a non-contact temperature sensor to meet the user's need to know his own temperature and the temperature of others. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of the structure of a micro-electromechanical intelligent detection chip provided by an embodiment of the present invention;

[0025] Figure 2 A top view of another micro-electromechanical intelligent detection chip provided by an embodiment of the present invention;

[0026] Figure 3 for Figure 2 A front view of

[0027] Figure 4 for Figure 2 Left view of

[0028] Figure 5 A top view of another micro-electromechanical intelligent detection chip provided by an embodiment of the present invention;

[0029] Figure 6 for Figure 5 A front view of

[0030] Figure 7for Figure 5 Left view of . DETAILED DESCRIPTION

[0031] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0032] As described in the above background technology, currently users have the need to know their own and each other's temperature, but existing micro-electromechanical intelligent detection chips, detection devices and smart wearable devices cannot perform temperature detection, which brings inconvenience to people's lives.

[0033] In order to solve the above technical problems, the embodiments of the present invention provide the following technical solutions:

[0034] Figure 1 A schematic diagram of the structure of a micro-electromechanical intelligent detection chip provided by an embodiment of the present invention. Figure 1 The micro-electromechanical intelligent detection chip includes: a substrate 10; a micro-electromechanical microphone chip 20 and a non-contact temperature sensor 30, wherein the micro-electromechanical microphone chip 20 and the non-contact temperature sensor 30 are integrated on the front side of the substrate 10.

[0035] Exemplarily, the substrate 10 may be a printed circuit board.

[0036] Faced with the high infectiousness of respiratory infectious diseases, which are generally accompanied by fever symptoms, users have the need to know their own temperature and the temperature of people around them. The micro-electromechanical intelligent detection chip in the existing technology cannot perform temperature detection, which brings inconvenience to people's lives.

[0037] In the technical solution provided in this embodiment, the micro-electromechanical microphone chip 20 can detect the user's voice signal while detecting the temperature of the user himself or the people around him through the non-contact temperature sensor 30 to meet the user's need to know the temperature of himself and the people around him.

[0038] Figure 2 A top view of another micro-electromechanical intelligent detection chip provided in an embodiment of the present invention. Figure 3 for Figure 2 Front view of . Figure 4 for Figure 2 Optionally, see Figure 2 , Figure 3 and Figure 4The micro-electromechanical intelligent detection chip provided in this embodiment also includes a signal processing unit 40, which is located on the front side of the substrate 10; the micro-electromechanical microphone chip 20 is located on one side of the signal processing unit 40, and the non-contact temperature sensor 30 is located on the surface of the signal processing unit 40 away from the substrate 10; the signal processing unit 40 includes a plurality of signal input terminals 40A; the output terminal 20A of the micro-electromechanical microphone chip 20 and the output terminal 30A of the non-contact temperature sensor 30 are respectively electrically connected to a signal input terminal 40A.

[0039] Exemplarily, the output terminal 20A of the micro-electromechanical microphone chip 20 and the output terminal 30A of the non-contact temperature sensor 30 are respectively connected to a signal input terminal 40A through an electrical wire 50 .

[0040] Specifically, the output end 20A of the micro-electromechanical microphone chip 20 and the output end 30A of the non-contact temperature sensor 30 are electrically connected to a signal input end 40A respectively. The signal processing unit 40 can process and output the sound signal and temperature, so that the micro-electromechanical microphone chip 20 can detect the user's voice signal while detecting the temperature of the user himself or the people around him through the non-contact temperature sensor 30, so as to meet the user's need to know his own temperature and the temperature of the people around him.

[0041] Optionally, the micro-electromechanical intelligent detection chip further includes at least one environmental parameter sensor, and the at least one environmental parameter sensor is integrated on the front side of the substrate.

[0042] In the technical solution provided in this embodiment, the micro-electromechanical microphone chip 20 can detect the user's voice signal, detect the temperature of the user himself or the people around him through the non-contact temperature sensor 30, and detect environmental parameters to meet the user's needs for obtaining environmental parameters.

[0043] Alternatively, see Figure 2 , Figure 3 and Figure 4 The environmental parameter sensor includes one or more of a micro-electromechanical pressure sensor 60, a micro-electromechanical acceleration sensor, and a micro-electromechanical humidity sensor.

[0044] It should be noted that the figure only shows the micro-electromechanical pressure sensor 60. The output terminal 60A of the micro-electromechanical pressure sensor 60 is electrically connected to the signal input terminal 40A of the signal processing unit 40 through the gold wire 50.

[0045] In the technical solution provided in this embodiment, the micro-electromechanical microphone chip 20 can detect the user's voice signal, detect the temperature of the user himself or the people around him through the non-contact temperature sensor 30, and can also detect the atmospheric pressure, ambient humidity and acceleration of the user's movement.

[0046] Optionally, the non-contact temperature sensor comprises a thermopile structure.

[0047] Specifically, the temperature sensor of the thermopile structure is a pyroelectric infrared sensor, which is a device composed of a thermocouple to detect the temperature of the user himself or the people around him in a non-contact manner.

[0048] For details, see Figure 3 and Figure 4 The thermopile structure includes a semiconductor substrate 31; at least one temperature detection unit 32, located on the surface of the semiconductor substrate 31; and a heat absorption unit 33, located on the surface of the temperature detection unit 32 away from the semiconductor substrate 31.

[0049] By way of example, the semiconductor substrate 31 may be made of silicon.

[0050] Specifically, the detection principle of the thermopile structure is as follows: the temperature detection unit 32 converts the temperature into heat, and the heat absorption unit 33 is used to convert the heat signal into a corresponding electrical signal.

[0051] Alternatively, see Figure 3 and Figure 4 The thermopile structure further includes a heat-conducting layer 34, which is located between the semiconductor substrate 31 and the temperature detection unit 32. Exemplarily, the heat-conducting layer 34 can be silicon oxide grown by thermal oxidation, undoped silicon oxide deposited by plasma enhanced chemical vapor deposition, phosphorus-doped silicon oxide, or silicon oxide doped with boron and phosphorus.

[0052] Optionally, the heat absorbing unit 33 includes an infrared absorbing layer. The user and people around the user can release infrared rays, and the infrared absorbing layer absorbs the infrared rays released by the user and converts them into corresponding heat.

[0053] Optionally, the temperature detection unit 32 includes a thermocouple. The thermocouple converts corresponding heat into corresponding electrical signals to achieve the technical effect of detecting the temperature of the user or the surrounding people in a non-contact manner.

[0054] It should be noted that Figure 2 , Figure 3 and Figure 4In the shown micro-electromechanical intelligent detection chip, a first pad 10A is provided on the front side of the substrate 10, and the first pad 10A can be provided on one side of the signal processing unit 40, or can be provided between the signal processing unit 40 and the substrate 10, and the first pad 10A provided on one side of the signal processing unit 40 is electrically connected to the signal output terminal 40B of the signal processing unit 40 through a gold wire 50. At least one second pad 10B is provided on the back side of the substrate 10 opposite to the front side, and the second pad 10B leads the electrical signal of the first pad 10A to the back side of the substrate 10 through a through hole 10C inside the substrate 10.

[0055] Figure 5 , Figure 6 and Figure 7 In the illustrated micro-electromechanical intelligent detection chip, all first pads 10A are disposed between the substrate 10 and the signal processing unit 40 , and the electrical signals of the signal processing unit 40 are transmitted to the second pads 10B through the through holes 10C.

[0056] The embodiment of the present invention does not limit the number and position of the through holes 10C, as long as the electrical signal of the first pad 10A on the front side of the substrate 10 can be transmitted to the second pad 10B on the back side.

[0057] Alternatively, see Figure 4 and Figure 7 The micro-electromechanical microphone chip 20 includes a diaphragm 21 and a back plate 22 , and the diaphragm 21 and the back plate 22 form a capacitor structure to convert sound signals into electrical signals.

[0058] See also Figure 2-Figure 7 , the embodiment of the present invention further provides a micro-electromechanical intelligent detection device, including any micro-electromechanical sound detection chip described in the above technical solution;

[0059] The device further comprises a protective shell 70, on which a sound inlet hole 71 is disposed. An infrared filter 80 is disposed at the sound inlet hole 71.

[0060] The sound waves enter from the sound inlet 71, and the micro-electromechanical microphone chip 20 converts the sound signals into electrical signals. The infrared light with a characteristic wavelength passes through the infrared filter 80, so that the non-contact temperature sensor 30 can detect the temperature of the user or the people around the user in a non-contact manner.

[0061] The embodiment of the present invention further provides a smart wearable device, comprising any of the micro-electromechanical intelligent detection devices described in the above technical solutions. The smart wearable device may be a smart watch, smart clothes, smart glasses, etc.

[0062] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A micro-electromechanical intelligent detection chip, characterized in that: include: substrate; A micro-electro-mechanical microphone chip and a non-contact temperature sensor, wherein the micro-electro-mechanical microphone chip and the non-contact temperature sensor are integrated on the front side of the substrate; Also included is a signal processing unit, the signal processing unit is located on the front side of the substrate; The micro-electromechanical microphone chip is located on one side of the signal processing unit, and the non-contact temperature sensor is located on a surface of the signal processing unit that is away from the substrate; The signal processing unit includes a plurality of signal input terminals; The output end of the micro-electromechanical microphone chip and the output end of the non-contact temperature sensor are electrically connected to one of the signal input ends respectively; The front side of the substrate includes a first pad, which is arranged between the substrate and the signal processing unit; the back side of the substrate includes at least one second pad, and the substrate also includes a through hole inside, and the first pad is connected to the second pad through the through hole; the front side of the substrate and the back side of the substrate are opposite sides; the signal of the first pad on the front side of the substrate is transmitted to the second pad on the back side of the substrate through the through hole.

2. The micro-electromechanical intelligent detection chip according to claim 1, characterized in that: It also includes at least one environmental parameter sensor, at least one of the environmental parameter sensors is integrated on the front side of the substrate.

3. The micro-electromechanical intelligent detection chip according to claim 2, characterized in that: The environmental parameter sensor includes one or more of a micro-electromechanical pressure sensor, a micro-electromechanical acceleration sensor and a micro-electromechanical humidity sensor.

4. The micro-electromechanical intelligent detection chip according to claim 1, characterized in that: The non-contact temperature sensor includes a thermopile structure.

5. The micro-electromechanical intelligent detection chip according to claim 4, characterized in that: The thermopile structure includes a semiconductor substrate; at least one temperature detection unit, located on the surface of the semiconductor substrate; The heat absorbing unit is located on a surface of the temperature detecting unit that is away from the semiconductor.

6. The micro-electromechanical intelligent detection chip according to claim 5, characterized in that: The heat absorbing unit includes an infrared absorbing layer.

7. The micro-electromechanical intelligent detection chip according to claim 5, characterized in that: The temperature detection unit includes a thermocouple.

8. A micro-electromechanical intelligent detection device, characterized in that: A micro-electromechanical intelligent detection chip comprising any one of claims 1 to 7; It also includes a protective shell, which is provided with a sound inlet hole, and an infrared filter is provided at the sound inlet hole.

9. A smart wearable device, characterized in that: Including the micro-electromechanical intelligent detection device as described in claim 8.

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