A circuit substrate, a flexible film circuit and a manufacturing method thereof

Abstract

The present invention provides a circuit substrate, a flexible film circuit and a manufacturing method thereof, and relates to the field of microelectronic technology. The circuit substrate provided by the present invention comprises: a first flexible substrate; a second flexible substrate; a liquid metal circuit, wherein the liquid metal circuit is located between the first flexible substrate and the second flexible substrate; wherein the first flexible substrate has a non-viscous state and a viscous state, wherein the first flexible substrate is in a non-viscous state when dry and is in a viscous state after contacting a first liquid. The technical solution of the present invention can simply and conveniently manufacture and use a flexible film circuit.

Description

Technical Field

[0001] The present invention relates to the field of microelectronic technology, and in particular to a circuit substrate, a flexible film circuit and a manufacturing method thereof. Background Art

[0002] Traditional circuits are integrated on PCB boards. The process of making PCB boards is complicated and requires tedious production steps such as cutting, drilling, copper plating, circuit contouring, graphic electroplating, etching, center testing, and solder resist. The production and processing cycle before realizing its function is long and the production cost is high.

[0003] With the continuous advancement of printed electronics technology, conductive fluids represented by liquid metal have made direct writing and printing possible. However, circuits still require the use of liquid metal direct writing pens, liquid metal printers and other equipment to make circuits, and the production of circuits is still relatively complicated.

[0004] Moreover, existing circuits are all enclosed in fixed products and cannot meet users' diverse needs for circuit usage scenarios and purposes. Summary of the invention

[0005] The present invention provides a circuit substrate, a flexible film circuit and a manufacturing method thereof, which can simply and conveniently manufacture and use the flexible film circuit.

[0006] In a first aspect, the present invention provides a circuit substrate, which adopts the following technical solution:

[0007] The circuit substrate comprises:

[0008] a first flexible substrate;

[0009] a second flexible substrate;

[0010] A liquid metal circuit, wherein the liquid metal circuit is located between the first flexible substrate and the second flexible substrate;

[0011] The first flexible substrate has a non-sticky state and a sticky state. The first flexible substrate is in a non-sticky state when dry and is in a sticky state after contacting the first liquid.

[0012] Optionally, the first flexible substrate includes an insulating body and starch powder and / or beeswax powder dispersed in the insulating body.

[0013] Optionally, the second flexible substrate has a dense state and a loose state. The second flexible substrate is in a dense state when dry, and is in a loose state after contacting the second liquid, allowing the first liquid to pass through the second flexible substrate.

[0014] Optionally, the second flexible substrate is a homogeneous structure, and the second flexible substrate can be completely dissolved in the second liquid.

[0015] Furthermore, the second flexible substrate is a PVB film, a PVP film, a PVA film, a sodium alginate film, a gelatin film, a chitosan film, a PEO film or a PEG film.

[0016] Optionally, the second flexible substrate includes a porous structure and a filling structure filled in the holes of the porous structure, and the filling structure is soluble in the second liquid.

[0017] Optionally, the circuit substrate further includes: at least one resistor and at least one light emitting diode, wherein the at least one resistor and the at least one light emitting diode are both located between the first flexible substrate and the second flexible substrate, and are both connected to the liquid metal circuit.

[0018] In a second aspect, the present invention provides a flexible film circuit, which adopts the following technical solution:

[0019] The flexible film circuit is made of any of the above circuit substrates, and the flexible film circuit comprises:

[0020] a first flexible substrate in a sticky state;

[0021] A liquid metal circuit, wherein the liquid metal circuit is located on the first flexible substrate;

[0022] A battery, the battery being adhered to the first flexible substrate and connected to the liquid metal circuit;

[0023] at least one resistor, the at least one resistor being located on the first flexible substrate and connected to the liquid metal circuit;

[0024] At least one light emitting diode is located on the first flexible substrate and connected to the liquid metal circuit.

[0025] In a third aspect, the present invention provides a method for manufacturing a flexible thin film circuit, which adopts the following technical solution:

[0026] The method for manufacturing the flexible thin film circuit is used to manufacture the flexible thin film circuit described above, and the method for manufacturing the flexible thin film circuit comprises:

[0027] Step S1, providing a circuit substrate;

[0028] Step S2, making the first flexible substrate in the circuit substrate contact with a first liquid to be in a viscous state;

[0029] Step S3: Pasting a battery on the first flexible substrate in a sticky state, wherein the battery is connected to the liquid metal circuit.

[0030] Optionally, step S2 includes:

[0031] Spraying a second liquid onto the second flexible substrate in the circuit substrate, wherein the second liquid is the same as the first liquid or includes the first liquid, so that the second flexible substrate is in a loose state;

[0032] The second liquid passes through the second flexible substrate in a loose state and reaches the first flexible substrate, so that the first flexible substrate is in a sticky state.

[0033] The present invention provides a circuit substrate, a flexible film circuit and a method for manufacturing the same, wherein the circuit substrate comprises a first flexible substrate, a second flexible substrate and a liquid metal circuit located therebetween. The circuit substrate already has a liquid metal circuit, so the process of using the circuit substrate to manufacture the flexible film circuit is simple. Furthermore, since the first flexible substrate is in a non-sticky state when dry and is in a sticky state after contacting a first liquid, the flexible film circuit manufactured using the circuit substrate can be pasted to a target position by contacting the first flexible substrate with the first liquid, making the flexible film circuit simple and convenient to use, which is conducive to meeting the diverse needs of users for the use scenarios and purposes of the flexible film circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0035] Figure 1 A top view of a circuit substrate provided by an embodiment of the present invention Figure 1 ;

[0036] Figure 2 The embodiment of the present invention provides Figure 1 Schematic diagram of the cross section along the AA' direction;

[0037] Figure 3 A top view of a circuit substrate provided by an embodiment of the present invention Figure 2 ;

[0038] Figure 4 The embodiment of the present invention provides Figure 3 Schematic diagram of the cross section along the AA' direction;

[0039] Figure 5A schematic diagram of the structure of a flexible film circuit provided by an embodiment of the present invention;

[0040] Figure 6 The present invention provides a flowchart of a method for manufacturing a flexible thin film circuit according to an embodiment of the present invention. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] It should be noted that the various technical features in the embodiments of the present invention can be combined with each other without conflict.

[0043] The embodiment of the present invention provides a circuit substrate, specifically, as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, Figure 1 A top view of a circuit substrate provided by an embodiment of the present invention Figure 1 , Figure 2 The embodiment of the present invention provides Figure 1 Schematic diagram of the cross section along the AA' direction, Figure 3 A top view of a circuit substrate provided by an embodiment of the present invention Figure 2 , Figure 4 The embodiment of the present invention provides Figure 3 A schematic cross-sectional view along the AA' direction, wherein the circuit substrate comprises a first flexible substrate 1, a second flexible substrate 2 and a liquid metal circuit 3, wherein the liquid metal circuit 3 is located between the first flexible substrate 1 and the second flexible substrate 2; wherein the first flexible substrate 1 has a non-sticky state and a sticky state, wherein the first flexible substrate 1 is in a non-sticky state when dry, and is in a sticky state after contacting the first liquid.

[0044] Since the circuit substrate already has a liquid metal circuit 3, the process of using the circuit substrate to make a flexible film circuit is simple, and since the first flexible substrate 1 is in a non-sticky state when dry and is in a sticky state after contacting the first liquid, the flexible film circuit made using the circuit substrate can be pasted to the target position by making the first flexible substrate 1 contact the first liquid, making the use of the flexible film circuit simple and convenient, which is conducive to meeting the user's diverse needs for the use scenarios and purposes of the flexible film circuit.

[0045] In the embodiment of the present invention, the first flexible substrate 1 may have a variety of structures, and a corresponding first liquid may be selected for different structures so that the first flexible substrate 1 can be in a viscous state after contacting the first liquid. The first flexible substrate 1 may undergo physical and / or chemical changes during the process of changing from a non-viscous state to a viscous state, and the embodiment of the present invention does not limit this, as long as it can still play a role in fixing the liquid metal circuit 3 thereon.

[0046] In one example, the first flexible substrate 1 includes an insulating body and starch powder and / or beeswax powder dispersed in the insulating body. The insulating body may include plant fibers, water-soluble resins, etc. After the first flexible substrate 1 with this structure comes into contact with water, the starch powder and / or beeswax powder therein will dissolve in the water, thereby becoming sticky and making the first flexible substrate 1 in a sticky state. Based on this, water or any liquid containing water can be used as the first liquid described above, so that the first liquid has a wide range of choices and good biocompatibility, which is conducive to further simplifying the use of flexible film circuits and further meeting the diverse needs of users for the use scenarios and purposes of flexible film circuits.

[0047] In another example, the first flexible substrate 1 includes a plurality of microcapsules, the capsule walls of the microcapsules are soluble in the first liquid and are non-sticky, and the capsule cores of the microcapsules are sticky. When the first flexible substrate 1 having such a structure contacts the first liquid, the capsule walls of the microcapsules dissolve, releasing the capsule cores of the microcapsules, thereby making the first flexible substrate 1 in a sticky state.

[0048] In another example, the first flexible substrate 1 includes two components that are uniformly mixed, and the two components can react chemically after contacting the first liquid to generate a viscous substance. After the first flexible substrate 1 with this structure contacts the first liquid, the two components react chemically to generate a viscous substance, thereby making the first flexible substrate 1 in a viscous state.

[0049] It should be noted that the “liquid metal” used in the liquid metal circuit 3 in the embodiment of the present invention is an alloy or a metal element with a melting point below 300° C., or a conductive mixture with the above-mentioned metal element or alloy as the main component.

[0050] Optionally, the alloy or metal element in the liquid metal can be one or more of gallium, indium, tin, mercury, gallium-indium alloy, gallium-indium-tin alloy, gallium-tin alloy, gallium-zinc alloy, gallium-indium-zinc alloy, gallium-tin-zinc alloy, gallium-indium-tin-zinc alloy, gallium-tin-cadmium alloy, gallium-zinc-cadmium alloy, bismuth-indium alloy, bismuth-tin alloy, bismuth-indium-tin alloy, bismuth-indium-zinc alloy, bismuth-tin-zinc alloy, bismuth-indium-tin-zinc alloy, bismuth-indium-tin-zinc alloy, bismuth-indium-tin-lead alloy, bismuth-tin-cadmium alloy, bismuth-lead-tin alloy, bismuth-tin-lead-cadmium alloy, tin-lead alloy, tin-copper alloy, tin-zinc alloy, tin-zinc-copper alloy, and tin-silver-copper alloy.

[0051] Preferably, the liquid metal in the embodiment of the present invention is a mixture of gallium-indium eutectic alloy and silver-coated copper powder, so that the liquid metal has good electrical properties and suitable viscosity and will not move due to gravity. The mass percentage of silver-coated copper powder in the liquid metal can be 8%.

[0052] The specific direction of the liquid metal circuit 3 can be selected according to actual needs. For example, when the main purpose is to realize the circuit function, the liquid metal circuit 3 can be simplified as much as possible to save materials. When the main purpose is decoration, the liquid metal circuit 3 can be designed to present an aesthetically pleasing pattern.

[0053] In the embodiment of the present invention, the second flexible substrate 2 can have many structures, as long as it can effectively protect the liquid metal circuit 3 when the circuit substrate is not in use. When the circuit substrate is in use, the second flexible substrate 2 can maintain the original structure unchanged, or can be removed, or the structure can be changed.

[0054] In one example, the second flexible substrate 2 has a stable structure, that is, the structure of the second flexible substrate 2 does not change before and after the circuit substrate is used. During the use of the circuit substrate with this structure, it is necessary to spray the first liquid on the side close to the first flexible substrate 1 so that the first flexible substrate 1 contacts the first liquid and is in a sticky state, and then the circuit substrate is pasted to the target position.

[0055] In this example, at least one mounting opening may be provided on the second flexible substrate 2 to facilitate the subsequent mounting of other structures (such as a light emitting diode, a power source, a resistor, etc.).

[0056] In another example, the second flexible substrate 2 has a dense state and a loose state. The second flexible substrate 2 is in a dense state when dry, and is in a loose state after contacting the second liquid, allowing the first liquid to pass through the second flexible substrate 2. During the use of the circuit substrate with this structure, the circuit substrate can be placed at the target position first, and then the second liquid is sprayed on the side close to the second flexible substrate 1 to change the second flexible substrate 2 from a dense state to a loose state, and then the first liquid is passed through the second flexible substrate 2 to reach the first flexible substrate 1 (the first liquid can be included in the second liquid, or can be provided separately), so that the first flexible substrate 1 is in a sticky state, and the circuit substrate is pasted, avoiding the occurrence of inaccurate pasting positions.

[0057] Furthermore, the second flexible substrate 2 may be in various loose states after contacting the second liquid.

[0058] First, the second flexible substrate 2 includes a porous structure and a filling structure filled in the holes of the porous structure, the filling structure can be dissolved in the second liquid, and after the second flexible substrate 2 contacts the second liquid, the filling structure is dissolved to obtain a second flexible substrate 2 in a loose state; at this time, at least one installation opening can also be provided on the second flexible substrate 2 to facilitate the subsequent installation of other structures (such as light-emitting diodes, power supplies, resistors, etc.).

[0059] The second type is that the second flexible substrate 2 is a homogeneous structure, and the second flexible substrate 2 can be completely dissolved in the second liquid. After the second flexible substrate 2 contacts the second liquid, it is completely dissolved and exists in the second liquid in the form of solute, thereby presenting a loose state.

[0060] Optionally, the second flexible substrate 2 is made of a water-soluble material or an alcohol-soluble material, so that the second liquid has a wide range of choices and good biocompatibility. Exemplarily, the second flexible substrate 2 is a PVB (polyvinyl butyral) film, a PVP (polyvinyl pyrrolidone) film, a PVA (polyvinyl alcohol) film, a sodium alginate film, a gelatin film, a chitosan film, a PEO (polyethylene oxide) film or a PEG (polyethylene glycol) film, etc. Among them, sodium alginate, gelatin, and chitosan are water-soluble materials, that is, soluble in water, PVB and PEG are alcohol-soluble materials, that is, soluble in alcohol, and PVP, PVA, and PEO can be soluble in both water and alcohol.

[0061] Optionally, in an embodiment of the present invention, if Figure 3 and Figure 4 As shown, the circuit substrate also includes: at least one resistor 5 and at least one light-emitting diode 4, each resistor 5 and each light-emitting diode 4 are located between the first flexible substrate 1 and the second flexible substrate 2, and are connected to the liquid metal circuit 3, so as to further simplify the method of making a flexible thin film circuit using the circuit substrate.

[0062] In addition, the setting of the resistor 5 can also effectively prevent the current flowing through the light-emitting diode 4 from being too large during the operation of the flexible film circuit, and can prevent the light-emitting diode 4 from being overheated. The resistor 5 can be a voltage-dividing resistor or a current-limiting resistor. The specific number of light-emitting diodes 4 can be selected according to the voltage of the battery selected in the flexible film circuit and actual needs. For example, a 3V battery can carry 1 to 10 light-emitting diodes, and a 5V battery can carry up to 50 light-emitting diodes. Of course, the circuit substrate can also include other electrical components according to actual needs.

[0063] The above light emitting diode 4 can be a common light emitting diode 4 available on the market, such as a light emitting diode in 0805 package, a light emitting diode in 0603 package, a light emitting diode in 0402 package, a light emitting diode in 5050 package, etc. When the battery is 3V or 5V and the resistor 5 is a voltage divider resistor, it can be selected as a packaged chip resistor below 0805 with a resistance value of 300Ω to 500Ω.

[0064] In addition, if Figure 1 and Figure 3 As shown, the circuit substrate in the embodiment of the present invention further includes a battery pad 6 and positive and negative electrode marks ("+" and "-" in the figure), and the battery pad 6 and the positive and negative electrode marks are both located between the first flexible substrate 1 and the second flexible substrate 2, so as to facilitate pasting batteries on the circuit substrate to make a flexible thin film circuit. The battery pad 6 and the positive and negative electrode marks can be made of the same liquid metal as the liquid metal circuit 3 to simplify the method for making the circuit substrate.

[0065] In order to facilitate those skilled in the art to manufacture the above-mentioned circuit substrate, the embodiments of the present invention provide several methods for manufacturing the circuit substrate.

[0066] In one example, a liquid metal circuit 3 is printed on a dry first flexible substrate 1, i.e., a first flexible substrate 1 in a non-sticky state; after the liquid metal circuit 3 is printed, a patch operation of components such as a light-emitting diode 4 and a resistor 5 is performed on the liquid metal circuit 3; the material of the second flexible substrate 2 in a liquid state is sealed; and then the substrate is placed in a blast drying oven at 50° C. to 80° C. for air drying; and finally, after the second flexible substrate 2 is dried, a circuit substrate is obtained.

[0067] In another example, a dispensing valve is used to dispense liquid metal on a wet first flexible substrate 1, i.e., the first flexible substrate 1 in a sticky state, to obtain a liquid metal circuit 3; after the liquid metal circuit 3 is dispensed, a patch operation of components such as a light-emitting diode 4 and a resistor 5 is performed on the liquid metal circuit 3; the material of the second flexible substrate 2 in a liquid state is sealed; and then the substrate is placed in a blast drying oven at 50° C. to 80° C. for air drying; finally, after the first flexible substrate 1 and the second flexible substrate 2 are dried, a circuit substrate is obtained.

[0068] In another example, a liquid metal circuit 3 is made on a certain liquid-repellent metal substrate surface (such as a stainless steel surface) by printing or dispensing valve, and a liquid second flexible substrate 2 material is sealed on the liquid metal circuit 3; then the liquid-repellent metal substrate surface is heated to accelerate the drying speed of the liquid second flexible substrate 2 material; after the second flexible substrate 2 is dried, the second flexible substrate 2 is peeled off, and the liquid metal circuit 3 is transferred to the second flexible substrate 2; the chip mounting operation of components such as light-emitting diodes 4 and resistors 5 is performed on the liquid metal circuit 3; then the liquid metal circuit 3 on the second flexible substrate 2 is encapsulated with the liquid first flexible substrate 1 material; and the first flexible substrate 1 is dried on a heated stainless steel plate or in a blast drying oven. After the first flexible substrate 1 is dried, a circuit substrate is obtained.

[0069] In addition, an embodiment of the present invention provides a flexible film circuit, which is made of any of the circuit substrates described above, specifically, Figure 5 As shown, Figure 5 A schematic diagram of the structure of a flexible film circuit provided by an embodiment of the present invention, wherein the flexible film circuit comprises:

[0070] A first flexible substrate 1 in a sticky state;

[0071] A liquid metal circuit 3, the liquid metal circuit 3 is located on the first flexible substrate 1;

[0072] A battery 7, which is attached to the first flexible substrate 1 and connected to the liquid metal circuit 3;

[0073] at least one resistor 5, each resistor 5 is located on the first flexible substrate 1 and connected to the liquid metal circuit 3;

[0074] At least one light emitting diode 4 , each light emitting diode 4 is located on the first flexible substrate 1 and connected to the liquid metal circuit 3 .

[0075] It should be noted that the above-mentioned resistors 5 and light-emitting diodes 4 can be integrated into the circuit substrate, or can be obtained by pasting the circuit substrate to the target position and then pasting the resistors 5 and the light-emitting diodes 4 to the corresponding positions while the first flexible substrate 1 is still in a sticky state.

[0076] If the second flexible substrate in the selected circuit substrate is completely soluble in the second liquid, the flexible film circuit made from the circuit substrate does not include the second flexible substrate; if the second flexible substrate in the selected circuit substrate is partially soluble in the second liquid, the flexible film circuit made from the circuit substrate also includes the second flexible substrate in a loose state; if the second flexible substrate in the selected circuit substrate has a stable structure, the flexible film circuit made from the circuit substrate also includes the second flexible substrate.

[0077] In addition, the embodiment of the present invention also provides a method for manufacturing a flexible thin film circuit, which is used to manufacture the flexible thin film circuit described above. Specifically, Figure 6 As shown, Figure 6 A flowchart of a method for manufacturing a flexible thin film circuit provided by an embodiment of the present invention, the method for manufacturing a flexible thin film circuit includes:

[0078] Step S1, providing a circuit substrate;

[0079] The circuit substrate described here can be any circuit substrate described above, and its specific structure will not be described in detail here.

[0080] Step S2, making the first flexible substrate in the circuit substrate contact with the first liquid to be in a viscous state;

[0081] Optionally, step S2 includes:

[0082] Spraying a second liquid onto the second flexible substrate in the circuit substrate, wherein the second liquid is the same as the first liquid or includes the first liquid, so that the second flexible substrate is in a loose state;

[0083] The second liquid passes through the second flexible substrate in a loose state and reaches the first flexible substrate 1, making the first flexible substrate 1 in a viscous state.

[0084] Step S3: Paste a battery on the first flexible substrate in a sticky state, and connect the battery to the liquid metal circuit.

[0085] When the first flexible substrate in the circuit substrate includes an insulating body and starch powder and / or beeswax powder dispersed in the insulating body, and the second flexible substrate is sodium alginate, gelatin, chitosan, PVP, PVA or PEO, the first liquid and the second liquid can both be water; when the first flexible substrate in the circuit substrate includes an insulating body and starch powder and / or beeswax powder dispersed in the insulating body, and the second flexible substrate is PVB, PEG, PVP, PVA or PEO, the second liquid can be an ethanol solution (such as medical alcohol), the first liquid is water, and the first liquid can be water provided separately or contained in the second liquid.

[0086] The method for making the flexible film circuit described above can also be understood as the method for using the circuit substrate described above. The user can use the circuit substrate described above to make the required flexible film circuit at any desired location (such as on human skin). When the obtained flexible film circuit is located on human skin, the flexible film circuit can play the role of decoration, physiological parameter monitoring, etc.

[0087] In one example, the circuit substrate includes a first flexible substrate, a second flexible substrate, a liquid metal circuit, at least one resistor, at least one light-emitting diode and a battery pad, the first flexible substrate includes an insulating body and starch powder and / or beeswax powder dispersed in the insulating body, the second flexible substrate is sodium alginate, gelatin, chitosan, PVP, PVA or PEO, and when the circuit substrate described above is used to make a flexible film circuit on human skin, the specific manufacturing process of the flexible film circuit includes:

[0088] placing the first flexible substrate of the circuit substrate facing downward on the skin;

[0089] spraying water on the second flexible substrate;

[0090] The second flexible substrate is dissolved and eliminated, and the first flexible substrate is in a sticky state after being wetted with water, and adheres to the skin, thereby playing the role of fixing the liquid metal circuit on the skin;

[0091] When the first flexible substrate is not completely dehydrated and is still in a sticky state, a battery is attached to the battery pad, and each light emitting diode starts to emit light.

[0092] In another example, the circuit substrate includes a first flexible substrate, a second flexible substrate, a liquid metal circuit, at least one resistor, at least one light-emitting diode and a battery pad, the first flexible substrate includes an insulating body and starch powder and / or beeswax powder dispersed in the insulating body, the second flexible substrate is PVB, PEG, PVP, PVA or PEO, and when the circuit substrate described above is used to make a flexible thin film circuit on human skin, the specific manufacturing process of the flexible thin film circuit includes:

[0093] placing the first flexible substrate of the circuit substrate facing downward on the skin;

[0094] Spraying the second flexible substrate with medical alcohol, i.e., alcohol with a concentration of 35% to 75%;

[0095] The second flexible substrate is dissolved and eliminated, and the first flexible substrate is in a sticky state after being dipped in water in the medical alcohol, and adheres to the skin, thereby playing the role of fixing the liquid metal circuit on the skin;

[0096] When the first flexible substrate is not completely dehydrated and is still in a sticky state, a battery is attached to the battery pad, and each light emitting diode starts to emit light.

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A circuit substrate, characterized in that: include: a first flexible substrate; a second flexible substrate; A liquid metal circuit, wherein the liquid metal circuit is located between the first flexible substrate and the second flexible substrate; Wherein, the first flexible substrate has a non-sticky state and a sticky state, the first flexible substrate is in a non-sticky state when dry, and is in a sticky state after contacting the first liquid; The second flexible substrate has a dense state and a loose state. The second flexible substrate is in a dense state when dry, and is in a loose state after contacting the second liquid, allowing the first liquid to pass through the second flexible substrate to reach the first flexible substrate.

2. The circuit substrate according to claim 1, characterized in that: The first flexible substrate includes an insulating body and starch powder and / or beeswax powder dispersed in the insulating body.

3. The circuit substrate according to claim 1, characterized in that: The second flexible substrate has a homogeneous structure, and the second flexible substrate can be completely dissolved in the second liquid.

4. The circuit substrate according to claim 3, characterized in that: The second flexible substrate is a PVB film, a PVP film, a PVA film, a sodium alginate film, a gelatin film, a chitosan film, a PEO film or a PEG film.

5. The circuit substrate according to claim 1, characterized in that: The second flexible substrate includes a porous structure and a filling structure filled in the holes of the porous structure, and the filling structure can be dissolved in the second liquid.

6. The circuit substrate according to claim 1, characterized in that: Also includes: At least one resistor and at least one light emitting diode, wherein the at least one resistor and the at least one light emitting diode are both located between the first flexible substrate and the second flexible substrate, and are both connected to the liquid metal circuit.

7. A flexible film circuit, made of the circuit substrate according to any one of claims 1 to 6, characterized in that: The flexible film circuit comprises: a first flexible substrate in a sticky state; A liquid metal circuit, wherein the liquid metal circuit is located on the first flexible substrate; A battery, the battery being adhered to the first flexible substrate and connected to the liquid metal circuit; at least one resistor, the at least one resistor being located on the first flexible substrate and connected to the liquid metal circuit; At least one light emitting diode is located on the first flexible substrate and connected to the liquid metal circuit.

8. A method for manufacturing a flexible thin film circuit, used for manufacturing the flexible thin film circuit as claimed in claim 7, characterized in that: The method for manufacturing the flexible film circuit comprises: Step S1, providing a circuit substrate as described in any one of claims 1 to 6; Step S2, making the first flexible substrate in the circuit substrate contact with a first liquid to be in a viscous state; Step S3: Pasting a battery on the first flexible substrate in a sticky state, wherein the battery is connected to the liquid metal circuit.

9. The method for manufacturing a flexible thin film circuit according to claim 8, characterized in that: The step S2 comprises: Spraying a second liquid onto the second flexible substrate in the circuit substrate, wherein the second liquid is the same as the first liquid or includes the first liquid, so that the second flexible substrate is in a loose state; The second liquid passes through the second flexible substrate in a loose state and reaches the first flexible substrate, so that the first flexible substrate is in a sticky state.

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