A crystal bar angle fixing and bonding machine and an angle fixing and bonding method thereof

Abstract

The application provides a crystal bar angle fixing and bonding machine and an angle fixing and bonding method thereof, and belongs to the technical field of semiconductor equipment. The crystal bar angle fixing and bonding machine solves the problem of low angle fixing and bonding precision of the existing crystal bar and the material plate. The crystal bar angle fixing and bonding machine comprises a workbench, an X-ray light path emitting and receiving mechanism and a scanning rack, the scanning rack is provided with a correction reference vertical plate, the correction reference vertical plate is provided with a flexible suction cup, and the scanning rack is provided with a pressing block. The method comprises the following steps: A, fixing the material plate on the scanning rack and placing the crystal bar on the material plate; B, the flexible suction cup adsorbs the crystal bar to the correction reference vertical plate, the pressing block presses the crystal bar, the scanning rack is rotated, the signal received by the X-ray light path emitting and receiving mechanism is processed, the compensation angle is obtained by comparing with the preset value, the pressing block is moved upward, the correction reference vertical plate is rotated and drives the crystal bar to rotate the compensation angle on the upper surface of the material plate to complete the angle fixing; and the crystal bar and the material plate are bonded by using glue.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor equipment and relates to a crystal bar angle fixing and bonding machine and an angle fixing and bonding method thereof. BACKGROUND

[0002] A crystal oscillator is a necessary component of a digital circuit and provides a clock reference for the digital circuit. A quartz wafer inside the crystal oscillator is made by cutting a crystal bar. Before cutting the crystal bar, an important angle fixing and bonding process is performed. Specifically, the angle between the outer processing surface of the crystal bar and the directional atomic surface is measured by X-ray diffraction, and then the crystal bar is bonded to a material plate in a correct angle posture. The purpose of the angle fixing and bonding process is to make the included angle (referred to as a wafer angle) between the cutting surface of the cut wafer and the directional atomic surface within a specified angle range. Different wafer angles are required for wafers of different frequencies, and the error of the angle determines the temperature-frequency characteristic of the crystal oscillator.

[0003] In the prior art, a crystal bar angle fixing and bonding machine disclosed in Comparative Document 201620999397.4 is provided with a material bonding platform, an X-ray emitter and an X-ray receiver on a workbench, a motor mounting seat is arranged above the material bonding platform, the motor mounting seat can move up and down by being driven by a servo motor, a rotary motor is arranged on the motor mounting seat, and a clamp is connected to the rotary motor. The specific working process is as follows: a material plate is clamped and fixed on the material bonding platform, a crystal bar is placed under the clamp and clamped by the clamp, the X-ray emitter and the X-ray receiver start to work and send the detected information to a control center, the control center controls the rotary motor to drive the clamp to rotate and correct the angle of the crystal bar relative to the material plate until the X-ray receiver receives a diffraction signal to complete angle fixing, the servo motor drives the entire motor mounting seat to move downward together with the rotary motor and the clamp until the crystal bar contacts the material plate, and material bonding is completed.

[0004] The prior art has the following defects: the machine determines the final bonding position from the angle, which is an open-loop system, and the crystal bar is clamped in the air by the clamp during the angle fixing process. After the crystal bar is clamped by the clamp, the upper side of the crystal bar is attached to the clamp, that is, the upper side of the crystal bar is in abutment with the reference surface on the clamp. However, it is difficult to ensure that the upper side and the lower side of the crystal bar are absolutely parallel, and the crystal bar is bonded with the upper surface of the material plate as the reference surface. Therefore, after the clamp drives the crystal bar to descend, it is difficult for the lower side of the crystal bar to remain attached to the upper surface of the material plate. After the clamp releases the crystal bar, manual pressure is required to hold the crystal bar, so that the crystal bar and the material plate are bonded together by glue, and finally the glue is cured for a certain period of time. This will cause the angle between the final crystal bar and the material plate to deviate from the angle when the angle fixing is completed. At the same time, due to the limitation of the precision of the device itself, the position of the crystal bar may also shift during the descending process after the angle fixing is completed. The angle precision between the crystal bar and the material plate needs to reach the angle second level, and the precision requirement is very high, which will seriously affect the precision of the subsequent cutting process. In summary, since the angle fixing and bonding machine is an open-loop system, errors caused by various factors during the process cannot guarantee the attitude angle precision between the crystal bar and the material plate, which affects the accuracy of the cut crystal wafer.

[0005] In order to improve the precision of angle fixing and bonding, the conventional method is to improve the equipment precision of the driving device that drives the clamp to move up and down. This requires a large amount of research and development cost, and since the entire driving device is composed of a servo motor and a screw nut mechanism, it is almost impossible to make the entire device very precise due to the limitations of the prior art. SUMMARY

[0006] The purpose of the present application is to solve the problem of low precision of angle fixing and bonding of the crystal bar and the material plate by providing a crystal bar angle fixing and bonding machine and an angle fixing and bonding method.

[0007] The purpose of the present application can be achieved by the following technical scheme: a crystal bar angle fixing and bonding machine, comprising a workbench, an X-ray light path emitting and receiving mechanism, and a scanning rack for placing and positioning the material plate horizontally, the scanning rack is arranged on the workbench, characterized in that the scanning rack can rotate relative to the workbench, a correction reference vertical plate is arranged on the scanning rack and can rotate relative to the scanning rack, a flexible suction cup is arranged on the correction reference vertical plate and can adsorb the crystal bar placed on the material plate and make the crystal bar abut on the vertical reference surface of the correction reference vertical plate, and a pressing block is arranged on the scanning rack and can press the crystal bar tightly on the material plate.

[0008] The X-ray light path emitting and receiving mechanism of the crystal bar fixed angle bonding machine includes an X-ray box, a monochromator and a counter tube, which are existing structures. The crystal bar fixed angle bonding machine is pre-provided with a preset value indicating the standard angle between the material plate and the crystal bar. The scanning frame is provided with a clamp. The material plate is clamped and fixed on the clamp. The crystal bar is placed on the material plate and close to the correction reference vertical plate. The flexible suction cup can absorb the crystal bar in the horizontal direction and make the side of the crystal bar close to the vertical reference surface of the correction reference vertical plate. The pressing block is pressed to press the crystal bar tightly so that the bottom surface of the crystal bar abuts against the upper surface of the material plate and takes this surface as the final reference. The X-ray tube in the X-ray box generates X-rays, which undergoes first-order diffraction through the monochromatic sheet in the monochromator. The scanning frame rotates to drive the crystal bar and the material plate to rotate together until the X-rays generate second-order diffraction in the crystal bar. The counter tube receives the second-order diffraction signal and processes it. By comparing the current rotation angle displacement of the material plate and the crystal bar with the preset value, the compensation angle is obtained. During the entire scanning process, the scanning frame rotates together with the crystal bar and the material plate. The crystal bar is always close to the upper surface of the material plate and there is no relative displacement between them. After the compensation angle is obtained, the pressing block moves up, the correction reference vertical plate rotates relative to the scanning frame, and the crystal bar rotates together with the pressing block to rotate the above-mentioned compensation angle to realize correction and fixed angle. As described above, during the scanning and fixed angle processes, the upper surface of the material plate is taken as the reference surface, which will not deviate, ensuring that the angle after bonding is the target angle, and improving the accuracy of fixed angle and bonding.

[0009] Due to the existence of machining and assembly errors, the vertical reference surface of the correction reference vertical plate close to the crystal bar and the upper surface of the material plate are not absolutely vertical from the micro level, which makes the crystal bar only close to the vertical reference surface during the absorption and positioning process, and a small angle is generated relative to the upper surface of the material plate. The correction can be realized by pressing the pressing block, so that the bottom surface of the crystal bar is tightly attached to the upper surface of the material plate. During this process, the suction cup will deform slightly or there will be a small gap between the suction cup and the side of the crystal bar. After the bottom surface of the crystal bar is tightly attached to the upper surface of the material plate, the flexible suction cup releases the crystal bar, the slight deformation of the flexible suction cup recovers, the flexible suction cup reabsorbs the side of the crystal bar in a natural state, and the pressing block moves up and presses again. Repeat this process one or several times to ensure that the flexible suction cup can absorb the crystal bar in a natural state and reduce or eliminate the small gap between the flexible suction cup and the crystal bar. At the same time, the bottom surface of the crystal bar abuts against the upper surface of the material plate and takes this surface as the final reference, so that the subsequent scanning is also based on this reference to ensure that the angle after bonding is the target angle and is not affected by other factors, thereby improving the final bonding accuracy.

[0010] Meanwhile, the crystal bar angle fixing and bonding machine can rotate the scanning rack again after the angle correction to perform scanning verification, and determine whether the crystal bar is fixed to the right position according to the verification structure. If the crystal bar is not fixed to the right position, the above steps are repeated, and if the crystal bar is fixed to the right position, the crystal bar is bonded to the material plate. Therefore, the crystal bar angle fixing and bonding machine can form a closed-loop correction and fixing process through scanning, correction, verification and fixing, thereby further improving the fixing and bonding accuracy. As a preferred embodiment, the pressing block is driven by a vertical cylinder.

[0011] In the above crystal bar angle fixing and bonding machine, the flexible suction cup is fixed on the correction reference vertical plate and is an organ-shaped suction cup capable of stretching and contracting in a direction perpendicular to the plate surface of the correction reference vertical plate. After the organ-shaped suction cup sucks the crystal bar, the organ-shaped suction cup is retracted backward by inertia, which is equivalent to a backward pulling action of the organ-shaped suction cup on the crystal bar, so that the crystal bar can be in close contact with the vertical reference surface of the correction reference vertical plate, and the pressing block is pressed downward, so that the bottom surface of the crystal bar is in close contact with the upper surface of the material plate. The organ-shaped suction cup releases the crystal bar after the air is cut off, and the organ-shaped suction cup is re-adsorbed to the side surface of the crystal bar in a natural state. The pressing block is moved upward and then pressed downward again. This process is repeated one or several times, so that the organ-shaped suction cup can finally adsorb the crystal bar in a natural state, and the bottom surface of the crystal bar is in close contact with the upper surface of the material plate and serves as the final reference surface. The subsequent scanning and correction are performed based on the final reference surface, so that the angle after the bonding is the target angle and is not affected by other factors, thereby improving the final bonding accuracy.

[0012] In the above crystal bar angle fixing and bonding machine, the correction reference vertical plate is connected with a positioning frame capable of sliding in a direction perpendicular to the plate surface of the correction reference vertical plate, and the flexible suction cup is connected to the positioning frame. When the flexible suction cup adsorbs the crystal bar, the positioning frame can be retracted to make the crystal bar in close contact with the vertical reference surface of the correction reference vertical plate. After the flexible suction cup sucks the crystal bar, the positioning frame slides to have a backward pulling action on the crystal bar, so that the crystal bar can be in close contact with the vertical reference surface of the correction reference vertical plate, and the pressing block is pressed downward, so that the bottom surface of the crystal bar is in close contact with the upper surface of the material plate. The flexible suction cup releases the crystal bar after the air is cut off, and the positioning frame is extended after being retracted. The flexible suction cup is re-adsorbed to the side surface of the crystal bar in a natural state. The pressing block is moved upward and then pressed downward again. This process is repeated one or several times, so that the flexible suction cup can finally adsorb the crystal bar in a natural state, and the bottom surface of the crystal bar is in close contact with the upper surface of the material plate and serves as the final reference surface. The subsequent scanning and correction are performed based on the final reference surface, so that the angle after the bonding is the target angle and is not affected by other factors, thereby improving the final bonding accuracy.

[0013] The object of the present application can also be achieved by the following technical solution: a crystal bar angle fixing and bonding method, characterized by comprising the following steps:

[0014] A, loading: the material plate is horizontally clamped and fixed on the scanning rack of the crystal bar angle bonding machine, and then the crystal bar is placed on the material plate;

[0015] B, correction and angle setting:

[0016] b1, the flexible suction cup on the crystal bar angle bonding machine adsorbs the crystal bar placed on the material plate and makes it adhere to the vertical reference surface of the correction reference vertical plate, and the pressing block on the crystal bar angle bonding machine is pressed to press the crystal bar tightly on the material plate,

[0017] b2, rotate the scanning rack to drive the material plate and the crystal bar to rotate together, process the signals received by the X-ray light path emitting and receiving mechanism, and compare them with the preset value to obtain the compensation angle,

[0018] b3, the pressing block moves up, the correction reference vertical plate rotates and drives the crystal bar to rotate the above-mentioned compensation angle against the upper surface of the material plate to complete the angle setting;

[0019] C, bonding: bond the crystal bar and the material plate with glue.

[0020] The X-ray light path emitting and receiving mechanism includes an X-ray box, a monochromator and a counter tube, which is a prior structure. The crystal bar angle bonding machine is pre-set with a preset standard position representing the standard angle between the material plate and the crystal bar. In this method, after the material plate is clamped and fixed on the clamp of the scanning rack, the crystal bar is placed on the material plate. The flexible suction cup can adsorb the crystal bar in the horizontal direction and make the side of the crystal bar adhere to the vertical reference surface of the correction reference vertical plate. The pressing block is pressed to press the crystal bar tightly so that the bottom surface of the crystal bar adheres to the upper surface of the material plate and takes this surface as the final reference, and the subsequent scanning is also based on this reference. The X-ray tube in the X-ray box generates X-rays, which undergoes first-order diffraction through the monochromatic sheet in the monochromator. The scanning rack rotates to drive the crystal bar and the material plate to rotate together until the X-rays produce second-order diffraction in the crystal bar. After the counter tube receives the second-order diffraction signal, it is processed. By comparing the current rotation angle displacement of the material plate and the crystal bar with the preset value, the compensation angle is obtained. After the compensation angle is obtained, the pressing block moves up, the correction reference vertical plate rotates relative to the scanning rack, and the crystal bar rotates the above-mentioned compensation angle against the upper surface of the material plate to realize correction and angle setting. In this method, the scanning and correction processes are separated. During the entire scanning process, the entire scanning rack rotates together with the crystal bar and the material plate. The bottom surface of the crystal bar adheres to the upper surface of the material plate without relative displacement between them; during the entire correction and angle setting process, the crystal bar rotates to complete the angle setting against the upper surface of the material plate, and the crystal bar and the material plate do not have relative displacement between them. In summary, during the scanning and angle setting processes, the bottom surface of the crystal bar and the upper surface of the material plate do not have relative displacement, the angle setting does not deviate, and the accuracy of the angle setting and bonding is improved.

[0021] As preferred, in the step A of the above method, after the crystal rod is placed on the material plate, the side of the crystal rod is attached to the flexible suction cup on the correction reference vertical plate. The side of the crystal rod is attached to the flexible suction cup, so that the flexible suction cup can adsorb the crystal rod to the vertical reference surface of the correction vertical plate.

[0022] As preferred, in the step B of the above method, the specific operation steps of b1 are as follows: the flexible suction cup on the correction reference vertical plate generates a vacuum suction force to adsorb the crystal rod, and pulls the crystal rod in the horizontal direction to attach the crystal rod to the vertical reference surface of the correction reference vertical plate; at the same time, the displacement sensor on the correction reference vertical plate detects whether the crystal rod is adsorbed in place, and after detecting that the crystal rod is adsorbed in place, the pressing block on the scanning rack is lowered to press the crystal rod tightly on the upper surface of the material plate; the flexible suction cup is broken to generate a vacuum suction force to adsorb the crystal rod again, and then the pressing block is raised; the flexible suction cup continuously maintains the vacuum adsorption state, and the pressing block is lowered again to press the crystal rod tightly on the material plate.

[0023] Due to the existence of machining and assembly errors, the vertical reference surface of the correction reference vertical plate to which the crystal rod is attached and the upper surface of the material plate are not absolutely vertical from the micro level, which makes the crystal rod only attach to the vertical reference surface during the adsorption and positioning process, and a small angle is generated relative to the upper surface of the material plate. The correction can be realized by the pressing block, so that the bottom surface of the crystal rod is tightly attached to the upper surface of the material plate. During this process, the suction cup will deform slightly or there will be a slight gap between the suction cup and the side of the crystal rod. After the bottom surface of the crystal rod is tightly attached to the upper surface of the material plate, the flexible suction cup is broken to release the crystal rod, the slight deformation of the flexible suction cup is restored, the flexible suction cup adsorbs the side of the crystal rod again in a natural state, and the pressing block is raised and then lowered again. This process is repeated one or several times, so that the flexible suction cup can adsorb the crystal rod in a natural state and reduce or eliminate the slight gap between the flexible suction cup and the crystal rod. At the same time, the bottom surface of the crystal rod is attached to the upper surface of the material plate and serves as the final reference, so that the subsequent scanning is also based on this reference, so as to ensure that the angle after the bonding is completed is the target angle and is not affected by other factors, thereby improving the accuracy of the final bonding.

[0024] In the above method, in the step B, the steps b1-b3 are repeated multiple times until the angle of the crystal rod relative to the material plate reaches the set allowable deviation range. Since the angle accuracy between the crystal rod and the material plate needs to reach the angle second level, the accuracy requirement is very high. Therefore, according to the actual angle setting, the steps b1-b3 can be repeated multiple times to form a multiple cycle closed loop angle setting mode, which can further ensure that the angle of the crystal rod relative to the material plate after the angle setting remains within the allowable deviation range, thereby further improving the angle setting and bonding accuracy.

[0025] As preferred, in the step C of the above method, the position of the crystal rod after the step B is verified, the verification process is as follows: the block is pressed again, the scanning frame is rotated for scanning verification, the signal received by the X-ray light path emitting and receiving mechanism is processed and compared with the preset value, if the deviation is beyond the allowed range, the step B is repeated, if the deviation is within the allowed range, the crystal rod is bonded with the plate by glue.

[0026] In the method, after the scanning and angle fixing of the crystal rod in the step B, the scanning frame is rotated again for scanning verification, and the structure is further verified to determine whether the crystal rod is fixed to the right position, if not, the step B is repeated, if yes, the crystal rod is bonded with the plate. The method forms a closed loop correction and angle fixing process through scanning, correction, verification and angle fixing, and further improves the accuracy of angle fixing and bonding.

[0027] In the above method, in the step C, after the bonding, if there is another crystal rod to be bonded on the plate according to the setting and requirement, the next crystal rod is placed on the plate, and the steps A-C are repeated until all the crystal rods are bonded on the plate, then the plate is removed from the clamp, and the glue is evenly applied on the edge of the contact surface between the crystal rod and the plate to make the glue penetrate into the contact surface, and the bonding is completed. Through the above design, multiple crystal rods can be bonded on one plate according to the setting and requirement, the plate is not repeatedly disassembled, and the work efficiency is improved.

[0028] Compared with the prior art, the crystal rod angle fixing and bonding machine and the angle fixing and bonding method have the following advantages:

[0029] 1. The closed loop correction and angle fixing process is formed through multiple scanning, correction and verification, which can ensure accurate angle fixing of the crystal rod and improve the accuracy of angle fixing and bonding.

[0030] 2. In the whole scanning process, the scanning frame rotates together with the crystal rod and the plate, the crystal rod is always attached to the upper surface of the plate, and the crystal rod rotates and fixes the angle along the upper surface of the plate in the whole correction and angle fixing process, that is, the upper surface of the plate is the reference surface in the scanning and angle fixing process, and no deviation occurs, the angle after bonding is the target angle, and the accuracy of angle fixing and bonding is improved.

[0031] 3、The process of flexible suction cup adsorption, briquetting, flexible suction cup release, and then adsorption, briquetting release, and then downward pressure can be repeated one or several times as needed to ensure that the final flexible suction cup can adsorb the crystal bar in a natural state and reduce or eliminate the gap between the flexible suction cup and the crystal bar, while the bottom surface of the crystal bar is attached to the upper surface of the material plate and serves as the final reference, so that subsequent scanning is also based on this reference to ensure that the angle of the completed bonding is the target angle and is not affected by other factors, thereby improving the accuracy of the final bonding. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 is a schematic diagram of the three-dimensional structure of the crystal bar angle bonding machine in Example One.

[0033] Figure 2 is a schematic diagram of the three-dimensional structure of the crystal bar angle bonding machine in Example One after removing the workbench.

[0034] Figure 3 is a schematic diagram of the three-dimensional structure of the first perspective view of the correction reference vertical plate in Example One.

[0035] Figure 4 is a structural elevation view of the correction reference vertical plate in Example One.

[0036] Figure 5 is a schematic diagram of the three-dimensional structure of the second perspective view of the correction reference vertical plate in Example One.

[0037] Figure 6 is a schematic diagram of the three-dimensional structure of the third perspective view of the correction reference vertical plate in Example One. Figure 4

[0038] Figure 7 is a structural cross-sectional view of C-C in Example One. Figure 4

[0039] Figure 8 is a schematic diagram of the three-dimensional structure of the third perspective view of the correction reference vertical plate in Example One.

[0040] Figure 9 is a structural cross-sectional view of C-C in Example One. Figure 4

[0041] Figure 10 is a schematic diagram of the three-dimensional structure of the third perspective view of the correction reference vertical plate in Example One.

[0042] Figure 11 is a schematic diagram of the three-dimensional structure of the third perspective view of the correction reference vertical plate in Example One.

[0043] ​​​In the diagram, 1. Scanning direct drive motor; 2. Scanning frame; 2a. Turntable; 2b. Side plate; 2c. Top plate; 3. Correction direct drive motor; 3a. Turntable; 4. Moving frame; 4a. Fixture; 4a1. Fixed clamping plate; 4a2. Moving clamping plate; 5. Correction reference plate; 5a. Reference protrusion; 5b. Clearance notch; 5c. Avoidance notch; 5d. Notch; 5e. Displacement sensor; 6. Positioning frame; 6a. Moving plate; 6a1. Mounting hole; 6a2. Guide sleeve; 6b. Buffer plate; 6b1. Guide post; 6b2. Buffer Spring; 6b3, Limiting plate; 6c, Positioning block; 6c1, Air duct; 6d, Connecting block; 6e, Connecting plate; 6e1, Rear limiting block; 6e2, Front limiting post; 6f, Horizontal cylinder; 6f1, Front limiting block; 7, Flexible suction cup; 7a, Suction hole; 8, Guide seat; 8a, Mounting part; 8a1, Rear limiting post; 9, Vertical cylinder; 9a, Lifting plate; 9b, Pressure block; 9c, Pressure plate; 10, Material plate; 11, Worktable; 12, X-ray box; 13, Monochromator; 14, Counting tube; 15, Touch screen. Detailed Implementation

[0044] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0045] Example 1

[0046] like Figure 1 As shown, this crystal rod angle-fixing bonding machine includes a worktable 11, a touch screen 15, an X-ray beam emission and receiving mechanism, a correction reference plate 5, and a scanning frame 2 for horizontally placing and positioning the material plate 10. The touch screen 15 is mounted on the worktable 11 and has preset values ​​indicating the standard angle between the material plate 10 and the crystal rod, as well as the allowable deviation range after angle fixing. The X-ray beam emission and receiving mechanism includes an X-ray box 12, a monochromator 13, and a counting tube 14, all of which are mounted on the worktable 11. A scanning direct drive motor 1 is fixed on the worktable 11. The scanning frame 2 is located above the worktable 11 and connected to the rotating shaft of the scanning direct drive motor 1. The scanning direct drive motor 1 can drive the scanning frame 2 to rotate relative to the worktable 11.

[0047] like Figures 1-4As shown, the scanning rack 2 includes a rotating disc 2a, two side plates 2b and a top plate 2c, the rotating disc 2a is horizontally arranged and connected with the rotating shaft of the scanning direct drive motor 1, the two side plates 2b are long strip-shaped and vertically fixed at the two side edges of the rotating disc 2a, and the top plate 2c is fixed at the top of the two side plates 2b, so that the scanning rack 2 as a whole is in the shape of a rectangular frame, and the scanning direct drive motor 1 can be controlled to run through the touch screen 15. The scanning rack 2 is provided with a clamp 4a, the clamp 4a includes a moving frame 4 which is slidingly connected to the rotating disc 2a in the horizontal direction, specifically connected through the cooperation structure of guide rail and sliding block, the moving frame 4 can be driven to adjust the position through a linear motion module such as a screw nut assembly, one side of the moving frame 4 is fixed with a fixed clamp plate 4a1, and the other side is connected with a movable clamp plate 4a2 through bolts, and the movable clamp plate 4a2 and the fixed clamp plate 4a1 can be clamped to horizontally place the material plate 10 on the moving frame 4 through bolt adjustment. The inverted correction direct drive motor 3 is fixed on the top plate 2c, the correction direct drive motor 3 can be controlled to run through the touch screen 15, a rotating table 3a is connected to the output end of the correction direct drive motor 3, the rotating table 3a is fixed with a mounting seat, and a correction reference vertical plate 5 is vertically arranged and fixed on the mounting seat, so that the material plate 10 can pass below the correction reference vertical plate 5 when the moving frame 4 moves, and the correction reference vertical plate 5 can be in a split type, such as being formed by splicing the front plate body and the rear plate body to be attached, so as to facilitate processing and installation of other parts. A positioning frame 6 is slidingly connected to the correction reference vertical plate 5 in the horizontal direction, the moving direction of the positioning frame 6 is perpendicular to the plate surface of the correction reference vertical plate 5, a plurality of flexible suction cups 7 are connected to the front end of the positioning frame 6, the plurality of flexible suction cups 7 can protrude from the front plate surface of the correction reference vertical plate 5 to adsorb the crystal bar, when the flexible suction cups 7 adsorb the crystal bar, the positioning frame 6 can retract and make the crystal bar press against the vertical reference surface of the correction reference vertical plate 5, and a pressing block 9b is slidingly connected to the correction reference vertical plate 5 in the vertical direction, when the flexible suction cups 7 are adsorbed on the crystal bar and the crystal bar presses against the correction reference vertical plate 5, the pressing block 9b can be lowered and press the crystal bar tightly on the material plate 10.

[0048] Specifically, as Figure 5 and 6As shown, the positioning frame 6 comprises a moving plate 6a, a buffer plate 6b and two positioning blocks 6c, a horizontal cylinder 6f is horizontally fixed on the rear side of the correction reference vertical plate 5, the horizontal cylinder 6f can be controlled to operate through the touch screen 15, the piston rod of the horizontal cylinder 6f is arranged towards the rear, the moving plate 6a and the buffer plate 6b are both in the shape of a strip plate, and both are arranged horizontally and parallel to the direction of the correction reference vertical plate 5, the moving plate 6a is located at the rear side of the correction reference vertical plate 5, a connecting block 6d is fixed on the rear side of the moving plate 6a, a connecting plate 6e is fixed on the connecting block 6d, the connecting plate 6e is in the shape of an L-shaped strip, one end of the connecting plate 6e is fixed towards the front and with the side of the connecting block 6d, the other end extends to the rear side of the horizontal cylinder 6f and is fixed with the piston rod of the horizontal cylinder 6f, the buffer plate 6b is located at the front side of the moving plate 6a, guide columns 6b1 are vertically fixed on the rear side of both ends of the buffer plate 6b, mounting holes 6a1 are formed on both sides of the moving plate 6a, guide sleeves 6a2 are screwed and fixed in the mounting holes 6a1, the axial direction of the guide sleeves 6a2 is arranged along the front-rear direction, the two guide columns 6b1 of the buffer plate 6b are respectively slidingly inserted into the two guide sleeves 6a2 of the moving plate 6a, the rear ends of the two guide columns 6b1 are both fixed with disc-shaped limiting sheets 6b3, and buffer springs 6b2 are further sleeved on the guide columns 6b1, the rear end of the buffer spring 6b2 extends into the mounting hole 6a1 and abuts against the front end of the guide sleeve 6a2, the front end of the buffer spring 6b2 abuts against the rear side of the buffer plate 6b, and under the action of the buffer spring 6b2, the limiting sheet 6b3 abuts against the rear end face of the guide sleeve 6a2, so that a gap is formed between the buffer plate 6b and the moving plate 6a. The two positioning blocks 6c are respectively fixed on the front side of both ends of the buffer plate 6b, rectangular avoiding notches 5c are formed on both ends of the lower edge of the correction reference vertical plate 5, the two positioning blocks 6c respectively pass through the two avoiding notches 5c, the flexible suction cups 7 are divided into two groups, the two groups of flexible suction cups 7 are respectively fixed on the front side of the two positioning blocks 6c, the lower part of the front plate of the correction reference vertical plate 5 has two groups of reference protrusions 5a protruding forward, the two groups of reference protrusions 5a are respectively close to the two positioning blocks 6c, the reference protrusions 5a are in the shape of a column, the front end face is a reference face, and the reference faces of the two groups of reference protrusions 5a are coplanar and vertically arranged to form the vertical reference face of the correction reference vertical plate 5. Figure 6 As shown, the flexible suction cup 7 is in the shape of a trumpet and is made of rubber material, a gas guide hole 6c1 is formed in the positioning block 6c and is connected with the air pump, and a gas suction hole 7a is formed in the central position of the flexible suction cup 7 and is connected with the gas guide hole 6c1.

[0049] As Figure 8As shown, a guide seat 8 is also fixed on the rear side of the correction reference plate 5. The guide seat 8 is strip-shaped and arranged horizontally and rearward. The guide seat 8 is located below the horizontal cylinder 6f. The lower edge of the connecting plate 6e abuts against the upper side of the guide seat 8. The rear end of the guide seat 8 has an upwardly protruding mounting part 8a. The connecting plate 6e is located between the horizontal cylinder 6f and the mounting part 8a. A rear limiting block 6e1 is fixed on the connecting plate 6e. A rear limiting post 8a1 is screwed onto the mounting part 8a. The rear limiting post 8a1 is arranged forward and is opposite to the rear side of the rear limiting block 6e1. When the positioning frame 6 retracts backward and the crystal rod abuts against the reference protrusion 5a, the rear limiting block 6e1 can abut against the rear limiting post 8a1 to form a limit. A front limiting block 6f1 is fixed to the side of the horizontal cylinder 6f, and a front limiting post 6e2 is screwed onto the rear limiting block 6e1. The front limiting post 6e2 is set forward and is opposite to the rear side of the front limiting block 6f1. When the positioning frame 6 extends forward a set distance, the front limiting post 6e2 can abut against the front limiting block 6f1 to form a limit.

[0050] like Figure 9 As shown, the scanning frame 2 is provided with a pressure block 9b, which can press the crystal rod onto the material plate 10. The definition here is that it can be a direct connection or an indirect connection. In this embodiment, it is an indirect connection. Specifically, a vertical cylinder 9 is fixed on the mounting base and is located on the rear side of the correction reference plate 5. The vertical cylinder 9 can be controlled by the touch screen 15. A clearance notch 5b is opened in the middle of the correction reference plate 5. A lifting plate 9a is slidably connected in the vertical direction in the clearance notch 5b. The piston rod of the vertical cylinder 9 is fixedly connected to the rear end of the lifting plate 9a. The pressure block 9b is T-shaped and located on the front side of the correction reference plate 5. The upper end of the pressure block 9b is fixedly connected to the front end of the lifting plate 9a. Both ends of the lower side of the pressure block 9b are fixed with downward-facing pressure plates 9c. A displacement sensor 5e is also fixed on the correction reference plate 5, and a notch 5d is located in the middle of the lower edge of the correction reference plate 5. The notch 5d is located below the clearance notch 5b, and the displacement sensor 5e is positioned forward and extends into the notch 5d.

[0051] This method for bonding crystal rods at fixed angles, using the aforementioned crystal rod bonding machine, includes the following steps:

[0052] A. Loading: Place the material plate 10 horizontally on the clamp 4a of the scanning frame 2 and tighten the bolts on the clamp 4a to fix the material plate 10 on the clamp 4a. Then place the crystal rod on the material plate 10 and bring the side of the crystal rod as close as possible to the flexible suction cup 7 located on the correction reference plate 5.

[0053] B. Angle Correction: Click the run button on the touch screen 15, and the crystal rod angle fixing bonding machine will run automatically.

[0054] b1, the flexible suction cup 7 on the correction reference vertical plate 5 generates vacuum suction force to suck the crystal bar, the horizontal cylinder 6f drives the positioning frame 6 to retract backward, so that the crystal bar is attached to the reference convex part 5a of the correction reference vertical plate 5, that is, the side surface of the crystal bar is attached to the vertical reference surface formed by the end surface of each reference convex part 5a. At this time, the displacement sensor 5e on the correction reference vertical plate 5 detects whether the crystal bar is adsorbed in place, after detecting that the crystal bar is adsorbed in place, the vertical cylinder 9 drives the pressing block 9b to press downward to press the crystal bar tightly against the upper surface of the material plate 10; then the flexible suction cup 7 is broken, the positioning frame 6 is stretched out again after retraction, so that the flexible suction cup 7 is in abutment with the side surface of the crystal bar again, the flexible suction cup 7 is operated again to generate vacuum suction force to adsorb the crystal bar, and then the pressing block 9b is moved upward; the flexible suction cup 7 continuously maintains the vacuum adsorption state, the pressing block 9b is pressed downward again to press the crystal bar tightly on the material plate 10, and the above steps are repeated multiple times.

[0055] b2, the X-ray tube in the X-ray box 12 generates X-rays, which undergoes first-order diffraction through the monochromatic sheet in the monochromator 13, the scanning direct drive motor 1 drives all components on the scanning rack 2 to rotate relative to the workbench 11 until the X-rays generate second-order diffraction in the crystal bar, and the counter tube 14 receives the second-order diffraction signal after data processing to calculate the rotation angle of the crystal bar in the current state, and compare it with the preset value to obtain the compensation angle.

[0056] b3, the pressing block 9b is moved upward, the correction direct drive motor 3 is operated to drive the correction reference vertical plate 5 to rotate relative to the scanning rack 2 and drive the crystal bar attached to the upper surface of the material plate 10 to rotate to the above-mentioned compensation angle. According to actual needs, the above steps b1-b3 can be repeated multiple times until the angle of the crystal bar relative to the material plate 10 reaches the set allowable deviation range, and the angle is determined.

[0057] C, verification and bonding:

[0058] c1, click the verification button on the touch screen 15, the vertical cylinder 9 drives the pressing block 9b to press downward again, the X-ray tube in the X-ray box 12 generates X-rays, which undergoes first-order diffraction through the monochromatic sheet in the monochromator 13, the scanning direct drive motor 1 drives all components on the scanning rack 2 to rotate relative to the workbench 11 until the X-rays generate second-order diffraction in the crystal bar, and the counter tube 14 receives the second-order diffraction signal after data processing to calculate the rotation angle of the crystal bar in the current state, and the touch screen 15 compares the calculated angle with the preset angle value, if the difference between the two exceeds the set allowable deviation range, the above step B is repeated, and if the difference between the obtained angle and the preset value is within the set allowable deviation range, the crystal bar and the contact surface of the material plate 10 are bonded with glue.

[0059] c2. According to the settings and requirements, if there is another crystal ingot that needs to be bonded to the material plate 10, place the next crystal ingot on the material plate 10 and repeat the above steps A, B and c1 until all crystal ingots are bonded to the material plate 10. Then, remove the material plate 10 from the fixture 4a to complete the bonding.

[0060] This method forms a closed-loop cyclic correction and angle-fixing process through multiple scans, corrections, and verifications, which can ensure accurate angle fixing of the crystal rod and improve the accuracy of angle fixing and bonding.

[0061] Example 2

[0062] The structure of this embodiment is basically the same as that of Embodiment 1, except that: Figures 10-11 As shown, the flexible suction cup 7 is fixed on the correction reference plate 5. The flexible suction cup 7 is an accordion-shaped suction cup and can extend and retract in a direction perpendicular to the surface of the correction reference plate 5. The vertical cylinder 9 is located on the front side of the correction reference plate 5 and is connected to the pressure block 9b. After the accordion-shaped suction cup picks up the crystal rod, it will retract backward due to inertia. This is equivalent to the accordion-shaped suction cup pulling the crystal rod backward, so that the crystal rod can be close to the vertical reference surface of the correction reference plate 5. With the downward pressure of the pressure block 9b, the bottom surface of the crystal rod is close to the upper surface of the material plate 10. The accordion-shaped suction cup releases the crystal rod after the air is cut off, and then re-adheres to the side of the crystal rod in a natural state. The pressure block 9b moves up and then presses down again. This process is repeated once or several times to ensure that the accordion-shaped suction cup can finally adsorb the crystal rod in a natural state. At the same time, the bottom surface of the crystal rod is attached to the upper surface of the material plate 10 and this surface is used as the final reference. Subsequent scanning and correction are based on this reference to ensure that the angle of the bonding is the target angle and is not affected by other factors, thereby improving the final bonding accuracy.

[0063] In this embodiment, the crystal rod angle-fixed bonding method is performed using the aforementioned crystal rod angle-fixed bonding machine, and includes the following steps:

[0064] A. Loading: Place the material plate 10 horizontally on the clamp 4a of the scanning frame 2 and tighten the bolts on the clamp 4a to fix the material plate 10 on the clamp 4a. Then place the crystal rod on the material plate 10 and bring the side of the crystal rod as close as possible to the flexible suction cup 7 located on the correction reference plate 5.

[0065] B. Angle Correction: Click the run button on the touch screen 15, and the crystal rod angle fixing bonding machine will run automatically.

[0066] b1, the flexible suction cup 7 on the correction reference vertical plate 5 generates vacuum suction force to suck the wafer, after the wafer is sucked by the flexible suction cup 7, the corrugated part will be deformed by the action of inertia, which is equivalent to pulling the wafer backward, so that the wafer is attached to the reference convex part 5a of the correction reference vertical plate 5, that is, the side of the wafer is attached to the vertical reference surface formed by the end surface of each reference convex part 5a. At this time, the displacement sensor 5e on the correction reference vertical plate 5 detects whether the wafer is attached to the position, after detecting that the wafer is attached to the position, the vertical cylinder 9 drives the pressing block 9b to press the wafer to be tightly attached to the upper surface of the material plate 10; then the flexible suction cup 7 is broken and the vacuum suction force is generated again to suck the wafer, and then the pressing block 9b is moved upward; the flexible suction cup 7 continues to maintain the vacuum suction state, and the pressing block 9b is pressed again to press the wafer on the material plate 10, and the above steps are repeated for several times.

[0067] b2, the X-ray tube in the X-ray box 12 generates X-rays, which undergoes first-order diffraction through the monochromatic sheet in the monochromator 13, the scanning direct drive motor 1 drives all parts on the scanning rack 2 to rotate relative to the workbench 11 until the X-rays generate second-order diffraction in the wafer, and the counter tube 14 receives the second-order diffraction signal for processing, and the compensation angle is obtained by comparing the current rotation angle displacement of the material plate 10 and the wafer with the displacement angle of the wafer and the material plate 10 from the initial position to the preset value.

[0068] b3, the pressing block 9b is moved upward, the correction direct drive motor 3 is operated to drive the correction reference vertical plate 5 to rotate relative to the scanning rack 2 and drive the wafer attached to the upper surface of the material plate 10 to rotate to the above-mentioned compensation angle. According to actual needs, the above steps b1-b3 can be repeated for several times until the angle of the wafer relative to the material plate 10 reaches the set allowable deviation range, and the angle is determined.

[0069] C, verification and bonding:

[0070] c1, click the verification button on the touch screen 15, the vertical cylinder 9 drives the pressing block 9b to press again, the X-ray tube in the X-ray box 12 generates X-rays, which undergoes first-order diffraction through the monochromatic sheet in the monochromator 13, the scanning direct drive motor 1 drives all parts on the scanning rack 2 to rotate relative to the workbench 11 until the X-rays generate second-order diffraction in the wafer, and the counter tube 14 receives the second-order diffraction signal for processing, and the compensation angle is obtained by comparing the current rotation angle displacement of the material plate 10 and the wafer with the displacement angle of the wafer and the material plate 10 from the initial position to the preset value. If the two are compared to exceed the allowable deviation range, repeat the above step B, if the two are compared to be within the set allowable deviation range, the contact surface of the wafer and the material plate 10 is bonded with glue.

[0071] c2, according to the setting and demand, if there is a next crystal bar to be bonded on the material plate 10, the next crystal bar is placed on the material plate 10, and the above steps A, B, c1 are repeated until all the crystal bars are bonded on the material plate 10, then the material plate 10 is unloaded from the clamp 4a, and the bonding is completed.

[0072] The method forms a closed-loop correction angle process through multiple scanning, correction and verification, and can ensure accurate angle setting of the crystal bar and improve the accuracy of angle setting and bonding.

[0073] Example three

[0074] The crystal bar angle setting and bonding method is completed by the crystal bar angle setting and bonding machine in example two, and includes the following steps:

[0075] A, feeding: the material plate 10 is placed on the clamp 4a of the scanning rack 2 in the horizontal direction and the bolts on the clamp 4a are tightened to fix the material plate 10 on the clamp 4a, then the crystal bar is placed on the material plate 10, and the side surface of the crystal bar is as close as possible to the flexible suction cup 7 on the correction reference vertical plate 5.

[0076] B, correction and angle setting: click the run button on the touch screen 15, and the crystal bar angle setting and bonding machine automatically runs.

[0077] b1, the flexible suction cup 7 on the correction reference vertical plate 5 generates a vacuum suction force to suck the crystal bar, after the flexible suction cup 7 sucks the crystal bar, the corrugated part will stretch and deform backward due to inertia, which is equivalent to a backward pulling action on the crystal bar, so that the crystal bar is attached to the reference convex part 5a of the correction reference vertical plate 5, that is, the side surface of the crystal bar is attached to the vertical reference surface formed by the end surface of each reference convex part 5a. At this time, the displacement sensor 5e on the correction reference vertical plate 5 detects whether the crystal bar is adsorbed in place, after detecting that the crystal bar is adsorbed in place, the vertical cylinder 9 drives the pressing block 9b to press down and press the crystal bar tightly against the upper surface of the material plate 10; then the flexible suction cup 7 breaks the vacuum and re-runs to generate a vacuum suction force to adsorb the crystal bar, and then the pressing block 9b moves up; the flexible suction cup 7 continuously maintains the vacuum adsorption state, and the pressing block 9b re-presses the crystal bar tightly on the material plate 10, and the process is repeated multiple times.

[0078] b2, the X-ray tube in the X-ray box 12 generates X-rays, which undergoes first-order diffraction through the monochromatic sheet in the monochromator 13, the scanning direct-drive motor 1 drives all parts on the scanning rack 2 to rotate relative to the workbench 11 until the X-rays generate second-order diffraction in the crystal bar, and the counting tube 14 receives the second-order diffraction signal for processing. By comparing the current rotation angle displacement of the material plate 10 and the crystal bar with the displacement angle of the crystal bar and the material plate 10 from the initial position to the preset value, the compensation angle is obtained.

[0079] b3. The pressure block 9b moves upward, the correction direct drive motor 3 runs, driving the correction reference plate 5 to rotate relative to the scanning frame 2 and causing the crystal rod attached to the upper surface of the material plate 10 to rotate to the above-mentioned compensation angle. According to actual needs, the above steps b1 to b3 can be repeated multiple times until the angle of the crystal rod relative to the material plate 10 reaches the set allowable deviation range, thus completing the angle fixing.

[0080] C. Verification and bonding:

[0081] c1. Click the verification button on the touch screen 15. The vertical cylinder 9 drives the pressure block 9b to press down again. The X-ray tube in the X-ray box 12 generates X-rays, which undergo first-order diffraction after passing through the monochromator 13. The scanning direct drive motor 1 drives all components on the scanning frame 2 to rotate relative to the worktable 11 until the X-rays generate second-order diffraction in the crystal rod. The counter tube 14 receives the second-order diffraction signal and processes it. By comparing the current rotation angle displacement of the material plate 10 and the crystal rod with the displacement angle of the crystal rod and the material plate 10 from the initial position to the preset value, if the two exceed the set allowable deviation range, repeat the above step B. If the two are within the set allowable deviation range, use glue to bond the contact surface of the crystal rod and the material plate 10.

[0082] This method forms a closed-loop cyclic correction and angle-fixing process through multiple scans, corrections, and verifications, which can ensure accurate angle fixing of the crystal rod and improve the accuracy of angle fixing and bonding.

[0083] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A crystal bar angle-bonding machine comprising a worktable (11), a transmitting and receiving mechanism of an X-ray light path, and a scanning frame (2) for horizontally placing and positioning a material plate (10), the scanning frame (2) being provided on the worktable (11), characterized in that, The scanning frame (2) can rotate relative to the workbench (11), the scanning frame (2) is provided with a correction reference vertical plate (5) and the correction reference vertical plate (5) can rotate relative to the scanning frame (2), the correction reference vertical plate (5) is provided with a flexible suction cup (7) and the flexible suction cup (7) can adsorb the crystal bar placed on the material plate (10) and make the crystal bar adhere to the vertical reference surface of the correction reference vertical plate (5), the scanning frame (2) is provided with a pressing block (9b) and the pressing block (9b) can press the crystal bar tightly on the material plate (10); the displacement sensor (5e) on the correction reference vertical plate (5) detects whether the crystal bar is adsorbed in place, after detecting that the adsorption is in place, the vertical cylinder (9) drives the pressing block (9b) to press down and press the crystal bar tightly against the upper surface of the material plate (10); Then the flexible suction cup (7) is broken and then re-run to generate vacuum suction to adsorb the crystal bar, and then the pressing block (9b) moves up; the flexible suction cup (7) continuously maintains the vacuum adsorption state, and the pressing block (9b) re-presses the crystal bar on the material plate (10), so as to repeat multiple times.

2. The goniometric adhesive bonder of claim 1, wherein, The correction reference vertical plate (5) is connected with a positioning frame (6) capable of sliding in a direction perpendicular to the plate surface of the correction reference vertical plate (5), and the flexible suction cup (7) is connected to the positioning frame (6). When the flexible suction cup (7) adsorbs the crystal bar, the positioning frame (6) can retract and make the crystal bar adhere to the vertical reference surface of the correction reference vertical plate (5).

3. The goniometric adhesive bonder of claim 1, wherein, The flexible suction cup (7) is fixed on the correction reference vertical plate (5), and the flexible suction cup (7) is an organ-shaped suction cup and can stretch and contract in a direction perpendicular to the plate surface of the correction reference vertical plate (5).

4. A method for angle bonding of a crystal bar using the angle bonding machine for a crystal bar according to any one of claims 1 to 3, characterized by, The method comprises the following steps: A, feeding: clamping and fixing the material plate (10) horizontally on the scanning frame (2) of the crystal bar angle bonding machine, and then placing the crystal bar on the material plate (10); B, correction angle: b1, the flexible suction cup (7) on the crystal bar angle bonding machine adsorbs the crystal bar placed on the material plate (10) and makes it adhere to the vertical reference surface of the correction reference vertical plate (5), and the pressing block (9b) on the crystal bar angle bonding machine presses the crystal bar tightly on the material plate (10), b2, rotate the scanning frame (2) to drive the material plate (10) and the crystal bar to rotate together, process the signals received by the emission and receiving mechanism of the X-ray light path, and compare with the preset value to obtain the compensation angle, b3, the pressing block (9b) moves up, the correction reference vertical plate (5) rotates and drives the crystal bar to rotate on the upper surface of the material plate (10) by the above-mentioned compensation angle to complete the angle; C, bonding: bonding the crystal bar and the material plate (10) with glue.

5. The method according to claim 4, wherein In the step A, after placing the crystal bar on the material plate (10), the side of the crystal bar is close to the flexible suction cup (7) on the correction reference vertical plate (5).

6. The method according to claim 4, wherein In the step B, the specific operation steps of b1 are as follows: the flexible suction cup (7) on the correction reference vertical plate (5) generates vacuum suction to suck the crystal bar, and pulls the crystal bar along the horizontal direction to make it adhere to the vertical reference surface of the correction reference vertical plate (5); at the same time, the displacement sensor on the correction reference vertical plate (5) detects whether the crystal bar is adsorbed in place, and after detecting that the crystal bar is adsorbed in place, the pressing block (9b) on the scanning rack (2) moves downward to press the crystal bar on the upper surface of the material plate (10); the flexible suction cup (7) is re-operated to generate vacuum suction to adsorb the crystal bar, and then the pressing block (9b) moves upward; the flexible suction cup (7) continuously maintains the vacuum adsorption state, and the pressing block (9b) re-presses the crystal bar on the material plate (10).

7. The method according to claim 6, wherein In the step B, the above steps b1-b3 are repeated multiple times until the angle of the crystal bar relative to the material plate (10) reaches the set allowable deviation range.

8. The method according to claim 4 or 5 or 6 or 7, wherein In the step C, the position of the crystal bar with a fixed angle in the step B is verified first, and the specific verification process is as follows: the pressing block (9b) re-presses, the scanning rack (2) rotates to scan and verify, the signal received by the X-ray light path emitting and receiving mechanism is processed and compared with the preset value, if the two are compared to exceed the set allowable deviation range, the above step B is repeated, if the two are compared to be within the set allowable deviation range, the crystal bar and the material plate (10) are bonded with glue.

9. The method according to claim 8, wherein In the step C, after the bonding is completed, according to the setting and demand, if there is still a next crystal bar to be bonded on the material plate (10), the next crystal bar is placed on the material plate (10), and the above steps A-C are repeated until all the crystal bars are bonded on the material plate (10), then the material plate (10) is unloaded from the clamp, and the bonding is completed.

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