Circuit board module and heat dissipation plate structure thereof

Abstract

The present invention discloses a circuit board module and a heat dissipation plate structure thereof, wherein the heat dissipation plate structure includes a first plate body, a second plate body, a heat transfer layer and a buffer liquid. The first plate body has a first inner surface, and the first inner surface has a plurality of first metal bumps. The second plate body is correspondingly joined to the first plate body to form a receiving cavity therebetween, wherein the second plate body has a second inner surface, and the second inner surface has a plurality of second metal bumps. The heat transfer layer is arranged in the receiving cavity and is located between the plurality of first metal bumps and the plurality of second metal bumps. The buffer liquid fills the remaining space in the receiving cavity. In this way, the heat dissipation plate structure can meet the design requirements of thin and light electronic products and can effectively remove heat from the heat source.

Description

Technical Field

[0001] The present invention relates to a heat dissipation structure, in particular to a heat dissipation plate structure and a circuit board module using the same. Background Art

[0002] With the advent of the 5G era, the performance requirements for high-frequency, high-speed products (such as antennas) are constantly increasing. Not only must signal transmission be accelerated, but signal loss during transmission, which can lead to a decrease in signal integrity, must also be avoided. Furthermore, as electronic products continue to evolve toward thinner, smaller, and more efficient designs, effectively dissipating heat from electronic components within limited internal space—that is, utilizing heat dissipation structures to remove heat generated during operation—has become a crucial challenge in this field. For example, when planning heat dissipation paths, one must not only focus on the XY directions, but also consider the contribution of heat conduction in the Z direction to overall heat dissipation performance.

[0003] During the heat dissipation process, the heat dissipation structure can be in direct contact with the electronic component or maintain a gap with the electronic component. For example, a graphite, metal, or graphite / metal heat sink can be directly attached to a high-power electronic component (such as a processor) or attached to other adjacent parts (such as a back cover) to remove heat from the electronic component. In addition, a high-power electronic component (such as a light-emitting diode) can also be placed on a heat pipe, so that the heat is first transferred from the electronic component to the heat dissipation structure (such as heat sink fins) through the heat pipe, and then dissipated from the heat dissipation structure to the outside.

[0004] Although the aforementioned heat sink can cool down the running electronic components in a timely manner, its heat dissipation capacity still has room for improvement and is not conducive to lightweight design. In addition, the cost of the heat pipe is high and it needs to be combined with another heat dissipation structure to dissipate heat. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a heat dissipation plate structure in view of the shortcomings of the prior art, which has excellent heat transfer effects in the three directions of X, Y, and Z; and to provide a circuit board module using the heat dissipation plate structure.

[0006] To address the aforementioned technical issues, one of the technical solutions employed by the present invention is to provide a circuit board module comprising a heat sink structure, a high-frequency, high-speed circuit board, and a thermal conductor. The heat sink structure comprises a first plate, a second plate, a heat transfer layer, and a buffer liquid. The first plate has a first inner surface with a plurality of first metal bumps on the first inner surface. The second plate is coupled to the first plate to form a receiving cavity therebetween, wherein the second plate has a second inner surface with a plurality of second metal bumps on the second inner surface. The heat transfer layer is disposed within the receiving cavity and positioned between the plurality of first metal bumps and the plurality of second metal bumps. The buffer liquid fills the remaining space within the receiving cavity. The high-frequency, high-speed circuit board is disposed on the first plate of the heat sink structure, wherein the high-frequency, high-speed circuit board comprises a dielectric substrate and at least one functional circuit layer formed on the dielectric substrate. The thermal conductor has a first end and a second end. The first end is thermally conductively connected to the first plate of the heat sink structure, and the second end is disposed adjacent to the functional circuit layer.

[0007] In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a heat dissipation plate structure, which includes a first plate body, a second plate body, a heat transfer layer and a buffer liquid; the first plate body has a first inner surface, and the first inner surface has a plurality of first metal protrusions; the second plate body is correspondingly joined to the first plate body to form a accommodating cavity therebetween, wherein the second plate body has a second inner surface, and the second inner surface has a plurality of second metal protrusions; the heat transfer layer is arranged in the accommodating cavity, and is located between the plurality of first metal protrusions and the plurality of second metal protrusions; the buffer liquid fills the remaining space in the accommodating cavity.

[0008] Furthermore, the positions of the plurality of first metal bumps and the plurality of second metal bumps are staggered.

[0009] Furthermore, the heat transfer layer exists in the form of a porous layer or a continuous layer.

[0010] Furthermore, the first board includes a first substrate layer and at least one first metal layer formed on the first substrate layer, and a plurality of first metal bumps are formed on the first metal layer.

[0011] Furthermore, the first plate body has at least one first blind hole, the first blind hole passes through the first substrate layer, and the first blind hole is filled with a heat conductive material.

[0012] Furthermore, the first plate body has at least one first through hole, the first through hole passes through the first substrate layer and the first metal layer, and the first through hole is filled with a heat conductive material.

[0013] Furthermore, the second plate includes a second substrate layer and at least one second metal layer formed on the second substrate layer, and a plurality of second metal bumps are formed on the second metal layer.

[0014] Furthermore, the second plate body has at least one second blind hole, the second blind hole passes through the second substrate layer, and the second blind hole is filled with a heat conductive material.

[0015] Furthermore, the second plate body has at least one second through hole, the second through hole passes through the second substrate layer and the second metal layer, and the second through hole is filled with a heat conductive material.

[0016] Furthermore, the first plate body has a first inner portion and at least one first outer portion located on one side of the first inner portion, the second plate body has a second inner portion and at least one second outer portion located on one side of the second inner portion, and the accommodating cavity is formed between the first inner portion and the second inner portion.

[0017] Furthermore, the heat dissipation plate structure further includes at least one heat-conducting column, and the at least one heat-conducting column is connected between the first outer portion and the second outer portion.

[0018] Furthermore, the thickness of the heat dissipation plate structure is 0.2 mm to 0.5 mm, and the average height of the plurality of first metal bumps and the plurality of second metal bumps is 30 micrometers to 220 micrometers.

[0019] One of the beneficial effects of the present invention is that the heat dissipation plate structure of the present invention can take into account lightweight, structural strength and heat dissipation capabilities through the technical solution of "the first plate body and the second plate body are correspondingly joined to form a accommodating cavity therebetween, the heat transfer layer is arranged in the accommodating cavity, and is located between the multiple first metal protrusions on the inner surface of the first plate body and the multiple second metal protrusions on the inner surface of the second plate body, and the buffer liquid is filled in the remaining space in the accommodating cavity", thereby meeting the design requirements of thin and light electronic products.

[0020] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 FIG. 1 is a schematic structural diagram of a heat dissipation plate structure according to a first embodiment of the present invention.

[0022] Figure 2 FIG. 1 is a perspective schematic diagram of a heat dissipation plate structure according to a first embodiment of the present invention.

[0023] Figure 3 FIG. 1 is another structural schematic diagram of the heat dissipation plate structure according to the first embodiment of the present invention.

[0024] Figure 4 for Figure 1 An enlarged schematic diagram of part IV of .

[0025] Figure 5 for Figure 1 An enlarged schematic diagram of the V portion of FIG.

[0026] Figure 6 for Figure 1 Another enlarged schematic diagram of part IV.

[0027] Figure 7 for Figure 1 Another enlarged schematic diagram of the V part.

[0028] Figure 8 for Figure 1 Another enlarged schematic diagram of part IV.

[0029] Figure 9 for Figure 1 Another enlarged schematic diagram of the V part.

[0030] Figure 10 FIG. 1 is a schematic structural diagram of a heat dissipation plate structure according to a second embodiment of the present invention.

[0031] Figure 11 It is a structural schematic diagram of a circuit board module of the present invention.

[0032] Figure 12 This is another structural schematic diagram of the circuit board module of the present invention.

[0033] Figure 13 This is another structural schematic diagram of the circuit board module of the present invention.

[0034] Figure 14 This is another structural schematic diagram of the circuit board module of the present invention. DETAILED DESCRIPTION

[0035] The following is an explanation of the implementation of the "circuit board module and its heat dissipation plate structure" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not drawn according to actual dimensions. Please note in advance. The following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0036] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term "or" as used herein may include any one or more combinations of the associated listed items, as appropriate.

[0037] First embodiment

[0038] See Figures 1 to 3 As shown, a first embodiment of the present invention provides a heat sink structure 1 comprising a first plate 11, a second plate 12, a heat transfer layer 13, and a buffer liquid 14. Both the first plate 11 and the second plate 12 have three-dimensional heat-conducting patterns on their surfaces. The first and second plates 11, 12 are joined to form a sealed receiving cavity C. The heat transfer layer 13 is disposed within the receiving cavity C, and the buffer liquid 14 fills the remaining space within the receiving cavity C. The buffer liquid 14 can be, but is not limited to, pure water.

[0039] When in use, the first plate 11 can quickly conduct heat generated by a heat source outward and transfer it to the accommodating cavity C. The conducted heat can be transferred along the XY directions under the synergistic action of the three-dimensional heat-conducting patterns, buffer liquid 14 and heat transfer layer 13 on the first plate 11 and the second plate 12, and then transferred to the second plate 12 in a large area along the Z direction, and then dissipated from the second plate 12 to the outside world.

[0040] Furthermore, the first plate 11 can serve as a heat sink. The first plate 11 has a first outer surface 111 and a first inner surface 112 opposite to the first outer surface 111. The first inner surface 112 has a plurality of first metal bumps 1121. The second plate 12 can serve as a heat sink. The second plate 12 has a second outer surface 121 and a second inner surface 122 opposite to the second outer surface 121. The second inner surface 122 has a plurality of second metal bumps 1221. Furthermore, the plurality of first metal bumps 1121 can be arranged in an array on the first inner surface 112 of the first plate 11. The distribution area of ​​the plurality of first metal bumps 1121 can occupy 5% to 30% of the area of ​​the first inner surface 112. The plurality of second metal bumps 1221 can be arranged in an array on the second inner surface 122 of the second plate 12. The distribution area of ​​the plurality of second metal bumps 1221 can occupy 5% to 30% of the area of ​​the second inner surface 122. However, the above example is only one feasible embodiment and is not intended to limit the present invention. According to actual needs, the plurality of first metal bumps 1121 and the plurality of second metal bumps 1221 may also be arranged in other regular manners.

[0041] In this embodiment, the first plate 11 and the second plate 12 can each be a flexible plate, such as a flexible PCB. The first metal bump 1121 and the second metal bump 1221 can be formed by electroplating or screen printing, and the average height of the first metal bump 1121 and the second metal bump 1221 can be 30 microns to 220 microns. The first metal bump 1121 and the second metal bump 1221 can be made of copper or other highly thermally conductive metals, and the materials of the first metal bump 1121 and the second metal bump 1221 can be the same or different. The first metal bump 1121 and the second metal bump 1221 can have a square column shape or a cylindrical shape, and the shapes of the first metal bump 1121 and the second metal bump 1221 can be the same or different. However, the present invention is not limited to the above examples.

[0042] See Figure 1 , and cooperate with Figure 4 and Figure 5 As shown, Figure 4 and Figure 5An implementation method of the first plate 11 and the second plate 12 is shown. The first plate 11 can be formed of a single metal, such as copper or other high thermal conductivity metal; according to actual needs, the first plate 11 can also be composed of metal and polymer or polymer composite material. Further, the first plate 11 may include a first substrate layer 11a and at least one first metal layer 11b formed on the first substrate layer 11a, and a plurality of first metal bumps 1121 are formed on the first metal layer 11b. The second plate 12 may include a second substrate layer 12a and at least one second metal layer 12b formed on the second substrate layer 12a, and a plurality of second metal bumps 1221 are formed on the second metal layer 12b. It is worth noting that the first substrate layer 11a and the second substrate layer 12a can play a supporting role, while the first metal layer 11b and the second metal layer 12b can play a role in absorbing and releasing heat.

[0043] See Figure 6 and Figure 7 , which shows another implementation of the first plate 11 and the second plate 12. Figure 6 As shown, in a configuration where the first plate 11 includes a first substrate layer 11a and two first metal layers 11b formed on opposite surfaces of the first substrate layer 11a, one or more first blind holes 11c can be formed in the first plate 11. The first blind holes 11c penetrate the first substrate layer 11a and are filled with a thermally conductive material to form a thermally conductive connection between the two first metal layers 11b. In a configuration where the second plate 12 includes a second substrate layer 12a and two second metal layers 12b formed on opposite surfaces of the second substrate layer 12a, one or more second blind holes 12c can be formed in the second plate 11. The second blind holes 12c penetrate the second substrate layer 11a and are filled with a thermally conductive material to form a thermally conductive connection between the two second metal layers 12b. This improves overall heat dissipation efficiency.

[0044] See Figure 8 and Figure 9 , which shows another implementation of the first plate 11 and the second plate 12. Figure 8 As shown, in order to form a thermal conductive connection between the two first metal layers 11b, one or more first through holes 11d can also be formed on the first plate 11, wherein the first through holes 11d pass through the first substrate layer 11a and the first metal layer 11b, and the first through holes 11d are filled with thermal conductive material. Figure 9 As shown, in order to form a thermally conductive connection between the two second metal layers 12b, one or more second through holes 12d can also be formed on the second plate body 12, wherein the second through holes 12d pass through the second substrate layer 12a and the second metal layer 12b, and the second through holes 12d are filled with thermal conductive material.

[0045] In this embodiment, the materials of the first substrate layer 11a and the second substrate layer 12a may be unmodified or modified polyimide, unmodified or modified liquid crystal polymer, or glass fiber reinforced epoxy resin, wherein the molecular chain structure of the modified polyimide and the modified liquid crystal polymer may contain functional monomers (aromatic monomers); the materials of the first substrate layer 11a and the second substrate layer 12a may be the same or different. The materials of the first metal layer 11b and the second metal layer 12b may be copper or other highly thermally conductive metals, and the materials of the first metal layer 11b and the second metal layer 12b may be the same or different. The thermally conductive material filled in the first and second blind vias 11c, 12c or the first and second through holes 11d, 12d may include metal or metal-based materials, carbon-based or carbon-based materials, or a combination thereof. However, the present invention is not limited to the above examples.

[0046] In this embodiment, the first plate 11 and the second plate 12 may have regular shapes, such as squares and rectangles. The first and second plates 11, 12 may be joined together by diffusion bonding, but the present invention is not limited thereto. To form the accommodating cavity C, an annular retaining wall 15 is provided between the first inner surface 112 of the first plate 11 and the second inner surface 122 of the second plate 12. The annular retaining wall 15 surrounds the plurality of first metal bumps 1121 and the plurality of second metal bumps 1221. Furthermore, the upper half of the annular retaining wall 15 may be integrally formed with the first plate 11, and the lower half of the annular retaining wall 15 may be integrally formed with the second plate 12, but the present invention is not limited thereto. In other embodiments, the annular retaining wall 15 may be entirely integral with the first or second plate 11, 12. The thickness of the annular retaining wall 15 may be between 3 and 6 microns to facilitate bonding between the first and second plates 11, 12.

[0047] In this embodiment, if Figures 1 to 3 As shown, the heat transfer layer 13 can be a porous layer or a continuous layer. The material of the heat transfer layer 13 can be a highly thermally conductive metal (such as copper), graphite, or carbon fiber. For example, the heat transfer layer 13 can be a metal mesh, a metal sheet, a graphite sheet, graphite paper, or a carbon fiber mesh. In the case where the heat transfer layer 13 is a porous layer, the multiple holes (not numbered) in the heat transfer layer 13 can be arranged in a matrix. Each hole can be circular, square, or other polygonal in shape, and the pore size can range from 25 microns to 200 microns. However, the present invention is not limited to the above examples. It is worth noting that in the case where the heat transfer layer 13 is a porous layer, the staggered arrangement of the multiple first metal bumps 1121 and the multiple second metal bumps 1221 can provide multiple heat transfer channels within the accommodating cavity C, while the buffer liquid 14 can enhance the heat transfer effect in the XY directions. Preferably, the heat transfer layer 13, the first metal bumps 1121, and the second metal bumps 1221 do not contact each other.

[0048] Second embodiment

[0049] See Figure 10 As shown, a second embodiment of the present invention provides a heat sink structure 1 comprising a first plate 11, a second plate 12, a heat transfer layer 13, and a buffer liquid 14. Both the first plate 11 and the second plate 12 have three-dimensional heat-conducting patterns on their surfaces. The first and second plates 11, 12 are joined to form a sealed receiving cavity C. The heat transfer layer 13 is disposed within the receiving cavity C, and the buffer liquid 14 fills the remaining space within the receiving cavity C. The main difference between this embodiment and the first embodiment is that the heat sink structure 1 further includes at least one heat-conducting column 16.

[0050] In this embodiment, the first plate 11 has a first inner portion 11P1 and at least one first outer portion 11P2 located on one side of the first inner portion 11P1. The second plate 12 has a second inner portion 12P1 and at least one second outer portion 12P2 located on one side of the second inner portion 12P1. The accommodating cavity C, along with the heat transfer layer 13 and buffer liquid 14 therein, is disposed between the first inner portion 11P1 and the second inner portion 12P1. The thermally conductive column 16 is disposed between the first outer portion 11P2 and the second outer portion 12P2, with its two ends connecting the first outer portion 11P2 and the second outer portion 12P2, respectively. This improves the structural stability and usability of the heat sink structure 1.

[0051] See Figures 11 to 14 As shown, the present invention further provides a circuit board module M, which includes a heat sink structure 1 having the aforementioned structure, a high-frequency, high-speed circuit board 2, and a heat conductor 3. The high-frequency, high-speed circuit board 2 is disposed on a first plate 11 of the heat sink structure 1. The heat conductor 3 is used to first direct heat generated by a heat source on the high-frequency, high-speed circuit board 2 to the first plate 11 for effective heat dissipation.

[0052] In this embodiment, the high-frequency, high-speed circuit board 2 includes a dielectric substrate 21 and at least one functional circuit layer 22 formed on the dielectric substrate 21. The functional circuit layer 22 may be, but is not limited to, an antenna structure. The thermal conductor 3 includes a first end 31, a second end 32, and a main body 33 connected to the first and second ends 31, 32. The first end 31 is thermally conductively connected to the first board 11, and the second end 32 is disposed adjacent to the functional circuit layer 22.

[0053] Furthermore, if Figure 11As shown, the dielectric substrate 21 of the high-frequency and high-speed circuit board 2 can be directly attached to the first board body 11 of the heat dissipation plate structure 1; preferably, the dielectric substrate 21 can be formed on the first board body 11 by a printed circuit board process or a soft board process, but is not limited to this. According to actual needs, an appropriate thermal conductive connection interface (such as thermal conductive glue) can also be used to connect the dielectric substrate 21 and the first board body 11 together. However, the present invention is not limited to the above examples. Under this architecture, the thermal conductor 3 can exist in the form of a column, wherein the first end 31 and the main body 33 of the thermal conductor 3 are both buried in the dielectric substrate 21, and the first end 31 is in direct contact with the first board body 11; it is worth noting that the second end 32 of the thermal conductor 3 protrudes from the dielectric substrate 21 from a position close to the functional circuit layer 22 to exchange heat with the functional circuit layer 22 through thermal convection.

[0054] In addition, if Figure 12 As shown, the dielectric substrate 21 of the high-frequency, high-speed circuit board 2 can be positioned above the first plate body 11 of the heat sink structure 1 via a plurality of support columns 4. That is, a plurality of support columns 4 can be provided between the dielectric substrate 21 and the first plate body 11. In this architecture, the thermal conductor 3 can be in the form of a column, wherein the first end 31 and the main body 33 of the thermal conductor 3 are both embedded in the dielectric substrate 21. The first end 31 directly contacts the support columns 4 and is thermally connected to the first plate body 11 through the support columns 4. The second end 32 of the thermal conductor 3 protrudes from the dielectric substrate 21 at a position close to the functional circuit layer 22. In this way, the second end 32 of the thermal conductor 3 can be positioned adjacent to the functional circuit layer 22 to exchange heat with the functional circuit layer 22 through thermal convection.

[0055] In addition, if Figure 13 and Figure 14 As shown, under the aforementioned two structures, the heat conductor 3 can exist in the form of a strip, wherein the first end portion 31 of the heat conductor 3 can be formed by extending from the first plate body 11, and the main body 33 of the heat conductor 3 extends toward the functional circuit layer 22 in a manner not to contact the dielectric substrate 21, so that the second end portion 32 is located near the functional circuit layer 22 without affecting the normal operation of the internal circuit (not shown in the figure) in the dielectric substrate 21.

[0056] Advantageous Effects of the Embodiments

[0057] One of the beneficial effects of the present invention is that the heat dissipation plate structure of the present invention can take into account lightweight, structural strength and heat dissipation capabilities through the technical solution of "the first plate body and the second plate body are correspondingly joined to form a accommodating cavity therebetween, the heat transfer layer is arranged in the accommodating cavity, and is located between the multiple first metal protrusions on the inner surface of the first plate body and the multiple second metal protrusions on the inner surface of the second plate body, and the buffer liquid is filled in the remaining space in the accommodating cavity", thereby meeting the design requirements of thin and light electronic products.

[0058] The contents disclosed above are only preferred feasible embodiments of the present invention and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the scope of the patent application of the present invention.

Claims

1. A heat dissipation plate structure, characterized in that: The heat dissipation plate structure comprises: a first plate body, comprising a first substrate layer and two first metal layers formed on two opposite surfaces of the first substrate layer, wherein the first metal layer located on the inner surface has a plurality of first metal bumps; a second plate body, the second plate body being joined to the first plate body to form a receiving cavity therebetween, wherein the second plate body comprises a second substrate layer and two second metal layers formed on two opposite surfaces of the second substrate layer, and the second metal layers on the inner surfaces thereof have a plurality of second metal bumps; a heat transfer layer disposed in the accommodating cavity and located between the first metal bumps and the second metal bumps; and a buffer liquid, which fills the remaining space in the accommodating cavity; The first plate has at least one first blind hole penetrating the first substrate layer or at least one first through hole penetrating the first substrate layer and the first metal layer, and the first blind hole or the first through hole is filled with a heat conductive material.

2. The heat dissipation plate structure according to claim 1, wherein: The positions of the plurality of first metal bumps and the plurality of second metal bumps are staggered.

3. The heat dissipation plate structure according to claim 1, wherein: The heat transfer layer is present in the form of a porous layer or a continuous layer.

4. The heat dissipation plate structure according to claim 1, wherein: The second plate body has at least one second blind hole, the second blind hole passes through the second substrate layer, and the second blind hole is filled with a heat conductive material.

5. The heat dissipation plate structure according to claim 1, wherein: The second plate has at least one second through hole. The second through hole passes through the second substrate layer and the second metal layer. A heat conductive material is filled in the second through hole.

6. The heat dissipation plate structure according to claim 1, wherein: The first plate body has a first inner portion and at least one first outer portion located on one side of the first inner portion, the second plate body has a second inner portion and at least one second outer portion located on one side of the second inner portion, and the accommodating cavity is formed between the first inner portion and the second inner portion.

7. The heat dissipation plate structure according to claim 6, wherein: The heat dissipation plate structure further includes at least one heat-conducting column, and the at least one heat-conducting column is connected between the first outer portion and the second outer portion.

8. The heat dissipation plate structure according to claim 1, wherein: The thickness of the heat dissipation plate structure is 0.2 mm to 0.5 mm, and the average height of the first metal bumps and the second metal bumps is 30 μm to 220 μm.

9. A circuit board module, characterized in that: The circuit board module includes: A heat sink structure comprising: a first plate body, comprising a first substrate layer and two first metal layers formed on two opposite surfaces of the first substrate layer, wherein the first metal layer located on the inner surface has a plurality of first metal bumps; a second plate body, the second plate body being joined to the first plate body to form a receiving cavity therebetween, wherein the second plate body comprises a second substrate layer and two second metal layers formed on two opposite surfaces of the second substrate layer, and the second metal layers on the inner surfaces thereof have a plurality of second metal bumps; a heat transfer layer disposed in the accommodating cavity and located between the first metal bumps and the second metal bumps; and a buffer liquid, which fills the remaining space in the accommodating cavity; The first plate has at least one first blind hole penetrating the first substrate layer or at least one first through hole penetrating the first substrate layer and the first metal layer, and the first blind hole or the first through hole is filled with a thermal conductive material; a high-frequency, high-speed circuit board, the high-frequency, high-speed circuit board being disposed on the first plate body of the heat sink structure, wherein the high-frequency, high-speed circuit board comprises a dielectric substrate and at least one functional circuit layer formed on the dielectric substrate; and A heat conducting member has a first end and a second end, the first end is thermally connected to the first plate body of the heat dissipation plate structure, and the second end is arranged near the functional circuit layer.

10. The circuit board module according to claim 9, wherein: The positions of the plurality of first metal bumps and the plurality of second metal bumps are staggered.

11. The circuit board module according to claim 9, wherein: The heat transfer layer is present in the form of a porous layer or a continuous layer.

12. The circuit board module according to claim 9, wherein: The second plate body has at least one second blind hole, the second blind hole passes through the second substrate layer, and the second blind hole is filled with a heat conductive material.

13. The circuit board module according to claim 9, wherein: The second plate has at least one second through hole. The second through hole passes through the second substrate layer and the second metal layer. A heat conductive material is filled in the second through hole.

14. The circuit board module according to claim 9, wherein: The first plate body has a first inner portion and at least one first outer portion located on one side of the first inner portion, the second plate body has a second inner portion and at least one second outer portion located on one side of the second inner portion, and the accommodating cavity is formed between the first inner portion and the second inner portion.

15. The circuit board module according to claim 14, wherein: The heat dissipation plate structure further includes at least one heat-conducting column, and the at least one heat-conducting column is connected between the first outer portion and the second outer portion.

16. The circuit board module according to claim 9, wherein: The thickness of the heat dissipation plate structure is 0.2 mm to 0.5 mm, and the average height of the first metal bumps and the second metal bumps is 30 μm to 220 μm.

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