Camera module

Abstract

The embodiment of the application discloses a camera module, relates to the field of image acquisition devices, and can be applied to the field of artificial intelligence, face recognition, image recognition and the like. The specific implementation scheme is that a heat conduction block is arranged between a main plate and a secondary plate, one end of the heat conduction block is combined with a control chip on the main plate, the other end of the heat conduction block is combined with the secondary plate, and the secondary plate is combined with a heat dissipation surface on a shell; heat generated by the control chip is first transmitted to the secondary plate through the heat conduction block, and then transmitted to the shell through the heat dissipation surface; compared with the control chip directly contacting the shell, the area of the shell receiving heat is larger, and local overheating of the shell can be avoided.

Description

TECHNICAL FIELD

[0001] The embodiment of the present application relates to an image acquisition device in an artificial intelligence device, in particular to a camera module. BACKGROUND

[0002] In an artificial intelligence device, an image acquisition task such as face recognition and behavior recognition is often performed through a camera module; wherein the camera module generally includes a shell and a mainboard, the shell is surrounded to form an installation cavity, the mainboard is placed in the installation cavity, and a control chip is arranged on the mainboard; since the control chip is prone to generate heat when working, the control chip is often directly in contact with the inner wall of the shell to directly transmit the heat generated by the control chip to the shell, thereby achieving heat dissipation.

[0003] However, the direct contact of the control chip with the shell makes the shell in contact with the control chip prone to overheating, resulting in overheating of part of the shell. SUMMARY

[0004] The present application provides a camera module.

[0005] According to an aspect of the present application, a camera module is provided, comprising:

[0006] a shell, the shell is surrounded to form an installation cavity with an installation opening at one end;

[0007] a mainboard and a subboard accommodated in the installation cavity, the mainboard and the subboard are arranged in parallel and spaced apart, the installation cavity has a heat dissipation surface arranged opposite to the installation opening, and the subboard is attached to the heat dissipation surface;

[0008] a heat conduction block arranged between the mainboard and the subboard, one end of the heat conduction block is engaged with the control chip on the mainboard, and the other end of the heat conduction block is engaged with the subboard.

[0009] The technical solution according to the present application solves the problem of overheating of part of the shell.

[0010] It should be understood that the contents described in this part are not intended to identify the key or important features of the embodiments of the present application, nor are they used to limit the scope of the present application. Other features of the present application will become apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0011] The accompanying drawings are used to better understand the present application, and do not constitute a limitation on the present application. Among them:

[0012] Figure 1 is the overall view of the camera module provided by the embodiment of the present application;

[0013] Figure 2 is the cross-sectional view of the camera module provided by the embodiment of the present application;

[0014] Figure 3 is an explosion of the camera module provided by an embodiment of the present application Figure 1 ;

[0015] Figure 4 is an explosion of the camera module provided by an embodiment of the present application Figure 2 ;

[0016] Figure 5 is a structural schematic diagram of a bottom plate in the camera module provided by an embodiment of the present application

[0017] Figure 6 is a connection schematic diagram among a sub plate, a main plate and the bottom plate in the camera module provided by an embodiment of the present application

[0018] Legend:

[0019] 10: shell

[0020] 20: main plate

[0021] 30: sub plate

[0022] 40: bottom plate

[0023] 50: heat conduction block

[0024] 60: transparent plate

[0025] 101: mounting cavity

[0026] 102: second light transmission hole

[0027] 103: light supplement hole

[0028] 104: third mounting hole

[0029] 105: adjusting groove

[0030] 106: opening

[0031] 107: connecting plate

[0032] 108: connecting hole

[0033] 201: control chip

[0034] 202: camera device

[0035] 203: connecting column

[0036] 204: stud

[0037] 205: interface device

[0038] 206: first mounting hole

[0039] 207: connecting bolt;

[0040] 208: second threaded hole;

[0041] 301: first light-transmitting hole;

[0042] 302: second mounting hole;

[0043] 303: natural light supplementing device;

[0044] 304: infrared light supplementing device;

[0045] 305: detection device;

[0046] 306: indicator light;

[0047] 401: heat dissipation boss;

[0048] 402: accommodating groove;

[0049] 403: first threaded hole;

[0050] 601: first light-transmitting area;

[0051] 602: second light-transmitting area;

[0052] 603: third light-transmitting area;

[0053] 604: fourth light-transmitting area;

[0054] 605: fifth light-transmitting area. DETAILED DESCRIPTION

[0055] Exemplary embodiments of the present application are described herein with reference to the accompanying drawings, which are meant to be exemplary. It should be understood, therefore, that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the application. Throughout the specification, like reference numerals refer to like elements in a drawing. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present application. It can be evident, however, that the present application can be practiced without these specific details. In other instances, well-known structures and functions are not described in detail in order to avoid obscuring the present application.

[0056] The camera module provided by the embodiments of the present application can be used in the field of artificial intelligence, face recognition, image recognition, etc., so as to avoid the overheating of the local area of the shell.

[0057] Reference is made to Figure 1 and Figure 2The camera module provided in the embodiment comprises a shell 10, the shell 10 surrounds a mounting cavity 101, and one end of the mounting cavity 101 has a mounting opening, so that other devices can be placed in the mounting cavity 101 through the mounting opening. Exemplarily, the shell 10 can have a regular shape such as a cuboid or a cylinder, and of course, the shell 10 can also have other irregular shapes, and the shape of the shell 10 is not limited in the embodiment.

[0058] Further, the material of the shell 10 is not limited in the embodiment. Exemplarily, the material of the shell 10 can comprise metal materials such as copper, iron and aluminum, and of course, the material of the shell 10 can also comprise non-metal materials such as plastic.

[0059] In the implementation mode in which the material of the shell 10 is a metal material, an oxide film can be formed on the outer wall of the shell 10, which can protect the internal metal from being corroded. In addition, compared with painting on the outer wall of the shell 10, the heat exchange speed between the oxide film composed of metal oxides and the external air is faster, which can make the heat on the shell 10 quickly transferred to the external air, so as to improve the heat dissipation effect of the shell 10.

[0060] Exemplarily, the oxide film can be formed by an electrochemical method, and of course, the shell 10 can also be treated by a solution containing an oxidizing agent to form the oxide film. The forming mode of the oxide film is not limited in the embodiment.

[0061] In other implementation modes, a frosted structure can also be formed on the outer wall of the shell 10 to increase the contact area between the shell 10 and the external air, so as to further improve the heat transfer rate between the shell 10 and the external air.

[0062] Please refer to Figures 2-4 The camera module provided in the embodiment further comprises a main board 20 and a sub-board 30, both of which are arranged in the mounting cavity 101, and the main board 20 and the sub-board 30 are arranged in parallel and spaced apart. The mounting cavity 101 has a heat dissipation surface at the end extending inward from the mounting opening, and the heat dissipation surface is arranged opposite to the mounting opening. The main board 20 and the sub-board 30 are arranged between the heat dissipation surface and the mounting opening, and the sub-board 30 is arranged close to the heat dissipation surface and is attached to the heat dissipation surface.

[0063] In the above implementation mode, the main board 20 can be a circuit board (such as a PCB board), and the main board 20 is provided with a control chip 201, a camera device 202 and other electronic devices. The main board 20 is provided with a circuit, and the control chip 201, the camera device 202 and the electronic devices are electrically connected to the circuit. The camera device 202 and the electronic devices can be controlled to work through the control chip 201.

[0064] The control chip 201 can be arranged on the side of the main plate 20 facing the auxiliary plate 30, a heat-conducting block 50 is arranged between the main plate 20 and the auxiliary plate 30, one end of the heat-conducting block 50 is engaged with the control chip 201, and the other end of the heat-conducting block 50 is engaged with the side of the auxiliary plate 30 facing the main plate 20. In this way, the heat generated by the control chip 201 can be transmitted to the auxiliary plate 30 through the heat-conducting block 50, and since the auxiliary plate 30 is engaged with the heat-dissipating surface, the heat transmitted to the auxiliary plate 30 can be transmitted to the shell 10 through the heat-dissipating surface, thereby achieving heat dissipation.

[0065] The camera module provided in the embodiment of the present application has the heat-conducting block 50 arranged between the main plate 20 and the auxiliary plate 30, one end of the heat-conducting block 50 is engaged with the control chip 201 on the main plate 20, the other end of the heat-conducting block 50 is engaged with the auxiliary plate 30, and the auxiliary plate 30 is engaged with the heat-dissipating surface on the shell; the heat generated by the control chip 201 is first transmitted to the auxiliary plate 30 through the heat-conducting block 50, and then transmitted to the shell 10 through the heat-dissipating surface; compared with the control chip 201 directly contacting the shell 10, the area of the shell 10 receiving heat is larger, and the local overheating of the shell 10 can be avoided. In addition, the heat is first transmitted to the auxiliary plate 30 through the heat-conducting block 50, and then transmitted to the shell 10 through the auxiliary plate 30, which increases the heat transmission path, and part of the heat is released to the external environment in the process of transmission, which further avoids the local overheating of the shell 10.

[0066] In the embodiment, the camera module is still taken as an example for description. Figure 4 The connecting plate 107 can be arranged on the outer wall of the shell 10 close to the mounting port, and the connecting hole 108 is arranged on the connecting plate 107 to facilitate the fixation of the shell 10.

[0067] In the embodiment, the camera module is still taken as an example for description. Figure 3 In the implementation mode in which the main plate 20 is a circuit board, the interface device 205 can be arranged on the main plate 20, and correspondingly, the opening 106 opposite to the interface device 205 is arranged on the shell 10, so that the external device can be electrically connected with the main plate 20 through the interface device 205. The interface device 205 can be a USB interface, a debugging interface, a power interface, etc.

[0068] In the embodiment, the heat-conducting block 50 can directly contact the control chip 201 and the auxiliary plate 30, so that the heat is transmitted to the auxiliary plate 30 through the heat-conducting block 50. Further, the first heat-conducting glue (not shown) can be arranged between the heat-conducting block 50 and the control chip 201, that is, the heat-conducting block 50 contacts the control chip 201 through the first heat-conducting glue; the control chip 201 transmits the heat to the heat-conducting block 50 through the first heat-conducting glue, thereby improving the speed of heat transmission to the heat-conducting block 50 to improve the heat dissipation rate. The first heat-conducting glue can be heat-conducting silica gel.

[0069] In other implementations, a second heat-conducting silica gel (not shown) is arranged between the heat-conducting block 50 and the sub-plate 30, that is, the heat-conducting block 50 is in contact with the sub-plate 30 through the second heat-conducting silica gel; in this way, the heat in the heat-conducting block 50 is transmitted to the sub-plate 30 through the second heat-conducting silica gel, which improves the speed of heat transmission to the sub-plate 30 and further improves the heat dissipation rate. The second heat-conducting silica gel can be a heat-conducting silica gel. Of course, the heat-conducting block 50 can also be in an integral structure with the sub-plate 30; in this way, the speed of heat transmission from the heat-conducting block 50 to the sub-plate 30 can also be increased.

[0070] In some embodiments, one end of the heat-conducting block 50 is in contact with the control chip 201 through the first heat-conducting silica gel, and the other end of the heat-conducting block 50 is in contact with the sub-plate 30 through the second heat-conducting silica gel; in this way, the speed of heat transmission can be further improved, and the heat dissipation rate can be further improved.

[0071] In this embodiment, the heat-conducting block 50 can have a regular shape such as a cylindrical shape or a prismatic shape. Of course, the heat-conducting block 50 can also have other irregular shapes.

[0072] The heat-conducting block 50 needs to cover the control chip 201 so that most of the heat generated by the control chip 201 is transmitted into the heat-conducting block 50; that is, the control chip 201 has an outer side surface for contacting the heat-conducting block 50, and the end surface of the heat-conducting block 50 that is in contact with the control chip 201 covers the outer side surface. For example, the end surface of the heat-conducting block 50 that is in contact with the control chip 201 can completely coincide with the outer side surface; or the projection of the outer side surface on the main plate 20 is located within the projection of the end surface of the heat-conducting block 50 that is in contact with the control chip 201 on the main plate 20.

[0073] In the above implementations, the area of the end of the heat-conducting block 50 that is in contact with the control chip 201 is smaller than the area of the end of the heat-conducting block 50 that is in contact with the sub-plate 30; in this way, the contact area between the heat-conducting block 50 and the sub-plate 30 can be increased, and the speed of heat transmission between the heat-conducting block 50 and the sub-plate 30 can be improved, so as to improve the heat dissipation rate. For example, the heat-conducting block 50 can have a circular truncated cone shape or a prismatic truncated cone shape.

[0074] In this embodiment, the heat-conducting block 50 can be a metal block, and the material of the heat-conducting block 50 can include copper, iron, aluminum, etc. Further, the sub-plate 30 can be a metal plate, and the material of the sub-plate 30 can include copper, iron, aluminum, etc. In this way, the heat-conducting block 50 and the sub-plate 30 are made of metal, which improves the speed of heat transmission between the heat-conducting block 50 and the sub-plate 30 and further improves the heat dissipation rate.

[0075] Please continue to refer to Figure 2 and Figure 3The camera module provided in the embodiment further includes a bottom plate 40 arranged in the mounting port to block the mounting port. In this way, the bottom plate 40 can block the mounting port to seal the mounting cavity 101.

[0076] In the above implementation, a heat dissipation boss 401 is arranged between the bottom plate 40 and the main plate 20, one end of the heat dissipation boss 401 is engaged with the side of the main plate 20 away from the auxiliary plate 30, and the other end of the heat dissipation boss 401 is engaged with the bottom plate 40. In this way, the heat from the main plate 20 can be transmitted to the bottom plate 40 through the heat dissipation boss 401, and then transmitted to the external environment by the bottom plate 40, thereby improving the heat dissipation effect. In addition, the heat generated by the control chip 201 can also be transmitted to the external environment through the main plate 20, the heat dissipation boss 401 and the bottom plate 40, which can further avoid overheating of the local area of the shell 10 compared with the direct contact of the control chip 201 with the shell 10.

[0077] In the implementation in which the main plate 20 includes a circuit board, the heat dissipation boss 401 can be directly engaged with the circuit board. The side of the main plate 20 away from the auxiliary plate 30 can be provided with electronic devices, and at this time the heat dissipation boss 401 can be engaged with the electronic devices with a larger heat generation. Of course, a protrusion can also be arranged on the side of the circuit board away from the auxiliary plate 30, and the heat dissipation boss 401 is engaged with the protrusion.

[0078] Further, a third heat-conducting glue (not shown) is arranged between the heat dissipation boss 401 and the main plate 20. In this way, the heat transfer speed between the heat dissipation boss 401 and the main plate 20 can be improved, and the heat can be quickly transmitted to the heat dissipation boss 401, and then released to the external environment by the bottom plate 40, thereby improving the heat dissipation rate. The third heat-conducting glue can be heat-conducting silicone.

[0079] In some embodiments, the heat dissipation boss 401 can also be in contact with the bottom plate 40 through heat-conducting silicone, thereby improving the heat transfer speed between the heat dissipation boss 401 and the bottom plate 40.

[0080] As shown in FIG. 1, Figure 5 In other implementations, the heat dissipation boss 401 can be an integral structure with the bottom plate 40. In this way, the heat transmitted to the heat dissipation boss 401 can directly enter the bottom plate 40, thereby improving the heat transfer speed between the heat dissipation boss 401 and the bottom plate 40.

[0081] In the embodiment, the heat dissipation boss 401 can be a plurality of heat dissipation bosses 401 arranged at intervals. In this way, the plurality of heat dissipation bosses 401 can simultaneously transmit the heat of the main plate 20 to the bottom plate 40 to improve the speed of heat transfer from the main plate 20 to the bottom plate 40, thereby improving the heat dissipation rate.

[0082] The bottom plate 40 can be a metal plate, and an example material of the bottom plate 40 can include copper, iron, aluminum, etc. The bottom plate 40 formed of metal can improve the heat transfer rate, thereby improving the heat dissipation effect. Of course, the bottom plate 40 can also be mainly formed of a non-metal material such as plastic. The material of the heat dissipation boss 401 can also include copper, iron, aluminum, etc.

[0083] With reference back to Figure 2 In some embodiments, the heat dissipation surface is provided with an adjusting groove 105, and the contact area between the secondary plate 30 and the shell 10 can be adjusted through the adjusting groove 105 to adjust the speed of heat transfer from the secondary plate 30 to the shell 10.

[0084] With reference back to Figure 2 , Figure 3 and Figure 5 Some of the electronic devices located on the main plate 20 can be arranged on the side of the main plate 20 away from the secondary plate 30, and a receiving groove 402 can be arranged on the side of the bottom plate 40 facing the main plate 20. The electronic devices on the side of the main plate 20 away from the secondary plate 30 are accommodated in the receiving groove 402. That is, one end of the electronic device away from the main plate 20 is accommodated in the receiving groove 402. In this way, part of the electronic devices are accommodated in the receiving groove 402, which can reduce the space occupied by the electronic devices in the mounting cavity 101, and can reduce the volume of the mounting cavity 101, thereby reducing the volume of the shell 10, and facilitating the miniaturization of the camera module.

[0085] It should be noted that the electronic devices accommodated in the receiving groove 402 can be capacitors, resistors, inductors, etc. The present embodiment does not limit the electronic devices.

[0086] Further, the receiving groove 402 can be a plurality of receiving grooves 402 arranged at intervals, so that different electronic devices can be accommodated in different receiving grooves 402.

[0087] With reference back to Figure 2 and Figure 3 The camera module provided by the present embodiment further includes a connecting column 203, one end of the connecting column 203 is provided with a threaded column 204, and the diameter of the connecting column 203 is greater than the diameter of the threaded column 204. Correspondingly, the main plate 20 is provided with a first mounting hole 206, and the bottom plate 40 is provided with a first threaded hole 403. The threaded column 204 passes through the first mounting hole 206 and cooperates with the first threaded hole 403. In this way, the connection between the main plate 20 and the bottom plate 40 is realized through the connecting column 203 and the threaded column 204, which is simple in structure and convenient to install.

[0088] The connecting column 203 and the screw post 204 can be made of metal materials such as copper and aluminum, and can also be made of non-metal materials such as plastic. The present embodiment does not limit the materials of the connecting column 203 and the screw post 204, as long as the main board 20 and the bottom plate 40 can be connected.

[0089] Further, the camera module further comprises a connecting bolt 207, the connecting column 203 is provided with a second threaded hole 208, the auxiliary plate 30 is provided with a second mounting hole 302, and the shell is provided with a third mounting hole 104 penetrating the heat dissipation surface; the connecting bolt 207 is sequentially threaded through the third mounting hole 104, the second mounting hole 302, and cooperates with the second threaded hole 208. The connecting bolt 207 can fix the connecting column 203 and the auxiliary plate 30 on the shell 10; since the connecting column 203 and the screw post 204 have fixed the bottom plate 40 and the main board 20 together, the connecting bolt 207, the connecting column 203, and the screw post 204 can realize the connection between the bottom plate 40, the main board 20, the auxiliary plate 30, and the shell; the structure is simple and the connection is convenient.

[0090] In the above implementation, the connecting column 203 and the connecting bolt 207 can be multiple; correspondingly, the bottom plate 40 is provided with multiple first threaded holes 403, the main board 20 is provided with multiple first mounting holes 206, the auxiliary plate 30 is provided with multiple second mounting holes 302, and the shell 10 is provided with multiple third mounting holes 104; wherein the screw post 204 on each connecting column 203 is threaded through a first mounting hole 206 and cooperates with the first threaded hole 403 opposite to the first mounting hole 206; each connecting bolt 207 is sequentially threaded through a third mounting hole 104 and a second mounting hole 302 opposite to the third mounting hole 104, and cooperates with a second threaded hole 208 on a connecting column 203. Multiple connecting columns 203 and connecting bolts 207 can improve the connection strength between the bottom plate 40, the main board 20, the auxiliary plate 30, and the shell 10.

[0091] Continuing to refer to Figure 2 and Figure 3 , the camera module provided by the present embodiment is provided with a camera 202 on the main board 20, the camera 202 can be arranged on the side of the main board 20 facing the auxiliary plate 30, that is, the camera 202 and the control chip 201 are located on the same side of the main board 20; the camera 202 is used to acquire images of the outside world to realize face recognition or behavior recognition. Further, the camera 202 can be multiple, and the multiple cameras 202 are arranged at intervals, and correspondingly, the multiple cameras 202 can simultaneously acquire images of the outside world.

[0092] In order to be able to receive external light, a first light-transmitting hole 301 is arranged on the sub-plate 30 and faces the camera 202, and a second light-transmitting hole 102 is arranged on the shell 10 and penetrates the heat dissipation surface, and the second light-transmitting hole 102 faces the first light-transmitting hole 301. In this way, the camera 202 can receive external light through the second light-transmitting hole 102 and the first light-transmitting hole 301 to achieve image acquisition.

[0093] In the implementation in which the bottom plate 40, the main plate 20, the sub-plate 30, and the shell 10 are fixed together by the connecting column 203 and the connecting bolt 207, the length of the connecting column 203 can be reasonably set so that the end of the camera 202 away from the main plate 20 extends into the second light-transmitting hole 102, so as to prevent the main plate 20 and the shell 10 from blocking light, thereby improving the image quality obtained by the camera 202.

[0094] In the embodiment, the camera module further includes a transparent plate 60, which covers the shell 10 to block the second light-transmitting hole 102. In this way, the second light-transmitting hole 102 can be closed, thereby preventing external dust and other impurities from entering the shell.

[0095] The transparent plate 60 can be mainly made of glass, organic glass (PMMA), or other transparent materials.

[0096] In the above implementation, the transparent plate 60 can be connected between the shell 10 and the adhesive. Further, the shell 10 can be provided with a groove, the second light-transmitting hole 102 is arranged at the bottom of the groove, and the transparent plate 60 is arranged in the groove. In this way, the transparent plate 60 is accommodated in the groove on the shell 10, and the camera module can be further miniaturized.

[0097] In the implementation in which the bottom plate 40, the main plate 20, the sub-plate 30, and the shell 10 are fixed together by the connecting column 203 and the connecting bolt 207, the third mounting hole 104 on the shell 10 can be arranged at the bottom of the groove, and the third mounting hole 104 can include a first section and a second section in the circumferential direction, the first section is arranged close to the sub-plate 30, and the diameter of the first section is smaller than that of the second section, and the nut of the connecting bolt 207 can be accommodated in the second section, so as to prevent the connecting bolt 207 from affecting the covering of the transparent plate 60 on the bottom of the groove.

[0098] Please refer to Figure 6In some embodiments, the third mounting hole 104 on the shell 10 has a diameter larger than that of the nut of the connecting bolt 207, and the bottom plate 40 and the main plate 20 are fixed together through the connecting post 203 and the threaded post 204, and the main plate 20 and the auxiliary plate 30 are fixed together through the connecting post 203 and the connecting bolt 207; that is, the bottom plate 40, the main plate 20 and the auxiliary plate 30 are assembled into a module through the connecting bolt 207, the connecting post 203 and the threaded post 204, and in the assembly process of the camera module, the bottom plate 40, the main plate 20 and the auxiliary plate 30 can be assembled into a module outside the shell 10, and then the module is assembled into the shell 10, which facilitates the assembly of the camera module; in addition, the module assembled by the bottom plate 40, the main plate 20 and the auxiliary plate 30 can realize the image acquisition function, so that the module can be tested after assembly, which facilitates the debugging after testing.

[0099] With reference to the foregoing Figure 2 and Figure 3 In this embodiment, the side of the auxiliary plate 30 away from the main plate 20 is provided with a light supplementing device, and the heat dissipation surface is provided with a light supplementing hole 103 opposite to the light supplementing device; the light supplementing device can provide light supplement through the light supplementing hole 103 while the camera device 202 acquires the image of the outside world, thereby improving the image quality acquired by the camera device 202.

[0100] For example, the light supplementing device can include a natural light supplementing device 303 and a detection device 305, the detection device 305 can detect the light of the outside world, so that the natural light supplementing device 303 emits white light when the light of the outside world is insufficient, thereby enabling the camera device 202 to acquire a clearer image. The natural light supplementing device 303 can be a light emitting diode, a bulb or the like capable of emitting white light; the detection device 305 can include a photoresistor or other device capable of detecting the light of the outside world.

[0101] Further, the light supplementing device can also include an infrared light supplementing device 304, which can emit infrared rays outward at night to meet the demand of night shooting. The infrared light supplementing device 304 can be a diode capable of emitting infrared rays or other device capable of emitting infrared rays.

[0102] An indicator light 306 can also be provided on the auxiliary plate 30, which can emit light when the camera module is working to prompt that the camera module is in a working state.

[0103] In some embodiments, in order to realize the electrical connection between the natural light light supplement device 303, the detection device 305, the infrared light light supplement device 304, the indicator light 306 and the main board 20, a first plug-in part can be arranged on the side of the main board 20 facing the sub-board 30, and the first plug-in part is electrically connected with the circuit on the main board 20; correspondingly, a second plug-in part can be arranged on the side of the sub-board 30 facing the main board 20, and the second plug-in part is electrically connected with the natural light light supplement device 303, the detection device 305, the infrared light light supplement device 304 and the indicator light 306; the first plug-in part cooperates with the second plug-in part, so as to realize the electrical connection between the natural light light supplement device 303, the detection device 305, the infrared light light supplement device 304 and the indicator light 306 and the main board 20.

[0104] In the implementation mode in which the natural light light supplement device 303, the detection device 305, the infrared light light supplement device 304 and the indicator light 306 are arranged on the sub-board 30, the transparent plate 60 has a first light transmission area 601 opposite to the natural light light supplement device 303, a second light transmission area 602 opposite to the detection device 305, a third light transmission area 603 opposite to the infrared light light supplement device 304, a fourth light transmission area 604 opposite to the indicator light 306 and a fifth light transmission area 605 opposite to the camera 202. For example, the transparent plate 60 can be silk-screened or etched to mark the light transmission areas.

[0105] The above detailed description does not constitute a limitation on the protection scope of the present application. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent replacement and improvement within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A camera module, comprising: a housing, the housing enclosing a mounting cavity having a mounting opening at one end; a main board and a sub-board accommodated in the mounting cavity, the sub-board being a metal plate, the main board and the sub-board being arranged in parallel and spaced apart, the mounting cavity having a heat dissipation surface arranged opposite to the mounting opening, the sub-board being attached to the heat dissipation surface, the heat dissipation surface being provided with an adjusting groove; a heat conduction block arranged between the main board and the sub-board, one end of the heat conduction block being engaged with a control chip on the main board, the other end of the heat conduction block being engaged with the sub-board; the camera module further comprising a bottom plate arranged in the mounting opening for closing the mounting opening; a heat dissipation boss being arranged between the bottom plate and the main board, one end of the heat dissipation boss being engaged with a side of the main board away from the sub-board, the other end of the heat dissipation boss being engaged with the bottom plate; an area of the one end of the heat conduction block engaged with the control chip being smaller than an area of the other end of the heat conduction block engaged with the sub-board; the bottom plate being provided with an accommodating groove on a side thereof facing the main board, part of electronic devices on a side of the main board away from the sub-board being accommodated in the accommodating groove. 2.The camera module of claim 1, a first heat conduction glue being arranged between the heat conduction block and the control chip. 3.The camera module of claim 1, a second heat conduction glue being arranged between the heat conduction block and the sub-board. 4.The camera module of claim 1, the heat conduction block being a metal block. 5.The camera module of claim 1, a third heat conduction glue being arranged between the heat dissipation boss and the main board. 6.The camera module of claim 1, the heat dissipation boss and the bottom plate being an integral structure. 7.The camera module of claim 1, the heat dissipation boss being a plurality of heat dissipation bosses arranged in spaced apart. 8.The camera module of claim 1, the camera module further comprising a connecting column, one end of the connecting column being provided with a stud, a diameter of the connecting column being greater than an outer diameter of the stud; the main board being provided with a first mounting hole, the bottom plate being provided with a first threaded hole, the stud passing through the first mounting hole and cooperating with the first threaded hole. 9.The camera module of claim 8, the camera module further comprising a connecting bolt, the sub-board being provided with a second mounting hole, the heat dissipation surface being provided with a third mounting hole, the connecting column being provided with a second threaded hole, the connecting bolt passing through the third mounting hole and the second mounting hole and cooperating with the second threaded hole. 10.The camera module of any one of claims 1-4, the main board being provided with a camera device, the sub-board being provided with a first light transmission hole directly opposite to the camera device, the heat dissipation surface being provided with a second light transmission hole directly opposite to the first light transmission hole. 11.The camera module of claim 10, the camera module further comprising a transparent plate, the transparent plate being covered on the housing to block the second light transmission hole.

12. The camera module of any one of claims 1-4, wherein a side of the sub-board opposite to the main board is provided with a light supplementing device, and the heat dissipation surface is provided with a light supplementing hole opposite to the light supplementing device.

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