Equipment for processing substrates of various sizes

Abstract

The present disclosure provides embodiments of methods and apparatus for processing substrates of different sizes. In some embodiments, an apparatus for processing substrates of different sizes includes: a pair of end effectors having a first set of contact pads configured to support a substrate of a first size and a second set of contact pads configured to support a substrate of a second size smaller than the first size.

Description

Technical Field

[0001] Embodiments of the present disclosure relate generally to substrate processing apparatus, and more particularly to methods and apparatus for processing substrates of varying sizes. Background Art

[0002] In the semiconductor manufacturing industry, precise and careful handling of substrates, such as semiconductor wafers, is a key aspect of substrate processing. Automation, such as by substrate handling robots with end effectors designed to handle wafers, is used to perform complex touch-free tasks and reduce or isolate any external contamination. Such substrate handling robots transfer substrates, such as wafers, from one location to another, pick up and drop off substrates from one station to another within the system, etc. Typically, substrate handling robots are designed and built to handle one type of substrate size, depending on, for example, system capabilities and configuration. As an example, some systems may be configured to handle 200 mm wafers or 300 mm wafers, etc.

[0003] With the advancement of technology and more compact and smaller electronic devices with high computing power, the industry has shifted its focus from 200mm wafers to 300mm wafers. As the processing of 300mm wafers becomes more dominant in the market, the demand for tools with 300mm processing capabilities increases, causing tool manufacturers to design and build more 300mm tools, slowly phasing out 200mm tools.

[0004] However, despite the transition to 300 mm substrate processing, many chip manufacturers still have a large number of 200 mm substrates in their respective inventories. The inventors believe that such chip manufacturers and others who desire to process 200 mm substrates may not want to purchase 200 mm tools that may soon be obsolete.

[0005] Accordingly, the inventors have provided improved methods and apparatus that enable a substrate processing robot to process substrates of different sizes, such as 200 mm and 300 mm wafers. Summary of the invention

[0006] Embodiments of methods and apparatus for processing substrates of different sizes are provided herein. In some embodiments, an apparatus for processing substrates of different sizes includes: a pair of end effectors having a first set of contact pads configured to support a substrate having a first size and a second set of contact pads configured to support a substrate having a second size smaller than the first size.

[0007] In some embodiments, a multi-chamber substrate processing tool includes: a factory interface (FI) that is selectively connected to a load lock chamber; a first front opening unification unit (FOUP) that is disposed on or coupled to the FI and is configured to provide substrates having a first size to or from the multi-chamber substrate processing tool; a second FOUP that is disposed on or coupled to the FI and is configured to provide substrates having a second size to or from the multi-chamber substrate processing tool; and a robot disposed in the factory interface, wherein the robot includes a pair of end effectors configured to support substrates having both the first size and the second size, the second size being smaller than the first size.

[0008] In some embodiments, a method for processing substrates of different sizes includes the following steps: rotating a pair of end effectors of a substrate processing robot in a tool configured to process substrates to a first position to support a substrate having a first size; and rotating the pair of end effectors to a second position to support a substrate having a second size.

[0009] Other and further embodiments of the invention are described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Embodiments of the present disclosure, briefly summarized above and discussed in more detail below, may be understood by reference to the illustrative embodiments of the present disclosure depicted in the accompanying drawings. However, the drawings illustrate only typical embodiments of the present disclosure and are therefore not to be considered limiting of the scope, as the present disclosure may admit to other equally effective embodiments.

[0011] Figure 1A-1B is a schematic top view of an apparatus for processing substrates of different sizes, according to at least some embodiments of the present disclosure.

[0012] Figure 2A-2B is a schematic front view of the apparatus of FIG. 1 for processing substrates of different sizes, according to at least some embodiments of the present disclosure.

[0013] Figure 3A-3B is a schematic alternative front view of the apparatus of FIG. 1 for processing substrates of different sizes, in accordance with at least some embodiments of the present disclosure.

[0014] Figure 4 is a plan view of a multi-chamber cluster tool suitable for performing methods for processes of different sizes according to some embodiments of the present disclosure.

[0015] To facilitate understanding, where possible, the same reference numerals have been used to denote the same elements common to the figures. The figures are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated into other embodiments without further recitation. DETAILED DESCRIPTION

[0016] Embodiments of methods and apparatus for processing substrates of different sizes are provided herein. Embodiments of the disclosed methods and apparatuses advantageously enable a substrate processing robot to process substrates of different sizes. For example, an apparatus for processing substrates of different sizes can process substrates of a first size (such as a wafer having a first diameter of, for example, 300 mm) and substrates of a second size smaller than the first size (such as a wafer having a second diameter of, for example, 200 mm). Therefore, embodiments of the disclosed methods and apparatuses advantageously enable a substrate processing robot (such as a substrate processing robot in a 300 mm processing tool) to process substrates of different sizes, such as both 200 mm and 300 mm wafers, or other combinations. In addition, by replacing the terminal effector on the robot without replacing the entire substrate processing robot and without worrying about the factory interface (FI) being incompatible with the substrate processing robot, the improved equipment can be advantageously refurbished on the existing substrate processing robot.

[0017] Embodiments of the apparatus disclosed herein for processing substrates of different sizes advantageously enable a substrate processing apparatus configured to process a substrate of a first size to process substrates of different sizes. The substrate may be a circular substrate (such as a 200 or 300 mm wafer, etc.) or a substrate having other form factors (such as a rectangular or polygonal substrate, for example, a rectangular glass substrate for solar energy, a display, or other applications). For example, according to the teachings disclosed herein, a substrate processing robot in a tool configured to process a 300 mm wafer may be replaced or modified to allow processing of, for example, both 200 mm and 300 mm wafers. In this way, the substrate processing robot may process a wafer process of 200 mm, 300 mm, or both 200 mm and 300 mm at any given point in time. Further advantageously, the terminal effector on the substrate processing robot may be modified according to the teachings disclosed herein without having to replace the entire robot or worrying about incompatibility with FI.

[0018] Figure 1A-1B 1 is a schematic top view of an apparatus 100 for processing substrates of different sizes according to at least some embodiments of the present disclosure. The apparatus 100 is suitable for use in conjunction with a substrate processing tool configured to process substrates having a first size, such as the following reference Figure 4 The multi-chamber substrate processing tool 400 .

[0019] In some embodiments, the apparatus 100 includes a pair of end effectors 102 coupled to a support plate 104. During substrate pickup and transfer, the support plate 104 provides support and distributes the weight of the load on the end effectors 102. The end effectors 102 can be easily removed from the support plate 104 to facilitate repair, reconfiguration, replacement, etc.

[0020] The end effector 102 includes a first set of contact pads 106A and a second set of contact pads 106B. The end effector 102 and the first and second sets of contact pads 106A, 106B are configured to pass through an opening in a processing system to allow processing and transfer of substrates throughout the processing system.

[0021] The first set of contact pads 106A is configured to support a substrate having a first size. The second set of contact pads 106B is configured to support a substrate having a second size that is smaller than the first size. The first and second contact pads 106A, 106B are further configured to not interfere with each other. For example, the first set of contact pads 106A can support a first substrate having a first size (indicated by dashed line 101) without the first substrate contacting the second set of contact pads 106B. Similarly, the second set of contact pads 106B can support a second substrate having a second size (indicated by dashed line 103) without the second substrate contacting the first set of contact pads 106A. In this way, due to the clearance provided by the configuration of the contact pads and the end effector, the device 100 can advantageously handle warped substrates.

[0022] The contact pads of the first and second sets of contact pads 106A, 106B may be any suitable contact pads for supporting a substrate in a substrate processing system. For example, the contact pads may include edge clamps or edge contact pads for supporting a substrate by their peripheral edges. Other types of contact pads may also be used. Furthermore, depending on processing requirements, the location of the contact pads may be selected to process substrates of a desired size.

[0023] The end effector 102 can selectively support larger or smaller substrates. For example, in some embodiments and as Figure 2A -B and 3A-B more clearly shown, the terminal actuator 102 can be partially or freely rotated relative to the support plate 104, so that the rotational orientation of each terminal actuator 102 can be controlled to properly position the first group of contact pads 106A or the second group of contact pads 106B for use and to set an unselected group of contact pads in a position that does not interfere with the use of the selected group of contact pads.

[0024] For example, in some embodiments, and depending on the size of the substrate to be processed, two contact pads are disposed on each end effector 102 at locations corresponding to a first substrate size, defined as a first set of contact pads. Two contact pads are disposed on each end effector 102 at locations corresponding to a second substrate size, defined as a second set of contact pads. The first and second sets of contact pads are radially spaced apart from each other, such as about 90 degrees apart from each other (e.g., Figure 2A-2B ), or at a smaller angle that still provides gaps between the contact pads (as depicted in FIG. Figure 3A-3B In some embodiments, the relative angular position of the contact pad is measured relative to an elongated axis of the end effector.

[0025] For example, Figure 2A-2B is a schematic front view of an apparatus for processing substrates of different sizes of FIG. 1 in accordance with at least some embodiments of the present disclosure. Figure 2A , the terminal effector 102 is rotated so that the second set of contact pads 106B is positioned to support a substrate having a second size (eg, a smaller substrate), as indicated by dashed lines 103. Figure 2B , the terminal effector 102 is rotated such that the first set of contact pads 106A is positioned to support a substrate having a first size (eg, a larger substrate), as indicated by dashed lines 101 .

[0026] Figure 3A-3B is a schematic alternative front view of the apparatus of FIG. 1 for processing substrates of different sizes, according to at least some embodiments of the present disclosure. Figure 3A , the terminal effector 102 is rotated so that the second set of contact pads 106B is positioned to support a substrate having a second size (eg, a smaller substrate), as indicated by dashed lines 103. Figure 3B , the terminal effector 102 is rotated so that the first set of contact pads 106A is positioned to support a substrate having a first size (eg, a larger substrate), as indicated by dashed line 101. Figure 3A-3B The groups of contact pads in are angularly closer to each other, so the end effector 102 does not need to rotate as much to switch configurations.

[0027] During operation, before picking up a substrate (such as, for example, before entering a FOUP), the end effector can be rotated to position a set of contact pads to a first position. Once in position, the substrate handling equipment will extend the end effector 102 into the FOUP. At the end of the extended position, the end effector 102 can be rotated to a second position where the set of contact pads (e.g., edge gripping pads) are in contact with the substrate. The substrate will then be held on the end effector 102 before the equipment 100 is retracted and the substrate is transferred to another position. When the substrate is placed on a support, the rotation of the end effector can be reversed to release the substrate.

[0028] In some embodiments, the apparatus 100 may be incorporated into a substrate transfer robot. Figure 1A , the support plate 104 can be configured as a wrist of a substrate transfer robot. The wrist supports each end effector 102 in a fixed position relative to each other, so that control of the movement of the wrist helps control the positioning of the end effector 102. The wrist is coupled to an arm 108, which can move the wrist (and the end effector 102) in a horizontal direction, such as extending horizontally through an opening in a FOUP or process chamber to deliver a substrate to or receive a substrate from a FOUP or process chamber. In some embodiments, the wrist is capable of at least one of horizontal or vertical rotational movement relative to the arm, such as, for example, by being coupled to the arm via a hinge, pin, pivotable joint, bend, etc. (pivotable joint 110 is shown). The arm 108 can be a composite arm including multiple parts and joints to facilitate more complex movements. In some embodiments, the arm 108 can be coupled to an assembly 112 for providing vertical and / or rotational movement of the arm about a central axis 114. Such vertical and / or rotational motion of the arm facilitates moving the wrist (and end effector 102) vertically and / or rotationally as needed to deliver or receive a substrate as desired.

[0029] Components of the apparatus 100 and the substrate transfer robot (e.g., arms, wrists, end effectors, etc.) can be made of any process-appropriate materials. For example, in some embodiments, materials can be selected to minimize deflection of the robot blade during substrate transfer. In some embodiments, materials can be selected to minimize contamination of the substrate by the robot blade during substrate transfer. In some embodiments where transfer to or from a chamber is performed at high temperatures, materials can be selected to minimize thermal effects during substrate transfer.

[0030] Figure 4A plan view of a non-limiting example of an integrated multi-chamber substrate processing tool 400 having equipment for processing substrates of different sizes according to the present disclosure is schematically shown. Examples of tools suitable for modification and use according to the present disclosure include the APPLIED ® 2000 available from Applied Materials, Inc. of Santa Clara, California. and A series of integrated substrate processing tools. The multi-chamber substrate processing tool 400 includes a plurality of processing chambers coupled to a mainframe that includes two transfer chambers (eg, transfer chamber 408 and transfer chamber 433).

[0031] The multi-chamber substrate processing tool 400 includes a front-end environmental factory interface (FI) 402 that selectively communicates with a load lock chamber 404. The multi-chamber substrate processing tool 400 is generally configured to process substrates having a first size (such as wafers having a first diameter of, for example, 300 mm). One or more front opening unification units (FOUPs) (e.g., FOUP 401a and FOUP 401b) are disposed on or coupled to the FI 402 to provide substrates to or receive substrates from the multi-chamber substrate processing tool 400. In some embodiments, a bridge FOUP 401c is provided to allow processing of substrates having a second size that is smaller than the first size (e.g., wafers having a second diameter of, for example, 200 mm). The bridge FOUP 401c is disposed on or coupled to the FI 402. In some embodiments, the bridge FOUP 401c may be configured to hold a substrate carrier of a first size (eg, 300 mm) on which a substrate of a second size (eg, 200 mm) is disposed.

[0032] The factory interface robot 403 is disposed within the FI 402. The factory interface robot 403 may be incorporated into any of the embodiments of the apparatus 100 for processing substrates of different sizes as described above. The factory interface robot 403 is configured to transfer substrates to / from the FOUPs 401a, 401b, and the bridge FOUP 401c, and to transfer substrates between the bridge FOUP 401c and the load lock chamber 404. In an operational example, the factory interface robot 403 obtains a substrate carrier from the FOUP 401a and places the substrate carrier in the bridge FOUP 401c. The substrate carrier has a first size, such as a 300 mm diameter. Subsequently, the factory interface robot 403 then obtains a substrate from the FOUP 401b and places the substrate on a substrate carrier in the bridge FOUP 401c. The substrate has a second size smaller than the first size, such as a 200 mm diameter. Next, the factory interface robot 403 may transfer the carrier holding the substrate together to the load lock chamber 404 so that the substrate having the second size can be processed in the multi-chamber substrate processing tool 400. In such an example, by using a single substrate processing apparatus to facilitate processing of substrates of multiple sizes, the substrate transfer apparatus 100 advantageously enables a processing tool (such as the multi-chamber substrate processing tool 400) configured to process substrates having a first size to process substrates having a second size that is smaller than the first size.

[0033] The load lock chamber 404 provides a vacuum interface between the FI 402 and the first transfer chamber assembly 410. The interior region of the first transfer chamber assembly 410 is typically maintained under vacuum conditions and provides an intermediate region in which substrates or substrate carriers holding substrates are moved from one chamber to another chamber and / or a load lock chamber.

[0034] In some embodiments, the first transfer chamber assembly 410 is divided into two parts. In some embodiments of the present disclosure, the first transfer chamber assembly 410 includes a transfer chamber 408 and a vacuum extension chamber 407. The transfer chamber 408 is coupled to the vacuum extension chamber 407 and is in fluid communication with each other. During processing, the internal volume of the first transfer chamber assembly 410 is generally maintained under low pressure or vacuum conditions. The load lock chamber 404 can be connected to the FI 402 and the vacuum extension chamber 407 via slit valves 405 and 406, respectively.

[0035] In some embodiments, the transfer chamber 408 may be a polygonal structure having a bottom, a lid, and a plurality of side walls. The plurality of side walls may have openings formed therethrough and may be configured to connect with a processing chamber, a vacuum extension, and / or a through chamber. Figure 4The transfer chamber 408 shown in FIG. 4 has a square or rectangular shape and is coupled to the process chambers 411, 413, the through chamber 431, and the vacuum extension chamber 407. The transfer chamber 408 may selectively communicate with the process chambers 411, 413, and the through chamber 431 via slit valves 416, 418, and 417, respectively.

[0036] In some embodiments, the central robot 409 may be installed in the transfer chamber 408 at a robot port formed on the bottom of the transfer chamber 408. The central robot 409 is disposed in the interior volume 420 of the transfer chamber 408 and is configured to move the substrate 414 (or a substrate carrier holding a substrate) back and forth between the processing chambers 411, 413, the pass-through chamber 431, and the load lock chamber 404. In some embodiments, the central robot 409 may include two blades for holding a substrate or a substrate carrier holding a substrate, each blade being mounted on an independently controllable robot arm mounted on the same robot base. In another embodiment, the central robot 409 may have the ability to move the blade vertically.

[0037] The vacuum extension chamber 407 is configured to provide an interface to the vacuum system for the first transfer chamber assembly 410. In some embodiments, the vacuum extension chamber 407 includes a bottom, a lid, and a sidewall. A pressure regulating port can be formed on the bottom of the vacuum extension chamber 407 and configured to adapt to a vacuum pump system. An opening is formed on the sidewall so that the vacuum extension chamber 407 is in fluid communication with the transfer chamber 408 and selectively communicates with the load lock chamber 404.

[0038] In some embodiments, the vacuum extension chamber 407 includes a shelf (not shown) configured to store one or more substrates or substrate carriers holding substrates. Processing chambers directly or indirectly connected to the transfer chamber 408 can store their substrates or substrate carriers holding substrates on the shelf and transfer them using the central robot 409.

[0039] The multi-chamber substrate processing tool 400 may further include a second transfer chamber assembly 430 connected to the first transfer chamber assembly 410 by a pass-through chamber 431. In some embodiments, similar to a load lock chamber, the pass-through chamber 431 is configured to provide an interface between two processing environments. In such embodiments, the pass-through chamber 431 provides a vacuum interface between the first transfer chamber assembly 410 and the second transfer chamber assembly 430.

[0040] In some embodiments, the second transfer chamber assembly 430 is divided into two parts to minimize the footprint of the multi-chamber substrate processing tool 400. In some embodiments of the present disclosure, the second transfer chamber assembly 430 includes a transfer chamber 433 and a vacuum extension chamber 432 that are in fluid communication with each other. During processing, the internal volume of the second transfer chamber assembly 430 is generally maintained under low pressure or vacuum conditions. The chamber 431 can be connected to the transfer chamber 408 and the vacuum extension chamber 432 via slit valves 417 and 438, respectively, so that the pressure within the transfer chamber 408 can be maintained at different vacuum levels.

[0041] In some embodiments, the transfer chamber 433 may be a polygonal structure having a bottom, a lid, and a plurality of side walls. The plurality of side walls may have openings formed therein and be configured to connect with a processing chamber, a vacuum extension, and / or a through chamber. Figure 4 The transfer chamber 433 shown in FIG. 4 has a square or rectangular shape and is coupled to the process chambers 435, 436, 437, and the vacuum extension chamber 432. The transfer chamber 433 may selectively communicate with the process chambers 435, 436 via slit valves 441, 440, 439, respectively.

[0042] The central robot 434 is installed in the transfer chamber 433 at a robot port formed on the bottom of the transfer chamber 433. The central robot 434 is disposed in the interior volume 449 of the transfer chamber 433 and is configured to move the substrate 443 (or a substrate carrier holding a substrate) back and forth between the processing chambers 435, 436, 437, and the through chamber 431. In some embodiments, the central robot 434 may include two blades for holding a substrate or holding a substrate carrier 132 for holding a substrate, each blade being mounted on an independently controllable robot arm mounted on the same robot base. In some embodiments, the central robot 434 may have the ability to move the blades vertically.

[0043] In some embodiments, the vacuum extension chamber 432 is configured to provide an interface between the vacuum system and the second transfer chamber assembly 430. In some embodiments, the vacuum extension chamber 432 includes a bottom, a lid, and a sidewall. A pressure regulating port can be formed on the bottom of the vacuum extension chamber 432 and configured to adapt to the vacuum system. An opening is formed through the sidewall so that the vacuum extension chamber 432 is in fluid communication with the transfer chamber 433 and selectively communicates with the through chamber 431.

[0044] In some embodiments of the present disclosure, vacuum extension chamber 432 includes a shelf (not shown) similar to the shelf described above in connection with vacuum extension chamber 407. Processing chambers directly or indirectly connected to transfer chamber 433 may store substrates or substrate carriers holding substrates on the shelf.

[0045] Typically, substrates are processed in a sealed chamber having a pedestal for supporting a substrate disposed thereon. The pedestal may include a substrate support having electrodes disposed therein to electrostatically hold the substrate or a substrate carrier for holding the substrate against the substrate support during processing. For processes that tolerate higher chamber pressures, the pedestal may alternatively include a substrate support having an opening in communication with a vacuum source for securely holding the substrate against the substrate support during processing.

[0046] Processes that may be performed in any of the processing chambers 411, 413, 435, 436, or 437 include deposition, implantation, and thermal treatment processes, among others. In some embodiments, a processing chamber (such as any of the processing chambers 411, 413, 435, 436, or 437) is configured to perform a sputtering process on a substrate or on multiple substrates simultaneously. In some embodiments, the processing chamber 411 is a degassing chamber. In some embodiments, the processing chamber 413 is a pre-metallization cleaning chamber. The pre-metallization cleaning chamber may use a sputtering cleaning process containing an inert gas such as argon. In some embodiments, the processing chamber 435 is a deposition chamber. The deposition chamber used with the embodiments described herein may be any known deposition chamber.

[0047] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof.

Claims

1. An apparatus for processing substrates of different sizes, comprising: A pair of end effectors, the pair of end effectors being coupled to a support plate and having a first set of contact pads collectively configured to support a substrate having a first size and a second set of contact pads collectively configured to support a substrate having a second size smaller than the first size, wherein the first set of contact pads and the second set of contact pads are angularly positioned relative to each other relative to an elongated axis of each respective end effector, wherein each of the pair of end effectors is rotatable about the elongated axis of the end effector and is rotatable relative to the support plate such that the rotation of each of the end effectors positions the first set of contact pads or the second set of contact pads for receiving the substrate.

2. The device according to claim 1, characterized in that The support plate is configured as a wrist of a substrate transfer robot and is coupled to an arm of the substrate transfer robot.

3. The device according to claim 1, characterized in that The first and second groups of contact pads are edge clamping pads.

4. The device according to claim 1, characterized in that The angle is greater than 0 and reaches 90 degrees.

5. The device according to any one of claims 1 to 4, characterized in that Two contact pads are provided on each end effector to define the first set of contact pads.

6. The device according to any one of claims 1 to 4, characterized in that Two contact pads are provided on each end effector to define the second set of contact pads.

7. The device according to any one of claims 1 to 4, characterized in that The second set of contact pads are disposed at locations on each end effector between locations of adjacent contact pads of the first set of contact pads.

8. A multi-chamber substrate processing tool comprising: a factory interface (FI) in selective communication with the load lock chamber; a first front opening unit (FOUP) disposed on or coupled to the FI and configured to provide substrates of a first size to or from the multi-chamber substrate processing tool; a second FOUP disposed on or coupled to the FI and configured to provide substrates having a second size smaller than the first size to or from the multi-chamber substrate processing tool; as well as A robot arranged in the factory interface, wherein the robot comprises an apparatus as described in any one of claims 1, 3 or 4.

9. The multi-chamber substrate processing tool of claim 8, wherein: Two contact pads are provided on each end effector to define the configured first set of contact pads, and two contact pads are provided on each end effector to define the second set of contact pads.

10. A method for processing substrates of different sizes, comprising: rotating a pair of end effectors of a substrate processing robot in a tool configured to process a substrate from a first position supporting a substrate having a first size to a second position supporting a substrate having a second size, wherein the pair of end effectors rotate about a respective elongated axis of each end effector, The pair of terminal effectors includes a first group of contact pads and a second group of contact pads, the first group of contact pads supports the substrate having the first size through the rotation of the terminal effector, and the second group of contact pads supports the substrate having the second size through the rotation of the terminal effector.

11. The method of claim 10, further comprising releasing the substrate having the first size before rotating the pair of end effectors to the second position. 12 . The method of claim 11 , further comprising picking up the substrate having the first size before releasing the substrate having the first size.

13. The method according to any one of claims 10 to 12, characterized in that Rotating the pair of end effectors to the second position includes rotating the pair of end effectors by 90 degrees relative to an elongated axis of each of the respective end effectors.

Images