A heat dissipation device combining a microchannel heat exchanger and a heat pipe

Abstract

The present invention discloses a heat dissipation device combining a microchannel heat exchanger and a heat pipe, which mainly consists of a microchannel heat exchanger, a heat pipe and a substrate. The evaporation section of the heat pipe is provided in the substrate, and the surface of the heat pipe is on the same horizontal plane as the surface of the substrate, that is, when the heat source works, it is in direct contact with the evaporation section of the heat pipe; the microchannel heat exchanger is composed of upper, middle and lower parts. The upper and lower parts are the condensation section parts of the heat pipe, and the middle part is a microchannel, and the inlets and outlets of the coolant are respectively installed at both ends of the heat exchanger. This device applies the principles of gravity and heat pipe operation as well as the excellent heat dissipation effect of the microchannel. The heat source transfers heat to the microchannel heat exchanger through the heat pipe for cooling. The present invention combines the outstanding heat transfer performance of the heat pipe and the effective cooling effect of the microchannel to form a heat dissipation device, which can fully absorb the heat of the heat source and significantly contribute to the thermal management technology, thereby improving the comprehensive application of the object to be cooled. Moreover, this heat dissipation device has a compact structure, is simple to use, convenient to maintain, and is efficient, environmentally friendly.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation devices, and particularly to a heat dissipation device combining a microchannel heat exchanger and a heat pipe. Background Art

[0002] With the rapid development of modern science and technology, many modern electronic devices generate a large amount of heat during operation, leading to device damage, reduced reliability, and shortened lifespan. And precisely for many electronic devices, the heat management problem is crucial. Take the LED lamp as an example. Since the luminous efficiency of the LED lamp is generally lower than 35%, the remaining part is dissipated in the form of heat. If reasonable heat dissipation treatment cannot be carried out, its sustainability and reliability will be greatly reduced.

[0003] Limited by traditional cooling methods, neither air cooling nor liquid cooling can effectively manage the heat of electronic devices in practical applications. With a large number of microchannels, research shows that a cooling system using a microchannel heat sink (MEMS) in combination with a coolant is the most effective method for cooling modern electronic devices. In recent years, MEMS technology has been developed and continuously matured. Because it can make up for some defects of traditional heat sinks, people have paid more and more attention to the use of microchannels.

[0004] A heat pipe is a heat transfer element with high thermal conductivity. It transfers heat through the evaporation and condensation of the working fluid in a fully enclosed vacuum shell. The heat pipe technology is a new type of heat dissipation technology. It makes full use of the principle of heat conduction and the rapid heat transfer property of the phase change medium. Its strong heat conduction ability exceeds that of any known metal. In addition, the design and installation of the heat pipe are quite flexible and can be put into use in different occasions. It is an efficient and environmentally friendly heat conduction element.

[0005] Nowadays, heat dissipation devices have been greatly developed and are used in many fields respectively. However, the heat management problem of high-power electronic devices has not been perfected yet. Therefore, the existing technology needs to be further improved and perfected. Summary of the Invention

[0006] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a heat dissipation device combining a microchannel heat exchanger and a heat pipe.

[0007] The purpose of the present invention is achieved through the following technical solutions:

[0008] A heat dissipation device combining a microchannel heat exchanger and a heat pipe mainly includes a substrate, a heat pipe group, and a heat exchanger. The substrate is disposed on the heat source and contacts the heat source to absorb heat. The heat exchanger is disposed above the substrate and is arranged parallel to the substrate. The heat pipe group is disposed on the substrate, one end of which is connected and contacts one side of the heat exchanger, and the other end is connected and contacts the other side of the heat exchanger.

[0009] Specifically, the heat pipe group is formed by arranging a number of heat pipes connecting the substrate and the heat exchanger side by side. The heat pipe includes an evaporation section, a first transition section, a second transition section, a first condensation section, and a second condensation section. The evaporation section is arranged on the substrate and fixedly connected to the substrate. The first condensation section is arranged on the side of the heat exchanger close to the substrate and fixedly connected to the heat exchanger. The second condensation section is arranged on the other side of the heat exchanger away from the substrate and fixedly connected to the heat exchanger. One end of the first transition section is connected to one end of the evaporation section, and the other end is connected to one end of the first condensation section, and the other end of the first condensation section is closed. One end of the second transition section is connected to the other end of the evaporator, and the other end is connected to one end of the second condensation section, and the other end of the second condensation section is closed.

[0010] Specifically, the heat exchanger adopts a microchannel heat exchanger, including a heat exchanger body, a coolant inlet, a coolant outlet, and microchannels. The coolant inlet is arranged at one end of the heat exchanger body and fixedly connected to the heat exchanger body. One end of the coolant inlet is communicated with the outside, and the other end is communicated with the inside of the heat exchanger body. The coolant outlet is arranged at the other end of the heat exchanger body and fixedly connected to the heat exchanger body. One end of the coolant outlet is communicated with the outside, and the other end is communicated with the inside of the heat exchanger body. The microchannels are curled and arranged inside the heat exchanger body, one end of which is connected to the coolant inlet and the other end is connected to the coolant outlet.

[0011] As a preferred solution of the present invention, the first transition section and the second transition section on one side of adjacent heat pipes in the heat pipe group are arranged alternately.

[0012] As a preferred solution of the present invention, both the first transition section and the second transition section adopt an arc-shaped or semi-circular structure design.

[0013] As a preferred solution of the present invention, the curled shape of the microchannels adopts a serpentine, meandering, spiral, or zigzag structure design.

[0014] As a preferred solution of the present invention, water or nanofluid is filled in the microchannels as the coolant.

[0015] As a preferred solution of the present invention, a phase change material is filled in the heat pipe as the cooling working medium, and the phase change material is a mixture composed of water, paraffin, graphite powder, and metal powder.

[0016] As a preferred solution of the present invention, the heat pipe adopts a square tube or circular tube structure design.

[0017] As a preferred solution of the present invention, part of the evaporation section is embedded or completely embedded in the substrate to increase the contact area with the substrate.

[0018] As a preferred embodiment of the present invention, the condensation section is partially or completely embedded in the heat exchanger, increasing the contact area with the heat exchanger.

[0019] The working process and principle of the present invention are as follows: When in use, the present invention is installed in a small heat exchange scenario, and the heat source dissipates heat under this device. The heat source and its heat conducting layer can be bonded to the substrate through heat conducting silicone grease. When the heat source starts to work, the heat dissipation increases and the temperature rises accordingly, causing the heat pipe in contact with the heat source to absorb heat. The phase change working fluid in the evaporation section of the heat pipe evaporates from a liquid to a gas and is transferred to the condensation section of the heat pipe. The condensation section of the heat pipe is in close contact with the microchannel heat exchanger. The microchannel heat exchanger takes away the heat of the condensation section of the heat pipe through the inflow and outflow of the coolant, causing the gas in the condensation section of the heat pipe to condense into a liquid, and the liquid flows back to the evaporation section of the heat pipe under the action of gravity, thus forming a closed circulation loop and continuously circulating. There are two usage scenarios for this device. When the heat of the heat source is less, the gas in the evaporation section of the heat pipe can only be transferred to the condensation section of the heat pipe closer to the substrate; when the heat of the heat source is greater, enough gas is generated so that the gas in the evaporation section of the heat pipe can be transferred to the condensation sections of the heat pipe on both sides of the microchannel heat exchanger for heat dissipation, achieving the effect of "double condensation sections" and effectively absorbing more heat. The present invention ingeniously combines the microchannel heat exchanger and the heat pipe, featuring a compact structure, outstanding performance, high efficiency and environmental protection, and can be put into use in small spaces with high power.

[0020] Compared with the prior art, the present invention also has the following advantages:

[0021] (1) The heat dissipation device combining the microchannel heat exchanger and the heat pipe provided by the present invention directly contacts the heat source with the evaporation section of the heat pipe, greatly improving the heat transfer effect and fully absorbing the heat of the heat source.

[0022] (2) When the heat is greater, the heat dissipation device combining the microchannel heat exchanger and the heat pipe provided by the present invention achieves the effect of "double condensation sections" between the heat pipe and the microchannel heat exchanger, which is also the effect obtained by a heat pipe combining long and short tubes, making the cooling liquid of the microchannel heat exchanger not only not affect the heat exchange effect but also making the liquid evenly heated.

[0023] (3) The microchannel heat exchanger of the heat dissipation device combining the microchannel heat exchanger and the heat pipe provided by the present invention has a very prominent cooling effect on electronic devices and extremely low thermal resistance, significantly promoting the solution of the heat management problem; combining the microchannel heat exchanger and the heat pipe for use, this device is not only simple and practical but also highly efficient and environmentally friendly. Description of the Drawings

[0024] Figure 1 is a schematic structural diagram of the heat dissipation device combining the microchannel heat exchanger and the heat pipe provided by the present invention.

[0025] Figure 2It is a perspective view of the heat dissipation device combining a microchannel heat exchanger and a heat pipe provided by the present invention.

[0026] Figure 3 It is a schematic structural diagram of the substrate and the evaporation section of the heat pipe provided by the present invention.

[0027] Figure 4 It is a side view of the heat dissipation device combining a microchannel heat exchanger and a heat pipe provided by the present invention.

[0028] Figure 5 It is a schematic structural diagram of the overall heat pipe provided by the present invention.

[0029] Figure 6 It is a schematic internal structure diagram of the heat exchanger provided by the present invention.

[0030] The reference numerals in the above-mentioned drawings are explained as follows:

[0031] 1 - Heat exchanger, 2 - Coolant inlet, 3 - Coolant outlet, 4 - Substrate, 5 / A - Evaporation section, 6 / (B1 and B2) - Transition section, 7 / (C1 and C2) - Condensation section. Detailed implementation manners

[0032] To make the purpose, technical solutions and advantages of the present invention clearer and more definite, the following examples are given with reference to the accompanying drawings to further illustrate the present invention.

[0033] Example 1:

[0034] As Figures 1 to 6 shown, this example discloses a heat dissipation device combining a microchannel heat exchanger and a heat pipe. The structure of this heat dissipation device is simple and compact, with low power consumption, and excellent heat exchange and heat dissipation effects, providing an effective way to solve the heat dissipation problem of high-power electronic devices.

[0035] To achieve the above object, the present invention provides the following technical solutions: A heat dissipation device combining a microchannel heat exchanger and a heat pipe, including a substrate 4. The evaporation section 5 of the heat pipe is installed on the top of the substrate 4, the heat source is placed on the top of the substrate 4, the condensation section 7 of the heat pipe is installed on the upper and lower surfaces of the microchannel heat exchanger 1, the transition section 6 of the heat pipe is bent to connect the evaporation section 5 and the condensation section 7, the heat pipes are evenly distributed on the surfaces of the substrate 4 and the microchannel heat exchanger 1, and a serpentine pipe is designed in the middle of the microchannel heat exchanger 1 and is provided with coolant inlet and outlet pipes.

[0036] There is a heat conduction layer on the bottom surface of the heat source, and the bottom surface of the heat conduction layer can be adhered to the top of the substrate 4 through heat-conducting glue to achieve the effect of direct contact between the evaporation section 5 of the heat pipe and it;

[0037] The substrate 4 is balanced and centrosymmetric with the microchannel heat exchanger 1. Since the microchannel heat exchanger 1 is provided with coolant inlets and outlets (coolant inlet 2 and coolant outlet 3), the length of the microchannel heat exchanger 1 is slightly longer than that of the substrate 4;

[0038] The heat pipe is internally filled with a phase change working fluid, which has the effects of heat absorption and evaporation and cooling and condensation. When in use, the top of the substrate 4 can be oriented downward, and under the action of gravity, the working fluid forms a reflux after condensation to achieve circulation;

[0039] The transition section 6 of the heat pipe is bent at 180°, forming a U-shaped structure. After that, the evaporation section 5 and the condensation section 7 of the heat pipe on the substrate 4 are fixedly connected respectively through thermal conductive adhesive;

[0040] Optionally, the phase change material in the heat pipe is a mixture of water, paraffin, graphite powder, and metal powder;

[0041] Optionally, the specifications of the substrate 4 and the microchannel heat exchanger 1 can be reasonably designed and processed according to the requirements of the heat source;

[0042] Optionally, the size and quantity of the heat pipes are set according to actual needs, and design and processing are carried out under the principle of maintaining uniform distribution and compact structure;

[0043] Optionally, the heat pipes can be made of different materials, such as copper, aluminum, stainless steel, etc. The substrate 4 and the microchannel heat exchanger 1 can be made of materials with good thermal conductivity, such as copper or aluminum;

[0044] Optionally, the liquid flowing into the microchannel heat exchanger 1 can be water or other coolants such as nanofluids;

[0045] Optionally, the internal microchannel structure of the microchannel heat exchanger 1 is serpentine.

[0046] As Figure 1 shown, it is a schematic structural diagram of the overall heat dissipation device provided by the present invention; it mainly includes three major parts: a substrate 4, a heat pipe, and a microchannel heat exchanger 1. The substrate 4 and the microchannel heat exchanger 1 are connected through the heat pipe. As Figure 2 , the condensation sections 7 of the heat pipes are installed on the upper and lower surfaces of the microchannel heat exchanger 1 and are evenly distributed regularly; as Figure 3 , the evaporation section 5 of the heat pipe is installed on the top of the substrate 4. When in use, the heat source is placed on the top of the substrate 4; as Figure 4 , it is a side view of the heat dissipation device, which can show the compactness of the structure and the uniform distribution of the heat pipes; as Figure 5 , the transition sections (B1 and B2) of the heat pipes are bent to connect the evaporation section A and the condensation sections (C1 and C2), and the heat pipes are evenly distributed on the surfaces of the substrate 4 and the microchannel heat exchanger 1; as Figure 6, which is the central part of the microchannel heat exchanger 1. The microchannel heat exchanger 1 is designed with serpentine pipes and liquid inlet and outlet pipes.

[0047] The instrument specifications of the microchannel heat exchanger 1, the substrate 4, the heat pipe, etc. can be determined by corresponding calculations according to the heat source required in actual use.

[0048] During use, the present invention is installed in a small heat exchange scenario, and the heat source dissipates heat under this device. The heat source and its heat conduction layer can be bonded to the substrate 4 through thermal conductive silicone grease. When the heat source starts to work, the heat dissipation increases and the temperature rises accordingly, causing the heat pipe in contact with the heat source to absorb heat. The phase change working fluid in the evaporation section 5 of the heat pipe evaporates from a liquid to a gas and is transferred to the condensation section 7 of the heat pipe. The condensation section 7 of the heat pipe is in close contact with the microchannel heat exchanger 1. The microchannel heat exchanger 1 takes away the heat of the condensation section 7 of the heat pipe through the inflow and outflow of the coolant, causing the gas in the condensation section 7 of the heat pipe to condense into a liquid, and the liquid flows back to the evaporation section 5 of the heat pipe under the action of gravity, thus forming a closed circulation loop and continuously circulating. There are two situations for the use of this device. When the heat of the heat source is less, the gas in the evaporation section 5 of the heat pipe can only be transferred to the condensation section 7 of the heat pipe closer to the substrate 4; when the heat of the heat source is greater, enough gas is generated so that the gas in the evaporation section 5 of the heat pipe can be transferred to the condensation sections 7 of the heat pipe on both sides of the microchannel heat exchanger 1 for heat dissipation, achieving the effect of "double condensation sections" and effectively absorbing more heat. The present invention cleverly combines the microchannel heat exchanger 1 and the heat pipe, and has the characteristics of compact structure, outstanding performance, high efficiency and environmental protection, etc., and can be put into use in occasions with small space and high power.

[0049] The above embodiments are the preferred embodiments of the present invention, but the embodiments of the present invention are not limited by the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications made without departing from the spirit and principle of the present invention shall be equivalent replacement methods and are all included in the protection scope of the present invention.

Claims

1. A heat dissipation device combining a microchannel heat exchanger and a heat pipe, characterized in that It includes a substrate, a heat pipe group, and a heat exchanger; the substrate is disposed on the heat source and contacts the heat source to absorb heat; the heat exchanger is disposed above the substrate and is arranged parallel to the substrate; the heat pipe group is disposed on the substrate, one end of which is connected and contacts one side of the heat exchanger, and the other end is connected and contacts the other side of the heat exchanger; The heat pipe group is formed by arranging a plurality of heat pipes connecting the substrate and the heat exchanger side by side. The heat pipe includes an evaporation section, a first transition section, a second transition section, a first condensation section, and a second condensation section; the evaporation section is disposed on the substrate and fixedly connected to the substrate; the first condensation section is disposed on the side of the heat exchanger close to the substrate and fixedly connected to the heat exchanger; the second condensation section is disposed on the other side of the heat exchanger away from the substrate and fixedly connected to the heat exchanger; one end of the first transition section is connected to one end of the evaporation section, and the other end is connected to one end of the first condensation section, and the other end of the first condensation section is closed; one end of the second transition section is connected to the other end of the evaporator, and the other end is connected to one end of the second condensation section, and the other end of the second condensation section is closed; the first transition section and the second transition section on one side of the adjacent heat pipes in the heat pipe group are arranged alternately; Both the first transition section and the second transition section are designed with an arc or semi-circular structure.

2. The heat dissipation device combining a microchannel heat exchanger and a heat pipe according to claim 1, wherein, The heat exchanger adopts a microchannel heat exchanger, including a heat exchanger body, a coolant inlet, a coolant outlet, and microchannels; the coolant inlet is disposed at one end of the heat exchanger body and fixedly connected to the heat exchanger body. One end of the coolant inlet communicates with the outside, and the other end communicates with the inside of the heat exchanger body; the coolant outlet is disposed at the other end of the heat exchanger body and fixedly connected to the heat exchanger body. One end of the coolant outlet communicates with the outside, and the other end communicates with the inside of the heat exchanger body; the microchannels are curled and arranged inside the heat exchanger body, one end of which is connected to the coolant inlet, and the other end is connected to the coolant outlet.

3. The heat dissipation device combining a microchannel heat exchanger and a heat pipe according to claim 2, characterized in that, The curled shape of the microchannels adopts a serpentine, meandering, spiral, or zigzag structure design.

4. The heat dissipation device combining a microchannel heat exchanger and a heat pipe according to claim 2, characterized in that, Water or nanofluid is filled in the microchannels as the coolant.

5. The heat dissipation device combining a microchannel heat exchanger and a heat pipe according to claim 1, characterized in that, A phase change material is filled in the heat pipe as the cooling working medium, and the phase change material is a mixture composed of water, paraffin, graphite powder, and metal powder.

6. The heat dissipation device combining a microchannel heat exchanger and a heat pipe according to claim 1, characterized in that, The heat pipe is designed with a square tube or circular tube structure.

7. The heat dissipation device combining a microchannel heat exchanger and a heat pipe according to claim 1, wherein, Part of the evaporation section is embedded or completely embedded in the substrate to increase the contact area with the substrate.

8. The heat dissipation device combining a microchannel heat exchanger and a heat pipe according to claim 1, characterized in that, Part of the first condensation section and the second condensation section are embedded or completely embedded in the heat exchanger to increase the contact area with the heat exchanger.

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